CN107201186A - Heating can reduce the adhesion glue band of adhesion - Google Patents
Heating can reduce the adhesion glue band of adhesion Download PDFInfo
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- CN107201186A CN107201186A CN201610149607.5A CN201610149607A CN107201186A CN 107201186 A CN107201186 A CN 107201186A CN 201610149607 A CN201610149607 A CN 201610149607A CN 107201186 A CN107201186 A CN 107201186A
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- adhesive
- adhesive tape
- adhesion
- heating
- temperature
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 42
- 239000003292 glue Substances 0.000 title abstract 3
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000005187 foaming Methods 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 12
- 239000010935 stainless steel Substances 0.000 claims abstract description 12
- 239000012790 adhesive layer Substances 0.000 claims description 44
- 239000002390 adhesive tape Substances 0.000 claims description 41
- -1 acryl Chemical group 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 23
- 230000001681 protective effect Effects 0.000 claims description 20
- 239000010410 layer Substances 0.000 claims description 18
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 17
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 17
- 239000004698 Polyethylene Substances 0.000 claims description 8
- 229920000573 polyethylene Polymers 0.000 claims description 8
- 239000004952 Polyamide Substances 0.000 claims description 7
- 229920002873 Polyethylenimine Polymers 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 7
- 229920002647 polyamide Polymers 0.000 claims description 7
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 7
- 229920001155 polypropylene Polymers 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 239000004800 polyvinyl chloride Substances 0.000 claims description 5
- UOBYKYZJUGYBDK-UHFFFAOYSA-N 2-naphthoic acid Chemical compound C1=CC=CC2=CC(C(=O)O)=CC=C21 UOBYKYZJUGYBDK-UHFFFAOYSA-N 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 3
- 238000007664 blowing Methods 0.000 abstract 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000004033 plastic Substances 0.000 description 8
- 229920000103 Expandable microsphere Polymers 0.000 description 5
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003522 acrylic cement Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000001282 iso-butane Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019198 oils Nutrition 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention, which provides a kind of heating, can reduce the adhesion glue band of adhesion, and it is formed at least one side of a base material by that mainly can reduce the adhesion layer of adhesion with being heated to the heating that expandable material after a blowing temperature is constituted by resin.When temperature is less than the blowing temperature, the adhesion between the adhesion layer and stainless steel plate is more than 1.29N/25mm；When temperature be higher than the blowing temperature when, the adhesion between the adhesion layer and stainless steel plate starts to diminish, in one section of temperature range be less than 1.0N/25mm.The foaming temperature range is fallen between 100 DEG C and 200 DEG C.By heating-up temperature, after adhesion is reduced, adhesion glue band is easily peeled off from the thing that gets adhered.
Description
Technical Field
The invention relates to the field of adhesive tapes capable of reducing adhesive force by heating, in particular to an adhesive tape containing a material capable of foaming under heat and capable of reducing adhesive force by heating.
Background
The hot peeling film is a film with unique characteristics, has viscosity under normal temperature conditions, can be reduced only by heating, and can be easily peeled off. The application is very wide. For example: the device is used for temporarily fixing the LED, the semiconductor chip and the like so as to carry out processes such as grinding, cutting, heating and fixing and the like; temporarily protecting the chip circuit or the board surface to avoid scratching; and adhesion between glass in the process of manufacturing the touch panel. The thermal peeling film makes great contribution to automation and labor saving in various processes of electronic components.
Generally, commercially available thermal release films are required to be substantially the same as ordinary adhesive films in terms of adhesion at room temperature and to be easily peeled off by heating when peeling is required. Preferably, the user can select the particular shape of the film, roll, label, etc. to be processed to save material waste and to adapt the operation of the processing machine. The user can select the heating temperature at the time of peeling, if possible. Most importantly, the thermal release film is not damaged when peeled off.
The structural cross-section of a conventional thermal release film is shown in FIG. 1. The thermal peeling film comprises a substrate layer 1, a thermal peeling adhesive layer 2 and a release layer 3. The base material layer 1 is usually made of a fiber base material such as a nonwoven fabric web. The substrate layer 1 is used for bearing the thermal release adhesive layer 2 and providing the adhesive body fixing support strength when being adhered to the adhesive body. The release layer 3 protects the thermal release adhesive layer 2 from external contaminants before the thermal release film is used, thereby reducing the adhesion and scratching the adherend. It is noted that for many prior art or patents, the main difference between them is not on the substrate layer 1 and the release layer 3, since the materials used for these articles are all existing finished products. The main difference is the material and the manufacturing method of the thermal release adhesive layer 2, and the properties of the thermal release film produced by different technologies are different, and the applied layer is also different.
In view of the prior art, many prior art thermal release adhesive layers provide references to the industry for making thermal release films. For example, taiwan patent No. I351425 proposes the use of a heat-expandable adhesive layer containing a foaming agent, wherein the heat-expandable adhesive layer has a shear elastic modulus (23 ℃) of 7 × 106Pa or more in an unfoamed state. Further, taiwan patent No. I428417 proposes a heat-peelable double-sided pressure-sensitive adhesive sheet in which a heat-peelable pressure-sensitive adhesive layer contains heat-expandable microspheres in an amount of 5 to 200 parts by weight per 100 parts by weight of the polymer components constituting the heat-peelable pressure-sensitive adhesive layer.
However, the thermal release adhesive layer has many different compositions and methods for making the same, and the resulting thermal release film has different adhesive properties and release characteristics, and is suitable for different thermal release films and processes.
Disclosure of Invention
Accordingly, the present invention is directed to an adhesive tape which can be heated to reduce the adhesive force, has different adhesive forces before and after thermal peeling, and can be easily peeled from an adherend after the adhesive force is reduced. In order to achieve the purpose, the technical scheme of the invention is as follows:
an adhesive tape capable of reducing adhesion by heating, which is formed by forming an adhesive layer capable of reducing adhesion by heating a foamable material after heating to a foaming temperature and a resin on at least one side of a base material, wherein the adhesion between the adhesive layer and a stainless steel plate is more than 1.29N/25mm when the temperature is lower than the foaming temperature; when the temperature is higher than the foaming temperature, the adhesive force between the adhesive layer and the stainless steel plate begins to be reduced and is less than 1.0N/25mm in a temperature interval; the stainless steel plate is SUS 304 in specification, and is subjected to surface treatment according to Japanese Industrial Standard JIS-Z-0237; the foaming temperature range is between 100 ℃ and 200 ℃.
Preferably, the resin may be selected from at least one of acryl resin, urethane resin and epoxy resin, and the foaming temperature maintaining time may be longer than 3 seconds but shorter than 30 minutes. The adhesive tape further comprises a protective film which is detachably formed on one side of the adhesive layer different from the substrate. The protective film may be made of polyethylene terephthalate (PET), Polyethylene (PE), polypropylene (PP), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyvinyl chloride (PVC), Polyphenylene Sulfide (PPs), Polyamide (PA), Polyimide (PI), Polyethyleneimine (PEI), Polycarbonate (PC), or Ethylene Vinyl Acetate (EVA). The protective film may further comprise a silicone resin layer, and the substrate may be replaced by another protective film.
The substrate may be made of polyethylene terephthalate, polyethylene, polypropylene, polyethylene-2, 6-naphthalate, polybutylene terephthalate, polyvinyl chloride, polyphenylene sulfide, polyamide, polyimide, polyethyleneimine, polycarbonate, or ethylene/vinyl acetate copolymer.
The invention has the beneficial effects that:
the adhesive tape with reduced adhesion force by heating of the invention has different adhesion force before and after thermal peeling, and can be used for processing products needing the adhesion force.
Drawings
FIG. 1 is a cross-sectional view of a conventional thermal release film;
FIG. 2 is a schematic structural view of an embodiment of an adhesive tape heated to reduce adhesion according to the present invention;
FIG. 3 is a schematic structural view of another embodiment of the adhesive tape for reducing adhesion by heating according to the present invention;
FIG. 4 is a schematic structural view of another embodiment of the adhesive tape for reducing adhesion force by heating according to the present invention;
wherein,
1. a substrate layer; 2. Thermally stripping the adhesive layer; 3. A release layer;
11. a substrate; 12. An adhesive layer; 13. And (5) protecting the film.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the adhesive tape with reduced adhesion force by heating according to the present invention will be described in further detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The adhesive tape of the present invention with reduced adhesion force by heating has a structure as shown in fig. 2 to 4. In fig. 2, the adhesive tape has a structure in which an adhesive layer 12 is formed on one surface of a substrate 11, and a protective film 13 is formed on the adhesive layer 12. This structure facilitates the amorphous adhesive layer 12 to adhere to the substrate 11 and thus to the adhered object after the protective film 13 is peeled off. The adhesive can be further processed by bonding with an adhesive tape, such as precision cutting. In fig. 3, the adhesive tape has a structure in which protective films 13 are formed on both sides of an adhesive layer 12, and one of the protective films 13 is removed to adhere the adhesive layer 12 to an adherend; then, the other protective film 13 is peeled off, and the adhesive layer 12 is adhered to another adherend. Preferably, both adhesives have a fixed and conformable shape (e.g., a flat surface), or at least one of them has a fixed shape. In still another structure of the adhesive tape of the present invention, as shown in fig. 4, an adhesive layer 12 is formed on each of both side surfaces of a substrate 11, and then a protective film 13 is formed on each of the side surfaces of the adhesive layers 12 different from the substrate 11. Such a structure enhances the performance characteristics of the adhesive tape structure of FIG. 4, but the mechanical properties of the substrate 11 between the two adhered materials are required to satisfy the requirements after bonding. In accordance with the spirit of the present invention, if there are two adhesive layers 12 in the adhesive tape, one of the layers may be made without using a special material disclosed below.
The adhesive tape capable of reducing the adhesive force by heating is formed by forming an adhesive layer 12 capable of reducing the adhesive force by heating a resin and a foamable material to a foaming temperature on at least one surface of a base material 11, and then forming a protective film 13. The adhesion of the adhesive layer 12 varies with temperature. The test was performed on stainless steel plates: the stainless steel plate is SUS 304, and after the surface treatment is carried out according to Japanese Industrial Standard JIS-Z-0237, the adhesive force between the adhesive layer 12 and the stainless steel plate is more than 1.29N/25mm when the temperature of the adhesive tape provided by the invention is lower than the foaming temperature; when the temperature is higher than the foaming temperature, the adhesion force between the adhesion layer 12 and the stainless steel plate begins to decrease and is less than 1.0N/25mm within a temperature range. According to the following embodiments, the foaming temperature ranges between 100 ℃ and 200 ℃ using different compositions and processes. Further, the foaming temperature holding time is longer than 3 seconds but shorter than 30 minutes. Before further disclosure of the embodiments, the components are described in detail.
The substrate 11 may be made of polyethylene terephthalate (PET). However, Polyethylene (PE), polypropylene (PP), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyvinyl chloride (PVC), Polyphenylene Sulfide (PPs), Polyamide (PA), Polyimide (PI), Polyethyleneimine (PEI), Polycarbonate (PC), or Ethylene Vinyl Acetate (EVA) are also materials for the substrate 11, based on different extensibility and temperature characteristics.
The substrate 11 does not have to be bonded to the adhesive layer 12 throughout the bonding and peeling process; the substrate 11 may be replaced by another protective film 13. In addition, in order to enhance the characteristics of the base material 11, the above materials may be mixed with a suitable plasticizer, such as phthalate, dimethyl adipate, epoxidized soybean oil, etc., and may further contain additives, such as an ultraviolet absorber, a surfactant, a pigment, a dye, an antioxidant, a stabilizer, a lubricant, etc. The thickness of the substrate 11 is not limited, but may be generally 50 to 300. mu.m.
The resin may be at least one selected from acryl resin, urethane resin and epoxy resin. In order to increase the viscosity of the adhesive tape, the use of tackifying resin can be increased. The tackifying resin can be C5 petroleum resin, C9 petroleum resin, esterified rosin, terpene phenolic resin, etc. In addition, a bridging agent can be added to adjust the adhesive force and prevent the occurrence of adhesive residue. The heating foamable material is microsphere with thermoplastic polymer as shell and contains liquid low boiling point hydrocarbon. The aforementioned hydrocarbons such as n-pentane (pentane), isobutane (isobutane), propane (propane), and the like. Heating the foamable material by the gas or liquid contained therein produces foaming due to thermal expansion or decomposition. The surface of the foaming material after heating and foaming is uneven, so that the contact area between the adhesive layer 12 and an adhered object can be reduced, the adhesive property of the resin surface is further damaged, and the property of reducing the adhesive force by heating is achieved. The heat foamable material may be a general commercial product such as model F-30D or F-100MD manufactured by Songyou oil pharmaceuticals, model 051DU40 manufactured by Akzo Nobel, or the like. The present invention is not limited to the method of heating to the foaming temperature. Generally, a hot plate, hot air circulation oven, infrared heating device, tunnel oven, or other heating means that can provide thermal energy can be used. The adhesive layer 12 is formed to a thickness of about 30-50 μm, or thicker, depending on the desired specification.
The protection film 13 is required to be detachably formed on the side of the adhesive layer 12 different from the substrate 11. As described above, in a special case, the substrate 11 may be replaced with another protective film 13, and the protective films 13 may be provided on both sides of the adhesive layer 12 as shown in fig. 3. Also because of this, the protective film 13 may be made of the same material as the base material 11. Preferably, the protection film 13 is made of polyethylene terephthalate or polyethylene release film. In practice, however, the protective film 13 preferably contains a silicone resin layer (a silicone-containing polyethylene terephthalate release film may be used) to facilitate peeling from the adhesive layer 12.
The details of the manufacturing method of the present invention are further illustrated in the following four examples, but the present invention is not limited thereto.
Example one
A coating solution for an adhesive layer was prepared by uniformly mixing and dissolving 21.8 parts by weight of thermally expandable microspheres (model F-30D, manufactured by panasonic fat pharmaceuticals), 100.0 parts by weight of an acrylic adhesive (molecular weight: about 60 ten thousand, acid value: 30mg/g), 21.8 parts by weight of a tackifying resin (softening point: 150 ℃), 0.4 parts by weight of a bridging agent, 188.8 parts by weight of toluene, and 105.9 parts by weight of ethyl acetate. The prepared adhesive solution was applied to a polyethylene terephthalate film (model BP21, manufactured by south Asia plastics industries, Ltd.) having a film thickness of 100 μm, and sufficiently dried at 70 ℃ to form an adhesive layer having a thickness of 32 μm, and a silicone-treated polyethylene terephthalate film (model L138A, manufactured by south Asia plastics industries, Ltd.) having a film thickness of 38 μm was applied to produce a heat-peelable adhesive tape. The test results of the adhesive tape manufactured according to this example are shown in table 1.
As can be seen from Table 1, the heat-peelable adhesive tape in this example, which was heated with a heating plate for 15 seconds to 60 seconds, also had a peel strength of at least 2.72N/25mm at 80 ℃. On the other hand, the peel strength starts to decrease to 1.0N/25mm or less at 100 ℃ or higher. When the temperature is over 140 ℃, the peeling strength begins to rise, but the peeling strength does not exceed 1.0N/25 mm. Between 1 minute and 30 minutes heating with a hot air circulation oven, yet at least 2.44N/25mm peel strength at 80 ℃. On the other hand, the peel strength starts to decrease to 1.0N/25mm or less at 100 ℃ or higher. When the temperature reaches 120 ℃, the peeling strength begins to rise; some of the fractions exceeded 1.0N/25mm by 140 ℃ (heating for 5 min, 10 min and 30 min). It can be seen that the optimal foaming temperature range in this embodiment falls between 100 ℃ and 120 ℃.
TABLE 1
Example two
A coating solution for an adhesive layer was prepared by uniformly mixing and dissolving 22.1 parts by weight of thermally expandable microspheres (model 051DU40, manufactured by akksonobel), 100.0 parts by weight of an acrylic adhesive (having a molecular weight of about 60 ten thousand and an acid value of 30mg/g), 22.1 parts by weight of a tackifying resin (having a softening point of 150 ℃), 0.7 parts by weight of a crosslinking agent, 188.5.1 parts by weight of toluene, and 105.9 parts by weight of ethyl acetate. The prepared adhesive solution was applied to a polyethylene terephthalate film (model BP21, manufactured by south Asia plastics industries, Ltd.) having a film thickness of 100 μm, and sufficiently dried at 80 ℃ to form an adhesive layer having a thickness of 48 μm, and a silicone-treated polyethylene terephthalate film (model L138A, manufactured by south Asia plastics industries, Ltd.) having a film thickness of 38 μm was applied to produce a heat-peelable adhesive tape. The test results of the adhesive tape manufactured according to this example are shown in table 2.
As can be seen from Table 2, the heat-peelable adhesive tape in this example, which was heated with a heating plate for 15 seconds to 60 seconds, also had a peel strength of at least 1.32N/25mm at 100 ℃. On the other hand, the peel strength starts to decrease to 1.0N/25mm or less at 120 ℃ or higher. At 160 ℃ the peel strength began to rise, but not to 1.0N/25 mm. Between 1 minute and 30 minutes heating with a hot air circulation oven, yet having a peel strength of at least 1.29N/25mm at 100 ℃. On the other hand, the peel strength started to decrease to 1.0N/25mm or less at 120 ℃ or higher, and started to increase again at 160 ℃ but did not reach 1.0N/25 mm. Therefore, the optimal foaming temperature range in this embodiment is about 120 ℃ to 160 ℃.
TABLE 2
EXAMPLE III
22.1 parts by weight of thermally expandable microspheres (model F-100MD, manufactured by Songyuan oil & fat pharmaceuticals Co., Ltd.), 100.0 parts by weight of acrylic adhesive (molecular weight: about 60 ten thousand, acid value: 30mg/g), 44.1 parts by weight of tackifying resin (softening point: 150 ℃ C.), 0.4 part by weight of bridging agent, 234.1 parts by weight of toluene and 105.9 parts by weight of ethyl acetate were uniformly mixed and dissolved to prepare a coating solution for an adhesive layer. The prepared adhesive solution was applied to a polyethylene terephthalate film (model BP21, manufactured by south Asia plastics industries, Ltd.) having a film thickness of 100 μm, and sufficiently dried at 80 ℃ to form an adhesive layer having a thickness of 40 μm, and a silicone-treated polyethylene terephthalate film (model L138A, manufactured by south Asia plastics industries, Ltd.) having a film thickness of 38 μm was applied to produce a heat-peelable adhesive tape. The test results of the adhesive tape manufactured according to this example are shown in Table 3.
As can be seen from Table 3, the heat-peelable adhesive tape in this example, which was heated with a heating plate for 15 seconds to 60 seconds, also had a peel strength of at least 1.29N/25mm at 120 ℃. On the other hand, the peel strength starts to decrease to 1.0N/25mm or less at 140 ℃ or higher. At 180 ℃ the peel strength recovery (heating for 15 seconds, 30 seconds, 45 seconds and 60 seconds) started to occur, but not to exceed 1.0N/25 mm. Between 1 minute and 30 minutes heating with a hot air circulation oven, yet having a peel strength of at least 1.95N/25mm at 120 ℃. On the other hand, the peel strength starts to decrease to 1.0N/25mm or less at 140 ℃ or higher. At 180 ℃ the peel strength recovery (heating for more than 1 minute) started to occur, but not more than 1.0N/25 mm. Therefore, the optimal foaming temperature range in this embodiment is about 140 ℃ to 180 ℃.
TABLE 3
Example four
14.7 parts by weight of thermally expandable microspheres (model EM-501, manufactured by hydrophylic chemical Co., Ltd.), 100.0 parts by weight of an acrylic adhesive (molecular weight: about 60 ten thousand, acid value: 30mg/g), 22.1 parts by weight of a tackifying resin (softening point: 150 ℃ C.), 0.9 part by weight of a bridging agent, 173.5 parts by weight of toluene, and 105.9 parts by weight of ethyl acetate were all uniformly mixed and dissolved to prepare a coating solution for an adhesive layer. The prepared adhesive solution was applied to a 38 μm thick polyethylene terephthalate film (model BP21, manufactured by south Asia plastics industries, Ltd.), sufficiently dried at 80 ℃ to form an adhesive layer having a thickness of 48 μm, and a 38 μm thick silicone-treated polyethylene terephthalate film (model L138A, manufactured by south Asia plastics industries, Ltd.) was applied to the adhesive layer to produce a heat-peelable adhesive tape. The test results of the adhesive tape manufactured according to this example are shown in Table 4.
As can be seen from Table 4, the heat-peelable adhesive tape of the present embodiment was heated with a heating plate for 15 seconds to 60 seconds, and the peel strength was always 6.78N/25mm or more at 140 ℃; the peel strength started to decrease to 1.0N/25mm or less at 160 ℃ and was maintained the same at 200 ℃. The heated material is heated in a hot air circulation oven for 1-30 minutes, and the peel strength of the material begins to decrease to below 1.0N/25mm (heated for 30 minutes) at 160 ℃ for the rest of the heating time except for heating at 120 ℃ for 30 minutes. The peel strength was 1.0N/25mm or less at 180 ℃ and was maintained the same up to 200 ℃. It can be seen that the optimal foaming temperature range in this example falls between 180 ℃ and 200 ℃.
TABLE 4
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. An adhesive tape capable of reducing adhesive force by heating, which is formed with an adhesive layer capable of reducing adhesive force by heating a resin and a foamable material after heating to a foaming temperature on at least one side of a base material, characterized in that: when the temperature is lower than the foaming temperature, the adhesion force between the adhesion layer and the stainless steel plate is more than 1.29N/25 mm; when the temperature is higher than the foaming temperature, the adhesive force between the adhesive layer and the stainless steel plate begins to be reduced and is less than 1.0N/25mm in a temperature interval; the stainless steel plate is SUS 304 in specification, and is subjected to surface treatment according to Japanese Industrial Standard JIS-Z-0237; the foaming temperature range is between 100 ℃ and 200 ℃.
2. The adhesive tape according to claim 1, wherein the resin is at least one selected from the group consisting of acryl resin, urethane resin and epoxy resin.
3. The adhesive tape according to claim 1, wherein the foaming temperature is maintained for a period of time longer than 3 seconds and shorter than 30 minutes.
4. The adhesive tape of claim 1, further comprising a protective film detachably disposed on a side of the adhesive layer different from the substrate.
5. The adhesive tape according to claim 4, wherein the protective film is made of polyethylene terephthalate, polyethylene, polypropylene, polyethylene-2, 6-naphthalate, polybutylene terephthalate, polyvinyl chloride, polyphenylene sulfide, polyamide, polyimide, polyethyleneimine, polycarbonate, or ethylene/vinyl acetate copolymer.
6. The adhesive tape of claim 4, wherein the protective film has a silicone layer thereon.
7. The adhesive tape according to claim 4, wherein the substrate is replaced with another protective film.
8. The adhesive tape according to claim 1, wherein the substrate is made of polyethylene terephthalate, polyethylene, polypropylene, polyethylene-2, 6-naphthalate, polybutylene terephthalate, polyvinyl chloride, polyphenylene sulfide, polyamide, polyimide, polyethyleneimine, polycarbonate, or ethylene/vinyl acetate copolymer.
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| CN201610149607.5A CN107201186A (en) | 2016-03-16 | 2016-03-16 | Heating can reduce the adhesion glue band of adhesion |
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| CN201610149607.5A CN107201186A (en) | 2016-03-16 | 2016-03-16 | Heating can reduce the adhesion glue band of adhesion |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111117430A (en) * | 2019-12-31 | 2020-05-08 | 东莞市德聚胶接技术有限公司 | Epoxy resin three-proofing paint and preparation method thereof |
| CN113224217A (en) * | 2020-01-21 | 2021-08-06 | 达迈科技股份有限公司 | Composite film for LED wafer level packaging |
| TWI809659B (en) * | 2021-03-05 | 2023-07-21 | 日商日東電工股份有限公司 | Double-sided adhesive sheet with backing |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1390763A (en) * | 2001-04-25 | 2003-01-15 | 日东电工株式会社 | Method and apparatus for hot separating adhered articles |
| CN103205225A (en) * | 2012-01-17 | 2013-07-17 | 日东电工株式会社 | Polymer For Adhesive, Adhesive Composition And Heat-peelable Adhesive Sheet |
| CN105131869A (en) * | 2015-09-10 | 2015-12-09 | 深圳市美信电子有限公司 | Thermal viscosity loss pressure-sensitive adhesive, thermally peelable adhesive tape and preparation methods of thermal viscosity loss pressure-sensitive adhesive and thermally peelable adhesive tape |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1390763A (en) * | 2001-04-25 | 2003-01-15 | 日东电工株式会社 | Method and apparatus for hot separating adhered articles |
| CN103205225A (en) * | 2012-01-17 | 2013-07-17 | 日东电工株式会社 | Polymer For Adhesive, Adhesive Composition And Heat-peelable Adhesive Sheet |
| CN105131869A (en) * | 2015-09-10 | 2015-12-09 | 深圳市美信电子有限公司 | Thermal viscosity loss pressure-sensitive adhesive, thermally peelable adhesive tape and preparation methods of thermal viscosity loss pressure-sensitive adhesive and thermally peelable adhesive tape |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111117430A (en) * | 2019-12-31 | 2020-05-08 | 东莞市德聚胶接技术有限公司 | Epoxy resin three-proofing paint and preparation method thereof |
| CN113224217A (en) * | 2020-01-21 | 2021-08-06 | 达迈科技股份有限公司 | Composite film for LED wafer level packaging |
| TWI809659B (en) * | 2021-03-05 | 2023-07-21 | 日商日東電工股份有限公司 | Double-sided adhesive sheet with backing |
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