CN113192994A - Lens module and forming method thereof - Google Patents

Lens module and forming method thereof Download PDF

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Publication number
CN113192994A
CN113192994A CN202110496842.0A CN202110496842A CN113192994A CN 113192994 A CN113192994 A CN 113192994A CN 202110496842 A CN202110496842 A CN 202110496842A CN 113192994 A CN113192994 A CN 113192994A
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China
Prior art keywords
lens
lens group
wafer
level
substrate
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CN202110496842.0A
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CN113192994B (en
Inventor
李绍志
王辉
陈一诚
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Omnivision Optoelectronic Technologies Shanghai Co Ltd
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Omnivision Optoelectronic Technologies Shanghai Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements

Abstract

The invention provides a lens module and a forming method thereof, wherein the lens module comprises a lens group and a substrate; the substrate includes a first surface having a concentration of internal stresses; the lens group is positioned on the first surface and is provided with a notch; wherein, the breach exposes the internal stress concentration point, has a confined cavity between lens group and the first surface, and the optics region of lens group is arranged in the cavity, is the interval setting between breach and the cavity, and does not link up between breach and the cavity. According to the lens module, the gap is formed in the lens group, the internal stress of the contact surface of the substrate and the lens group at the internal stress concentration point can be dispersed by exposing the internal stress concentration point through the gap, and the internal stress is transferred and dispersed to other areas of the contact surface of the substrate and the lens group, so that physical damage between the lens group and the substrate is avoided, and the optical quality of the lens module is improved.

Description

Lens module and forming method thereof
Technical Field
The present invention relates to the field of optical devices, and more particularly, to a lens module and a method for forming the same.
Background
The lens module has the characteristics of small volume and strong function, and the main components of the lens module comprise a lens and an image sensor. The main working principle is as follows: the optical image generated by the scene through the lens is projected on the surface of the image sensor and converted into an electric signal. The lens is formed by combining different lenses, is an important component of the lens module and plays a very important role in the imaging effect. The lens mainly determines the image clarity (image clarity, light, distance view) and image display range, and affects the highest pixels. The image sensor is a core module of the lens module and converts light rays into electric signals.
After the lens module is assembled, the lens module is heated for a period of time at a high temperature ranging from 240 ℃ to 250 ℃ through a high-temperature reflow soldering process, and the components of the lens module are cracked due to internal stress under the high-temperature condition, so that the optical quality of the lens module is poor.
Disclosure of Invention
The present invention is directed to a lens module and a method for forming the same, which can reduce the internal stress of the lens module and improve the reliability and optical quality of the lens module.
In order to solve the above technical problems, the present invention provides a lens module, which includes a lens group and a substrate;
the substrate includes a first surface having a point of concentration of internal stress;
the lens group is positioned on the first surface and is provided with a notch;
wherein, the breach exposes the internal stress concentration point, lens group with a confined cavity has between the first surface, the optics region of lens group is located in the cavity, the breach with be the interval setting between the cavity, just the breach with do not link up between the cavity.
Optionally, the length of the notch in the thickness direction of the lens group is less than or equal to the thickness of the lens group.
Further, the lens group comprises a first lens and a plurality of second lenses, the second lenses are sequentially stacked on the first lens along the thickness direction of the lens group, and the length of the notch in the thickness direction of the lens group is smaller than or equal to the length of the first lens in the thickness direction of the lens group.
Optionally, the lens group is of a cuboid structure, the substrate is a rectangular substrate, and the internal stress concentration point is located at the corner of the rectangular substrate.
Optionally, the lens module further includes a protection layer and an image sensor, the substrate further includes a second surface, the second surface is opposite to the first surface, and the protection layer and the image sensor are sequentially stacked on the second surface along a thickness direction of the lens group.
In another aspect, the present invention further provides a method for forming a lens module, including the following steps:
providing a lens group, wherein the lens group is provided with a notch;
providing a substrate, wherein the substrate comprises a first surface, and the lens group is stacked on the first surface to form a lens module;
wherein, the first surface has the internal stress and concentrates the point, the breach exposes the internal stress concentrates the point, the lens group with a confined cavity has between the first surface, the optics region of lens group is located in the cavity, the breach with be the interval setting between the cavity, just the breach with do not link up between the cavity.
Optionally, providing the lens group includes:
providing a first wafer-level lens and a plurality of second wafer-level lenses, and sequentially stacking the plurality of second wafer-level lenses along the thickness direction of the first wafer-level lens to form a wafer-level lens group;
the first lens of the wafer level is provided with a recess, the recess is positioned on the cutting path of the lens group of the wafer level, and the recess is positioned on one side of the first lens of the wafer level, which is far away from the second lens of the wafer level; and
and cutting the first wafer-level lens and the second wafer-level lens along the cutting path to obtain a single first lens, a single second lens and a single lens group, wherein the notch forms a notch on each lens group.
Optionally, providing a lens set, the lens set having a notch comprising:
providing a first wafer-level lens and a plurality of second wafer-level lenses, and sequentially stacking the plurality of second wafer-level lenses along the thickness direction of the first wafer-level lens to form a wafer-level lens group;
forming a through hole at the intersection of the cutting streets of the wafer-level lens group, wherein the through hole penetrates through the lens group along the thickness direction of the lens group, and the through hole is partially positioned in a non-optical area of the lens group; and
and cutting the first wafer-level lens and the second wafer-level lens along the cutting path to obtain a single first lens, a single second lens and a single lens group, wherein the through hole forms a notch on each lens group.
Optionally, providing a substrate, the substrate including a first surface, and stacking the lens group on the first surface to form a lens module includes:
providing a substrate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged, and arranging the lens group on the first surface; and
and sequentially stacking a protective layer and an image sensor on the second surface along the thickness direction of the lens group to form the lens module.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a lens module and a forming method, wherein the lens module comprises a lens group and a substrate; the substrate includes a first surface having a point of concentration of internal stress; the lens group is positioned on the first surface and is provided with a notch; wherein, the breach exposes the internal stress concentration point, lens group with a confined cavity has between the first surface, the optics region of lens group is located in the cavity, the breach with be the interval setting between the cavity, just the breach with do not link up between the cavity. The lens group is provided with the notch, the notch exposes the internal stress concentration point, so that the internal stress of the contact surface of the substrate and the lens group at the internal stress concentration point can be dispersed, and the internal stress is transferred and dispersed to other areas of the contact surface of the substrate and the lens group, thereby avoiding the physical damage between the lens group and the substrate and improving the optical quality of the lens module.
Drawings
FIGS. 1a-1d are schematic cross-sectional views of two lens modules;
fig. 2a-2b are schematic cross-sectional views of a lens module according to an embodiment of the invention;
fig. 2c is a schematic view of an FEM simulation of a lens module with a notch according to a first embodiment of the invention;
FIGS. 3a-3b are schematic cross-sectional views illustrating the formation of a first lens according to a first embodiment of the invention;
fig. 4a-4b are schematic cross-sectional views of a lens module according to a second embodiment of the present invention;
fig. 4c is a schematic view of an FEM simulation of a lens module with a notch according to a second embodiment of the invention;
fig. 5a-5b are schematic cross-sectional views illustrating the formation of a first lens according to a second embodiment of the invention.
Description of reference numerals:
in FIGS. 1a-1 c:
a-an internal stress concentration point;
10-a support structure; 11. 11' -a substrate; 11 a-a first substrate; 11b a second substrate; 12-side walls; 12 a-a first sidewall; 12 b-a second sidewall; 21. 22-a lens; 31-a protective layer; 32-an image sensor; 40-a lens;
in FIGS. 2a-5 b:
a-an internal stress concentration point; b-a notch;
100-lens; 110-a substrate; 120-a lens group; 120 a-optical zone of lens set; 120 b-cutting lane of lens group; 121-a first lens; 122-a second lens; 210-an image sensor; 220-a protective layer; 300-a light-shielding layer; 400-a through hole; 121' -a mold.
Detailed Description
As shown in fig. 1a, a lens of a conventional lens module includes a supporting structure 10 and a lens, the supporting structure includes a substrate 11 and a side wall 12, the side wall 12 and the substrate 11 are sequentially arranged along an axial direction of a height of the lens module, for example, the number of the substrate 11 and the side wall 12 is two, and the first substrate 12a, the first substrate 11a, the second substrate 12b and the second substrate 11b are sequentially arranged from bottom to top, so that the first substrate 11a and the second substrate 11b are arranged at intervals. The protective layer 31 of the image sensor is disposed between the image sensor 32 and the lens, and the protective layer 31 is disposed at a distance from the second substrate 11 b. The number of the lenses is two, for example, and the lenses are lenses 21 and 22, respectively, and the lenses 21 and 22 are oppositely disposed on two surfaces of the first substrate 11 a. In this structure, since the Coefficients of Thermal Expansion (CTE) of the substrate 11 and the sidewall 12 are very similar, the structure has good characteristics in a reliability test (e.g., a reflow test), but the optical quality of the structure is poor.
Therefore, as shown in fig. 1b, in order to improve the optical quality of the lens module, a new lens of the lens module is provided, wherein the lens comprises a lens group and a substrate 11 ', the lens group comprises a plurality of lenses 40 prepared by cured optical cement, each lens 40 comprises at least one lens, the plurality of lenses 40 are formed by stacking, for example, the optical areas of each lens 40 are overlapped, and the lens group is adhered on the substrate 11' by adhesive cement. In the structure, because the thermal expansion coefficient of the lens group changes greatly, the difference between the thermal expansion coefficient of the lens group and the thermal expansion coefficient of the substrate is large, the internal stress between the lens group and the substrate is large in reliability test (such as reflow test), the fracture of the lens group is easily caused, and the optical quality of the lens module is influenced.
It is found through research that the internal stress between the lens group and the substrate is concentrated and distributed at an internal stress concentration point (in an area where a corner edge is extremely small) a on a surface of the substrate facing the lens group, and the internal stress concentration point has a large pressure (e.g., about 38.9Mpa), which easily causes the fracture of the lens group, thereby affecting the optical quality of the lens module, as shown in fig. 1c and 1 d.
Based on the above analysis, the core of the present invention is to provide a lens module, which includes a lens group and a substrate;
the substrate includes a first surface having a point of concentration of internal stress;
the lens group is positioned on the first surface and is provided with a notch;
wherein, the breach exposes the internal stress concentration point, lens group with a confined cavity has between the first surface, the optics region of lens group is located in the cavity, the breach with be the interval setting between the cavity, just the breach with do not link up between the cavity.
The invention also provides a forming method of the lens module, which comprises the following steps:
providing a lens group, wherein the lens group is provided with a notch; and
providing a substrate including a first surface, stacking the lens group on the first surface to form a lens module,
wherein, the first surface has the internal stress and concentrates the point, the breach exposes the internal stress concentrates the point, the lens group with a confined cavity has between the first surface, the optics region of lens group is located in the cavity, the breach with be the interval setting between the cavity, just the breach with do not link up between the cavity.
A lens module and a method of forming the same according to the present invention will be described in more detail with reference to the flow chart and the schematic drawings, in which preferred embodiments of the present invention are shown, it being understood that those skilled in the art can modify the present invention described herein while still achieving the advantageous effects of the present invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.
The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
Fig. 2a is a schematic perspective view of the lens module according to the embodiment. FIG. 2b is a schematic cross-sectional view along AA' of FIG. 2 a. As shown in fig. 2a and 2b, the present embodiment provides a lens module, which includes a lens 100 and an image sensor 210, wherein the lens 100 includes a substrate 110 and a lens group 120, and the image sensor 210 and the lens group 120 are respectively disposed on two sides of the substrate 110.
The substrate 110 includes a first surface and a second surface opposite to each other, the lens group 120 is disposed on the first surface, and specifically, the lens group 120 is bonded on the first surface by an adhesive. The substrate 110 is, for example, transparent glass, optical glass, glass with an optical coating layer, or optical glass.
The lens set 120 is formed by stacking at least two lens pieces, each of which may include at least one lens, the lens set 120 includes, for example, a first lens piece 121 and at least one second lens piece 122, the first lens piece 121 is adhered to the first surface of the substrate 110 by an adhesive, the at least one second lens piece 122 is stacked on the first lens piece 121 along a thickness direction of the lens set, and a closed cavity is formed between the substrate 110 and the first lens piece 121. The lens set 120 includes an optical area and a non-optical area, the optical area of the lens set 120 being located in the cavity. In this embodiment, the first lens 121 includes two lenses, two lenses are disposed along the thickness direction of the first lens 121, one of the lenses is disposed on a side of the first lens 121 close to the first surface, the other lens is disposed on a side of the first lens 121 far from the first surface, and projections of optical areas of the two lenses on the first surface overlap. The first lens 121 and the second lens 122 may be a convex lens, a concave lens, or a combination of a convex lens and a concave lens. The optical area of the first mirror 121 overlaps the projection of the optical area of the second mirror 122 onto the first surface. The number of the second lens 122 may be 2, the second lens 122 close to the substrate 110 is a convex lens, and the second lens 122 far from the substrate 110 is a concave lens. In the first mirror 121 and the second mirror 122, an area where the curved surface of the lens is located is an optical area, and an area other than the optical area is a non-optical area. In addition, in the present embodiment, the same reference numeral 122 is used for both of the two different second mirrors 122, but the types of the two lenses are not limited to be the same (i.e., both are convex lenses or concave lenses).
Fig. 2c is a schematic view of FEM simulation of the lens module with the notch according to the present embodiment. As shown in fig. 2c, the first surface has an internal stress concentration point a, and the first lens piece 121 and the substrate 110 have the largest interaction force at the internal stress concentration point a of the first surface during a high/low temperature test (e.g., a reflow test), which may easily cause a crack of the lens group 120 (especially the first lens piece 121). Therefore, the lens group 120 has a notch b at the internal stress concentration point a. Since the lens group 120 is generally a rectangular parallelepiped structure, the substrate 110 is a rectangular substrate, and the internal stress concentration point a is located at a corner of the first surface, which is close to the intersection of two edges of the first surface, the notch b exposes the corner of the first surface. The gap b and be the interval setting between the cavity (the optical zone of lens group), just gap b with do not link up between the cavity, that is to say, gap b does not expose the cavity in the external environment for the internal stress dispersion of this point is to other positions of first surface (specifically, disperses to other positions that base plate 110 and first lens 121 contacted each other, and is close to stress concentration point a including usually), thereby has avoided the physical damage between lens group and the base plate, has improved the optical quality of camera lens module.
In the first lens 121, the number of the notches is at least one, preferably, the number of the first notches is 4, and in other embodiments, the number of the notches is at least 1, 2 or 3.
Taking the example that the first lens has 4 notches, in the reflow test, the lens module shown in fig. 2a is adopted, the stress at the internal stress concentration point a is about 21.8Mpa, but because the first lens at the internal stress concentration point a is not in contact with the substrate, the stress at this point does not exert an extrusion effect on the first lens, and the internal stress at other positions of the first surface is about 17.9Mpa at most, which is much smaller than the internal stress (38.9Mpa) of the first lens on the first surface when no notch is present, it can be known that the notches disperse the internal stress caused by the thermal expansion coefficient of the lens group in the reflow test, thereby avoiding the physical damage between the lens group and the substrate, and improving the optical quality of the lens module.
The lens module further includes a protection layer 220, the protection layer 220 is located between the lens and the image sensor 210, one side of the protection layer 220 is adhered to the second surface of the substrate 110 by an adhesive, and the other side of the protection layer 220 is adhered to the image sensor 210 by an adhesive.
The image sensor 210 may include, for example, a photodiode therein to convert a received optical signal into an electrical signal. The image sensor 210 may be provided with a circuit substrate, and a solder ball may be formed on a surface of the circuit substrate, or may be in a form of a pad, and is used for leading out a signal of the image sensor 210. The circuit substrate is used for amplifying the electric signals, outputting the electric signals in a normalized mode, shielding EMC electromagnetic interference and the like. The protective layer 220 covers the surface of the image sensor 210, and is used to protect the image sensor 210, place damages or dust pollution, and the like, the protective layer 220 is, for example, a glass layer, the glass layer is transparent glass, and while protecting the surface of the image sensor 210, light can penetrate through the glass layer to irradiate the image sensor 210, and does not affect the image sensor 210 to receive light.
The lens module further includes a light shielding layer 300, where the light shielding layer 300 covers the lens, the protection layer 220, the sidewall of the image sensor 210, and the non-optical area on the side of the lens group 120 away from the substrate 110, so as to prevent light from entering the lens module from these areas, and prevent light entering the lens module from the optical area of the second lens 122 from exiting from these areas.
The embodiment also provides a method for forming a lens module, which comprises the following steps:
step S11: providing a lens set 120, wherein the lens set 120 has a notch; and
step S12: providing a substrate 110, the substrate 110 including a first surface, stacking the lens group 120 on the first surface to form a lens module,
wherein, the first surface has the internal stress concentration point, the breach exposes the internal stress concentration point, lens group 120 with a confined cavity has between the first surface, the optics region position of lens group 120 in the cavity, breach b with be the interval setting between the cavity, just breach b with do not link up between the cavity.
A method for forming a lens module according to the present embodiment will be described in detail with reference to fig. 3a to 3b and fig. 2a to 2 b.
First, step S11 is executed to provide a lens set 120, wherein the lens set 120 has a notch.
The method specifically comprises the following steps:
firstly, providing a wafer-level first lens and a plurality of wafer-level second lenses, and sequentially stacking the plurality of wafer-level second lenses along the thickness direction of the wafer-level first lenses to form a wafer-level lens group, wherein the wafer-level first lens is provided with a recess, the recess is positioned on a cutting path of the wafer-level lens group, and the recess is positioned on one side of the wafer-level first lens, which is far away from the wafer-level second lenses.
Wherein, the first lens forming the wafer level is formed by the following steps: first, as shown in fig. 3a, a mold 121 'is provided, where the mold 121' includes a plurality of convex surfaces and curved surfaces for preparing the first lens, the curved surfaces are arranged in an array, and adjacent curved surfaces are spaced apart from each other, and the spacing between adjacent curved surfaces is used to form a cutting path, the convex surfaces are located at the intersection of the cutting paths, and the curved surfaces and the convex surfaces are spaced apart from each other, that is, the curved surfaces and the convex surfaces are not connected or overlapped with each other. The convex surface can be arranged at the intersection of each cutting path, or the convex surface can be arranged at part of the intersection, and each curved surface is at least adjacent to one convex surface. In this embodiment, the convex surface is present at the intersection of each cutting street. As shown in fig. 3b, a carrier plate is provided, and an optical adhesive is covered on the carrier plate to be confined between the mold and the carrier plate. Then, a first lens at a wafer level is formed through a curing process, the mold and the carrier plate are removed, the first lens 121 is formed on the curved surface of the mold, and the concave is formed on the convex surface of the mold. A plurality of wafer-level second lenses are provided, and the wafer-level second lenses include a plurality of second lenses 122 arranged in an array, and scribe lines for spacing adjacent second lenses 122. The optical area of the first lens 121 and the optical area of the second lens 122 are overlapped in the thickness direction of the first lens 121 to form an optical area of a circular-grade lens group, and the scribe line of the second lens of the wafer grade and the scribe line of the first lens of the wafer grade are overlapped in the thickness direction of the first lens of the wafer grade to form a scribe line of the circular-grade lens group.
Then, the first wafer-level lens and the second wafer-level lens are cut along the dicing streets, and the single first lens 121 and the single second lens 122 are separated to obtain the single first lens 121, the single second lens 122 and the single lens group 120, wherein the recesses form a notch on each lens group 121, the notch is located at a corner of the first lens 121, and the notch is spaced from the optical area of the first lens 121.
As shown in fig. 2a-2b, step S12 is performed to provide a substrate 110, wherein the substrate 110 includes a first surface and a second surface opposite to each other, the lens group 120 is stacked on the first surface to form a lens module,
wherein, the internal stress concentration point has on the first surface, the breach exposes the internal stress concentration point, lens group 120 with a confined cavity has between the first surface, the optics region position of lens group 120 in the cavity, breach b with be the interval setting between the cavity, just breach b with do not link up between the cavity.
The method specifically comprises the following steps:
first, a substrate 110 is provided, wherein the substrate 110 includes a first surface and a second surface oppositely disposed. Then, the lens group 120 is stacked on the first surface, and an internal stress concentration point a is formed on the stacked first surface, a closed cavity is formed between the lens group 120 and the substrate 110, an optical area of the lens group 120 is located in the cavity, the notch b exposes the internal stress concentration point a, and the notch b and the cavity are arranged at an interval, and the notch b and the cavity are not communicated.
Next, an image sensor 210 is provided, on which a protective layer 220 is disposed on the image sensor 210.
Wherein the image sensor 210 is adhered on one side of the protective layer 220 by an adhesive.
Next, an image sensor 210 is disposed on the second surface, and the protective layer 220 is located between the substrate 110 and the image sensor 210.
Next, a light shielding layer 300 is formed on the lens module, and the light shielding layer 300 covers the lens group 120, the protective layer 220, and the sidewall of the image sensor 210, and also covers a non-optical area of the second lens 122 away from the substrate 110.
Tests show that the internal stress on the surface of the substrate in contact with the lens group is reduced by 45% in high and low temperature tests (temperature-40 ℃ to 25 ℃).
Example two
Fig. 4a is a schematic perspective view of a lens module according to the present embodiment. Fig. 4b is a schematic cross-sectional view along BB' of fig. 4 a. As shown in fig. 4a-4b, compared with the first embodiment, the present embodiment is different in that the notch b penetrates through the lens group 120 along the thickness direction of the lens group 120, so that the length of the notch b along the thickness direction of the lens group 120 is equal to the thickness of the lens group 120. That is to say, the notch penetrates through the first lens 121 and all the second lenses 122 along the thickness direction of the lens group 120, and the notch is not communicated with the optical areas of the first lens 121 and the second lenses 122 and is disposed at an interval.
In other embodiments, the length of the notch along the thickness direction of the lens set 120 is less than the thickness of the lens set.
The number of said indentations is at least 1, such as 1, 2, 3 or 4. In this embodiment, the notches b are located at the intersection of two sidewalls of the lens group 120, and the number of the notches b is 4.
Fig. 4c is a schematic view of FEM simulation of the lens module with the notch according to the present embodiment. As shown in fig. 4c, taking the lens assembly with 4 notches as an example, in the reflow test, the lens module shown in fig. 4b is adopted, and the pressure at the internal stress concentration point a of the first surface is about 38.9 Mpa; adopt the camera lens module of this embodiment, the pressure of internal stress concentration point a is about 18.5Mpa, and the pressure of the biggest position department of pressure on first surface is about 17.5Mpa, can know, the breach of this structure has dispersed the internal stress that causes because of the coefficient of thermal expansion of lens group when the reflux test to avoid the physical damage between lens group and the base plate, improved the optics quality of camera lens module.
As shown in fig. 5a-5b, the forming method of the lens assembly of the present embodiment is as follows:
first, a wafer level lens set is provided having optical areas 120a and non-optical areas, the wafer level lens set having kerfs 120b between the lens sets 120 in the non-optical areas, the kerfs 120b surrounding the optical areas 120a of each lens set 120.
The wafer-level lens group is formed by sequentially stacking a wafer-level first lens and a plurality of wafer-level second lenses along the thickness direction of the wafer-level first lens, wherein the wafer-level first lens is provided with a single first lens 121 and a first cutting path arranged between the adjacent first lenses 121, the wafer-level second lens 122 is stacked with a single second lens 122 and a second cutting path arranged between the adjacent second lenses 122, the projection of the second cutting path on the wafer-level first lens is overlapped with the first cutting path to form the cutting path of the wafer-level lens group, and the projection of the optical area of the wafer-level second lens on the wafer-level first lens is overlapped with the optical area of the wafer-level first lens to form the optical area of the wafer-level lens group.
Then, a through hole 400 is formed at the intersection of the cutting streets of the wafer-level lens group, the through hole 400 penetrates through the wafer-level lens group along the thickness direction of the wafer-level lens group, and the through hole is partially located in the non-optical area of the lens group.
In this step, the through holes 400 may be formed at the intersections of some of the cutting streets, or the through holes 400 may be formed at the intersections of each of the cutting streets, but at least one lens group 120 is adjacent to one through hole 400. In this embodiment, a through hole 400 is formed at the intersection of each cutting street, so that each lens group 120 is adjacent to 4 through holes 400.
Then, the wafer-level first lens and the wafer-level second lens are cut along the cutting track to obtain a single first lens 121, a single second lens 122 and a single lens group 120, and the cut through hole 400 forms a notch at a corner of the lens group 120, where the notch exposes the internal stress concentration point.
In this step, the wafer-level lens group is cut along the cutting path by the through hole 400 to form a single lens group 120, the through hole 400 at the intersection of the cutting path is cut and split during cutting, specifically, the through hole 400 is located at the cross intersection, and is cut and split into four pieces, the four pieces of split through holes 400 form a notch in the lens group 120, and the notch enables the subsequent lens group 120 to be stacked behind the first surface, and exposes an internal stress concentration point a where the internal stress is concentrated, so that the internal stress on the first surface is dispersed, thereby reducing the lenses and improving the optical quality of the lens module.
In summary, the present invention provides a lens module and a method for forming the same, wherein the lens module includes a lens assembly and a substrate; the substrate includes a first surface having a point of concentration of internal stress; the lens group is positioned on the first surface and is provided with a notch; wherein, the breach exposes the internal stress concentration point, lens group with a confined cavity has between the first surface, the optics region of lens group is located in the cavity, the breach with be the interval setting between the cavity, just the breach with do not link up between the cavity. The lens group is provided with the notch, the notch exposes the internal stress concentration point, so that the internal stress of the contact surface of the substrate and the lens group at the internal stress concentration point can be dispersed, and the internal stress is transferred and dispersed to other areas of the contact surface of the substrate and the lens group, thereby avoiding the physical damage between the lens group and the substrate and improving the optical quality of the lens module.
In addition, unless otherwise specified or indicated, the description of the terms "first" and "second" in the specification is only used for distinguishing various components, elements, steps and the like in the specification, and is not used for representing logical relationships or sequential relationships among the various components, elements, steps and the like.
It is to be understood that while the present invention has been described in conjunction with the preferred embodiments thereof, it is not intended to limit the invention to those embodiments. It will be apparent to those skilled in the art from this disclosure that many changes and modifications can be made, or equivalents modified, in the embodiments of the invention without departing from the scope of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention, unless the contents of the technical solution of the present invention are departed.

Claims (9)

1. A lens module is characterized in that the lens module comprises a lens group and a substrate;
the substrate includes a first surface having a point of concentration of internal stress;
the lens group is positioned on the first surface and is provided with a notch;
wherein, the breach exposes the internal stress concentration point, lens group with a confined cavity has between the first surface, the optics region of lens group is located in the cavity, the breach with be the interval setting between the cavity, just the breach with do not link up between the cavity.
2. The lens module as recited in claim 1 wherein the length of the notch along the thickness direction of the lens group is less than or equal to the thickness of the lens group.
3. The lens module as recited in claim 2 wherein the lens group comprises a first lens and a plurality of second lenses, the plurality of second lenses are sequentially stacked on the first lens along a thickness direction of the lens group, and a length of the notch along the thickness direction of the lens group is less than or equal to a length of the first lens along the thickness direction of the lens group.
4. The lens module as recited in claim 1 wherein the lens group is a rectangular parallelepiped, the substrate is a rectangular substrate, and the stress concentration point is located at a corner of the rectangular substrate.
5. The lens module as recited in claim 1, wherein the lens module further comprises a protective layer and an image sensor, the substrate further comprises a second surface, the second surface is disposed opposite to the first surface, and the protective layer and the image sensor are sequentially stacked on the second surface along a thickness direction of the lens group.
6. A method for forming a lens module is characterized by comprising the following steps:
providing a lens group, wherein the lens group is provided with a notch;
providing a substrate, wherein the substrate comprises a first surface, and the lens group is stacked on the first surface to form a lens module;
wherein, the first surface has the internal stress and concentrates the point, the breach exposes the internal stress concentrates the point, the lens group with a confined cavity has between the first surface, the optics region of lens group is located in the cavity, the breach with be the interval setting between the cavity, just the breach with do not link up between the cavity.
7. The method as claimed in claim 6, wherein providing the lens assembly comprises:
providing a first wafer-level lens and a plurality of second wafer-level lenses, and sequentially stacking the plurality of second wafer-level lenses along the thickness direction of the first wafer-level lens to form a wafer-level lens group;
the first lens of the wafer level is provided with a recess, the recess is positioned on the cutting path of the lens group of the wafer level, and the recess is positioned on one side of the first lens of the wafer level, which is far away from the second lens of the wafer level; and
and cutting the first wafer-level lens and the second wafer-level lens along the cutting path to obtain a single first lens, a single second lens and a single lens group, wherein the notch forms a notch on each lens group.
8. The method as claimed in claim 6, wherein providing a lens set having a notch comprises:
providing a first wafer-level lens and a plurality of second wafer-level lenses, and sequentially stacking the plurality of second wafer-level lenses along the thickness direction of the first wafer-level lens to form a wafer-level lens group;
forming a through hole at the intersection of the cutting streets of the wafer-level lens group, wherein the through hole penetrates through the lens group along the thickness direction of the lens group, and the through hole is partially positioned in a non-optical area of the lens group; and
and cutting the first wafer-level lens and the second wafer-level lens along the cutting path to obtain a single first lens, a single second lens and a single lens group, wherein the through hole forms a notch on each lens group.
9. The method as claimed in claim 6, wherein providing a substrate having a first surface, and stacking the lens assembly on the first surface to form a lens module comprises:
providing a substrate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged, and arranging the lens group on the first surface; and
and sequentially stacking a protective layer and an image sensor on the second surface along the thickness direction of the lens group to form the lens module.
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Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101034193A (en) * 2006-03-08 2007-09-12 鸿富锦精密工业（深圳）有限公司 Spacing ring used in camera lens, camera lens and assembling method therefor
JP2009104100A (en) * 2007-09-27 2009-05-14 Enplas Corp Optical unit
JP2009123788A (en) * 2007-11-12 2009-06-04 Sharp Corp Solid-state imaging apparatus, method of manufacturing solid-state imaging apparatus, and photographic apparatus using the same solid-state imaging apparatus
US20100053407A1 (en) * 2008-02-26 2010-03-04 Tessera, Inc. Wafer level compliant packages for rear-face illuminated solid state image sensors
CN101950787A (en) * 2009-07-10 2011-01-19 夏普株式会社 Light emitting element module and manufacturing method thereof, and backlight apparatus
JP2011040577A (en) * 2009-08-11 2011-02-24 Citizen Electronics Co Ltd Method of manufacturing light-emitting device
CN102547082A (en) * 2010-12-29 2012-07-04 三星电机株式会社 Camera module and method for manufacturing the same
AU2012203592A1 (en) * 2005-11-16 2012-07-12 Manufacturing Systems Limited Improvements in or relating to forming apparatus
US20140118664A1 (en) * 2012-11-01 2014-05-01 Seiko Epson Corporation Micro lens array substrate, electro-optical device, and electronic apparatus
US20140125995A1 (en) * 2011-05-05 2014-05-08 Carl Zeiss Smt Gmbh Optical module with a measuring device
CN106772884A (en) * 2016-12-21 2017-05-31 北京空间机电研究所 A kind of low-temperature lens compress release type and disappear thermal stress supporting construction
US20170294390A1 (en) * 2016-04-07 2017-10-12 Schott Ag Lens cap for a transistor outline package
CN112166361A (en) * 2018-05-24 2021-01-01 珀莱特股份有限公司 Optical element with stress distribution support structure
CN112698463A (en) * 2020-12-29 2021-04-23 豪威光电子科技（上海）有限公司 Packaging structure and packaging method of optical element

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2012203592A1 (en) * 2005-11-16 2012-07-12 Manufacturing Systems Limited Improvements in or relating to forming apparatus
CN101034193A (en) * 2006-03-08 2007-09-12 鸿富锦精密工业（深圳）有限公司 Spacing ring used in camera lens, camera lens and assembling method therefor
JP2009104100A (en) * 2007-09-27 2009-05-14 Enplas Corp Optical unit
JP2009123788A (en) * 2007-11-12 2009-06-04 Sharp Corp Solid-state imaging apparatus, method of manufacturing solid-state imaging apparatus, and photographic apparatus using the same solid-state imaging apparatus
US20100053407A1 (en) * 2008-02-26 2010-03-04 Tessera, Inc. Wafer level compliant packages for rear-face illuminated solid state image sensors
CN101950787A (en) * 2009-07-10 2011-01-19 夏普株式会社 Light emitting element module and manufacturing method thereof, and backlight apparatus
JP2011040577A (en) * 2009-08-11 2011-02-24 Citizen Electronics Co Ltd Method of manufacturing light-emitting device
CN102547082A (en) * 2010-12-29 2012-07-04 三星电机株式会社 Camera module and method for manufacturing the same
US20140125995A1 (en) * 2011-05-05 2014-05-08 Carl Zeiss Smt Gmbh Optical module with a measuring device
US20140118664A1 (en) * 2012-11-01 2014-05-01 Seiko Epson Corporation Micro lens array substrate, electro-optical device, and electronic apparatus
US20170294390A1 (en) * 2016-04-07 2017-10-12 Schott Ag Lens cap for a transistor outline package
CN106772884A (en) * 2016-12-21 2017-05-31 北京空间机电研究所 A kind of low-temperature lens compress release type and disappear thermal stress supporting construction
CN112166361A (en) * 2018-05-24 2021-01-01 珀莱特股份有限公司 Optical element with stress distribution support structure
CN112698463A (en) * 2020-12-29 2021-04-23 豪威光电子科技（上海）有限公司 Packaging structure and packaging method of optical element

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