CN109096987A - A kind of opto-electronic device adhesive that viscosity is high - Google Patents
A kind of opto-electronic device adhesive that viscosity is high Download PDFInfo
- Publication number
- CN109096987A CN109096987A CN201810809576.0A CN201810809576A CN109096987A CN 109096987 A CN109096987 A CN 109096987A CN 201810809576 A CN201810809576 A CN 201810809576A CN 109096987 A CN109096987 A CN 109096987A
- Authority
- CN
- China
- Prior art keywords
- parts
- electronic device
- formaldehyde resin
- opto
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of opto-electronic device adhesives that viscosity is high, according to the mass fraction, it is specifically made by following component: 30-50 parts of rosin resin, cold styrene butadiene rubber 20-40,15-20 parts of polystyrene, 5-15 parts of dibutyl phthalate, 8-20 parts of ethyl acetate, 5-10 parts of rubber smoked sheet, 1-6 parts of stearic acid, 1-3 parts of anti-aging agent, 1-3 parts of curing agent, 3-15 parts of modified formaldehyde resin, 2-8 parts of chlorosulfonated polyethylene.The present invention is handled by having carried out special adjustment collocation by the raw material components to adhesive, is effectively improved the viscosity of adhesive entirety, is sprawled, the characteristics such as corrosion resistant, heatproof, intensity；By experiment, the present invention under 4 μ m thicks, stablize in 1.66kg/in or more by 180 ° of peeling forces, and commercially available opto-electronic device adhesive is under 4 μ m thicks, and 180 ° of peeling forces are only 1.13kg/in.
Description
Technical field
The present invention relates to optoelectronic device technology field, the high opto-electronic device adhesive of specifically a kind of viscosity.
Background technique
There are many classification method of adhesive, can be divided into thermoset, hot melt, room temperature curing type, pressure sensitive by application method
Deng；It is divided into structural, non-configuration or special glue by application；Water-soluble, emulsion type, solvent type and each can be divided by connecing form
Kind solid-state version etc..Synthesis chemist is often liked classifying adhesive by the chemical component of sizing.
It is glued (bonding, bonding, cementing, gluing) using adhesive and refers to that homogeneous or heterogeneous surface is connected with adhesive
The features such as technology together has stress distribution continuous, light-weight, or sealing, most technological temperatures are low.It is glued particularly suitable
In the connection of different materials, different thicknesses, ultra-thin specification and complex component.Splicing RECENT DEVELOPMENTS is most fast, and application industry is extremely wide.
Adhesive is in the application of photoelectron material, in order to reduce the volume of opto-electronic device, needs reduced coating thick
Degree, but will lead to the decline of adhesive viscosity, it solves the problems, such as this, opto-electronic device can just developed to smaller volume.
Summary of the invention
In order to solve the problems mentioned above in the background art, the present invention provides a kind of opto-electronic device that viscosity is high use
Adhesive.
A kind of opto-electronic device adhesive that viscosity is high is specifically made by following component: rosin tree according to the mass fraction
30-50 parts of rouge, cold styrene butadiene rubber 20-40,15-20 parts of polystyrene, 5-15 parts of dibutyl phthalate, ethyl acetate 8-20
Part, 5-10 parts of rubber smoked sheet, 1-6 parts of stearic acid, 1-3 parts of anti-aging agent, 1-3 parts of curing agent, 3-15 parts of modified formaldehyde resin, chlorosulfonation
2-8 parts of polyethylene；Preparation method, specially following steps:
(1) by the rosin resin, cold styrene butadiene rubber, polystyrene, dibutyl phthalate, ethyl acetate, smoked sheet
Piece, chlorosulfonated polyethylene are placed in high mixer in proportion, 90-100 DEG C at a temperature of stir 60-90 minutes, be subsequently cooled to
Room temperature obtains cooling solution；
(2) the modified formaldehyde resin is added in the cooling solution, and ethyl acetate is added and stirs to completely mixed
It closes, obtains mixed solution；
(3) be added into the mixed solution stearic acid, anti-aging agent, curing agent stir in the pasty state, be washed out,
It filters to obtain the final product.
Further, the modified formaldehyde resin, preparation method, specially following steps:
(1) formaldehyde resin is mixed with the hydrogen chloride solution solution that mass concentration is 3%-5% with mass ratio 1:20-30,
Using 35-45kHz ultrasonication at stable suspension, impregnated 3-4 hours under conditions of temperature is 30-35 DEG C, after taking-up
It is washed to neutrality repeatedly, obtains pretreatment formaldehyde resin；
(2) in mass ratio by the pretreatment formaldehyde resin and hydroxy-ethyl acrylate, pyridone copper sulphate and enuatrol
8-10:1:3 after mixing evenly, by heating water bath to 80-85 DEG C, continues stirring in 200r/ minutes 1-2 hours, is cooled to 50-55
DEG C, the modification diatomaceous earth of 0.1 times of pretreatment formaldehyde resin mass fraction is added and is after initiator insulated and stirred 2-4 hours
, the mass ratio of the modified diatomaceous earth and initiator is 8-15:1.
Further, the initiator, in tert-butyl hydroperoxide, lauroyl peroxide, cumyl peroxide
Any one.
Further, the preparation method of the modified diatomaceous earth, specific as follows:
(1) diatomaceous earth is immersed in the hydrochloric acid solution that mass fraction is 1-4% and is handled 4-6 minutes, then filter out immersion
Handle 6-8 minutes into the sodium hydroxide solution that mass fraction is 1-6%, finally filter out dried for one time with deionized water flushing it is standby
With；
(2) high-temperature calcination processing, control calcining will be carried out in step (1) treated diatomaceous earth is put into high-temperature calcination stove
Temperature be 600-700 DEG C, processing 2-4 hours after to obtain the final product.
Compared with prior art, the beneficial effects of the present invention are:
The present invention is handled by having carried out special adjustment collocation by the raw material components to adhesive, is effectively improved
The viscosity of adhesive entirety is sprawled, the characteristics such as corrosion resistant, heatproof, intensity, wherein described enhance it between adhesive bulk composition
Compatible binding ability, enhance the effect that uses of filling, hence it is evident that the viscosity for improving adhesive, cooperate the rosin resin,
Cold styrene butadiene rubber, polystyrene, dibutyl phthalate, ethyl acetate, rubber smoked sheet, chlorosulfonated polyethylene, have adhesive
Have the characteristics that softening point is high, cohesive force is big, further enhances its adhesion strength.By experiment, the present invention is under 4 μ m thicks, and 180 °
Peeling force is stablized in 1.66kg/in or more, and commercially available opto-electronic device adhesive is under 4 μ m thicks, and 180 ° of peeling forces are only
1.13kg/in。
Specific embodiment
Embodiment 1
A kind of opto-electronic device adhesive that viscosity is high is specifically made by following component: rosin tree according to the mass fraction
It is 30 parts of rouge, cold styrene butadiene rubber 20,15 parts of polystyrene, 5 parts of dibutyl phthalate, 8 parts of ethyl acetate, 5 parts of rubber smoked sheet, hard
1 part of resin acid, 1 part of anti-aging agent, 1 part of curing agent, 3 parts of modified formaldehyde resin, 2 parts of chlorosulfonated polyethylene；Preparation method, specially
Following steps:
(1) by the rosin resin, cold styrene butadiene rubber, polystyrene, dibutyl phthalate, ethyl acetate, smoked sheet
Piece, chlorosulfonated polyethylene are placed in high mixer in proportion, 90-100 DEG C at a temperature of stir 60 minutes, be subsequently cooled to often
Temperature obtains cooling solution；
(2) the modified formaldehyde resin is added in the cooling solution, and ethyl acetate is added and stirs to completely mixed
It closes, obtains mixed solution；
(3) be added into the mixed solution stearic acid, anti-aging agent, curing agent stir in the pasty state, be washed out,
It filters to obtain the final product.
Further, the modified formaldehyde resin, preparation method, specially following steps:
(1) formaldehyde resin is mixed with the hydrogen chloride solution solution that mass concentration is 3%-5% with mass ratio 1:20, is used
35-45kHz ultrasonication is impregnated 3 hours under conditions of temperature is 30-35 DEG C at stable suspension, water repeatedly after taking-up
It is washed till neutrality, obtains pretreatment formaldehyde resin；
(2) in mass ratio by the pretreatment formaldehyde resin and hydroxy-ethyl acrylate, pyridone copper sulphate and enuatrol
8:1:3 after mixing evenly, by heating water bath to 80-85 DEG C, continues to stir 1 hour for 200r/ minutes, is cooled to 50-55 DEG C, adds
Enter 0.1 times it is described pretreatment formaldehyde resin mass fraction modification diatomaceous earth and after initiator insulated and stirred 2 hours to obtain the final product, it is described
The mass ratio of modified diatomaceous earth and initiator is 8:1.
Further, the initiator, in tert-butyl hydroperoxide, lauroyl peroxide, cumyl peroxide
Any one.
Further, the preparation method of the modified diatomaceous earth, specific as follows:
(1) diatomaceous earth is immersed in the hydrochloric acid solution that mass fraction is 1-4% and is handled 4 minutes, then filtered out and be immersed in
Handle 6 minutes in the sodium hydroxide solution that mass fraction is 1-6%, finally filter out dried for one time with deionized water flushing it is spare；
(2) high-temperature calcination processing, control calcining will be carried out in step (1) treated diatomaceous earth is put into high-temperature calcination stove
Temperature be 600-700 DEG C, processing 2 hours after to obtain the final product.
Embodiment 2
A kind of opto-electronic device adhesive that viscosity is high is specifically made by following component: rosin tree according to the mass fraction
50 parts of rouge, cold styrene butadiene rubber 40,20 parts of polystyrene, 15 parts of dibutyl phthalate, 20 parts of ethyl acetate, rubber smoked sheet 10
Part, 6 parts of stearic acid, 3 parts of anti-aging agent, 3 parts of curing agent, 15 parts of modified formaldehyde resin, 8 parts of chlorosulfonated polyethylene；Preparation method,
Specially following steps:
(1) by the rosin resin, cold styrene butadiene rubber, polystyrene, dibutyl phthalate, ethyl acetate, smoked sheet
Piece, chlorosulfonated polyethylene are placed in high mixer in proportion, 90-100 DEG C at a temperature of stir 90 minutes, be subsequently cooled to often
Temperature obtains cooling solution；
(2) the modified formaldehyde resin is added in the cooling solution, and ethyl acetate is added and stirs to completely mixed
It closes, obtains mixed solution；
(3) be added into the mixed solution stearic acid, anti-aging agent, curing agent stir in the pasty state, be washed out,
It filters to obtain the final product.
Further, the modified formaldehyde resin, preparation method, specially following steps:
(1) formaldehyde resin is mixed with the hydrogen chloride solution solution that mass concentration is 3%-5% with mass ratio 1:30, is used
35-45kHz ultrasonication is impregnated 4 hours under conditions of temperature is 30-35 DEG C at stable suspension, water repeatedly after taking-up
It is washed till neutrality, obtains pretreatment formaldehyde resin；
(2) in mass ratio by the pretreatment formaldehyde resin and hydroxy-ethyl acrylate, pyridone copper sulphate and enuatrol
10:1:3 after mixing evenly, by heating water bath to 80-85 DEG C, continues to stir 2 hours for 200r/ minutes, is cooled to 50-55 DEG C,
Be added 0.1 times it is described pretreatment formaldehyde resin mass fraction modification diatomaceous earth and after initiator insulated and stirred 4 hours to obtain the final product, institute
The mass ratio for stating modified diatomaceous earth and initiator is 15:1.
Further, the initiator, in tert-butyl hydroperoxide, lauroyl peroxide, cumyl peroxide
Any one.
Further, the preparation method of the modified diatomaceous earth, specific as follows:
(1) diatomaceous earth is immersed in the hydrochloric acid solution that mass fraction is 1-4% and is handled 6 minutes, then filtered out and be immersed in
Handle 8 minutes in the sodium hydroxide solution that mass fraction is 1-6%, finally filter out dried for one time with deionized water flushing it is spare；
(2) high-temperature calcination processing, control calcining will be carried out in step (1) treated diatomaceous earth is put into high-temperature calcination stove
Temperature be 600-700 DEG C, processing 4 hours after to obtain the final product.
Embodiment 3
A kind of opto-electronic device adhesive that viscosity is high is specifically made by following component: rosin tree according to the mass fraction
40 parts of rouge, cold styrene butadiene rubber 30,18 parts of polystyrene, 10 parts of dibutyl phthalate, 12 parts of ethyl acetate, 8 parts of rubber smoked sheet,
3 parts of stearic acid, 2 parts of anti-aging agent, 2 parts of curing agent, 8 parts of modified formaldehyde resin, 6 parts of chlorosulfonated polyethylene；Preparation method, specifically
For following steps:
(1) by the rosin resin, cold styrene butadiene rubber, polystyrene, dibutyl phthalate, ethyl acetate, smoked sheet
Piece, chlorosulfonated polyethylene are placed in high mixer in proportion, 90-100 DEG C at a temperature of stir 80 minutes, be subsequently cooled to often
Temperature obtains cooling solution；
(2) the modified formaldehyde resin is added in the cooling solution, and ethyl acetate is added and stirs to completely mixed
It closes, obtains mixed solution；
(3) be added into the mixed solution stearic acid, anti-aging agent, curing agent stir in the pasty state, be washed out,
It filters to obtain the final product.
Further, the modified formaldehyde resin, preparation method, specially following steps:
(1) formaldehyde resin is mixed with the hydrogen chloride solution solution that mass concentration is 3%-5% with mass ratio 1:25, is used
35-45kHz ultrasonication is impregnated 3 hours under conditions of temperature is 30-35 DEG C at stable suspension, water repeatedly after taking-up
It is washed till neutrality, obtains pretreatment formaldehyde resin；
(2) in mass ratio by the pretreatment formaldehyde resin and hydroxy-ethyl acrylate, pyridone copper sulphate and enuatrol
9:1:3 after mixing evenly, by heating water bath to 80-85 DEG C, continues to stir 1.5 hours for 200r/ minutes, is cooled to 50-55 DEG C,
Be added 0.1 times it is described pretreatment formaldehyde resin mass fraction modification diatomaceous earth and after initiator insulated and stirred 3 hours to obtain the final product, institute
The mass ratio for stating modified diatomaceous earth and initiator is 10:1.
Further, the initiator, in tert-butyl hydroperoxide, lauroyl peroxide, cumyl peroxide
Any one.
Further, the preparation method of the modified diatomaceous earth, specific as follows:
(1) diatomaceous earth is immersed in the hydrochloric acid solution that mass fraction is 1-4% and is handled 5 minutes, then filtered out and be immersed in
Handle 7 minutes in the sodium hydroxide solution that mass fraction is 1-6%, finally filter out dried for one time with deionized water flushing it is spare；
(2) high-temperature calcination processing, control calcining will be carried out in step (1) treated diatomaceous earth is put into high-temperature calcination stove
Temperature be 600-700 DEG C, processing 3 hours after to obtain the final product.
Comparative example 1
This comparative example 1 prepares adhesive only with conventional method compared with Example 1, without using the method, removes
Furthermore method and step is all the same.
Comparative example 2
This comparative example 2 compared with Example 2, is added without the modified formaldehyde resin, and method and step in addition to this is equal
It is identical.
Comparative example 3
This comparative example 3 compared with Example 3, is added without the modified diatomaceous earth, and method and step in addition to this is homogeneous
Together.
Control group
Commercially available opto-electronic device adhesive.
Viscosity test is carried out to above-mentioned 7 kinds of adhesives respectively, under 4 μ m thicks, measures 180 ° of peeling forces of every kind of adhesive,
The result is as follows:
As seen from the above table, the present invention is under 4 μ m thicks, and 180 ° of peeling forces are stablized in 1.66kg/in or more, and commercially available photoelectricity
For sub- device adhesive under 4 μ m thicks, 180 ° of peeling forces are only 1.13kg/in.
Claims (6)
1. a kind of opto-electronic device adhesive that viscosity is high, which is characterized in that according to the mass fraction, specifically by following component system
: 30-50 parts of rosin resin, cold styrene butadiene rubber 20-40,15-20 parts of polystyrene, 5-15 parts of dibutyl phthalate, second
8-20 parts of acetoacetic ester, 5-10 parts of rubber smoked sheet, 1-6 parts of stearic acid, 1-3 parts of anti-aging agent, 1-3 parts of curing agent, modified formaldehyde resin 3-
15 parts, 2-8 parts of chlorosulfonated polyethylene.
2. a kind of high opto-electronic device adhesive of viscosity according to claim 1, which is characterized in that press mass fraction
Meter, is specifically made by following component: 40 parts of rosin resin, cold styrene butadiene rubber 30,18 parts of polystyrene, dibutyl phthalate
10 parts, 12 parts of ethyl acetate, 8 parts of rubber smoked sheet, 3 parts of stearic acid, 2 parts of anti-aging agent, 2 parts of curing agent, 8 parts of modified formaldehyde resin, chlorine
6 parts of sulfonated polyethylene.
3. a kind of high opto-electronic device adhesive of viscosity according to claim 1, which is characterized in that the modified first
The preparation method of urea formaldehyde, specially following steps:
(1) formaldehyde resin is mixed with the hydrogen chloride solution solution that mass concentration is 3%-5% with mass ratio 1:20-30, is used
35-45kHz ultrasonication is at stable suspension, immersion 3-4 hours under conditions of temperature is 30-35 DEG C, after taking-up repeatedly
It is washed to neutrality, obtains pretreatment formaldehyde resin；
(2) by the pretreatment formaldehyde resin and hydroxy-ethyl acrylate, pyridone copper sulphate and enuatrol 8-10 in mass ratio:
1:3 after mixing evenly, by heating water bath to 80-85 DEG C, continues stirring in 200r/ minutes 1-2 hours, is cooled to 50-55 DEG C, adds
Enter 0.1 times it is described pretreatment formaldehyde resin mass fraction modification diatomaceous earth and after initiator insulated and stirred 2-4 hours to obtain the final product, institute
The mass ratio for stating modified diatomaceous earth and initiator is 8-15:1.
4. a kind of high opto-electronic device adhesive of viscosity according to claim 3, it is characterised in that: the initiation
Agent, for any one in tert-butyl hydroperoxide, lauroyl peroxide, cumyl peroxide.
5. a kind of high opto-electronic device adhesive of viscosity according to claim 3, it is characterised in that: the modified silicon
The preparation method of diatomaceous earth, specific as follows:
(1) diatomaceous earth is immersed in the hydrochloric acid solution that mass fraction is 1-4% and is handled 4-6 minutes, then filtered out and be immersed in matter
Handle 6-8 minutes in the sodium hydroxide solution that amount score is 1-6%, finally filter out dried for one time with deionized water flushing it is spare；
(2) high-temperature calcination processing will be carried out in step (1) treated diatomaceous earth is put into high-temperature calcination stove, controls the temperature of calcining
Degree is 600-700 DEG C, after processing 2-4 hours to obtain the final product.
6. a kind of preparation method for the opto-electronic device adhesive that viscosity according to claim 1-5 is high,
It is characterized in that, specially following steps:
(1) by the rosin resin, cold styrene butadiene rubber, polystyrene, dibutyl phthalate, ethyl acetate, rubber smoked sheet, chlorine
Sulfonated polyethylene is placed in high mixer in proportion, 90-100 DEG C at a temperature of stir 60-90 minutes, then be cooled to room temperature,
Solution must be cooled down；
(2) the modified formaldehyde resin is added in the cooling solution, and ethyl acetate is added and stirs to being thoroughly mixed, obtained
Mixed solution；
(3) stearic acid, anti-aging agent, curing agent are added into the mixed solution to stir in the pasty state, being washed out, filter
To obtain the final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810809576.0A CN109096987A (en) | 2018-07-23 | 2018-07-23 | A kind of opto-electronic device adhesive that viscosity is high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810809576.0A CN109096987A (en) | 2018-07-23 | 2018-07-23 | A kind of opto-electronic device adhesive that viscosity is high |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109096987A true CN109096987A (en) | 2018-12-28 |
Family
ID=64847099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810809576.0A Withdrawn CN109096987A (en) | 2018-07-23 | 2018-07-23 | A kind of opto-electronic device adhesive that viscosity is high |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109096987A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113136152A (en) * | 2021-03-26 | 2021-07-20 | 湖南浩森胶业有限公司 | High-stability electronic adhesive |
-
2018
- 2018-07-23 CN CN201810809576.0A patent/CN109096987A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113136152A (en) * | 2021-03-26 | 2021-07-20 | 湖南浩森胶业有限公司 | High-stability electronic adhesive |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106833398B (en) | Fast-curing acrylate pressure-sensitive adhesive and preparation method thereof | |
| CN111285962A (en) | Water-based environment-friendly acrylic emulsion pressure-sensitive adhesive for protective film and preparation method thereof | |
| CN107083215A (en) | A kind of ceramic tile gum produced by pure acrylate elastic emulsion and styrene-acrylic emulsion and technique | |
| CN104559899A (en) | Polyaspartate polyurea adhesive and preparation method thereof | |
| CN106633965A (en) | Weather-resistant high-extension self-adhesion polymer waterproof coiled material for roof and preparation method of weather-resistant high-extension self-adhesion polymer waterproof coiled material | |
| CN106147649A (en) | A kind of corrugated board low temperature adhesion glue and application thereof | |
| CN109096987A (en) | A kind of opto-electronic device adhesive that viscosity is high | |
| CN111234727A (en) | Waterborne environmental protection acrylic emulsion pressure sensitive adhesive protection film | |
| CN106753229A (en) | A kind of lacquer wood raw lacquer colored drawing return repairs adhesive | |
| CN109913170A (en) | Glued board is without aldehyde soybean protein glue and preparation method thereof | |
| CN101792641A (en) | Environment-friendly adhesive for quickly adhering aluminum alloy and PVC thin film and preparation and application thereof | |
| CN103881634A (en) | Urea-formaldehyde resin adhesive and preparation method thereof | |
| CN110105819A (en) | A kind of dedicated modifying interface agent of rock wool thin-coat plaster and preparation method thereof | |
| CN112724844B (en) | Acrylate adhesive suitable for full-flow plastic spraying process | |
| CN107254282A (en) | A kind of preparation method for the epoxy resin that bonding is processed for light industry | |
| CN108624270A (en) | A kind of aluminum-based copper-clad plate high-performance colloid and preparation method thereof | |
| CN103571431A (en) | Binding agent and preparation method thereof | |
| CN111909647A (en) | Preparation method of resin adhesive | |
| CN109207070B (en) | High-water-resistance acrylate adhesive and preparation method thereof | |
| CN113308158A (en) | Quick-drying type interface agent for wall surface base layer and preparation method thereof | |
| CN104277750B (en) | A kind of plastics sizing agent that can use under water and preparation method thereof | |
| CN105860301A (en) | Formula and preparation method of oil-proof and anti-ageing cable sheath | |
| CN111961155A (en) | Method for preparing low-viscosity anionic surfactant | |
| CN105176444A (en) | Rubber adhesive and preparation method thereof | |
| CN113072902B (en) | Single-component chloroprene rubber adhesive suitable for bonding automobile leather |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181228 |
|
| WW01 | Invention patent application withdrawn after publication |