CN207891298U

CN207891298U - Thermmohardening type compound adhesive tape

Info

Publication number: CN207891298U
Application number: CN201820006277.9U
Authority: CN
Inventors: 林志维; 赖俊廷
Original assignee: Taimide Tech Inc
Current assignee: Taimide Tech Inc
Priority date: 2018-01-02
Filing date: 2018-01-02
Publication date: 2018-09-21
Anticipated expiration: 2028-01-02

Abstract

The utility model provides a kind of thermmohardening type compound adhesive tape, gets adhered on object to be attached to one comprising have：One base material has a first surface and second surface；One thermmohardening type adhesive agent, it is coated on the first surface of the base material, is got adhered on object to be attached to this, it is more than 300gf/inch to have an initial adhesion, adhesion is less than 200gf/inch, to the adhesion for the object that reduces and get adhered when being down to room temperature after being heated；And a release layer, it is covered on the thermmohardening type adhesive agent, it can be from its stripping.

Description

Thermmohardening type compound adhesive tape

Technical field

The utility model gets adhered to fit in one on object, about a kind of thermmohardening type compound adhesive tape after heated Tackness can be reduced by being down to room temperature, make its object stripping that can get adhered certainly.

Background technology

In the prior art, adhesion material such as pressure-sensitive adhesive sheet has been widely used for various products (such as semiconductor crystal wafer) In production process.For example, pressure-sensitive adhesive sheet used when being cut as semiconductor crystal wafer.Therefore, using pressure-sensitive adhesive sheet to assist half When the cutting work of semiconductor wafer, the adhesion of pressure-sensitive adhesive sheet must be enough with by semiconductor crystal wafer be fixed to each other without with semiconductor die Circle separation, i.e., it is not peeling-off.In addition, in semiconductor crystal wafer after cutting, it is cut partly in being picked up (pick-up) In the step of semiconductor wafer, then need to detach pressure-sensitive adhesive sheet with semiconductor crystal wafer.Therefore, it is used for the production process of semiconductor crystal wafer Pressure-sensitive adhesive sheet need to be provided simultaneously with good adhesion, and in easily peelable characteristic after treatment.

Flake products are sticked together existing, the processing needed for carrying out, such as after high-temperature technology, pressure-sensitive adhesive sheet and quilt Adhesion between the object sticked can all rise, therefore, instead so that the stripping transfer contaminant capacity on the object sticked increases The problems such as more or generation residue glue.

Therefore, to solve the above-mentioned problems, a kind of pressure-sensitive adhesive sheet has been developed in the prior art, is used in pressure-sensitive adhesive sheet The functional group with photo-hardening characteristic is added in the polymer of adhesion material.Thus, in semiconductor crystal wafer after cutting, As long as carrying out irradiation step to pressure-sensitive adhesive sheet, can pressure-sensitive adhesive sheet be hardened and reduce its tackness.It accordingly, can be easily Pressure-sensitive adhesive sheet is removed from the semiconductor crystal wafer by cutting in required time point.

However, carrying out irradiation step to pressure-sensitive adhesive sheet, such as photo-hardening type pressure-sensitive adhesive sheet irradiation radioactive ray needs are additionally bought more The equipment such as radioactive ray board, and newly-increased website is needed in process of production, and increase production cost and reduce production efficiency.Except this Except, due to generally store or working environment in sticking together for photo-hardening pressure-sensitive adhesive sheet is still more or less influenced there are ultraviolet light Power, therefore, photo-hardening type pressure-sensitive adhesive sheet have the shortcomings that not easy to maintain.

Therefore, in the prior art, the adhesive agent composition for protecting or fixing target surface still has improved sky Between.

Utility model content

The thermmohardening type compound adhesive tape of the utility model comprising have face adhesive tape comprising have a base material, have one the One surface and second surface；One thermmohardening type adhesive agent, is coated on the first surface of the base material, to be attached to the object that gets adhered On, it is more than 300gf/inch to have an initial adhesion, and adhesion is less than 200gf/ when being down to room temperature after being heated Inch, to the adhesion for the object that reduces and get adhered；And a release layer, it is covered on the thermmohardening type adhesive agent, it can be from it Stripping.

Description of the drawings

Fig. 1 is the first schematic diagram of the utility model thermmohardening type compound adhesive tape；

Fig. 2 is the second schematic diagram of the utility model thermmohardening type compound adhesive tape；

Fig. 3 is the third schematic diagram of the utility model thermmohardening type compound adhesive tape；

Fig. 4 is the third schematic diagram of the utility model thermmohardening type compound adhesive tape.

Reference sign：

Substrate 10

Thermmohardening type adhesive agent 12

Release layer 14,22

First surface 16

Second surface 18

Get adhered object 20,24

Specific implementation mode

Referring to Fig. 1, first schematic diagram of the utility model with thermmohardening type compound adhesive tape comprising have a substrate 10, One thermmohardening type adhesive agent 12 and a release layer 14.

Substrate 10 can be polyimide film (PI), polyethylene terephthalate (PET), polyurethane (PU) or silicon rubber, With a first surface 16 and a second surface 18.

One thermmohardening type adhesive agent 12 is coated on the first surface 16 of substrate 10 comprising a main polymer, at least one Thermosetting group and a thermoinitiators, the main polymer includes at least structural unit derived from a monomer, described Monomer is that an acryloyl group containing polymerizable carbon-to-carbon double bond either one contains polymerizable carbon-to-carbon double bond metering system Acyl group, this is known techniques, and in this, it will not go into details.It is more than 300gf/ that thermmohardening type adhesive agent 12, which has an initial adhesion, Inch, adhesion is small 200gf/inch when being down to room temperature after being heated.

One release layer 14 is covered on thermmohardening type adhesive agent 12, can be from its stripping.

Please refer to Fig. 2, after the thermmohardening type adhesive agent 12 in 14 self-reference substrate 10 of release layer is removed, thermmohardening type sticks together Agent 12 gets adhered to be attached at one on object 20, such as semiconductor subassembly, makes substrate 10 that can be stable on release layer 12, when getting adhered When object 20 is completed to be down to room temperature after necessary high-temperature technology, 12 adhesion of thermmohardening type sticker will reduce, and make the object 20 that gets adhered It is able to remove with thermmohardening type adhesive agent 12.

Referring to Fig. 3, the second surface 18 of substrate 10 also can 12 or general adhesive agent of coated heat constrictive type adhesive agent.

Release layer 14 is covered in the thermmohardening type adhesive agent 12 of 10 first surface 16 of substrate and release layer 24 is covered in substrate On the thermmohardening type adhesive agent 12 of 10 second surfaces or general adhesive agent.

Please refer to Fig. 4, after the thermmohardening type adhesive agent 12 of first surface 19 is removed in 14 self-reference substrate 10 of release layer, heat Constrictive type adhesive agent 12 gets adhered to be attached at one on object 20, such as semiconductor subassembly, makes substrate 10 that can be stable in release layer 12 On, when being down to room temperature after the object 20 that gets adhered completes necessary high-temperature technology, 12 adhesion of thermmohardening type sticker will reduce, and make The object 20 that gets adhered is able to remove with thermmohardening type adhesive agent 12.

Release layer 22 can be removed the thermmohardening type adhesive agent 12 of second surface 18 in self-reference substrate 10, and thermmohardening type adhesive agent is made 12, which are attached at one, gets adhered on object 24, such as semiconductor subassembly, makes substrate 10 that can be stable on release layer 12, object 20 is complete when getting adhered When at being down to room temperature after necessary high-temperature technology, 12 adhesion of thermmohardening type sticker will reduce, enable to get adhered object 20 with Thermmohardening type adhesive agent 12 is removed.

Alternatively, release layer 22 can be removed the general adhesive agent 12 of second surface 18 in self-reference substrate 10, general adhesive agent is made to paste One is invested to get adhered on object 24.

The content of above-mentioned specific embodiment is in order to which the utility model is described in detail, however, such embodiment is only used for It is bright, it is not intended to limit the utility model.Those skilled in the art are it is understood that in the scope for not departing from claims and being defined It is directed to the various change that is carried out of the utility model down or modification falls into the part of the utility model.

Claims

1. a kind of thermmohardening type compound adhesive tape, gets adhered to be attached to one on object comprising have：

One base material has a first surface and second surface；

One thermmohardening type adhesive agent, is coated on the first surface of the base material, gets adhered on object to be attached to this, has at the beginning of one Beginning adhesion is more than 300gf/inch, and adhesion is less than 200gf/inch, to reduce when being down to room temperature after being heated With the adhesion for the object that gets adhered；And

One release layer is covered on the thermmohardening type adhesive agent, can be from its stripping.

2. thermmohardening type compound adhesive tape as described in claim 1, wherein the base material is polyimide film (PI), gathers to benzene two Ethyl formate (PET), polyurethane (PU) or silicon rubber.

3. thermmohardening type compound adhesive tape as described in claim 1, wherein the thermmohardening adhesive agent include a main polymer, An at least thermosetting group and a thermoinitiators, the main polymer include at least structure list derived from a monomer Member, the monomer are that an acryloyl group containing polymerizable carbon-to-carbon double bond either one contains polymerizable carbon-to-carbon double bond first Base acryloyl group.

4. thermmohardening type compound adhesive tape as described in claim 1, wherein the second surface of the base material further includes an adhesive agent, One release layer is covered on the adhesive agent.

5. thermmohardening type compound adhesive tape as claimed in claim 4, wherein the adhesive agent is thermmohardening type adhesive agent, is had One initial adhesion be more than 300gf/inch, when being down to room temperature after being heated adhesion be less than 200gf/inch, one from Type layer is covered on the thermmohardening type adhesive agent.