CN113186521B - Chemical water bath deposition device and using method thereof - Google Patents
Chemical water bath deposition device and using method thereof Download PDFInfo
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- CN113186521B CN113186521B CN202110491129.7A CN202110491129A CN113186521B CN 113186521 B CN113186521 B CN 113186521B CN 202110491129 A CN202110491129 A CN 202110491129A CN 113186521 B CN113186521 B CN 113186521B
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 216
- 239000000126 substance Substances 0.000 title claims abstract description 185
- 230000008021 deposition Effects 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000007747 plating Methods 0.000 claims abstract description 27
- 238000000151 deposition Methods 0.000 claims description 47
- 238000003860 storage Methods 0.000 claims description 38
- 238000007789 sealing Methods 0.000 claims description 26
- 239000007788 liquid Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 238000000224 chemical solution deposition Methods 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims description 2
- 238000004904 shortening Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 7
- 101100298222 Caenorhabditis elegans pot-1 gene Proteins 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 3
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003020 moisturizing effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a chemical water bath deposition device and a use method thereof, wherein the chemical water bath deposition device comprises a water bath kettle and a chemical tank; the chemical tank is arranged in an inner cavity of the water bath kettle, the inner cavity of the water bath kettle is used for containing water, and the inner cavity of the chemical tank is used for containing chemical plating solution and a substrate; the top surface of the chemical tank is open, the bottom surface of the chemical tank is closed, and the bottom surface of the chemical tank is raised upwards to form a boss, so that the bottom of the chemical tank forms a groove; the groove can be communicated with the inner cavity of the water bath, and the outer side surface of the chemical tank and the tank wall of the groove can be in contact with water in the water bath. In the invention, the bottom surface of the chemical tank is upwards raised, so that the bottom of the chemical tank is provided with the groove which can be communicated with the inner cavity of the water bath, the contact area of the chemical tank and the water in the water bath is increased, and the volume of the chemical plating solution is reduced, thereby shortening the temperature rise time of the chemical plating solution.
Description
Technical Field
The invention relates to the field of water bath deposition devices, in particular to a chemical water bath deposition device and a use method of the chemical water bath deposition device.
Background
At present, there are many methods for preparing thin film materials, including magnetron sputtering, screen printing, electrodeposition, and Chemical Bath Deposition (CBD). Among the above methods, the chemical water bath deposition method is a non-vacuum preparation method, and has the advantages of simple structure of the apparatus, low deposition temperature, and low energy consumption, and thus is widely favored by the scientific research and industrial fields.
In the conventional chemical water bath deposition method, a substrate is usually placed in a chemical bath containing a chemical plating solution, and the chemical bath is placed in a water bath kettle to perform water bath heating treatment, so that a thin film material is deposited on the substrate. However, the temperature of the electroless plating solution in the conventional chemical bath is slowly raised.
Disclosure of Invention
The invention mainly aims to provide a chemical water bath deposition device and a use method of the chemical water bath deposition device, and aims to solve the problem that the temperature of chemical plating solution in a chemical tank is slowly increased.
In order to achieve the purpose, the chemical water bath deposition device provided by the invention comprises a water bath kettle and a chemical tank;
the chemical tank is arranged in the inner cavity of the water bath kettle, the inner cavity of the water bath kettle is also used for containing water, and the inner cavity of the chemical tank is used for containing chemical plating solution and a substrate;
the top surface of the chemical tank is opened, the bottom surface of the chemical tank is closed, and the bottom surface of the chemical tank is raised upwards to form a boss, so that the bottom of the chemical tank forms a groove;
the groove can be communicated with the inner cavity of the water bath, and the outer side surface of the chemical tank and the tank wall of the groove can be in contact with water in the water bath.
Further, the chemical groove is a cylindrical chemical groove, and the boss is a cylindrical boss.
Further, the chemical water bath deposition device also comprises a pair of arc-shaped supports;
the pair of arc-shaped supports are arranged on the inner bottom surface of the water bath kettle and are arranged oppositely; the chemical tank is erected on the arc-shaped support.
Further, the chemical water bath deposition device also comprises at least one U-shaped connecting piece;
the U-shaped connecting piece comprises a rod part, two ends of the rod part are respectively bent and extended to form bent parts, and an opening is formed between the two bent parts of the U-shaped connecting piece;
the U-shaped connecting piece is arranged in an inner cavity of the cylindrical chemical tank, the opening of the U-shaped connecting piece faces the cylindrical boss, and the two bent parts of the U-shaped connecting piece are arranged on the outer side of the cylindrical boss;
the two bending parts of the U-shaped connecting piece are respectively connected with the substrate.
Further, the chemical water bath deposition device also comprises a sealing cover and a driving assembly;
the middle part of the rod part is rotatably connected to the top of the cylindrical boss;
the top surface of the cylindrical chemical tank is detachably connected with the sealing cover;
one side of the sealing cover, which is far away from the cylindrical chemical tank, is connected with the driving assembly, and the driving assembly is connected with the U-shaped connecting piece so as to drive the U-shaped connecting piece to rotate, and further drive the substrate to rotate around the central axis of the cylindrical boss.
Further, the driving assembly comprises a driving motor and a rotating rod;
driving motor connect in what sealed lid deviates from the one side of cylindrical chemical tank, driving motor's output shaft with the one end of dwang is connected, the dwang other end is followed sealed lid stretches into the inside cavity in cylindrical chemical tank and with the U-shaped connecting piece is connected, in order to drive the U-shaped connecting piece rotates.
Further, the driving motor is a speed-regulating motor.
Further, the chemical water bath deposition device also comprises a water storage pipe, a connecting pipe and a one-way valve;
the inner space of the water storage pipe is used for containing water, the water storage pipe is arranged along the vertical direction, the top end of the water storage pipe is communicated with the outer space, the bottom end of the water storage pipe is communicated with the inner cavity of the water bath kettle through the connecting pipe, and the inner cavity of the water bath kettle is communicated with the outer space;
the pipe of the connecting pipe is connected with the one-way valve, so that water in the water storage pipe can flow to the inner cavity of the water bath kettle.
Further, the chemical water bath deposition device also comprises an alarm component and a liquid level switch;
the alarm assembly is mounted on the outer wall of the water bath;
the liquid level switch is arranged in an inner cavity of the water bath kettle and is arranged along the height direction of the water bath kettle;
the liquid level switch is in signal connection with the alarm component and is used for detecting a liquid level value in the water bath and sending the liquid level value to the alarm component;
the alert component is to: storing a preset lowest level value, comparing the level value with the lowest level value, and giving an alarm when the level value is not more than the lowest level value.
In order to achieve the purpose, the invention also provides a using method of the chemical water bath deposition device, which is applied to the chemical water bath deposition device in any one of the above steps; the chemical water bath deposition device also comprises a sealing cover and a driving assembly, wherein the sealing cover is detachably connected to the top surface of the chemical tank, the driving assembly is connected to the sealing cover, and the driving assembly is used for driving the substrate to rotate in the inner cavity of the chemical tank; the chemical water bath deposition device also comprises a water storage pipe, a connecting pipe and a one-way valve; the water storage pipe is arranged along the vertical direction, the top end of the water storage pipe is communicated with the external space, the bottom end of the water storage pipe is communicated with the internal cavity of the water bath kettle through the connecting pipe, and the internal cavity of the water bath kettle is communicated with the external space of the water bath kettle; the one-way valve is connected in the pipe of the connecting pipe so that water in the water storage pipe can flow to the inner cavity of the water bath kettle;
the use method of the chemical water bath deposition device comprises the following steps:
injecting water from the top end of the water storage pipe, so that the water flows into the water bath through the connecting pipe and the one-way valve;
heating the water in the water bath;
detaching the sealing cover on the top surface of the chemical tank;
mounting the substrate to the U-shaped connector;
injecting chemical plating solution into the chemical tank;
mounting the sealing cover on the top surface of the chemical tank;
activating the drive assembly to rotate the substrate within the interior cavity of the chemical bath.
The invention has the following beneficial effects:
1. the bottom surface of the chemical tank is upwards raised, so that a groove which can be communicated with the inner cavity of the water bath pot is formed at the bottom of the chemical tank, the contact area of the chemical tank and the water in the water bath pot is increased, and the volume of the chemical plating solution is reduced, thereby shortening the temperature rise time of the chemical plating solution.
2. In prior art, traditional chemical bath is cuboid chemical bath or cylinder chemical bath usually, however, in traditional chemical bath, the chemical plating solution that is located the intermediate position exists the difference with being located chemical plating solution all around in the temperature, and then can lead to the film deposition inhomogeneous, therefore, make the bottom surface of chemical bath upwards protruding, so that the bottom of chemical bath is formed with the recess that can communicate with the inside cavity of water bath pot, so that carry out the even heating to the chemical plating solution in the chemical bath, and then can reduce the temperature difference of the chemical plating solution of different positions in the chemical bath, in order to improve the homogeneity of coating film.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic perspective view of the present invention;
fig. 2 is a schematic view of the internal structure of the present invention.
The reference numbers illustrate:
| reference numerals | Name(s) | Reference numerals | Name(s) |
| 1 | |
6 | |
| 2 | |
7 | |
| 3 | Thermocouple | 8 | |
| 4 | |
801 | Driving motor |
| 5 | |
802 | Rotating rod |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, descriptions such as "first", "second", etc. in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of the technical solutions by those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a chemical water bath deposition device.
Referring to fig. 1 and 2, the chemical bath deposition apparatus includes a water bath 1 and a chemical bath 2; the chemical tank 2 is arranged in the inner cavity of the water bath 1, the inner cavity of the water bath 1 is also used for containing water, and the inner cavity of the chemical tank 2 is used for containing chemical plating solution and a substrate 4; the top surface of the chemical tank 2 is open, the bottom surface of the chemical tank 2 is closed, and the bottom surface of the chemical tank 2 is raised upwards to form a boss, so that the bottom of the chemical tank 2 forms a groove; the recess can with the inside cavity intercommunication of water-bath 1, the lateral surface of chemical bath 2 with the cell wall of recess all can with water contact in the water-bath 1.
In the technical scheme of the invention, the bottom surface of the chemical tank 2 is raised upwards, so that a groove which can be communicated with the inner cavity of the water bath pot 1 is formed at the bottom of the chemical tank 2, the contact area of the chemical tank 2 and the water in the water bath pot 1 is increased, and the volume of the chemical plating solution is reduced, thereby shortening the temperature rise time of the chemical plating solution. In prior art, traditional chemical bath is cuboid chemical bath or cylinder chemical bath usually, however, in traditional chemical bath, the chemical plating solution that is located the intermediate position and the chemical plating solution that is located all around have the difference in the temperature, and then can lead to the film deposit inhomogeneous, consequently, make the bottom surface of chemical bath 2 raise to the top, so that the bottom of chemical bath 2 is formed with the recess that can communicate with the inside cavity of water bath 1, so that carry out the even heating to the chemical plating solution in the chemical bath 2, and then can reduce the temperature difference of the chemical plating solution of different positions in the chemical bath 2, in order to improve the homogeneity of coating film.
Specifically, the chemical water bath deposition device further comprises a thermocouple 3, wherein the thermocouple 3 is installed in the inner cavity of the water bath kettle 1, and the thermocouple 3 is used for measuring the water temperature in the water bath kettle 1.
Specifically, the chemical tank 2 is a cylindrical chemical tank, and the boss is a cylindrical boss. The chemical water bath deposition device also comprises a pair of arc-shaped supports 5; the pair of arc-shaped supports 5 are arranged on the inner bottom surface of the water bath pot 1, and the pair of arc-shaped supports 5 are arranged oppositely; the chemical tank 2 is erected on the arc-shaped support 5, and a gap is formed between the pair of arc-shaped supports 5, so that the inner cavity of the water bath kettle 1 can be communicated with the groove. Further, the water bath 1 comprises a water bath of a cuboid structure and a water bath of a cylindrical structure; the longitudinal section of the chemical tank 2 is in an inverted concave shape.
In particular, the chemical water bath deposition device further comprises at least one U-shaped connecting piece 6; the U-shaped connecting piece 6 comprises a rod part, two ends of the rod part are respectively bent and extended to form bent parts, and an opening is formed between the two bent parts of the U-shaped connecting piece 6; the U-shaped connecting piece 6 is arranged in an inner cavity of the cylindrical chemical tank, the opening of the U-shaped connecting piece 6 faces the cylindrical boss, and the two bent parts of the U-shaped connecting piece 6 are arranged on the outer side of the cylindrical boss; the two bent portions of the U-shaped connecting member 6 are connected to the substrate 4, respectively. The substrate 4 is arranged along the vertical direction, and when the chemical plating solution is stirred by means of external force, the substrate 4 is arranged along the vertical direction, so that the contact area between the substrate 4 and the chemical plating solution can be increased, and the uniformity of a plated film is improved; the substrate 4 is fixed in through high temperature resistant double faced adhesive tape U-shaped connecting piece 6 connects through high temperature resistant double faced adhesive tape, not only has the convenient advantage of connecting, still has high temperature resistant and connects reliable advantage under the high temperature condition.
Specifically, the chemical water bath deposition device further comprises a sealing cover 7 and a driving assembly 8; the middle part of the rod part is rotatably connected to the top of the cylindrical boss; the top surface of the cylindrical chemical tank is detachably connected with the sealing cover 7; what sealed lid 7 deviates from the one side in cylindrical chemical tank is connected with drive assembly 8, drive assembly 8 with U-shaped connecting piece 6 is connected, in order to drive U-shaped connecting piece 6 rotates, and then drives substrate 4 winds the axis of cylindrical boss rotates. Further, the driving assembly 8 includes a driving motor 801 and a rotating rod 802; the driving motor 801 is connected with the sealing cover 7 deviating from one surface of the cylindrical chemical tank, the output shaft of the driving motor 801 is connected with one end of the rotating rod 802, and the other end of the rotating rod 802 extends into the inner cavity of the cylindrical chemical tank from the sealing cover 7 and is connected with the U-shaped connecting piece 6 to drive the U-shaped connecting piece 6 to rotate. In the prior art, the chemical plating solution is usually stirred by a stirrer positioned at the bottom of the chemical tank, so that the problem of uneven stirring exists, and the uniformity of the plated film can be reduced. Preferably, the driving motor 801 is a speed-adjustable motor, and the rotation speed of the substrate 4 can be adjusted according to requirements, so as to achieve the optimal film coating effect. Preferably, the chemical water bath deposition device comprises a plurality of U-shaped connectors 6 to improve the coating efficiency.
Specifically, the chemical water bath deposition device further comprises a water storage pipe, a connecting pipe and a one-way valve; the inner space of the water storage pipe is used for containing water, the water storage pipe is arranged along the vertical direction, the top end of the water storage pipe is communicated with the outer space, the bottom end of the water storage pipe is communicated with the inner cavity of the water bath kettle 1 through the connecting pipe, and the inner cavity of the water bath kettle 1 is communicated with the outer space; the pipe of the connecting pipe is connected with the one-way valve, so that water in the water storage pipe can flow to the inner cavity of the water bath 1. Through the principle of linker, the liquid level height of the water in the water bath 1 all the time with liquid level height in the water storage pipe is the same, and because the effect of check valve makes water in the water storage pipe can flow to in the water bath 1, and water in the water bath 1 can not flow to the standpipe, consequently, works as water in the water bath 1 is by when thermocouple 3 heats and evaporates, water in the water bath 1 reduces, the standpipe can be right water supply is carried out to the water bath 1 to make the deposit reaction can continuously go on, in addition, because the moisturizing volume at every turn is very little, consequently can not be right the temperature of water in the water bath 1 causes too big influence, and then can guarantee the effect of coating film. Further, the chemical water bath deposition device further comprises an alarm component and a liquid level switch; the alarm assembly is mounted on the outer wall of the water bath 1; the liquid level switch is arranged in an inner cavity of the water bath pot 1 and is arranged along the height direction of the water bath pot 1; the liquid level switch is in signal connection with the alarm component and is used for detecting a liquid level value in the water bath 1 and sending the liquid level value to the alarm component; the alert component is to: storing a preset lowest level value, comparing the level value with the lowest level value, and giving an alarm when the level value is not more than the lowest level value. Preferably, the lowest level value is set according to a level value of the electroless plating solution in the chemical bath 2, and the lowest level value is not less than the level value of the electroless plating solution. When the liquid level value in the water bath 1 is lower than the lowest liquid level value, the alarm component gives an alarm sound to prompt an operator to timely replenish water to the water storage pipe and the water bath 1 so as to ensure a good film coating effect.
The invention provides a using method of a chemical water bath deposition device.
The chemical water bath deposition device is applied to the chemical water bath deposition device; the chemical water bath deposition device further comprises a sealing cover 7 and a driving assembly 8, wherein the sealing cover 7 is detachably connected to the top surface of the chemical tank 2, the driving assembly 8 is connected to the sealing cover 7, and the driving assembly 8 is used for driving the substrate 4 to rotate in the inner cavity of the chemical tank 2; the chemical water bath deposition device also comprises a water storage pipe, a connecting pipe and a one-way valve; the water storage pipe is arranged along the vertical direction, the top end of the water storage pipe is communicated with the external space, the bottom end of the water storage pipe is communicated with the internal cavity of the water bath kettle 1 through the connecting pipe, and the internal cavity of the water bath kettle 1 is communicated with the external space of the water bath kettle 1; the one-way valve is connected in the pipe of the connecting pipe so that water in the water storage pipe can flow to the inner cavity of the water bath kettle 1;
the use method of the chemical water bath deposition device comprises the following steps:
step S1: water is injected from the top end of the water storage pipe so that the water flows into the water bath 1 through the connecting pipe and the one-way valve, so that the liquid level value in the water bath 1 is greater than the lowest liquid level value.
Step S2: the water in the water bath kettle 1 is heated, meanwhile, the temperature of the water in the water bath kettle 1 is measured through the thermocouple 3, and when the temperature of the water in the water bath kettle 1 meets the experiment or production requirements, the water in the water bath kettle 1 is insulated, so that a good film coating effect is ensured.
And step S3: the sealing cover 7 of the top surface of the chemical tank 2 is removed.
And step S4: the substrate 4 is mounted to the U-shaped connector 6.
Step S5: and injecting the chemical plating solution into the chemical tank 2 so that the liquid level of the chemical plating solution in the chemical tank 2 exceeds the height of the substrate 4.
Step S6: the sealing cover 7 is mounted on the top surface of the chemical bath 2.
Step S7: and starting the driving assembly 8, wherein the driving assembly 8 comprises a driving motor 801, the driving motor 801 is a speed regulating motor, and the rotating speed of the speed regulating motor is regulated so that the substrate 4 can rotate at different rotating speeds in the inner cavity of the chemical tank 2.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. The chemical water bath deposition device is characterized by comprising a water bath kettle (1) and a chemical tank (2);
the chemical tank (2) is mounted in the inner cavity of the water bath pot (1), the inner cavity of the water bath pot (1) is also used for containing water, and the inner cavity of the chemical tank (2) is used for containing chemical plating solution and a substrate (4);
the top surface of the chemical tank (2) is open, the bottom surface of the chemical tank (2) is closed, and the bottom surface of the chemical tank (2) is raised upwards to form a boss, so that the bottom of the chemical tank (2) forms a groove;
the groove can be communicated with an inner cavity of the water bath kettle (1), and the outer side surface of the chemical tank (2) and the groove wall of the groove can be contacted with water in the water bath kettle (1); wherein,
the chemical water bath deposition device also comprises at least one U-shaped connecting piece (6);
the U-shaped connecting piece (6) comprises a rod part, two ends of the rod part are respectively bent and extended to form bent parts, and an opening is formed between the two bent parts of the U-shaped connecting piece (6);
the chemical tank (2) is a cylindrical chemical tank, the top surface of the cylindrical chemical tank is provided with an opening, and the boss is a cylindrical boss;
the U-shaped connecting piece (6) is arranged in an inner cavity of the cylindrical chemical tank, the opening of the U-shaped connecting piece (6) faces the cylindrical boss, and the two bent parts of the U-shaped connecting piece (6) are arranged on the outer side of the cylindrical boss;
the two bent parts of the U-shaped connecting piece (6) are respectively connected with the substrate (4);
the substrate (4) is arranged along the vertical direction, and the substrate (4) is fixed on the U-shaped connecting piece (6) through a high-temperature-resistant double-faced adhesive tape.
2. The chemical water bath deposition apparatus according to claim 1, further comprising a pair of arc-shaped supports (5);
the pair of arc-shaped supports (5) are arranged on the inner bottom surface of the water bath pot (1), and the pair of arc-shaped supports (5) are arranged oppositely; the chemical tank (2) is erected on the arc-shaped support (5).
3. The chemical water bath deposition device according to claim 1, further comprising a sealing cover (7) and a driving assembly (8);
the middle part of the rod part is rotatably connected to the top of the cylindrical boss;
the top surface of the cylindrical chemical tank is detachably connected with the sealing cover (7);
the sealing cover (7) is connected with the driving assembly (8) on the side away from the cylindrical chemical tank, the driving assembly (8) is connected with the U-shaped connecting piece (6) to drive the U-shaped connecting piece (6) to rotate, and then the substrate (4) is driven to rotate around the central axis of the cylindrical boss.
4. The chemical bath deposition apparatus according to claim 3, wherein the driving assembly (8) comprises a driving motor (801) and a rotating rod (802);
driving motor (801) connect in deviating from of sealed lid (7) the one side of cylindrical chemical tank, driving motor (801) the output shaft with the one end of dwang (802) is connected, dwang (802) other end is followed sealed lid (7) stretches into the internal cavity of cylindrical chemical tank and with U-shaped connecting piece (6) are connected, in order to drive U-shaped connecting piece (6) rotate.
5. The chemical water bath deposition apparatus according to claim 4, wherein the driving motor (801) is a speed-adjustable motor.
6. The chemical water bath deposition device according to any one of claims 1 to 5, further comprising a water storage pipe, a connecting pipe and a one-way valve;
the water storage pipe is arranged in the vertical direction, the top end of the water storage pipe is communicated with the external space, the bottom end of the water storage pipe is communicated with the internal cavity of the water bath kettle (1) through the connecting pipe, and the internal cavity of the water bath kettle (1) is communicated with the external space;
the one-way valve is connected in the pipe of the connecting pipe so that water in the water storage pipe can flow to the inner cavity of the water bath kettle (1).
7. The chemical water bath deposition apparatus according to any one of claims 1 to 5, further comprising an alarm assembly and a level switch;
the alarm assembly is mounted on the outer wall of the water bath (1);
the liquid level switch is arranged in an inner cavity of the water bath (1) and is arranged along the height direction of the water bath (1);
the liquid level switch is in signal connection with the alarm component and is used for detecting a liquid level value in the water bath (1) and sending the liquid level value to the alarm component;
the alert component is to: storing a preset lowest level value, comparing the level value with the lowest level value, and giving an alarm when the level value is not more than the lowest level value.
8. The use method of the chemical water bath deposition device is characterized by being applied to the chemical water bath deposition device according to any one of claims 1 to 7; the chemical water bath deposition device further comprises a U-shaped connecting piece (6), a sealing cover (7) and a driving assembly (8), wherein the U-shaped connecting piece (6) is arranged in the inner cavity of the chemical tank (2), the U-shaped connecting piece (6) is connected with the substrate (4), the sealing cover (7) is detachably connected to the top surface of the chemical tank (2), the driving assembly (8) is connected with the sealing cover (7), and the driving assembly (8) is used for driving the U-shaped connecting piece (6) and the substrate (4) to rotate in the inner cavity of the chemical tank (2); the chemical water bath deposition device also comprises a water storage pipe, a connecting pipe and a one-way valve; the water storage pipe is arranged in the vertical direction, the top end of the water storage pipe is communicated with the external space, the bottom end of the water storage pipe is communicated with the internal cavity of the water bath kettle (1) through the connecting pipe, and the internal cavity of the water bath kettle (1) is communicated with the external space of the water bath kettle (1); the one-way valve is connected in the pipe of the connecting pipe so that water in the water storage pipe can flow to the inner cavity of the water bath kettle (1); the U-shaped connecting piece (6) comprises a rod part, two ends of the rod part are respectively bent and extended to form bent parts, and an opening is formed between the two bent parts of the U-shaped connecting piece (6); the U-shaped connecting piece (6) is arranged in an inner cavity of the cylindrical chemical tank, the opening of the U-shaped connecting piece (6) faces the cylindrical boss, and the two bent parts of the U-shaped connecting piece (6) are arranged on the outer side of the cylindrical boss; the two bent parts of the U-shaped connecting piece (6) are respectively connected with the substrate (4); the substrate (4) is arranged along the vertical direction, and the substrate (4) is fixed on the U-shaped connecting piece (6) through a high-temperature-resistant double-faced adhesive tape;
the use method of the chemical water bath deposition device comprises the following steps:
injecting water from the top end of the water storage pipe so that the water flows into the water bath (1) through the connecting pipe and the one-way valve;
heating the water in the water bath (1);
detaching the sealing cover (7) on the top surface of the chemical tank (2);
mounting the substrate (4) to the U-shaped connector (6);
injecting chemical plating solution into the chemical tank (2);
mounting the sealing cover (7) on the top surface of the chemical tank (2);
activating the drive assembly (8) to rotate the substrate (4) within the internal cavity of the chemical bath (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110491129.7A CN113186521B (en) | 2021-05-06 | 2021-05-06 | Chemical water bath deposition device and using method thereof |
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| CN202110491129.7A CN113186521B (en) | 2021-05-06 | 2021-05-06 | Chemical water bath deposition device and using method thereof |
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| CN113186521A CN113186521A (en) | 2021-07-30 |
| CN113186521B true CN113186521B (en) | 2023-02-03 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CH100437A (en) * | 1921-03-18 | 1923-07-16 | Lehmann Franz | Baking apparatus. |
| CN102383117B (en) * | 2011-11-23 | 2014-05-14 | 核工业理化工程研究院 | Dynamic chemical nickel-plating method and dynamic chemical nickel-plating device |
| CN204908916U (en) * | 2015-08-26 | 2015-12-30 | 福建日春实业有限公司 | Heat dissipation teacup and possess covered bowl of this teacup |
| CN208032621U (en) * | 2018-02-07 | 2018-11-02 | 青海蓝博检测科技有限公司 | A kind of constant-temperature hot water bath structure |
| CN108588688B (en) * | 2018-04-23 | 2020-04-07 | 大连交通大学 | Magnetic abrasive chemical composite plating device |
| CN110885974A (en) * | 2018-09-07 | 2020-03-17 | 北京铂阳顶荣光伏科技有限公司 | Chemical water bath deposition device |
| CN210787410U (en) * | 2019-08-15 | 2020-06-19 | 西安新长安再生医学科技研发有限公司 | Magnetic stirring water bath with fixed function |
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