CN113136152A - High-stability electronic adhesive - Google Patents
High-stability electronic adhesive Download PDFInfo
- Publication number
- CN113136152A CN113136152A CN202110322672.4A CN202110322672A CN113136152A CN 113136152 A CN113136152 A CN 113136152A CN 202110322672 A CN202110322672 A CN 202110322672A CN 113136152 A CN113136152 A CN 113136152A
- Authority
- CN
- China
- Prior art keywords
- parts
- reaction kettle
- polystyrene
- electronic adhesive
- liquid formaldehyde
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 18
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 18
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 239000004793 Polystyrene Substances 0.000 claims abstract description 12
- 229920002223 polystyrene Polymers 0.000 claims abstract description 12
- 229920001084 poly(chloroprene) Polymers 0.000 claims abstract description 10
- 229920003048 styrene butadiene rubber Polymers 0.000 claims abstract description 9
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 9
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 9
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 claims abstract description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims abstract description 8
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims abstract description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims abstract description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 27
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- 238000005576 amination reaction Methods 0.000 claims description 3
- 239000004202 carbamide Substances 0.000 claims description 3
- 238000006482 condensation reaction Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 230000007935 neutral effect Effects 0.000 claims description 3
- 238000005070 sampling Methods 0.000 claims description 3
- 230000032683 aging Effects 0.000 abstract description 4
- 231100000956 nontoxicity Toxicity 0.000 abstract description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000003063 flame retardant Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003973 paint Substances 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J111/00—Adhesives based on homopolymers or copolymers of chloroprene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/06—Copolymers with styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention provides an electronic adhesive with high stability, which comprises the following components in parts by mass: 400 parts of chloroprene rubber, 350 parts of thermoplastic styrene-butadiene rubber, 50-80 parts of polystyrene, 5-25 parts of dibutyl phthalate, 300 parts of liquid formaldehyde, 5-15 parts of tetrahydrofuran and 5-25 parts of butyl lithium. After the scheme is adopted, the adhesive has the characteristics of strong adhesive force, no toxicity, heat resistance, aging resistance and the like; meanwhile, the paint is not easy to be affected with damp, and has good water absorption, weather resistance and flame retardant property.
Description
Technical Field
The invention relates to the technical field of electronic glue, in particular to electronic glue with high stability.
Background
At present, the single-component epoxy electronic glue applied to electronic components (such as LED televisions or high-end advertising lamp box backlight lamp bars) has the common problem that the toughness of the glue is not enough, the bonding force and the impact resistance are not up to the standard, and the damage always occurs at the triangular position of a PMMA lens. The anti-falling property of the single-component epoxy electronic adhesive needs to be improved corresponding to the backlight lamp bar applied to the LED television, and meanwhile, thermosol, unsaturated resin and curing agent applied to electronic components have the defects of poor temperature resistance, high brittleness, high shrinkage, easiness in inversion, no anti-counterfeiting property and the like.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the electronic adhesive which has high stability, strong adhesive force, no toxicity, heat resistance and aging resistance.
In order to achieve the purpose, the technical scheme provided by the invention is as follows: the electronic adhesive with high stability comprises the following components in parts by mass: 400 parts of chloroprene rubber, 350 parts of thermoplastic styrene-butadiene rubber, 50-80 parts of polystyrene, 5-25 parts of dibutyl phthalate, 300 parts of liquid formaldehyde, 5-15 parts of tetrahydrofuran and 5-25 parts of butyl lithium.
The preparation method comprises the following steps:
1) adding thermoplastic styrene butadiene rubber and chloroprene rubber into a reaction kettle, and adding a certain amount of liquid formaldehyde together, wherein the chloroprene rubber is M-40; the adding amount of the liquid formaldehyde is 20-30% of the total mass in the reaction kettle;
2) heating the reaction kettle to 70 ℃, starting a stirrer and fully stirring;
3) slowly adding polystyrene into the reaction kettle which is finished with the step 2), and heating to 90-95 ℃ to completely dissolve the polystyrene;
4) cooling the solution obtained in the step 3) to 80-85 ℃, adding dibutyl phthalate in a trickle mode while continuing stirring, and stirring for 20 minutes;
5) then adding the rest liquid formaldehyde for condensation reaction, wherein the time is controlled to be 50-70 minutes;
6) reducing the temperature of the reaction kettle, adjusting the pH value, performing amination treatment by using urea, adjusting the pH value to be neutral after sampling inspection is qualified, cooling to 45-50 ℃, and discharging to obtain the electronic adhesive.
The thermoplastic styrene-butadiene rubber has the characteristics of strong adhesive force, no toxicity, heat resistance, aging resistance and the like after being modified by polystyrene; meanwhile, the material is not easy to damp, has good water absorption, weather resistance and flame retardant property, and the cured material has better insulativity, toughness and heat resistance than products of the same grade on the market, thereby having wide market prospect.
Detailed Description
The present invention is further described below, and the preferred embodiments of the present invention are: the electronic adhesive with high stability is prepared from the following components in parts by mass: 400 parts of chloroprene rubber, 350 parts of thermoplastic styrene-butadiene rubber, 50-80 parts of polystyrene, 5-25 parts of dibutyl phthalate, 300 parts of liquid formaldehyde, 5-15 parts of tetrahydrofuran and 5-25 parts of butyl lithium.
The preparation method comprises the following steps:
1) adding thermoplastic styrene butadiene rubber and chloroprene rubber into a reaction kettle, and adding a certain amount of liquid formaldehyde together, wherein the chloroprene rubber is M-40; the adding amount of the liquid formaldehyde is 20-30% of the total mass in the reaction kettle;
2) heating the reaction kettle to 70 ℃, starting a stirrer and fully stirring;
3) slowly adding polystyrene into the reaction kettle which is finished with the step 2), and heating to 90-95 ℃ to completely dissolve the polystyrene;
4) cooling the solution obtained in the step 3) to 80-85 ℃, adding dibutyl phthalate in a trickle mode while continuing stirring, and stirring for 20 minutes;
5) then adding the rest liquid formaldehyde for condensation reaction, wherein the time is controlled to be 50-70 minutes;
6) reducing the temperature of the reaction kettle, adjusting the pH value, performing amination treatment by using urea, adjusting the pH value to be neutral after sampling inspection is qualified, cooling to 45-50 ℃, and discharging to obtain the electronic adhesive.
The thermoplastic styrene-butadiene rubber has the characteristics of strong adhesive force, no toxicity, heat resistance, aging resistance and the like after being modified by polystyrene; meanwhile, the material is not easy to damp, has good water absorption, weather resistance and flame retardant property, and the cured material has better insulativity, toughness and heat resistance than products of the same grade on the market, thereby having wide market prospect.
The above-mentioned embodiments are merely preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, so that variations made according to the principle of the present invention should be covered by the protection scope of the present invention.
Claims (2)
1. The high-stability electronic adhesive is characterized in that: the electronic adhesive comprises the following components in parts by mass: 400 parts of chloroprene rubber, 350 parts of thermoplastic styrene-butadiene rubber, 50-80 parts of polystyrene, 5-25 parts of dibutyl phthalate, 300 parts of liquid formaldehyde, 5-15 parts of tetrahydrofuran and 5-25 parts of butyl lithium.
2. A preparation method of an electronic adhesive with high stability is characterized by comprising the following steps: the preparation method comprises the following steps:
1) adding thermoplastic styrene butadiene rubber and chloroprene rubber into a reaction kettle, and adding a certain amount of liquid formaldehyde together, wherein the chloroprene rubber is M-40; the adding amount of the liquid formaldehyde is 20-30% of the total mass in the reaction kettle;
2) heating the reaction kettle to 70 ℃, starting a stirrer and fully stirring;
3) slowly adding polystyrene into the reaction kettle which is finished with the step 2), and heating to 90-95 ℃ to completely dissolve the polystyrene;
4) cooling the solution obtained in the step 3) to 80-85 ℃, adding dibutyl phthalate in a trickle mode while continuing stirring, and stirring for 20 minutes;
5) then adding the rest liquid formaldehyde for condensation reaction, wherein the time is controlled to be 50-70 minutes;
6) reducing the temperature of the reaction kettle, adjusting the pH value, performing amination treatment by using urea, adjusting the pH value to be neutral after sampling inspection is qualified, cooling to 45-50 ℃, and discharging to obtain the electronic adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110322672.4A CN113136152A (en) | 2021-03-26 | 2021-03-26 | High-stability electronic adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110322672.4A CN113136152A (en) | 2021-03-26 | 2021-03-26 | High-stability electronic adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113136152A true CN113136152A (en) | 2021-07-20 |
Family
ID=76809992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110322672.4A Pending CN113136152A (en) | 2021-03-26 | 2021-03-26 | High-stability electronic adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113136152A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05320600A (en) * | 1992-05-21 | 1993-12-03 | Aica Kogyo Co Ltd | Aqueous adhesive for spray-coating |
| CN105238298A (en) * | 2015-09-25 | 2016-01-13 | 安徽大松树脂有限公司 | High-performance modified chloroprene rubber adhesive |
| CN106281131A (en) * | 2016-08-25 | 2017-01-04 | 强新正品（苏州）环保材料科技有限公司 | A kind of glue |
| CN109096987A (en) * | 2018-07-23 | 2018-12-28 | 合肥岑遥新材料科技有限公司 | A kind of opto-electronic device adhesive that viscosity is high |
-
2021
- 2021-03-26 CN CN202110322672.4A patent/CN113136152A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05320600A (en) * | 1992-05-21 | 1993-12-03 | Aica Kogyo Co Ltd | Aqueous adhesive for spray-coating |
| CN105238298A (en) * | 2015-09-25 | 2016-01-13 | 安徽大松树脂有限公司 | High-performance modified chloroprene rubber adhesive |
| CN106281131A (en) * | 2016-08-25 | 2017-01-04 | 强新正品（苏州）环保材料科技有限公司 | A kind of glue |
| CN109096987A (en) * | 2018-07-23 | 2018-12-28 | 合肥岑遥新材料科技有限公司 | A kind of opto-electronic device adhesive that viscosity is high |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210720 |