CN215201312U

CN215201312U - Equipment for removing excessive glue after semiconductor plastic packaging

Info

Publication number: CN215201312U
Application number: CN202121100662.8U
Authority: CN
Inventors: 魏忠亮; 王健; 王鹏; 孙彬; 孙铎; 魏冬
Original assignee: Qingdao Tairuisi Microelectronics Co Ltd
Current assignee: Qingdao Tairuisi Microelectronics Co Ltd
Priority date: 2021-05-20
Filing date: 2021-05-20
Publication date: 2021-12-17
Anticipated expiration: 2031-05-20

Abstract

The utility model relates to an excessive gluey equipment of getting rid of behind semiconductor plastic envelope, this equipment includes: a frame; a support wheel rotatably mounted on the frame; the conveying mechanisms arranged on the rack are arranged on two sides of the supporting wheel and are used for conveying products to be subjected to photoresist stripping; the mounting rack is arranged on the rack and can be adjusted in a lifting manner; the polishing wheel which is rotatably arranged on the mounting frame is correspondingly arranged above the supporting wheel; the driving piece is arranged on the mounting frame and is in driving connection with the grinding wheel, the grinding wheel can be driven to rotate, and the surface of a product to be subjected to glue removal, which is positioned on the supporting wheel, can be ground through the rotation of the grinding wheel so as to remove glue overflow; install in the frame and control the controller that the mounting bracket carries out lift adjustment, the controller still is connected with driving piece control. The utility model discloses can be to pasting the thick excessive glue that just covers whole subsides dress face that appears on the dress class product and realize automatic effectual getting rid of, saved the step of artifical polishing, the thickness of control product that can be accurate.

Description

Equipment for removing excessive glue after semiconductor plastic packaging

Technical Field

The utility model relates to a semiconductor package technical field refers in particular to a semiconductor plastic envelope back excessive glue removal equipment.

Background

Most of base materials used in the current semiconductor packaging and testing industry are copper base bodies, and the copper base bodies are the main selection of electronic device product frames because the copper base bodies have very good electric conduction and heat conduction capabilities. In addition, the partial frame is made of other metals or alloys as a substrate, and a layer of copper or other metals (such as nickel and the like) is plated on the surface of the partial frame. Most of the plastic packaging materials are epoxy resins, and different flash removal processes are required according to different fillers.

Early deflashing processes were very simple, such as soaking with 50% sulfuric acid or even hydrochloric acid solutions at high temperatures to detach the flash from the substrate, and finally brushing off the flash with a copper brush. However, this process is disadvantageous, inter alia, in that it is a safety concern, sulfuric acid being a highly corrosive acid, being more corrosive at high temperatures and therefore being a great safety hazard for the operator. Secondly, the reaction speed of the high-concentration sulfuric acid with the copper matrix is difficult to control at high temperature, and over-corrosion phenomenon can be caused locally to cause damage to the matrix. Thirdly, there is no organic solvent in the solution, which has poor softening effect on the flash, often resulting in unclean flash removal. Through the improvement of the process flow and the addition of partial alkaline organic solvent in the solution, the current popular deflashing process is gradually formed.

The existing glue removing mode is a mode of soaking in chemical liquid and washing in high-pressure water, and the process is to soak a product frame in chemical solution by using alkaline chemicals under the condition of heating so as to fully soften overflow glue attached to a lead frame, and then to separate and remove the softened overflow from the product frame by using high-pressure water.

Alkaline deflash solutions are the most widely used, relatively mature and sophisticated processes at present. The main components of the corrosion inhibitor comprise an alkaline organic solvent and other additives (including a corrosion inhibitor, a surfactant, a penetrating agent and the like). The specific working mechanism is as follows:

the main role of strong base in the solution. First, the flash is separated from the substrate. Copper in alkaline solution will be oxidized under the action of oxygen in the air to generate basic salt, and can enter the solution under the action of complexing agent in the additive. The reaction is slow at low temperatures and is significantly accelerated at high temperatures, so the alkaline deflash solution needs to be heated to above seventy degrees. Second, the pH of the solution is controlled. The organic solvent selected in the alkaline solution has stronger activity under alkaline conditions, so that the softening efficiency of the organic solvent can be ensured, and the softening effect is ensured.

However, with the development of technology, more and more electronic products tend to be larger and thinner, and the market demand of the mounting type integrated circuit is increasing, and for the mounting type products, such as QFN (quad flat non-leaded package) type products, the glue overflow is black and thick and appears on the whole mounting surface, and the existing glue overflow removing manner cannot meet the glue overflow removing requirement of the mounting type chip for the material overflow on the product frame of the type. In prior art, to pasting the excessive gluey processing of dress class chip, need after the chemistry soaks, artifical use abrasive paper to polish to getting rid of excessive gluey, not only extravagant chemical liquid but also extravagant manpower and materials, and leaning on the artifical mode of polishing of hand, the thickness of product can not accurate control, has promoted the manufacturing cost of enterprise.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's defect, provide a semiconductor plastic envelope back overflow glues and gets rid of equipment, solve present subsides dress class product and remove overflow glue need get rid of with the help of the manual mode of polishing of manual work, not only extravagant chemical liquid but also extravagant manpower and materials, still have the problem that the thickness of product can not accurate control and promotion cost in business.

The technical scheme for realizing the purpose is as follows:

the utility model provides an excessive gluey clarification plant behind semiconductor plastic envelope, include:

a frame;

the supporting wheel is rotatably arranged on the frame;

the conveying mechanisms are arranged on two sides of the supporting wheel and used for conveying products to be subjected to photoresist stripping;

the mounting rack is arranged on the rack and can be adjusted in a lifting manner;

the polishing wheel is rotatably arranged on the mounting frame and correspondingly arranged above the supporting wheel;

the driving piece is arranged on the mounting frame and is in driving connection with the grinding wheel, the grinding wheel is driven to rotate through the driving piece, and then the surface of a product to be subjected to glue removal, which is positioned on the supporting wheel, can be ground through the rotation of the grinding wheel so as to remove glue overflow; and

install in the frame and control the mounting bracket carries out lift adjustment's controller, the controller still with driving piece control connection.

The utility model discloses a product that the equipment was got rid of to excessive glue waits to be glued through the automatic transport of transport mechanism, and on the product was conveyed the supporting wheel by transport mechanism, and then the rotatory removal that realizes excessive glue on the product of the wheel of polishing that passes through the setting again, can be thicker and cover the excessive glue of whole subsides dress face to pasting the thickness that appears on the dress class product and realize automatic effectual getting rid of, saved the step of artifical polishing, saved manpower and materials. And the overflowing glue is removed through equipment, so that the thickness of the product can be accurately controlled.

The semiconductor plastic-encapsulated glue overflow removing equipment of the utility model is further improved in that the equipment also comprises a pressing wheel which can be adjusted in a swinging way and is arranged on the frame, and the pressing wheel is arranged at two sides of the grinding wheel and is positioned above the corresponding conveying mechanism;

and adjusting the pressing wheel through swinging so that the pressing wheel is tightly pressed on a product to be subjected to glue removal.

The semiconductor plastic-encapsulated glue overflow removing equipment of the utility model is further improved in that the equipment also comprises a sensor which is arranged on the frame and corresponds to the pinch roller, and the sensor is connected with the controller;

detecting the swing of the pinch roller through the sensor so as to form a detection signal and sending the detection signal to the controller;

the controller is also in control connection with the conveying mechanism, and the controller controls and adjusts the conveying speed of the conveying mechanism after receiving the detection signal.

The semiconductor plastic-encapsulated post-flash glue removing equipment of the utility model is further improved in that the equipment also comprises a support frame arranged on the frame;

the supporting frame is rotatably provided with a swinging shaft, the swinging shaft is connected to the pressing wheel through an inclined rod, and the swinging shaft is also connected with a push rod;

and a pushing spring is arranged on the support frame corresponding to the push rod and is connected with the push rod and applies elasticity to the push rod so that the push rod drives the oscillating shaft to rotate, and the pressing wheel is further made to oscillate and tightly pressed on the product to be subjected to glue removal.

The semiconductor plastic package post-overflowing glue removing device of the utility model is further improved in that the device also comprises a track frame arranged on the frame and a telescopic adjusting piece arranged on the track frame;

the mounting frame is connected with the telescopic adjusting piece;

the mounting frame can be driven to carry out lifting adjustment relative to the track frame through telescopic adjustment of the telescopic adjusting piece, so that the distance between the mounting frame and the supporting wheel is adjusted.

The utility model discloses a further improvement of the semiconductor plastic package post-flash glue removing equipment is that a vertical guide rail is arranged on the track frame;

the mounting frame is provided with a sliding block corresponding to the vertical guide rail, and the sliding block is slidably arranged on the vertical guide rail.

The utility model discloses the excessive glue equipment of getting rid of after semiconductor plastic envelope further improves and lies in, flexible regulating part is cylinder or push rod motor.

The utility model discloses the excessive gluey further improvement of removing equipment lies in behind semiconductor plastic envelope, the driving piece is the motor, the motor shaft of motor passes through belt drive and is connected with the wheel drive of polishing.

The utility model discloses the excessive gluey further improvement of removing equipment lies in behind semiconductor plastic envelope still include rotatable install in a plurality of auxiliary wheels in the frame, the auxiliary wheel is located transport mechanism's top.

The utility model discloses the excessive glue after semiconductor plastic envelope gets rid of equipment further improves and lies in, transport mechanism is the conveyer belt.

Drawings

Fig. 1 is a schematic structural diagram of a first embodiment of the semiconductor plastic package post-flash glue removing device of the present invention.

Fig. 2 is a schematic structural diagram of a second embodiment of the semiconductor plastic package post-flash removing device of the present invention.

Fig. 3 is a working principle diagram of the second embodiment of the semiconductor plastic-encapsulated back-flash removing device of the present invention.

Detailed Description

The invention will be further explained with reference to the drawings and the specific embodiments.

Referring to fig. 1, the utility model provides an excessive gluey clarification plant behind semiconductor plastic envelope for solve the current chemical soaking mode when degumming and get rid of the poor problem of effect to pasting the excessive gluey poor problem of getting rid of on class chip surface, the utility model discloses an automatic the polishing of overflow gluey on the product of clarification plant can be got rid of, has saved the step of artifical polishing, and the volume of polishing of clarification plant is accurate controllable, and the surface quality of polishing back product is even, and roughness and color and luster are unanimous, can promote the quality of product. The following description is made of the semiconductor plastic-encapsulated after-flash glue removing device of the present invention with reference to the accompanying drawings.

Referring to fig. 1, a schematic structural diagram of a first embodiment of the semiconductor plastic package back flash removing device of the present invention is shown. The structure of the semiconductor plastic package post-flash glue removing device of the present invention is described with reference to fig. 1.

As shown in fig. 1, the semiconductor plastic package flash removing apparatus of the present invention includes a frame 21, a support wheel 22, a conveying mechanism 23, an installation frame 24, a polishing wheel 25, a driving member, and a controller; a support wheel 22 is rotatably mounted on the frame 21, the support wheel 22 being free to rotate on the frame 21; the conveying mechanism 23 is installed on the frame 21, the conveying mechanism 23 is arranged on two sides of the supporting wheel 22, the products 10 to be stripped are conveyed through the conveying mechanism 23, the conveying directions of the conveying mechanisms 23 on the two sides of the supporting wheel 22 are consistent, the products 10 to be stripped are conveyed to the supporting wheel 22 through the conveying mechanism 23 on one side of the supporting wheel 22, the front sides of the products 10 to be stripped are arranged on the conveying mechanism 23 on the other side after passing through the supporting wheel 22, and the products 10 to be stripped can be conveyed from one side of the frame 21 to the other side through the arrangement of the conveying mechanisms 23 on the two sides. The mounting bracket 24 is mounted on the frame 21 to be adjustable in elevation so that the mounting bracket 24 moves downward to be close to the support wheel 22 or moves upward to be away from the support wheel 22 by the adjustment in elevation. The grinding wheel 25 is rotatably installed on the installation frame 24, the grinding wheel 25 is correspondingly arranged above the supporting wheel 22, a certain gap is formed between the grinding wheel 25 and the supporting wheel 22, the gap is used for allowing a product 10 to be subjected to glue removal to pass through, the supporting wheel 22 supports the bottom of the product 10 to be subjected to glue removal, the bottom of the grinding wheel 25 is in contact with the surface of the product 10 to be subjected to glue removal, and then the surface of the product 10 to be subjected to glue removal is ground through the rotation of the grinding wheel 25, so that the glue overflow is removed. The driving member is mounted on the mounting frame 24, the driving member is in driving connection with the polishing wheel 25, the polishing wheel 25 can be driven to rotate by the driving member, and further, the surface of the product 10 to be stripped, which is located above the supporting wheel 22, can be polished by the rotation of the polishing wheel 25 to remove the flash glue. The controller is installed in frame 21, and this controller control mounting bracket 24 carries out lift adjustment, and this controller still is connected with driving piece control, and the operation of the steerable driving piece through the controller realizes controlling in order to realize the rotation of wheel 25 of polishing to reach the effect of accurate control volume of polishing, realized polishing the accuracy of product.

The utility model discloses an in a specific embodiment, combine shown in fig. 1 and 3, the wheel 25 of polishing is cylindrical structure, supporting wheel 22 also is cylindrical structure, should polish and take turns 25 and supporting wheel 22's center pin and align the setting from top to bottom, the part of contacting between the surface of wheel 25 of polishing and the product 10 of waiting to strip is a straight line, the part of contacting between supporting wheel 22 and the bottom surface of the product 10 of waiting to strip is also a straight line, these two straight lines align from top to bottom, thereby when having ensured to polish the product 10 of waiting to strip, the upper and lower surface atress of the product 10 of should waiting to strip is even, avoid taking place the deformation of product, warpage scheduling problem. The contact part of the polishing wheel 25 and the surface of the product 10 to be stripped is a straight line, and the polishing straight line is expanded into a surface by moving the product 10 to be stripped forward, so that the upper surface of the product 10 to be stripped is completely polished.

Preferably, the grinding wheel 25 is a soft grinding wheel, which can be uniformly attached to the surface of the product 10 to be stripped, thereby improving the grinding effect. The soft grinding wheel is made of non-woven fabric, abrasive and binding agent, wherein the non-woven fabric forms a spongy structure with large pores, the abrasive is uniformly distributed in the pores of the non-woven fabric, the binding agent is preferably made of resin materials, such as epoxy resin, and the abrasive can be made of diamond or silicon carbide. The supporting wheel 22 is a soft rubber wheel, has certain elasticity and deformability, supports the product 10 to be degumming by using the soft rubber wheel, and can absorb and buffer the short edge warpage of the product to a certain degree through the deformation of the soft rubber wheel, thereby improving the structural stability of the product.

In one embodiment of the present invention, the controller is in control connection with the driving member, the controller monitors the driving current of the driving member, when the driving current is changed, the controller adjusts the elevation of the mounting frame 24 so that the mounting frame 24 carries the grinding wheel 25 for elevation adjustment, so as to restore the driving current to the state before the change, namely the controller realizes the effect of keeping the driving current stable, to ensure the polishing effect while keeping the driving current stable, the controller controls the speed of the elevating movement of the mounting frame 24 and the conveying speed of the conveying mechanism 23 to make the conveying speed of the conveying mechanism 23 less than the speed of the elevating movement of the mounting frame 24, i.e. the product 10 to be degummed is conveyed forward slowly, and the grinding wheel 25 moves downwards and rotates rapidly, so that the overflow glue on the surface of the product can be completely ground on the premise of stable driving current. The working principle of the device is explained as follows: the excessive thickness on product surface is uneven, when grinding wheel 25 contacts with the thick excessive department of gluing of thickness, the resistance grow that this grinding wheel 25 received, thereby the drive current of driving piece can grow, for this reason, the real-time drive current of monitoring driving piece of controller, when drive current enlarges, upwards adjust grinding wheel 25's height in order to reduce grinding wheel 25 and product surface contact's inseparable degree, make drive current can descend, drive current's size through monitoring next moment, the regulation of relapse is ground grinding wheel 25 highly can make drive current get back to the state before the change, drive current's stability has been kept. After the height of the polishing wheel 25 is increased, the polishing amount of the overflowing glue with thicker thickness at the position is constant, if the conveying speed of the product is inconvenient, the overflowing glue with thicker thickness cannot be completely polished, in order to improve the polishing effect, when the controller monitors the change of the driving current, the conveying speed of the conveying mechanism 23 is synchronously controlled, the conveying speed is reduced, specifically, the conveying speed and the lifting speed of the polishing wheel can be controlled according to the change proportion of the driving current, and the proportion of the lifting speed to the conveying speed is consistent with the change proportion of the driving current. At this moment, the product moves forward slowly, the grinding wheel 25 grinds the surface of the product to enable the driving current to change continuously, the controller continues to adjust the lifting of the grinding wheel, and the working process of the grinding wheel 25 is equivalent to gradually moving downwards until the overflowed glue is completely ground.

The driving current of the grinding wheel 25 is stable, the rotating working state of the grinding wheel 25 is stable, the grinding effect of the product is stable, the acting force applied to the product is kept stable, the risk of deformation, warping and the like of the product caused by sudden change of the acting force is avoided, and the quality and the yield of the product are guaranteed.

In a specific embodiment of the present invention, as shown in fig. 2 and 3, the removing apparatus of the present invention further includes a pressing wheel 26 installed on the frame 21 and capable of being adjusted by swinging, wherein the pressing wheel 26 is disposed on both sides of the polishing wheel 25 and above the corresponding conveying mechanism 23, and the pressing wheel 26 is adjusted by swinging so that the pressing wheel 26 is pressed on the product 10 to be removed. The pinch roller 26 can realize the up-swing or the downswing through the swing regulation, and pinch roller 26 downswing is adjusted and is made this pinch roller 26 sticiss at the upper surface of waiting to remove the product 10 of gluing, and this pinch roller 26 has two, locates the both sides of polishing wheel 25, sticiss the both sides of product department of polishing through two pinch rollers 26, can play the effect of flattening to the product, avoids the product to take place to warp, the warping phenomenon at the in-process of polishing.

Preferably, the pinch roller 26 is a soft rubber wheel, has certain elasticity and deformability, and compresses the product 10 to be degummed through the soft rubber wheel, so that the product 10 to be degummed can be prevented from being damaged, and the product to be degummed is effectively protected.

Further, a supporting frame 27 is arranged on the frame 21, a swinging shaft 271 is rotatably arranged on the supporting frame 27, the swinging shaft 271 is connected to the pressing wheel 26 through an inclined rod 272, and the swinging adjustment can be carried out by driving the pressing wheel 26 through the rotation adjustment of the swinging shaft 271; a push rod 273 is connected to the swinging shaft 271; the supporting frame 27 is provided with a pushing spring 274 corresponding to the pushing rod 273, the pushing spring 274 is connected to the pushing rod 273 and applies an elastic force to the pushing rod 273 so that the pushing rod 273 drives the swinging shaft 271 to rotate, and the pressing wheel 26 swings and presses on the product 10 to be stripped. That is, the pushing spring 274 always applies pushing elastic force to the pushing rod 273, so that the swinging shaft 271 rotates toward the grinding wheel 25 and drives the pressing wheel 26 to move downwards through the inclined rod 272, and the pressing wheel 26 is pressed on the product. Preferably, the two ends of the pinch roller 26 are rotatably connected to the inclined rod 272 through bearings, and the pinch roller 26 can rotate automatically, so that the friction resistance of the pinch roller 26 to the forward conveying movement of the product can be reduced.

In order to improve the stability of the pushing spring 274, a limiting post is arranged on the supporting frame 27 corresponding to the pushing spring 274, the limiting post penetrates through the pushing spring 274, an adjusting distance is formed between the limiting post and the push rod 273, and the limiting post plays a limiting role in limiting the pushing spring 274.

Preferably, the supporting frame 27 comprises a pair of supporting plates, the pair of supporting plates are oppositely and vertically arranged on the frame 21, a cross beam 275 is supported and connected between the pair of supporting plates, a swinging shaft 271 is supported and arranged between the pair of supporting plates, the swinging shaft 271 is rotatably connected to the supporting plates through bearings, a push rod 273 arranged on the swinging shaft 271 is vertically arranged, and a pushing spring 274 is supported and connected between the push rod 273 and the cross beam 275.

The utility model discloses an in the embodiment, the utility model discloses an equipment of getting rid of is still including installing in frame 21 and corresponding the sensor that pinch roller 26 set up, and this sensor is connected with the controller, and this sensor is used for detecting the swing of pinch roller 26, and the sensor detects when pinch roller 26 takes place the swing and then forms the detected signal and sends this detected signal for the controller, and the controller still is connected with transport mechanism 23 control, and transport speed that transport mechanism 23 was adjusted in the control of controller after receiving the detected signal.

When the excessive glue on the surface of the product 10 waiting to remove glue is thick, this excessive glue can exert ascending thrust to pinch roller 26 when the pinch roller 26 for pinch roller 26 can the upswing, the utility model discloses a thereby the swing that the sensor that sets up detected pinch roller 26 can not reach grinding wheel 25 department at thicker excessive glue and just know in advance, and then reduces the conveying speed of transport mechanism 23 in advance through the controller to prevent transport mechanism 23's speed too fast and make grinding wheel 25 can't be clean with thicker excessive glue. Preferably, in the actual production process, the thickness of the overflowing glue on the product is subjected to statistical analysis to obtain the average thickness of the overflowing glue, the overflowing glue exceeding the average thickness is defined as thicker, the swing angle of the pressing wheel 26 can be calculated through the average thickness of the overflowing glue, the sensor detects the actual swing condition of the pressing wheel 26, when the actual swing condition is greater than the swing angle corresponding to the average thickness of the overflowing glue, the sensor forms a detection signal to inform the controller, and the controller controls the conveying mechanism 23 to reduce the conveying speed. Preferably, a set speed, which is lower than the normal conveying speed of the conveying mechanism 23, may be preset in the controller, and when the controller receives the detection signal of the sensor, the conveying speed of the conveying mechanism 23 is controlled to be adjusted to the set speed.

In a preferred embodiment, the sensor is a laser sensor, the laser sensor is supported on the frame 21, the laser sensor is correspondingly located at the pinch roller 26, when the pinch roller 26 is in a normal state, the laser sensor is not triggered, and when the pinch roller 26 swings upwards to shield the laser sensor, the laser sensor is triggered to form a detection signal.

In another preferred embodiment, the sensor is a distance sensor mounted on the support frame 27, the distance sensor is used for measuring the distance between itself and the inclined rod 272, when the pressing wheel 26 swings upwards, the inclined rod 272 also moves upwards, and thus the distance sensor detects the distance change and forms a detection signal.

In one embodiment of the present invention, as shown in fig. 1 and 2, the removing apparatus further comprises a track frame 29 supported on the frame 21 and a telescopic adjusting member 31 mounted on the track frame 29; the mounting frame 24 is connected to a telescopic adjustment member 31, and the telescopic adjustment of the telescopic adjustment member 31 can bring the mounting frame 24 into a lifting adjustment relative to the rail frame 29, thereby adjusting the distance between the mounting frame 24 and the support wheel 22.

Preferably, the track frame 29 and the mounting frame 24 are both door-shaped frames, a telescopic adjusting piece 31 is arranged at the top of the track frame 29, and the telescopic adjusting piece 31 can be telescopically adjusted; the mounting frame 24 is disposed inside the rail frame 29, and the telescopic adjustment member 31 is telescopically adjusted to allow the mounting frame 24 to be adjusted up and down relative to the rail frame 29.

In order to improve the stability of the up-and-down movement adjustment of the mounting frame 24, vertical guide rails 291 are arranged on the track frame 29; the mounting frame 24 is provided with a sliding block corresponding to the vertical guide rail 291, and the sliding block is slidably disposed on the vertical guide rail 291. Through the sliding fit of the vertical guide rail 291 and the slider, the up-and-down movement of the mounting frame 24 can be limited and guided. In a preferred embodiment, the vertical guide rail 291 is a square rail, which is fixedly connected to the inner side of the rail frame 29, and a slider is disposed on the outer side of the mounting frame 24, and a square groove is formed on the slider, so that the slider can be clamped on the square rail through the square groove, and the slider can slide along the square rail for adjustment. In another preferred embodiment, the vertical guide rail 291 is a rail groove disposed on the inner side of the rail frame 29, and a slider on the mounting frame 24 is inserted into the rail groove, and the slider can be slidably adjusted in the rail groove.

The utility model discloses an in a preferred embodiment, flexible regulating part is the cylinder, and the piston rod and the mounting bracket fixed connection of this cylinder can drive the mounting bracket through the flexible of piston rod and reciprocate the regulation. The controller is connected with the cylinder in a control mode and can control the operation of the cylinder.

The utility model discloses an in another preferred embodiment, flexible regulating part is the push rod motor, push rod and mounting bracket fixed connection on the push rod motor, and flexible through the push rod can drive the mounting bracket and reciprocate the regulation, controller and this push rod motor control connection.

The utility model discloses an in a concrete implementation mode, the driving piece is the motor, and the motor shaft of this motor passes through belt drive and is connected with the drive of wheel 25 of polishing, specifically, at an epaxial fixed connection belt pulley of wheel 25 of polishing, also a fixed connection belt pulley on the motor shaft of motor, overlaps the belt on two belt pulleys to the rotation of motor shaft can be through two belt pulleys and belt drive to the wheel 25 of polishing epaxial, and then the drive wheel 25 of polishing rotates.

Preferably, the controller is connected with the motor control, and the controller can detect the driving current of the motor. Specifically, a current sensor may be installed at a power source of the motor, and the driving current of the motor may be detected by the current sensor, and then the current sensor may be connected to the controller to transmit the detected driving current to the controller.

In one embodiment of the present invention, as shown in fig. 3, the removing device further includes a plurality of auxiliary wheels 28 rotatably mounted on the frame 21, and the auxiliary wheels 28 are disposed above the conveying mechanism 23. When the product 10 to be subjected to glue removal is conveyed to the conveying mechanism 23, if the product 10 to be subjected to glue removal passes through the auxiliary wheel 28, the auxiliary wheel 28 has a pressing effect on the product, and the effect of fixing and flattening the product can be achieved.

In a specific embodiment of the utility model, as shown in fig. 1, transport mechanism 23 is the conveyer belt, and this conveyer belt is including the area body 231, drive shaft 232 and driven shaft 233, and drive shaft 232 and driven shaft 233 all rotate in frame 21 through the rotatable installation of bearing, and drive shaft 232 department is equipped with driving motor and rotates with this drive shaft 232 of drive, and the area body 231 cover is on this drive shaft 232 and driven shaft 233, and the rotation through drive shaft 232 drives the area body 231 and rotates, has realized carrying the product. In order to improve the stability of the product, the positioning holes are formed in the frame of the product, the positioning columns matched with the positioning holes are arranged on the conveying belt, and when the product is placed on the conveying belt, the positioning columns on the conveying belt are inserted into the positioning holes of the product, so that the stability of the product in the conveying process is ensured.

In a specific embodiment of the present invention, as shown in fig. 1 and fig. 2, the top of the frame 21 of the present invention is formed with a platform surface 211, a pair of vertical plates 212 is disposed on the platform surface 211, and the pair of vertical plates 212 is used for mounting the supporting wheel 22, the conveying mechanism 23, the supporting frame 27 and the track frame 29.

The present invention has been described in detail with reference to the embodiments shown in the drawings, and those skilled in the art can make various modifications to the present invention based on the above description. Therefore, certain details of the embodiments should not be construed as limitations of the invention, which are intended to be covered by the following claims.

Claims

1. The utility model provides an excessive gluey equipment of getting rid of behind semiconductor plastic envelope which characterized in that includes:

a frame;

the supporting wheel is rotatably arranged on the frame;

2. The semiconductor plastic package post-flash removal apparatus of claim 1, further comprising swing-adjustable pinch rollers mounted on the frame, the pinch rollers being disposed on both sides of the grinding wheel and above the corresponding transfer mechanism;

3. The semiconductor plastic package post-flash removal device of claim 2, further comprising a sensor mounted on the frame and disposed corresponding to the pinch roller, the sensor being connected to the controller;

4. The semiconductor plastic package post-flash removal device of claim 2, further comprising a support bracket supported on the frame;

5. The semiconductor plastic package post-flash removal device of claim 1, further comprising a rail frame supported on the frame and a telescopic adjusting member mounted on the rail frame;

the mounting frame is connected with the telescopic adjusting piece;

6. The semiconductor plastic package post-flash removal apparatus of claim 5, wherein a vertical guide rail is provided on the rail frame;

7. The semiconductor plastic package post flash removal apparatus of claim 5, wherein the telescoping adjustment member is a cylinder or a push rod motor.

8. The semiconductor plastic package post flash removal apparatus of claim 1, wherein the driving member is a motor, a motor shaft of the motor is in driving connection with the grinding wheel through a belt drive.

9. The semiconductor plastic package post flash removal apparatus of claim 1, further comprising a plurality of auxiliary wheels rotatably mounted to the frame, the auxiliary wheels being disposed above the transfer mechanism.

10. The semiconductor plastic package post flash removal apparatus of claim 1, wherein the transfer mechanism is a conveyor belt.