CN113157071A - Sealed computer board heat radiation structure - Google Patents
Sealed computer board heat radiation structure Download PDFInfo
- Publication number
- CN113157071A CN113157071A CN202110332160.6A CN202110332160A CN113157071A CN 113157071 A CN113157071 A CN 113157071A CN 202110332160 A CN202110332160 A CN 202110332160A CN 113157071 A CN113157071 A CN 113157071A
- Authority
- CN
- China
- Prior art keywords
- computer board
- heat dissipation
- board
- heat
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 5
- 230000017525 heat dissipation Effects 0.000 claims abstract description 79
- 238000002791 soaking Methods 0.000 claims abstract description 47
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 238000004891 communication Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 238000004378 air conditioning Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a sealed computer board heat radiation structure, wherein: the computer board radiating structure seals the opening of the sealed case to form a sealing structure, and works at outdoor or air-conditioning-free ambient temperature; the computer board heat dissipation structure comprises a soaking plate, a computer board, a heat dissipation cover plate and a centrifugal fan; all high-heat devices on the computer board are tightly attached to the inner side of the soaking board, the heat conducting pipes are laid in the soaking board, the heat radiating teeth are designed on the outer side of the soaking board, heat on the computer board is transferred to the positions of the heat radiating teeth through the heat conducting pipes in the soaking board, and then the heat radiating teeth on the soaking board are radiated through the centrifugal fan, so that the purpose of rapid heat radiation is finally achieved. The invention has strong environmental adaptability, and can ensure the normal work of the computer board when the computer board is completely sealed and installed and is in the field high-temperature working environment.
Description
Technical Field
The invention belongs to the field of computer board heat dissipation, and particularly relates to a sealed computer board heat dissipation structure.
Background
The computer board commonly used at present is provided with a CPU, a power supply module, a GPU and other high-heat devices, heat dissipation needs to be carried out on the computer board in the working process, the heat productivity of a core module of the computer board is gradually increased due to the gradual improvement of performance requirements, particularly, the heat productivity of a domestic substitute device is further increased, and the computer board arranged in sealing equipment is subjected to common heat dissipation modes such as air cooling, water cooling, heat conduction pipes and the like, and the following structural modes are mainly adopted.
The main structure of the air cooling heat dissipation mode is that a radiator is fixed on the upper part of a high-heat device, and then the fan is used for directly dissipating heat of the high-heat device, such as the heat dissipation of a common computer CPU (central processing unit), the air cooling heat dissipation mode has the advantages of low cost and small volume, and has the defects of low heat dissipation efficiency, high temperature rise inside sealing equipment, influence on the heat dissipation efficiency and influence on the working performance of other devices. This structure is often used in non-hermetic devices having louvers in the enclosure.
The main structure of the water-cooling heat dissipation mode is that a radiator is fixed on the upper part of a large-heat device, a circulating cooling pipeline is laid on the radiator, and heat is transferred through circulating cooling water inside the pipeline.
The heat conduction pipe mode main structure is that hug closely the big heat device on the computer board on the heat-conducting plate, and heat conduction pipe has laid to the heat-conducting plate inside, can transmit the heat that the device produced fast, and the advantage of this kind of mode is that area occupied is less, and structural arrangement is comparatively compact, and this kind of structure can be used to sealed equipment, and the shortcoming is that the radiating efficiency is lower.
The computer board heat dissipation structures can ensure that the computer board normally works at normal temperature or air-conditioning ambient temperature, but for some equipment which needs to work at outdoor or air-conditioning ambient temperature and needs to be sealed, the common heat dissipation structure cannot meet the requirements, and a structure which is faster in heat dissipation efficiency and more compact is needed to meet the requirements.
Disclosure of Invention
Aiming at least one of the defects or improvement requirements in the prior art, the invention provides a sealed computer board heat dissipation structure, wherein all high-heat devices on a computer board are tightly attached to the inner side of a soaking plate, a heat conduction pipe is laid in the soaking plate, heat dissipation teeth are designed on the outer side of the soaking plate, heat on the computer board is transferred to the positions of the heat dissipation teeth through the heat conduction pipe in the soaking plate, and then the heat dissipation teeth on the soaking plate are dissipated through a centrifugal fan, so that the aim of quickly dissipating heat is finally fulfilled.
To achieve the above object, according to one aspect of the present invention, there is provided a sealed computer board heat dissipation structure, wherein: the computer board radiating structure seals the opening of the sealed case to form a sealing structure, and works at outdoor or air-conditioning-free ambient temperature;
the computer board heat dissipation structure comprises a soaking plate, a computer board, a heat dissipation cover plate and a centrifugal fan;
the soaking plate comprises an inner side, an inner part and an outer side, the inner side is provided with a groove, and the computer plate is arranged in the groove and has a gap with the bottom of the groove;
the heat conducting pipe is arranged at the back of a heat dissipation device of the computer board, and heat dissipation liquid is sealed in the heat conducting pipe;
the outside has two recess districts that link up, just the outside by the heat dissipation apron covers, installs in the first recess district centrifugal fan, second recess district is provided with a plurality of heat dissipation teeth.
Further preferably, the recess of the inner side has a number of protrusions therein, which are supported between the inner side and the computer board.
Further preferably, the inner part is provided with a flange edge of a flange at the periphery, and the flange edge is fixed at the edge of the opening of the sealed case.
Further preferably, the heat conducting pipe is bent in multiple sections.
Further preferably, the air outlet of the centrifugal fan blows the heat dissipation teeth through a communication groove between the first groove and the second groove.
Further preferably, the centrifugal fan is provided in plurality.
Further preferably, the computer board is of an integral structure and comprises a printed board, and the heat dissipation devices are all mounted on the printed board.
Further preferably, the computer board is a split structure and comprises a core board, a computer bottom board, a power module, a stud and an external socket;
carry out the communication through the connector between nuclear core plate and the computer bottom plate, couple through the double-screw bolt, power module and external socket are installed respectively the two sides of computer bottom plate, and the heat dissipation device is installed respectively on nuclear core plate and the computer bottom plate.
Further preferably, the upper part of the heat-radiating cover plate is provided with an air inlet, and the lower part of the heat-radiating cover plate is provided with an air outlet;
the air inlet of the heat dissipation cover plate is over against the air inlet of the centrifugal fan, and the air outlet of the heat dissipation cover plate is over against the heat dissipation teeth of the soaking plate.
Further preferably, the centrifugal fan is a direct-current centrifugal fan, the top of the centrifugal fan is an air inlet, and the side of the centrifugal fan is an air outlet.
The above-described preferred features may be combined with each other as long as they do not conflict with each other.
Generally, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects:
1. according to the sealed computer board heat dissipation structure, all large-heat devices on the computer board are tightly attached to the inner side of the soaking board, the heat conduction pipes are laid in the soaking board, the heat dissipation teeth are arranged on the outer side of the soaking board, heat on the computer board is transferred to the positions of the heat dissipation teeth through the heat conduction pipes in the soaking board, and then the heat dissipation teeth on the soaking board are dissipated through the centrifugal fan, so that the purpose of rapid heat dissipation is finally achieved.
2. The sealed computer board radiating structure has strong environmental adaptability, and can ensure the normal work of the computer board when the computer board is completely sealed and installed and is in a field high-temperature working environment.
3. The sealed computer board radiating structure has the advantages of compact structure, high radiating efficiency and convenient assembly, maintenance and disassembly.
4. The sealed computer board radiating structure is suitable for a computer board radiating structure for field work, is also suitable for upgrading, miniaturization and technical improvement of the computer board radiating structure, and has better application value and popularization prospect.
5. The highest bearable temperature of heating devices such as a CPU (central processing unit), a power supply module and the like on the computer board is 100 ℃, and the sealed computer board heat dissipation structure can normally work under the outdoor high-temperature 60 ℃ environment condition; the temperature rise is controlled within 20 ℃ (relative to the ambient temperature) by the heat dissipation of the soaking plate.
Drawings
FIG. 1a is a schematic cross-sectional view of the installation of the present invention;
FIG. 1b is a side view of the installation of the present invention;
FIG. 2a is an assembly view of the present invention in the medial direction;
FIG. 2b is a cross-sectional assembly view of the present invention;
FIG. 2c is an assembly view in the outboard direction of the present invention;
FIG. 3 is an exploded view of the present invention;
fig. 4a is a layout view of heat dissipation of the inner side of the soaking plate of the present invention;
fig. 4b is a view of the heat dissipation layout of the inside of the soaking plate of the present invention;
FIG. 5 is an exploded view of the computer board of the present invention;
FIG. 6a is an assembled view of the cover plate of the present invention disassembled;
FIG. 6b is an assembled view of the cover plate of the present invention prior to disassembly;
FIG. 7 is a test temperature profile of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other. The present invention will be described in further detail with reference to specific embodiments.
As a preferred embodiment of the present invention, as shown in fig. 1a-7, the present invention provides a heat dissipation structure a for a sealed computer board, which seals an opening of a sealed case B to form a sealed structure, and operates at an outdoor or non-air-conditioning ambient temperature, and can dissipate heat from an internal computer board while ensuring the sealing.
As shown in fig. 2a-c and fig. 3, the heat dissipation structure of the computer board in the present embodiment mainly includes a vapor chamber 1, a computer board 2, a heat dissipation cover plate 3, a centrifugal fan 4, and an insulating pad 5.
As shown in fig. 4a-b, a schematic diagram of a front-back side heat dissipation structure of a soaking plate 1 in this embodiment is shown, the soaking plate 1 is a core heat dissipation part of a computer board 2, the whole soaking plate 1 is a thick plate structure, a set of flange edges are arranged on the periphery, a set of mounting holes 1a are arranged on the periphery of the flange and used for fixing the soaking plate 1, the whole soaking plate 1 is composed of an inner side, an inner side and an outer side, the inner side is the same as the flange edges, the computer board 2 is mounted on the inner side, the inner side is in a groove structure with four raised edges, a set of mounting holes 1b are arranged on the four raised edges and used for mounting the computer board 2, corresponding protrusions or grooves are reserved in the grooves according to positions of heat dissipation devices on the computer board 2, and a 0.3mm gap is reserved between the two after mounting in this embodiment; a layer of hollow heat conduction pipe 1c is arranged in the soaking plate 1, heat dissipation liquid is sealed in the heat conduction pipe 1c, and the heat conduction pipe 1c is mainly arranged at the position of a heat dissipation device of the computer plate 2 to facilitate the rapid heat transfer; the outer side of the soaking plate 1 is of a two-through groove structure, one end of the first groove is provided with two centrifugal fans 4 which are fixed through mounting holes 1d, one corner of the first groove is provided with a fan wire outlet 1e, the second groove is a rapid heat dissipation area, the rapid heat dissipation area is composed of an air inlet 1f (a communication groove between the first groove and the second groove), an air guide groove 1g and heat dissipation teeth 1h, and devices needing heat dissipation of the computer plate 2 are mounted on the reverse side of the heat dissipation teeth 1 h.
As shown in fig. 5, the computer board 2 in this embodiment is a split type, and mainly includes a core board 2a, a computer board 2b, a power module 2c, a stud 2d, an external socket 2e, and the like, where the core board 2a and the computer board 2b communicate with each other through a connector and are connected through the stud 2d, the power module and the external socket are respectively installed on two sides of the computer board, and devices requiring heat dissipation are respectively installed on the two printed boards.
As shown in fig. 6a-b, the heat-dissipating cover plate 3 of the present invention is disassembled and assembled in a comparative view, the heat-dissipating cover plate 3 is a thin plate structure, the periphery thereof is provided with a group of mounting holes for fixing the heat-dissipating cover plate, the upper part is provided with 2 groups of air inlets, and the lower part is provided with 1 group of air outlets. Wherein the air inlet corresponds to the air inlet of the centrifugal fan 4, and the air outlet corresponds to the heat dissipation teeth 1h of the soaking plate 1.
As shown in fig. 6a-b, the centrifugal fan 4 of the present invention is a direct-flow centrifugal fan, the top is an air inlet, and the side is an air outlet. The main parameters of the centrifugal fan 4 are: voltage 28V, power 2.8W and air volume 12.8 CFM.
As shown in fig. 3a-c, the insulating padding plate 5 of the present invention is a ring-shaped thin plate structure, and has a set of mounting holes on the periphery thereof, the mounting holes correspond to the mounting holes of the computer board 2, and the insulating padding plate 5 is located between the computer board 2 and the soaking plate 1, and is used for insulating the computer board 2 from the soaking plate 1.
During the assembly of this embodiment, 1 inboard installation insulating backing plates 5 and the computer board 2 of soaking board, 1 outside installation centrifugal fan 4 of soaking board and heat dissipation apron 3. The power cord of the centrifugal fan 4 enters the inside through the wire outlet hole 1e on the soaking plate 1.
This embodiment is when designing, for guaranteeing radiating efficiency and the reliability of whole computer board 2, carries out simulation analysis through ANSYS, through simulation analysis, optimizes and adjusts following:
A. the air volume of the centrifugal fan 4;
B. the distribution position of the heat conduction pipe 1c in the soaking plate 1;
C. arranging heat dissipation teeth 1h and an air guide groove 1g on the outer side of the soaking plate;
D. the sizes and positions of the air inlet and the air outlet on the heat dissipation cover plate 3.
After the production of the embodiment is completed, the embodiment is tested before the installation, and for the temperature test of the embodiment in the test process, temperature test points are arranged at a 1-a 8, and analog heating devices are fixed in a-e areas, wherein the a area 5W, b, the 10W, c, the 20W, d, the 5W area and the 3 e areas are 2W respectively. During testing, under the environment condition of high temperature of 60 ℃, the temperature rise of the test points a 1-a 8 can be controlled within 20 ℃ (relative to the environment temperature) through heat dissipation of the soaking plate.
After the production and assembly are completed, the test shows that the device can normally work under the high-temperature 60 ℃ environment condition.
In summary, compared with the prior art, the scheme of the invention has the following significant advantages:
according to the sealed computer board heat dissipation structure, all large-heat devices on the computer board are tightly attached to the inner side of the soaking board, the heat conduction pipes are laid in the soaking board, the heat dissipation teeth are arranged on the outer side of the soaking board, heat on the computer board is transferred to the positions of the heat dissipation teeth through the heat conduction pipes in the soaking board, and then the heat dissipation teeth on the soaking board are dissipated through the centrifugal fan, so that the purpose of rapid heat dissipation is finally achieved.
The sealed computer board radiating structure has strong environmental adaptability, and can ensure the normal work of the computer board when the computer board is completely sealed and installed and is in a field high-temperature working environment.
The sealed computer board radiating structure has the advantages of compact structure, high radiating efficiency and convenient assembly, maintenance and disassembly.
The sealed computer board radiating structure is suitable for a computer board radiating structure for field work, is also suitable for upgrading, miniaturization and technical improvement of the computer board radiating structure, and has better application value and popularization prospect.
The highest bearable temperature of heating devices such as a CPU (central processing unit), a power supply module and the like on the computer board is 100 ℃, and the sealed computer board heat dissipation structure can normally work under the outdoor high-temperature 60 ℃ environment condition; the temperature rise is controlled within 20 ℃ (relative to the ambient temperature) by the heat dissipation of the soaking plate.
It will be appreciated that the embodiments of the system described above are merely illustrative, in that elements illustrated as separate components may or may not be physically separate, may be located in one place, or may be distributed over different network elements. Some or all of the modules can be selected according to actual needs to achieve the purpose of the scheme of the embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
In addition, it should be understood by those skilled in the art that in the specification of the embodiments of the present invention, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In the description of the embodiments of the invention, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description. Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the invention, various features of the embodiments of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects.
However, the disclosed method should not be interpreted as reflecting an intention that: that is, the claimed embodiments of the invention require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of an embodiment of this invention.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention, and not to limit the same; although embodiments of the present invention have been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A sealed computer board heat radiation structure is characterized in that: the computer board radiating structure seals the opening of the sealed case to form a sealing structure, and works at outdoor or air-conditioning-free ambient temperature;
the computer board heat dissipation structure comprises a soaking plate, a computer board, a heat dissipation cover plate and a centrifugal fan;
the soaking plate comprises an inner side, an inner part and an outer side, the inner side is provided with a groove, and the computer plate is arranged in the groove and has a gap with the bottom of the groove;
the heat conducting pipe is arranged at the back of a heat dissipation device of the computer board, and heat dissipation liquid is sealed in the heat conducting pipe;
the outside has two recess districts that link up, just the outside by the heat dissipation apron covers, installs in the first recess district centrifugal fan, second recess district is provided with a plurality of heat dissipation teeth.
2. The sealed computer board heat dissipating structure of claim 1, wherein:
the groove of the inner side is provided with a plurality of bulges which are supported between the inner side and the computer board.
3. The sealed computer board heat dissipating structure of claim 1, wherein:
the periphery of the inner part is provided with a flange edge of a flange, and the flange edge is fixed on the edge of the opening of the sealed case.
4. The sealed computer board heat dissipating structure of claim 1, wherein:
the heat conduction pipe is in a multi-section bending shape.
5. The sealed computer board heat dissipating structure of claim 1, wherein:
and the air outlet of the centrifugal fan blows the heat dissipation teeth through the communication groove between the first groove and the second groove.
6. The sealed computer board heat dissipating structure of claim 1, wherein:
the centrifugal fan is provided with a plurality of.
7. The sealed computer board heat dissipating structure of claim 1, wherein:
the computer board is of an integral structure and comprises a printed board, and the heat dissipation devices are all arranged on the printed board.
8. The sealed computer board heat dissipating structure of claim 1, wherein:
the computer board is of a split structure and comprises a core board, a computer base board, a power supply module, a stud and an external socket;
carry out the communication through the connector between nuclear core plate and the computer bottom plate, couple through the double-screw bolt, power module and external socket are installed respectively the two sides of computer bottom plate, and the heat dissipation device is installed respectively on nuclear core plate and the computer bottom plate.
9. The sealed computer board heat dissipating structure of claim 1, wherein:
the upper part of the radiating cover plate is provided with an air inlet, and the lower part of the radiating cover plate is provided with an air outlet;
the air inlet of the heat dissipation cover plate is over against the air inlet of the centrifugal fan, and the air outlet of the heat dissipation cover plate is over against the heat dissipation teeth of the soaking plate.
10. The sealed computer board heat dissipating structure of claim 1, wherein:
the centrifugal fan is a direct-current centrifugal fan, the top of the centrifugal fan is an air inlet, and the side of the centrifugal fan is an air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110332160.6A CN113157071A (en) | 2021-03-29 | 2021-03-29 | Sealed computer board heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110332160.6A CN113157071A (en) | 2021-03-29 | 2021-03-29 | Sealed computer board heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113157071A true CN113157071A (en) | 2021-07-23 |
Family
ID=76885168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110332160.6A Pending CN113157071A (en) | 2021-03-29 | 2021-03-29 | Sealed computer board heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113157071A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1545179A1 (en) * | 2003-12-16 | 2005-06-22 | Shuttle Inc. | Integrated heat dissipating assembly for computer systems |
| US20100073864A1 (en) * | 2008-09-24 | 2010-03-25 | Furui Precise Component (Kunshan) Co., Ltd. | Heat dissipation device and computer using same |
| CN204669782U (en) * | 2015-06-24 | 2015-09-23 | 中国电子科技集团公司第五十四研究所 | A kind of high-power compact sealed cabinet |
| CN107949236A (en) * | 2017-10-27 | 2018-04-20 | 中国船舶重工集团公司第七二三研究所 | A kind of synthesis heat-exchanger rig based on conduction |
| CN111651956A (en) * | 2020-05-25 | 2020-09-11 | 湖北三江航天万峰科技发展有限公司 | Board card assembly based on medium phase change heat transfer and electronic equipment comprising board card assembly |
-
2021
- 2021-03-29 CN CN202110332160.6A patent/CN113157071A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1545179A1 (en) * | 2003-12-16 | 2005-06-22 | Shuttle Inc. | Integrated heat dissipating assembly for computer systems |
| US20100073864A1 (en) * | 2008-09-24 | 2010-03-25 | Furui Precise Component (Kunshan) Co., Ltd. | Heat dissipation device and computer using same |
| CN204669782U (en) * | 2015-06-24 | 2015-09-23 | 中国电子科技集团公司第五十四研究所 | A kind of high-power compact sealed cabinet |
| CN107949236A (en) * | 2017-10-27 | 2018-04-20 | 中国船舶重工集团公司第七二三研究所 | A kind of synthesis heat-exchanger rig based on conduction |
| CN111651956A (en) * | 2020-05-25 | 2020-09-11 | 湖北三江航天万峰科技发展有限公司 | Board card assembly based on medium phase change heat transfer and electronic equipment comprising board card assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111213439B (en) | Electronic device | |
| CN102469752B (en) | The heat abstractor of power conversion module | |
| CN105716046A (en) | Omnidirectional convection active radiator and stage lamp applying radiator | |
| CN112885798A (en) | Integrated phase change heat transfer element liquid cooling heat radiation module for server | |
| CN112243339B (en) | Double-circulation heat dissipation system | |
| WO2022127746A1 (en) | Cabinet assembly and heat exchanger | |
| CN220156945U (en) | Radiating assembly, electric control box and air conditioner | |
| CN110785701A (en) | Heat dissipation system and photographic equipment | |
| CN113157071A (en) | Sealed computer board heat radiation structure | |
| CN110632561A (en) | Thermal control structure of airborne radar radio frequency unit | |
| CN104577809B (en) | Radiator for switchboard copper bar | |
| CN211240533U (en) | Air conditioner electrical box with high-efficient heat dissipation mechanism | |
| CN210005702U (en) | CT detector temperature equal structure based on heat dissipation fin differential design | |
| CN219961158U (en) | Heat abstractor and electronic equipment | |
| CN216017370U (en) | Electrical equipment box | |
| CN217884260U (en) | Heat radiation structure and satellite communication equipment | |
| CN216532433U (en) | Main control box | |
| CN219938833U (en) | Controller for controlling a power supply | |
| CN219305144U (en) | Air-cooled base station equipment | |
| CN219496997U (en) | Server device | |
| CN217608195U (en) | Heat radiation structure | |
| CN217985858U (en) | ADAS domain controller | |
| CN221103909U (en) | Heat abstractor and electric installation | |
| CN215073604U (en) | Liquid-electricity separated liquid cooling heat dissipation system for laser television | |
| CN216700735U (en) | Novel photovoltaic inverter radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210723 |