CN113210211B - A rubber coating equipment for production of power amplifier chip - Google Patents

A rubber coating equipment for production of power amplifier chip Download PDF

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Publication number
CN113210211B
CN113210211B CN202110566384.3A CN202110566384A CN113210211B CN 113210211 B CN113210211 B CN 113210211B CN 202110566384 A CN202110566384 A CN 202110566384A CN 113210211 B CN113210211 B CN 113210211B
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assembly
chip
gluing
mounting
dust
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CN202110566384.3A
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CN113210211A (en
Inventor
孟剑
姚建海
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Beijing Aofengyuan Technology Co ltd
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Beijing Aofengyuan Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/10Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed before the application
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00Accessories or details of general applicability for machines or apparatus for cleaning

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  • Cleaning In General (AREA)

Abstract

The invention discloses gluing equipment for power amplifier chip production, which belongs to the technical field of power amplifier chip production equipment and comprises a dust removal device, a chip installation device and a gluing device, wherein the chip installation device is arranged on one side of the dust removal device; the invention can carry out dust removal, gluing and mounting operations on the chip base and the chip cover plate under the condition of small distance, and can reduce the dust entering rate during gluing operation to a greater extent, thereby improving the yield of the power amplifier chip.

Description

A rubber coating equipment for production of power amplifier chip
Technical Field
The invention relates to the technical field of power amplifier chip production equipment, in particular to gluing equipment for producing a power amplifier chip.
Background
A power amplifier (abbreviated as "power amplifier") is an amplifier that can generate maximum power output to drive a load (e.g., a speaker) under a given distortion ratio. The power amplifier plays a role of 'organization and coordination' in the whole sound system, and governs to some extent whether the whole system can provide good sound quality output.
In the prior art, in the gluing process, the distance between the chip cover plate and the chip base is large, the dust feeding rate is high, there is a need for an apparatus that can ash the power amplifier chip, the chip cover plate, and the chip base prior to adhesive application and minimize the ash ingress rate during the adhesive application and mounting process.
Disclosure of Invention
The embodiment of the invention provides gluing equipment for producing a power amplifier chip, which aims to solve the technical problems that the power amplifier chip cannot be dedusted before being installed and glued and the ash entering rate of the power amplifier chip is reduced as much as possible in the installation and gluing process in the prior art.
The embodiment of the invention adopts the following technical scheme: the utility model provides a rubber coating equipment for production of power amplifier chip, includes dust collector, chip installation device and rubber coating device, chip installation device sets up the one side at dust collector, the below at chip installation device is installed to the rubber coating device, dust collector includes dust removal piece, removal subassembly, inflation component and change subassembly, the removal subassembly includes base platform and electric putter, the first electric putter level sets up the top at the base platform, inflation component installs on first electric putter's output, it sets up the one side at inflation component to change the subassembly, dust removal piece installs on changing the subassembly.
Further, the inflation assembly comprises a connecting piece, a gas pipe and an inflation sleeve, one end of the connecting piece is connected with the output end of the first electric push rod, one end of the gas pipe penetrates through the other end of the connecting piece, the other end of the gas pipe is communicated with the inflation sleeve, and the inflation sleeve is hollow and is provided with a plurality of gas outlet holes at the upper end and the lower end of the inflation sleeve.
Further, the replacing component comprises two mounting rods, a first moving component and a second moving component, the two mounting rods are symmetrically arranged on one side of the inflatable sleeve away from the first electric push rod, the first moving component and the second moving component are symmetrically arranged between the two mounting rods, the first moving component is positioned right above the second moving component, the first moving component and the second moving component are identical in structure, the second moving component comprises a first limiting rod, a first driving screw rod, a first motor, a first sliding block, a driving electric cylinder and a sucker, two ends of the first limiting rod are respectively connected with side ends of the two mounting rods, two ends of the first driving screw rod are respectively rotatably connected with the two mounting rods, one end of the first driving screw rod penetrates through the mounting rods and is connected with an output end of the first motor, a first sliding block is sleeved on the first limiting rod and the first driving screw rod, the electric driving cylinder is installed on one side of the first sliding block, the output end of the electric driving cylinder is arranged upwards and is connected with the suckers, the upper end and the lower end of the dust removing piece are connected with the suckers in the first moving assembly and the second moving assembly respectively, and an opening is formed in one side, close to the inflating sleeve, of the dust removing piece.
Furthermore, the surface of the dust removing piece is made of soft sticky materials.
Furthermore, the dust removing device also comprises two clamping components, wherein the two clamping components are symmetrically arranged at two sides of the gas conveying pipe, each clamping component comprises a mounting plate, a first connecting rod component, a second connecting rod component and a second motor, one side of the mounting plate is connected with the side end of the gas conveying pipe, the first connecting rod component and the second connecting rod component are symmetrically arranged at one side of the mounting plate, the first connecting rod component is positioned above the second connecting rod component, the first connecting rod component and the second connecting rod component have the same structure, the second connecting rod component comprises a first rotating shaft, a second rotating shaft, a driving gear, a first linkage rod, a second linkage rod, a moving rod and a clamping plate, the first rotating shaft is rotatably connected with the mounting plate, the driving gear is arranged on the first rotating shaft, and the first rotating shaft is connected with one end of the first linkage rod, the utility model discloses a pneumatic device, including first linkage pole, second axis of rotation, mounting panel, the one end of first linkage pole is connected and is located first axis of rotation and is close to the one side of inflating cover, the one end rotation of second axis of rotation and second linkage pole is connected, the other end of first linkage pole and second linkage pole rotates respectively with the carriage release lever to be connected, the top and the clamping plate that the carriage release lever is close to the one end of inflating the cover are connected, the one end that first axis of rotation and mounting panel in the first link subassembly are connected with the output transmission of second motor, drive gear intermeshing in first link subassembly and the second link subassembly.
Further, chip installation device includes mounting bracket, third removal subassembly and base tray, the mounting bracket has two, two the mounting bracket symmetry sets up the subassembly is being changed and is being kept away from one side of aerifing the subassembly, the third removes the unit mount between two mounting brackets, the third removes the subassembly and removes the subassembly structure the same with the second, the driving electric cylinder output in the third removes the subassembly and sets up down, the base tray sets up under the sucking disc in the third removes the subassembly.
Further, the gluing device comprises a surrounding gluing component and a separating component, the surrounding gluing component comprises a fixed frame, two connecting plates, two connecting rods, a movable loop bar, two belt pulleys, a third motor, a rotary belt, a sliding connecting frame, a special-shaped fixed rod and a gluing gun, the fixed frame is arranged under the base tray, the two connecting rods are respectively arranged at two ends of the top of the fixed frame, the two connecting plates are arranged at the top of the fixed frame and positioned between the two connecting rods, the number of the belt pulleys is four, every two belt pulleys are respectively arranged at two ends of one connecting plate, the four belt pulleys are distributed in a rectangular shape, the output end of the third motor is in transmission connection with the joint of one belt pulley and the connecting plate, and the rotary belt is sleeved on the four belt pulleys, the utility model discloses a glue gun, including two connecting rods, remove loop bar, slide connection frame, special-shaped dead lever, glue gun installs the top at special-shaped dead lever and glue gun is slope setting, the both ends of removing the loop bar establish respectively on two connecting rods just remove loop bar and two connecting rod sliding fit, the middle part of removing the loop bar is equipped with the slide, sliding connection frame installs the slide joint on rotatory area and sliding connection frame's top and the removal loop bar, sliding connection frame and the slide sliding fit on the removal loop bar, the top at sliding connection frame is installed to special-shaped dead lever, glue gun installs the top at special-shaped dead lever and glue gun is the slope setting.
Further, the separation assembly comprises a second limiting rod, a second driving screw rod, a fourth motor, a second sliding block and two connecting seats, the two connecting seats are symmetrically arranged below the fixing frame, the two ends of the second limiting rod are respectively connected with the side ends of the two connecting seats, the two ends of the second driving screw rod are respectively rotatably connected with the two connecting seats, one end of the second driving screw rod penetrates through the connecting seats and is connected with the output end of the fourth motor, the second sliding block is sleeved on the second limiting rod and the second driving screw rod, and the top of the second sliding block is connected with the bottom of the fixing frame.
The embodiment of the invention adopts at least one technical scheme which can achieve the following beneficial effects:
firstly, when dust removal needs to be carried out on a chip cover plate and a chip base, a first motor in a first moving assembly and a second moving assembly works to control a first driving screw rod to rotate to drive two first sliding blocks to move towards the direction of an inflating sleeve synchronously until a dust removing piece corresponds to the position of the inflating sleeve, then two suckers are controlled to move upwards and downwards respectively through driving electric cylinders in the first moving assembly and the second moving assembly, so that the dust removing piece is pulled open along the opening of the dust removing piece through the suckers, then the inflating sleeve is controlled to move towards the dust removing piece through a first electric push rod until the inflating sleeve enters the dust removing piece from the opening of the dust removing piece, then the suckers at the upper end and the lower end of the dust removing piece are controlled to remove adsorption and fixation on the dust removing piece, the first electric push rod continuously controls the inflating sleeve sleeved with the dust removing piece to move towards the direction of the chip base until the dust removing piece moves to the area between the chip base and the chip cover plate, the gas is conveyed to the gas filling sleeve through the gas conveying port of the gas conveying pipe, the gas enters the dust removing part through the gas outlet hole of the gas filling sleeve, the gas pressure is increased, the dust removing part begins to expand, the surface of the dust removing part is made of soft viscous materials, the chip base and the chip cover plate are completely filled at the two ends of the dust removing part, the gas pressure in the dust removing part is reduced, the dust removing part begins to contract, the dust on the chip, the chip base and the chip cover plate can be adhered to the surface of the dust removing part by the dust removing part in the contraction process, the dust removing part is a disposable article due to the fact that the dust removing part cannot be cleaned in place in one time and possibly has dust residue, the dust removing part is required to be replaced, the gas filling sleeve sleeved with the dust removing part is controlled to move back to the position between the two suckers for adsorption and fixation, the dust removing part is pulled open again, the device can simultaneously remove dust from the chip, the chip base and the chip cover plate by structural design, and simultaneously ensure that the distance between the chip cover plate and the chip base after dust removal can be kept at a short distance, the dust feeding rate during gluing and mounting can be reduced to a greater extent, so that the yield of the power amplifier chip is improved, and the problem of replacing the dust removing piece is solved.
Secondly, after the dust removal is finished, the gluing area of the chip base needs to be glued, the gluing area of the chip base is arranged on the periphery of the top of the chip base and is distributed in a rectangular shape, a fourth motor is controlled to work, a second driving screw rod rotates to drive a second sliding block to move, so that a gluing gun arranged on a fixed frame is driven to move towards the chip base until a gluing opening of the gluing gun moves to the position right above the gluing area on one side of the chip base, then a third motor is controlled to work, four belt pulleys rotate to drive a rotating belt to move in a rectangular shape, because a moving loop bar is in sliding fit with two connecting bars, a sliding connection frame is in sliding fit with a slide way on the moving loop bar, the rotating belt can drive the sliding connection frame to move in a rectangular shape synchronously with the rotating connection frame, and the rectangular area formed by the moving track of the sliding connection frame corresponds to the plane area of the chip base, thereby the rubber coating rifle can carry out the rubber coating operation of surrounding type to the rubber coating region of chip base, the rubber coating is accomplished the back, keep away from the chip base through breaking away from subassembly control rubber coating rifle, so that carry out subsequent installation and unloading operation, because the rubber coating rifle is the slope setting, the rubber coating rifle only scribbles the mouth and is located between chip base and the chip apron, occupation space is less, so can be with the distance control between chip apron and the chip base within a less scope, thereby the effect of the ash rate of advancing when having realized the at utmost reduction rubber coating and installing.
Thirdly, when the inflating sleeve enters the dust removing part for inflating, if the dust removing part is not sealed, the problem that the dust removing part is not fully expanded can be caused, and meanwhile, in the process of moving the inflating sleeve sleeved with the dust removing part, the situation that the dust removing part falls off can also occur, in order to solve the problem, clamping components are arranged on two sides of the gas pipe and used for controlling a second motor to work, a driving gear in a first connecting rod component rotates to drive a driving gear in a second connecting rod component to reversely and synchronously rotate with the driving gear, so that a first linkage rod, a second linkage rod and a moving rod in the first connecting rod component and the second connecting rod component are driven to synchronously reversely rotate, so that clamping plates in the first connecting rod component and the second connecting rod component simultaneously move towards the opposite direction until the end parts of the inflating sleeve and the dust removing part are clamped and fixed, and the two clamping components respectively clamp and fix the end parts at two ends of the inflating sleeve and the dust removing part, thereby the problem of sealing the dust removal part and preventing the dust removal part from falling off is solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a schematic perspective view of the dust removing device of the present invention;
FIG. 4 is a perspective view of the moving assembly of the present invention;
FIG. 5 is a perspective view of the clamping assembly of the present invention;
FIG. 6 is a perspective view of a replacement assembly of the present invention;
FIG. 7 is a schematic perspective view of a chip mounting apparatus and a glue spreading apparatus according to the present invention;
FIG. 8 is a schematic perspective view of a chip mounting apparatus according to the present invention;
FIG. 9 is a schematic perspective view of the glue spreading device of the present invention;
FIG. 10 is a top view of the wrap-around glue assembly of the present invention;
fig. 11 is a schematic perspective view of the surrounding glue-spreading assembly of the present invention.
Reference numerals:
the dust removing device 1, the dust removing part 11, the moving assembly 12, the base table 121, the first electric push rod 122, the inflating assembly 13, the connecting member 131, the air pipe 132, the inflating sleeve 133, the replacing assembly 14, the mounting rod 141, the first moving assembly 142, the second moving assembly 143, the first limit rod 1431, the first driving screw 1432, the first motor 1433, the first sliding block 1434, the driving electric cylinder 1435, the suction cup 1436, the clamping assembly 2, the mounting plate 21, the first link assembly 22, the second link assembly 23, the first rotating shaft 231, the second rotating shaft 232, the driving gear 233, the first link 234, the second link 235, the moving rod 236, the clamping plate 237, the second motor 24, the chip mounting device 3, the mounting frame 31, the third moving assembly 32, the base tray 33, the gluing device 4, the surrounding gluing assembly 41, the fixing frame 411, the connecting plate 412, the connecting rod 413, the moving sleeve 414, the belt pulley 415, the connecting rod 131, the mounting rod 141, the first moving assembly 23, the second moving assembly 23, the second connecting rod assembly and the connecting rod assembly 23, The device comprises a third motor 416, a rotating belt 417, a sliding connection frame 418, a special-shaped fixing rod 419, a glue gun 42, a disengaging assembly 43, a second limiting rod 431, a second driving screw rod 432, a fourth motor 433, a second sliding block 434 and a connecting seat 435.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 11, a glue spreading apparatus for power amplifier chip production according to an embodiment of the present invention includes a dust removing device 1, a chip mounting device 3, and a glue spreading device 4, where the chip mounting device 3 is disposed on one side of the dust removing device 1, the glue spreading device 4 is mounted below the chip mounting device 3, the dust removing device 1 includes a dust removing member 11, a moving member 12, an air charging member 13, and a replacing member 14, the moving member 12 includes a base table 121 and a first electric push rod 122, the first electric push rod 122 is horizontally disposed on top of the base table 121, the air charging member 13 is mounted on an output end of the first electric push rod 122, the replacing member 14 is disposed on one side of the air charging member 13, and the dust removing member 11 is mounted on the replacing member 14; the chip base and the chip cover plate provided with the power amplifier chip are fixed by the chip mounting device 3, the chip cover plate is positioned right above the chip base, the gap between the chip base and the chip cover plate is small, the dust removing piece 11 is sleeved on the air charging component 13 by the moving component 12 and the replacing component 14, the dust removing piece 11 is moved between the chip base and the chip cover plate by the moving component 12, the upper end and the lower end of the dust removing piece 11 are controlled to expand by the air charging component 13 until the upper end and the lower end of the dust removing piece 11 completely fill the chip base and the chip cover plate, so that dust on the chip base and the chip cover plate is adhered, after once dust removal, the dust removing piece 11 is replaced by the replacing component 14, the new dust removing piece 11 removes dust on the chip base and the chip cover plate again, and after dust removal for several times, no dust is adhered on the surface of the dust removing piece 11, namely, the dust removal is finished, and then, the gluing device 4 is used for gluing the gluing area around the chip base, the gluing end of the gluing device 4 is obliquely arranged, and the chip base is coated with glue in a surrounding manner from the side surface of the chip base, so that the occupied space is small when the chip base is glued, the distance between the chip cover plate and the chip base can be set to be a short distance, the dust entering rate during the gluing operation can be greatly reduced, the yield of the power amplifier chip is improved, after the gluing is finished, the gluing area of the chip cover plate and the gluing area of the chip base are bonded and connected through the chip mounting device 3, and finally, the mounted power amplifier chip is blanked through the chip mounting device 3. The invention can carry out dust removal, gluing and mounting operations on the chip base and the chip cover plate under the condition of small distance, and can reduce the dust entering rate during gluing operation to a greater extent, thereby improving the yield of the power amplifier chip.
Preferably, the inflation assembly 13 includes a connecting piece 131, a gas pipe 132 and an inflation sleeve 133, one end of the connecting piece 131 is connected with the output end of the first electric push rod 122, the other end of the connecting piece 131 is passed through by one end of the gas pipe 132, the other end of the gas pipe 132 is communicated with the inflation sleeve 133, and the inflation sleeve 133 is hollow and is provided with a plurality of air outlets at the upper end and the lower end of the inflation sleeve 133.
Preferably, the replacing assembly 14 includes two mounting rods 141, a first moving assembly 142 and a second moving assembly 143, the two mounting rods 141 are symmetrically disposed on one side of the inflating sleeve 133 away from the first electric push rod 122, the first moving assembly 142 and the second moving assembly 143 are symmetrically disposed between the two mounting rods 141, the first moving assembly 142 is located right above the second moving assembly 143, the first moving assembly 142 and the second moving assembly 143 have the same structure, the second moving assembly 143 includes a first limit rod 1431, a first driving screw 1432, a first motor 1433, a first sliding block 1434, a driving electric cylinder 1435 and a suction cup 1436, two ends of the first limit rod 1431 are respectively connected with side ends of the two mounting rods 141, two ends of the first driving screw 1432 are respectively rotatably connected with the two mounting rods 141, one end of the first driving screw 1432 passes through the mounting rods 141 and is connected with an output end of the first motor 1433, the first limiting rod 1431 and the first driving screw 1432 are sleeved with a first sliding block 1434, a driving electric cylinder 1435 is installed on one side of the first sliding block 1434, an output end of the driving electric cylinder 1435 is arranged upward and connected with a suction cup 1436, upper and lower ends of the dust removing piece 11 are respectively connected with the suction cups 1436 in the first moving assembly 142 and the second moving assembly 143, and an opening is formed in one side, close to the inflating sleeve 133, of the dust removing piece 11.
Preferably, the surface of the dust removing piece 11 is made of soft viscous materials; when dust removal needs to be performed on the chip cover plate and the chip base, firstly, the first motor 1433 in the first moving assembly 142 and the second moving assembly 143 works to control the first driving screw 1432 to rotate, so as to drive the two first sliding blocks 1434 to move towards the direction of the air inflation sleeve 133 synchronously until the dust removal part 11 corresponds to the position of the air inflation sleeve 133, then the driving electric cylinder 1435 in the first moving assembly 142 and the second moving assembly 143 controls the two suction cups 1436 to move upwards and downwards respectively, so that the dust removal part 11 is pulled open along the opening of the dust removal part by the suction cups 1436, then the first electric push rod 122 controls the air inflation sleeve 133 to move towards the dust removal part 11 until the air inflation sleeve 133 enters the dust removal part 11 from the opening of the dust removal part 11, then the suction cups 1436 at the upper end and the lower end of the dust removal part 11 are controlled to release the adsorption fixation to the dust removal part 11, the first electric push rod 122 continues to control the air inflation sleeve 133 sleeved with the dust removal part 11 to move towards the chip base, until the chip base and the chip cover plate are moved to the area between the chip base and the chip cover plate, gas is conveyed to the gas-filled sleeve 133 through the gas conveying port of the gas conveying pipe 132, the gas enters the dust-removing part 11 through the gas outlet of the gas-filled sleeve 133, the gas pressure is increased, the dust-removing part 11 begins to expand, the surface of the dust-removing part 11 is made of soft viscous materials, the chip base and the chip cover plate are completely filled at the two ends of the dust-removing part 11, then the gas pressure in the dust-removing part 11 is reduced, the dust-removing part 11 begins to shrink, the dust-removing part 11 can adhere dust on the chip, the chip base and the chip cover plate on the surface of the dust-removing part 11 in the shrinking process, the dust-removing part 11 is possibly not cleaned in place and possibly has dust residue due to the fact that one-time dust removal is possible, and the dust-removing part 11 is a disposable article, the same dust-removing part 11 cannot be used for secondary dust removal, the dust-removing part 11 needs to be replaced, firstly, the gas-filled sleeve 133 is controlled to move back to the two sucking discs 1436 for adsorption and fixation Surely, pull open dust removal piece 11 once more, it breaks away from dust removal piece 11 to control inflatable sleeve 133 through first electric putter 122, the sucking disc 1436 that is located dust removal piece 11 below removes the absorption to dust removal piece 11, remove dust removal piece 11 to the position of keeping away from inflatable sleeve 133 through first removal subassembly 142, take off used dust removal piece 11 and change new dust removal piece 11, control dust removal piece 11 and remove to the top of sucking disc 1436 in second removal subassembly 143, carry out sucking disc 1436 to dust removal piece 11 again and fix, repeat the operation of above-mentioned dust removal operation at last, can carry out many times dust removal operation to chip, chip base and chip apron, until there is not the adhesion dust on dust removal piece 11 after the dust removal completion again, namely the dust removal is accomplished, this device is through structural design, can carry out dust removal treatment to chip, chip base and chip apron simultaneously, guaranteed that the interval between chip apron and chip base can keep at very short distance after the dust removal simultaneously The dust feeding rate during gluing and mounting can be reduced to a greater extent, so that the yield of the power amplifier chip is improved, and the problem of replacing the dust removing piece 11 is solved.
Preferably, the dust removing device 1 further comprises two clamping assemblies 2, two of the clamping assemblies 2 are symmetrically arranged at two sides of the gas pipe 132, each clamping assembly 2 comprises a mounting plate 21, a first connecting rod assembly 22, a second connecting rod assembly 23 and a second motor 24, one side of the mounting plate 21 is connected with the side end of the gas pipe 132, the first connecting rod assembly 22 and the second connecting rod assembly 23 are symmetrically arranged at one side of the mounting plate 21, the first connecting rod assembly 22 is positioned above the second connecting rod assembly 23, the first connecting rod assembly 22 and the second connecting rod assembly 23 have the same structure, the second connecting rod assembly 23 comprises a first rotating shaft 231, a second rotating shaft 232, a driving gear 233, a first linkage 234, a second linkage 235, a moving rod 236 and a clamping plate 237, the first rotating shaft 231 is rotatably connected with the mounting plate 21, the driving gear 233 is mounted on the first rotating shaft 231, the first rotating shaft 231 is connected with one end of the first linkage rod 234, the second rotating shaft 232 is rotatably connected with the mounting plate 21 and is positioned on one side of the first rotating shaft 231 close to the inflating sleeve 133, the second rotating shaft 232 is rotatably connected with one end of the second linkage rod 235, the other ends of the first linkage rod 234 and the second linkage rod 235 are respectively rotatably connected with the moving rod 236, the top of one end of the moving rod 236 close to the inflating sleeve 133 is connected with the clamping plate 237, one end of the first rotating shaft 231 in the first link assembly 22, which is connected with the mounting plate 21, is in transmission connection with the output end of the second motor 24, and the driving gears 233 in the first link assembly 22 and the second link assembly 23 are engaged with each other; when the air inflation sleeve 133 enters the dust removing part 11 for inflation, if the dust removing part 11 is not sealed, the problem that the expansion of the dust removing part 11 is not sufficient may be caused, and meanwhile, in the process of moving the air inflation sleeve 133 sleeved with the dust removing part 11, the situation that the dust removing part 11 falls off may also occur, in order to solve the above problem, the clamping assemblies 2 are arranged on two sides of the air pipe 132, the second motor 24 is controlled to work, the driving gear 233 in the first link assembly 22 rotates to drive 417 to drive the driving gear 233 in the second link assembly 23 to rotate reversely and synchronously, so as to drive the first linkage 234, the second linkage 235 and the moving rod 236 in the first link assembly 22 and the second link assembly 23 to synchronously rotate reversely, so that the clamping plates 237 in the first link assembly 22 and the second link assembly 23 simultaneously move towards each other direction until the end portions of the air inflation sleeve 133 and the dust removing part 11 are clamped and fixed, the two clamping assemblies 2 respectively clamp and fix the end parts of the inflatable sleeve 133 and the two ends of the dust removing piece 11, thereby solving the problems of sealing the dust removing piece 11 and preventing the dust removing piece 11 from falling off.
Preferably, the chip mounting device 3 includes two mounting frames 31, two mounting frames 31 are symmetrically disposed on the side of the replacing assembly 14 away from the inflating assembly 13, the third moving assembly 32 is mounted between the two mounting frames 31, the third moving assembly 32 has the same structure as the second moving assembly 143, the output end of the driving electric cylinder 1435 in the third moving assembly 32 is disposed downward, and the base tray 33 is disposed right below the suction cup 1436 in the third moving assembly 32; install the chip base setting of chip on base tray 33, the chip apron adsorbs through sucking disc 1436, remove the subassembly 32 through the third and remove the chip apron to the chip base directly over, can control the interval between chip apron and the chip base through drive electric jar 1435, adjust to the minimum interval that can remove dust and the rubber coating operation after, can remove dust and rubber coating operation, the rubber coating is accomplished the back, control drive electric jar 1435 drives the chip apron and removes toward chip base direction, the bonding region of chip apron is connected with the regional bonding of rubber coating of chip base, chip apron and chip base after will bonding break away from with base tray 33 through third removal subassembly 32 at last, remove to appointed region can accomplish the unloading at last.
Preferably, the gluing device 4 comprises a surrounding gluing component 41 and a disengaging component 43, the surrounding gluing component 41 comprises a fixed frame 411, two connecting plates 412, two connecting rods 413, two movable sleeve rods 414, two pulleys 415, a third motor 416, a rotating belt 417, a sliding connecting frame 418, a special-shaped fixing rod 419 and a gluing gun 42, the fixed frame 411 is arranged right below the base tray 33, the two connecting rods 413 are respectively arranged at two ends of the top of the fixed frame 411, the two connecting plates 412 are arranged at the top of the fixed frame 411 and located between the two connecting rods 413, the pulleys 415 are four, every two pulleys 415 are respectively arranged at two ends of one connecting plate 412, the four pulleys 415 are distributed in a rectangular shape, the output end of the third motor 416 is in transmission connection with the connection position of one pulley 415 and the connecting plate 412, rotatory area 417 cover is established four on belt pulley 415, the both ends of removing loop bar 414 are established respectively and are just on two connecting rods 413 remove loop bar 414 and two connecting rods 413 sliding fit, the middle part of removing loop bar 414 is equipped with the slide, sliding connection frame 418 is installed on rotatory area 417 and sliding connection frame 418's top and the slide joint on removing loop bar 414, sliding connection frame 418 and the slide sliding fit on removing loop bar 414, the top at sliding connection frame 418 is installed to dysmorphism dead lever 419, glue gun 42 is installed at the top of dysmorphism dead lever 419 and glue gun 42 is the slope setting.
Preferably, the disengaging assembly 43 includes two second limiting rods 431, two second driving screws 432, a fourth motor 433, a second sliding block 434 and two connecting seats 435, the two connecting seats 435 are symmetrically disposed below the fixing frame 411, two ends of the second limiting rods 431 are respectively connected to side ends of the two connecting seats 435, two ends of the second driving screws 432 are respectively rotatably connected to the two connecting seats 435, one end of the second driving screws 432 passes through the connecting seats 435 and is connected to an output end of the fourth motor 433, the second limiting rods 431 and the second driving screws 432 are sleeved with the second sliding block 434, and a top of the second sliding block 434 is connected to a bottom of the fixing frame 411; after the dust removal is finished, the gluing area of the chip base needs to be glued, the gluing area of the chip base is arranged around the top of the chip base and distributed in a rectangular shape, a fourth motor 433 is controlled to work, a second driving screw 432 rotates and drives 417 to move a second sliding block 434, so that a gluing gun 42 arranged on a fixed frame 411 is driven to move towards the chip base until a gluing opening of the gluing gun 42 moves to the position right above the gluing area on one side of the chip base, then a third motor 416 is controlled to work, four belt pulleys 415 rotate and drive 417 to drive a rotating belt 417 to move in a rectangular shape, as the moving loop bar 414 is in sliding fit with two connecting bars 413, the sliding connecting frame 418 is in sliding fit with a slide way on the moving loop bar 414, the rotating belt 417 can drive the sliding connecting frame 418 to move in a rectangular shape synchronously with the rotating frame 418, and the rectangular area formed by the moving track of the sliding connecting frame 418 corresponds to the plane area of the chip base, thereby glue gun 42 can carry out the rubber coating operation of surrounding type to the rubber coating region of chip base, the rubber coating is accomplished the back, keep away from the chip base through breaking away from subassembly 43 control glue gun 42, so that carry out subsequent installation and unloading operation, because glue gun 42 is the slope setting, glue gun 42 only scribbles the mouth and is located between chip base and the chip apron, occupation space is less, so can be with the distance control between chip apron and the chip base within a less scope, thereby the effect of the ash rate of advancing when having realized the at utmost reduction glue coating and installing.
The working principle is as follows: the chip base and the chip cover plate provided with the power amplifier chip are fixed by the chip mounting device 3, the chip cover plate is positioned right above the chip base, the gap between the chip base and the chip cover plate is small, the dust removing piece 11 is sleeved on the air charging component 13 by the moving component 12 and the replacing component 14, the dust removing piece 11 is moved between the chip base and the chip cover plate by the moving component 12, the upper end and the lower end of the dust removing piece 11 are controlled to expand by the air charging component 13 until the upper end and the lower end of the dust removing piece 11 completely fill the chip base and the chip cover plate, so that dust on the chip base and the chip cover plate is adhered, after once dust removal, the dust removing piece 11 is replaced by the replacing component 14, the new dust removing piece 11 removes dust on the chip base and the chip cover plate again, and after dust removal for several times, no dust is adhered on the surface of the dust removing piece 11, namely, the dust removal is finished, and then, the gluing device 4 is used for gluing the gluing area around the chip base, the gluing end of the gluing device 4 is obliquely arranged, and the chip base is coated with glue in a surrounding manner from the side surface of the chip base, so that the occupied space is small when the chip base is glued, the distance between the chip cover plate and the chip base can be set to be a short distance, the dust entering rate during the gluing operation can be greatly reduced, the yield of the power amplifier chip is improved, after the gluing is finished, the gluing area of the chip cover plate and the gluing area of the chip base are bonded and connected through the chip mounting device 3, and finally, the mounted power amplifier chip is blanked through the chip mounting device 3. The invention can carry out dust removal, gluing and mounting operations on the chip base and the chip cover plate under the condition of small distance, and can reduce the dust entering rate during gluing operation to a greater extent, thereby improving the yield of the power amplifier chip; when dust removal needs to be performed on the chip cover plate and the chip base, firstly, the first motor 1433 in the first moving assembly 142 and the second moving assembly 143 works to control the first driving screw 1432 to rotate, so as to drive the two first sliding blocks 1434 to move towards the direction of the air inflation sleeve 133 synchronously until the dust removal part 11 corresponds to the position of the air inflation sleeve 133, then the driving electric cylinder 1435 in the first moving assembly 142 and the second moving assembly 143 controls the two suction cups 1436 to move upwards and downwards respectively, so that the dust removal part 11 is pulled open along the opening of the dust removal part by the suction cups 1436, then the first electric push rod 122 controls the air inflation sleeve 133 to move towards the dust removal part 11 until the air inflation sleeve 133 enters the dust removal part 11 from the opening of the dust removal part 11, then the suction cups 1436 at the upper end and the lower end of the dust removal part 11 are controlled to release the adsorption fixation to the dust removal part 11, the first electric push rod 122 continues to control the air inflation sleeve 133 sleeved with the dust removal part 11 to move towards the chip base, until the chip base and the chip cover plate are moved to the area between the chip base and the chip cover plate, gas is conveyed to the gas-filled sleeve 133 through the gas conveying port of the gas conveying pipe 132, the gas enters the dust-removing part 11 through the gas outlet of the gas-filled sleeve 133, the gas pressure is increased, the dust-removing part 11 begins to expand, the surface of the dust-removing part 11 is made of soft viscous materials, the chip base and the chip cover plate are completely filled at the two ends of the dust-removing part 11, then the gas pressure in the dust-removing part 11 is reduced, the dust-removing part 11 begins to shrink, the dust-removing part 11 can adhere dust on the chip, the chip base and the chip cover plate on the surface of the dust-removing part 11 in the shrinking process, the dust-removing part 11 is possibly not cleaned in place due to one-time dust removal, dust residues are possibly generated, and the dust-removing part 11 is a disposable article, the same dust-removing part 11 cannot be used for secondary dust removal, the dust-removing part 11 needs to be replaced, firstly, the gas-filled sleeve 133 of the dust-removing part 11 is controlled to move back to the area between the two sucking discs 1436 for adsorption and fixation The dust removing component 11 is pulled open again, the inflating sleeve 133 is controlled to be separated from the dust removing component 11 through the first electric push rod 122, then the sucking disc 1436 positioned below the dust removing component 11 removes the adsorption on the dust removing component 11, the dust removing component 11 is moved to the position far away from the inflating sleeve 133 through the first moving component 142, the used dust removing component 11 is taken down and replaced by a new dust removing component 11, then the dust removing component 11 is controlled to move to the position above the sucking disc 1436 in the second moving component 143, the sucking disc 1436 is fixed on the dust removing component 11 again, finally the dust removing operation is repeated, the dust removing operation can be carried out on the chip, the chip base and the chip cover plate for many times, until no dust is adhered to the dust removing component 11 after the dust removing operation is finished, namely, the dust removing is finished, the device can carry out dust removing treatment on the chip, the chip base and the chip cover plate simultaneously through the structural design, and simultaneously ensures that the distance between the chip cover plate and the chip base plate can be kept at a short distance after the dust removing, the dust feeding rate during gluing and mounting can be reduced to a greater extent, so that the yield of the power amplifier chip is improved, and the problem of replacing the dust removing piece 11 is solved; when the air inflation sleeve 133 enters the dust removing part 11 for inflation, if the dust removing part 11 is not sealed, the problem that the expansion of the dust removing part 11 is not sufficient may be caused, and meanwhile, in the process of moving the air inflation sleeve 133 sleeved with the dust removing part 11, the situation that the dust removing part 11 falls off may also occur, in order to solve the above problem, the clamping assemblies 2 are arranged on two sides of the air pipe 132, the second motor 24 is controlled to work, the driving gear 233 in the first link assembly 22 rotates to drive 417 to drive the driving gear 233 in the second link assembly 23 to rotate reversely and synchronously, so as to drive the first linkage 234, the second linkage 235 and the moving rod 236 in the first link assembly 22 and the second link assembly 23 to synchronously rotate reversely, so that the clamping plates 237 in the first link assembly 22 and the second link assembly 23 simultaneously move towards each other direction until the end portions of the air inflation sleeve 133 and the dust removing part 11 are clamped and fixed, the two clamping assemblies 2 respectively clamp and fix the inflatable sleeve 133 and the end parts at two ends of the dust removing piece 11, thereby solving the problems of sealing the dust removing piece 11 and preventing the dust removing piece 11 from falling off; the chip base provided with the chip is arranged on a base tray 33, the chip cover plate is adsorbed through a sucker 1436, the chip cover plate is moved to the position right above the chip base through a third moving assembly 32, the distance between the chip cover plate and the chip base can be controlled through a driving electric cylinder 1435, dust removal and gluing operation can be carried out after the minimum distance capable of carrying out dust removal and gluing operation is adjusted, after gluing is finished, the driving electric cylinder 1435 is controlled to drive the chip cover plate to move towards the chip base, the bonding area of the chip cover plate is bonded with the gluing area of the chip base, finally the bonded chip cover plate and the bonded chip base are separated from the base tray 33 through the third moving assembly 32, and finally blanking can be finished after the chip cover plate and the bonded chip base are moved to a designated area; after the dust removal is finished, the gluing area of the chip base needs to be glued, the gluing area of the chip base is arranged around the top of the chip base and distributed in a rectangular shape, a fourth motor 433 is controlled to work, a second driving screw 432 rotates and drives 417 to move a second sliding block 434, so that a gluing gun 42 arranged on a fixed frame 411 is driven to move towards the chip base until a gluing opening of the gluing gun 42 moves to the position right above the gluing area on one side of the chip base, then a third motor 416 is controlled to work, four belt pulleys 415 rotate and drive 417 to drive a rotating belt 417 to move in a rectangular shape, as the moving loop bar 414 is in sliding fit with two connecting bars 413, the sliding connecting frame 418 is in sliding fit with a slide way on the moving loop bar 414, the rotating belt 417 can drive the sliding connecting frame 418 to move in a rectangular shape synchronously with the rotating frame 418, and the rectangular area formed by the moving track of the sliding connecting frame 418 corresponds to the plane area of the chip base, thereby glue gun 42 can carry out the rubber coating operation of surrounding type to the rubber coating region of chip base, the rubber coating is accomplished the back, keep away from the chip base through breaking away from subassembly 43 control glue gun 42, so that carry out subsequent installation and unloading operation, because glue gun 42 is the slope setting, glue gun 42 only rubber coating mouth is located between chip base and the chip apron, occupation space is less, so can be with the chip apron within a less scope with the distance control between the chip base, thereby the effect of the ash rate of advancing when having realized the at utmost reduction glue coating and installing.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (5)

1. A gluing device for power amplifier chip production is characterized by comprising a dust removal device (1), a chip installation device, a gluing device (4), a chip installation device and a gluing device (4), wherein the chip installation device (3) is arranged on one side of the dust removal device (1), the gluing device (4) is arranged below the chip installation device (3), the dust removal device (1) comprises a dust removal part (11), a moving assembly (12), an inflating assembly (13) and a replacing assembly (14), the moving assembly (12) comprises a base table (121) and a first electric push rod (122), the first electric push rod (122) is horizontally arranged at the top of the base table (121), the inflating assembly (13) is arranged on the output end of the first electric push rod (122), the replacing assembly (14) is arranged on one side of the inflating assembly (13), the dust removal part (11) is arranged on the replacing assembly (14), the inflation assembly (13) comprises a connecting piece (131), air conveying pipes (132) and an inflation sleeve (133), one end of the connecting piece (131) is connected with the output end of the first electric push rod (122), the other end of the connecting piece (131) is penetrated by one end of the air conveying pipes (132), the other end of the air conveying pipes (132) is communicated with the inflation sleeve (133), the inflation sleeve (133) is arranged to be hollow, a plurality of air outlet holes are formed in the upper end and the lower end of the inflation sleeve (133), the replacement assembly (14) comprises mounting rods (141), first movable assemblies (142) and second movable assemblies (143), the mounting rods (141) are two and two symmetrically arranged on one side of the inflation sleeve (133) far away from the first electric push rod (122), the first movable assemblies (142) and the second movable assemblies (143) are symmetrically arranged between the two mounting rods (141), and the first movable assemblies (142) are located right above the second movable assemblies (143), the first moving assembly (142) and the second moving assembly (143) have the same structure, the second moving assembly (143) comprises a first limit rod (1431), a first driving screw (1432), a first motor (1433), a first sliding block (1434), an electric driving cylinder (1435) and a suction cup (1436), two ends of the first limit rod (1431) are respectively connected with side ends of two mounting rods (141), two ends of the first driving screw (1432) are respectively connected with the two mounting rods (141) in a rotating manner, one end of the first driving screw (1432) penetrates through the mounting rods (141) and is connected with an output end of the first motor (1433), the first limit rod (1431) and the first driving screw (1432) are sleeved with a first sliding block (1434), the electric driving cylinder (1435) is mounted on one side of the first sliding block (1434), the output end of the electric driving cylinder (1435) faces upwards and is connected with the suction cup (1436), the upper end and the lower end of the dust removing piece (11) are respectively connected with the suckers (1436) in the first moving assembly (142) and the second moving assembly (143), an opening is arranged on one side of the dust removing piece (11) close to the inflating sleeve (133), the chip mounting device (3) comprises a mounting frame (31), a third moving assembly (32) and a base tray (33), the number of the mounting frames (31) is two, the two mounting frames (31) are symmetrically arranged on one side of the replacing component (14) far away from the inflating component (13), the third moving assembly (32) is mounted between two mounting brackets (31), the third moving assembly (32) is identical to the second moving assembly (143) in structure, the output end of a driving electric cylinder (1435) in the third moving assembly (32) is arranged downwards, the base tray (33) is disposed directly below the suction cups (1436) in the third moving assembly (32).
2. The gluing equipment for the production of the power amplifier chip as claimed in claim 1, wherein the surface of the dust removing piece (11) is made of soft sticky material.
3. The gluing equipment for the production of the power amplifier chip as claimed in claim 2, wherein the dust removal device (1) further comprises two clamping assemblies (2), the two clamping assemblies (2) are symmetrically arranged on two sides of the gas transmission pipe (132), each clamping assembly comprises a mounting plate (21), a first connecting rod assembly (22), a second connecting rod assembly (23) and a second motor (24), one side of the mounting plate (21) is connected with the side end of the gas transmission pipe (132), the first connecting rod assembly (22) and the second connecting rod assembly (23) are symmetrically arranged on one side of the mounting plate (21) and the first connecting rod assembly (22) is located above the second connecting rod assembly (23), the first connecting rod assembly (22) and the second connecting rod assembly (23) have the same structure, and the second connecting rod assembly (23) comprises a first rotating shaft (231), Second axis of rotation (232), drive gear (233), first gangbar (234), second gangbar (235), carriage release lever (236) and clamp plate (237), first axis of rotation (231) rotate with mounting panel (21) and are connected, drive gear (233) install on first axis of rotation (231) and first axis of rotation (231) are connected with the one end of first gangbar (234), second axis of rotation (232) rotate with mounting panel (21) and are connected and lie in one side that first axis of rotation (231) are close to inflating cover (133), second axis of rotation (232) rotate with the one end of second gangbar (235) and be connected, the other end of first gangbar (234) and second gangbar (235) rotates with carriage release lever (236) respectively and is connected, the top that carriage release lever (236) are close to the one end of inflating cover (133) is connected with clamp plate (237), the one end that first axis of rotation (231) in first gangbar (22) and mounting panel (21) are connected is connected And the driving gear (233) in the first connecting rod assembly (22) and the second connecting rod assembly (23) is meshed with each other.
4. The gluing device for the production of the power amplifier chip according to claim 3, wherein the gluing device (4) comprises a surrounding gluing component (41) and a disengaging component (43), the surrounding gluing component (41) comprises a fixed frame (411), a connecting plate (412), a connecting rod (413), a movable sleeve rod (414), a belt pulley (415), a third motor (416), a rotating belt (417), a sliding connection frame (418), a special-shaped fixing rod (419) and a gluing gun (42), the fixed frame (411) is arranged right below a base tray (33), the connecting rods (413) are two, the two connecting rods (413) are respectively arranged at two ends of the top of the fixed frame (411), the connecting plates (412) are two, the two connecting plates (412) are arranged at the top of the fixed frame (411) and are positioned between the two connecting rods (413), the number of the belt pulleys (415) is four, every two belt pulleys (415) are respectively arranged at two ends of a connecting plate (412), the four belt pulleys (415) are distributed in a rectangular shape, the output end of a third motor (416) is in transmission connection with the joint of one belt pulley (415) and the connecting plate (412), the rotating belt (417) is sleeved on the four belt pulleys (415), two ends of a movable loop bar (414) are respectively sleeved on two connecting rods (413), the movable loop bar (414) is in sliding fit with the two connecting rods (413), a slide way is arranged in the middle of the movable loop bar (414), the sliding connecting frame (418) is arranged on the rotating belt (417), the top of the sliding connecting frame (418) is clamped with the slide way on the movable loop bar (414), and the sliding connecting frame (418) is in sliding fit with the slide way on the movable loop bar (414), the special-shaped fixing rod (419) is arranged at the top of the sliding connection frame (418), and the glue gun (42) is arranged at the top of the special-shaped fixing rod (419) in an inclined mode.
5. The gluing device for the production of the power amplifier chip as recited in claim 4, wherein the detaching assembly (43) comprises two second limiting rods (431), two second driving screw rods (432), a fourth motor (433), two second sliding blocks (434) and two connecting seats (435), the two connecting seats (435) are symmetrically arranged below the fixing frame (411), two ends of the second limiting rods (431) are respectively connected with the side ends of the two connecting seats (435), two ends of the second driving screw rods (432) are respectively rotatably connected with the two connecting seats (435), one end of the second driving screw rods (432) passes through the connecting seats (435) and is connected with the output end of the fourth motor (433), the second limiting rods (431) and the second driving screw rods (432) are sleeved with the second sliding blocks (434), the top of the second sliding block (434) is connected with the bottom of the fixed frame (411).
CN202110566384.3A 2021-05-24 2021-05-24 A rubber coating equipment for production of power amplifier chip Active CN113210211B (en)

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CN112354799A (en) * 2020-11-09 2021-02-12 惠州市迪凡家具有限公司 Automatic gluing device
CN212883996U (en) * 2020-08-06 2021-04-06 山东省食品药品检验研究院 Novel handheld air bag type automatic cleaning device for distillation flask

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CN108704871A (en) * 2018-05-29 2018-10-26 无锡远及科技有限公司 A kind of PCB circuit board production and processing plate face cleaning systems and its clean method
CN212237992U (en) * 2020-02-24 2020-12-29 江苏传艺科技股份有限公司 Gluing equipment for producing power amplifier chip
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