CN113178317A - Magnetic-lead invagination type mutual inductor glue sealing process - Google Patents
Magnetic-lead invagination type mutual inductor glue sealing process Download PDFInfo
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- CN113178317A CN113178317A CN202110408227.XA CN202110408227A CN113178317A CN 113178317 A CN113178317 A CN 113178317A CN 202110408227 A CN202110408227 A CN 202110408227A CN 113178317 A CN113178317 A CN 113178317A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/005—Impregnating or encapsulating
Abstract
The invention discloses a magnetic-guiding invagination type mutual inductor glue sealing process, belonging to the field of mutual inductors, which is characterized in that a layer of sinking magnetic balls is laid on an epoxy resin outer layer, then the sinking magnetic balls can be effectively guided to sink inwards through a magnetic plate, so that longitudinal stirring in the epoxy resin outer layer is realized, thereby effectively accelerating the overflow of bubbles in the epoxy resin outer layer, obviously reducing the amount of gaps of a glue sealing layer and effectively avoiding the generation of cracks in use, on the other hand, when cracks are generated in the epoxy resin outer layer after casting or after a period of use, because iron powder absorbs heat and conducts heat faster than epoxy resin, the time difference of melting or softening between the glue sealing layer and the sinking magnetic balls is increased, so that crystal glue in the sinking magnetic balls overflows when the glue sealing layer is not melted and seeps into the cracks, the repair of the internal cracks is realized, and the repair difficulty is effectively reduced, and meanwhile, the utilization rate of the mutual inductor is effectively improved.
Description
Technical Field
The invention relates to the field of mutual inductors, in particular to a magnetic-attraction invagination type mutual inductor glue sealing process.
Background
In order to transmit electric energy, an electric power system usually adopts an alternating voltage and large current loop to transmit the electric power to a user, and cannot use an instrument to directly measure the electric power. The mutual inductor has the functions of reducing alternating voltage and large current to values which can be directly measured by the instrument in proportion, facilitating the direct measurement of the instrument and simultaneously providing power for relay protection and automatic devices. The mutual inductor for power system is a special transformer for transmitting the information of high voltage and large current of power network to the metering and measuring instrument and relay protection of low voltage and small current secondary side and automatic equipment. The mutual inductor is matched with the measuring instrument and the metering device, and can measure the voltage, the current and the electric energy of a primary system; and the device can be matched with a relay protection device and an automatic device to form electric protection and automatic control on various faults of a power grid. The performance of the mutual inductor directly influences the accuracy of measurement and metering of the power system and the reliability of the action of the relay protection device.
The winding of current mutual-inductor generally uses epoxy and shell embedment, but when gluing and sealing, the inside bubble that exists easily of epoxy, leads to having certain space in the gluey seal after the shaping, leads to inside easy cracking when using, leads to the mutual-inductor to have the potential safety hazard of discharge phenomenon to when gluing the inside crack that produces in seal, it is great to repair the degree of difficulty, leads to the life and the utilization ratio reduction of mutual-inductor.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a magnetic-induction invagination type mutual inductor glue sealing process, which comprises the steps of laying a layer of sunken magnetic balls on an epoxy resin outer layer, then effectively guiding the sunken magnetic balls to sink through a magnetic plate, realizing longitudinal stirring in the epoxy resin outer layer, thereby effectively accelerating the overflow of air bubbles in the epoxy resin outer layer, obviously reducing the amount of gaps of a glue sealing layer, and effectively avoiding the generation of cracks in use, and on the other hand, when cracks are generated in the epoxy resin outer layer after casting or after a period of use, because iron powder absorbs heat and conducts heat faster than epoxy resin, the time difference of melting or softening between the glue sealing layer and the sunken magnetic balls is increased, so that crystal glue in the sunken magnetic balls overflows when the glue sealing layer is not melted and permeates into the cracks, the repair of the internal cracks is realized, and the repair difficulty is effectively reduced, and meanwhile, the utilization rate of the mutual inductor is effectively improved.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A magnetic-lead invagination type mutual inductor glue sealing process comprises the following steps:
s1, firstly, pouring a thin epoxy resin inner layer at the joint of the upper end surface of the bottom plate, the shell and the winding, and cooling and forming;
s2, firstly, preprocessing the ABS resin balls to obtain sinking magnetic balls, then, pouring an epoxy resin outer layer on the epoxy resin inner layer again, and then, uniformly spreading the sinking magnetic balls on the epoxy resin outer layer;
s3, continuously reciprocating the magnetic plate in the transverse direction under the bottom plate to guide the sinking magnetic balls to sink from the upper surface of the epoxy resin outer layer, so as to realize longitudinal stirring of the epoxy resin outer layer and overflow bubbles in the epoxy resin outer layer;
and S4, standing, cooling and solidifying to finish glue sealing, and obtaining the low-gap epoxy resin glue sealing layer transformer.
Furthermore, the bottom plate is heated while the sinking magnetic balls are spread in the step S2, the heating temperature is not lower than 70 ℃, after the epoxy resin outer layer is poured, a certain temperature can be maintained, and the curing speed of the epoxy resin outer layer is effectively reduced, so that the sinking magnetic balls can smoothly move in the epoxy resin outer layer when being guided by the magnetic plate in the step S3, and the overflowing effect of bubbles in the sinking magnetic balls is better.
Furthermore, the distance between the magnetic plate and the bottom plate is not more than 10cm, the distance is too far, the magnetic adsorption force between the magnetic plate and the sinking magnetic ball is small, the guiding effect on the sinking magnetic ball is poor, the sinking range of the sinking magnetic ball is small, the effect of removing bubbles in the epoxy resin outer layer is poor, the distance is too close, the sinking magnetic ball sinks too fast, the time for the sinking magnetic ball to pass through the epoxy resin outer layer is too short, and the internal bubbles are not ready to overflow.
Further, the preprocessing step of the ABS resin ball in step S2 specifically includes:
s21, heating the ABS resin balls until the surfaces of the ABS resin balls are softened, and then stopping heating;
s22, the ABS resin ball with softened surface is put into nano-level iron powder, and is vibrated and stirred, so that a layer of nano-level iron powder layer is adhered on the surface of the ABS resin ball, and a sinking magnetic ball is obtained after cooling, the arrangement of the iron powder layer can lead the ABS resin ball to be adsorbed with a magnetic plate on one hand, so that the magnetic plate can lead the ABS resin ball to move in an epoxy resin outer layer conveniently, on the other hand, the iron powder absorbs heat and conducts heat faster than the epoxy resin, after casting, or after a period of time in which cracks are generated in the epoxy resin outer layer, the base plate may be heated, under the same heating temperature, the surface temperature of the sinking magnetic ball is higher, and simultaneously, the melting point of the ABS resin ball is lower than that of the epoxy resin, so that the ABS resin ball is melted more quickly than the outer layer of the epoxy resin, the crystal glue in the ABS resin ball overflows, therefore, the steel wire penetrates into the cracks, the repair is realized, the repair difficulty is effectively reduced, and the utilization rate of the mutual inductor is effectively improved.
Further, sink the magnetism ball before spreading the outer surface of epoxy, place it on elasticity pocket cloth earlier, vibrate, detach the not firm iron powder of its surface adhesion, effectively avoid sinking the magnetism ball when epoxy is outer to be removed, glue glutinous insecure iron powder and sink the magnetism ball and break away from, disperse in the epoxy outer layer, lead to the outer holistic transparency of epoxy, lead to the staff to be difficult to observe inside space or the cracked condition.
Further, the heating temperature in step S21 is not lower than 80 ℃, and after the heating is stopped, the temperature is maintained before the iron powder is added, so that the surface of the ABS resin balls is maintained in a softened state, and the ABS resin balls are not easily cured before contacting the iron powder, thereby effectively ensuring the formation of the iron powder layer.
Furthermore, a self-repairing cavity is formed in the center of the interior of the ABS resin ball, a lining liquid outlet ball is inlaid in the inner wall of the self-repairing cavity, and crystal glue is filled in the lining liquid outlet ball.
Furthermore, the liner liquid outlet ball is of a hard porous structure, and serves as a liner, so that the overall strength of the sinking magnetic ball can be effectively guaranteed, the sinking magnetic ball is not prone to large-area collapse after being heated or the internal crystal glue overflows, the melting point of the liner liquid outlet ball is higher than that of epoxy resin, the shape of the liner liquid outlet ball is not prone to being influenced when the sinking magnetic ball is heated, and the overall shape of the sinking magnetic ball is further effectively guaranteed.
Furthermore, the diameter of the self-repairing cavity is 1/3-1/2 of the diameter of the ABS resin ball, the diameter of the self-repairing cavity is too large, the wall thickness of the ABS resin ball is easily too small, the self-repairing cavity is easily broken during pretreatment, the crystal glue in the self-repairing cavity overflows, the wall thickness of the ABS resin ball is too large, when the gap or the crack in the epoxy resin outer layer needs to be repaired, the ABS resin ball is difficult to soften or melt in time, the time difference of melting between the ABS resin ball and the epoxy resin outer layer is shortened, and the strength of the epoxy resin outer layer is influenced.
Furthermore, the thickness of the epoxy resin outer layer is 2-3 times of that of the epoxy resin inner layer, the epoxy resin inner layer is used for intercepting the sunken magnetic ball, so that the sunken magnetic ball is not easy to sink to the bottom plate, the sunken magnetic ball is effectively prevented from directly sinking to contact with the bottom plate, and therefore the connection strength between the sunken magnetic ball and the glue sealing layer and the bottom plate is effectively avoided.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) this scheme is through laying the one deck magnetic ball that sinks on the epoxy is outer, then can effectively guide the magnetic ball that sinks to sink through the magnetic sheet, realize longitudinal stirring in the epoxy outer, thereby effectively accelerate overflowing of the outer inside bubble of epoxy, show the volume that reduces and glue the seal space, the fissured production when effectively avoiding using, on the other hand, after pouring or after using a period, when producing the crack in the epoxy outer, because the iron powder is compared in epoxy heat absorption heat conduction faster, increase glue the seal and sink the melting between the magnetic ball or the time difference that softens, make the interior quartzy glue of magnetic ball that sinks spill over when gluing the seal and not melting, and infiltrate in the crack, realize the restoration of inside crack, effectively reduce the degree of difficulty of repairing, effectively improve the rate of utilization of mutual-inductor simultaneously.
(2) And S2, heating the bottom plate at a temperature not lower than 70 ℃ while spreading the sinking magnetic balls, maintaining a certain temperature after the epoxy resin outer layer is poured, and effectively reducing the curing speed of the epoxy resin outer layer, so that the sinking magnetic balls can smoothly move in the epoxy resin outer layer when guided by the magnetic plate in the S3, and the overflowing effect of bubbles inside the sinking magnetic balls is better.
(3) The distance between the magnetic plate and the lower portion of the bottom plate is not more than 10cm, the distance is too far, the magnetic adsorption force between the magnetic plate and the sinking magnetic ball is small, the guiding effect on the sinking magnetic ball is poor, the sinking range of the sinking magnetic ball is small, the effect on removing bubbles in the epoxy resin outer layer is poor, the distance is too close, the sinking of the sinking magnetic ball is too fast, the time for the sinking magnetic ball to pass through the epoxy resin outer layer is too short, and the internal bubbles are not in time to overflow.
(4) The ABS resin ball with softened surface is put into nano-level iron powder, and is vibrated and stirred, so that a layer of nano-level iron powder layer is adhered to the surface of the ABS resin ball, and a sinking magnetic ball is obtained after cooling, the arrangement of the iron powder layer can enable the ABS resin ball and the magnetic plate to generate adsorption on one hand, so that the magnetic plate can guide the magnetic plate to move in the outer layer of the epoxy resin, and on the other hand, the heat absorption and the heat conduction of the iron powder are faster compared with the heat conduction of the epoxy resin, after casting, or after a period of time in which cracks are generated in the epoxy resin outer layer, the base plate may be heated, under the same heating temperature, the surface temperature of the sinking magnetic ball is higher, and simultaneously, the melting point of the ABS resin ball is lower than that of the epoxy resin, so that the ABS resin ball is melted more quickly than the outer layer of the epoxy resin, the crystal glue in the ABS resin ball overflows, therefore, the steel wire penetrates into the cracks, the repair is realized, the repair difficulty is effectively reduced, and the utilization rate of the mutual inductor is effectively improved.
(5) Sinking the magnetic ball and before spreading the epoxy outer layer surface, placing it on elasticity pocket cloth earlier, vibrate, detach the not firm iron powder of its surface adhesion, effectively avoid sinking the magnetic ball when epoxy outer removes, glue glutinous insecure iron powder and sink the magnetic ball and break away from, the dispersion leads to the outer holistic transparency of epoxy in the epoxy outer layer, leads to the staff to be difficult to observe inside space or cracked condition.
(6) In the step S21, the heating temperature is not lower than 80 ℃, and after the heating is stopped, the temperature is maintained before the iron powder is added, so that the surface of the ABS resin sphere is maintained in a softened state, and the ABS resin sphere is not easily cured before contacting the iron powder, thereby effectively ensuring the formation of the iron powder layer.
(7) A self-repairing cavity is cut in the center of the ABS resin ball, a lining liquid outlet ball is embedded in the inner wall of the self-repairing cavity, and crystal glue is filled in the lining liquid outlet ball.
(8) The liner goes out the liquid ball and is stereoplasm porous structure, and the inside lining goes out the liquid ball as the inside lining, can effectively guarantee to sink the holistic intensity of magnetic ball, makes it be heated or inside crystal glue spill over the back, and the difficult large tracts of land that takes place the shape collapses, and the inside lining goes out the liquid ball melting point and is higher than epoxy melting point, makes when the heating, is difficult for influencing the shape that the liner goes out the liquid ball, and then effectively guarantees to sink the holistic shape of magnetic ball.
(9) The diameter of the self-compensating cavity is 1/3-1/2 of the diameter of the ABS resin ball, the diameter of the self-compensating cavity is too large, the wall thickness of the ABS resin ball is too small, the self-compensating cavity is easy to crack during pretreatment, the internal crystal glue overflows, the wall thickness of the ABS resin ball is too large due to the too small diameter of the self-compensating cavity, when the gap or crack in the epoxy resin outer layer needs to be repaired, the ABS resin ball is difficult to soften or melt in time, the time difference of melting between the ABS resin ball and the epoxy resin outer layer is shortened, and the strength of the epoxy resin outer layer is influenced.
(10) The thickness of the epoxy resin outer layer is 2-3 times of that of the epoxy resin inner layer, the epoxy resin inner layer is used for intercepting the sunken magnetic ball sinking inwards, so that the sunken magnetic ball is not easy to sink to the bottom plate, the sunken magnetic ball is effectively prevented from directly sinking to be in contact with the bottom plate, and therefore the connection strength between the sunken magnetic ball and the glue sealing layer and the bottom plate is effectively avoided.
Drawings
FIG. 1 is a schematic diagram of the main flow structure of the present invention;
FIG. 2 is a schematic structural diagram of the pretreatment process of ABS resin balls according to the present invention;
FIG. 3 is a schematic structural diagram of a sinking magnetic ball of the present invention;
FIG. 4 is a schematic view of the present invention showing a sunken magnetic ball fracture repairing a crack in an epoxy outer layer;
fig. 5 is a schematic structural diagram of the mutual inductor after being sealed by glue.
The reference numbers in the figures illustrate:
1 epoxy resin inner layer, 2 epoxy resin outer layers, 3 sinking magnetic balls, 31ABS resin balls, 32 iron powder layers and 4 lining liquid balls.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1, in the figure, a represents a bottom plate, b represents a winding, and c represents an overflowing bubble, a magnetic-guiding invagination type mutual inductor glue sealing process includes the following steps:
s1, firstly, pouring a layer of thin epoxy resin inner layer 1 at the joint of the upper end face of the bottom plate, the shell and the winding, and cooling and forming;
s2, firstly, preprocessing the ABS resin balls 31 to obtain sinking magnetic balls 3, then, pouring the epoxy resin outer layer 2 on the epoxy resin inner layer 1 again, and then, uniformly spreading the sinking magnetic balls 3 on the epoxy resin outer layer 2;
s3, continuously reciprocating the magnetic plate in the transverse direction under the bottom plate to guide the sinking magnetic balls 3 to sink from the upper surface of the epoxy resin outer layer 2, so as to realize longitudinal stirring of the epoxy resin outer layer 2 and overflow bubbles in the epoxy resin outer layer;
and S4, referring to the figure 5, standing, cooling and solidifying to finish glue sealing, thus obtaining the low-gap epoxy resin glue sealing layer transformer.
The sinking magnetic balls 3 are spread and sprayed in the step S2, the bottom plate is heated at the same time, the heating temperature is not lower than 70 ℃, after the epoxy resin outer layer 2 is poured, a certain temperature can be maintained, the curing speed of the epoxy resin outer layer 2 is effectively reduced, so that the sinking magnetic balls 3 can move smoothly in the epoxy resin outer layer 2 when being guided by the magnetic plate in the step S3, the overflowing effect of bubbles in the sinking magnetic balls 3 is better, the distance between the magnetic plate and the bottom plate is not more than 10cm, the distance between the magnetic plate and the sinking magnetic balls 3 is too far, the magnetic adsorption force between the magnetic plate and the sinking magnetic balls 3 is smaller, the guiding effect on the sinking magnetic balls 3 is poorer, the sinking range of the sinking magnetic balls 3 is smaller, the effect of removing the bubbles in the epoxy resin outer layer 2 is poorer, the distance is too close, the sinking magnetic balls 3 sink too fast, and the time for the sinking magnetic balls 3 to pass through the epoxy resin outer layer 2 is too short, resulting in internal bubbles that have less time to escape.
Referring to fig. 2, the preprocessing step of the ABS resin balls 31 in step S2 specifically includes:
s21, heating the ABS resin balls 31 until the surfaces of the ABS resin balls are softened, and then stopping heating;
s22, the ABS resin ball with softened surface is put into nano-level iron powder, and is vibrated and stirred, so that a layer of nano-level iron powder layer 32 is adhered to the surface of the ABS resin ball, and a sinking magnetic ball 3 is obtained after cooling, and the arrangement of the iron powder layer 32 can make the magnetic ball and the magnetic plate generate adsorption on one hand, so that the magnetic plate can guide the magnetic plate to move in the epoxy resin outer layer 2, please refer to figure 4, on the other hand, the iron powder has faster heat absorption and heat conduction compared with the epoxy resin, and can heat the bottom plate after casting or after cracks are generated in the epoxy resin outer layer 2 for a period of time, the surface temperature of the sinking magnetic ball 3 is higher at the same heating temperature, and simultaneously the melting point of the ABS resin ball 31 is lower than that of the epoxy resin, so that the ABS resin ball 31 is melted faster than that of the epoxy resin outer layer 2, and crystal glue in the ABS resin ball 31 overflows, thereby infiltrating into the cracks, realizing repair and effectively reducing repair difficulty, and meanwhile, the utilization rate of the mutual inductor is effectively improved.
Before being spread on the surface of the epoxy resin outer layer 2, the sinking magnetic balls 3 are firstly placed on the elastic pocket cloth, the vibration is carried out, the iron powder with weak surface adhesion is removed, when the sinking magnetic balls 3 are effectively prevented from moving in the epoxy resin outer layer 2, the iron powder with weak adhesion is separated from the sinking magnetic balls 3 and is dispersed in the epoxy resin outer layer 2, the integral transparency of the epoxy resin outer layer 2 is caused, the condition that workers are difficult to observe the inner gaps or cracks is caused, the heating temperature is not lower than 80 ℃ in the step S21, after the heating is stopped, the temperature is maintained before the iron powder is put into the heating chamber, the surface of the ABS resin balls 31 is maintained in a softened state, the ABS resin balls 31 are not easy to cure before contacting the iron powder, and the formation of the iron powder layer 32 is effectively guaranteed.
Referring to fig. 3, a self-filling cavity is cut in the center of the inside of the ABS resin ball 31, a lining liquid-out ball 4 is embedded in the inner wall of the self-filling cavity, the lining liquid-out ball 4 is filled with crystal glue, the lining liquid-out ball 4 is a hard porous structure, and the lining liquid-out ball 4 serves as a lining, so that the strength of the whole sinking magnetic ball 3 can be effectively ensured, the sinking magnetic ball is not prone to large area collapse after being heated or the crystal glue inside overflows, and the melting point of the lining liquid-out ball 4 is higher than that of epoxy resin, so that the shape of the lining liquid-out ball 4 is not prone to being affected during heating, and further the shape of the whole sinking magnetic ball 3 is effectively ensured, the diameter of the self-filling cavity is 1/3-1/2 of the diameter of the ABS resin ball 31, the diameter of the self-filling cavity is too large, the wall thickness of the ABS resin ball 31 is easily too small, the lining liquid-out ball is, lead to ABS resin ball 31 wall thickness too big, when need repair the space or the crack in epoxy outer 2, ABS resin ball 31 is difficult to in time soften or melt, the melting time difference between ABS resin ball 31 and the epoxy outer 2 has been shortened, influence the intensity of epoxy outer 2, the thickness of epoxy outer 2 is 2-3 times of epoxy inner 1 thickness, epoxy inner 1 is used for intercepting sunken magnetic ball 3 that sinks in, make it be difficult for sinking to bottom plate department, effectively avoid sinking magnetic ball 3 directly to contact with the bottom plate, thereby effectively avoid sinking the magnetic ball 3 and glue the joint strength between seal and the bottom plate.
Through laying one deck magnetic ball 3 that sinks on epoxy outer 2, then can effectively guide through the magnetic sheet that sinks that magnetic ball 3 sinks, realize the vertical stirring in epoxy outer 2, thereby effectively accelerate the spilling over of the inside bubble of epoxy outer 2, show the volume that reduces and glue the seal space, the production of fracture when effectively avoiding using, on the other hand, after pouring or after using a period, when producing the fracture in epoxy outer 2, because the iron powder is compared in epoxy heat absorption heat conduction faster, increase and glue the seal and sink the time difference of melting or softening between the magnetic ball 3, make the interior crystal glue of magnetic ball 3 that sinks spill over when gluing the seal and not melting, and infiltrate in the fracture, realize the restoration of inside fracture, effectively reduce the repair degree of difficulty, effectively improve the rate of utilization of mutual-inductor simultaneously.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (10)
1. A magnetic-lead invagination type mutual inductor glue sealing process is characterized in that: the method comprises the following steps:
s1, firstly, pouring a thin epoxy resin inner layer (1) at the joint of the upper end face of the bottom plate, the shell and the winding, and cooling and forming;
s2, firstly, preprocessing the ABS resin balls (31) to obtain sinking magnetic balls (3), then, pouring the epoxy resin outer layer (2) on the epoxy resin inner layer (1) again, and then, uniformly spreading the sinking magnetic balls (3) on the epoxy resin outer layer (2);
s3, continuously reciprocating the magnetic plate in the transverse direction under the bottom plate to guide the sinking magnetic balls (3) to sink from the upper surface of the epoxy resin outer layer (2) so as to realize longitudinal stirring of the epoxy resin outer layer (2) and overflow of bubbles in the epoxy resin outer layer;
and S4, standing, cooling and solidifying to finish the glue sealing.
2. The magnetic-lead invaginated mutual inductor glue sealing process according to claim 1, characterized in that: and in the step S2, the bottom plate is heated while the sinking magnetic balls (3) are spread, and the heating temperature is not lower than 70 ℃.
3. The magnetic-lead invaginated mutual inductor glue sealing process according to claim 2, characterized in that: the distance between the magnetic plate and the lower part of the bottom plate is not more than 10 cm.
4. The magnetic-lead invaginated mutual inductor glue sealing process according to claim 1, characterized in that: the pretreatment step of the ABS resin ball (31) in the step S2 is specifically as follows:
s21, heating the ABS resin balls (31) until the surfaces of the ABS resin balls are softened, and then stopping heating;
and S22, putting the ABS resin balls with softened surfaces into nano-scale iron powder, vibrating and stirring to enable a layer of nano-scale iron powder layer (32) to be adhered to the surfaces of the ABS resin balls, and cooling to obtain the sinking magnetic balls (3).
5. The magnetic-lead invaginated mutual inductor glue sealing process according to claim 4, characterized in that: before the sinking magnetic balls (3) are spread on the surface of the epoxy resin outer layer (2), the sinking magnetic balls are firstly placed on the elastic pocket cloth and vibrated to remove the iron powder which is not firmly adhered on the surface of the sinking magnetic balls.
6. The magnetic-lead invaginated mutual inductor glue sealing process according to claim 4, characterized in that: in step S21, the heating temperature is not lower than 80 ℃, and after the heating is stopped, the temperature is maintained until the iron powder is charged, so that the surface of the ABS resin balls (31) is maintained in a softened state.
7. The magnetic-lead invaginated mutual inductor glue sealing process according to claim 4, characterized in that: the ABS resin ball (31) is characterized in that a self-complementary cavity is formed in the center of the interior of the ABS resin ball (31), a lining liquid outlet ball (4) is embedded in the inner wall of the self-complementary cavity, and crystal glue is filled in the lining liquid outlet ball (4).
8. The magnetic-lead invaginated mutual inductor glue sealing process according to claim 7, characterized in that: the lining liquid outlet ball (4) is of a hard porous structure, and the melting point of the lining liquid outlet ball (4) is higher than that of epoxy resin.
9. The magnetic-lead invaginated mutual inductor glue sealing process according to claim 7, characterized in that: the diameter of the self-compensation cavity is 1/3-1/2 of the diameter of the ABS resin ball (31).
10. The magnetic-lead invaginated mutual inductor glue sealing process according to claim 1, characterized in that: the thickness of the epoxy resin outer layer (2) is 2-3 times of that of the epoxy resin inner layer (1).
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| CN210110489U (en) * | 2019-09-09 | 2020-02-21 | 大连北方互感器集团有限公司 | Primary coil high-voltage shielding device of voltage transformer |
| CN112077528A (en) * | 2020-08-03 | 2020-12-15 | 王艳伟 | Self-repairing method for bent part of metal plate |
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2021
- 2021-04-16 CN CN202110408227.XA patent/CN113178317B/en active Active
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| JPH04115507A (en) * | 1990-09-05 | 1992-04-16 | Tokin Corp | Inductor |
| CN203350327U (en) * | 2013-07-26 | 2013-12-18 | 易能乾元（北京）电力科技有限公司 | Insulator core chamber sealing device and current sensor/transformer |
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