CN113146049A - Laser processing device and method for realizing super-hydrophobic metal micro-part - Google Patents
Laser processing device and method for realizing super-hydrophobic metal micro-part Download PDFInfo
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- CN113146049A CN113146049A CN202110419441.5A CN202110419441A CN113146049A CN 113146049 A CN113146049 A CN 113146049A CN 202110419441 A CN202110419441 A CN 202110419441A CN 113146049 A CN113146049 A CN 113146049A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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Abstract
The invention discloses a laser processing device and a laser processing method for realizing a super-hydrophobic metal micro-part, and the laser processing device comprises a forming system, a modifying system, a cleaning system, a clamp assembly and a control assembly, wherein the clamp assembly clamps a workpiece to be processed and sequentially passes through the forming system, the modifying system and the cleaning system, and the control assembly respectively controls the forming system, the modifying system, the cleaning system and the clamp assembly; preparing a microstructure on the surface of a workpiece by a laser impact imprinting technology, modifying the microstructure by using a low surface energy modifying solution, and further cleaning the microstructure by using absolute ethyl alcohol to obtain a super-hydrophobic surface. Has the advantages that: the invention adopts modules with different functions, and the modules can be changed according to the processing requirements in the processing process to realize different functions of the surface of the workpiece; the whole machining process can be automated and can be completed by one-time clamping, the machining efficiency is high, the operation is convenient, and the production cost can be effectively saved.
Description
Technical Field
The invention relates to a laser processing device and a processing method, in particular to a laser processing device and a processing method for realizing a super-hydrophobic metal micro-part, and belongs to the technical field of laser processing.
Background
The super-hydrophobic property is a water-repellent property of the surface of a material and is one of important characteristics of the surface of a solid, the phenomenon is very common in daily life, and the super-hydrophobic property is defined by that the contact angle of the surface of the material is more than 150 degrees in an experiment. The super-hydrophobic surface has application values in the aspects of self-cleaning, anti-icing and anti-frosting, corrosion resistance, resistance reduction and the like. A plurality of methods exist for preparing the super-hydrophobic surface, and the basic principle of the method is that the super-hydrophobic characteristic of the surface of the material is determined by the surface micro-nano structure of the metal material and the free energy of the surface.
Compared with the traditional physical and chemical methods, the laser impact imprinting method has many advantages, and is a novel manufacturing method improved on the basis of laser impact forming, namely, a micro-mold is added on the basis of laser impact deformation, so that the material can realize precise and controllable microstructure forming. Compared with the traditional micro-processing technology, the laser impact imprinting technology has high precision, diversity and universal applicability, and can realize the rapid high-precision manufacturing of large-area complex microstructures.
Chinese patent CN201911241817.7 discloses a device and a method for preparing a super-hydrophobic micro-part by laser shock forming, namely, a surface micro-protrusion texture is accurately prepared on the surface of a workpiece by the laser shock forming method to regulate and control the wettability of the micro-part, the micro-part with controllable wettability is manufactured, and the durability of the surface of the micro-texture is enhanced. The surface with the micro texture is modified by the low surface energy substance, so that the hydrophobic property of the part can be further improved, but the micro part has small size, so that the problem of difficult clamping exists in the processing process, and the forming precision and the wetting effect of the micro part are finally influenced.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the defects in the prior art, the invention provides a laser processing device and a laser processing method for realizing a super-hydrophobic metal micro part; according to the invention, the automation of the preparation of the super-hydrophobic surface is realized through laser impact imprinting forming and surface modification, so that the secondary clamping of the micro-part during the subsequent surface modification can be avoided, and the processing efficiency is improved.
The technical scheme is as follows: a laser processing device for realizing a super-hydrophobic metal micro-part comprises a forming system, a modifying system, a cleaning system, a clamp assembly and a control assembly, wherein the clamp assembly clamps a workpiece to be processed and sequentially passes through the forming system, the modifying system and the cleaning system, and the control assembly respectively controls the forming system, the modifying system, the cleaning system and the clamp assembly;
the forming system comprises a laser assembly, a constraint layer, an absorption layer, a soft film, a forming module supporting platform and a forming module positioning assembly, wherein laser generated by the laser assembly penetrates through the constraint layer and irradiates on the absorption layer to cause plasma explosion to generate high-pressure shock waves, the shock waves are transmitted to a workpiece through the soft film, the lower surface of the workpiece is in contact with the forming module, a concave forming part is arranged on the surface of the forming module, which is in contact with the workpiece, and a sawtooth-shaped convex part is arranged at the bottom of the forming part; the forming module positioning assembly controls the position degree of the forming module supporting platform so as to control the forming module to be in contact with the lower surface of the workpiece;
the modification system comprises a modification module, a modification module supporting platform, a modification module positioning assembly and a modification liquid container assembly, wherein the modification module positioning assembly controls the position degree of the modification module supporting platform so as to control the modification module to be in contact with the processing surface of the workpiece, the modification liquid container assembly injects modification solution into the modification module, and the processing surface of the workpiece is immersed in the modification solution;
the cleaning system comprises a cleaning module, a cleaning module supporting platform, a cleaning module positioning assembly and a cleaning liquid container assembly, wherein the cleaning module positioning assembly controls the position degree of the cleaning module supporting platform so as to control the cleaning module to be in contact with the processing surface of the workpiece;
the clamp assembly comprises a clamp body, a pressing block, a base and a clamp platform, wherein the pressing block and the base are positioned in the clamp body, and the constraint layer, the absorption layer, the soft film and the workpiece are sequentially fixed and stacked between the pressing block and the base from top to bottom; the clamp platform drives the clamp body which finishes clamping to move among the forming system, the decorating system and the cleaning system;
the control assembly comprises a computer, a laser controller, a positioning assembly controller, a supporting platform controller, a clamp platform controller, a container positioning controller and a solution controller; the computer controls the laser assembly through the laser controller; the computer respectively controls the forming module positioning assembly, the decorating module positioning assembly and the cleaning module positioning assembly through the positioning assembly controller; the computer respectively controls the forming module supporting platform, the decorating module supporting platform and the cleaning module supporting platform through the supporting platform controller; the computer controls the movement of the clamp platform through the clamp platform controller; the computer modifies the movement of the liquid container assembly and the cleaning liquid container assembly respectively through the container positioning controller; and the computer respectively modifies the injection of the solution in the solution container assembly and the cleaning solution container assembly through the solution controller.
Further, a solution recovery device is arranged between the modification system and the cleaning system, and the solution recovery device is connected with the container positioning controller and the solution controller; the upper surface of the modification module is provided with a workpiece immersion opening, a solution filling recovery opening and a vent hole; the processing surface of the workpiece is contacted with the solution in the box body through the workpiece immersion opening; the modifying liquid container assembly, the cleaning liquid container assembly and the solution recovery device are communicated with the interior of the box body through a solution filling recovery port; the decoration module and the cleaning module are communicated with the atmosphere through vent holes; and liquid level sensors are arranged in the decoration module and the cleaning module.
Further, a sealing ring is arranged on the periphery of the workpiece immersion opening and is positioned between the upper surface of the box body and the workpiece.
Further, the restraint layer is K9 glass, the absorption layer is black paint, and the soft membrane is polyurethane rubber.
Further, the solution contained in the modification module is a perfluorosilane ethanol solution with the mass ratio of 0.5%.
Further, the solution contained in the cleaning module is absolute ethyl alcohol.
A laser processing method for realizing a superhydrophobic metal micro part according to claim 3, comprising the steps of:
s1, clamping a workpiece, stacking the workpiece, the soft film, the absorption layer and the restraint layer on the base from bottom to top in sequence, pressing a pressing block on the pressing block, fixing the pressing block by using the clamp body, and finally fixedly mounting the clamp assembly with the workpiece on the clamp platform through the clamp body;
s2, forming, wherein the control assembly respectively controls the forming module supporting platform and the clamp platform to move until the forming module contacts with the processing surface of the workpiece; the laser assembly is started by the control assembly, laser generated by the laser assembly penetrates through the constraint layer and irradiates on the absorption layer to cause plasma explosion to generate high-pressure shock waves, the shock waves are transmitted to a workpiece through the soft film, and the processing surface of the workpiece is pressed into the concave forming part of the forming module to form a bulge with a periodic microstructure; separating the workpiece from the forming module, and driving the forming module to return to the initial position by the forming module supporting platform;
s3, workpiece decoration, wherein the control assembly respectively controls the decoration module supporting platform and the clamp platform to move until the decoration module is contacted with the processing surface of the workpiece; the control assembly controls the modification liquid container assembly to fill the modification module with modification solution; immersing the processing surface of the workpiece into a modification solution, separating the workpiece from the modification module after the modification is finished, and driving the modification module to return to the initial position by the modification module supporting platform;
s4, recovering the modified solution, controlling the solution recovery device to suck the modified solution in the modification module by the control assembly, and returning the solution recovery device) to the initial position after the recovery of the modified solution is finished;
s5, cleaning the workpiece, wherein the control assembly respectively controls the cleaning module supporting platform and the clamp platform to move until the cleaning module is contacted with the processing surface of the workpiece; the control assembly controls the cleaning liquid container assembly to fill the cleaning module with cleaning solution; the processing surface of the workpiece is immersed in the cleaning solution, the workpiece is separated from the cleaning module after cleaning is finished, and the cleaning module supporting platform drives the cleaning module to return to the initial position;
s6, recovering the cleaning solution, wherein the control assembly controls the solution recovery device to suck the cleaning solution in the cleaning module, and the solution recovery device returns to the initial position after the cleaning solution is recovered); (ii) a
And S7, disassembling the workpiece, and taking out the workpiece by disassembling the clamp assembly after the workpiece is cleaned to finish machining.
Further, the computer of the control assembly in the step S2 controls the forming module positioning assembly to move to the forming station through the positioning assembly controller; the computer controls the forming module supporting platform to drive the forming module to move through the supporting platform controller, and the forming module is positioned to a forming station through the forming module positioning assembly; the positioning assembly controller controls the forming module positioning assembly to move to a positioning point of the clamp platform, the clamp platform controller controls the clamp platform to move, and the clamp platform is positioned to a forming station through the forming module positioning assembly; the supporting platform controller controls the forming module supporting platform to drive the forming module to move upwards until the upper surface of the forming module is attached to the lower surface of the workpiece, and the forming module stops moving; the positioning assembly controller controls the forming module positioning assembly to move to an initial position;
the computer of the control assembly in the step S3 controls the decoration module positioning assembly to move to the decoration station through the positioning assembly controller; the computer controls the decoration module supporting platform to drive the decoration module to move through the supporting platform controller, and the decoration module is positioned to the decoration station through the decoration module positioning assembly; the positioning assembly controller controls the decoration module positioning assembly to move to a positioning point of the clamp platform, the clamp platform controller controls the clamp platform to move, and the clamp platform is positioned to a decoration station through the decoration module positioning assembly; the supporting platform controller controls the decoration module supporting platform to drive the decoration module to move upwards until the upper surface of the decoration module is attached to the lower surface of the workpiece, and the movement is stopped; the positioning assembly controller controls the decoration module positioning assembly to move to an initial position;
the computer of the control assembly in the step S5 controls the cleaning module positioning assembly to move to the cleaning station through the positioning assembly controller; the computer controls the cleaning module supporting platform to drive the cleaning module to move through the supporting platform controller, and the cleaning module is positioned to the cleaning station through the cleaning module positioning assembly; the positioning assembly controller controls the cleaning module positioning assembly to move to a positioning point of the clamp platform, the clamp platform controller controls the clamp platform to move, and the clamp platform is positioned to a cleaning station through the cleaning module positioning assembly; the supporting platform controller controls the cleaning module supporting platform to drive the cleaning module to move upwards until the upper surface of the cleaning module is attached to the lower surface of the workpiece, and the movement is stopped; the positioning assembly controller controls the cleaning module positioning assembly to move to an initial position.
Further, the time for immersing the processing surface of the workpiece in the dressing solution in step S3 is 2 hours or more.
Further, the time for immersing the processing surface of the workpiece in the cleaning solution in step S5 is 5 minutes or more.
Has the advantages that: 1. the invention adopts the laser impact imprinting technology to prepare the periodic microstructure on the surface of the workpiece, and compared with other methods, the invention has the following advantages:
(1) the precision is high: the periodic microstructure on the surface of the workpiece can be accurately controlled through the microstructure pre-processed on the micro-mould, so that the precise and controllable microstructure forming can be realized;
(2) the efficiency is high: the workpiece with different microstructures can be processed only by changing the micro-mould with different microstructures;
(3) the method has diversity and universal applicability, and can realize rapid and high-precision manufacturing of the complex microstructure with a larger area.
2. The automatic die changing system has the advantages of high accuracy and convenience in operation, and various functions required in the process of preparing the super-hydrophobic surface can be realized by designing modules with different functions.
3. The invention can realize the processing and treatment of the miniature parts, and the whole processing process can be finished under one-time clamping, thereby avoiding secondary clamping and improving the processing precision and the production efficiency.
4. The degree of automation of course of working is high, uses manpower sparingly, raises the efficiency.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic illustration of a laser shock peening operation of the present invention;
FIG. 3 is a schematic view of the forming module structure of the present invention;
FIG. 4 is a schematic view of a workpiece modification state according to the present invention;
FIG. 5 is a schematic view of a cleaning state of a workpiece according to the present invention;
FIG. 6 is a cross-sectional view of a finishing module and cleaning module solution fill recovery port of the present invention;
FIG. 7 is a cross-sectional view of a workpiece immersion opening of a dressing module and a cleaning module of the present invention;
fig. 8 is a top view of the present invention.
Detailed Description
The invention will be further described with reference to the following figures and specific examples, but the scope of the invention is not limited thereto.
As shown in fig. 1, 2, 3, 4, 5 and 8, a laser processing apparatus for realizing a superhydrophobic metal micro part includes a forming system 1, a modifying system 2, a cleaning system 3, a fixture assembly 4 and a control assembly 5, wherein the fixture assembly 4 holds a workpiece 6 to be processed and sequentially passes through the forming system 1, the modifying system 2 and the cleaning system 3, and the control assembly 5 respectively controls the forming system 1, the modifying system 2, the cleaning system 3 and the fixture assembly 4;
the forming system 1 comprises a laser assembly 11, a constraint layer 12, an absorption layer 13, a soft film 14, a forming module 15, a forming module supporting platform 16 and a forming module positioning assembly 17, wherein laser generated by the laser assembly 11 passes through the constraint layer 12 and irradiates on the absorption layer 13 to cause plasma explosion to generate high-pressure shock waves, the shock waves are transmitted to a workpiece 6 through the soft film 14, the lower surface of the workpiece 6 is in contact with the forming module 15, a concave forming part 151 is arranged on the surface of the forming module 15, which is in contact with the workpiece 6, and a saw-toothed convex part 152 is arranged at the bottom of the forming part; the forming module positioning assembly 17 controls the position degree of the forming module supporting platform 16 so as to control the forming module 15 to be in contact with the lower surface of the workpiece 6;
the modification system 2 comprises a modification module 21, a modification module supporting platform 22, a modification module positioning assembly 23 and a modification liquid container assembly 24, wherein the modification module positioning assembly 23 controls the position degree of the modification module supporting platform 22 so as to control the modification module 21 to be in contact with the processing surface of the workpiece 6, the modification liquid container assembly 24 injects modification solution into the modification module 21, and the processing surface of the workpiece 6 is immersed in the modification solution;
the cleaning system 3 comprises a cleaning module 31, a cleaning module supporting platform 32, a cleaning module positioning assembly 33 and a cleaning liquid container assembly 34, wherein the cleaning module positioning assembly 33 controls the position degree of the cleaning module supporting platform 32 so as to control the cleaning module 31 to be in contact with the processing surface of the workpiece 6, the cleaning liquid container assembly 34 injects cleaning liquid into the cleaning module 31, and the processing surface of the workpiece 6 is immersed in the cleaning liquid;
the clamp assembly 4 comprises a clamp body 41, a pressing block 42, a base 43 and a clamp platform 44, wherein the pressing block 42 and the base 43 are positioned in the clamp body 41, and the constraint layer 12, the absorption layer 13, the soft film 14 and the workpiece 6 are sequentially and fixedly stacked between the pressing block 42 and the base 43 from top to bottom; the clamp body 41 which is clamped is fixedly arranged on the clamp platform 44, and the clamp platform 44 drives the clamp body 41 which is clamped to move among the forming system 1, the decorating system 2 and the cleaning system 3;
the control assembly 5 comprises a computer 51, a laser controller 52, a positioning assembly controller 53, a support platform controller 54, a clamp platform controller 55, a container positioning controller 56 and a solution controller 57; the computer 51 controls the laser assembly 11 through the laser controller 52; the computer 51 controls the forming module positioning assembly 17, the decorating module positioning assembly 23 and the cleaning module positioning assembly 33 through the positioning assembly controller 53 respectively; the computer 51 controls the forming module support platform 16, the grooming module support platform 22 and the cleaning module support platform 32, respectively, via the support platform controller 54; the computer 51 controls the movement of the clamp platform 44 via the clamp platform controller 55; the computer 51 modifies the movement of the liquid container assembly 24 and the cleaning liquid container assembly 34, respectively, via the container positioning controller 56; the computer 51 modifies the infusion of solutions into the solution container assembly 24 and the cleaning solution container assembly 34, respectively, via the solution controller 57.
As shown in fig. 6 and 7, a solution recovery device 7 is arranged between the modification system 2 and the cleaning system 3, and the solution recovery device 7 is connected with a container positioning controller 56 and a solution controller 57; the modification module 21 and the cleaning module 31 are box-type structures with the same structure, and the upper surface of the modification module 21 is provided with a workpiece immersion opening 25, a solution filling recovery opening 26 and a vent hole 27; the processing surface of the workpiece 6 is contacted with the solution in the box body through a workpiece immersion opening 25; the decorative liquid container assembly 24, the cleaning liquid container assembly 34 and the solution recovery device 7 are communicated with the interior of the tank body through a solution filling recovery port 26; the decoration module 21 and the cleaning module 31 are communicated with the atmosphere through the vent hole 27; the interior of the dressing module 21 and the cleaning module 31 is provided with a liquid level sensor 28. A level sensor 28 extends from the top to the bottom of the module for detecting whether the module is full of solution and drained of solution; the vent 27 is used to vent gases in the module to facilitate the flow of liquid in and out.
And a sealing ring 29 is arranged on the periphery of the workpiece immersion opening 25, and the sealing ring 29 is positioned between the upper surface of the box body and the workpiece 6. The sealing ring 29 prevents the outflow of liquid during the dressing or cleaning process, and facilitates the dressing or cleaning of a local area of the workpiece 6.
The middle of the clamp platform 44 is provided with a square hole, so that the forming module 15, the modifying module 21 and the cleaning module 31 can conveniently pass through the clamp platform 44 to be contacted with the workpiece 6; each module is secured to the module support platform 16 by a module clamping bolt.
The restraint layer 12 is made of K9 glass, the absorption layer 13 is made of black paint, and the soft film 14 is made of polyurethane rubber. The forming module 15 is a micro-mold, and the surface of the micro-mold is provided with a periodic microstructure at a concave position; the clamp body 41 is divided into a left clamp body and a right clamp body, and a clamp clamping bolt is arranged at the top of the clamp body 41 so as to clamp the micro-part forming system by the clamp body 41 and ensure the accuracy of assembly among all parts; the pressing block 42 and the base 43 are cuboids with square holes in the middle, the square holes of the pressing block 42 are convenient for laser to pass through, and the square holes of the base 43 are convenient for the forming module 15, the dressing module 21 and the cleaning module 31 to penetrate through the clamp platform 44 to be in contact with the workpiece 6.
The solution contained in the modification module 21 is a perfluorosilane ethanol solution with the mass ratio of 0.5% and is used for modifying the workpiece (21) and reducing the surface energy of the workpiece.
The solution contained in the cleaning module 31 is absolute ethyl alcohol and is used for cleaning the modified workpiece 6.
A laser processing method for realizing a super-hydrophobic metal micro part comprises the following steps:
s1, clamping the workpiece, stacking the workpiece 6, the soft film 14, the absorption layer 13 and the restraint layer 12 on the base 43 from bottom to top in sequence, pressing the pressing block 42 on the pressing block, fixing the pressing block by the clamp body 41, and finally fixedly mounting the clamp assembly 4 with the workpiece on the clamp platform 44 through the clamp body 41;
s2, forming, wherein the control assembly 5 respectively controls the forming module supporting platform 16 and the clamp platform 44 to move until the forming module 15 contacts with the processing surface of the workpiece 6; the control assembly 5 starts the laser assembly 11, laser generated by the laser assembly 11 passes through the constraint layer 12 and irradiates on the absorption layer 13 to cause plasma explosion to generate high-pressure shock waves, the shock waves are transmitted to the workpiece 6 through the soft film 14, and the processing surface of the workpiece 6 is pressed into the concave forming part 151 of the forming module 15 to form a bulge with a periodic microstructure; the workpiece 6 is separated from the forming module 15, and the forming module supporting platform 16 drives the forming module 15 to return to the initial position;
the computer 51 of the control assembly 5 controls the forming module positioning assembly 17 to move to the forming station through the positioning assembly controller 53; the computer 51 controls the forming module supporting platform 16 to drive the forming module 15 to move through the supporting platform controller 54, and positions the forming module 15 to a forming station through the forming module positioning assembly 17; the positioning assembly controller 53 controls the forming module positioning assembly 17 to move to the positioning point of the clamp platform 44, the clamp platform controller 55 controls the clamp platform 44 to move, and the clamp platform 44 is positioned to the forming station through the forming module positioning assembly 17; the support platform controller 54 controls the forming module support platform 16 to drive the forming module 15 to move upwards until the upper surface of the forming module 15 is attached to the lower surface of the workpiece 6; the positioning assembly controller 53 controls the forming module positioning assembly 17 to move to the initial position;
s3, workpiece decoration, wherein the control assembly 5 respectively controls the decoration module supporting platform 22 and the clamp platform 44 to move until the decoration module 21 contacts with the processing surface of the workpiece 6; the control assembly 5 controls the modification liquid container assembly 24 to fill the modification module 21 with modification solution; immersing the processing surface of the workpiece 6 into the modifying solution, wherein the time for immersing the processing surface of the workpiece 6 into the modifying solution is more than or equal to 2 hours; after finishing the decoration, the workpiece 6 is separated from the decoration module 21, and the decoration module support platform 22 drives the decoration module 21 to return to the initial position;
the computer 51 of the control assembly 5 controls the decoration module positioning assembly 23 to move to the decoration station through the positioning assembly controller 53; the computer 51 controls the decoration module supporting platform 22 to drive the decoration module 21 to move through the supporting platform controller 54, and positions the decoration module 21 to a decoration station through the decoration module positioning assembly 23; the positioning assembly controller 53 controls the decoration module positioning assembly 23 to move to the positioning point of the fixture platform 44, the fixture platform controller 55 controls the fixture platform 44 to move, and the fixture platform 44 is positioned to the decoration station through the decoration module positioning assembly 23; the supporting platform controller 54 controls the decoration module supporting platform 22 to drive the decoration module 21 to move upwards until the upper surface of the decoration module 21 is attached to the lower surface of the workpiece 6, and then the movement is stopped; the positioning assembly controller 53 controls the decoration module positioning assembly 23 to move to the initial position;
s4, recovering the modification solution, wherein the control assembly 5 controls the solution recovery device 7 to suck the modification solution in the modification module 21, and the solution recovery device 7 returns to the initial position after the recovery of the modification solution is finished;
s5, cleaning the workpiece, wherein the control assembly 5 respectively controls the cleaning module supporting platform 32 and the clamp platform 44 to move until the cleaning module 31 contacts with the processing surface of the workpiece 6; the control assembly 5 controls the cleaning solution container assembly 34 to fill the cleaning module 31 with the cleaning solution; immersing the processing surface of the workpiece 6 into the cleaning solution, wherein the time for immersing the processing surface of the workpiece 6 into the cleaning solution is more than or equal to 5 minutes; after cleaning, the workpiece 6 is separated from the cleaning module 31, and the cleaning module supporting platform 32 drives the cleaning module 31 to return to the initial position;
the computer 51 of the control assembly 5 controls the cleaning module positioning assembly 33 to move to the cleaning station through the positioning assembly controller 53; the computer 51 controls the cleaning module support platform 32 to drive the cleaning module 31 to move through the support platform controller 54, and positions the cleaning module 31 to the cleaning station through the cleaning module positioning assembly 33; the positioning assembly controller 53 controls the cleaning module positioning assembly 33 to move to the positioning point of the clamp platform 44, the clamp platform controller 55 controls the clamp platform 44 to move, and the clamp platform 44 is positioned to the cleaning station through the cleaning module positioning assembly 33; the support platform controller 54 controls the cleaning module support platform 32 to drive the cleaning module 31 to move upwards until the upper surface of the cleaning module 31 is attached to the lower surface of the workpiece 6; the positioning assembly controller 53 controls the cleaning module positioning assembly 33 to move to the initial position;
s6, recovering the cleaning solution, wherein the control assembly 5 controls the solution recovery device 7 to suck the cleaning solution in the cleaning module 31, and the solution recovery device 7 returns to the initial position after the recovery of the cleaning solution is finished; (ii) a
And S7, disassembling the workpiece, and after the workpiece 6 is cleaned, disassembling the clamp assembly 4 to take the workpiece 6 out, thereby finishing machining.
The present invention is not limited to the above-described embodiments, and any obvious improvements, substitutions or modifications can be made by those skilled in the art without departing from the spirit of the present invention.
Claims (10)
1. A laser processing device for realizing a super-hydrophobic metal micro-part comprises a forming system (1), a modifying system (2), a cleaning system (3), a clamp assembly (4) and a control assembly (5), wherein the clamp assembly (4) clamps a workpiece (6) to be processed and sequentially passes through the forming system (1), the modifying system (2) and the cleaning system (3), and the control assembly (5) respectively controls the forming system (1), the modifying system (2), the cleaning system (3) and the clamp assembly (4); the method is characterized in that:
the forming system (1) comprises a laser assembly (11), a constraint layer (12), an absorption layer (13), a soft film (14), a forming module (15), a forming module supporting platform (16) and a forming module positioning assembly (17), laser generated by the laser assembly (11) penetrates through the constraint layer (12) and irradiates on the absorption layer (13) to cause plasma explosion to generate high-pressure shock waves, the shock waves are transmitted to a workpiece (6) through the soft film (14), the lower surface of the workpiece (6) is in contact with the forming module (15), a concave forming part (151) is arranged on the surface of the forming module (15) in contact with the workpiece (6), and a saw-toothed convex part (152) is arranged at the bottom of the forming part; the forming module positioning assembly (17) controls the position degree of a forming module supporting platform (16) so as to control the forming module (15) to be in contact with the lower surface of the workpiece (6);
the modification system (2) comprises a modification module (21), a modification module supporting platform (22), a modification module positioning assembly (23) and a modification liquid container assembly (24), wherein the modification module positioning assembly (23) controls the position degree of the modification module supporting platform (22) so as to control the modification module (21) to be in contact with the processing surface of the workpiece (6), modification solution is injected into the modification module (21) through the modification liquid container assembly (24), and the processing surface of the workpiece (6) is immersed into the modification solution;
the cleaning system (3) comprises a cleaning module (31), a cleaning module supporting platform (32), a cleaning module positioning assembly (33) and a cleaning liquid container assembly (34), wherein the cleaning module positioning assembly (33) controls the position degree of the cleaning module supporting platform (32) so as to control the cleaning module (31) to be in contact with the processing surface of the workpiece (6), the cleaning liquid container assembly (34) injects cleaning liquid into the cleaning module (31), and the processing surface of the workpiece (6) is immersed in the cleaning liquid;
the clamp assembly (4) comprises a clamp body (41), a pressing block (42), a base (43) and a clamp platform (44), wherein the pressing block (42) and the base (43) are positioned in the clamp body (41), and a constraint layer (12), an absorption layer (13), a soft film (14) and a workpiece (6) are sequentially fixed and stacked between the pressing block (42) and the base (43) from top to bottom; the clamp body (41) which finishes clamping is fixedly arranged on a clamp platform (44), and the clamp platform (44) drives the clamp body (41) which finishes clamping to move among the forming system (1), the decorating system (2) and the cleaning system (3);
the control assembly (5) comprises a computer (51), a laser controller (52), a positioning assembly controller (53), a support platform controller (54), a clamp platform controller (55), a container positioning controller (56) and a solution controller (57); the computer (51) controls the laser assembly (11) through the laser controller (52); the computer (51) controls the forming module positioning assembly (17), the decorating module positioning assembly (23) and the cleaning module positioning assembly (33) through the positioning assembly controller (53) respectively; the computer (51) controls the forming module support platform (16), the grooming module support platform (22), and the cleaning module support platform (32) via a support platform controller (54), respectively; the computer (51) controls the movement of the clamp platform (44) via a clamp platform controller (55); the computer (51) modifies the movement of the liquid container assembly (24) and the cleaning liquid container assembly (34) respectively through the container positioning controller (56); the computer (51) modifies the injection of the solution in the solution container assembly (24) and the cleaning solution container assembly (34) respectively through the solution controller (57).
2. The laser processing device for realizing the superhydrophobic metal micro part according to claim 1, wherein: a solution recovery device (7) is arranged between the modification system (2) and the cleaning system (3), and the solution recovery device (7) is connected with the container positioning controller (56) and the solution controller (57); the modification module (21) and the cleaning module (31) are box-type structures with the same structure, and the upper surface of the modification module (21) is provided with a workpiece immersion opening (25), a solution filling recovery opening (26) and a vent hole (27); the processing surface of the workpiece (6) is contacted with the solution in the box body through a workpiece immersion opening (25); the decorative liquid container assembly (24), the cleaning liquid container assembly (34) and the solution recovery device (7) are communicated with the interior of the box body through a solution filling recovery port (26); the decoration module (21) and the cleaning module (31) are communicated with the atmosphere through a vent hole (27); and liquid level sensors (28) are arranged inside the decoration module (21) and the cleaning module (31).
3. The laser processing device for realizing the superhydrophobic metal micro part according to claim 2, wherein: and a sealing ring (29) is arranged on the periphery of the workpiece immersion opening (25), and the sealing ring (29) is positioned between the upper surface of the box body and the workpiece (6).
4. The laser processing device for realizing the superhydrophobic metal micro part according to claim 1, wherein: the restraint layer (12) is K9 glass, the absorption layer (13) is black paint, and the soft film (14) is polyurethane rubber.
5. The laser processing device for realizing the superhydrophobic metal micro part according to claim 1, wherein: the solution contained in the modification module (21) is a perfluorosilane ethanol solution with the mass ratio of 0.5%.
6. The laser processing device for realizing the superhydrophobic metal micro part according to claim 1, wherein: the solution contained in the cleaning module (31) is absolute ethyl alcohol.
7. The laser processing method for realizing the superhydrophobic metal micro-part according to claim 3, comprising the steps of:
s1, clamping the workpiece, stacking the workpiece (6), the soft film (14), the absorption layer (13) and the restraint layer (12) on the base (43) from bottom to top in sequence, pressing the pressing block (42) on the base, fixing the pressing block by using the clamp body (41), and finally fixedly mounting the clamp assembly (4) with the workpiece on the clamp platform (44) through the clamp body (41);
s2, forming, wherein the control assembly (5) respectively controls the forming module supporting platform (16) and the clamp platform (44) to move until the forming module (15) is contacted with the processing surface of the workpiece (6); the control assembly (5) starts the laser assembly (11), laser generated by the laser assembly (11) penetrates through the constraint layer (12) and irradiates the absorption layer (13) to cause plasma explosion to generate high-pressure shock waves, the shock waves are transmitted to the workpiece (6) through the soft film (14), and the processing surface of the workpiece (6) is pressed into the concave forming part (151) of the forming module (15) to form a bulge with a periodic microstructure; the workpiece (6) is separated from the forming module (15), and the forming module supporting platform (16) drives the forming module (15) to return to the initial position;
s3, workpiece modification, wherein the control assembly (5) respectively controls the modification module supporting platform (22) and the clamp platform (44) to move until the modification module (21) is contacted with the processing surface of the workpiece (6); the control assembly (5) controls the modification liquid container assembly (24) to fill modification solution into the modification module (21); the processing surface of the workpiece (6) is immersed in the modifying solution, the workpiece (6) is separated from the modifying module (21) after modification is finished, and the modifying module supporting platform (22) drives the modifying module (21) to return to the initial position;
s4, recovering the modified solution, wherein the control assembly (5) controls the solution recovery device (7) to suck the modified solution in the modification module (21), and the solution recovery device (7)) returns to the initial position after the recovery of the modified solution is finished;
s5, cleaning the workpiece, wherein the control assembly (5) respectively controls the cleaning module supporting platform (32) and the clamp platform (44) to move until the cleaning module (31) is contacted with the processing surface of the workpiece (6); the control assembly (5) controls the cleaning solution container assembly (34) to fill the cleaning module (31) with cleaning solution; the processing surface of the workpiece (6) is immersed in the cleaning solution, the workpiece (6) is separated from the cleaning module (31) after cleaning is finished, and the cleaning module supporting platform (32) drives the cleaning module (31) to return to the initial position;
s6, recovering the cleaning solution, wherein the control assembly (5) controls the solution recovery device (7) to suck the cleaning solution in the cleaning module (31), and the solution recovery device (7)) returns to the initial position after the recovery of the cleaning solution is completed; (ii) a
And S7, disassembling the workpiece, and after the workpiece (6) is cleaned, disassembling the clamp assembly (4) to take out the workpiece (6) to finish machining.
8. The laser processing method for realizing the superhydrophobic metal micro-part according to claim 7, wherein: the computer (51) of the control assembly (5) in the step S2 controls the forming module positioning assembly (17) to move to the forming station through the positioning assembly controller (53); the computer (51) controls the forming module supporting platform (16) to drive the forming module (15) to move through the supporting platform controller (54), and the forming module (15) is positioned to a forming station through the forming module positioning assembly (17); the positioning assembly controller (53) controls the forming module positioning assembly (17) to move to a positioning point of the clamp platform (44), the clamp platform controller (55) controls the clamp platform (44) to move, and the clamp platform (44) is positioned to the forming station through the forming module positioning assembly (17); the supporting platform controller (54) controls the forming module supporting platform (16) to drive the forming module (15) to move upwards until the upper surface of the forming module (15) is attached to the lower surface of the workpiece (6) and stop moving; the positioning assembly controller (53) controls the forming module positioning assembly (17) to move to an initial position;
the computer (51) of the control assembly (5) in the step S3 controls the decorating module positioning assembly (23) to move to the decorating station through the positioning assembly controller (53); the computer (51) controls the decoration module supporting platform (22) to drive the decoration module (21) to move through the supporting platform controller (54), and the decoration module (21) is positioned to a decoration station through the decoration module positioning assembly (23); the positioning assembly controller (53) controls the decoration module positioning assembly (23) to move to a positioning point of the clamp platform (44), the clamp platform controller (55) controls the clamp platform (44) to move, and the clamp platform (44) is positioned to a decoration station through the decoration module positioning assembly (23); the supporting platform controller (54) controls the decoration module supporting platform (22) to drive the decoration module (21) to move upwards until the upper surface of the decoration module (21) is attached to the lower surface of the workpiece (6) and then stops moving; the positioning assembly controller (53) controls the decoration module positioning assembly (23) to move to an initial position;
the computer (51) of the control assembly (5) in the step S5 controls the cleaning module positioning assembly (33) to move to the cleaning station through the positioning assembly controller (53); the computer (51) controls the cleaning module supporting platform (32) to drive the cleaning module (31) to move through the supporting platform controller (54), and the cleaning module (31) is positioned to a cleaning station through the cleaning module positioning assembly (33); the positioning assembly controller (53) controls the cleaning module positioning assembly (33) to move to a positioning point of the clamp platform (44), the clamp platform controller (55) controls the clamp platform (44) to move, and the clamp platform (44) is positioned to the cleaning station through the cleaning module positioning assembly (33); the supporting platform controller (54) controls the cleaning module supporting platform (32) to drive the cleaning module (31) to move upwards until the upper surface of the cleaning module (31) is attached to the lower surface of the workpiece (6) and stop moving; a positioning assembly controller (53) controls movement of the wash module positioning assembly (33) to an initial position.
9. The laser processing method for realizing the superhydrophobic metal micro-part according to claim 7, wherein: in the step S3, the time for which the processing surface of the workpiece (6) is immersed in the finishing solution is 2 hours or more.
10. The laser processing method for realizing the superhydrophobic metal micro-part according to claim 7, wherein: in the step S5, the processing surface of the workpiece (6) is immersed in the cleaning solution for a time of 5 minutes or more.
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