CN113133203A - Solar Internet of things device and packaging method - Google Patents
Solar Internet of things device and packaging method Download PDFInfo
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- CN113133203A CN113133203A CN202110331894.2A CN202110331894A CN113133203A CN 113133203 A CN113133203 A CN 113133203A CN 202110331894 A CN202110331894 A CN 202110331894A CN 113133203 A CN113133203 A CN 113133203A
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 45
- 239000003292 glue Substances 0.000 claims description 93
- 239000000758 substrate Substances 0.000 claims description 56
- 239000004814 polyurethane Substances 0.000 claims description 30
- 229920002635 polyurethane Polymers 0.000 claims description 30
- 238000003466 welding Methods 0.000 claims description 28
- 239000003822 epoxy resin Substances 0.000 claims description 25
- 229920000647 polyepoxide Polymers 0.000 claims description 25
- 238000010030 laminating Methods 0.000 claims description 23
- 239000002648 laminated material Substances 0.000 claims description 16
- 238000002156 mixing Methods 0.000 claims description 12
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 7
- 238000004146 energy storage Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000010248 power generation Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 53
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 22
- 239000005038 ethylene vinyl acetate Substances 0.000 description 22
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 22
- 239000000047 product Substances 0.000 description 16
- 229920000139 polyethylene terephthalate Polymers 0.000 description 10
- 239000005020 polyethylene terephthalate Substances 0.000 description 10
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- 239000002861 polymer material Substances 0.000 description 3
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- 230000032683 aging Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The embodiment of the invention relates to the technical field of photovoltaic equipment, and discloses a solar internet of things device and a packaging method.
Description
Technical Field
The embodiment of the invention relates to the technical field of photovoltaic equipment, in particular to a solar internet of things device and a packaging method.
Background
The solar module is produced by hot laminating and packaging a cell which is easy to crack and generate electricity, a substrate with certain hardness, a transparent colloid adhesive and a special light-transmitting film on the surface. In order to ensure the fluidity of the EVA colloid during processing and the cohesiveness of the finished product, the general thermal lamination process needs a high temperature of 120-200 ℃ for 10-60 minutes. Drying prior to lamination and vacuum evacuation during lamination are required to reduce the occurrence of air bubbles or delamination within the assembly.
With the development of communication internet of things, the mobility requirement of an internet of things product is stronger, the integration level is higher, and the requirements on the mobile power supply, the volume and the weight of the product are higher. Products composed by stacking modules will become increasingly difficult to meet market demands for mature modern industrial production.
Disclosure of Invention
The invention aims to provide a solar internet of things device and a packaging method, wherein all electronic components and photovoltaic cell panels are integrated on the same printed circuit board, and are integrally packaged in a transparent or semitransparent high polymer material after being pasted, welded or bonded through integral design, so that the characteristics of water resistance, dust resistance, ultraviolet resistance and the like are realized, and the photovoltaic cell panels and the internet of things electronic components are respectively packaged on two sides of a PCB circuit substrate through a laminating method and a glue dripping method, so that the production process is reasonable and efficient, the production material and integrated processing cost is reduced, and the integral design service life of a product reaches the expectation.
To solve the above technical problem, in a first aspect, an embodiment of the present invention provides a solar internet of things device, including:
a PCB circuit substrate including opposing first and second sides;
the photovoltaic cell panel is arranged on the first side, and a first packaging layer is arranged outside the photovoltaic cell panel;
the electronic components are arranged on the second side and electrically connected with the photovoltaic cell panel; and a plurality of electronic components are also provided with a second packaging layer, and the second packaging layer coats the plurality of electronic components.
Preferably, the electronic components at least include one or more of the following: the system comprises an internet of things communication circuit module, a sensing circuit module, an intelligent computing circuit module, a vibration power generation circuit module and an energy storage circuit module.
Preferably, the PCB circuit substrate is a double-layer printed circuit board or a multi-layer printed circuit board;
the photovoltaic cell panel comprises one or more photovoltaic cell pieces, and any two of the photovoltaic cell pieces are mutually connected in parallel or in series to form the photovoltaic cell panel on the first side.
Preferably, the first packaging layer comprises an EVA (ethylene vinyl acetate) glue layer and an ETFE (ethylene-vinyl acetate) layer or a PET (polyethylene terephthalate) layer; the second packaging layer is an epoxy resin glue layer or a polyurethane glue layer, and the epoxy resin glue layer or the polyurethane glue layer coats the component layer on the second side through a glue dripping encapsulation process and fills the area between the adjacent electronic components.
In a second aspect, an embodiment of the present invention provides a method for encapsulating a solar internet of things device, including:
step S1, cleaning the first side and the second side of the PCB circuit substrate;
s2, welding electronic components with the tolerance temperature larger than a preset temperature threshold value on the second side in batch, and welding the photovoltaic cell panel on the first side;
step S3, sleeving the second side of the PCB circuit substrate obtained in the step S2 with a prefabricated concave tool, and placing the first side of the PCB circuit substrate and the packaging laminated material group in an aligned and overlapped mode; one side of the prefabricated concave tool is a plane, and the other side of the concave tool is provided with a containing cavity matched with the positions and the sizes of the plurality of electronic components;
placing the laminated packaging laminated material group, the PCB circuit substrate and the prefabricated concave tool into a laminating machine to laminate the packaging laminated material group on the first side, so that the packaging laminated material group is laminated and wraps the photovoltaic cell panel;
and S4, adhering the electronic component with the tolerance temperature not greater than the preset temperature threshold value to the second side, and carrying out concave glue dripping encapsulation treatment on the second side.
Preferably, the method further comprises the following steps:
and S5, putting the product obtained in the step S4 into an oven, baking at the temperature of 50-80 ℃ until the glue is cured, taking out the product, and airing for 2 hours.
Preferably, the step S2 specifically includes:
step S21, based on the surface pasting and welding method, the electronic components with the tolerance temperature higher than the preset temperature threshold are pasted and welded in batch in the electronic circuit module area on the second side of the PCB circuit substrate through solder paste at 200-260 ℃, and the electronic components are naturally cooled after welding;
step S22, based on the surface pasting and welding method, pasting and welding the photovoltaic cell panel on the cell area on the first side of the PCB circuit substrate through solder paste pasting and welding at 160-200 ℃, and naturally cooling after welding;
and S23, putting the PCB circuit substrate obtained in the step S22 into a drying oven, and drying at the temperature of 70-100 ℃ for 1-3 hours.
Preferably, the step S4 specifically includes:
step S41, connecting the temperature-sensitive electronic component and the electronic component with the tolerance temperature not greater than the preset temperature threshold value to the second side through welding or conductive adhesive, and fixing;
step S42, pouring polyurethane A glue or epoxy resin A glue into a charging barrel A of the dispensing machine, and pouring polyurethane B glue or epoxy resin B glue into a charging barrel B of the dispensing machine; and dripping the polyurethane A glue and the polyurethane B glue in a mixing ratio of 5:2, or dripping the epoxy resin A glue and the epoxy resin B glue in a mixing ratio of 2:1, so that the mixed glue can cover the tops of all the electronic components on the second side smoothly.
Preferably, in the step S3, the packaging laminated material set includes an EVA glue layer, and an ETFE layer or a PET layer; the thickness of EVA glue film is 0.2 ~ 2mm, the EVA glue film is piled up through at least one deck EVA and is formed.
Preferably, in step S3, the step of laminating the stacked package laminate assembly, the PCB circuit board and the concave tooling in a laminator includes:
putting the stacked packaging laminated material group, the PCB circuit substrate and the prefabricated concave tool into a laminating machine;
setting the vacuumizing time to be 5-8 min, the laminating temperature to be 130-160 ℃, and the vacuum heat laminating time to be 10-60 min; and laminating is performed.
The solar internet of things device and the packaging method provided by the embodiment integrate all electronic components and photovoltaic cell panels on the same printed circuit board, through integrated design, after the bonding or the bonding, the whole packaging is realized in transparent or semitransparent high polymer materials, the characteristics of water resistance, dust resistance, ultraviolet resistance and the like are realized, the photovoltaic cell panels and the internet of things electronic components are packaged on two sides of a PCB circuit substrate respectively through a laminating method and a glue dripping method, the production process is reasonable and efficient, the production material and the integrated processing cost are reduced, and meanwhile, the overall design service life of a product reaches the expectation.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a schematic view of a solar internet of things device according to a first embodiment of the invention;
fig. 2 is a flowchart of a method for packaging a solar internet of things device according to a second embodiment of the invention;
FIG. 3 is a schematic view of a prefabricated female tooling according to a third embodiment of the present invention;
FIG. 4 is a schematic view of a laminated blank according to a third embodiment of the invention;
fig. 5 is a schematic diagram of a glue dropping process according to a third embodiment of the invention.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present invention, and the embodiments may be mutually incorporated and referred to without contradiction.
The terms "first" and "second" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "comprise" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a system, product or apparatus that comprises a list of elements or components is not limited to only those elements or components but may alternatively include other elements or components not expressly listed or inherent to such product or apparatus. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.
The following describes implementation details of the solar internet of things device and the packaging method of the present embodiment in detail, and the following description is only provided for facilitating understanding of the implementation details and is not necessary for implementing the present embodiment.
The first embodiment of the invention relates to a solar internet of things device. As shown in fig. 1, includes:
the PCB circuit substrate 1 comprises a first side and a second side which are opposite; in this embodiment, the first side refers to a Top surface of the PCB circuit substrate 1, and the second side refers to a Bottom surface of the PCB circuit substrate 1;
the photovoltaic cell panel 2 is arranged on the first side, and a first packaging layer is arranged outside the photovoltaic cell panel 2; the photovoltaic cell panel 2 is arranged on the Top surface, so that light can be continuously utilized to be converted into electric energy when light exists, and the capacity is provided for each electric device on the PCB circuit substrate 1;
the electronic components are arranged on the second side, and the electronic components 4 are electrically connected with the photovoltaic cell panel 2; and a plurality of electronic components 4 are also provided with second packaging layers, and the second packaging layers coat the plurality of electronic components 4. The electronic components 4 are welded and fixed on the Bottom surface, and the electronic components 4 on the Bottom surface are electrically connected with the photovoltaic cell panel 2 on the Top surface through the circuit structure of the PCB circuit substrate 1, so that the photovoltaic cell panel 2 can provide electric energy for each electronic component 4 under the bright scene.
On the basis of the above embodiments, as a preferred implementation manner, the electronic component 4 at least includes one or more of the following: the system comprises an internet of things communication circuit module, a sensing circuit module, an intelligent computing circuit module, a vibration power generation circuit module and an energy storage circuit module.
Specifically, besides some sensing circuit modules, intelligent computing circuit modules, internet of things communication circuit modules and the like which are arranged according to requirements, in order to ensure that the solar internet of things device provided by the embodiment of the invention can continuously work, a vibration power generation circuit module and an energy storage circuit module are also arranged so as to continuously provide energy under the condition of no light.
On the basis of the above embodiments, as a preferred implementation manner, the thickness of the PCB circuit substrate 1 is 0.4 to 3mm, and the PCB circuit substrate 1 is a double-layer printed circuit board or a multi-layer printed circuit board;
the photovoltaic cell panel 2 comprises one or more photovoltaic cell pieces, and any two of the photovoltaic cell pieces are connected in parallel or in series to form the photovoltaic cell panel 2 on the first side.
Specifically, a plurality of photovoltaic cells are located on the same plane, and two adjacent photovoltaic cells are connected in parallel and/or in series to form the photovoltaic cell panel 2 on the first side. A plurality of photovoltaic cells are arranged on the Top surface in an array mode to form a light-sensitive surface, solar energy can be fully absorbed and converted into electric energy, and the photovoltaic cells are connected in parallel and/or in series, so that the purpose of boosting or increasing the capacity of the photovoltaic cell panel 2 is achieved.
On the basis of the above embodiments, as a preferred implementation, the first encapsulating layer includes an EVA glue layer 3, and an ETFE layer or a PET layer; the second packaging layer is an epoxy resin glue layer or a polyurethane glue layer 6, the epoxy resin glue layer or the polyurethane glue layer 6 coats the component layer on the second side through a glue dripping encapsulation process, and the adjacent regions between the electronic components 4 are filled.
Specifically, in the embodiment, in order to ensure that the photovoltaic cell panel 2 on the first side and the electronic component 4 on the second side are stable and not damaged, a first encapsulating layer is further covered outside the photovoltaic cell panel 2 on the first side, wherein the first encapsulating layer comprises an EVA glue layer 3 and an ETFE layer or a PET layer, the EVA glue layer 3 is 0.2-2 mm thick, and is formed by stacking 1 to multiple layers of EVA; each electronic component 4 on the second side is packaged flatly through an epoxy resin glue layer or a polyurethane glue layer so as to realize the characteristics of water resistance, dust resistance, ultraviolet resistance, vibration reduction and the like.
Wherein, the thickness on epoxy glue film or polyurethane glue film is 0.5 ~ 20mm, and the epoxy glue film is glued through epoxy A, epoxy B and is glued the mixed point and form, and epoxy A glues the mixing ratio that glues with epoxy B and is 2: 1; the polyurethane adhesive layer is formed by mixing and dispensing polyurethane A adhesive and polyurethane B adhesive, and the mixing ratio of the polyurethane A adhesive to the polyurethane B adhesive is 5: 2.
A second embodiment of the present invention provides a method for packaging a solar internet of things device, including:
step S1, cleaning the first side and the second side of the PCB circuit substrate 1; in this embodiment, the first side refers to a Top surface of the PCB circuit substrate 1, and the second side refers to a Bottom surface of the PCB circuit substrate 1;
step S2, welding the electronic components 4 with the tolerance temperature larger than a preset temperature threshold value on the second side in batch, and welding the photovoltaic cell panel 2 on the first side;
step S3, sleeving the second side of the PCB circuit substrate 1 obtained in the step S2 with a prefabricated concave tool, and placing the first side of the PCB circuit substrate and the packaging laminated material group in an aligned and overlapped mode; one side of the prefabricated concave tool is a plane, and the other side of the concave tool is provided with a containing cavity 7 matched with the positions and the sizes of the electronic components 4;
putting the laminated packaging laminated material group, the PCB circuit substrate 1 and the prefabricated concave tool into a laminating machine to laminate the packaging laminated material group on the first side, so that the packaging laminated material group is laminated and wraps the photovoltaic cell panel 2;
in this embodiment, one or more layers of materials (packaging laminate group) are combined into a formed whole by heating and pressing based on a lamination process, and the rolled materials are laminated into a whole sheet laminate by lamination; the film of material that has just been formed can be laminated on a calender (see calendering); or laminating the extruded material flat film and other films by a set of rollers after the extruder to form a composite film which is used as a high polymer material for packaging.
And step S4, adhering the electronic component 4 with the tolerance temperature not greater than the preset temperature threshold value to the second side, and carrying out concave glue dripping encapsulation treatment on the second side.
And (3) designing the appearance of the laminated PCB circuit substrate 1, and trimming by a trimming device to remove laminated pre-materials and fused edges.
Specifically, in the embodiment, an improved half-lamination and half-glue-dripping method is provided, and the photovoltaic cell panel 2 and the electronic component 4 of the internet of things are respectively packaged on two sides of the PCB circuit substrate 1 by a lamination method and a glue-dripping method, so that the production process is reasonable and efficient, the production material and the integrated processing cost are reduced, and the overall design life of the product is expected.
Solar thermal lamination process in the prior art. The Bottom surface is easily damaged at high temperature due to the energy storage circuit module and part of temperature sensitive components, so that the performance and the service life of the device are affected, and the Bottom surface is not suitable for a hot lamination process.
In the glue dripping process in the prior art, because no vacuum pumping is carried out, the drying of the surface of a device is difficult to ensure, and the moisture on the surface of the device is volatilized in long-term outdoor exposure, so that bubbles are generated in a glue body, peeling is carried out, and the aging of a product is accelerated. Therefore, the TOP layer is not suitable for the dropping process.
In the embodiment, because the Bottom surface is welded or bonded with the electronic components 4, in order to prevent the electronic components 4 from being damaged or falling off in the lamination process, in the embodiment, the electronic components 4 are protected by the prefabricated concave tool, one side of the prefabricated concave tool is a plane, the other side of the prefabricated concave tool is an opening, the Bottom of the opening is provided with a containing cavity 7 matched with the positions and the sizes of the electronic components 4, each electronic component 4 is correspondingly placed into one containing cavity 7, the size of the opening of the prefabricated concave tool is larger than the size of the PCB circuit substrate 1, so that the EVA adhesive layer 3 can flow into the side surface of the PCB circuit substrate 1 and the Bottom surface in the thermal lamination process to coat the side surfaces of the photovoltaic cell panel 2 and the PCB circuit substrate 1, and the edge of the second side forms a glue dripping limiting area, and glue at the edge is wasted in the glue dripping process, and after electronic components 4 placed into and hold chamber 7, prefabricated concave type frock opening edge is a little higher than the height of photovoltaic cell board 2 on PCB circuit substrate 1, if this difference in height scope is 0.2 ~ 2mm to can carry out stacking of EVA glue film 3 and align.
On the basis of the above embodiments, as a preferred implementation, the method further includes:
and S5, putting the product obtained in the step S4 into an oven, baking at the temperature of 50-80 ℃ until the glue is cured, taking out the product, and airing for 2 hours.
On the basis of the foregoing embodiments, as a preferred implementation manner, the step S2 specifically includes:
step S21, based on the surface pasting and welding method, the electronic components 4 with the tolerance temperature larger than the preset temperature threshold are pasted and welded in batch in the electronic circuit module area on the second side of the PCB circuit substrate 1 through solder paste at 200-260 ℃, and are naturally cooled after welding;
step S22, based on the surface pasting and welding method, pasting and welding the photovoltaic cell panel 2 on the cell area at the first side of the PCB circuit substrate 1 through the tin paste pasting and welding at the temperature of 160-;
and S23, placing the PCB circuit substrate 1 obtained in the step S22 into a drying oven, and drying at the temperature of 70-100 ℃ for 1-3 hours.
On the basis of the foregoing embodiments, as a preferred implementation manner, the step S4 specifically includes:
step S41, the temperature-sensitive electronic component 4 and the electronic component 4 with the tolerance temperature not greater than the preset temperature threshold are connected to the second side through welding or conductive glue and fixed;
step S42, pouring polyurethane A glue or epoxy resin A glue into a charging barrel A of the dispensing machine, and pouring polyurethane B glue or epoxy resin B glue into a charging barrel B of the dispensing machine; and dripping the polyurethane A glue and the polyurethane B glue in a mixing ratio of 5:2, or dripping the epoxy resin A glue and the epoxy resin B glue in a mixing ratio of 2:1, so that the mixed glue can cover the tops of all the electronic components 4 on the second side smoothly.
On the basis of the above examples, as a preferred implementation manner, in the step S3, the packaging laminate set includes the EVA glue layer 3, and the ETFE layer or the PET layer; the thickness of EVA glue film 3 is 0.2 ~ 2mm, EVA glue film 3 piles up through at least one deck EVA and forms.
In the step S3, in the step S3, in the step S3, the stacked package laminate group, the PCB circuit board 1, and the concave tooling are placed in a laminator for lamination, which specifically includes:
putting the laminated packaging laminated material group, the PCB circuit substrate 1 and the prefabricated concave tool into a laminating machine;
setting the vacuumizing time to be 5-8 min, the laminating temperature to be 130-160 ℃, and the vacuum heat laminating time to be 10-60 min; and laminating is performed.
The third embodiment of the invention also provides a packaging method of the solar internet of things device, and the solar internet of things device to be packaged comprises an epoxy resin adhesive layer, an electronic component 4, a PCB circuit substrate 1, a photovoltaic cell panel 2, an EVA adhesive layer 3 and an ETFE or PET layer 5 which are sequentially stacked from bottom to top. Wherein, 4 layers of electronic components include thing allies oneself with communication circuit module, sensing circuit module, intelligent calculation circuit module to and energy storage circuit module. The sensing circuit module integrates a temperature and humidity probe (the probe part needs to be exposed outside the package), and the intelligent computing circuit module comprises a local display module (displaying the current electrical performance parameters and sensing communication data).
The photovoltaic cell panel 2 is formed by connecting a single photovoltaic cell or a plurality of photovoltaic cells in series or in parallel, in the preferred embodiment, the photovoltaic cell panel 2 is electrically connected with the copper-clad layer on the PCB circuit substrate 1 in a combination mode of connecting a plurality of photovoltaic cells in series.
The thickness of PCB circuit substrate 1 is 1mm, and its length, width are confirmed according to photovoltaic cell board 2's size, and the Top face of PCB circuit substrate 1 converges and later transmits the electric energy to the bottom face through inside via hole copper foil, supplies power and energy storage.
The Top surface is transparent, so that solar energy can be absorbed conveniently. The Bottom surface adopts transparent epoxy resin glue or partially transparent epoxy resin glue when having a digital display function; when no display is required, a non-transparent epoxy glue is used.
The thickness of the epoxy resin glue layer is 0.5-0.7 mm, and the epoxy resin glue layer is formed by mixing and dispensing epoxy resin A, B glue; the thickness of the polyurethane glue layer is 1-1.5 mm, and the polyurethane glue layer is formed by mixing and dispensing polyurethane A, B glue.
The manufacturing process flow comprises the following steps:
(1) the electronic component 4 with high heat tolerance is pasted and welded in the electronic circuit module area of the PCB circuit substrate 1 by high-temperature solder paste (200-;
(2) adhering and welding the photovoltaic cell panel 2 on a cell area of the PCB circuit substrate 1 by using medium and low temperature solder paste (160-; drying in a drying oven at 80 deg.C for one hour;
(3) sequentially stacking the dried PCB circuit substrate 1, adhesive EVA and surface packaging material ETFE or PET in order, and flatly placing the stacked PCB circuit substrate 1, adhesive EVA and surface packaging material ETFE or PET on a designed prefabricated concave tool, wherein the left side of the prefabricated concave tool is provided with an empty prefabricated concave tool, the right side of the prefabricated concave tool is provided with a prefabricated concave tool filled with the PCB circuit substrate 1, EVA, ETFE or PET, and the prefabricated concave tool is flatly laid in order;
(4) putting the stacked materials into a laminating machine, setting the vacuumizing time for 5 minutes;
(5) setting the laminating temperature and time, carrying out vacuum thermal lamination for 15 minutes, then naturally cooling, and taking out the laminated semi-finished product as shown in figure 4;
(6) welding or adhering conductive adhesive on the surface of a laminated semi-finished product and fixing devices (such as batteries, sensors and the like) which are sensitive to temperature and have low tolerance;
(7) pouring the A, B polyurethane glue into a feed cylinder of a glue dispenser A, B, and uniformly stirring, wherein the mixing ratio of A, B glue is 5: 2;
(8) turning over the laminated and welded semi-finished product, and starting to drip the polyurethane glue, wherein the glue covers the top of the whole device smoothly, and the dripped glue is full without overflowing, as shown in fig. 5.
(9) And (3) putting the product with the dripped glue into an oven, baking for 1 hour at 60 ℃, taking out after the glue is completely cured, and airing for 2 hours to obtain a finished product as shown in figure 1.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific embodiments for practicing the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (10)
1. A solar internet of things device is characterized by comprising:
a PCB circuit substrate including opposing first and second sides;
the photovoltaic cell panel is arranged on the first side, and a first packaging layer is arranged outside the photovoltaic cell panel;
the electronic components are arranged on the second side and electrically connected with the photovoltaic cell panel; and a plurality of electronic components are also provided with a second packaging layer, and the second packaging layer coats the plurality of electronic components.
2. The solar internet of things device of claim 1, wherein the electronic components comprise at least one or more of the following: the system comprises an internet of things communication circuit module, a sensing circuit module, an intelligent computing circuit module, a vibration power generation circuit module and an energy storage circuit module.
3. The solar internet of things device of claim 1, wherein the PCB circuit substrate is a double-layer printed circuit board or a multi-layer printed circuit board;
the photovoltaic cell panel comprises one or more photovoltaic cell pieces, and any two of the photovoltaic cell pieces are mutually connected in parallel or in series to form the photovoltaic cell panel on the first side.
4. The solar internet of things device of claim 1, wherein the first encapsulant layer comprises an EVA glue layer, and an ETFE layer or a PET layer; the second packaging layer is an epoxy resin glue layer or a polyurethane glue layer, and the epoxy resin glue layer or the polyurethane glue layer coats the component layer on the second side through a glue dripping encapsulation process and fills the area between the adjacent electronic components.
5. A method for packaging a solar Internet of things device is characterized by comprising the following steps:
step S1, cleaning the first side and the second side of the PCB circuit substrate;
s2, welding electronic components with the tolerance temperature larger than a preset temperature threshold value on the second side in batch, and welding the photovoltaic cell panel on the first side;
step S3, sleeving the second side of the PCB circuit substrate obtained in the step S2 with a prefabricated concave tool, and placing the first side of the PCB circuit substrate and the packaging laminated material group in an aligned and overlapped mode; one side of the prefabricated concave tool is a plane, and the other side of the concave tool is provided with a containing cavity matched with the positions and the sizes of the plurality of electronic components;
placing the laminated packaging laminated material group, the PCB circuit substrate and the prefabricated concave tool into a laminating machine to laminate the packaging laminated material group on the first side, so that the packaging laminated material group is laminated and wraps the photovoltaic cell panel;
and S4, adhering the electronic component with the tolerance temperature not greater than the preset temperature threshold value to the second side, and carrying out concave glue dripping encapsulation treatment on the second side.
6. The method for encapsulating the solar internet of things device according to claim 5, further comprising:
and S5, putting the product obtained in the step S4 into an oven, baking at the temperature of 50-80 ℃ until the glue is cured, taking out the product, and airing for 2 hours.
7. The method for encapsulating the solar internet of things device according to claim 5, wherein the step S2 specifically comprises:
step S21, based on the surface pasting and welding method, the electronic components with the tolerance temperature higher than the preset temperature threshold are pasted and welded in batch in the electronic circuit module area on the second side of the PCB circuit substrate through solder paste at 200-260 ℃, and the electronic components are naturally cooled after welding;
step S22, based on the surface pasting and welding method, pasting and welding the photovoltaic cell panel on the cell area on the first side of the PCB circuit substrate through solder paste pasting and welding at 160-200 ℃, and naturally cooling after welding;
and S23, putting the PCB circuit substrate obtained in the step S22 into a drying oven, and drying at the temperature of 70-100 ℃ for 1-3 hours.
8. The method for encapsulating the solar internet of things device according to claim 5, wherein the step S4 specifically comprises:
step S41, connecting the temperature-sensitive electronic component and the electronic component with the tolerance temperature not greater than the preset temperature threshold value to the second side through welding or conductive adhesive, and fixing;
step S42, pouring polyurethane A glue or epoxy resin A glue into a charging barrel A of the dispensing machine, and pouring polyurethane B glue or epoxy resin B glue into a charging barrel B of the dispensing machine; and dripping the polyurethane A glue and the polyurethane B glue in a mixing ratio of 5:2, or dripping the epoxy resin A glue and the epoxy resin B glue in a mixing ratio of 2:1, so that the mixed glue can cover the tops of all the electronic components on the second side smoothly.
9. The method for encapsulating a solar internet of things device according to claim 5, wherein in the step S3, the encapsulating laminate set comprises an EVA glue layer, and an ETFE layer or a PET layer; the thickness of EVA glue film is 0.2 ~ 2mm, the EVA glue film is piled up through at least one deck EVA and is formed.
10. The method for encapsulating the solar internet of things device according to claim 5, wherein in the step S3, the step of laminating the stacked encapsulation laminate set, the PCB circuit substrate and the pre-fabricated concave tooling is put into a laminator for lamination, which specifically comprises:
putting the stacked packaging laminated material group, the PCB circuit substrate and the prefabricated concave tool into a laminating machine;
setting the vacuumizing time to be 5-8 min, the laminating temperature to be 130-160 ℃, and the vacuum heat laminating time to be 10-60 min; and laminating is performed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110331894.2A CN113133203A (en) | 2021-03-29 | 2021-03-29 | Solar Internet of things device and packaging method |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065652A (en) * | 2018-07-03 | 2018-12-21 | 深圳市迪晟能源技术有限公司 | A kind of solar cell encapsulation method |
| CN211507654U (en) * | 2020-04-10 | 2020-09-15 | 深圳市光瑞实业有限公司 | Novel solar glue dripping plate |
| CN111769172A (en) * | 2020-07-13 | 2020-10-13 | 广东柔智物联网技术有限公司 | Solar self-powered Internet of things terminal and production process thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065652A (en) * | 2018-07-03 | 2018-12-21 | 深圳市迪晟能源技术有限公司 | A kind of solar cell encapsulation method |
| CN211507654U (en) * | 2020-04-10 | 2020-09-15 | 深圳市光瑞实业有限公司 | Novel solar glue dripping plate |
| CN111769172A (en) * | 2020-07-13 | 2020-10-13 | 广东柔智物联网技术有限公司 | Solar self-powered Internet of things terminal and production process thereof |
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