CN215251253U - Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate - Google Patents
Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate Download PDFInfo
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- CN215251253U CN215251253U CN202120472989.1U CN202120472989U CN215251253U CN 215251253 U CN215251253 U CN 215251253U CN 202120472989 U CN202120472989 U CN 202120472989U CN 215251253 U CN215251253 U CN 215251253U
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- 238000009713 electroplating Methods 0.000 title claims abstract description 145
- 239000007921 spray Substances 0.000 claims abstract description 47
- 238000005507 spraying Methods 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims description 44
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 239000003814 drug Substances 0.000 description 25
- 239000010902 straw Substances 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005213 imbibition Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- KUYVNGGTWMVWAF-UHFFFAOYSA-N iridium(3+) oxygen(2-) titanium(4+) Chemical compound [O-2].[Ti+4].[Ir+3] KUYVNGGTWMVWAF-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a can realize electroplating perpendicular continuous plating bath that board high aspect ratio hole was evenly electroplated, electroplating board (1) through the plating bath perpendicularly erectly in succession, electroplating the board in the plating bath and being the negative pole, electroplating the both sides of board and being equipped with positive pole (2), characterized by: a plurality of spray pipes (3) and suction pipes (4) are vertically arranged between the two sides of the electroplating plate and the anode in parallel, the spray pipes and the suction pipes on the same side are arranged in a staggered manner, the spray pipes and the suction pipes opposite to each other on the two sides are correspondingly arranged in a spraying manner, a plurality of nozzles (5) facing the electroplating plate are arranged on the spray pipes, and a plurality of suction nozzles facing the electroplating plate are arranged on the suction pipes; a plurality of auxiliary suction pipes (7) are vertically arranged on the outer sides of the spray pipe and the suction pipes in parallel, and a plurality of suction nozzles back to the electroplating plate are arranged on the auxiliary suction pipes. The utility model discloses can effectively promote the homogeneity of electroplating plate high aspect ratio hole.
Description
Technical Field
The utility model relates to a vertical continuous electroplating device for an electroplating plate, in particular to a spray-suction staggered vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of the electroplating plate.
Background
In the fields of electronics, communications, military industry, and the like, electroplating has become a very important surface treatment method in order to achieve electrical conductivity, oxidation resistance, and wear resistance of products. Taking copper plating as an example (the same applies to other metal structures), electroplating is performed by taking a plating plate as a cathode and taking an iridium titanium oxide net or a titanium basket as an anode.
Currently, electroplating production increasingly uses vertical continuous electroplating equipment (vertical continuous plating), as shown in fig. 1 and 2. The traditional vertical continuous electroplating equipment adopts a structure that a pair of pressure equalizing pipes which are not communicated with each other are arranged at the bottom of an electroplating bath, the two pressure equalizing pipes are respectively connected with respective hydraulic pumps through pipelines, and electroplating solution is sprayed by the hydraulic pumps in a pumping mode. A plurality of vertical spray pipes are communicated in parallel with the upper surface of the pressure equalizing pipe, a plurality of horizontal inward spray holes are drilled on the spray pipes, and electroplating liquid is sprayed out of the spray holes. The electroplating plate is arranged between the spray pipes which are symmetrically arranged, and both sides of the electroplating plate are sprayed with electroplating solution in the mode.
The above conventional techniques mainly have problems: the main spraying directions of the spraying pipes of the hydraulic pump are the directions of the electroplating plate, so that the liquid medicine in the area of the electroplating plate can be well circulated by the spraying pipes, but in addition, the liquid medicine is poorly circulated due to no spraying pipe device for stirring in other areas of the tank body; secondly, a fifth generation mobile communication system 5G becomes a hotspot of the communication industry, and an important step of realizing the 5G is uniform electroplating of a high-aspect-ratio hole (the ratio of the depth to the aperture of the hole on the electroplating plate reaches 8: 1-20: 1). In order to realize high-density interconnection, the diameter of the hole on the electroplating plate is smaller and deeper, and the depth of the hole is deeper and deeper. The existing electroplating technology can only be suitable for electroplating plates with the aspect ratio of less than 6:1, because electroplating solution is sprayed on two sides of the electroplating plate, spraying pressure on two sides is offset, and the exchange of the electroplating solution of holes with high aspect ratio cannot be met, so that the electroplating of the holes with high aspect ratio is not uniform enough, and the electroplating often only occurs at the orifice accessories and the plate surface. In addition, other liquid medicines in the liquid medicine tank can not participate in liquid medicine exchange all the time, and the exchange efficiency is limited.
Chinese utility model patent "spray-suction type plating bath" with publication number CN103668403B discloses a spray-suction type plating bath, which includes: the electroplating device comprises a tank body, a plurality of electroplating plates and a plurality of connecting rods, wherein the tank body is internally provided with an accommodating space for accommodating electroplating liquid, a cathode electrode is arranged in the accommodating space, the cathode electrode can be provided with an electroplating plate which is provided with a through hole and is defined to extend along the longitudinal direction, and an anode electrode is arranged on one side of the electroplating plate in the accommodating space; the spraying device is arranged in the accommodating space of the tank body and is positioned on the same side of the electroplating plate and the anode electrode, and the spraying device is provided with a nozzle facing the electroplating plate and used for spraying the electroplating solution towards the electroplating plate; the suction device is arranged in the accommodating space of the tank body and is positioned on one side of the electroplating plate opposite to the spraying device, and the suction device is provided with a suction inlet for sucking the electroplating solution in the accommodating space and enabling the electroplating solution to be sprayed out of the spraying device together with the spraying device and flow to the suction device through the holes of the electroplating plate.
The cathode electrode can drive the electroplating plate to move longitudinally in the accommodating space of the tank body, and devices on two sides of the electroplating plate are arranged alternately in the accommodating space along the longitudinal direction.
However, the patent has the following disadvantages: firstly, because only spray and inhale correspondingly at electroplating board both sides, can make the liquid medicine circulation in the plating bath elsewhere not ideal enough, and because under the state of continuously electroplating, copper ion and additive in the liquid medicine near electroplating board both sides reduce because of being consumed, lead to that the liquid medicine concentration of electroplating board regional near can reduce to some extent and can't maintain the liquid medicine concentration that can normally operate, so will influence the electroplating effect in hole. Secondly, the patent design only adopts a single-sided anode matched with a spraying nozzle for electroplating, and then recovers the liquid medicine through a suction pipe, and the design idea is to ensure that the current and the liquid medicine flow enter the hole together during electroplating. However, such a design would change the electroplating on both sides of the electroplated plate into "intermittent" electroplating, which is prone to multi-layer delamination and not good for the electroplated product. Finally, because the suction tube does not have a suction-guiding device, if only one tube is used alone with no special design of the nozzle, the situation of ineffective suction is easy to occur because the pressurizing strength is much lower than the sprayed liquid medicine when the liquid medicine is sucked by the hydraulic pump.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a vertical continuous electroplating bath is provided, which can effectively improve the electroplating uniformity of the electroplating plate with high aspect ratio holes.
Solve above-mentioned technical problem, the utility model discloses the technical scheme who adopts as follows.
The utility model provides a can realize electroplating the even perpendicular continuous plating bath of electroplating board high aspect ratio hole, electroplating board 1 erect ground perpendicularly and pass through the plating bath in succession, electroplating the board and being the negative pole in the plating bath, electroplating the both sides of board and being equipped with positive pole 2, characterized by: a plurality of spray pipes 3 and suction pipes 4 are vertically arranged between the two sides of the electroplating plate and the anode in parallel, the spray pipes and the suction pipes on the same side are arranged in a staggered manner, the spray pipes opposite to each other on the two sides correspond to the suction pipes in a spraying manner, a plurality of nozzles 5 facing the electroplating plate are arranged on the spray pipes, and a plurality of suction nozzles facing the electroplating plate are arranged on the suction pipes; a plurality of auxiliary suction pipes 7 are vertically erected in parallel outside the spray pipe and the suction pipes, and a plurality of suction nozzles back to the electroplating plate (also pointing to the anode) are arranged on the auxiliary suction pipes.
The auxiliary suction pipe is positioned at the rear position of the spray pipe.
The bottom end of the spray pipe is communicated with a horizontally arranged liquid spraying pressure equalizing main pipe 8, and the bottom ends of the suction pipe and the auxiliary suction pipe are communicated with a horizontal liquid suction main pipe 9.
The suction nozzle on the suction pipe is in a long hole shape, so that the stirring circulation of the liquid medicine is facilitated.
The liquid spraying pressure equalizing main pipe and the liquid absorbing main pipe are respectively connected with respective hydraulic pumps through pipelines.
The two sides of the elongated hole suction nozzle on the suction pipe are provided with sheet-shaped baffles which have guiding functions and extend out (the auxiliary suction pipe is not provided with the sheet-shaped baffles), and the included angle range of the sheet-shaped baffles and the vertical symmetrical plane of the suction nozzle is plus or minus 45 degrees, preferably 26 degrees.
The electroplating tank is internally provided with a main moving track, an electroplating hanger is arranged on the electroplating track, and the electroplating plate is clamped by the hanger and moves vertically under the traction of the main moving track.
The spray pipe, the suction pipe and the auxiliary suction pipe are all made of corrosion-resistant PVC pipes.
The back auxiliary suction pipe is arranged to enable the relatively stable liquid medicine near the anode to be sucked back at the same time, and the liquid medicine sucked by the two suction pipes can neutralize the concentration of the liquid medicine to increase the circulation of the liquid medicine. The auxiliary suction pipe can suck the liquid medicine on the periphery of the electroplating plate at the same time, so that the liquid medicine in the whole tank body can be uniformly added. Meanwhile, if the anode is titanium blue, the auxiliary suction pipe can suck the chemical liquid which is filled with copper ions around the titanium blue, so that the chemical liquid sprayed by the spray pipe can be kept at a uniform and stable concentration on the electroplating plate.
The utility model discloses a mode of "one spouts a suction staggering" and plus supplementary straw makes the plating solution flow at electroplating board high aspect ratio hole and plating bath inner loop reciprocating in the plating bath, makes the electroplating ability and the homogeneity in high aspect ratio hole promote by a wide margin.
The utility model has the advantages of it is following: the electroplating plate moves vertically on a vertical continuous electroplating line, and spray pipes and suction pipes are distributed on two sides of the electroplating plate in a staggered manner, so that electroplating solution in the spray pipes on the A surface can flow to the suction pipes on the B surface from the A surface for one hole on the plate surface, and electroplating solution in the spray pipes on the B surface can flow to the suction pipes on the A surface at the next moment. The electroplating solution in the holes is continuously updated and alternated to be fully supplemented, and the high aspect ratio electroplating reliability and electroplating uniformity are met. Secondly, because the anodes are arranged at two positions, the continuous electroplating state is always kept in the electroplating process, and the multilayer layering condition caused by the electroplating interval can not occur.
The sheet-shaped baffle is arranged on the suction nozzle, and the sheet-shaped baffle and the suck-back strip-shaped holes form a certain opening angle, so that the sucked liquid medicine has certain target property and can be sucked by the liquid medicine sprayed out by the spray pipe which is closer to the periphery of the plate surface or even the opposite spray pipe; secondly, after the flaky baffle is added, the liquid medicine sprayed by the spray pipes on the left side and the right side of the same side of the suction pipe is not easy to be sucked, and a local small circulation state is not easy to form.
Drawings
FIG. 1 is a schematic side view of a conventional vertical continuous plating apparatus;
FIG. 2 is a schematic top view of a conventional vertical continuous plating apparatus (showing only a nozzle and a plating plate);
fig. 3 is a schematic front view of an embodiment of the present invention;
fig. 4 is a schematic top view of an embodiment of the present invention;
fig. 5 is a left side view of the embodiment of the present invention;
FIG. 6 is a perspective view of an embodiment of the present invention (only the nozzle tube and the plating plate are shown);
FIG. 7 is a schematic front view of a straw according to an embodiment of the present invention;
FIG. 8 is a schematic top view of a straw according to an embodiment of the present invention;
FIG. 9 is a left side view of the straw according to the embodiment of the present invention;
fig. 10 is a perspective view of a straw according to an embodiment of the present invention.
Reference numerals in the figures refer to: 1-electroplating a plate; 2-an anode; 3-spraying a pipe; 4-a straw; 5-a nozzle; 6-a sheet baffle; 7-auxiliary suction pipe; 8-pressure equalizing main pipe; 9-main pipette.
Detailed Description
Fig. 1 and 2 are schematic views of a vertical continuous plating apparatus of the prior art.
Referring to fig. 3 to 10, embodiments of a vertical continuous electroplating bath for uniformly electroplating high aspect ratio holes of a plated board according to the present invention are shown.
The electroplating plate 1 vertically and vertically passes through the electroplating bath continuously, the electroplating plate in the electroplating bath is a cathode, anodes 2 are arranged on two sides of the electroplating plate, a plurality of spray pipes 3 and suction pipes 4 are vertically arranged between two sides of the electroplating plate and the anode in parallel, the spray pipes and the suction pipes on the same side are arranged in a staggered manner, the spray pipes and the suction pipes opposite to each other on two sides are correspondingly arranged, a plurality of nozzles 5 facing the electroplating plate are arranged on the spray pipes, and a plurality of suction nozzles facing the electroplating plate are arranged on the suction pipes; a plurality of auxiliary suction pipes 7 which are positioned at the rear part of the spray pipe are vertically arranged at the outer sides of the spray pipe and the suction pipes in parallel, and a plurality of suction nozzles which are back to the electroplating plate (namely, point to the anode) are arranged on the auxiliary suction pipes.
The suction nozzle on the suction pipe is a strip-shaped hole, the two sides of the suction nozzle are provided with the sheet-shaped baffles 6 with the guiding function and extending out (the auxiliary suction pipe is not provided with the suction nozzle), the included angle between the sheet-shaped baffles and the vertical symmetrical plane of the suction nozzle is 45 degrees, and the preferred angle is 26 degrees in the embodiment. A plurality of fixing pieces are arranged between the two flaky baffles for reinforcing and supporting.
The spray pipe, the suction pipe and the auxiliary suction pipe are all closed at the top ends, the bottom end of the spray pipe is communicated with two liquid spraying pressure-equalizing main pipes 8 horizontally arranged at the bottom of the electroplating bath, the bottom ends of the suction pipe and the auxiliary suction pipe are communicated with two liquid absorption main pipes (9) horizontally arranged at the bottom of the electroplating bath, the liquid absorption main pipes 9, and the liquid spraying pressure-equalizing main pipes and the liquid absorption main pipes are respectively connected with respective hydraulic pumps through pipelines. The spray pipe, the suction pipe and the auxiliary suction pipe are all made of corrosion-resistant PVC pipes.
The electroplating bath is provided with a main moving track, an electroplating hanger is arranged on the track, and an electroplating plate is clamped by the hanger and moves vertically under the traction of the main moving track.
In the embodiment, the spraying liquid pressure equalizing main pipe is arranged at the bottommost part of the electroplating bath body, a plurality of hole sites are arranged on the spraying liquid pressure equalizing main pipe, a plurality of parallel spray pipes are vertically arranged on the hole sites, and a plurality of nozzles for spraying the plating solution are vertically arranged on each spray pipe. The imbibition is responsible for and installs the back upper place of being responsible for at the hydrojet pressure-sharing, and a plurality of bleeder are stretched out to imbibition is responsible for the parallel on top surface, and the bleeder top is plugged up, installs a straw on every branch, has seted up a plurality of hole sites on the imbibition is responsible for, is provided with a plurality of parallel resorption auxiliary tubes on these hole sites, and the resorption auxiliary tube opening is towards the positive pole. Behind the main suction pipe, the suction pipe is arranged in parallel with the spray pipe through the branch. In the present embodiment, the nozzles and the suction pipes are arranged in a staggered manner, i.e. one suction pipe is installed between every two nozzles.
The main moving track in the embodiment adopts belt transmission, the belt pulley moves under the driving of the variable frequency motor, a plurality of electroplating hangers are hung on the belt, and the electroplating plate is clamped by the hangers and vertically moves under the traction of the main moving track.
The application discloses a vertical continuous electroplating tank with high-longitudinal-transverse holes, which aims to continuously circulate the liquid medicine in the holes of an electroplating plate and replenish new liquid medicine at any time, and the parts with similar structures and concepts are all within the protection scope of the patent.
Claims (9)
1. The utility model provides a can realize electroplating perpendicular continuous plating bath that board high aspect ratio hole was evenly electroplated, electroplating board (1) erect perpendicularly and pass through the plating bath in succession, electroplating the board and being the negative pole in the plating bath, electroplating the both sides of board and being equipped with positive pole (2), characterized by: a plurality of spray pipes (3) and suction pipes (4) are vertically arranged between the two sides of the electroplating plate and the anode in parallel, the spray pipes and the suction pipes on the same side are arranged in a staggered manner, the spray pipes and the suction pipes on the two opposite sides correspond to each other in a spraying and sucking manner, a plurality of nozzles (5) facing the electroplating plate are arranged on the spray pipes, and a plurality of suction nozzles facing the electroplating plate are arranged on the suction pipes; a plurality of auxiliary suction pipes (7) are vertically arranged on the outer sides of the spray pipe and the suction pipes in parallel, and a plurality of suction nozzles back to the electroplating plate are arranged on the auxiliary suction pipes.
2. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the auxiliary suction pipe (7) is positioned at the rear position of the spray pipe (3).
3. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the spray pipe, the suction pipe and the auxiliary suction pipe are all closed at the top ends, the bottom end of the spray pipe is communicated with a horizontally arranged liquid spraying pressure equalizing main pipe (8), the bottom ends of the suction pipe and the auxiliary suction pipe are communicated with a horizontally arranged liquid suction main pipe (9), and the liquid spraying pressure equalizing main pipe and the liquid suction main pipe are respectively connected with respective hydraulic pumps through pipelines.
4. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the suction nozzle on the suction pipe is in a long hole shape.
5. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the two sides of the elongated hole suction nozzle on the suction pipe are provided with sheet-shaped baffles which have guiding functions and extend out, and the included angle range of the sheet-shaped baffles and the vertical symmetrical plane of the suction nozzle is plus or minus 45 degrees.
6. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 5, wherein: the included angle range of the sheet-shaped baffle and the vertical symmetrical plane of the suction nozzle is 26 degrees.
7. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated board as claimed in claim 6, wherein: a fixing sheet is arranged between the two sheet-shaped baffles for reinforcing and supporting.
8. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the electroplating bath is provided with a main moving track, an electroplating hanger is arranged on the main moving track, and the electroplating plate is clamped by the hanger and moves vertically under the traction of the main moving track.
9. The vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes on an electroplated plate as claimed in claim 1, wherein: the spray pipe, the suction pipe and the auxiliary suction pipe are all made of corrosion-resistant PVC pipes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120472989.1U CN215251253U (en) | 2021-03-03 | 2021-03-03 | Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120472989.1U CN215251253U (en) | 2021-03-03 | 2021-03-03 | Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate |
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| Publication Number | Publication Date |
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| CN215251253U true CN215251253U (en) | 2021-12-21 |
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| CN202120472989.1U Active CN215251253U (en) | 2021-03-03 | 2021-03-03 | Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate |
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| CN (1) | CN215251253U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113151871A (en) * | 2021-03-03 | 2021-07-23 | 广州明毅电子机械有限公司 | Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate |
-
2021
- 2021-03-03 CN CN202120472989.1U patent/CN215251253U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113151871A (en) * | 2021-03-03 | 2021-07-23 | 广州明毅电子机械有限公司 | Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Vertical continuous plating bath that can realize uniform plating of holes with high aspect ratio of plating plate Effective date of registration: 20230110 Granted publication date: 20211221 Pledgee: Zengcheng sub branch of Bank of Guangzhou Co.,Ltd. Pledgor: GUANGZHOU MING YI ELECTRONIC MACHINERY Co.,Ltd. Registration number: Y2023980030728 |