CN108624270A - A kind of aluminum-based copper-clad plate high-performance colloid and preparation method thereof - Google Patents
A kind of aluminum-based copper-clad plate high-performance colloid and preparation method thereof Download PDFInfo
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- CN108624270A CN108624270A CN201810491623.1A CN201810491623A CN108624270A CN 108624270 A CN108624270 A CN 108624270A CN 201810491623 A CN201810491623 A CN 201810491623A CN 108624270 A CN108624270 A CN 108624270A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The present invention relates to a kind of aluminum-based copper-clad plate high-performance colloids, are made of following masses percentage substance：Resin matrix 20% -30%, curing agent 8% -19%, plasticizer 9% -21%, coupling agent 1% -2.1%, filler 40% -55%, surplus are organic solvent.Nine steps such as preparation method includes material pretreatment, and resin and pretreatment, curing agent mix, add solvent, add coupling agent, add plasticizer, add silica flour, and adjustment viscosity and emulsification are spare.It is convenient that raw material of the present invention obtains, raw material and low processing cost, toxic side effect is small, producing process is simple, on the one hand the production efficiency of glue can be effectively improved, production cost is reduced, on the other hand can effectively improve high fever coefficient, high temperature resistance and the bending resistance of glue, to reach the production and the use cost that separately have while improving and improving the high temperature resistance and buckle resistance energy of aluminum-based copper-clad plate life greatly and reduce aluminum-based copper-clad plate product.
Description
Technical field
The present invention relates to a kind of aluminum-based copper-clad plate high-performance colloids and preparation method thereof, belong to aluminum-based copper-clad plate production technology
Field.
Background technology
It is used for realizing bonding between aluminum substrate and copper foil at present in carrying out aluminum-based copper-clad plate production process
Traditional glass cloth is substituted by glued membrane for material, to greatly improve the structural behaviour of aluminum-based copper-clad plate, heat dissipation performance and
Production efficiency, and production cost is reduced, but found in the production process of aluminum-based copper-clad plate, currently used glued membrane is often
It is that the base materials such as the epoxy resin used are used as basic raw material, does filler with aluminium oxide and be mixed with to obtain, although can be certain
Degree meets the needs used, but glue prepares production technology complexity, and raw material and production cost are relatively high, while glued membrane is viscous
Connect performance and heat dissipation heat conductivility it is relatively poor, so as to cause the aluminum-based copper-clad plate of preparation hardness it is larger, high temperature resistance is poor,
Be easy to powder away cause electric leakage and production cost it is relatively high, cannot effectively meet market makes aluminum-based copper-clad plate production
Needs, therefore it is directed to this present situation, there is an urgent need to a kind of completely new aluminum-based copper-clad plate colloid and its process for producing,
To meet the needs of actual use.
Invention content
The object of the invention, which is that, overcomes above-mentioned deficiency, provides a kind of aluminum-based copper-clad plate high-performance colloid and its preparation side
Method.
To achieve the above object, the present invention is to be achieved through the following technical solutions：
A kind of aluminum-based copper-clad plate high-performance colloid, is made of following masses percentage substance：Resin matrix 20% -30%, solidification
Agent 8% -19%, plasticizer 9% -21%, coupling agent 1% -2.1%, filler 40% -55%, surplus are organic solvent.
Further, the resin matrix includes acrylic resin and epoxy resin, and acrylic resin and epoxy resin
Between with 1：3.5-5.5 ratios mix.
Further, the curing agent is any one in Mo Ka and bisamide.
Further, the plasticizer is any one in polyvinyl alcohol and carboxyl butyraldehyde.
Further, the coupling agent is KH560.
Further, the filler is compound silicon powder.
Further, the organic solvent is dimethylformamide and dimethylformamide and appointing in acetone mixture
Meaning is a kind of, wherein when organic solvent is dimethylformamide and acetone mixture, acetone total amount is dimethylformamide total amount
1% -5%.
A kind of aluminum-based copper-clad plate preparation method of high-performance colloid, includes the following steps：
Organic solvent, is divided into two parts according to the usage amount of curing agent and plasticizer by the first step, material pretreatment accordingly first,
Then a copy of it organic solvent is mixed with curing agent under normal temperature environment, and is stirred dispersion by dispersion machine, wherein stirring
Mix rotating speed is 600-1000 revs/min, and mixing time is 4-8 hours, another organic solvent is with plasticizer under normal temperature environment
Mixing, and dispersion is stirred by dispersion machine, wherein speed of agitator is 900-1100 revs/min, and mixing time is 8-12 small
When, respective mixing speed then is being kept with ORGANIC SOLVENT MIXTURES to curing agent and ORGANIC SOLVENT MIXTURES and plasticizer respectively
It is spare that independent storage is carried out under permanence condition；
Second step, resin and pretreatment, the acrylic resin of resin matrix and epoxy resin are added in reaction kettle, and 20
At the uniform velocity stirred by rabbling mechanism under DEG C-50 DEG C states 20-50 minutes it is spare, and rotating speed is 40-100 revs/min；
Third walks, curing agent mixing, and after completing second step operation, curing agent and ORGANIC SOLVENT MIXTURES prepared by the first step is even
Speed is added in reaction kettle in resin compound, and carries out at the uniform velocity stirring 1.5-3 hours with 40-100 revs/min of speed, so
Gelatinization detection is carried out to mixture afterwards, and primary every detection in 10-30 minutes, until mixture reaches gelatinization examination criteria i.e.
Can, while it is constant spare to be kept stirring state；
4th step adds solvent, to completing in the reaction kettle after three-step process in mixture constant-speed material-adding added with machine volume, and protects
It holds and mixture at the uniform velocity stir 15-40 minutes under temperature and mixing speed permanence condition；
5th step adds coupling agent, the constant-speed material-adding coupling agent in mixture into the reaction kettle after completion the 4th step processing, and keeps
Mixture at the uniform velocity stir 15-40 minutes at temperature and mixing speed permanence condition；
6th step adds plasticizer, the constant-speed material-adding first step preparation in mixture into the reaction kettle after completion the 5th step processing
Plasticizer and ORGANIC SOLVENT MIXTURES, and keep that mixture is carried out under temperature and mixing speed permanence condition at the uniform velocity to stir 40-
80 minutes；
7th step adds silica flour, the constant-speed material-adding filler in mixture into the reaction kettle after completion the 6th step processing, and keeps temperature
With complete filler addition under mixing speed permanence condition in 3-4 hours, and filler addition is subsequent continuous to be kept stirring completing
2.5-4 hours；
8th step adjusts viscosity, after completing the 7th step operation, in the premise that holding reactor temperature and stirring are constant
Under, viscosity measurements are carried out to the mixture in reaction kettle, until mixture viscosity reaches 3-4 points, are carrying out viscosity measurements
When, the adjacent time interval of viscosity measurements twice is 10-30 minutes；
9th step, emulsification is spare, and after completing the 8th step operation, the mixture in reaction kettle is transported in emulsifying device,
Under 25 DEG C-30 DEG C environment temperatures, emulsification operation is carried out under 40-100 revs/min of rotating speed to mixture, after then emulsifying
Mixture be saved in holding vessel, you can obtain finished product glue.
Further, the examination criteria of the gelatinization detection in third step is：Under 170 DEG C of isoperibols, 3-10 points
Gelatinization is completed in clock.
Further, the shelf-life of finished product glue was prepared no more than 15 days in the 9th step.
It is convenient that raw material of the present invention obtains, and raw material and low processing cost, toxic side effect is small, and producing process is simple, and one
Aspect can effectively improve the production efficiency of glue, reduce production cost, on the other hand can effectively improve the high fever system of glue
Number, high temperature resistance and bending resistance, to reach in high temperature resistance and the bending resistance for improving and improving aluminum-based copper-clad plate life
While folding endurance energy, separately there are production and the use cost for greatly reducing aluminum-based copper-clad plate product.
Description of the drawings
Fig. 1 is the method for the present invention flow diagram.
Specific implementation mode
Embodiment 1
A kind of aluminum-based copper-clad plate high-performance colloid, is made of following masses percentage substance：Resin matrix 25%, curing agent
11%, plasticizer 16%, coupling agent 1.4%, filler 47%, surplus are organic solvent.
In the present embodiment, the resin matrix includes acrylic resin and epoxy resin, and acrylic resin and asphalt mixtures modified by epoxy resin
With 1 between fat：4 ratios mix.
In the present embodiment, the curing agent is not block.
In the present embodiment, the plasticizer is polyvinyl alcohol.
In the present embodiment, the coupling agent is KH560.
In the present embodiment, the filler is compound silicon powder.
In the present embodiment, the organic solvent is dimethylformamide.
A kind of aluminum-based copper-clad plate preparation method of high-performance colloid, includes the following steps：
Organic solvent, is divided into two parts according to the usage amount of curing agent and plasticizer by the first step, material pretreatment accordingly first,
Then a copy of it organic solvent is mixed with curing agent under normal temperature environment, and is stirred dispersion by dispersion machine, wherein stirring
Mix rotating speed is 800 revs/min, and mixing time is 6 hours, another organic solvent is mixed with plasticizer under normal temperature environment, and is led to
It crosses dispersion machine and is stirred dispersion, wherein speed of agitator is 1000 revs/min, and mixing time is 10 hours, then respectively to solidification
The progress in the case where keeping respective mixing speed permanence condition is only with ORGANIC SOLVENT MIXTURES with ORGANIC SOLVENT MIXTURES and plasticizer for agent
Vertical storage is spare；
Second step, resin and pretreatment, the acrylic resin of resin matrix and epoxy resin are added in reaction kettle, and 30
At the uniform velocity stirred by rabbling mechanism under DEG C state 30 minutes it is spare, and rotating speed is 60 revs/min；
Third walks, curing agent mixing, and after completing second step operation, curing agent and ORGANIC SOLVENT MIXTURES prepared by the first step is even
Speed is added in reaction kettle in resin compound, and with 60 revs/min of speed at the uniform velocity stir 2 hours, then to mixture
Gelatinization detection is carried out, and primary every detection in 15 minutes, until mixture reaches gelatinization examination criteria, is kept stirring simultaneously
State is constant spare；
4th step adds solvent, to completing in the reaction kettle after three-step process in mixture constant-speed material-adding added with machine volume, and protects
It holds and mixture at the uniform velocity stir 20 minutes under temperature and mixing speed permanence condition；
5th step adds coupling agent, the constant-speed material-adding coupling agent in mixture into the reaction kettle after completion the 4th step processing, and keeps
Mixture at the uniform velocity stir 30 minutes at temperature and mixing speed permanence condition；
6th step adds plasticizer, the constant-speed material-adding first step preparation in mixture into the reaction kettle after completion the 5th step processing
Plasticizer and ORGANIC SOLVENT MIXTURES, and keep that mixture is carried out under temperature and mixing speed permanence condition at the uniform velocity to stir 60 points
Clock；
7th step adds silica flour, the constant-speed material-adding filler in mixture into the reaction kettle after completion the 6th step processing, and keeps temperature
With complete filler addition under mixing speed permanence condition in 4 hours, and subsequent continuous to be kept stirring 3 small completing filler addition
When；
8th step adjusts viscosity, after completing the 7th step operation, in the premise that holding reactor temperature and stirring are constant
Under, viscosity measurements are carried out to the mixture in reaction kettle, until mixture viscosity reaches 3 points, when carrying out viscosity measurements,
The adjacent time interval of viscosity measurements twice is 15 minutes；
9th step, emulsification is spare, and after completing the 8th step operation, the mixture in reaction kettle is transported in emulsifying device,
Under 29 DEG C of environment temperatures, emulsification operation is carried out to mixture under 60 revs/min of rotating speed, then preserves the mixture after emulsification
Into holding vessel, you can obtain finished product glue.
In the present embodiment, the examination criteria of the gelatinization detection in third step is：Under 170 DEG C of isoperibols, 5 minutes
Interior completion gelatinization.
In the present embodiment, the shelf-life that finished product glue is prepared in the 9th step is 15 days.
Embodiment 2
A kind of aluminum-based copper-clad plate high-performance colloid, is made of following masses percentage substance：Resin matrix 30%, curing agent
15%, plasticizer 21%, coupling agent 1.8%, filler 50%, surplus are organic solvent.
In the present embodiment, the resin matrix includes acrylic resin and epoxy resin, and acrylic resin and asphalt mixtures modified by epoxy resin
With 1 between fat：5 ratios mix.
In the present embodiment, the curing agent is bisamide.
In the present embodiment, the plasticizer is carboxyl butyraldehyde.
In the present embodiment, the coupling agent is KH560.
In the present embodiment, the filler is compound silicon powder.
In the present embodiment, the organic solvent is dimethylformamide and acetone mixture, and wherein acetone total amount is two
The 1% of methylformamide total amount.
A kind of aluminum-based copper-clad plate preparation method of high-performance colloid, includes the following steps：
Organic solvent, is divided into two parts according to the usage amount of curing agent and plasticizer by the first step, material pretreatment accordingly first,
Then a copy of it organic solvent is mixed with curing agent under normal temperature environment, and is stirred dispersion by dispersion machine, wherein stirring
Mix rotating speed is 900 revs/min, and mixing time is 7 hours, another organic solvent is mixed with plasticizer under normal temperature environment, and is led to
It crosses dispersion machine and is stirred dispersion, wherein speed of agitator is 1100 revs/min, and mixing time is 12 hours, then respectively to solidification
The progress in the case where keeping respective mixing speed permanence condition is only with ORGANIC SOLVENT MIXTURES with ORGANIC SOLVENT MIXTURES and plasticizer for agent
Vertical storage is spare；
Second step, resin and pretreatment, the acrylic resin of resin matrix and epoxy resin are added in reaction kettle, and 35
At the uniform velocity stirred by rabbling mechanism under DEG C state 50 minutes it is spare, and rotating speed is 100 revs/min；
Third walks, curing agent mixing, and after completing second step operation, curing agent and ORGANIC SOLVENT MIXTURES prepared by the first step is even
Speed is added in reaction kettle in resin compound, and with 100 revs/min of speed at the uniform velocity stir 3 hours, then to mixture
Gelatinization detection is carried out, and primary every detection in 30 minutes, until mixture reaches gelatinization examination criteria, is kept stirring simultaneously
State is constant spare；
4th step adds solvent, to completing in the reaction kettle after three-step process in mixture constant-speed material-adding added with machine volume, and protects
It holds and mixture at the uniform velocity stir 60 minutes under temperature and mixing speed permanence condition；
5th step adds coupling agent, the constant-speed material-adding coupling agent in mixture into the reaction kettle after completion the 4th step processing, and keeps
Mixture at the uniform velocity stir 40 minutes at temperature and mixing speed permanence condition；
6th step adds plasticizer, the constant-speed material-adding first step preparation in mixture into the reaction kettle after completion the 5th step processing
Plasticizer and ORGANIC SOLVENT MIXTURES, and keep that mixture is carried out under temperature and mixing speed permanence condition at the uniform velocity to stir 80 points
Clock；
7th step adds silica flour, the constant-speed material-adding filler in mixture into the reaction kettle after completion the 6th step processing, and keeps temperature
With complete filler addition under mixing speed permanence condition in 4 hours, and subsequent continuous to be kept stirring 4 small completing filler addition
When；
8th step adjusts viscosity, after completing the 7th step operation, in the premise that holding reactor temperature and stirring are constant
Under, viscosity measurements are carried out to the mixture in reaction kettle, until mixture viscosity reaches 4 points, when carrying out viscosity measurements,
The adjacent time interval of viscosity measurements twice is 30 minutes；
9th step, emulsification is spare, and after completing the 8th step operation, the mixture in reaction kettle is transported in emulsifying device,
Under 30 DEG C of environment temperatures, emulsification operation is carried out to mixture under 100 revs/min of rotating speed, then protects the mixture after emulsification
It is stored in holding vessel, you can obtain finished product glue.
In the present embodiment, the examination criteria of the gelatinization detection in third step is：Under 170 DEG C of isoperibols, 6 minutes
Interior completion gelatinization.
In the present embodiment, the shelf-life that finished product glue is prepared in the 9th step is 10 days.
It is convenient that raw material of the present invention obtains, and raw material and low processing cost, toxic side effect is small, and producing process is simple, and one
Aspect can effectively improve the production efficiency of glue, reduce production cost, on the other hand can effectively improve the high fever system of glue
Number, high temperature resistance and bending resistance, to reach in high temperature resistance and the bending resistance for improving and improving aluminum-based copper-clad plate life
While folding endurance energy, separately there are production and the use cost for greatly reducing aluminum-based copper-clad plate product.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (10)
1. a kind of aluminum-based copper-clad plate high-performance colloid, it is characterised in that：The aluminum-based copper-clad plate is with high-performance colloid under
Row substances in weight percentage is constituted：Resin matrix 20% -30%, curing agent 8% -19%, plasticizer 9% -21%, coupling agent 1% -
2.1%, filler 40% -55%, surplus are organic solvent.
2. a kind of aluminum-based copper-clad plate high-performance colloid according to claim 1, it is characterised in that：The resin matrix packet
Acrylic resin and epoxy resin are included, and with 1 between acrylic resin and epoxy resin：3.5-5.5 ratios mix.
3. a kind of aluminum-based copper-clad plate high-performance colloid according to claim 1, it is characterised in that：The curing agent is
Not two kinds of card and dicyandiamide, ratio 2.8:1.
4. a kind of aluminum-based copper-clad plate high-performance colloid according to claim 1, it is characterised in that：The plasticizer is
Any one in polyvinyl butyral or nitrile rubber.
5. a kind of aluminum-based copper-clad plate high-performance colloid according to claim 1, it is characterised in that：The coupling agent is
KH560。
6. a kind of aluminum-based copper-clad plate high-performance colloid according to claim 1, it is characterised in that：The filler is multiple
Close silicon powder.
7. a kind of aluminum-based copper-clad plate high-performance colloid according to claim 1, it is characterised in that：The organic solvent
For two kinds of dimethylformamide and acetone, the ratio of dimethylformamide and acetone is 1:0.2.
8. a kind of aluminum-based copper-clad plate preparation method of high-performance colloid, it is characterised in that：The high property of the aluminum-based copper-clad plate
The preparation method of energy colloid includes the following steps：
Organic solvent, is divided into two parts according to the usage amount of curing agent and plasticizer by the first step, material pretreatment accordingly first,
Then a copy of it organic solvent is mixed with curing agent under normal temperature environment, and is stirred dispersion by dispersion machine, wherein stirring
Mix rotating speed is 300-500 revs/min, and mixing time is 4-8 hours, another organic solvent is mixed with plasticizer under normal temperature environment
It closing, and dispersion is stirred by dispersion machine, wherein speed of agitator is 600-900 revs/min, and mixing time is 8-12 hours,
Then respective mixing speed is being kept not with ORGANIC SOLVENT MIXTURES to curing agent and ORGANIC SOLVENT MIXTURES and plasticizer respectively
It is spare that independent storage is carried out under the conditions of change；
Second step, resin and pretreatment, the acrylic resin of resin matrix and epoxy resin are added in reaction kettle, and 20
At the uniform velocity stirred by rabbling mechanism under DEG C-50 DEG C states 20-50 minutes it is spare, and rotating speed is 60 revs/min；
Third walks, curing agent mixing, and after completing second step operation, curing agent and ORGANIC SOLVENT MIXTURES prepared by the first step is even
Speed is added in reaction kettle in resin compound, and with 60 revs/min of speed at the uniform velocity stir 1.5-3 hours, then to mixed
It closes object and carries out gel time detection, and is primary every detection in 10-30 minutes, until mixture reaches gel time examination criteria
, while it is constant spare to be kept stirring state；
4th step adds solvent, to completing in the reaction kettle after three-step process in mixture constant-speed material-adding added with machine volume, and protects
It holds and mixture at the uniform velocity stir 15-40 minutes under temperature and mixing speed permanence condition；
5th step adds coupling agent, at the uniform velocity adds coupling agent in mixture into the reaction kettle after completion the 4th step processing, and protect
It holds and mixture at the uniform velocity stir 20 minutes under temperature and mixing speed permanence condition；
6th step adds plasticizer, and at the uniform velocity adding the first step in mixture into the reaction kettle after completion the 5th step processing prepares
Plasticizer and ORGANIC SOLVENT MIXTURES, and keep at the uniform velocity being stirred 40 to mixture under temperature and mixing speed permanence condition
Minute；
7th step adds silica flour, and into the reaction kettle after completion the 6th step processing, constant-speed material-adding is filled in mixture, and keeps temperature
Complete filler addition under degree and mixing speed permanence condition in 3-4 hours, and filler addition is subsequent continuous to be kept stirring completing
2.5-4 hours；Addition filler has to a small amount of slowly addition, makes sure to keep in mind be filler caking；
8th step adjusts viscosity, after completing the 7th step operation, in the premise that holding reactor temperature and stirring are constant
Under, viscosity measurements are carried out to the mixture in reaction kettle, until mixture viscosity reaches 3-4 points (applying four glasss of detections),
When carrying out viscosity measurements, the adjacent time interval of viscosity measurements twice is 15 minutes；
9th step, emulsification is spare, and after completing the 8th step operation, the mixture in reaction kettle is transported in emulsifying device,
Under 25 DEG C -30 DEG C environment temperatures, online-emulsification operation is carried out in mulser to mixture, then by the mixture after emulsification
It is saved in holding vessel, you can obtain finished product glue.
9. a kind of preparation method of aluminum-based copper-clad plate high-performance colloid according to claim 8, it is characterised in that：It is described
Third step in gelatinization detection examination criteria be：Under 170 DEG C of isoperibols, gelatinization is completed in 3-10 minutes.
10. a kind of preparation method of aluminum-based copper-clad plate high-performance colloid according to claim 8, it is characterised in that：Institute
The shelf-life that finished product glue is prepared in the 9th step stated is not more than 15 days.
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| CN201810491623.1A CN108624270A (en) | 2018-05-22 | 2018-05-22 | A kind of aluminum-based copper-clad plate high-performance colloid and preparation method thereof |
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| CN201810491623.1A CN108624270A (en) | 2018-05-22 | 2018-05-22 | A kind of aluminum-based copper-clad plate high-performance colloid and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109942921A (en) * | 2019-03-25 | 2019-06-28 | 郴州功田电子陶瓷技术有限公司 | A kind of high-frequency copper-clad plate composition applied to communication antenna substrate |
| CN113046011A (en) * | 2021-02-24 | 2021-06-29 | 广西中科鑫玺电子科技有限公司 | Special adhesive for copper-clad plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
-
2018
- 2018-05-22 CN CN201810491623.1A patent/CN108624270A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109942921A (en) * | 2019-03-25 | 2019-06-28 | 郴州功田电子陶瓷技术有限公司 | A kind of high-frequency copper-clad plate composition applied to communication antenna substrate |
| CN109942921B (en) * | 2019-03-25 | 2021-06-18 | 郴州功田电子陶瓷技术有限公司 | High-frequency copper-clad plate composition applied to communication antenna base material |
| CN113046011A (en) * | 2021-02-24 | 2021-06-29 | 广西中科鑫玺电子科技有限公司 | Special adhesive for copper-clad plate |
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Application publication date: 20181009 |