CN113163702A - Chip mounter - Google Patents
Chip mounter Download PDFInfo
- Publication number
- CN113163702A CN113163702A CN202110414080.5A CN202110414080A CN113163702A CN 113163702 A CN113163702 A CN 113163702A CN 202110414080 A CN202110414080 A CN 202110414080A CN 113163702 A CN113163702 A CN 113163702A
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- China
- Prior art keywords
- pick
- cleaning roller
- pickup
- image
- lens
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a chip mounter which comprises a base, a pickup device, an X-axis driving device, a Y-axis driving device and a vision calibration device, wherein the pickup device comprises a pickup base and a plurality of pickup heads arranged on the pickup base, the vision calibration device also comprises a cross laser and an image acquisition device, the cross laser is arranged on the pickup base, the image acquisition device is arranged on the base and positioned below the pickup device, and the image acquisition device sequentially acquires a laser cross image emitted by the cross laser and a workpiece image picked up by the pickup heads. According to the invention, the position of the pickup head is calibrated by adopting the laser cross image, and then the position deviation of the workpiece is calibrated by adopting the workpiece image, so that the movement precision of picking and placing components of the chip mounter is improved, the stability is good, the zero point adjustment efficiency of the components is higher, the processing and installation of the accessories are more efficient and convenient, and the equipment operation is more reliable.
Description
Technical Field
The invention relates to the technical field of chip mounters, in particular to a chip mounter.
Background
In the process of processing electronic components, resistance and capacitance electronic components need to be attached, which is a so-called surface mounting process. Depending on the nature of the product, the application is usually done manually or by machine. The efficiency of artifical laminating is lower, and the human cost who consumes is higher, has restricted components and parts manufacturer's shipment volume and the control of cost. The conventional chip mounter has high purchase cost and maintenance cost and high reject ratio of bonding. A plurality of material stations with fixed positions are designed in the movement range of a carrying mechanism of the existing chip mounter, when the same material is picked up, the chip mounter of the chip mounter is used for picking up the same position at each time, and then the materials are uploaded to an upper-view camera to be subjected to upward distribution and rectification and then are mounted.
For example, chinese utility model publication No. CN209546230U discloses an automatic chip mounter, including a worktable for placing a workpiece and a manipulator device disposed on the worktable, the manipulator device includes a pickup device and a mechanical arm for driving the pickup device to move, including an upper visual unit and a lower visual unit, the upper visual unit is used for determining the position of the workpiece, the pickup device picks up the workpiece according to the position information of the workpiece obtained by the upper visual unit, the lower visual unit collects the image of the workpiece picked up by the pickup device and calibrates the initial position information of the workpiece to the current position information of the workpiece according to the image of the workpiece, the pickup device continues to move according to the current position information of the workpiece to complete the transfer of the workpiece, the pickup device includes a pickup base and a plurality of pickup heads mounted on the pickup base, the pickup base is detachably connected to the end of the mechanical arm, and has a disadvantage that the chip mounter employs two sets of upper and lower visual units, the cost is high, and the upper vision unit is easy to deviate due to the shooting angle when judging the position of the workpiece.
Disclosure of Invention
The invention aims to provide a chip mounter, which improves the movement precision of picking and placing components of the chip mounter.
The above object of the present invention is achieved by the following technical solutions: the utility model provides a chip mounter, includes the base, sets up pick-up device, the X axle drive arrangement that drive pick-up device removed along X axle direction and the Y axle drive arrangement that drive pick-up device removed along Y axle direction above the base, pick-up device still includes vision calibrating device including picking up the seat and setting up a plurality of pick-up heads on picking up the seat, vision calibrating device includes cross laser instrument and image acquisition device, the cross laser instrument sets up on picking up the seat, image acquisition device sets up on the base and is located pick-up device's below, image acquisition device gathers the laser cross image of cross laser instrument transmission and the work piece image that pick up head and pick up in proper order.
Preferably, the cross laser and the plurality of pick-up heads are linearly distributed along an X-axis or a Y-axis.
Preferably, the image acquisition device comprises a shell, a lens arranged in the shell, a CCD sensor arranged below the lens, and light sources arranged around the lens.
Preferably, a cleaning roller is arranged above the lens, the cleaning roller is horizontally arranged, and two ends of the cleaning roller are movably arranged on the inner wall of the shell.
Preferably, the top of camera lens still sets up the protection casing, the protection casing is including being two cover bodies about, two cover body amalgamation becomes hemispherical protection casing, the cleaning roller sets up the below at the protection casing.
Preferably, the cover bodies are installed in the shell through rotating shafts, the first gears which are meshed with each other are arranged on the same sides of the two cover bodies, the two cover bodies are synchronously turned over through the two first gears, and a linkage mechanism for driving the cleaning roller to move horizontally is arranged between the cover bodies and the cleaning roller.
Preferably, the linkage mechanism comprises a rack and a second gear, the rack is arranged horizontally, the end of the cleaning roller is provided with a movable seat, the inner wall of the shell is provided with a horizontal sliding groove for installing the movable seat, the rack is fixed on the movable seat, and the second gear is arranged between the first gear and the rack and is respectively meshed with the first gear and the rack.
Preferably, the inner surface of the shield is provided with a light absorbing layer.
Preferably, the pick-up head is provided with a lining plate, and the lining plate is positioned above the picked-up workpiece.
The invention has the beneficial effects that: according to the invention, the position of the pickup head is calibrated by adopting the laser cross image, and then the position deviation of the workpiece is calibrated by adopting the workpiece image, so that the movement precision of picking and placing components of the chip mounter is improved, the stability is good, the zero point adjustment efficiency of the components is higher, the processing and installation of the accessories are more efficient and convenient, and the equipment operation is more reliable.
Drawings
FIG. 1 is a schematic structural view of embodiment 1 of the present invention;
FIG. 2 is a schematic structural diagram of an image capturing apparatus according to embodiment 1 of the present invention;
fig. 3 is a schematic structural view of the protection cover in the open state according to embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of an image capturing device in embodiment 2 of the present invention;
in the figure: 1-base, 2-pick-up device, 201-pick-up seat, 202-pick-up head, 203-lining plate, 3-X axis driving device, 4-Y axis driving device, 5-cross laser, 6-image acquisition device, 601-shell, 602-lens, 603-CCD sensor, 604-light source, 605-cover body, 606-first gear, 607-horizontal chute, 608-moving seat, 609-cleaning roller, 610-second gear, 611-rack, 612-movable inner shell and 613-cylinder.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Example 1: as shown in fig. 1, a chip mounter includes a base 1, a pick-up device 2, an X-axis driving device 3, a Y-axis driving device 4, and a vision calibration device, where the pick-up device 2 includes a pick-up base 201 and a plurality of pick-up heads 202 disposed on the pick-up base 201, the pick-up heads 202 employ negative pressure suction nozzles, and the number of the pick-up heads 202 is 3 to 4. The pickup device 2 is arranged above the base 1, the X-axis driving device 3 drives the pickup device 2 to move along the X-axis direction, and the Y-axis driving device 4 drives the pickup device 2 to move 4 along the Y-axis direction. In the present embodiment, as shown in fig. 1, the X-axis direction refers to the horizontal direction, and the Y-axis direction refers to the vertical direction of the screen. Wherein, the X-axis driving device 3 and the Y-axis driving device 4 both adopt a conventional ball screw mechanism or a belt transmission mechanism.
The vision calibration device comprises a cross laser 5 and an image acquisition device 6, wherein the cross laser 5 is arranged on the pickup seat 201 and used for emitting laser cross downwards. The cross laser 5 and the plurality of pick-up heads 202 are linearly distributed along the X-axis or Y-axis, and in this example only one distribution is shown, as shown in fig. 1, the cross laser 5 and the 3 pick-up heads 202 are linearly distributed along the X-axis, and the distance between the cross laser 5 and the first pick-up head 202 is a fixed distance.
The image acquisition device 6 is arranged on the base 1 and below the pickup device 2, and the image acquisition device 6 sequentially acquires a laser cross image emitted by the cross laser 5 and a workpiece image picked up by the pickup head 202.
As shown in fig. 2 and 3, the image capturing device 6 includes a housing 601, a lens 602 disposed in the housing 601, a CCD sensor 603 disposed below the lens 602, and a light source 604 disposed around the lens 602, wherein the light source 604 irradiates a workpiece picked up by the pickup head 202 with a conventional monochromatic light.
A cleaning roller 609 is arranged above the lens 602, the cleaning roller 609 is arranged horizontally, a moving seat 608 is arranged at the end of the cleaning roller 609, a horizontal sliding groove 607 for installing the moving seat 608 is arranged on the inner wall of the shell 601, and two ends of the cleaning roller 609 are movably arranged on the inner wall of the shell 601. The cleaning roller 609 is a brush roller or a lint roller and is driven to rotate by a micro motor.
The protective cover is arranged above the lens 602 and comprises a left cover body 605 and a right cover body 605, the two cover bodies 605 are spliced into a hemispherical protective cover, and the cleaning roller 609 is arranged below the protective cover. The shields 605 are installed in the housing 601 through a rotating shaft, the first gears 606 which are meshed with each other are arranged on the same sides of the two shields 605, the two shields 605 are turned over synchronously through the two first gears 606, and a linkage mechanism for driving the cleaning roller 609 to translate is arranged between the shields 605 and the cleaning roller 609.
The linkage mechanism comprises a rack 611 and a second gear 610, wherein the rack 611 is horizontally arranged, the rack 611 is fixed on the moving seat 608, and the second gear 610 is arranged between the first gear 606 and the rack 611 and is respectively meshed with the first gear 606 and the rack 611. Wherein the first gear 606, the second gear 610 and the rack 611 are all disposed at the inner wall of the housing 601, and the lens 602 is located at the middle position of the housing 601, thus not affecting the normal captured image of the lens 602.
As shown in fig. 2, when the shield is normally closed, the cleaning roller 609 is positioned at the upper left of the lens 602.
As shown in fig. 3, during the opening process of the protective cover, the first gear 606 drives the second gear 610 to rotate, the second gear 610 drives the rack 611 to translate rightward, so that the cleaning roller 609 moves rightward to the upper right of the lens 602, and during the moving process, the cleaning roller 609 rotates itself, so as to clean the surface of the lens 602.
The internal surface of protection casing is provided with the light-absorbing layer, and the light-absorbing layer adopts black extinction cotton, prevents that the light that light source 604 shines from reflecting and influencing the normal collection of camera lens 602 at the internal surface of protection casing, and reduces image acquisition quality.
The pick-up head 202 is provided with the horizontally arranged lining plate 203, the lining plate 203 is positioned above the picked-up workpiece, the lining plate 203 is a black plate, and when the image of the workpiece is collected, the light of the light source 604 irradiates on the workpiece and the lining plate 203, so that the outline of the workpiece relative to the lining plate 203 is more obvious, and the image collecting device 6 can clearly collect the outline of the workpiece.
Example 2: as shown in fig. 4, a movable inner housing 612 is mounted in the housing 601, an air cylinder 613 is mounted at the bottom of the movable inner housing 612, the air cylinder 613 pushes the movable inner housing 612 to move up and down, and the image capturing device 6 is mounted in the movable inner housing 612. The size of the image collected by the image collecting device 6 is adjusted by the up-and-down movement of the image collecting device 6, so that the device is suitable for workpieces with different sizes.
In the application, after the picking device 2 picks up a workpiece, the workpiece is firstly moved to the image acquisition device 6, so that the cross laser 5 is moved right above the lens 602, the image acquisition device 6 acquires a laser cross image emitted by the cross laser 5, the acquired laser cross image is compared with a reference image stored by software, a deviation value of the laser cross is calculated, the picking device 2 is calibrated according to the deviation value, namely, the position is reset to zero, and accumulated errors generated in the repeated moving process of the picking device 2 are reduced. After the position is reset to zero, the first pickup head 202 is moved to the right center of the lens 602 by a corresponding distance according to the distance between the cross laser 5 and the first pickup head 202, and the image acquisition device 6 acquires the image of the workpiece. And then drawing a zero position and a central cross line on the acquired image, carrying out gray scale comparison to calculate the outline and the specific shape of the workpiece, comparing the central position and the deviation value of the workpiece, and giving an instruction to control the movement of the chip mounter in the X direction or the Y direction through the ARM processor so as to adjust the workpiece to the zero position.
Claims (9)
1. The utility model provides a chip mounter, includes base (1), sets up pick device (2) above base (1), drives X axle drive arrangement (3) that pick device (2) removed along X axle direction and drive Y axle drive arrangement (4) that pick device (2) removed along Y axle direction, pick device (2) are including picking up seat (201) and setting up a plurality of pick heads (202) on picking up seat (201), its characterized in that: still include vision calibrating device, vision calibrating device includes cross laser instrument (5) and image acquisition device (6), cross laser instrument (5) set up on picking up seat (201), image acquisition device (6) set up on base (1) and are located the below of pick-up device (2), the laser cross image that cross laser instrument (5) transmitted and the work piece image that pick up head (202) picked up are gathered in proper order in image acquisition device (6).
2. The mounter according to claim 1, wherein: the cross laser (5) and the plurality of pick-up heads (202) are distributed linearly along an X axis or a Y axis.
3. The mounter according to claim 1, wherein: the image acquisition device (6) comprises a shell (601), a lens (602) arranged in the shell (601), a CCD sensor (603) arranged below the lens (602) and light sources (604) arranged around the lens (602).
4. The mounter according to claim 3, wherein: a cleaning roller (609) is arranged above the lens (602), the cleaning roller (609) is horizontally arranged, and two ends of the cleaning roller (609) are movably arranged on the inner wall of the shell (601).
5. The mounter according to claim 4, wherein: the protective cover is further arranged above the lens (602) and comprises a left cover body and a right cover body (605), the two cover bodies (605) are spliced into a hemispherical protective cover, and the cleaning roller (609) is arranged below the protective cover.
6. The mounter according to claim 5, wherein: the cleaning device is characterized in that the cover bodies (605) are arranged in the shell (601) through a rotating shaft, the first gears (606) which are meshed with each other are arranged on the same side of the two cover bodies (605), the two cover bodies (605) are synchronously turned over through the two first gears (606), and a linkage mechanism for driving the cleaning roller (609) to translate is arranged between the cover bodies (605) and the cleaning roller (609).
7. The mounter according to claim 6, wherein: the linkage mechanism comprises a rack (611) and a second gear (610), the rack (611) is arranged horizontally, a moving seat (608) is arranged at the end of the cleaning roller (609), a horizontal sliding groove (607) for installing the moving seat (608) is formed in the inner wall of the shell (601), the rack (611) is fixed on the moving seat (608), and the second gear (610) is arranged between the first gear (606) and the rack (611) and is respectively meshed with the first gear (606) and the rack (611).
8. The mounter according to claim 4, wherein: the inner surface of the protective cover is provided with a light absorption layer.
9. The mounter according to claim 1, wherein: the pick-up head (202) is provided with a lining plate (203), and the lining plate (203) is positioned above the picked-up workpiece.
Priority Applications (1)
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CN202110414080.5A CN113163702B (en) | 2021-04-16 | 2021-04-16 | Chip mounter |
Applications Claiming Priority (1)
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CN202110414080.5A CN113163702B (en) | 2021-04-16 | 2021-04-16 | Chip mounter |
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CN113163702A true CN113163702A (en) | 2021-07-23 |
CN113163702B CN113163702B (en) | 2023-04-07 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114305705A (en) * | 2022-03-15 | 2022-04-12 | 珠海维尔康生物科技有限公司 | Automatic correcting device and method for position of surgical robot |
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CN110621149A (en) * | 2019-09-24 | 2019-12-27 | 大连佳峰自动化股份有限公司 | Chip mounter |
CN110610869A (en) * | 2019-10-22 | 2019-12-24 | 苏州艾科瑞思智能装备股份有限公司 | Chip packaging equipment |
CN210573860U (en) * | 2019-12-05 | 2020-05-19 | 福建船政交通职业学院 | Big data information acquisition device |
CN110958833A (en) * | 2019-12-23 | 2020-04-03 | 深圳市易通自动化设备有限公司 | Improved full-automatic efficient chip mounter |
CN112188753A (en) * | 2020-10-28 | 2021-01-05 | 先进光电器材(深圳)有限公司 | Multi-head eutectic machine |
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CN114305705A (en) * | 2022-03-15 | 2022-04-12 | 珠海维尔康生物科技有限公司 | Automatic correcting device and method for position of surgical robot |
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