CN113211273A - Equipment and method for removing glue overflow after semiconductor plastic packaging - Google Patents
Equipment and method for removing glue overflow after semiconductor plastic packaging Download PDFInfo
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- CN113211273A CN113211273A CN202110552515.2A CN202110552515A CN113211273A CN 113211273 A CN113211273 A CN 113211273A CN 202110552515 A CN202110552515 A CN 202110552515A CN 113211273 A CN113211273 A CN 113211273A
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- 239000003292 glue Substances 0.000 title claims abstract description 93
- 238000000034 method Methods 0.000 title claims abstract description 39
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- 238000004806 packaging method and process Methods 0.000 title description 7
- 230000007246 mechanism Effects 0.000 claims abstract description 55
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- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 5
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- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
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- 239000004745 nonwoven fabric Substances 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
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- 239000011159 matrix material Substances 0.000 description 2
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- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- 229910003460 diamond Inorganic materials 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention relates to a device and a method for removing excessive glue after semiconductor plastic package, wherein the device comprises: a frame; a support wheel rotatably mounted on the frame; the conveying mechanisms arranged on the rack are arranged on two sides of the supporting wheel and are used for conveying products to be subjected to photoresist stripping; the mounting rack is arranged on the rack and can be adjusted in a lifting manner; the polishing wheel which is rotatably arranged on the mounting frame is correspondingly arranged above the supporting wheel; the driving piece is arranged on the mounting frame and is in driving connection with the grinding wheel, the grinding wheel can be driven to rotate, and the surface of a product to be subjected to glue removal, which is positioned on the supporting wheel, can be ground through the rotation of the grinding wheel so as to remove glue overflow; install in the frame and control the controller that the mounting bracket carries out lift adjustment, the controller still is connected with driving piece control. The automatic glue removing device can automatically and effectively remove excessive glue which is thicker and covers the whole mounting surface on the mounting product, saves the step of manual polishing, and can accurately control the thickness of the product.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to equipment and a method for removing glue overflowing after semiconductor plastic packaging.
Background
Most of base materials used in the current semiconductor packaging and testing industry are copper base bodies, and the copper base bodies are the main selection of electronic device product frames because the copper base bodies have very good electric conduction and heat conduction capabilities. In addition, the partial frame is made of other metals or alloys as a substrate, and a layer of copper or other metals (such as nickel and the like) is plated on the surface of the partial frame. Most of the plastic packaging materials are epoxy resins, and different flash removal processes are required according to different fillers.
Early deflashing processes were very simple, such as soaking with 50% sulfuric acid or even hydrochloric acid solutions at high temperatures to detach the flash from the substrate, and finally brushing off the flash with a copper brush. However, this process is disadvantageous, inter alia, in that it is a safety concern, sulfuric acid being a highly corrosive acid, being more corrosive at high temperatures and therefore being a great safety hazard for the operator. Secondly, the reaction speed of the high-concentration sulfuric acid with the copper matrix is difficult to control at high temperature, and over-corrosion phenomenon can be caused locally to cause damage to the matrix. Thirdly, there is no organic solvent in the solution, which has poor softening effect on the flash, often resulting in unclean flash removal. Through the improvement of the process flow and the addition of partial alkaline organic solvent in the solution, the current popular deflashing process is gradually formed.
The existing glue removing mode is a mode of soaking in chemical liquid and washing in high-pressure water, and the process is to soak a product frame in chemical solution by using alkaline chemicals under the condition of heating so as to fully soften overflow glue attached to a lead frame, and then to separate and remove the softened overflow from the product frame by using high-pressure water.
Alkaline deflash solutions are the most widely used, relatively mature and sophisticated processes at present. The main components of the corrosion inhibitor comprise an alkaline organic solvent and other additives (including a corrosion inhibitor, a surfactant, a penetrating agent and the like). The specific working mechanism is as follows:
the main role of strong base in the solution. First, the flash is separated from the substrate. Copper in alkaline solution will be oxidized under the action of oxygen in the air to generate basic salt, and can enter the solution under the action of complexing agent in the additive. The reaction is slow at low temperatures and is significantly accelerated at high temperatures, so the alkaline deflash solution needs to be heated to above seventy degrees. Second, the pH of the solution is controlled. The organic solvent selected in the alkaline solution has stronger activity under alkaline conditions, so that the softening efficiency of the organic solvent can be ensured, and the softening effect is ensured.
However, with the development of technology, more and more electronic products tend to be larger and thinner, and the market demand of the mounting type integrated circuit is increasing, and for the mounting type products, such as QFN (quad flat non-leaded package) type products, the glue overflow is black and thick and appears on the whole mounting surface, and the existing glue overflow removing manner cannot meet the glue overflow removing requirement of the mounting type chip for the material overflow on the product frame of the type. In prior art, to pasting the excessive gluey processing of dress class chip, need after the chemistry soaks, artifical use abrasive paper to polish to getting rid of excessive gluey, not only extravagant chemical liquid but also extravagant manpower and materials, and leaning on the artifical mode of polishing of hand, the thickness of product can not accurate control, has promoted the manufacturing cost of enterprise.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides equipment and a method for removing glue overflowing after semiconductor plastic packaging, and solves the problems that the glue overflowing of the existing surface-mounted product needs to be removed by means of manual polishing, chemical liquid and manpower and material resources are wasted, the thickness of the product cannot be accurately controlled, and the enterprise cost is increased.
The technical scheme for realizing the purpose is as follows:
the invention provides a device for removing excessive glue after semiconductor plastic package, which comprises:
a frame;
the supporting wheel is rotatably arranged on the frame;
the conveying mechanisms are arranged on two sides of the supporting wheel and used for conveying products to be subjected to photoresist stripping;
the mounting rack is arranged on the rack and can be adjusted in a lifting manner;
the polishing wheel is rotatably arranged on the mounting frame and correspondingly arranged above the supporting wheel;
the driving piece is arranged on the mounting frame and is in driving connection with the grinding wheel, the grinding wheel is driven to rotate through the driving piece, and then the surface of a product to be subjected to glue removal, which is positioned on the supporting wheel, can be ground through the rotation of the grinding wheel so as to remove glue overflow; and
install in the frame and control the mounting bracket carries out lift adjustment's controller, the controller still with driving piece control connection.
According to the glue overflow removing equipment, a product to be subjected to glue removal is automatically conveyed through the conveying mechanism, the product is conveyed onto the supporting wheel through the conveying mechanism, and then the glue overflow on the product is removed through rotation of the arranged grinding wheel, so that the glue overflow which is thicker in thickness and covers the whole mounting surface on the mounting product can be automatically and effectively removed, the steps of manual grinding are saved, and manpower and material resources are saved. And the overflowing glue is removed through equipment, so that the thickness of the product can be accurately controlled.
The semiconductor plastic-encapsulated over-flow glue removing equipment is further improved in that the equipment further comprises pressing wheels which can be adjusted in a swinging mode and are arranged on the rack, wherein the pressing wheels are arranged on two sides of the grinding wheel and are positioned above the corresponding conveying mechanisms;
and adjusting the pressing wheel through swinging so that the pressing wheel is tightly pressed on a product to be subjected to glue removal.
The semiconductor plastic-encapsulated post-flash removal equipment is further improved in that the equipment also comprises a sensor which is arranged on the rack and corresponds to the pressing wheel, and the sensor is connected with the controller;
detecting the swing of the pinch roller through the sensor so as to form a detection signal and sending the detection signal to the controller;
the controller is also in control connection with the conveying mechanism, and the controller controls and adjusts the conveying speed of the conveying mechanism after receiving the detection signal.
The semiconductor plastic-encapsulated over-flow glue removing equipment is further improved in that the equipment further comprises a support frame supported on the rack;
the supporting frame is rotatably provided with a swinging shaft, the swinging shaft is connected to the pressing wheel through an inclined rod, and the swinging shaft is also connected with a push rod;
and a pushing spring is arranged on the support frame corresponding to the push rod and is connected with the push rod and applies elasticity to the push rod so that the push rod drives the oscillating shaft to rotate, and the pressing wheel is further made to oscillate and tightly pressed on the product to be subjected to glue removal.
The semiconductor plastic-encapsulated over-flow glue removing equipment is further improved in that the equipment further comprises a track frame arranged on the rack and a telescopic adjusting piece arranged on the track frame;
the mounting frame is connected with the telescopic adjusting piece;
the mounting frame can be driven to carry out lifting adjustment relative to the track frame through telescopic adjustment of the telescopic adjusting piece, so that the distance between the mounting frame and the supporting wheel is adjusted.
The invention also provides a method for removing the glue by using the equipment for removing the overflow glue after the semiconductor plastic package, which comprises the following steps:
providing a product to be subjected to glue removal, and placing the product to be subjected to glue removal on the conveying mechanism;
starting the conveying mechanism and the driving piece, conveying the product to be subjected to glue removal between the supporting wheel and the polishing wheel by using the conveying mechanism, driving the polishing wheel to rotate by using the driving piece, and polishing the surface of the product to be subjected to glue removal by using the rotating polishing wheel to remove overflowing glue; and
in the process of removing the excessive glue, the controller collects the driving current of the driving piece in real time, and carries out lifting control adjustment on the mounting rack according to the magnitude of the driving current obtained by real-time collection so as to control the driving current of the driving piece to be stable.
The method is further improved in that the removing equipment is also provided with pressing wheels which can be adjusted in a swinging mode, and the pressing wheels are arranged on two sides of the grinding wheel;
and in the process of removing the overflowing glue, adjusting the pressing wheel to enable the pressing wheel to be tightly pressed on a product to be subjected to glue removal.
The method is further improved in that in the process of removing the overflowing glue, the controller also collects the swing condition of the pressing wheel in real time, and the conveying speed of the conveying mechanism is controlled and adjusted through the collected swing condition of the pressing wheel.
The method of the invention is further improved in that when the driving current collected by the controller changes, the controller controls the mounting frame to perform lifting movement adjustment, and simultaneously controls and adjusts the conveying speed of the conveying mechanism.
The method of the invention is further improved in that the control adjusts the conveying speed of the conveying mechanism to be less than the moving speed of the mounting frame.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor molding post-flash removal apparatus according to a first embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a semiconductor molding post-flash removal apparatus according to a second embodiment of the present invention.
Fig. 3 is a schematic diagram illustrating the operation of the apparatus for removing flash after semiconductor molding according to the second embodiment of the present invention.
Detailed Description
The invention is further described with reference to the following figures and specific examples.
Referring to fig. 1, the invention provides equipment and a method for removing excessive glue on the surface of a surface-mounted chip after semiconductor plastic packaging, which are used for solving the problem of poor removal effect on the excessive glue on the surface of the surface-mounted chip during the existing chemical soaking glue removal. The following describes the apparatus and method for removing flash after semiconductor molding according to the present invention with reference to the accompanying drawings.
Referring to fig. 1, a schematic structural diagram of a semiconductor plastic encapsulation post-flash removal apparatus according to a first embodiment of the present invention is shown. The structure of the apparatus for removing flash after semiconductor molding according to the present invention will be described with reference to fig. 1.
As shown in fig. 1, the semiconductor plastic-encapsulated flash removing apparatus of the present invention comprises a frame 21, a support wheel 22, a conveying mechanism 23, a mounting frame 24, a grinding wheel 25, a driving member and a controller; a support wheel 22 is rotatably mounted on the frame 21, the support wheel 22 being free to rotate on the frame 21; the conveying mechanism 23 is installed on the frame 21, the conveying mechanism 23 is arranged on two sides of the supporting wheel 22, the products 10 to be stripped are conveyed through the conveying mechanism 23, the conveying directions of the conveying mechanisms 23 on the two sides of the supporting wheel 22 are consistent, the products 10 to be stripped are conveyed to the supporting wheel 22 through the conveying mechanism 23 on one side of the supporting wheel 22, the front sides of the products 10 to be stripped are arranged on the conveying mechanism 23 on the other side after passing through the supporting wheel 22, and the products 10 to be stripped can be conveyed from one side of the frame 21 to the other side through the arrangement of the conveying mechanisms 23 on the two sides. The mounting bracket 24 is mounted on the frame 21 to be adjustable in elevation so that the mounting bracket 24 moves downward to be close to the support wheel 22 or moves upward to be away from the support wheel 22 by the adjustment in elevation. The grinding wheel 25 is rotatably installed on the installation frame 24, the grinding wheel 25 is correspondingly arranged above the supporting wheel 22, a certain gap is formed between the grinding wheel 25 and the supporting wheel 22, the gap is used for allowing a product 10 to be subjected to glue removal to pass through, the supporting wheel 22 supports the bottom of the product 10 to be subjected to glue removal, the bottom of the grinding wheel 25 is in contact with the surface of the product 10 to be subjected to glue removal, and then the surface of the product 10 to be subjected to glue removal is ground through the rotation of the grinding wheel 25, so that the glue overflow is removed. The driving member is mounted on the mounting frame 24, the driving member is in driving connection with the polishing wheel 25, the polishing wheel 25 can be driven to rotate by the driving member, and further, the surface of the product 10 to be stripped, which is located above the supporting wheel 22, can be polished by the rotation of the polishing wheel 25 to remove the flash glue. The controller is installed in frame 21, and this controller control mounting bracket 24 carries out lift adjustment, and this controller still is connected with driving piece control, and the operation of the steerable driving piece through the controller realizes controlling in order to realize the rotation of wheel 25 of polishing to reach the effect of accurate control volume of polishing, realized polishing the accuracy of product.
In an embodiment of the present invention, as shown in fig. 1 and 3, the polishing wheel 25 has a cylindrical structure, the supporting wheel 22 also has a cylindrical structure, the polishing wheel 25 is aligned with the central axis of the supporting wheel 22 up and down, the portion of the polishing wheel 25 in contact with the surface of the product 10 to be degummed is a straight line, the portion of the supporting wheel 22 in contact with the bottom surface of the product 10 to be degummed is a straight line, and the two straight lines are aligned up and down, so that the upper and lower surfaces of the product 10 to be degummed are uniformly stressed when the product 10 to be degummed is polished, and the problems of deformation, warping, and the like of the product are avoided. The contact part of the polishing wheel 25 and the surface of the product 10 to be stripped is a straight line, and the polishing straight line is expanded into a surface by moving the product 10 to be stripped forward, so that the upper surface of the product 10 to be stripped is completely polished.
Preferably, the grinding wheel 25 is a soft grinding wheel, which can be uniformly attached to the surface of the product 10 to be stripped, thereby improving the grinding effect. The soft grinding wheel is made of non-woven fabric, abrasive and binding agent, wherein the non-woven fabric forms a spongy structure with large pores, the abrasive is uniformly distributed in the pores of the non-woven fabric, the binding agent is preferably made of resin materials, such as epoxy resin, and the abrasive can be made of diamond or silicon carbide. The supporting wheel 22 is a soft rubber wheel, has certain elasticity and deformability, supports the product 10 to be degumming by using the soft rubber wheel, and can absorb and buffer the short edge warpage of the product to a certain degree through the deformation of the soft rubber wheel, thereby improving the structural stability of the product.
In one embodiment of the invention, a controller is in control connection with the drive member, the controller monitoring the drive current of the drive member, when the driving current is changed, the controller adjusts the elevation of the mounting frame 24 so that the mounting frame 24 carries the grinding wheel 25 for elevation adjustment, so as to restore the driving current to the state before the change, namely the controller realizes the effect of keeping the driving current stable, to ensure the polishing effect while keeping the driving current stable, the controller controls the speed of the elevating movement of the mounting frame 24 and the conveying speed of the conveying mechanism 23 to make the conveying speed of the conveying mechanism 23 less than the speed of the elevating movement of the mounting frame 24, i.e. the product 10 to be degummed is conveyed forward slowly, and the grinding wheel 25 moves downwards and rotates rapidly, so that the overflow glue on the surface of the product can be completely ground on the premise of stable driving current. The working principle of the device is explained as follows: the excessive thickness on product surface is uneven, when grinding wheel 25 contacts with the thick excessive department of gluing of thickness, the resistance grow that this grinding wheel 25 received, thereby the drive current of driving piece can grow, for this reason, the real-time drive current of monitoring driving piece of controller, when drive current enlarges, upwards adjust grinding wheel 25's height in order to reduce grinding wheel 25 and product surface contact's inseparable degree, make drive current can descend, drive current's size through monitoring next moment, the regulation of relapse is ground grinding wheel 25 highly can make drive current get back to the state before the change, drive current's stability has been kept. After the height of the polishing wheel 25 is increased, the polishing amount of the overflowing glue with thicker thickness at the position is constant, if the conveying speed of the product is inconvenient, the overflowing glue with thicker thickness cannot be completely polished, in order to improve the polishing effect, when the controller monitors the change of the driving current, the conveying speed of the conveying mechanism 23 is synchronously controlled, the conveying speed is reduced, specifically, the conveying speed and the lifting speed of the polishing wheel can be controlled according to the change proportion of the driving current, and the proportion of the lifting speed to the conveying speed is consistent with the change proportion of the driving current. At this moment, the product moves forward slowly, the grinding wheel 25 grinds the surface of the product to enable the driving current to change continuously, the controller continues to adjust the lifting of the grinding wheel, and the working process of the grinding wheel 25 is equivalent to gradually moving downwards until the overflowed glue is completely ground.
The driving current of the grinding wheel 25 is stable, the rotating working state of the grinding wheel 25 is stable, the grinding effect of the product is stable, the acting force applied to the product is kept stable, the risk of deformation, warping and the like of the product caused by sudden change of the acting force is avoided, and the quality and the yield of the product are guaranteed.
In one embodiment of the present invention, as shown in fig. 2 and 3, the removing apparatus of the present invention further comprises swing-adjustable pinch rollers 26 mounted on the frame 21, the pinch rollers 26 being disposed on both sides of the pinch roller 25 and above the corresponding conveying mechanism 23, the pinch rollers 26 being adjusted by swing-adjustment so that the pinch rollers 26 are pressed against the product 10 to be stripped. The pinch roller 26 can realize the up-swing or the downswing through the swing regulation, and pinch roller 26 downswing is adjusted and is made this pinch roller 26 sticiss at the upper surface of waiting to remove the product 10 of gluing, and this pinch roller 26 has two, locates the both sides of polishing wheel 25, sticiss the both sides of product department of polishing through two pinch rollers 26, can play the effect of flattening to the product, avoids the product to take place to warp, the warping phenomenon at the in-process of polishing.
Preferably, the pinch roller 26 is a soft rubber wheel, has certain elasticity and deformability, and compresses the product 10 to be degummed through the soft rubber wheel, so that the product 10 to be degummed can be prevented from being damaged, and the product to be degummed is effectively protected.
Further, a supporting frame 27 is arranged on the frame 21, a swinging shaft 271 is rotatably arranged on the supporting frame 27, the swinging shaft 271 is connected to the pressing wheel 26 through an inclined rod 272, and the swinging adjustment can be carried out by driving the pressing wheel 26 through the rotation adjustment of the swinging shaft 271; a push rod 273 is connected to the swinging shaft 271; the supporting frame 27 is provided with a pushing spring 274 corresponding to the pushing rod 273, the pushing spring 274 is connected to the pushing rod 273 and applies an elastic force to the pushing rod 273 so that the pushing rod 273 drives the swinging shaft 271 to rotate, and the pressing wheel 26 swings and presses on the product 10 to be stripped. That is, the pushing spring 274 always applies pushing elastic force to the pushing rod 273, so that the swinging shaft 271 rotates toward the grinding wheel 25 and drives the pressing wheel 26 to move downwards through the inclined rod 272, and the pressing wheel 26 is pressed on the product. Preferably, the two ends of the pinch roller 26 are rotatably connected to the inclined rod 272 through bearings, and the pinch roller 26 can rotate automatically, so that the friction resistance of the pinch roller 26 to the forward conveying movement of the product can be reduced.
In order to improve the stability of the pushing spring 274, a limiting post is arranged on the supporting frame 27 corresponding to the pushing spring 274, the limiting post penetrates through the pushing spring 274, an adjusting distance is formed between the limiting post and the push rod 273, and the limiting post plays a limiting role in limiting the pushing spring 274.
Preferably, the supporting frame 27 comprises a pair of supporting plates, the pair of supporting plates are oppositely and vertically arranged on the frame 21, a cross beam 275 is supported and connected between the pair of supporting plates, a swinging shaft 271 is supported and arranged between the pair of supporting plates, the swinging shaft 271 is rotatably connected to the supporting plates through bearings, a push rod 273 arranged on the swinging shaft 271 is vertically arranged, and a pushing spring 274 is supported and connected between the push rod 273 and the cross beam 275.
In a specific embodiment of the present invention, the removing apparatus of the present invention further includes a sensor installed on the frame 21 and corresponding to the pressing wheel 26, the sensor is connected to the controller, the sensor is configured to detect the swing of the pressing wheel 26, the sensor further forms a detection signal when detecting the swing of the pressing wheel 26 and sends the detection signal to the controller, the controller is further connected to the conveying mechanism 23 in a control manner, and the controller controls and adjusts the conveying speed of the conveying mechanism 23 after receiving the detection signal.
When the overflowing glue on the surface of the product 10 to be stripped is thick, the overflowing glue can apply upward thrust to the pressing wheel 26 when passing through the pressing wheel 26, so that the pressing wheel 26 can swing upwards, the swinging of the pressing wheel 26 is detected through the arranged sensor, the thick overflowing glue can be known in advance when the thick overflowing glue does not reach the polishing wheel 25, and then the conveying speed of the conveying mechanism 23 is reduced in advance through the controller, so that the condition that the polishing wheel 25 cannot polish the thick overflowing glue completely due to the fact that the speed of the conveying mechanism 23 is too high is avoided. Preferably, in the actual production process, the thickness of the overflowing glue on the product is subjected to statistical analysis to obtain the average thickness of the overflowing glue, the overflowing glue exceeding the average thickness is defined as thicker, the swing angle of the pressing wheel 26 can be calculated through the average thickness of the overflowing glue, the sensor detects the actual swing condition of the pressing wheel 26, when the actual swing condition is greater than the swing angle corresponding to the average thickness of the overflowing glue, the sensor forms a detection signal to inform the controller, and the controller controls the conveying mechanism 23 to reduce the conveying speed. Preferably, a set speed, which is lower than the normal conveying speed of the conveying mechanism 23, may be preset in the controller, and when the controller receives the detection signal of the sensor, the conveying speed of the conveying mechanism 23 is controlled to be adjusted to the set speed.
In a preferred embodiment, the sensor is a laser sensor, the laser sensor is supported on the frame 21, the laser sensor is correspondingly located at the pinch roller 26, when the pinch roller 26 is in a normal state, the laser sensor is not triggered, and when the pinch roller 26 swings upwards to shield the laser sensor, the laser sensor is triggered to form a detection signal.
In another preferred embodiment, the sensor is a distance sensor mounted on the support frame 27, the distance sensor is used for measuring the distance between itself and the inclined rod 272, when the pressing wheel 26 swings upwards, the inclined rod 272 also moves upwards, and thus the distance sensor detects the distance change and forms a detection signal.
In one embodiment of the present invention, as shown in fig. 1 and 2, the removing apparatus of the present invention further comprises a rail frame 29 supported on the frame 21 and a telescopic adjusting member 31 mounted on the rail frame 29; the mounting frame 24 is connected to a telescopic adjustment member 31, and the telescopic adjustment of the telescopic adjustment member 31 can bring the mounting frame 24 into a lifting adjustment relative to the rail frame 29, thereby adjusting the distance between the mounting frame 24 and the support wheel 22.
Preferably, the track frame 29 and the mounting frame 24 are both door-shaped frames, a telescopic adjusting piece 31 is arranged at the top of the track frame 29, and the telescopic adjusting piece 31 can be telescopically adjusted; the mounting frame 24 is disposed inside the rail frame 29, and the telescopic adjustment member 31 is telescopically adjusted to allow the mounting frame 24 to be adjusted up and down relative to the rail frame 29.
In order to improve the stability of the up-and-down movement adjustment of the mounting frame 24, vertical guide rails 291 are arranged on the track frame 29; the mounting frame 24 is provided with a sliding block corresponding to the vertical guide rail 291, and the sliding block is slidably disposed on the vertical guide rail 291. Through the sliding fit of the vertical guide rail 291 and the slider, the up-and-down movement of the mounting frame 24 can be limited and guided. In a preferred embodiment, the vertical guide rail 291 is a square rail, which is fixedly connected to the inner side of the rail frame 29, and a slider is disposed on the outer side of the mounting frame 24, and a square groove is formed on the slider, so that the slider can be clamped on the square rail through the square groove, and the slider can slide along the square rail for adjustment. In another preferred embodiment, the vertical guide rail 291 is a rail groove disposed on the inner side of the rail frame 29, and a slider on the mounting frame 24 is inserted into the rail groove, and the slider can be slidably adjusted in the rail groove.
In a preferred embodiment of the present invention, the telescopic adjusting member is a cylinder, a piston rod of the cylinder is fixedly connected to the mounting frame, and the mounting frame can be driven to move up and down for adjustment by the extension and contraction of the piston rod. The controller is connected with the cylinder in a control mode and can control the operation of the cylinder.
In another preferred embodiment of the present invention, the telescopic adjusting member is a push rod motor, a push rod on the push rod motor is fixedly connected with the mounting frame, the mounting frame can be driven to move up and down for adjustment through the extension and retraction of the push rod, and the controller is in control connection with the push rod motor.
In one embodiment of the present invention, the driving member is a motor, a motor shaft of the motor is in driving connection with the grinding wheel 25 through a belt transmission, specifically, a belt pulley is fixedly connected to a shaft of the grinding wheel 25, a belt pulley is also fixedly connected to a motor shaft of the motor, and the belt is sleeved on the two belt pulleys, so that the rotation of the motor shaft can be transmitted to the shaft of the grinding wheel 25 through the two belt pulleys and the belt, and further, the grinding wheel 25 is driven to rotate.
Preferably, the controller is connected with the motor control, and the controller can detect the driving current of the motor. Specifically, a current sensor may be installed at a power source of the motor, and the driving current of the motor may be detected by the current sensor, and then the current sensor may be connected to the controller to transmit the detected driving current to the controller.
In one embodiment of the invention, as shown in fig. 3, the removal apparatus of the invention further comprises a plurality of auxiliary wheels 28 rotatably mounted on the frame 21, the auxiliary wheels 28 being disposed above the transfer mechanism 23. When the product 10 to be subjected to glue removal is conveyed to the conveying mechanism 23, if the product 10 to be subjected to glue removal passes through the auxiliary wheel 28, the auxiliary wheel 28 has a pressing effect on the product, and the effect of fixing and flattening the product can be achieved.
In an embodiment of the present invention, as shown in fig. 1, the conveying mechanism 23 is a conveying belt, the conveying belt includes a belt body 231, a driving shaft 232 and a driven shaft 233, the driving shaft 232 and the driven shaft 233 are both rotatably mounted on the frame 21 through bearings, a driving motor is disposed at the driving shaft 232 to drive the driving shaft 232 to rotate, the belt body 231 is sleeved on the driving shaft 232 and the driven shaft 233, and the belt body 231 is driven to rotate by the rotation of the driving shaft 232, so as to convey a product. In order to improve the stability of the product, the positioning holes are formed in the frame of the product, the positioning columns matched with the positioning holes are arranged on the conveying belt, and when the product is placed on the conveying belt, the positioning columns on the conveying belt are inserted into the positioning holes of the product, so that the stability of the product in the conveying process is ensured.
In one embodiment of the present invention, as shown in fig. 1 and 2, the top of the frame 21 of the present invention is formed with a platform 211, and a pair of vertical plates 212 are disposed on the platform 211, and the pair of vertical plates 212 are used for mounting the support wheels 22, the conveying mechanism 23, the support frame 27, and the rail frame 29.
The invention also provides a method for removing photoresist by using the removing equipment, which is explained below.
The method for removing the glue by using the equipment for removing the overflowing glue after the semiconductor plastic package comprises the following steps of:
as shown in fig. 1, a product 10 to be stripped is provided, and the product 10 to be stripped is placed on a conveying mechanism 23;
starting the conveying mechanism 23 and the driving part, conveying the product 10 to be subjected to glue removal between the supporting wheel 22 and the polishing wheel 25 by using the conveying mechanism 23, driving the polishing wheel 25 to rotate by using the driving part, and polishing the surface of the product 10 to be subjected to glue removal by using the rotating polishing wheel 25 to remove overflowing glue;
in the process of removing the excessive glue, the controller collects the driving current of the driving piece in real time, and carries out lifting control adjustment on the mounting frame 24 according to the size of the driving current obtained by real-time collection so as to control the driving current of the driving piece to keep stable.
Further, the controller collects the driving current of the driving part in real time, compares the driving current collected in real time with a set current value, and when the driving current is inconsistent with the set current value, the controller performs lifting adjustment on the mounting frame 24, collects the driving current at the next moment after adjustment and compares the driving current with the set current value, and if the driving current is inconsistent with the set current value, the controller continues to lift and adjust the mounting frame 24 until the driving current is consistent with the set current value. Specifically, the variation of the driving current is caused by the thick glue overflow on the product, and the driving current becomes large, and the controller adjusts the mounting frame 24 to move upwards, so that the driving current is kept stable.
In order to improve the polishing effect, when the controller monitors that the driving current changes, the controller controls the mounting frame to carry out lifting adjustment and simultaneously also controls and adjusts the conveying speed of the conveying mechanism, and the conveying speed of the conveying mechanism is adjusted to be smaller than the lifting movement speed of the mounting frame, so that the overflowing glue on the surface of the product is polished completely. Preferably, the controller calculates a change ratio of the driving current when monitoring a change of the driving current, and controls and adjusts the conveying speed and the lifting speed of the grinding wheel according to the change ratio of the driving current, so that the ratio of the lifting speed to the conveying speed is consistent with the change ratio of the driving current.
In one embodiment of the present invention, as shown in fig. 2 and 3, the removing apparatus of the present invention is further provided with a swing-adjustable pinch roller 26, the pinch roller 26 being provided on both sides of the grinding wheel 25;
during the process of removing the flash, the pinch roller 26 is adjusted to press the pinch roller 26 against the product to be stripped. The two pressing wheels 26 are used for pressing the two sides of the polishing position of the product, so that the product can be leveled, and the phenomena of deformation and warping of the product in the polishing process are avoided.
Further, in the process of removing the excessive glue, the controller also collects the swing condition of the pressing wheel in real time, and the conveying speed of the conveying mechanism is controlled and adjusted through the collected swing condition of the pressing wheel.
Specifically, a sensor is arranged at the position of the pressing wheel, the swinging of the pressing wheel is detected through the sensor, when the glue overflowing from the product passing through the position of the pressing wheel is thick, the thick glue overflowing applies upward thrust to the pressing wheel, so that the pressing wheel 26 can swing upwards, the swinging of the pressing wheel 26 is detected through the arranged sensor, the thick glue overflowing can be known in advance when the thick glue does not reach the position of the polishing wheel 25, and then the conveying speed of the conveying mechanism 23 is reduced in advance through the controller, so that the condition that the polishing wheel 25 cannot polish the thick glue overflowing due to the fact that the speed of the conveying mechanism 23 is too high is avoided.
Preferably, after the controller receives the detection signal that the sensor sent, control transport mechanism and reduce conveying speed to let the product remove towards the wheel of polishing at a slow speed, improve the effect of polishing processing to the excessive glue of thickness.
The equipment and the method for removing the overflowing glue after the semiconductor plastic package have the beneficial effects that: the height of the polishing wheel is adjusted according to the change of the driving current by monitoring the driving current in real time in the polishing process, so that the stable driving current can be kept, the polishing accuracy is ensured, and the problems of slight deformation and warping of a product are solved. Conveying mechanism and supporting wheel have formed three point support, and the unevenness of the long limit direction that can effectual adaptation product combines the pinch roller that sets up, can reach the effect of fixing and flattening the product.
While the present invention has been described in detail and with reference to the embodiments thereof as illustrated in the accompanying drawings, it will be apparent to one skilled in the art that various changes and modifications can be made therein. Therefore, certain details of the embodiments are not to be interpreted as limiting, and the scope of the invention is to be determined by the appended claims.
Claims (10)
1. The utility model provides an excessive gluey equipment of getting rid of behind semiconductor plastic envelope which characterized in that includes:
a frame;
the supporting wheel is rotatably arranged on the frame;
the conveying mechanisms are arranged on two sides of the supporting wheel and used for conveying products to be subjected to photoresist stripping;
the mounting rack is arranged on the rack and can be adjusted in a lifting manner;
the polishing wheel is rotatably arranged on the mounting frame and correspondingly arranged above the supporting wheel;
the driving piece is arranged on the mounting frame and is in driving connection with the grinding wheel, the grinding wheel is driven to rotate through the driving piece, and then the surface of a product to be subjected to glue removal, which is positioned on the supporting wheel, can be ground through the rotation of the grinding wheel so as to remove glue overflow; and
install in the frame and control the mounting bracket carries out lift adjustment's controller, the controller still with driving piece control connection.
2. The semiconductor plastic package post-flash removal apparatus of claim 1, further comprising swing-adjustable pinch rollers mounted on the frame, the pinch rollers being disposed on both sides of the grinding wheel and above the corresponding transfer mechanism;
and adjusting the pressing wheel through swinging so that the pressing wheel is tightly pressed on a product to be subjected to glue removal.
3. The semiconductor plastic package post-flash removal device of claim 2, further comprising a sensor mounted on the frame and disposed corresponding to the pinch roller, the sensor being connected to the controller;
detecting the swing of the pinch roller through the sensor so as to form a detection signal and sending the detection signal to the controller;
the controller is also in control connection with the conveying mechanism, and the controller controls and adjusts the conveying speed of the conveying mechanism after receiving the detection signal.
4. The semiconductor plastic package post-flash removal device of claim 2, further comprising a support bracket supported on the frame;
the supporting frame is rotatably provided with a swinging shaft, the swinging shaft is connected to the pressing wheel through an inclined rod, and the swinging shaft is also connected with a push rod;
and a pushing spring is arranged on the support frame corresponding to the push rod and is connected with the push rod and applies elasticity to the push rod so that the push rod drives the oscillating shaft to rotate, and the pressing wheel is further made to oscillate and tightly pressed on the product to be subjected to glue removal.
5. The semiconductor plastic package post-flash removal device of claim 1, further comprising a rail frame supported on the frame and a telescopic adjusting member mounted on the rail frame;
the mounting frame is connected with the telescopic adjusting piece;
the mounting frame can be driven to carry out lifting adjustment relative to the track frame through telescopic adjustment of the telescopic adjusting piece, so that the distance between the mounting frame and the supporting wheel is adjusted.
6. A method for removing photoresist by using the apparatus for removing flash after semiconductor plastic encapsulation of claim 1, comprising the steps of:
providing a product to be subjected to glue removal, and placing the product to be subjected to glue removal on the conveying mechanism;
starting the conveying mechanism and the driving piece, conveying the product to be subjected to glue removal between the supporting wheel and the polishing wheel by using the conveying mechanism, driving the polishing wheel to rotate by using the driving piece, and polishing the surface of the product to be subjected to glue removal by using the rotating polishing wheel to remove overflowing glue; and
in the process of removing the excessive glue, the controller collects the driving current of the driving piece in real time, and carries out lifting control adjustment on the mounting rack according to the magnitude of the driving current obtained by real-time collection so as to control the driving current of the driving piece to be stable.
7. The method of claim 6, wherein said removing apparatus further comprises swingably adjustable pinch rollers disposed on both sides of said grinding wheel;
and in the process of removing the overflowing glue, adjusting the pressing wheel to enable the pressing wheel to be tightly pressed on a product to be subjected to glue removal.
8. The method as claimed in claim 7, wherein the controller also collects the swing condition of the pressing wheel in real time during the process of removing the overflowed glue, and the conveying speed of the conveying mechanism is controlled and adjusted through the collected swing condition of the pressing wheel.
9. The method of claim 6, wherein the controller controls the mounting frame to perform the adjustment of the up-and-down movement when the driving current collected by the controller is changed, and the controller controls and adjusts the conveying speed of the conveying mechanism.
10. The method of claim 9, wherein controlling adjusts the conveying speed of the conveyor to be less than the travel speed of the mounting frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110552515.2A CN113211273A (en) | 2021-05-20 | 2021-05-20 | Equipment and method for removing glue overflow after semiconductor plastic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110552515.2A CN113211273A (en) | 2021-05-20 | 2021-05-20 | Equipment and method for removing glue overflow after semiconductor plastic packaging |
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| Publication Number | Publication Date |
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| CN113211273A true CN113211273A (en) | 2021-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110552515.2A Pending CN113211273A (en) | 2021-05-20 | 2021-05-20 | Equipment and method for removing glue overflow after semiconductor plastic packaging |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114193268A (en) * | 2021-12-26 | 2022-03-18 | 罗贵军 | New energy automobile lithium battery polar plate processingequipment |
| CN114770289A (en) * | 2022-03-23 | 2022-07-22 | 深圳市智能机器人研究院 | Grinding and polishing device and calibration method |
-
2021
- 2021-05-20 CN CN202110552515.2A patent/CN113211273A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114193268A (en) * | 2021-12-26 | 2022-03-18 | 罗贵军 | New energy automobile lithium battery polar plate processingequipment |
| CN114770289A (en) * | 2022-03-23 | 2022-07-22 | 深圳市智能机器人研究院 | Grinding and polishing device and calibration method |
| CN114770289B (en) * | 2022-03-23 | 2024-02-06 | 深圳市智能机器人研究院 | Grinding and polishing device and calibration method |
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