CN113133268A - Heat radiating piece, manufacturing method thereof and bendable device - Google Patents
Heat radiating piece, manufacturing method thereof and bendable device Download PDFInfo
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- CN113133268A CN113133268A CN201911425693.8A CN201911425693A CN113133268A CN 113133268 A CN113133268 A CN 113133268A CN 201911425693 A CN201911425693 A CN 201911425693A CN 113133268 A CN113133268 A CN 113133268A
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- bending
- bendable
- heat dissipation
- heat sink
- heat
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000005452 bending Methods 0.000 claims abstract description 105
- 230000017525 heat dissipation Effects 0.000 claims abstract description 87
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000010410 layer Substances 0.000 claims description 27
- 239000012790 adhesive layer Substances 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 229910002804 graphite Inorganic materials 0.000 claims description 13
- 239000010439 graphite Substances 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 8
- 239000003351 stiffener Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008602 contraction Effects 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005087 graphitization Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The application also discloses a heat sink, include: a heat dissipating film and a reinforcing member; the heat dissipation film comprises a bending part and a reinforcing part connected with the bending part; the reinforcing member covers the surface of the reinforcing portion to reinforce the reinforcing portion. The embodiment of the application also discloses a method for manufacturing the heat dissipation piece and a bendable device using the heat dissipation piece. Thereby, the heat dissipation member is stretchable or contractible.
Description
Technical Field
The present disclosure relates to heat dissipation, and particularly to a heat dissipation member, a method for forming the same, and a foldable device.
Background
Most of the existing artificial graphite manufacturing processes adopt a polyimide film (PI film) to perform dehydrogenation and deoxidation at the temperature of 600-1300 ℃ in a vacuum condition, then leave carbon to obtain a carbon material (namely carbonization), then perform three-dimensional ordered rearrangement (namely graphitization) of carbon atoms in an inert gas medium at the temperature of 2600-3000 ℃ to obtain a multilayer carbon molecule high crystalline state graphite film, and the graphite film is subjected to gluing, film covering, die cutting and edge covering to obtain a graphite heat dissipation film finished product. The graphite has the characteristics of high temperature resistance, small thermal expansion coefficient, good heat and electric conductivity, stable chemical property and the like, and can be applied to curved surfaces. The graphite heat dissipation film has certain bending capability, and is actually bent for 5 ten thousand times under the condition of R5/187 degrees, and the heat dissipation performance loss is within 10 percent. The graphite heat dissipation film is a film formed by multiple layers of carbon molecules, has conductivity and can be applied to a curved plane. However, the traditional graphite heat dissipation film does not have the stretching and shrinking characteristics, and the heat dissipation film is easily torn due to the radius difference in the bending process of the graphite heat dissipation film coated on the equipment needing to be bent, so that the delamination and powder falling are caused; or the two sides extrude the heat dissipation film towards the middle to cause the heat dissipation film to arch, thereby affecting the heat conduction performance of the heat dissipation film and causing the short circuit of the equipment mainboard due to powder falling.
Disclosure of Invention
In view of this, the present disclosure provides a heat sink, a manufacturing method thereof, and a foldable device, which are used to stretch and contract the heat sink to solve the above problems.
The heat dissipation piece disclosed in the embodiment of the application comprises a heat dissipation film and a reinforcing piece, wherein the heat dissipation film comprises a bending part and a connecting part, the reinforcing part of the bending part is covered on the reinforcing piece, and the surface of the reinforcing part is right to reinforce the reinforcing part.
The method for manufacturing the heat dissipation element is applied to a mold, the mold is provided with an inner cavity, and the inner cavity is provided with a bending part and a straight part connected with the bending part; the method comprises the following steps: placing an unformed heat dissipation piece in the inner cavity for a predefined time to shape the unformed heat dissipation piece into the heat dissipation piece with the bending part and the reinforcing part, wherein the bending part of the heat dissipation piece is shaped in the bending part of the mold, and the reinforcing part of the heat dissipation piece is located in the straight part of the mold when the bending part is shaped.
The embodiment of the application discloses a device of can buckling, including the bendable piece, connect respectively in the mounting at bendable piece both ends, the third glue film of heat dissipation piece bonds respectively on the mounting.
The heat dissipation piece comprises a heat dissipation film and a reinforcing piece, the heat dissipation film comprises a bending portion and a reinforcing portion connected with the bending portion, the bending portion of the heat dissipation film provides enough length allowance for the heat dissipation film, and the heat dissipation piece can be stretched and retracted.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation element in an embodiment of the present application.
Fig. 2 is an enlarged view of the heat sink of fig. 1 at I.
Fig. 3 is a schematic structural view of a heat sink in an embodiment of the present application when stretched.
Fig. 4 is a schematic structural diagram of a heat dissipation element in another embodiment of the present application.
Fig. 5 is a schematic view of a heat sink in another embodiment of the present application, when stretched.
Fig. 6 is a flowchart illustrating a method for fabricating a heat sink according to an embodiment of the present disclosure.
Fig. 7 is a schematic structural diagram of a bendable apparatus according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "comprises" and "comprising," and any variations thereof, in the description and claims of this invention and the above-described drawings are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus. The terms "first," "second," and "third," etc. in the description and claims of this application and the above-described drawings are used for distinguishing between different objects and not for describing a particular order.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat dissipation element 100 according to an embodiment of the present disclosure. The heat dissipation member 100 is disposed inside the bendable electronic device and used for dissipating heat of the bendable electronic device. The heat sink 100 includes a heat dissipation film 10 and a reinforcement 20. Referring to fig. 2, the heat dissipation film 10 includes a bending portion 11 and a reinforcing portion 13 connected to the bending portion 11. The reinforcing material 20 covers the surface of the reinforcing portion 13 to reinforce the reinforcing portion 13.
Specifically, in one embodiment, referring to fig. 3 together, when the heat dissipation member 100 is stretched, the reinforcing portion 13 of the heat dissipation film 10 is kept flat, and the bending degree of the bending portion 11 is reduced. On the contrary, when the heat sink 100 contracts, the reinforcing portion 13 of the heat dissipation film 10 is kept flat, and the bending degree of the bending portion 11 is increased. In the embodiment of fig. 1-3, the bent portion 11 is a heat dissipation material that is bent into an S-shape and disposed to partially overlap or completely overlap, where "bending degree" is used to indicate the amount of "overlapping portion". In other words, the greater the degree of bending, the more the overlapped portion, and thus the shorter the bent portion 11 in the longitudinal direction. Conversely, the smaller the degree of bending, the less the overlapping portion, and the longer the bent portion 11 in the longitudinal direction.
Likewise, the "degree of bending" is generally understood above in the embodiments described below, such as in fig. 4-5, as well as in any alternative embodiment as would occur to one of ordinary skill in the art.
Thus, in this application, heat dissipation member 100 contracts the in-process, the both ends of the portion of bending 11 are great owing to there is reinforcing piece 20, and hardness is great, transmits the thrust of shrink to the portion of bending 11 that has the length surplus, the length shrink of whole heat dissipation member 100 is realized to the shrink deformation of the portion of bending 11, the tensile in-process of heat dissipation member 11, the both ends of the portion of bending 11 are great owing to there is reinforcing piece 20, and the hardness is great, transmits tensile pulling force to the portion of bending 11 that has the length surplus, the length of the tensile deformation realization whole heat dissipation member 100 of the portion of bending 11 is tensile, and, the region that reinforcing piece 20 belongs to can not have the tangible change thereby avoid this region to arch and produce the friction between the equipment, can also avoid heat dissipation member 100 is at the in-process of buckling because the radius difference tears the radiating membrane and lead to layering, the phenomenon.
As described above, by providing the bent portions 11, the heat dissipating material having no contractility is provided by overlapping, and the tensile force of the reinforcing member 20 are transmitted, thereby achieving the "flexibility" of the bent portions.
Specifically, in one embodiment, the heat dissipation film 10 is a graphite heat dissipation film. The graphite heat dissipation film can adopt a single-layer or multi-layer composite graphite heat dissipation film, and the thickness of the graphite heat dissipation film is about 50-200 um. The stiffener 20 may be, but is not limited to, a polyester film (PET) having a thickness of about 50-100 um.
Specifically, in one embodiment, the bending portion 11 is S-shaped. The bending portion 11 includes two arc portions 111 and a connecting portion 113, and the connecting portion 113 is connected between the two arc portions 111. The connecting portion 113 is disposed in parallel with the reinforcing portion 13. The bent portion 11 having the S-shape provides the heat sink 100 with a sufficient length margin so that the heat sink 10 can be stretched or contracted.
Specifically, in one embodiment, the stiffener 20 is adhered to the stiffener 13 by a first adhesive layer (not shown). It is understood that the first adhesive layer may be, but is not limited to, a double-sided adhesive, a glue layer. When the first adhesive layer is a double-sided adhesive tape, the double-sided adhesive tape is a double-sided pressure-sensitive adhesive tape with the thickness of 3-30 um.
Further, in one embodiment, the bending portion 11 is covered with a friction-resistant layer 40 on a contact side, where the contact side is a side surface of the bending portion 11 that is in contact with each other in a bending state. The material of the friction-resistant layer 40 may be, but is not limited to: polyimide film (PI film), thermoplastic polyurethane elastomer (TPU), polyvinyl chloride film (soft PVC film), polyester film (PET film), polypropylene film (PP film).
As described above, in the process of extending or contracting the heat sink 10, the connection portion 113 of the bent portion 11 and the reinforcing portion 13 slide relative to each other, and the relative sliding causes friction and thus breakage, so that the friction-resistant layer 40 is provided, thereby effectively preventing the breakage of the bent portion 11.
It should be noted that the concept of the connecting portion 113 and the arc portion 111 is not a specific portion of the bending portion 11, and the corresponding positions of the connecting portion 113 and the arc portion 111 are changed along with the process of stretching and shrinking. Therefore, in order to ensure that the bent portion 11 is not damaged, in one embodiment, the anti-friction layer 40 is disposed on the side surfaces of the bent portion 11 where relative sliding occurs.
Further, in one embodiment, the friction-resistant layer 40 is disposed adjacent to the stiffener 20. The thickness of the friction-resistant layer 40 is 5-50 um. The thickness of the friction-resistant layer 40 is smaller than the thickness of the reinforcement 30.
Further, in one embodiment, the friction-resistant layer 40 is bonded to the bending portion 11 by a second adhesive layer (not shown). It is understood that the second adhesive layer may be, but is not limited to, a double-sided adhesive, a glue layer. When the second adhesive layer is a double-sided adhesive tape, the double-sided adhesive tape is a double-sided pressure-sensitive adhesive tape with the thickness of 3-30 um.
Because the connecting portion 113 of the portion of bending 11 with the distance between the reinforcing part 13 is less, consequently, will after the portion of bending 11 is stereotyped, again to the contact side setting of the portion of bending 11 the degree of difficulty of antifriction layer 40 will increase, consequently, need be before the portion of bending 11 is stereotyped, earlier set up antifriction layer 40 on an unformed heat dissipation piece, again will unformed heat dissipation piece is stereotyped through the mould, can obtain being provided with antifriction layer 40 the portion of bending 11.
Specifically, in one embodiment, the third adhesive layers 60 are disposed on the same sides of the two ends of the heat sink 100, and the third adhesive layers 60 are respectively bonded to the two ends of a device with a variable length. It is understood that the third adhesive layer 60 may be, but is not limited to, a double-sided adhesive, a glue layer. When the third glue film is the double faced adhesive tape, the double faced adhesive tape is double faced pressure sensitive adhesive tape, thickness 3 ~ 30 um. Because the heat sink 100 is scalable as described above, the heat sink 100 can adapt to the length variability of the device and contract and expand simultaneously with the device, thereby achieving heat dissipation without arching or hard pull cracking due to contraction or expansion.
Therefore, the friction-resistant layer 40 covers the surface of the bent portion 11, and the performance of the heat dissipation film 10 is not damaged due to the influence of the heat dissipation film body caused by friction generated by relative displacement in the process of changing the length of the heat dissipation film 10.
Alternatively, please refer to fig. 4 and 5, and fig. 4 and 5 are schematic structural views of a heat sink 10' in another embodiment of the present application. The heat sink 10 'is similar to the heat sink 10 in structure, except that in the present embodiment, the connecting portion 113' of the bending portion 11 'of the heat sink 10' is inclined with respect to the two reinforcing portions 13. It will be appreciated that such a relatively inclined arrangement may reduce the overall thickness of the heat dissipation film 10.
Referring to fig. 6, fig. 6 is a flow chart illustrating a method for manufacturing the heat sink 100 according to an embodiment of the present disclosure. It will be appreciated that the order of execution of the method is not limited to the order shown in fig. 6. The method is applied to a mold. The mold has an interior cavity. The inner cavity is provided with a bending part and a straight part connected with the bending part. The method comprises the following steps:
step 601: an unformed heat sink 100 is provided.
Step 602: placing the unmolded heat sink 100 in the inner cavity for a predefined time to mold the unmolded heat sink 100 into the heat sink 100 having the bent portion 11 and the reinforcing portion 13. The bending part 11 of the heat dissipation member 100 is shaped in the bending part of the mold, and when the bending part 11 is shaped, the reinforcing part 13 of the heat dissipation member 100 is located in the straight part of the mold.
It is understood that, in one embodiment, step 601 specifically includes:
providing a heat dissipation film 10, wherein the heat dissipation film 10 can be a heat dissipation film 10 pre-bent into a predetermined shape, or can be a heat dissipation film 10 which is not bent;
and a friction-resistant layer 40 is arranged at the position of the heat dissipation film 10 corresponding to the bent part 11.
Because the connecting portion of the portion of bending 11 with distance between the reinforcing part 13 is less, consequently, will after the portion of bending 11 is stereotyped, again to the portion of bending 11 sets up the degree of difficulty of antifriction layer 40 will increase, consequently, need be before the portion of bending 11 is stereotyped, earlier set up antifriction layer 40 on an unformed heat dissipation piece 100, again will unformed heat dissipation piece 100 is stereotyped through the mould, can obtain being provided with antifriction layer 40 the portion of bending 11.
Further, in one embodiment, the method further includes:
step 603: a reinforcing member 20 is provided on the bent portion 11;
step 604: the third adhesive layers 60 are disposed on the same sides of the two ends of the heat sink 100, and the third adhesive layers 60 are respectively bonded to the two ends of a device with a variable length.
It will be appreciated that the variable length device may be, but is not limited to, a bendable electronic device.
Therefore, the heat sink 100 is stretched and contracted by using the length allowance of the bending portion 11, in the contraction process of the heat sink 100, the two ends of the bending portion 11 have high hardness due to the reinforcing member 20, the contraction thrust is transmitted to the bending portion 11 having the length allowance, the deformation of the bending portion 11 realizes the length contraction of the whole heat sink 100, and the area where the reinforcing member 20 is located cannot be deformed, so that the friction between the area arching and the equipment is avoided. The friction-resistant layer 40 can further reduce the friction force of the bent portion 11.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a bendable apparatus 200 according to an embodiment of the present application. It is understood that, in one embodiment, the foldable device 200 includes a foldable element 210, and a fixing element 220 respectively connected to two ends of the foldable element 210, and the third adhesive layers 60 of the heat dissipating element 100 are respectively adhered to the fixing elements 220. It should be noted that fig. 7 is only an exemplary illustration, and in one embodiment, the fixing element 220 is symmetrically disposed on both sides of the bendable element 210, and the bendable element 210 has bendability, while the fixing element 220 does not have bendability. In the process of unfolding and folding, it is a folding process by unfolding and folding of the bendable pieces 210. The length ratios in the figures are merely illustrative and are not intended as limitations on the physical structure ratios.
Specifically, in one embodiment, the third adhesive layers 60 of the heat dissipating element 100 are respectively adhered to the first sides of the fixing elements 220, wherein the first sides are on the same side as the inner sides of the bendable elements 210 during bending.
Specifically, in one embodiment, the bending portion 11 of the heat dissipation element 100 is located on the first side of the fixing element 220, but not on the first side of the bendable element 210, so as to prevent the heat dissipation element 100 from affecting the unfolding and bending of the bendable element 210.
Specifically, in one embodiment, during the bending process of the bendable apparatus 200, the inner bending side of the bendable element 210 contracts, which results in the length of the bendable element 210 inside the bending side becoming smaller; the bent portion 11 of the heat sink 100 is subjected to the tension of the reinforcing member 20, and the degree of bending increases.
Specifically, in one embodiment, during the unfolding process of the foldable device 200, the inner side of the foldable element 210 extends, which results in the length of the foldable element 210 inside the foldable element 210 becoming larger; the bending part 11 of the heat sink 100 receives the tensile force transmitted from the third adhesive layer 60 to the reinforcing member 20, and the bending degree is reduced.
Thus, the heat sink 100 may be disposed between a hinge of the bendable electronic device and the cover, and the flexible display screen is located on a side of the hinge away from the cover. The heat sink 100 is used for dissipating heat generated by the flexible display screen and/or electronic components such as a battery and a motherboard. The heat dissipation member 100 utilizes the length allowance of the bending portion 11 to achieve stretching and shrinking, in the shrinking process of the heat dissipation member 100, two ends of the bending portion 11 are large in hardness due to the reinforcing member 20, shrinking thrust is transmitted to the bending portion 11 with the length allowance, the deformation of the bending portion 11 achieves the length shrinkage of the whole heat dissipation member 100, and the area where the reinforcing member 20 is located cannot be deformed, so that the friction generated between the area arching and the bendable electronic equipment is avoided.
It is understood that, in other embodiments, the third adhesive layers 60 of the heat dissipating member 100 are respectively adhered to the second sides of the fixing members 220, wherein the second sides are the same as the outer sides of the bendable members 210 when they are bent.
Alternatively, in other embodiments, the bending part 11 of the heat dissipation element 100 is located at the second side of the fixing element 220.
Alternatively, in other embodiments, during the unfolding of the foldable device 200, the outer side of the bendable part 210 is contracted, which results in the length of the bendable part 210 at the outer side of the bending part becoming smaller; the bent portion 11 of the heat sink 100 is subjected to the tensile force of the reinforcing member 20, and the degree of bending increases.
Alternatively, in other embodiments, during the bending process of the bendable apparatus 200, the bending outer side of the bendable element 210 extends, which results in the length of the bendable element 210 at the bending outer side becoming larger; the bent portion of the heat sink 100 receives the tensile force transmitted from the third adhesive layer 60 to the reinforcing member 20, and the bending degree is reduced.
Thus, the heat sink 100 may be disposed between a hinge of a bendable electronic device and a flexible display, and the heat sink 100 is used for dissipating heat generated by the display and/or electronic components such as a battery and a motherboard. The heat dissipation member 100 utilizes the length allowance of the bending portion 11 to achieve stretching and shrinking, in the shrinking process of the heat dissipation member 100, due to the fact that the reinforcing member 20 is arranged at the two ends of the bending portion 11, the hardness is large, shrinking thrust is transmitted to the bending portion 11 with the length allowance, the whole heat dissipation member 100 is shrunk in length due to deformation of the bending portion 11, and the area where the reinforcing member 20 is located cannot be deformed, so that friction generated between the region arch and bendable electrons of the bendable electronic device is avoided.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The steps in the method of the embodiment of the application can be sequentially adjusted, combined and deleted according to actual needs.
The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and embodiments of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (17)
1. A heat sink, comprising: the heat dissipation film comprises a bending part and a reinforcing part connected with the bending part, and the reinforcing part covers the surface of the reinforcing part and reinforces the reinforcing part.
2. The heat sink of claim 1, wherein the reinforcing portion of the heat dissipating film is kept flat and the bending degree of the bent portion is reduced when the heat sink is stretched.
3. The heat sink of claim 2, wherein the stiffener is bonded to the stiffener by a first glue layer.
4. The heat sink as recited in claim 1, wherein the bent portions are covered with a friction resistant layer on a contact side, the contact side being a side surface where the bent portions contact each other in a bent state.
5. The heat sink of claim 4, wherein the anti-friction layer is bonded to the bent portion by a second adhesive layer.
6. The heat sink of claim 1, wherein a third adhesive layer is disposed on the same side of both ends of the heat sink, and the third adhesive layers are respectively bonded to both ends of a device having a variable length.
7. The heat spreading member of any one of claims 1-6, wherein the heat spreading film is a graphite heat spreading film.
8. A method of making a heat sink as claimed in any one of claims 1-7, wherein said method is applied to a mold having an internal cavity with a bend and a straight portion connecting said bends; the method comprises the following steps:
placing an unformed heat dissipation piece in the inner cavity for a predefined time to shape the unformed heat dissipation piece into the heat dissipation piece with the bending part and the reinforcing part, wherein the bending part of the heat dissipation piece is shaped in the bending part of the mold, and the reinforcing part of the heat dissipation piece is located in the straight part of the mold when the bending part is shaped.
9. A bendable device comprising a bendable element, a fixing element connected to each end of the bendable element, respectively, characterized in that it further comprises a heat dissipating element according to any of claims 1-7, wherein the third adhesive layer of the heat dissipating element is bonded to the fixing element, respectively.
10. The foldable device of claim 9 wherein the third layer of adhesive of the heat sink is bonded to a first side of the mounting member, wherein the first side is the same side as the inner side of the foldable member when bent.
11. The bendable device of claim 10, wherein the bend of the heat sink is located on the first side of the fixture.
12. The bendable device according to claim 9, wherein the bendable device is characterized in that during bending, the bending inner side of the bendable element is contracted, resulting in a reduction in length of the bendable element inside the bending; the bending part of the heat dissipation piece is subjected to the tension of the reinforcing piece, and the bending degree is increased.
13. The bendable device of claim 9, wherein the bendable device is configured such that during deployment, the inner side of the bendable element extends, causing the bendable element to increase in length inside the bend; the bending part of the heat dissipation piece is subjected to the pulling force transmitted to the reinforcing piece by the third glue layer, and the bending degree is reduced.
14. The foldable device of claim 9, wherein the third adhesive layers of the heat dissipating element are respectively adhered to the second sides of the fixing elements, wherein the second sides are the same as the outer sides of the foldable elements when the foldable elements are bent.
15. The foldable device of claim 14, wherein the bend of the heat sink is located on the second side of the fixture.
16. The bendable device of claim 9, wherein the bendable device is characterized in that during deployment, the outside of the bending of the bendable element contracts, causing the length of the bendable element outside the bending to decrease; the bending part of the heat dissipation piece is under the tension of the reinforcing piece, and the bending degree is increased.
17. The bendable device according to claim 9, wherein the bendable device is characterized in that during bending, the bending outer side of the bendable element extends, resulting in the length of the bendable element at the bending outer side becoming larger; the bending part of the heat dissipation piece is subjected to the pulling force transmitted to the reinforcing piece by the third glue layer, and the bending degree is reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911425693.8A CN113133268A (en) | 2019-12-31 | 2019-12-31 | Heat radiating piece, manufacturing method thereof and bendable device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911425693.8A CN113133268A (en) | 2019-12-31 | 2019-12-31 | Heat radiating piece, manufacturing method thereof and bendable device |
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| CN113133268A true CN113133268A (en) | 2021-07-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113810529A (en) * | 2021-09-18 | 2021-12-17 | 维沃移动通信有限公司 | Electronic device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130027886A1 (en) * | 2011-07-26 | 2013-01-31 | Crooijmans Wilhelmus | Thermal conductors in electronic devices |
| CN106847870A (en) * | 2017-03-10 | 2017-06-13 | 上海天马微电子有限公司 | Flexible display apparatus |
| US20180092253A1 (en) * | 2016-09-29 | 2018-03-29 | Bo Qiu | Flexible heat spreader |
| CN207958232U (en) * | 2018-01-19 | 2018-10-12 | 北京中石伟业科技无锡有限公司 | Scalable flexible high heat conduction thin-film material resistant to bending |
| CN109699151A (en) * | 2017-10-20 | 2019-04-30 | 华为技术有限公司 | Membranaceous radiating component, can bending display device and terminal device |
| CN110418550A (en) * | 2019-06-25 | 2019-11-05 | 华为技术有限公司 | Soaking plate and folding terminal |
-
2019
- 2019-12-31 CN CN201911425693.8A patent/CN113133268A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130027886A1 (en) * | 2011-07-26 | 2013-01-31 | Crooijmans Wilhelmus | Thermal conductors in electronic devices |
| US20180092253A1 (en) * | 2016-09-29 | 2018-03-29 | Bo Qiu | Flexible heat spreader |
| CN106847870A (en) * | 2017-03-10 | 2017-06-13 | 上海天马微电子有限公司 | Flexible display apparatus |
| CN109699151A (en) * | 2017-10-20 | 2019-04-30 | 华为技术有限公司 | Membranaceous radiating component, can bending display device and terminal device |
| CN207958232U (en) * | 2018-01-19 | 2018-10-12 | 北京中石伟业科技无锡有限公司 | Scalable flexible high heat conduction thin-film material resistant to bending |
| CN110418550A (en) * | 2019-06-25 | 2019-11-05 | 华为技术有限公司 | Soaking plate and folding terminal |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113810529A (en) * | 2021-09-18 | 2021-12-17 | 维沃移动通信有限公司 | Electronic device |
| CN113810529B (en) * | 2021-09-18 | 2024-02-20 | 维沃移动通信有限公司 | Electronic equipment |
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