CN113163590A - Circuit board easy to control back drilling depth and back drilling method thereof - Google Patents

Circuit board easy to control back drilling depth and back drilling method thereof Download PDF

Info

Publication number
CN113163590A
CN113163590A CN202110423712.4A CN202110423712A CN113163590A CN 113163590 A CN113163590 A CN 113163590A CN 202110423712 A CN202110423712 A CN 202110423712A CN 113163590 A CN113163590 A CN 113163590A
Authority
CN
China
Prior art keywords
hole
back drilling
drilling
circuit board
depth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110423712.4A
Other languages
Chinese (zh)
Inventor
向参军
曾红
陈俊玲
张志超
陈梓阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Guanghe Technology Co Ltd
Original Assignee
Guangzhou Guanghe Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Guanghe Technology Co Ltd filed Critical Guangzhou Guanghe Technology Co Ltd
Priority to CN202110423712.4A priority Critical patent/CN113163590A/en
Publication of CN113163590A publication Critical patent/CN113163590A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The invention relates to the technical field of circuit board preparation processes, in particular to a circuit board easy to control back drilling depth and a back drilling method thereof, wherein the circuit board comprises a substrate, a first through hole and a second through hole are formed in the substrate, conductive layers are plated on the inner wall of the first through hole and the inner wall of the second through hole respectively, a must-break circuit layer is distributed in the middle of the substrate, the must-break circuit layer transversely penetrates through the first through hole and is connected with the conductive layer in the second through hole, the conductive layer in the second through hole can be connected with a drilling machine, and the circuit board easy to control back drilling depth can enable a back drilling needle to quickly and accurately control back drilling depth of circuit boards with various thicknesses; the method can back drill holes with accurate depth for circuit boards with various thicknesses.

Description

Circuit board easy to control back drilling depth and back drilling method thereof
Technical Field
The invention relates to the technical field of circuit board preparation processes, in particular to a circuit board with back drilling depth easy to control and a back drilling method thereof.
Background
With the intel publication eagle-stream platform tightening the back drilling stub control, the requirement on the signal loss of the circuit board is getting tighter, and the requirement on the through hole stub of the PCIe transmission line in particular cannot exceed 10 mils. The back drilling method of the conventional back drilling hole comprises the following steps: a circuit layer which must be broken is designed on the surface of the circuit board, and a back drilling needle penetrates through the circuit layer which must be broken to serve as a calculation point to calculate and control the back drilling depth, however, the back drilling mode has defects for the circuit board with high back drilling precision requirement: because the circuit board in actual production often has certain thickness, for example the circuit board thickness is above 3.0mm, when the transmission line distributes in the intermediate level of circuit board, the back drill needle is far away from boring through must brokenly the circuit layer to the drilling distance that finishes the back drill, like this longer drilling distance, the error that the back drill accumulated is just bigger, therefore it is difficult to control the degree of depth deviation of back drill at the scope of 10 mil.
Disclosure of Invention
A first object of the present invention is to provide a circuit board in which the back drilling depth can be easily controlled by avoiding the disadvantages of the prior art, and which enables a back drilling pin to quickly and accurately control the back drilling depth of circuit boards of various thicknesses.
A second object of the present invention is to provide a method for backdrilling a circuit board, which is capable of backdrilling a backdrilled hole of a precise depth for circuit boards of various thicknesses, while avoiding the disadvantages of the prior art.
The first purpose of the invention is realized by the following technical scheme:
the utility model provides a circuit board of easily control back drilling degree of depth, includes the base plate, first through-hole and second through-hole have been seted up on the base plate, the inner wall of first through-hole with the conducting layer has been plated respectively to the inner wall of second through-hole, the middle part cloth of base plate has must brokenly the circuit layer, must brokenly the circuit layer traversing first through-hole and with the conducting layer in the second through-hole is connected, the conducting layer in the second through-hole can be connected with the rig.
Further, the distance between the drilling surface of the substrate and the breakable line layer is larger than 2.0mm, and the distance between the breakable line layer and the unbreakable transmission line in the substrate is not larger than 0.2 mm.
Further, the first via is connected to the transmission line, and the second via is not connected to the transmission line.
Further, the breakable line layer traverses through the second via to connect with the conductive layer in the second via.
Further, the conductive layer is a copper layer.
The circuit board easy to control the back drilling depth has the beneficial effects that:
(1) the circuit layer which is necessary to be broken and is taken as the calculation point is moved to the middle part of the circuit board, so that the distance from the back drilling calculation point to the back drilling end is effectively reduced, the drilling distance which needs to be calculated is reduced, and the back drilling error is effectively reduced.
(2) The circuit board is provided with the second through hole, so that the circuit layer which needs to be broken can be conveniently connected to the drilling machine outside the circuit board even if the circuit layer is arranged in the middle of the circuit board, and the problem that the circuit layer which needs to be broken can only be arranged on the surface of the circuit board in the prior art is effectively solved.
(3) According to the invention, the position of the circuit layer to be broken is adjusted, so that the back drilling needle is not influenced by the thickness of the circuit board, the back drilling depth of the circuit board with various thicknesses can be rapidly and accurately controlled, the quality of the circuit board is improved, and the back drilling efficiency is effectively improved.
The second purpose of the invention is realized by the following technical scheme:
provides a back drilling method of a circuit board for easily controlling back drilling depth, which comprises the following steps,
s1: the circuit board which is easy to control the back drilling depth is adopted, and the back drilling depth is easy to control;
s2: connecting the conductive layer of the second through hole of the circuit board to a drilling machine;
s3: the back drilling needle of the drilling machine faces the first through hole of the circuit board to back drill the circuit board;
s4: and starting the back drilling needle, back drilling the back drilling needle in the first through hole and drilling the must-broken circuit layer, connecting the back drilling needle with a drilling machine connected to the second through hole by the must-broken layer, controlling the back drilling depth of the back drilling needle by the drilling machine according to the preset depth, and stopping back drilling when the back drilling needle reaches the preset depth to obtain the back drilling circuit board.
Further, after S4, performing back-drilling detection on the back-drilled circuit board.
Further, the method of backborehole detection comprises the steps of:
s41: slicing the back drilling hole of the back drilling circuit board of the first piece, measuring the depth of the sliced back drilling hole, and confirming the precision of the back drilling hole;
s42: and (4) carrying out back drilling deviation test on the back drilling circuit board subjected to the external alkali etching by using a universal meter, and confirming the accuracy of the back drilling hole again.
The circuit board back drilling method easy to control back drilling depth has the beneficial effects that:
(1) according to the invention, any drilling stroke does not need to be calculated before the back drilling needle reaches the circuit layer to be broken, so that the workload of monitoring the operation of the back drilling needle is reduced.
(2) The back drilling method is easy to operate and suitable for large-scale production and application.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a circuit board easy to control back drilling depth according to the present invention.
Fig. 2 is a working state diagram of the back drilling needle and the broken circuit layer of the circuit board easy to control the back drilling depth.
Reference numerals
A substrate 1; a first through-hole 2; a second through hole 3; a conductive layer 4; breaking the circuit layer 5; a drilling machine 6; a transmission line 7; back drill pins 8; the back bore 9.
Detailed Description
The invention is further described with reference to the following examples.
Example 1
A first through hole 2 and a second through hole 3 are formed in the substrate 1, and conductive layers 4 are plated on an inner wall of the first through hole 2 and an inner wall of the second through hole 3, respectively, wherein the first through hole 2 is used for arranging a transmission line 7 and then drilling a back drilling hole 9, the second through hole 3 is used for arranging a wire, a breakable line layer 5 is distributed in the middle of the substrate 1, the breakable line layer 5 transversely penetrates through the first through hole 2 and is connected with the conductive layer 4 in the second through hole 3, the breakable line layer 5 serves as a calculation starting point of a back drilling needle 8, the breakable line layer 5 is connected to the conductive layer 4 in the second through hole 3 so as to be connected with a drilling machine 6, and the drilling machine 6 is used for calculating a back drilling starting point of the back drilling needle 8.
In this embodiment, the middle of the substrate 1 is further provided with a plurality of unbreakable transmission lines 7, a distance between a drilling surface (a surface where the substrate is initially drilled) of the substrate 1 and the breakable line layer 5 is greater than 2.0mm, so that the breakable line layer 5 is moved backwards as much as possible, the distance between the breakable line layer 5 and the unbreakable transmission lines 7 in the substrate 1 is not greater than 0.2mm, and the calculation error can be reduced as much as possible by the drilling distance of 0.2 mm.
In this embodiment, the first through hole 2 is connected to the transmission line 7, and the second through hole 3 is not connected to the transmission line 7, so that the transmission line 7 is not affected by the conductive layer 4 of the second through hole 3, and the normal operation of the circuit board is ensured.
In this embodiment, the breakable line layer 5 transversely passes through the second through hole 3 to connect with the conductive layer 4 in the second through hole 3, thereby facilitating quick and easy application of the breakable line layer 5.
In this embodiment, the conductive layer 4 is a copper layer.
Example 2
The embodiment discloses a back drilling method of a circuit board, which is easy to control the back drilling depth and comprises the following steps,
s1: the circuit board of embodiment 1, in which the back drilling depth is easy to control, is adopted;
s2: connecting the conductive layer 4 of the second through hole 3 of the wiring board to a drilling machine 6;
s3: the back drilling needle 8 of the drilling machine 6 faces the first through hole 2 of the circuit board to back drill the circuit board;
s4: and starting the back drilling needle 8, back drilling the back drilling needle 8 in the first through hole 2 and drilling the must-broken circuit layer 5, connecting the back drilling needle 8 with a drilling machine 6 connected to the second through hole 3 by the must-broken layer, controlling the back drilling depth of the back drilling needle 8 by the drilling machine 6 according to the preset depth, and stopping back drilling when the back drilling needle 8 reaches the preset depth to obtain the back drilling circuit board.
In order to ensure the accuracy of the back-drilled hole 9, after S4, the method further includes performing back-drilled hole 9 detection on the back-drilled circuit board.
The method for detecting the back drilled hole 9 comprises the following steps:
s41: slicing the back drilling hole 9 of the back drilling circuit board of the first piece, measuring the depth of the sliced back drilling hole 9, and confirming the precision of the back drilling hole 9, wherein only the back drilling hole 9 on the back drilling circuit board of the first piece is subjected to slicing detection;
s42: and (4) carrying out back drilling hole 9 deviation test on the back drilling circuit board subjected to the external alkali etching by adopting a universal meter, and confirming the precision of the back drilling hole 9 again.
The application is easy to control the working principle of the circuit board of the back drilling depth:
moving the must-break circuit layer 5 for calculating the drilling distance of the back drill point 8 downwards, and starting to calculate the back drilling distance after the back drill point 8 of the drilling machine 6 drills the must-break circuit layer 5, so that the problem that the accumulated back drilling error is large because the back drilling distance is too long due to too thick circuit boards can be prevented; wherein, this must break circuit layer 5 is connected to the rig 6 outside the circuit board through conducting layer 4 on the second through-hole 3, and during the use, must break first through-hole 2 section above circuit layer 5 and need not to calculate the back drilling and bore the journey, the back drilling needle 8 directly back drilling can, and must break first through-hole 2 section below circuit layer 5 then calculates the back drilling and bore the journey according to rig 6, can reduce the error of calculation effectively like this to guarantee the back drilling precision of back drilling 9.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims (8)

1. The utility model provides an easily control circuit board of back drilling degree of depth which characterized in that: the drilling machine comprises a substrate, wherein a first through hole and a second through hole are formed in the substrate, conducting layers are plated on the inner wall of the first through hole and the inner wall of the second through hole respectively, a broken circuit layer is distributed in the middle of the substrate, the broken circuit layer transversely penetrates through the first through hole and is connected with the conducting layer in the second through hole, and the conducting layer in the second through hole can be connected with a drilling machine.
2. A circuit board for facilitating backdrilling depth control according to claim 1, wherein: the distance between the drilling surface of the substrate and the breakable line layer is larger than 2.0mm, and the distance between the breakable line layer and the unbreakable transmission line in the substrate is not larger than 0.2 mm.
3. A circuit board for facilitating backdrilling depth control according to claim 2, wherein: the first via is connected with the transmission line, and the second via is not connected with the transmission line.
4. A circuit board for facilitating backdrilling depth control according to claim 1, wherein: the breakable line layer transversely penetrates through the second through hole to be connected with the conductive layer in the second through hole.
5. A circuit board for facilitating backdrilling depth control according to claim 1, wherein: the conductive layer is a copper layer.
6. A back drilling method of a circuit board capable of easily controlling back drilling depth is characterized in that: comprises the following steps of (a) carrying out,
s1: the circuit board which is easy to control the back drilling depth is adopted, and the back drilling depth is easy to control;
s2: connecting the conductive layer of the second through hole of the circuit board to a drilling machine;
s3: the back drilling needle of the drilling machine faces the first through hole of the circuit board to back drill the circuit board;
s4: and starting the back drilling needle, back drilling the back drilling needle in the first through hole and drilling the must-broken circuit layer, connecting the back drilling needle with a drilling machine connected to the second through hole by the must-broken layer, controlling the back drilling depth of the back drilling needle by the drilling machine according to the preset depth, and stopping back drilling when the back drilling needle reaches the preset depth to obtain the back drilling circuit board.
7. The method of backdrilling a wiring board for easily controlling the backdrilling depth according to claim 6, wherein: and after S4, back drilling detection is carried out on the back drilling circuit board.
8. A method of backdrilling a wiring board for easily controlling a backdrilling depth according to claim 7, wherein: the method for back-drilling detection comprises the following steps:
s41: slicing the back drilling hole of the back drilling circuit board of the first piece, measuring the depth of the sliced back drilling hole, and confirming the precision of the back drilling hole;
s42: and (4) carrying out back drilling deviation test on the back drilling circuit board subjected to the external alkali etching by using a universal meter, and confirming the accuracy of the back drilling hole again.
CN202110423712.4A 2021-04-20 2021-04-20 Circuit board easy to control back drilling depth and back drilling method thereof Pending CN113163590A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110423712.4A CN113163590A (en) 2021-04-20 2021-04-20 Circuit board easy to control back drilling depth and back drilling method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110423712.4A CN113163590A (en) 2021-04-20 2021-04-20 Circuit board easy to control back drilling depth and back drilling method thereof

Publications (1)

Publication Number Publication Date
CN113163590A true CN113163590A (en) 2021-07-23

Family

ID=76869005

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110423712.4A Pending CN113163590A (en) 2021-04-20 2021-04-20 Circuit board easy to control back drilling depth and back drilling method thereof

Country Status (1)

Country Link
CN (1) CN113163590A (en)

Similar Documents

Publication Publication Date Title
CN103433969B (en) The boring method of printed circuit board (PCB) and device
TW201605315A (en) Backdrilling method, and backdrilling apparatus
CN110475432B (en) PCB and manufacturing and back drilling method thereof
CN105430913B (en) A kind of boring method of printed circuit board
CN109121305B (en) PCB back drilling control method and PCB
CN104640380B (en) A kind of non-heavy copper hole with orifice ring and print circuit plates making method
CN110646726A (en) PCB back drilling nondestructive testing method
JP4046058B2 (en) Multilayer printed wiring board, stub counterboring device and method thereof
CN105517349A (en) Back drilling detection method
CN103517556B (en) A kind of circuit board depth control type drilling depth determining method and circuit board
CN114828424A (en) Method for improving alignment of back drilling hole
CN214627492U (en) Circuit board of easily controlling back drilling depth
CN113163590A (en) Circuit board easy to control back drilling depth and back drilling method thereof
CN106216735B (en) A kind of operating method of numerically controlled drill system and numerically controlled drill
CN111256578A (en) Method for detecting depth of back drilling plate
CN207197407U (en) A kind of tool for being used to measure the borehole accuracy of X Ray drilling machines
CN105430869B (en) The high hole position precision processing method of IC test boards and production method
CN103796435B (en) The method that measurement circuitry flaggy presses off normal
CN109520438A (en) The inclined distance measurement method in the hole of machine drilling
CN108811336A (en) Two sided pcb processing method
CN113079638B (en) Back drilling method and device for PCB
CN210491300U (en) Multilayer PCB board convenient to measure drilling skew
CN211063849U (en) Circuit board of control degree of depth control quality
CN114423161A (en) PCB processing method and PCB
CN110896593B (en) Method for manufacturing circuit board and drilling machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination