CN113224217A - Composite film for LED wafer level packaging - Google Patents
Composite film for LED wafer level packaging Download PDFInfo
- Publication number
- CN113224217A CN113224217A CN202010070076.7A CN202010070076A CN113224217A CN 113224217 A CN113224217 A CN 113224217A CN 202010070076 A CN202010070076 A CN 202010070076A CN 113224217 A CN113224217 A CN 113224217A
- Authority
- CN
- China
- Prior art keywords
- heat
- composite film
- led wafer
- resistant
- wafer level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 51
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 229920001721 polyimide Polymers 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 7
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 4
- 125000005670 ethenylalkyl group Chemical group 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 230000006698 induction Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 150000001875 compounds Chemical class 0.000 abstract 2
- 238000000034 method Methods 0.000 description 37
- 239000003522 acrylic cement Substances 0.000 description 27
- 235000012431 wafers Nutrition 0.000 description 25
- 239000011248 coating agent Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- 239000004642 Polyimide Substances 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 9
- 239000003431 cross linking reagent Substances 0.000 description 9
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 238000010998 test method Methods 0.000 description 9
- 239000002202 Polyethylene glycol Substances 0.000 description 8
- 229920001223 polyethylene glycol Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- SZGZILRQIYNODJ-UHFFFAOYSA-L disodium;7,12-dihydroquinoxalino[3,2-b]phenazine-2,9-disulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)C1=CC=C2N=C(C=C3C(NC4=CC=C(C=C4N3)S(=O)(=O)[O-])=C3)C3=NC2=C1 SZGZILRQIYNODJ-UHFFFAOYSA-L 0.000 description 7
- 238000003756 stirring Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention is a compound film used for LED wafer level packaging, which makes LED wafer stick to a carrier for LED wafer level packaging in a heating process, the compound film includes; a substrate including a first surface and a second surface; the heat-resistant pressure-sensitive adhesive is formed on the first surface of the base material and used for adhering the LED wafer to the base material; and a heat-resistant thermal viscosity-reducing pressure-sensitive adhesive formed on the second surface of the substrate for adhering the substrate to the carrier, wherein the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive can reduce the adhesive force thereof after the heating process, so that the carrier can be easily peeled from the composite film after the LED is packaged at wafer level.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to a composite film for LED wafer level packaging, in particular to a composite film which is attached to a supporting body, can easily remove the supporting body from a composite film after the LED wafer level packaging is completed through a heating process, and has no residual glue phenomenon.
[ background of the invention ]
Referring to fig. 1, a composite film for wafer level packaging of conventional LED includes a substrate 10, a heat-resistant pressure-sensitive adhesive 12 adhered to one surface of the substrate, and a photo-curable pressure-sensitive adhesive 14 (commonly referred to as UV adhesive) adhered to the other surface of the substrate 10. Referring to fig. 2, a schematic diagram of a conventional LED wafer level package is shown, first, a photo-curable pressure sensitive adhesive 14 (commonly referred to as UV adhesive) of a substrate 10 is adhered to a glass carrier 16, then an LED wafer is adhered to a heat-resistant pressure sensitive adhesive 12 to be cut into single dies 18, a package 22 is packaged at a high temperature, then the single dies are cut into single dies, a tape 24 is attached, the glass carrier 16 is removed after being irradiated by ultraviolet light, and finally the tape 24 is removed, so as to complete the LED wafer level package process.
The photo-curable pressure sensitive adhesive 14 (commonly referred to as UV adhesive) of the above-mentioned conventional composite film has insufficient heat resistance during high temperature processing, which results in the defect that the residual adhesive is adhered to the glass carrier 16 and is not easily peeled off when the glass carrier 16 is removed. Moreover, additional equipment such as radiation machine is required to remove the glass carrier 16, and additional stations are required in the production process, thereby increasing the production cost and reducing the production efficiency. In addition, due to the chemical formula design of the UV glue system, the risk of residual glue during subsequent separation from the glass carrier 16 due to insufficient heat resistance is more likely to occur. In addition, the light-curable adhesive sheet has a disadvantage of being difficult to store because ultraviolet rays still exist in a general storage or working environment to a greater or lesser extent to affect the adhesive force of the light-curable adhesive sheet. Thus, there is still room for improvement in the prior art for composite films for LED wafer level packaging.
[ summary of the invention ]
The invention relates to a composite film for LED wafer level packaging, which comprises a carrier, a plurality of LED wafers, a plurality of LED chips, a plurality of LED chip packaging bodies and a plurality of LED chip packaging bodies, wherein the LED wafers can be attached to the carrier and cut into crystal grains; a substrate including a first surface and a second surface; the heat-resistant pressure-sensitive adhesive is formed on the first surface of the base material and used for adhering the LED wafer to the base material; and the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive is formed on the second surface of the base material and is used for adhering the base material to the supporting body, wherein the adhesion force of the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive before heating is more than 200gf/inch, and the adhesion force after heating is less than 150gf/inch, so that the supporting body can be easily peeled from the composite film after the LED is packaged at a wafer level.
[ brief description of drawings ]
Fig. 1 is a schematic diagram of a composite film for wafer level packaging of LEDs.
Fig. 2 is a schematic diagram of a conventional LED wafer level package.
FIG. 3 is a schematic diagram of a composite film for LED wafer level packaging according to the present invention.
Fig. 4 is a first schematic view of a composite film of the present invention for use in LED wafer level packaging.
FIG. 5 is a second schematic view of a composite film of the present invention for use in LED wafer level packaging.
FIG. 6 is a third schematic view of a wafer level package for LED using the composite film of the present invention.
FIG. 7 is a fourth schematic view of a wafer level package for LEDs using the composite film of the present invention.
FIG. 8 is a fifth schematic view of a wafer level package for LEDs using the composite film of the present invention.
In fig. 1 to 8, the symbols are illustrated as follows:
Heat-resistant adhesive 36
Heat resistant thermal detackifying pressure sensitive adhesive 38
Die 44
Die package 46
[ detailed description ] embodiments
Referring to fig. 3, the present invention is a composite film for LED wafer level package, which includes a polyimide film substrate 30 having a first surface 32 and a second surface 34; a heat-sensitive adhesive 36, which can be selected from pressure-sensitive adhesive systems of known heat-resistant formulations, such as rubber-based pressure-sensitive adhesives, propylene-based pressure-sensitive adhesives, vinyl-alkyl ether-based pressure-sensitive adhesives, silicone-based pressure-sensitive adhesives, polyester-based pressure-sensitive adhesives, polyamide-based pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, polystyrene/diene copolymer-based pressure-sensitive adhesives, propylene-based pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, polystyrene/diene copolymers; and a heat-resistant thermal tack-reducing adhesive 38 formed on the second surface 34 of the substrate 30, wherein the heat-resistant thermal tack-reducing adhesive 38 has an adhesion force of greater than 200gf/inch before heating and an adhesion force of less than 150gf/inch after heating.
Referring to fig. 4 to 7, which are schematic diagrams of using the composite film of the present invention for LED wafer level packaging, the heat-resistant thermal de-bonding pressure sensitive adhesive 38 of the substrate 30 is adhered to the carrier 40, the LED wafer 42 is adhered to the heat-resistant pressure sensitive adhesive 36 of the substrate 30, dicing is performed to obtain single dies 44, then die packaging is performed, the single die packages 46 are cut, the tape 48 is adhered to the die packages 46, and the carrier 40 is removed.
Description of examples and comparative examples
Example 1
A heat-resistant acrylic adhesive such as HT-6555-. Another container is taken 250ml, a heat-resistant acrylic adhesive such as HT-6555 acrylic adhesive (available from Taiwan Sunjaku Co., Ltd.) 150G, a crosslinking agent N0.5G (available from Taiwan Sunjaku Co., Ltd.), 23G (polyethylene glycol # 1000-dimethacrylate) 3G (available from Xinzhongcun chemical Co., Ltd.), 1G (ethylene glycol dimethacrylate) 5G (available from Xinzhongcun chemical Co., Ltd.), 1,3, 3-tetramethylbutyl hydroperoxide 0.5G (available from Taiwan Jingming chemical Co., Ltd.), stirring uniformly for 10min, controlling the gap with a doctor blade to obtain a subsequent coating adhesive thickness of 40 μm, coating the other side of the polyimide substrate coated with the heat-resistant adhesive, placing in an oven to remove the solvent under baking conditions of 100 ℃/30min, and taking out the sample to cover the release film to form the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive layer on the second surface of the composite film. Referring to the adhesion test method of the result evaluation method, the adhesion of the first surface before the thermal process was 267gf/inch, and the adhesion of the first surface after the thermal process was 412 gf/inch; the adhesion force of the second surface before the thermal process is 1082gf/inch, and the adhesion force of the second surface after the thermal process is 132 gf/inch.
Example 2
A heat-resistant acrylic adhesive such as HT-6555-. Another container (250 ml) is placed in a heat-resistant acrylic adhesive (HT-6555 acrylic adhesive) (available from New Zealand corporation) 150G, a crosslinking agent (N1G) is added (available from New Zealand corporation), 23G (poly (ethanol # 1000-dimethacrylate)) 4G (available from New Memura chemical corporation), 1G (ethylene glycol dimethacrylate) 4G (available from New Zealand chemical corporation), 1,3, 3-tetramethylbutyl hydroperoxide (0.5G available from Taiwan Zengming chemical corporation), the mixture is uniformly stirred for 10min, a doctor blade is used to control the gap to obtain a subsequent adhesive thickness of 5um, the other side of the polyimide substrate coated with the heat-resistant adhesive is coated, the polyimide substrate is placed in an oven to remove the solvent under the baking condition of 100 ℃/30min, and taking out the sample to cover the release film to form the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive layer on the second surface of the composite film. Referring to the adhesion test method of the result evaluation method, the adhesion of the first surface before the thermal process was 267gf/inch, and the adhesion of the first surface after the thermal process was 412 gf/inch; the adhesion force of the second surface before the thermal process is 215gf/inch, and the adhesion force of the second surface after the thermal process is 143 gf/inch.
Example 3
A heat-resistant acrylic adhesive such as HT-6555-. Another container is taken 250ml, a heat-resistant acrylic adhesive such as HT-6555 acrylic adhesive (available from Taiwan Sunjaku Co., Ltd.) 150G, a crosslinking agent N0.5G (available from Taiwan Sunjaku Co., Ltd.), 23G (polyethylene glycol # 1000-dimethacrylate) 3G (available from Xinzhongcun chemical Co., Ltd.), 1G (ethylene glycol dimethacrylate) 5G (available from Xinzhongcun chemical Co., Ltd.), 1,3, 3-tetramethylbutyl hydroperoxide 0.5G (available from Taiwan Jingming chemical Co., Ltd.), stirring uniformly for 10min, controlling the gap with a doctor blade to obtain a subsequent coating adhesive thickness of 40 μm, coating the other side of the polyimide substrate coated with the heat-resistant adhesive, placing in an oven to remove the solvent under baking conditions of 100 ℃/30min, and taking out the sample to cover the release film to form the heat-resistant second surface of the composite film so as to obtain the thermal viscosity-reducing pressure-sensitive adhesive layer. Referring to the adhesion test method of the result evaluation method, it was found that the adhesion of the first surface before the thermal process was 345gf/inch and the adhesion of the first surface after the thermal process was 545 gf/inch; the adhesion force of the second surface before the thermal process is 1082gf/inch, and the adhesion force of the second surface after the thermal process is 132 gf/inch.
Example 4
A heat-resistant acrylic adhesive such as HT-6555-. Another container is taken 250ml, a heat-resistant acrylic adhesive such as HT-6555 acrylic adhesive (available from Taiwan Sunjaku Co., Ltd.) 150G, a crosslinking agent N0.5G (available from Taiwan Sunjaku Co., Ltd.), 23G (polyethylene glycol # 1000-dimethacrylate) 3G (available from Xinzhongcun chemical Co., Ltd.), 1G (ethylene glycol dimethacrylate) 5G (available from Xinzhongcun chemical Co., Ltd.), 1,3, 3-tetramethylbutyl hydroperoxide 0.5G (available from Taiwan Jingming chemical Co., Ltd.), stirring uniformly for 10min, controlling the gap with a doctor blade to obtain a subsequent coating adhesive thickness of 40 μm, coating the other side of the polyimide substrate coated with the heat-resistant adhesive, placing in an oven to remove the solvent under baking conditions of 100 ℃/30min, and taking out the sample to cover the release film to form the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive layer on the second surface of the composite film. Referring to the adhesion test method of the result evaluation method, it was found that the adhesion of the first surface before the thermal process was 1450gf/inch, and the adhesion of the first surface after the thermal process was 1905 gf/inch; the adhesion force of the second surface before the thermal process is 1082gf/inch, and the adhesion force of the second surface after the thermal process is 132 gf/inch.
Comparative example 1
A heat-resistant acrylic adhesive such as HT-6555-. Another container is taken 250ml, a heat-resistant acrylic adhesive such as HT-6555 acrylic adhesive (available from Taiwan Sunjaku Co., Ltd.) 150G, a crosslinking agent N0.5G (available from Taiwan Sunjaku Co., Ltd.), 23G (polyethylene glycol # 1000-dimethacrylate) 3G (available from Xinzhongcun chemical Co., Ltd.), 1G (ethylene glycol dimethacrylate) 5G (available from Xinzhongcun chemical Co., Ltd.), 1,3, 3-tetramethylbutyl hydroperoxide 0.5G (available from Taiwan Jingming chemical Co., Ltd.), stirring uniformly for 10min, controlling the gap with a doctor blade to obtain a subsequent coating adhesive thickness of 40 μm, coating the other side of the polyimide substrate coated with the heat-resistant adhesive, placing in an oven to remove the solvent under baking conditions of 100 ℃/30min, and taking out the sample to cover the release film to form the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive layer on the second surface of the composite film. Referring to the adhesion test method of the result evaluation method, the adhesion of the first surface before the thermal process is 239gf/inch, and the adhesion of the first surface after the thermal process is 419gf/inch can be obtained; the adhesion force of the second surface before the thermal process is 1082gf/inch, and the adhesion force of the second surface after the thermal process is 132 gf/inch.
Comparative example 2
A heat-resistant acrylic adhesive such as HT-6555-. Another container is taken 250ml, a heat-resistant acrylic adhesive such as HT-6555 acrylic adhesive (available from Taiwan Sunjaku Co., Ltd.) 150G, a crosslinking agent N0.5G (available from Taiwan Sunjaku Co., Ltd.), 23G (polyethylene glycol # 1000-dimethacrylate) 3G (available from Xinzhongcun chemical Co., Ltd.), 1G (ethylene glycol dimethacrylate) 5G (available from Xinzhongcun chemical Co., Ltd.), 1,3, 3-tetramethylbutyl hydroperoxide 0.5G (available from Taiwan Jingming chemical Co., Ltd.), stirring uniformly for 10min, controlling the gap with a doctor blade to obtain a subsequent coating adhesive thickness of 40 μm, coating the other side of the polyimide substrate coated with the heat-resistant adhesive, placing in an oven to remove the solvent under baking conditions of 100 ℃/30min, and taking out the sample to cover the release film to form the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive layer on the second surface of the composite film. Referring to the adhesion test method of the result evaluation method, it was found that the adhesion of the first surface before the thermal process was 380gf/inch and the adhesion of the first surface after the thermal process was 598 gf/inch; the adhesion force of the second surface before the thermal process is 1082gf/inch, and the adhesion force of the second surface after the thermal process is 132 gf/inch.
Comparative example 3
A heat-resistant acrylic adhesive such as HT-6555-. Another container is taken 250ml, a heat-resistant acrylic adhesive such as HT-6555 acrylic adhesive (available from Taiwan Sunjaku Co., Ltd.) 150G, a crosslinking agent N0.5G (available from Taiwan Sunjaku Co., Ltd.), 23G (polyethylene glycol # 1000-dimethacrylate) 3G (available from Xinzhongcun chemical Co., Ltd.), 1G (ethylene glycol dimethacrylate) 5G (available from Xinzhongcun chemical Co., Ltd.), 1,3, 3-tetramethylbutyl hydroperoxide 0.5G (available from Taiwan Jingming chemical Co., Ltd.), stirring uniformly for 10min, controlling the gap with a doctor blade to obtain a subsequent coating adhesive thickness of 40 μm, coating the other side of the polyimide substrate coated with the heat-resistant adhesive, placing in an oven to remove the solvent under baking conditions of 100 ℃/30min, and taking out the sample to cover the release film to form the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive layer on the second surface of the composite film. Referring to the adhesion test method of the result evaluation method, it was found that the adhesion of the first surface before the thermal process was 270gf/inch and the adhesion of the first surface after the thermal process was 388 gf/inch; the adhesion force of the second surface before the thermal process is 1082gf/inch, and the adhesion force of the second surface after the thermal process is 132 gf/inch.
Comparative example 4
A heat-resistant acrylic adhesive such as HT-6555-. Another container is taken 250ml, a heat-resistant acrylic adhesive such as HT-6555 acrylic adhesive (available from Taiwan Sunjaku Co., Ltd.) 150G is poured, a crosslinking agent N1.2G (available from Taiwan Sunjaku Co., Ltd.), 23G (polyethylene glycol # 1000-dimethacrylate) 4G (available from Xinzhongcun chemical Co., Ltd.), 1G (ethylene glycol dimethacrylate) 4G (available from Xinzhongcun chemical Co., Ltd.), 1,3, 3-tetramethylbutyl hydroperoxide 0.5G (available from Taiwan Jingming chemical Co., Ltd.) are added, the mixture is uniformly stirred for 10min, a gap is controlled by a doctor blade to obtain a subsequent coating adhesive thickness of 5um, the other side of the polyimide substrate coated with the heat-resistant adhesive is coated, the polyimide substrate is placed in an oven to remove the solvent under the baking condition of 100 ℃/30min, and taking out the sample to cover the release film to form the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive layer on the second surface of the composite film. Referring to the adhesion test method of the result evaluation method, the adhesion of the first surface before the thermal process was 267gf/inch, and the adhesion of the first surface after the thermal process was 412 gf/inch; the adhesion force of the second surface before the thermal process was 190gf/inch, and the adhesion force of the second surface after the thermal process was 145 gf/inch.
Comparative example 5
A heat-resistant acrylic adhesive such as HT-6555-. Another container is taken 250ml, a heat-resistant acrylic adhesive such as HT-6555 acrylic adhesive (available from Taiwan Sunjaku Co., Ltd.) 150G, a crosslinking agent N0.45G (available from Taiwan Sunjaku Co., Ltd.), 23G (polyethylene glycol # 1000-dimethacrylate) 2.5G (available from Xinzhongcun chemical Co., Ltd.), 1G (ethylene glycol dimethacrylate) 4.8G (available from Xinzhongcun chemical Co., Ltd.), 1,3, 3-tetramethylbutyl hydroperoxide 0.5G (available from Taiwan Sunjaku chemical Co., Ltd.) are added, the mixture is uniformly stirred for 10min, a gap is controlled by a scraper to obtain a subsequent coating thickness of 40 μm, the other side of the polyimide substrate coated with the heat-resistant adhesive is coated, the polyimide substrate is placed in an oven to remove the solvent under the baking condition of 100 ℃/30min, and taking out the sample to cover the release film to form the heat-resistant thermal viscosity-reducing pressure-sensitive adhesive layer on the second surface of the composite film. Referring to the adhesion test method of the result evaluation method, the adhesion of the first surface before the thermal process was 267gf/inch, and the adhesion of the first surface after the thermal process was 412 gf/inch; the adhesion force of the second surface before the thermal process is 1134gf/inch, and the adhesion force of the second surface after the thermal process is 173 gf/inch.
Evaluation of results
Adhesion force testing method
The composite film was cut into 1inch (inch) in width and 150 mm (mm) in length, and adhered to a polished steel plate mirror-finished at 23 ℃ at room temperature using a 2 kg (kg) roller. The polished steel plate is cleaned by soaking alcohol and acetone with dust-free cloth before use and is placed for 1 hour. The pre-thermal adhesion in the following table is obtained by peeling a composite film laminated on a polished steel plate at room temperature at a peeling speed of 300 mm/min and a peeling angle of 180 degrees, and measuring the adhesion (unit: gf/1 inch). The adhesion after thermal processing in the following table was measured by baking the composite film bonded to a polished steel plate in an oven at a temperature of 150 ℃ for 4hrs, peeling the composite film at a peeling speed of 300 mm/min and a peeling angle of 180 degrees, and measuring the adhesion (unit: gf/1 inch).
Thickness testing method
Firstly, using a SYLVAC step standard electronic watch to measure the thickness of five different areas of a sample before coating to obtain an average value record, then using the SYLVAC step standard electronic watch to measure the thickness of five different areas of the sample after coating the pressure sensitive adhesive to obtain the average value record, and finally subtracting the two average values to obtain the difference value of the thickness of the pressure sensitive adhesive layer.
Table description of examples and comparative examples
The foregoing description of specific embodiments is provided for the purpose of illustrating the invention in detail, however, the examples are for the purpose of illustration only and are not intended to be limiting of the invention. It will be appreciated by those skilled in the art that the present invention may be practiced without departing from the scope of the claims set out below. Various changes or modifications may be made which are intended to be part of this disclosure.
Claims (7)
1. A composite film for LED wafer level packaging, the composite film comprising:
a substrate including a first surface and a second surface;
the heat-resistant pressure sensitive adhesive is formed on the first surface of the substrate and used for enabling the LED wafer to be adhered to the substrate; and
a heat-resistant thermal tack-reducing pressure-sensitive adhesive formed on the second surface of the substrate, wherein the heat-resistant thermal tack-reducing pressure-sensitive adhesive has an adhesion force of greater than 200gf/inch before heating and an adhesion force of less than 150gf/inch after heating.
2. The composite film for LED wafer level packaging of claim 1, wherein the substrate is selected from polyimide films.
3. The composite film for LED wafer level packaging according to claim 1, wherein the heat-resistant pressure-sensitive adhesive is selected from the group consisting of rubber-based pressure-sensitive adhesives, propylene-based pressure-sensitive adhesives, vinyl-alkyl ether-based pressure-sensitive adhesives, silicone-based pressure-sensitive adhesives, polyester-based pressure-sensitive adhesives, polyamide-based pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, polystyrene/diene copolymer-based pressure-sensitive adhesives, propylene-based pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, and polystyrene/diene copolymers.
4. The composite film for LED wafer level packaging of claim 1, wherein the heat resistant pressure sensitive adhesive thickness is less than 30 microns.
5. The composite film for LED wafer level packaging as claimed in claim 1, wherein the adhesion force before the thermal induction compression resistant adhesive heating process is greater than 250gf/inch, and the adhesion force after the heating process is greater than 400 gf/inch.
6. The composite film for LED wafer level package according to claim 1, wherein the carrier is selected from glass.
7. The composite film for LED wafer level packaging according to claim 1 or 4, wherein the heating is at 150 ℃/4 hrs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010070076.7A CN113224217A (en) | 2020-01-21 | 2020-01-21 | Composite film for LED wafer level packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010070076.7A CN113224217A (en) | 2020-01-21 | 2020-01-21 | Composite film for LED wafer level packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113224217A true CN113224217A (en) | 2021-08-06 |
Family
ID=77085179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010070076.7A Pending CN113224217A (en) | 2020-01-21 | 2020-01-21 | Composite film for LED wafer level packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113224217A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM508113U (en) * | 2015-05-26 | 2015-09-01 | Alliance Material Co Ltd | Structural improvement of adhesive layer for use in die bonding process |
| TWM508117U (en) * | 2015-05-14 | 2015-09-01 | Alliance Material Co Ltd | Structural improvement of adhesive layer for use in die bonding process |
| CN107201186A (en) * | 2016-03-16 | 2017-09-26 | 利昌电气工业有限公司 | Heating can reduce the adhesion glue band of adhesion |
| CN207891298U (en) * | 2018-01-02 | 2018-09-21 | 达迈科技股份有限公司 | Thermmohardening type compound adhesive tape |
| TW201909354A (en) * | 2017-07-11 | 2019-03-01 | 力成科技股份有限公司 | Double-sided adhesive |
-
2020
- 2020-01-21 CN CN202010070076.7A patent/CN113224217A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM508117U (en) * | 2015-05-14 | 2015-09-01 | Alliance Material Co Ltd | Structural improvement of adhesive layer for use in die bonding process |
| TWM508113U (en) * | 2015-05-26 | 2015-09-01 | Alliance Material Co Ltd | Structural improvement of adhesive layer for use in die bonding process |
| CN107201186A (en) * | 2016-03-16 | 2017-09-26 | 利昌电气工业有限公司 | Heating can reduce the adhesion glue band of adhesion |
| TW201909354A (en) * | 2017-07-11 | 2019-03-01 | 力成科技股份有限公司 | Double-sided adhesive |
| CN207891298U (en) * | 2018-01-02 | 2018-09-21 | 达迈科技股份有限公司 | Thermmohardening type compound adhesive tape |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI307545B (en) | Dicing/die-bonding film, method of fixing chipped work and semiconductor device | |
| TWI616943B (en) | Wafer back side coating as dicing tape adhesive | |
| TWI469204B (en) | A polishing method for a semiconductor wafer, and a resin composition and a protective sheet used therefor | |
| KR101330128B1 (en) | Adhesive composition, dicing tape for semiconductor wafer and method and device for producing the same | |
| TWI459455B (en) | Adhesive sheet for grinding back surface of semiconductor wafer and method for grinding back surface of semiconductor wafer using the same | |
| TW201044452A (en) | Method of applying pressure-sensitive adhesive sheet for semiconductor wafer protection and pressure-sensitive adhesive sheet for semiconductor wafer protection for use in the application method | |
| TWI671380B (en) | Heat-resistant adhesive sheet for detecting semiconductor, and semiconductor detection method | |
| TWI491701B (en) | Re-peelable adhesive sheet | |
| JP2008162240A (en) | Adhesion sheet | |
| TW200918634A (en) | Pressure-sensitive adhesive sheet for dicing and dicing method | |
| JP2012177084A (en) | Heat-resistant temporary adhesive composition and heat-resistant temporary adhesive tape | |
| WO2015080188A1 (en) | Semiconductor-processing pressure-sensitive adhesive tape | |
| JP2003147300A (en) | Surface protecting sheet in grinding wafer rear and method for producing semiconductor chip | |
| JP2003332267A (en) | Method for working semiconductor wafer | |
| KR20190098046A (en) | Pressure-sensitive adhesive sheet and pressure-sensitive adhesive sheet laminate | |
| CN108602312A (en) | Can conformal, stretchable stripping adhesive article | |
| KR20150026844A (en) | Adhesive tape for dicing and method for manufacturing semiconductor chip | |
| JP2003338474A (en) | Machining method of brittle member | |
| JP6126436B2 (en) | Baseless silicone double-sided tape | |
| JP3766304B2 (en) | Heat release type adhesive sheet | |
| JP2002203822A (en) | Method for processing brittle member and both-side adhesive sheet | |
| TWI304610B (en) | Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape | |
| TW202131399A (en) | Dicing tape and manufacturing method of semiconductor component | |
| CN113224217A (en) | Composite film for LED wafer level packaging | |
| KR20180079695A (en) | Silicon-based adhesive tape and method of preparing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210806 |