CN113151871A - Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate - Google Patents
Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate Download PDFInfo
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- CN113151871A CN113151871A CN202110233970.6A CN202110233970A CN113151871A CN 113151871 A CN113151871 A CN 113151871A CN 202110233970 A CN202110233970 A CN 202110233970A CN 113151871 A CN113151871 A CN 113151871A
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- electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
The invention discloses a vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of an electroplating plate, wherein the electroplating plate (1) vertically and continuously passes through the electroplating bath, the electroplating plate in the electroplating bath is a cathode, and two sides of the electroplating plate are provided with anodes (2), and the electroplating bath is characterized in that: a plurality of spray pipes (3) and suction pipes (4) are vertically arranged between the two sides of the electroplating plate and the anode in parallel, the spray pipes and the suction pipes on the same side are arranged in a staggered manner, the spray pipes and the suction pipes opposite to each other on the two sides are correspondingly arranged in a spraying manner, a plurality of nozzles (5) facing the electroplating plate are arranged on the spray pipes, and a plurality of suction nozzles facing the electroplating plate are arranged on the suction pipes; a plurality of auxiliary suction pipes (7) are vertically arranged on the outer sides of the spray pipe and the suction pipes in parallel, and a plurality of suction nozzles back to the electroplating plate are arranged on the auxiliary suction pipes. The invention can effectively improve the electroplating uniformity of the electroplating plate with the high aspect ratio holes.
Description
Technical Field
The invention relates to electroplating plate vertical continuous electroplating equipment, in particular to a spray-suction staggered vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of an electroplating plate.
Background
In the fields of electronics, communications, military industry, and the like, electroplating has become a very important surface treatment method in order to achieve electrical conductivity, oxidation resistance, and wear resistance of products. Taking copper plating as an example (the same applies to other metal structures), electroplating is performed by taking a plating plate as a cathode and taking an iridium titanium oxide net or a titanium basket as an anode.
Currently, electroplating production increasingly uses vertical continuous electroplating equipment (vertical continuous plating), as shown in fig. 1 and 2. The traditional vertical continuous electroplating equipment adopts a structure that a pair of pressure equalizing pipes which are not communicated with each other are arranged at the bottom of an electroplating bath, the two pressure equalizing pipes are respectively connected with respective hydraulic pumps through pipelines, and electroplating solution is sprayed by the hydraulic pumps in a pumping mode. A plurality of vertical spray pipes are communicated in parallel with the upper surface of the pressure equalizing pipe, a plurality of horizontal inward spray holes are drilled on the spray pipes, and electroplating liquid is sprayed out of the spray holes. The electroplating plate is arranged between the spray pipes which are symmetrically arranged, the two sides of the electroplating plate are sprayed with electroplating solution,
the above conventional techniques mainly have problems: the main spraying directions of the spraying pipes of the hydraulic pump are the directions of the electroplating plate, so that the liquid medicine in the area of the electroplating plate can be well circulated by the spraying pipes, but in addition, the liquid medicine is poorly circulated due to no spraying pipe device for stirring in other areas of the tank body; secondly, a fifth generation mobile communication system 5G becomes a hotspot of the communication industry, and an important step of realizing the 5G is uniform electroplating of a high-aspect-ratio hole (the ratio of the depth to the aperture of the hole on the electroplating plate reaches 8: 1-20: 1). In order to realize high-density interconnection, the diameter of the hole on the electroplating plate is smaller and deeper, and the depth of the hole is deeper and deeper. The existing electroplating technology can only be suitable for electroplating plates with the aspect ratio of less than 6:1, because electroplating solution is sprayed on two sides of the electroplating plate, spraying pressure on two sides is offset, and the exchange of the electroplating solution of holes with high aspect ratio cannot be met, so that the electroplating of the holes with high aspect ratio is not uniform enough, and the electroplating often only occurs at the orifice accessories and the plate surface. In addition, other liquid medicines in the liquid medicine tank can not participate in liquid medicine exchange all the time, and the exchange efficiency is limited.
Chinese patent publication No. CN103668403B, "spray-suction plating bath", discloses a spray-suction plating bath, which includes: the electroplating device comprises a tank body, a plurality of electroplating plates and a plurality of connecting rods, wherein the tank body is internally provided with an accommodating space for accommodating electroplating liquid, a cathode electrode is arranged in the accommodating space, the cathode electrode can be provided with an electroplating plate which is provided with a through hole and is defined to extend along the longitudinal direction, and an anode electrode is arranged on one side of the electroplating plate in the accommodating space; the spraying device is arranged in the accommodating space of the tank body and is positioned on the same side of the electroplating plate and the anode electrode, and the spraying device is provided with a nozzle facing the electroplating plate and used for spraying the electroplating solution towards the electroplating plate; the suction device is arranged in the accommodating space of the tank body and is positioned on one side of the electroplating plate opposite to the spraying device, and the suction device is provided with a suction inlet for sucking the electroplating solution in the accommodating space and enabling the electroplating solution to be sprayed out of the spraying device together with the spraying device and flow to the suction device through the holes of the electroplating plate.
The cathode electrode can drive the electroplating plate to move longitudinally in the accommodating space of the tank body, and devices on two sides of the electroplating plate are arranged alternately in the accommodating space along the longitudinal direction.
However, the patent has the following disadvantages: firstly, because only spray and inhale correspondingly at electroplating board both sides, can make the liquid medicine circulation in the plating bath elsewhere not ideal enough, and because under the state of continuously electroplating, copper ion and additive in the liquid medicine near electroplating board both sides reduce because of being consumed, lead to that the liquid medicine concentration of electroplating board regional near can reduce to some extent and can't maintain the liquid medicine concentration that can normally operate, so will influence the electroplating effect in hole. Secondly, the patent design only adopts a single-sided anode matched with a spraying nozzle for electroplating, and then recovers the liquid medicine through a suction pipe, and the design idea is to ensure that the current and the liquid medicine flow enter the hole together during electroplating. However, such a design would change the electroplating on both sides of the electroplated plate into "intermittent" electroplating, which is prone to multi-layer delamination and not good for the electroplated product. Finally, because the suction tube does not have a suction-guiding device, if only one tube is used alone with no special design of the nozzle, the situation of ineffective suction is easy to occur because the pressurizing strength is much lower than the sprayed liquid medicine when the liquid medicine is sucked by the hydraulic pump.
Disclosure of Invention
The invention aims to solve the technical problem of providing a vertical continuous electroplating bath which can effectively improve the electroplating uniformity of high aspect ratio holes of an electroplating plate.
The technical scheme adopted by the invention is as follows.
The utility model provides a can realize electroplating the even perpendicular continuous plating bath of electroplating board high aspect ratio hole, electroplating board 1 erect ground perpendicularly and pass through the plating bath in succession, electroplating the board and being the negative pole in the plating bath, electroplating the both sides of board and being equipped with positive pole 2, characterized by: a plurality of spray pipes 3 and suction pipes 4 are vertically arranged between the two sides of the electroplating plate and the anode in parallel, the spray pipes and the suction pipes on the same side are arranged in a staggered manner, the spray pipes opposite to each other on the two sides correspond to the suction pipes in a spraying manner, a plurality of nozzles 5 facing the electroplating plate are arranged on the spray pipes, and a plurality of suction nozzles facing the electroplating plate are arranged on the suction pipes; a plurality of auxiliary suction pipes 7 are vertically erected in parallel outside the spray pipe and the suction pipes, and a plurality of suction nozzles back to the electroplating plate (also pointing to the anode) are arranged on the auxiliary suction pipes.
The auxiliary suction pipe is positioned at the rear position of the spray pipe.
The bottom end of the spray pipe is communicated with a horizontally arranged liquid spraying pressure equalizing main pipe 8, and the bottom ends of the suction pipe and the auxiliary suction pipe are communicated with a horizontal liquid suction main pipe 9.
The suction nozzle on the suction pipe is in a long hole shape, so that the stirring circulation of the liquid medicine is facilitated.
The liquid spraying pressure equalizing main pipe and the liquid absorbing main pipe are respectively connected with respective hydraulic pumps through pipelines.
The two sides of the elongated hole suction nozzle on the suction pipe are provided with sheet-shaped baffles which have guiding functions and extend out (the auxiliary suction pipe is not provided with the sheet-shaped baffles), and the included angle range of the sheet-shaped baffles and the vertical symmetrical plane of the suction nozzle is plus or minus 45 degrees, preferably 26 degrees.
The electroplating tank is internally provided with a main moving track, an electroplating hanger is arranged on the electroplating track, and the electroplating plate is clamped by the hanger and moves vertically under the traction of the main moving track.
The spray pipe, the suction pipe and the auxiliary suction pipe are all made of corrosion-resistant PVC pipes.
The back auxiliary suction pipe is arranged to enable the relatively stable liquid medicine near the anode to be sucked back at the same time, and the liquid medicine sucked by the two suction pipes can neutralize the concentration of the liquid medicine to increase the circulation of the liquid medicine. The auxiliary suction pipe can suck the liquid medicine on the periphery of the electroplating plate at the same time, so that the liquid medicine in the whole tank body can be uniformly added. Meanwhile, if the anode is titanium blue, the auxiliary suction pipe can suck the chemical liquid which is filled with copper ions around the titanium blue, so that the chemical liquid sprayed by the spray pipe can be kept at a uniform and stable concentration on the electroplating plate.
The invention adopts a mode of 'one-spraying and one-sucking staggered' and additionally arranging an auxiliary suction pipe, so that the electroplating solution in the electroplating bath circularly and repeatedly flows in the high aspect ratio holes of the electroplating plate and the electroplating bath, and the electroplating capacity and uniformity of the high aspect ratio holes are greatly improved.
The invention has the following advantages: the electroplating plate moves vertically on a vertical continuous electroplating line, and spray pipes and suction pipes are distributed on two sides of the electroplating plate in a staggered manner, so that electroplating solution in the spray pipes on the A surface can flow to the suction pipes on the B surface from the A surface for one hole on the plate surface, and electroplating solution in the spray pipes on the B surface can flow to the suction pipes on the A surface at the next moment. The electroplating solution in the holes is continuously updated and alternated to be fully supplemented, and the high aspect ratio electroplating reliability and electroplating uniformity are met. Secondly, because the anodes are arranged at two positions, the continuous electroplating state is always kept in the electroplating process, and the multilayer layering condition caused by the electroplating interval can not occur
The sheet-shaped baffle is arranged on the suction nozzle, and the sheet-shaped baffle and the suck-back strip-shaped holes form a certain opening angle, so that the sucked liquid medicine has certain target property and can be sucked by the liquid medicine sprayed out by the spray pipe which is closer to the periphery of the plate surface or even the opposite spray pipe; secondly, after the flaky baffle is added, the liquid medicine sprayed by the spray pipes on the left side and the right side of the same side of the suction pipe is not easy to be sucked, and a local small circulation state is not easy to form.
Drawings
FIG. 1 is a schematic side view of a conventional vertical continuous plating apparatus;
FIG. 2 is a schematic top view of a conventional vertical continuous plating apparatus (showing only a nozzle and a plating plate);
FIG. 3 is a schematic front view of an embodiment of the present invention;
FIG. 4 is a schematic top view of an embodiment of the present invention;
FIG. 5 is a left side view of an embodiment of the present invention;
FIG. 6 is a schematic perspective view of an embodiment of the present invention (showing only the nozzle and the plating plate)
FIG. 7 is a schematic front view of a straw according to an embodiment of the present invention;
FIG. 8 is a schematic top view of a straw according to an embodiment of the present invention;
FIG. 9 is a left side view of a straw according to an embodiment of the present invention;
FIG. 10 is a perspective view of a straw according to an embodiment of the present invention.
Reference numerals in the figures refer to: 1-electroplating a plate; 2-an anode; 3-spraying a pipe; 4-a straw; 5-a nozzle; 6-a sheet baffle; 7-auxiliary suction pipe; 8-pressure equalizing main pipe; 9-main pipette.
Detailed Description
Fig. 1 and 2 are schematic views of a vertical continuous plating apparatus of the prior art.
Referring to fig. 3-10, embodiments of a vertical continuous electroplating bath for uniformly electroplating high aspect ratio holes on a plated board are shown.
The electroplating plate 1 vertically and vertically passes through the electroplating bath continuously, the electroplating plate in the electroplating bath is a cathode, anodes 2 are arranged on two sides of the electroplating plate, a plurality of spray pipes 3 and suction pipes 4 are vertically arranged between two sides of the electroplating plate and the anode in parallel, the spray pipes and the suction pipes on the same side are arranged in a staggered manner, the spray pipes and the suction pipes opposite to each other on two sides are correspondingly arranged, a plurality of nozzles 5 facing the electroplating plate are arranged on the spray pipes, and a plurality of suction nozzles facing the electroplating plate are arranged on the suction pipes; a plurality of auxiliary suction pipes 7 which are positioned at the rear part of the spray pipe are vertically arranged at the outer sides of the spray pipe and the suction pipes in parallel, and a plurality of suction nozzles which are back to the electroplating plate (namely, point to the anode) are arranged on the auxiliary suction pipes.
The suction nozzle on the suction pipe is a strip-shaped hole, the two sides of the suction nozzle are provided with the sheet-shaped baffles 6 with the guiding function and extending out (the auxiliary suction pipe is not provided with the suction nozzle), the included angle between the sheet-shaped baffles and the vertical symmetrical plane of the suction nozzle is 45 degrees, and the preferred angle is 26 degrees in the embodiment. A plurality of fixing pieces are arranged between the two flaky baffles for reinforcing and supporting.
The spray pipe, the suction pipe and the auxiliary suction pipe are all closed at the top ends, the bottom end of the spray pipe is communicated with two liquid spraying pressure-equalizing main pipes 8 horizontally arranged at the bottom of the electroplating bath, the bottom ends of the suction pipe and the auxiliary suction pipe are communicated with two liquid absorption main pipes (9) horizontally arranged at the bottom of the electroplating bath, the liquid absorption main pipes 9, and the liquid spraying pressure-equalizing main pipes and the liquid absorption main pipes are respectively connected with respective hydraulic pumps through. The spray pipe, the suction pipe and the auxiliary suction pipe are all made of corrosion-resistant PVC pipes.
The electroplating bath is provided with a main moving track, an electroplating hanger is arranged on the track, and an electroplating plate is clamped by the hanger and moves vertically under the traction of the main moving track.
In the embodiment, the spraying liquid pressure equalizing main pipe is arranged at the bottommost part of the electroplating bath body, a plurality of hole sites are arranged on the spraying liquid pressure equalizing main pipe, a plurality of parallel spray pipes are vertically arranged on the hole sites, and a plurality of nozzles for spraying the plating solution are vertically arranged on each spray pipe. The imbibition is responsible for and installs the back upper place of being responsible for at the hydrojet pressure-sharing, and a plurality of bleeder are stretched out to imbibition is responsible for the parallel on top surface, and the bleeder top is plugged up, installs a straw on every branch, has seted up a plurality of hole sites on the imbibition is responsible for, is provided with a plurality of parallel resorption auxiliary tubes on these hole sites, and the resorption auxiliary tube opening is towards the positive pole. Behind the main suction pipe, the suction pipe is arranged in parallel with the spray pipe through the branch. In the present embodiment, the nozzles and the suction pipes are arranged in a staggered manner, i.e. one suction pipe is installed between every two nozzles.
The main moving track in the embodiment adopts belt transmission, the belt pulley moves under the driving of the variable frequency motor, a plurality of electroplating hangers are hung on the belt, and the electroplating plate is clamped by the hangers and vertically moves under the traction of the main moving track.
The application discloses a vertical continuous electroplating tank with high-longitudinal-transverse holes, which aims to continuously circulate the liquid medicine in the holes of an electroplating plate and replenish new liquid medicine at any time, and the parts with similar structures and concepts are all within the protection scope of the patent.
Claims (9)
1. The utility model provides a can realize electroplating perpendicular continuous plating bath that board high aspect ratio hole was evenly electroplated, electroplating board (1) erect perpendicularly and pass through the plating bath in succession, electroplating the board and being the negative pole in the plating bath, electroplating the both sides of board and being equipped with positive pole (2), characterized by: a plurality of spray pipes (3) and suction pipes (4) are vertically arranged between the two sides of the electroplating plate and the anode in parallel, the spray pipes and the suction pipes on the same side are arranged in a staggered manner, the spray pipes and the suction pipes on the two opposite sides correspond to each other in a spraying and sucking manner, a plurality of nozzles (5) facing the electroplating plate are arranged on the spray pipes, and a plurality of suction nozzles facing the electroplating plate are arranged on the suction pipes; a plurality of auxiliary suction pipes (7) are vertically arranged on the outer sides of the spray pipe and the suction pipes in parallel, and a plurality of suction nozzles back to the electroplating plate are arranged on the auxiliary suction pipes.
2. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the auxiliary suction pipe (7) is positioned at the rear position of the spray pipe (3).
3. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the spray pipe, the suction pipe and the auxiliary suction pipe are all closed at the top ends, the bottom end of the spray pipe is communicated with a horizontally arranged liquid spraying pressure equalizing main pipe (8), the bottom ends of the suction pipe and the auxiliary suction pipe are communicated with a horizontally arranged liquid suction main pipe (9), and the liquid spraying pressure equalizing main pipe and the liquid suction main pipe are respectively connected with respective hydraulic pumps through pipelines.
4. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the suction nozzle on the suction pipe is in a long hole shape.
5. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the two sides of the elongated hole suction nozzle on the suction pipe are provided with sheet-shaped baffles which have guiding functions and extend out, and the included angle range of the sheet-shaped baffles and the vertical symmetrical plane of the suction nozzle is plus or minus 45 degrees.
6. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 5, wherein: the included angle range of the sheet-shaped baffle and the vertical symmetrical plane of the suction nozzle is 26 degrees.
7. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated board as claimed in claim 6, wherein: a fixing sheet is arranged between the two sheet-shaped baffles for reinforcing and supporting.
8. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the electroplating tank is internally provided with a main moving track, an electroplating hanger is arranged on the electroplating track, and the electroplating plate is clamped by the hanger and moves vertically under the traction of the main moving track.
9. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the spray pipe, the suction pipe and the auxiliary suction pipe are all made of corrosion-resistant PVC pipes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110233970.6A CN113151871A (en) | 2021-03-03 | 2021-03-03 | Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110233970.6A CN113151871A (en) | 2021-03-03 | 2021-03-03 | Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate |
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| Publication Number | Publication Date |
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| CN113151871A true CN113151871A (en) | 2021-07-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110233970.6A Pending CN113151871A (en) | 2021-03-03 | 2021-03-03 | Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate |
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| CN (1) | CN113151871A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116103732A (en) * | 2023-03-22 | 2023-05-12 | 苏州太阳井新能源有限公司 | Vertical electroplating device, equipment and method |
-
2021
- 2021-03-03 CN CN202110233970.6A patent/CN113151871A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116103732A (en) * | 2023-03-22 | 2023-05-12 | 苏州太阳井新能源有限公司 | Vertical electroplating device, equipment and method |
| CN116103732B (en) * | 2023-03-22 | 2024-03-08 | 苏州太阳井新能源有限公司 | Vertical electroplating device, equipment and method |
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