CN113132569A

CN113132569A - Imaging module and manufacturing method thereof

Info

Publication number: CN113132569A
Application number: CN201911408621.2A
Authority: CN
Inventors: 桂珞; 黄河
Original assignee: China Core Integrated Circuit Ningbo Co Ltd
Current assignee: China Core Integrated Circuit Ningbo Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2021-07-16
Anticipated expiration: 2039-12-31
Also published as: CN113132569B

Abstract

The invention provides an imaging module and a manufacturing method thereof, a piezoelectric element supports and is connected with a moved element, a limit groove is arranged on the surface of the moved element, a fixed end of the piezoelectric element is fixed on a support block, a movable end extends into the limit groove, the limit groove provides a moving space for the movable end, when the piezoelectric element is electrified, the movable end of the piezoelectric element is warped upwards or downwards relative to the fixed end so as to move the moved element, the movable element is connected with an external signal through an elastic conductor and a lead arranged on the piezoelectric element, and the elastic conductor is integrally arranged on the limit groove, so that compared with the situation that the external signal is directly connected with the moved element through a lead, the reliability of an electric connection device between the external signal and the moved element is improved.

Description

Imaging module and manufacturing method thereof

Technical Field

The invention relates to the technical field of motion control, in particular to an imaging module and a manufacturing method thereof.

Background

In some electronic terminals, it is often necessary to translate, vertically move or tilt some of the components to achieve some specific functions. For example, in various electronic terminals such as video cameras, still cameras, and mobile phones having a lens module, a movable lens or an image sensor is usually moved in an optical axis direction to focus or zoom or moved in a direction perpendicular to the optical axis direction to prevent optical shake by a driving mechanism such as a VCM Motor. However, unlike the conventional single lens reflex camera, it is a great engineering challenge to implement the function in electronic terminals such as mobile phones, micro video cameras, and cameras with a small spatial volume. Moreover, along with the imaging system of the electronic terminal such as the mobile phone is more and more complex, the lens module is more and more heavy, the driving capability of the traditional driving mechanism such as the VCM motor is gradually insufficient, and the structure is complex and the occupied space is large.

Disclosure of Invention

In order to solve the problems, a piezoelectric element is used for driving a moved element, when the moved element needs to be externally connected with a signal, a signal end of the moved element is connected with a circuit board through a lead, and the lead is bent along with the movement of the moved element, so that the service life of the lead is influenced or the contact failure of the connection part of the lead is caused.

The invention aims to provide an imaging module and a manufacturing method thereof, which can move a moved part by utilizing the electrostrictive effect of a piezoelectric material, have a simple structure and are beneficial to reducing the occupied space.

In order to achieve the above object, in a first aspect, the present invention provides an imaging module, including: the method comprises the following steps:

the device comprises a moved element, a signal processing unit and a signal processing unit, wherein the moved element is an element needing an external signal;

the limiting groove is arranged on the surface of the moved element, the edge of the limiting groove protrudes relative to the edge of the moved element, and the limiting groove of the protruding part is provided with an electric connection part;

the piezoelectric element comprises a movable end and a fixed end, the movable end extends into the limiting groove, the movable end is wholly or partially positioned in the limiting groove, and the movable end drives the moved element to move upwards or downwards in the power-on state of the piezoelectric element;

the lead is positioned on the piezoelectric element and extends from the movable end to the fixed end;

an elastic conductor having one end connected to the lead of the movable end of the piezoelectric element and the other end electrically connected to the electrical connection portion;

the supporting block is used for supporting and fixing the piezoelectric element, and the fixed end is fixed on the supporting block;

a first external signal connection terminal electrically connected to an electrode in the piezoelectric element;

and the second external signal connecting end is electrically connected with the lead of the fixed end.

In a second aspect, the present invention provides a method for manufacturing an imaging module, where the imaging module includes a moved component, and the moved component is a component that needs to be externally connected with a signal, and the method includes:

providing a substrate;

forming a support block on the substrate;

forming a piezoelectric element, a lead, an elastic conductor and a limiting groove on the substrate, wherein the piezoelectric element comprises a movable end and a fixed end, the fixed end is fixed on the supporting block, the movable end extends into the limiting groove, and the movable end is wholly or partially positioned in the limiting groove; the lead is positioned on the piezoelectric element and extends from the movable end to the fixed end; the elastic conductor is positioned between the piezoelectric element and the limiting groove in the thickness direction of the piezoelectric element, one end of the elastic conductor is connected with the lead of the movable end of the piezoelectric element, and the other end of the elastic conductor is electrically connected with the electric connection part;

the limiting groove is provided with a first area and a second area, and the second area of the limiting groove is provided with an electric connection part;

arranging the moved element on the first area of the limiting groove;

electrically connecting the moved element with the electrical connection of the second region.

The imaging module and the manufacturing method thereof provided by the invention have the beneficial effects that:

the piezoelectric element is supported and connected with a moved element, the limiting groove is formed in the surface of the moved element, the fixed end of the piezoelectric element is fixed on a supporting block, the movable end of the piezoelectric element extends into the limiting groove, the limiting groove provides a moving space for the movable end, when the piezoelectric element is electrified, the movable end of the piezoelectric element is enabled to warp upwards or downwards relative to the fixed end so as to move the moved element, the moving element is connected with an external signal through the elastic conductor and a lead arranged on the piezoelectric element, and compared with the situation that the external signal is connected with the moved element directly through a lead, the reliability of an electric connection device between the external signal and the moved element is improved as the elastic conductor is integrally arranged on the limiting groove.

The side wall of the movable end of the piezoelectric element is provided with the stop block, the movable element is limited to move in the direction vertical to the direction from the movable end to the fixed end of the piezoelectric element, the included angle between two adjacent piezoelectric elements is set, and the movable element is limited to move in the direction parallel to the direction from the movable end to the fixed end of the piezoelectric element through the limitation of two adjacent elements, so that the movable element is prevented from moving transversely, and the shake in the imaging process is avoided.

Drawings

FIG. 1a is a schematic cross-sectional view of a prior art imaging module;

fig. 1b is a schematic cross-sectional view of a first imaging module having a pair of piezoelectric elements according to an embodiment of the present invention;

fig. 1c is a schematic cross-sectional view of an imaging module according to an embodiment of the present invention before being lifted;

fig. 1d is a schematic cross-sectional view of the imaging module shown in fig. 1c after being partially lifted according to an embodiment of the invention;

fig. 2 is a schematic cross-sectional view of a piezoelectric element according to an embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of a second imaging module having a pair of piezoelectric elements according to an embodiment of the invention;

FIG. 4 is a schematic diagram of a pair of piezoelectric elements in FIG. 1 warped upward by the same magnitude according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a pair of piezoelectric elements in FIG. 1 warped upward by different magnitudes according to an embodiment of the present invention;

fig. 6 is a top view of an imaging module having two pairs of piezoelectric elements according to an embodiment of the present invention;

fig. 7 is a top view of an imaging module having three pairs of piezoelectric elements according to an embodiment of the present invention;

fig. 8 is a top view of an imaging module having two piezoelectric elements on one side of a moved element according to an embodiment of the present invention;

FIG. 9 is a schematic structural diagram of an elastic conductor according to an embodiment of the present invention;

fig. 10a is a schematic cross-sectional view of a second imaging module having a pair of piezoelectric elements according to an embodiment of the invention;

FIG. 10b is a schematic cross-sectional view of a third imaging module with a pair of piezoelectric elements according to an embodiment of the present invention;

fig. 11 is a schematic cross-sectional view of a piezoelectric element having three piezoelectric films according to an embodiment of the present invention;

fig. 12a is a schematic structural diagram of a first piezoelectric element according to an embodiment of the present invention;

fig. 12b is a schematic structural diagram of a second piezoelectric element according to an embodiment of the present invention;

fig. 12c is a schematic structural diagram of a third piezoelectric element according to an embodiment of the present invention;

fig. 12d is a schematic structural diagram of a fourth piezoelectric element according to an embodiment of the present invention;

FIG. 13 is a schematic cross-sectional view of an imaging module according to a second embodiment;

FIG. 14 is a top view of the cross-section along AA in FIG. 13 according to a second embodiment of the present invention;

FIG. 15 is a top view of an imaging module according to a second embodiment of the present invention;

fig. 16a is a schematic top view of a first initial position-limiting structure and a position-limiting groove according to a second embodiment of the present invention;

FIG. 16b is a schematic top view of a second initial position-limiting structure and a position-limiting groove according to a second embodiment of the present invention;

FIG. 16c is a schematic top view of a third initial position-limiting structure and a position-limiting groove according to the second embodiment of the present invention;

FIG. 16d is a schematic top view of a fourth initial position-limiting structure and a position-limiting groove according to the second embodiment of the present invention;

fig. 17 is a flowchart of a method for manufacturing an imaging module according to a third embodiment of the invention;

fig. 18a to 18t are schematic structural diagrams of an imaging module in a method for manufacturing the imaging module according to a third embodiment of the present invention;

wherein the reference numbers are as follows:

10-a circuit board; 20-a piezoelectric element; 201-a rotating shaft; 21-a first electrode; 22-a second electrode; 23-a piezoelectric film; 24-a support layer; 25-an insulating layer; 251-a first lead-out terminal; 252-a second terminal; 30-a moved element; 31-electrical signal connection terminals; 40-a limiting groove; 41-a first film layer; 42-a second film layer; 43-a third film layer; 44-an electrical connection; 50-a support block; 61-a third electrical connection; 62-a fourth electrical connection; 63-a conductive plug; 71-a first electrical connection; 74-a second electrical connection; 75-a wire; 76-lead wires; 77-a sixth electrical connection; 80-an elastic electrical conductor; 81-a limiting wall; 82-an initial limit structure;

211-odd layer electrodes; 221-even layer electrodes; 26-a conductive structure;

1701-a substrate; 1702-first sacrificial layer; 1703-anti-stiction structure; 1704-a first support layer; 1705-a first opening; 1706-a second sacrificial layer; 1707-a second support layer; 1708-a first portion of a second film layer; 1709-a second opening; 1710-a third sacrificial layer; 1711-a fourth sacrificial layer; 1712-a third opening; 1713-a fifth sacrificial layer; 1714-a fourth opening; 1715-a second portion of the second film layer; 1716-sixth sacrificial layer; 1717-fifth opening; 1718-sixth opening; 1719-a seventh opening; 1720-an isolation layer; 1721-a tie layer; 1724-stopper opening; 1725-opening of the fixing block; 1726 fixed block.

Detailed Description

The technical solution of the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention. Similarly, if the method described herein comprises a series of steps, the order in which these steps are presented herein is not necessarily the only order in which these steps may be performed, and some of the described steps may be omitted and/or some other steps not described herein may be added to the method. Although elements in one drawing may be readily identified as such in other drawings, the present disclosure does not identify each element as being identical to each other in every drawing for clarity of description.

As shown in fig. 1a, the imaging module of the previous application comprises: the moved element 30; a limit groove 40 fixed on the surface of the moved element 30, wherein the surface of the moved element 30 refers to the upper surface, the lower surface or the side surface of the moved element 30; the piezoelectric element 20 comprises a movable end and a fixed end, the movable end extends into the limit groove 40 and is wholly or partially positioned in the limit groove 40, the limit groove 40 provides a moving space for the movable end, and the movable end is warped upwards or downwards relative to the fixed end to move the moved element 30 when the piezoelectric element 20 is in a power-on state; the supporting block 50 is used for supporting and fixing the piezoelectric element 20, and the fixed end is fixed on the supporting block 50; and an external signal connection terminal electrically connected to an electrode in the piezoelectric element 20 to energize the piezoelectric element 20.

In the imaging module in the prior art, when the signal end of the moved element is connected with the external signal end, the electrical signal connection end 31 is directly connected with the circuit board 10 by using the lead 76, and along with the movement of the moved element 30, the lead 76 is also bent, so that the service life of the lead 76 is affected, or the problem of poor contact at the welding position of the lead 76 and the electrical signal connection end 31 is caused. The embodiment of the present invention proposes the following solutions to solve the above problems.

Example one

As shown in fig. 1b, the present embodiment provides an imaging module, including:

the device comprises a moved element 30, wherein the moved element 30 is an element needing an external signal;

a limiting groove 40 arranged on the surface of the moved element 30, wherein the edge of the limiting groove 40 is protruded relative to the edge of the moved element 30, and the limiting groove of the protruded part is provided with an electric connection part 44;

the piezoelectric element 20 comprises a movable end and a fixed end, the movable end extends into the limiting groove 40, the movable end is wholly located in the limiting groove 40 or partially located in the limiting groove 40, and the movable end drives the moved element 30 to move upwards or downwards when the piezoelectric element 20 is in a power-on state;

a lead 75 on the piezoelectric element, the lead 75 extending from the movable end to the fixed end of the piezoelectric element 20;

an elastic conductor 80 having one end connected to a lead wire at a movable end of the piezoelectric element 20 and the other end electrically connected to the electrical connection portion 44;

the supporting block 50 is used for supporting and fixing the piezoelectric element 20, and the fixed end is fixed on the supporting block 50;

a first external signal connection terminal electrically connected to an electrode in the piezoelectric element 20;

and a second external signal connection terminal electrically connected to the lead 75 of the fixed terminal.

The first and second external signal connection terminals are provided on the wiring board 10.

Optionally, the moved element 30 includes: imaging sensing elements, variable lenses, or variable apertures.

In this embodiment, the moved element 30 is an imaging sensor element, and the imaging sensor element includes: front-illuminated image sensors or back-illuminated image sensors.

In this embodiment, the electrical signal connection terminal 31 of the moved element 30, which needs to be externally connected with a signal, is located on the upper surface of the moved element 30, and because the electrical signal connection terminal 31 of the moved element 30, which needs to be externally connected with a signal, is located on the upper surface of the moved element 30, the electrical connection portion 44 is disposed at the outer edge of the moved element 30 by disposing the elastic conductor 80, so that the electrical connection portion 44 is conveniently connected with the electrical signal connection terminal 31 of the moved element 30, which needs to be externally connected with a signal.

The external signal of the moved element 30 comes from the circuit board 10, after the electrical signal connection end 31 of the moved element is connected with the electrical connection portion 44 through the lead 76, corresponding welding points are arranged on the upper surface of the supporting block 50, as shown in fig. 2, the welding points include welding points which are respectively connected with the first electrode 21 and the second electrode 22 of the piezoelectric element and the lead 75 arranged on the piezoelectric element, the welding points are connected with the welding points on the circuit board 10 through the lead 76 to provide voltage for the piezoelectric element 20, the electrical signal on the circuit board is transmitted to the lead 76 through the lead, and then transmitted to the elastic conductor 80 and then transmitted to the moved element 30 through the lead 76 between the elastic conductor 80 and the electrical signal connection end 31 of the moved element.

Specifically, as shown in fig. 2, the piezoelectric element 20 includes a support layer 24, a piezoelectric stack structure on the support layer 24, the piezoelectric stack structure includes a piezoelectric film 23 and an insulating layer 25 stacked in sequence from bottom to top, and a lead 75 is disposed on a surface of the insulating layer 25 of the piezoelectric element. The piezoelectric film 23 has a first electrode 21 and a second electrode 22 on the upper and lower surfaces thereof, the first electrode 21 and the second electrode 22 are connected to a first terminal 251 and a second terminal 252, respectively, and the first terminal 251 and the second terminal 252 are both located in the insulating layer 25.

A specific lead wire 75 is disposed on the upper surface of the piezoelectric element 20, the lead wire 75 is located in the insulating layer 25, and both ends have a first electrical connection end 71 and a second electrical connection end 74 which are exposed out of the insulating layer 25. The first electrical connection end 71 is closer to the moved element 30 than the second electrical connection end 74. The first electrical connection end 71 is electrically connected to the elastic electrical conductor, in this embodiment by welding two electrical connection points together by using a soldering technique, or by connecting two electrical connection points together by using a patch technique, or by connecting two electrical connection points by a lead wire, so that an electrical signal is transmitted from one electrical connection point to the other electrical connection point.

In this embodiment of the present invention, the first lead-out terminal 251 and the second lead-out terminal 252 may be both located on the bottom surface of the piezoelectric element 20, that is, in the support layer 24, or the first lead-out terminal 251 and the second lead-out terminal 252 may be located on the top surface and the bottom surface of the piezoelectric element 20, respectively, and the embodiment of the present invention is not limited. The piezoelectric element 20 is not limited to an integral structure having the first and second terminals, but may be a structure in which the first and second terminals are not formed, that is, the piezoelectric element 20 includes a support layer 24, a piezoelectric film 23, an insulating layer 25, and first and second electrodes 21 and 22 on upper and lower surfaces of the piezoelectric film 23, and the external signal connection terminal needs to be connected to the first and second electrodes 21 and 22 by additionally manufacturing a conductive plug.

Alternatively, as shown in fig. 2, the first terminal 251 and the second terminal 252 are both located on the top surface of the piezoelectric element 20 and serve as the external signal connection terminals. The first lead-out terminal 251 and the second lead-out terminal 252 are electrically connected to a circuit board 10 by leads, respectively, so that the circuit board 10 can apply a voltage to the first electrode 21 and the second electrode 22 of the piezoelectric element 20 to generate a voltage difference between the upper surface and the lower surface of the piezoelectric film 23, thereby causing the piezoelectric film 23 to contract, and since the support layer 24 cannot stretch, the entire piezoelectric element 20 may be warped upwards or downwards (the warping direction, the warping degree depends on the voltage applied to the upper surface and the lower surface of the piezoelectric film 23) when energized. The piezoelectric film 23 is made of a piezoelectric material that can be deformed when energized, such as quartz crystal, aluminum nitride, zinc oxide, lead zirconate titanate, barium titanate, lithium gallate, lithium germanate, or titanium germanate. The material of the support layer 24 is a dielectric material that is not electrically conductive, such as silicon oxide, silicon nitride, etc.

It should be understood that the present invention is not limited to the first and

second terminals

251 and 252 and the circuit board 10 being directly connected by the leads 76, and an electrical connection terminal may be provided on the top surface of the supporting block, the first and

second terminals

251 and 252 and the electrical connection terminal are electrically connected by the leads, and then the electrical connection terminal on the top surface of the supporting block and the circuit board 10 are electrically connected by another interconnection structure (e.g., a lead or a conductive plug), so that the length of the leads 76 can be shortened.

In the present invention, the first lead-out terminal 251 and the second lead-out terminal 252 are not limited to be the external signal connection terminals. As shown in fig. 3, when the first lead-out terminal 251 and the second lead-out terminal 252 are both located on the bottom surface of the piezoelectric element 20, the first external signal connection terminal includes the third electrical connection terminal 61 and the fourth electrical connection terminal 62, the third electrical connection terminal 61 and the fourth electrical connection terminal 62 are located on the bottom surface of the supporting block 50 and face the piezoelectric element 20, and the first lead-out terminal 251 and the second lead-out terminal 252 are electrically connected to the third electrical connection terminal and the fourth electrical connection terminal by using conductive plugs. It should be understood that when the first terminal 251 and the second terminal 252 are respectively located on the top surface and the bottom surface of the piezoelectric element 20, the fourth electrical connection terminal 62 may be located on the bottom surface of the supporting block 50 and directly face the piezoelectric element 20, and a conductive plug is used to electrically connect the terminal located on the bottom surface (for example, the second terminal 252) with the fourth electrical connection terminal, and the first terminal 251 serves as the third electrical connection terminal 61.

As shown in fig. 1b, the limiting groove 40 is disposed on the lower surface of the moved element 30. As shown in fig. 1b, a first film layer 41, a second film layer 42 and a third film layer 43 are disposed on the lower surface of the moved element 30, and the limiting groove 40 is surrounded by three film layers. An electrical connection is provided on the first film 41.

In the present invention, the film layer constituting the limiting groove 40 is disposed on the moved element 30 by deposition, or each limiting groove 40 may be used as an independent structure to be adhesively connected to the surface of the moved element 30.

As shown in fig. 1b, the limiting groove 40 includes: the electric connector comprises a top wall, a bottom wall and a side wall, wherein an electric connection part is arranged on the top wall. The top wall is closer to the moved element 30 than the bottom wall, and the side wall is located between the bottom wall and the top wall, connecting the bottom wall and the top wall. The top wall is served by the first film layer 41 and the bottom wall by the third film layer 43; the sidewalls are served by the second film layer 43.

When the piezoelectric element 20 is in an energized state, the movable end may be warped upwards or downwards, and when the movable end is warped to contact with the top wall or the bottom wall of the limiting groove 40, an upward or downward pushing force may be applied to the limiting groove 40, so as to drive the limiting groove 40 to move. The movement space provided by the limiting groove 40 can allow the piezoelectric element 20 to have a certain warping degree in the direction along the surface of the moved element 30, so that the piezoelectric element is prevented from rotating unnecessarily. In addition, the limiting groove 40 can also provide support for the piezoelectric element 20, so as to prevent the piezoelectric element 20 from sagging when not being electrified.

As shown in fig. 4, after the piezoelectric element 20 is powered on, the fixed end of the piezoelectric element 20 is fixedly disposed on the supporting block 50, and the movable end extending into the limiting groove 40 is warped upwards or downwards, so that the imaging sensor element 30 can be raised or lowered integrally, thereby changing the vertical position of the imaging sensor element 30 and realizing optical auto-focusing.

As shown in fig. 5, after the autofocus is completed, when necessary, the voltage applied to the piezoelectric element 20 on the side of the imaging sensor element 30 may be changed, so as to tilt the imaging sensor element 30, thereby changing the angle of the imaging sensor element 30, and correcting the optical warping angle of the imaging sensor element 30, thereby achieving optical anti-shake.

The supporting block 50 is connected to the fixed end of the piezoelectric element 20 by adhesive or by a dry film. In the present invention, the piezoelectric element 20 is integrally located on the supporting block 50, and the movable end of the piezoelectric element extends out of the supporting block 50 to form a cantilever structure, which can be applied to the occasion that the moved element 30 needs to be lifted up or down. As shown in fig. 1c and 1d, the movable end of the piezoelectric element 20 is entirely located in the stopper groove 40.

As shown in fig. 6, the piezoelectric elements 20 are two pairs distributed on four sides of the moved element 30, a connecting line between each pair of piezoelectric elements 20 is used as a rotation axis, and the total of two rotation axes is two, and the moved element 30 can rotate along the two rotation axes to change the inclination angles in two directions.

As shown in fig. 7, the piezoelectric elements 20 are three pairs, the three pairs of piezoelectric elements 20 are uniformly distributed in the circumferential direction, the connecting line between each pair of piezoelectric elements 20 is used as a rotating axis, the total number of the rotating axes is three, and the moved element 30 can rotate along the three rotating axes to change the inclination angles in three directions.

Of course, the piezoelectric elements 20 may also be four pairs, five pairs or six pairs, each pair of piezoelectric elements 20 is not limited to be symmetrically arranged along the center of the moved element 30, and may also be asymmetrically arranged, the more the number of pairs of piezoelectric elements 20, the more the rotation axis of the moved element 30 may be increased, so as to implement multi-dimensional rotation, the moved element 30 is also not limited to be square or circular, and may also be in other shapes, and the present invention is not limited.

It is understood that the paired piezoelectric elements 20 are beneficial to control the movement of the moved element 30, and in fact, the piezoelectric elements 20 may also be unpaired, for example, four piezoelectric elements 20 are uniformly distributed along the circumference of the moved element 30, and the embodiment is not illustrated.

As shown in fig. 8, two piezoelectric elements 20 are connected to two opposite sides of the moved element 30, so that the two piezoelectric elements 20 are synchronously warped upwards or downwards (and the warping amplitudes are the same), so that the two piezoelectric elements 20 together support one side of the moved element 30, which can be applied to the case where the piezoelectric elements 20 are small in size, and the moved element 30 is large in size, or the case where the moved element 30 is large in mass. In the present invention, the two opposite sides of the moved element 30 are not limited to the connection of two piezoelectric elements 20, and may be connected to three, four, five, or the like.

When a plurality of piezoelectric elements 20 are disposed on the lower surface of the moved element 30, each piezoelectric element is disposed with an elastic conductor 80, so that the distance between each piezoelectric element 20 and the lower surface of the moved element can be ensured to be the same.

As shown in fig. 9, the elastic conductor 80 is a wire made of a conductive metal. The electric wire can be the beta structure also can be helical structure, and preparation elastic conductor metal includes: metals or alloys having high electrical conductivity such as copper, aluminum, gold, platinum, copper alloys or aluminum alloys. The present embodiment is not limited to these metals, and the use of other metals should be considered as an alternative to the same technical means. In one specific application, the elastic electrical conductor is made of copper, which is folded as shown in fig. 9. The Δ H of the piezoelectric element (PZT) is large and Δ X is small (1mm PZT, Δ X is not more than 70um when Δ H350um is used, at this time, the maximum deformation of the suspended copper wires is only 7%), Δ H is the height difference of vertical movement, Δ X is the distance of horizontal movement, the width of the copper wires is 5um, the thickness of the copper wires is 2um, for example, 80 copper wires are distributed at most on the side length of the moved element 30 with 8mm, the total width of 80 copper wires is 400um, 400um is 5% of the total width of 8mm, that is, the total width of 80 copper wires is 5% of the side length of the moved element 30, and the hardness of copper is far less than Si or PZT, therefore, when the moved element 30 moves under the effect of the piezoelectric element 20, the force required to overcome the deformation of the copper spring is ignored, and the movement of the moved element. The elastic conductor is also made so that the elevation heights of the moved element 30 are completely symmetrical regardless of whether the moved element 30 is gold-bonded on one side or not. In addition, the folding structure of the copper wire is not limited to the regular folding structure shown in fig. 9, and may have an irregular folding shape, such as a wavy line.

In the embodiment of the present invention, the limiting grooves 40 are not limited to be fixed on the lower surface of the moved element 30, as shown in fig. 10a, a pair of limiting grooves 40 are fixed on the upper surface of the moved element 30; as shown in fig. 10b, one of a pair of stopper grooves 40 is fixed to the upper surface of the moved element 30, and the other is fixed to the lower surface of the moved element 30, and at this time, the heights of the supporting blocks 50 supporting the two piezoelectric elements 20 are different, that is, in order to support the piezoelectric elements 20, the heights of the supporting blocks 50 may be adjusted according to the positions of the piezoelectric elements 20.

As shown in fig. 11, in the present embodiment, the piezoelectric element 20 includes a piezoelectric stack structure in which a support layer 24 is located on the support layer 24, and the piezoelectric stack structure includes three piezoelectric films 23.

Electrodes are distributed on the upper surface and the lower surface of each piezoelectric film 23, and two adjacent piezoelectric films 23 share the electrode positioned between the two piezoelectric films, so that the three piezoelectric films 23 are 4 layers of electrodes, the electrodes are counted from bottom to top, the electrodes 211 on the odd layers are electrically connected together by using a conductive structure 26, the electrodes 221 on the even layers are electrically connected together by using another conductive structure 26, the part of the conductive structure 26 extending into the piezoelectric laminated structure is required to be positioned in the insulating layer 25, and only the end part of the conductive structure is in contact with the electrode required to be electrically connected. The tops of the two conductive structures 26 may be used as a first terminal and a second terminal, respectively, so that the first terminal and the second terminal are both located on the top surface of the piezoelectric element 20. The insulating layer 25 has a conductive line provided therein.

In the present invention, the piezoelectric stack structure is not limited to include three piezoelectric films, and may also include two, four, five, or six piezoelectric films, and the like, and the ability of warping the piezoelectric element 20 may be improved by increasing the number of piezoelectric films, so that the piezoelectric element 20 may move an imaging sensing element with a higher mass.

Alternatively, the manner in which the odd-numbered layer electrodes 211 and the even-numbered layer electrodes 221 are electrically connected is not limited to the conductive structure 26 shown in fig. 16, and may be electrically connected by means of a conductive plug and an interconnection line, for example. The conductive structure 26 may also lead the odd-numbered layer electrodes 211 and the even-numbered layer electrodes 221 to the bottom surface of the support layer 24, so that the first lead terminals and the second lead terminals are located on the bottom surface of the piezoelectric element 20, or lead the odd-numbered layer electrodes 211 and the even-numbered layer electrodes 221 to the top surface of the piezoelectric element 20 and the bottom surface of the support layer 24, respectively, so that the first lead terminals and the second lead terminals are located on the top surface and the bottom surface of the piezoelectric element 20, respectively, which is not illustrated herein.

It is to be understood that, in order to ensure that the warping directions of the three piezoelectric films are the same, the polarities of the adjacent two piezoelectric films are opposite.

In this embodiment, the movable end has a rotating shaft, the rotating shaft is disposed in the limiting groove, the limiting groove provides a moving space for the rotating shaft, the rotating shaft and the piezoelectric element are integrated, and the two are insulated from each other; alternatively, the rotary shaft is bonded to the movable end of the piezoelectric element. The rotating shafts are distributed on two sides of the movable end; or at least one rotating shaft is distributed between two sides of the movable end.

The fact that the limiting groove 40 provides a moving space for the movable end means that the size of the limiting groove 40 is larger than that of the movable end, that is, the length of the limiting groove 40 is larger than that of the movable end, the height of the limiting groove 40 is larger than the thickness of the movable end, so that the movable end can freely rotate and slide in the limiting groove 40, and when the piezoelectric element 20 warps, the movable end can move in the limiting groove 40 to prevent the movable end of the piezoelectric element 20 from being stuck. When the height of the limiting groove is equal to the diameter of the rotating shaft, the lifting and descending amount of the moved element can be better controlled, and the problem that the space allowance between the rotating shaft and the limiting groove needs to be overcome is solved.

As shown in fig. 12a, the rotating shaft 201 is distributed in the center of the end of the movable end of the piezoelectric element 20, and a gap is formed between the rotating shaft 201 and the piezoelectric element 20 along the vertical direction and the axial direction of the rotating shaft 201, so that after the rotating shaft 201 is disposed in the limiting groove 40, the piezoelectric element 20 is not disposed in the limiting groove 40.

In the present invention, the number of the rotating shafts 201 of each piezoelectric element 20 is not limited to 1, as shown in fig. 12b, three rotating shafts 201 are uniformly distributed in the center of the end portion of the movable end of the piezoelectric element 20, a gap is formed between each rotating shaft 201 and the piezoelectric element 20 in the direction perpendicular to the axial direction of the rotating shaft 201, and each rotating shaft 201 is disposed in the limiting groove 40. Or as shown in fig. 12c, two rotating shafts 201 are respectively located at two sides of the movable end of the piezoelectric element 20, and extend outward in a direction away from the piezoelectric element 20, and each rotating shaft 201 is placed in one of the limiting grooves 40.

Further, as shown in fig. 12d, the rotation shaft 201 is not limited to a separate two structure from the piezoelectric element 20, and the rotation shaft 201 and the piezoelectric element 20 may be a unitary structure. The end of the piezoelectric element may be etched by a patterning process, the material of the shaft 201 may be the same as that of the piezoelectric element 20, or the shaft 201 may be formed by some film structures of the piezoelectric element 20. The piezoelectric element 20 and the rotating shaft 201 are arranged in an insulating manner, and the two parts are isolated by adopting an insulating structure, or the rotating shaft 201 itself can adopt an insulating material, so that when a voltage is applied to the electrode of the piezoelectric element 20, the rotating shaft 201 is not influenced. Specifically, as shown in fig. 15d, when the piezoelectric element 20 is manufactured, one end of the piezoelectric element 20 may be isolated by using the insulating structure, and then the rotating shaft 201 may be manufactured, where the material of the rotating shaft 201 is the same as that of the piezoelectric element 20. The integral structure is not limited to this, and after the insulating layer 25 is formed, a part of the insulating layer 25 may be processed into the rotating shaft 201, and the material of the rotating shaft 201 may be a dielectric material.

It should be understood that the present embodiment only schematically describes several distribution manners of the rotating shafts 201 on the movable end, and actually, the distribution manner of the rotating shafts 201 may also be other, the number of the rotating shafts 201 is not limited to one, two or three, and may also be four, five or six, etc., and the present embodiment is not limited. Moreover, when the distribution of the rotating shafts 201 is different, the number of the limiting grooves 40 and the positions on the surface of the moved element 30 should be changed correspondingly.

Example two

The present embodiment differs from the preceding embodiments in that: the side wall of the movable end of the piezoelectric element is provided with the stop block, the moved element is limited to move in the direction vertical to the direction from the movable end to the fixed end of the piezoelectric element, the included angle between two adjacent piezoelectric elements is set, and the moved element is prevented from moving transversely by limiting the two adjacent elements mutually.

Optionally, the first film layer 41 is connected to the upper surface of the moved element 30, and in a direction parallel to the plane of the moved element 30 and along the concave of the limiting groove 40, the side wall of the moved element 30 protrudes relative to the concave side wall of the limiting groove 40; the electrical connection 44 is located within the first membrane layer 41. As shown in fig. 13, the moved element 30 covers most of the first film 41, and the distance between the moved element and the electrical connection portion 44 is shortened, so that the electrical signal connection end of the moved element 30 and the electrical connection portion 44 are more conveniently connected by a lead wire.

Optionally, the second film 42 has a stopper at the movable end of the piezoelectric element 20 along the direction perpendicular to the extending direction from the fixed end to the movable end, and the extending direction of the stopper is parallel to the piezoelectric element 20. As shown in fig. 14, stoppers are provided at upper and lower ends of the stopper groove 40 where the movable end of the piezoelectric element 20 is located, and the stoppers are located inside a dotted frame in fig. 14. When the position-limiting groove 40 is moved by the piezoelectric element 20, the position-limiting groove 40 and the piezoelectric element 20 can only move in the direction of the solid line arrow in the figure due to the existence of the stopper, and the relative movement between the position-limiting groove 40 and the piezoelectric element 20 in the direction of the dotted line in the figure is limited to the gap between the piezoelectric element 20 and the stopper, and the gap is relatively small, so that the movement error of the position-limiting groove 40 and the piezoelectric element 20 in the direction of the dotted line in the figure can be controlled within + -2 um. The stopper is provided with a sliding groove for the rotation shaft 201 to move, as shown in fig. 11, the stopper may penetrate through the side wall or not penetrate through the stopper, and when the stopper is not penetrated through, the rotation shaft 201 may be disposed in the groove for the groove formed on the stopper.

At least two piezoelectric elements 20 are optionally arranged on the lower surface of the moved element 30, and an included angle between two adjacent piezoelectric elements 20 is greater than 0 degree and less than 180 degrees. As shown in fig. 15, the angle between the piezoelectric element 20 in the a direction and the piezoelectric element in the b direction is 90 degrees, and the angle between the piezoelectric element 20 in the a direction and the piezoelectric element in the b direction may be any angle greater than 0 degree and less than 180 degrees, but 0 degree and 180 degrees are not included. The shape of the moved element 30 is a square, the shape of the moving element in the present embodiment is a square, the shape of the moving element is not limited to a square, and the moved element 30 may be any polygon, circle, or the like. The piezoelectric elements 20 are distributed axisymmetrically around the moved element 30. Namely, the moved elements a, b, c and d are provided with the piezoelectric elements 20. If the piezoelectric element in the a direction moves towards the a direction, the moving distance of the piezoelectric element in the b direction in the a direction is limited to the gap between the piezoelectric element and the side wall, and similarly, the piezoelectric elements in the b direction, the c direction and the d direction are limited by the stop blocks of the adjacent piezoelectric elements when moving towards all directions, so that the transverse movement of the moved element is limited, and the piezoelectric elements can only move upwards or downwards.

Optionally, the imaging module further comprises: the initial limiting structure comprises at least one limiting arm arranged opposite to the supporting block; or the supporting block and the initial limiting structure form a direct or indirect annular surrounding limiting groove.

As shown in fig. 10a, the supporting block 50 and the stopper wall 81 are disposed opposite to each other, and when the piezoelectric element is not energized, the stopper groove is located in a space between the supporting block 50 and the stopper wall 81. As shown in fig. 10b, the supporting block 50 and the limiting wall 81 may be discontinuous and have a plurality of parts spaced apart from each other, and in a specific implementation, the supporting block 50 and the limiting wall 81 may be divided into any parts. The support blocks 50 and the stopper walls 81 are spaced apart to reduce the weight of the lifter.

As shown in fig. 10c, the space formed by the supporting block 50 and the limiting wall 81 completely encloses the limiting groove 40 and the piezoelectric element 20, so that the limiting groove is located in the space formed by the supporting block 50 and the initial limiting structure when the piezoelectric element is not energized. As shown in fig. 10d, a plurality of support blocks 50 and initial retaining structures are spaced to form a discrete space around the retaining groove 40 and piezoelectric element 20, thereby reducing the weight of the lifter. In a specific implementation, the supporting block 50 and the initial limiting structure are not limited to be divided into several parts in the drawing, and the supporting block 50 and the initial limiting structure may be divided into any parts according to a specific application scenario.

EXAMPLE III

The embodiment of the present invention further provides a method for manufacturing an imaging module, where the imaging module includes a moved element, and the moved element is an element that needs to be externally connected with a signal, and the method includes:

providing a substrate 1701;

forming a support block 50 on the substrate 1701;

forming a piezoelectric element 20, a lead 75, an elastic conductor 80 and a limiting groove 40 on the substrate 1701, wherein the piezoelectric element 20 comprises a movable end and a fixed end, the fixed end is fixed on the supporting block 50, the movable end extends into the limiting groove 40, and the movable end is wholly located in the limiting groove 40 or partially located in the limiting groove 40; a lead 75 is located on the piezoelectric element 20, the lead 75 extending from the movable end to the fixed end; the elastic conductor 80 is located between the piezoelectric element 20 and the limiting groove 40 in the thickness direction of the piezoelectric element 20, one end of the elastic conductor 80 is connected to the lead of the movable end of the piezoelectric element 20, and the other end is electrically connected to the electrical connection part 44;

the limiting groove 40 has a first region and a second region, the limiting groove second region having an electrical connection 44;

arranging the moved element 30 on the first region of the limiting groove 40;

electrically connecting the moved element 30 with the electrical connection 44 of the second region.

The manufacturing method of the imaging module comprises the following steps:

a substrate 1701 is provided.

The substrate 1701 includes a first region that is subsequently used to form a support block and a second region that is subsequently used to form a retaining groove.

The substrate 1701 may be any suitable substrate known to those skilled in the art, and may be, for example, at least one of the following materials: silicon (Si), germanium (Ge), silicon germanium (SiGe), silicon carbon (SiC), silicon germanium carbon (SiGeC), indium arsenide (InAs), gallium arsenide (GaAs), indium phosphide (InP), or other III/V compound semiconductors, and further includes a multilayer structure composed of these semiconductors, or may be Silicon On Insulator (SOI), silicon on insulator (SSOI), silicon germanium on insulator (S-SiGeOI), silicon germanium on insulator (SiGeOI), and germanium on insulator (GeOI), or may be Double-Side Polished silicon Wafers (DSP), or may be a ceramic substrate such as alumina, quartz, or a glass substrate. This embodiment employs silicon as the substrate 1701.

The substrate comprises a first area and a second area, a supporting block is formed on the first area, and a limiting groove is formed on the second area.

In this embodiment, the substrate further comprises a third region; subsequently forming the initial limiting structure on the third area;

the support block 50, the piezoelectric element 20, the lead 75, the elastic conductor 80, and the stopper groove 40 are formed on the substrate 1701.

In this embodiment, the supporting block and the limiting groove are formed in the same process step. In other embodiments, the support block and the retaining groove are not formed in the same process step.

The method of forming the support block, piezoelectric element 20, wires and resilient conductors and retaining groove 40 on the substrate is described in detail with reference to fig. 18a to 18 t.

Referring to fig. 18a, a first sacrificial layer 1702 is formed on a second region of the substrate.

Before forming the first sacrificial layer 1702 on the substrate, the method further includes: an anti-adhesion link 1703 is formed on the substrate, and the anti-adhesion link 1703 is a plurality of discrete bumps.

The anti-sticking link 1703 is located on the substrate surface of the second region.

The anti-adhesion structure 1703 functions to reduce adhesion between the first sacrificial layer 1702 and the substrate 1701, so as to facilitate later separation of the first sacrificial layer 1702 from the substrate 1701, and a plurality of discrete bumps is formed by patterning the substrate.

The method for forming the first sacrificial layer 1702 comprises the following steps: forming an initial first sacrificial layer 1702 on the substrate and the anti-adhesion link 1703; removing the initial first sacrificial layer 1702 in the first region to form the first sacrificial layer 1702, wherein the first sacrificial layer 1702 is located in the second region of the substrate;

depositing a sacrificial layer material on the substrate and the anti-adhesion link 1703 to form an initial first sacrificial layer 1702, and patterning the initial first sacrificial layer 1702 to form the first sacrificial layer 1702. As shown in fig. 18 a.

Referring to fig. 18b, a first support layer 1704 is formed on the first region of the substrate; forming a third film 43 of a limiting groove 40 on the first sacrificial layer 1702, wherein a first opening 1705 is formed between the third film 43 and the first support layer 1704;

optionally, the first portion of the initial limit structure 82 is formed during the formation of the support blocks of the first region.

Depositing a structural layer, which may be Poly, SiGe, etc., to a thickness of 5um, on the structure shown in fig. 18a, and then patterning the structural layer to form a first support layer 1704 on the first region of the substrate; a third membrane layer 43 of the limiting groove 40 is formed on the first sacrificial layer 1702, a first opening 1705 is formed between the third membrane layer 43 and the first support layer 1704, and a first portion of the initial limiting structure 82 is formed on a third region of the substrate.

Referring to fig. 18c and 18d, a patterned second sacrificial layer 1706 is formed in the first opening 1705 and on the third membrane layer 43, and the second sacrificial layer 1706 exposes at least a surface of an end of the third membrane layer 43 away from the first support layer 1704.

Depositing a second sacrificial layer 1706 on the structure shown in FIG. 18b, and planarizing the second sacrificial layer 1706, wherein the thickness of the second sacrificial layer 1706 can be 0.5-1 um, thereby obtaining the structure shown in FIG. 18 c.

The second sacrificial layer 1706 is patterned to expose the first supporting layer 1704, the first portion of the initial stopper structure 82 and the third membrane layer 43, resulting in the structure shown in fig. 18.

Referring to fig. 18e, a second support layer 1707 is formed on the first support layer 1704, and the first support layer 1704 and the second support layer 1707 constitute a support block.

A first portion 1708 of the second membrane layer of the limiting groove 40 is formed on the exposed third membrane layer 43 of the second sacrificial layer 1706.

Optionally, the movable end has a spindle 201, and the movable end of the piezoelectric element 20 is located on the surfaces of the third sacrificial layer 1710 and the spindle 201; the method for forming the first portion of the second film layer, the first support layer 1704 and the rotating shaft 201 comprises the following steps:

depositing an initial structure layer on the second sacrificial layer 1706, the third membrane layer 43 and the first support layer 1704; patterning the initial structure layer to form a first portion of the second membrane layer, a second support layer 1707 and the hinge 201, wherein the hinge 201 is located on the second sacrificial layer 1706, the second support layer 1707 is located on the first support layer 1704, the first portion of the second membrane layer is located on the third membrane layer 43, and a top surface of the first portion of the second membrane layer, a top surface of the second support layer 1707 and a top surface of the hinge 201 are flush.

Optionally, during the process of forming the first portion 1708 of the second film layer, a second portion of the initial limiting structure 82 is formed, the second portion of the initial limiting structure 82 being located above the first portion of the initial limiting structure 82.

Optionally, during the process of forming the first portion 1708 of the second film layer, a first layer of the second film layer stop is formed, the first layer of the stop being perpendicular to the first portion of the second film layer.

A structural layer is deposited on the structure shown in fig. 18d, and the deposited structural layer is patterned to form a second support layer 1707, a first portion 1708 of a second film layer, the rotating shaft 201, and a second portion of the initial position limiting structure 82, as shown in fig. 18 e.

Referring to FIG. 18f, a third sacrificial layer 1710 is formed on the second sacrificial layer 1706, wherein the third sacrificial layer 1710 is flush with the top surface of the spindle 201; a third sacrificial layer 1710 is deposited on the structure shown in fig. 18e, and the third sacrificial layer 1710 is planarized such that the third sacrificial layer 1710 is flush with the top surface of the spindle 201.

Referring to fig. 18g, the piezoelectric element 20 is formed on the third sacrificial layer 1710, the spindle 201, and the second support layer 1707.

A piezoelectric element 20 is formed on the second support layer 1707, one end of the piezoelectric element 20 on the second support layer 1707 is a fixed end, and the end opposite to the fixed end is a movable end, and the piezoelectric element 20 is not in contact with the first portion 1708 of the second film layer.

The structure of the piezoelectric element is described with reference to the foregoing embodiments, and is not described herein again.

Bonding the fixed end of the piezoelectric element 20 to the second support layer 1707 with the movable end of the piezoelectric element 20 on the third sacrificial layer 1710, and optionally, bonding the end of the movable end of the piezoelectric element 20 to the spindle 201. The bonding method comprises the following steps: structural adhesive bonding or dry film bonding.

The first layer of the block is positioned at two ends of the movable end of the piezoelectric element in the extending direction from the fixed end to the movable end, and the extending direction of the first layer of the block is parallel to the piezoelectric element.

Referring to fig. 18h, a fourth sacrificial layer 1711 is formed on the surface of the piezoelectric element 20, and the fourth sacrificial layer 1711 also covers the supporting block and the surface of the first portion of the second film layer.

A third opening 1712 for forming a wire at the movable end of the piezoelectric element 20 is formed in the fourth sacrificial layer 1711, and the wire at the movable end of the piezoelectric element 20 is exposed from the third opening 1712.

And depositing a fourth sacrificial layer 1711 on the structure shown by 18g, and flattening the fourth sacrificial layer 1711, wherein the thickness of the fourth sacrificial layer 1711 can be 0.5-1 um. And patterning the fourth sacrificial layer 1711 to form a third opening 1712, wherein the third opening 1712 exposes the lead at the movable end of the piezoelectric element 20.

Referring to fig. 18i, an initial elastic conductive layer is formed in the third opening 1712 and on the surface of the fourth sacrificial layer 1711, and the initial elastic conductive layer on the surface of the fourth sacrificial layer 1711 is patterned to form an elastic conductive body which fills the third opening 1712, is located above the piezoelectric element 20, and extends from the movable end to the fixed end.

The elastic conductor is manufactured by RDL (re-wiring), and the contact position of an IC circuit (I/O pad) originally designed is changed by a wafer level metal wiring process and a bump process, so that the IC can be suitable for different packaging forms. The metal routing process of is to coat an insulating passivation layer on the IC, define a new conductive pattern by exposure and development, and then use electroplating technique to fabricate a new metal circuit to connect the original aluminum pad and the new bump or gold pad for redistribution. The rewired metal circuit is mainly plated with copper materials, and nickel gold or nickel palladium gold can be plated on the copper circuit according to needs.

A suspended elastic conductor is formed above the piezoelectric element 20, and one end of the elastic conductor is electrically connected to the lead.

Referring to fig. 18j, a fifth sacrificial layer 1713 is formed overlying the elastic electrical conductor and the fourth sacrificial layer 1711, the fifth sacrificial layer 1713 also overlying the second membrane layer first portion.

A fifth sacrificial layer 1713 is deposited over the structure shown in fig. 18i, and the fifth sacrificial layer 1713 may be 0.5um thick for a planarization process.

Forming a second film layer second portion on the second film layer first portion, the second film layer first portion and second film layer second portion comprising a second film layer.

Optionally, in the process of forming the second portion 1715 of the second film layer, a third portion of the initial limiting structure 82 is formed, the third portion of the initial limiting structure 82 is located above the second portion of the initial limiting structure 82, and the first portion of the initial limiting structure 82, the second portion of the initial limiting structure 82, and the third portion of the initial limiting structure 82 form the initial limiting structure 82.

Referring to fig. 18k, a fourth opening 1714 is formed through the fourth sacrificial layer 1711 and the fifth sacrificial layer 1713, the fourth opening 1714 exposing at least a portion of the first portion 1708 of the second film layer.

In the process of forming the fourth opening 1714, forming a stopper opening 1724 and forming a fixing block opening 1725 are also included.

In one embodiment, the fourth opening 1714 surrounds the movable end of the piezoelectric element 20.

The fifth sacrificial layer 1713 is patterned, and the fifth sacrificial layer 1713 and the fourth sacrificial layer 1711 are etched in the patterning process to form a fourth opening 1714.

Referring to fig. 18l, an initial second structural layer is formed in the fourth opening 1714 and on the fifth sacrificial layer 1713, the initial second structural layer is patterned, the initial second structural layer on the surface of the fifth sacrificial layer 1713 is removed, a second portion 1715 of the second film layer is formed in the fourth opening 1714, and the top surface 1715 of the second portion 1715 of the second film layer is higher than the surface of the fifth sacrificial layer 1713.

A second layer of stops is formed within the stop opening 1724, the first and second layers of stops forming a stop.

The fixing block 1726 is formed in the opening of the fixing block, and the rotating shaft stopper 1726 can connect the joint of the elastic conductor 80 and the piezoelectric element 20 more firmly, so that the problem of poor contact at the joint of the elastic conductor 80 and the piezoelectric element 20 is avoided in the warping process of the piezoelectric element 20 and the elastic conductor 80.

Optionally, the second film layer has a stopper at the movable end of the piezoelectric element 20 along the direction perpendicular to the extending direction from the fixed end to the movable end, and the extending direction of the stopper is parallel to the piezoelectric element 20.

A structural layer is deposited over the structure shown in fig. 18k, and the structural layer is patterned to form a second portion 1715 of the second film layer and to form a third portion of the initial stopper structure 82.

Forming a first film 41 over the second film, wherein the first film 41 is located over the elastic conductor, and the elastic conductor is suspended between the first film 41 and the piezoelectric element 20;

referring to fig. 18m, a sixth sacrificial layer 1716 is formed on the fifth sacrificial layer 1713, the sixth sacrificial layer 1716 covering the second film layer;

depositing a sixth sacrificial layer 1716 on the fifth sacrificial layer 1713, and etching the sixth sacrificial layer 1716 and the fifth sacrificial layer 1713 in the second region to form a fifth opening 1717, a sixth opening 1718, and a seventh opening 1719, wherein the fifth opening 1717 exposes the other end of the elastic conductor, which is not connected to the conductive line, the sixth opening 1718 exposes a portion of the surface of the second portion 1715 of the second film, and the seventh opening 1719 exposes the top of the stopper of the second film.

Referring to fig. 18o, forming a spacer 1720 covering the inner walls of the fifth opening 1717, the sixth opening 1718 and the seventh opening 1719, wherein the spacer 1720 further covers the surface of the sixth sacrificial layer 1716; the isolation layer 1720 is removed at the bottom of a portion of the sixth opening 1718, exposing the surface of the elastic conductor.

Isolation layer 1720 is deposited over the structure shown in fig. 18n, where isolation layer 1720 may be SIN and may be 1um thick. The isolation layer 1720 is patterned, and the isolation layer 1720 on the fixed end of the piezoelectric element 20 is etched away, which is an electrode exposure process on the piezoelectric element 20 to facilitate later wiring.

Referring to fig. 18p, electrical connections 44 are formed in the sixth opening 1718 and the seventh opening 1719, the electrical connections 44 are also located on the surface of the sixth sacrificial layer 1716 between the sixth opening 1718 and the seventh opening 1719, so that the electrical connections 44 in the sixth opening 1718 and the electrical connections 44 in the seventh opening 1719 are conducted, and the electrical connections 44 at the bottom of the sixth opening 1718 are connected with the elastic electrical conductor; the electrical connection portion 44 of the sixth opening 1718 is connected to the exposed surface of the elastic conductor.

The electrical connection portions 44 are formed by the RDL process on the surfaces of the sixth sacrificial layer 1716 within the sixth opening 1718 and the seventh opening 1719 and between the sixth opening 1718 and the seventh opening 1719, and the material of the electrical connection portions 44 may be copper.

Referring to fig. 18q, a first film layer 41 is formed in the fifth opening 1717, on the sixth sacrificial layer 1716 and on the electrical connection portion 44; a portion of the first film 41 at the bottom of the seventh opening 1719 is removed to expose the electrical connection portion 44 at the bottom of the seventh opening 1719.

The first film 41 has a first region and a second region, and an electrical connection portion 44 penetrating the first film 41 is formed in the first film 41 in the second region, so that the electrical connection portion 44 is electrically connected to the elastic electrical conductor.

And depositing PI in the fifth opening 1717, on the sixth sacrificial layer 1716 and on the electric connection part 44, and patterning the deposited PI to form a first film layer 41, wherein the material of the first film layer 41 is firstly limited to PI. Materials such as dry films may also be used.

Referring to fig. 18r, a connection layer 1721 is formed on the first region of the limiting groove 40; placing the moved element 30 on a connecting layer 1721; the moved element 30 is connected to the connection layer 1721 by dispensing.

The material of the connection layer 1721 includes a dry film or a curing adhesive.

Referring to fig. 18s, electrically connecting the moved element 30 with the electrical connection 44 of the second region;

referring to fig. 18t, the first sacrificial layer 1702, the second sacrificial layer 1706, the third sacrificial layer 1710, the fourth sacrificial layer 1711, the fifth sacrificial layer 1713, and the sixth sacrificial layer 1716 are removed. The moving element is electrically connected with the electrical connection portion 44 of the second region, and then the first sacrificial layer 1702, the second sacrificial layer 1706, the third sacrificial layer 1710, the fourth sacrificial layer 1711, the fifth sacrificial layer 1713 and the sixth sacrificial layer 1716 are removed, so that the wiring accuracy of the moved element 30 and the electrical connection portion 44 of the second region is ensured.

Removing the first sacrificial layer 1702, the second sacrificial layer 1706, the third sacrificial layer 1710, the fourth sacrificial layer 1711, the fifth sacrificial layer 1713, and the sixth sacrificial layer 1716 is releasing the first sacrificial layer 1702, the second sacrificial layer 1706, the third sacrificial layer 1710, the fourth sacrificial layer 1711, the fifth sacrificial layer 1713, and the sixth sacrificial layer 1716 by a hydrogen peroxide wet method.

Providing a circuit board 10, wherein the first external signal connecting end and the second external signal connecting end are positioned on the circuit board 10; placing the surface of the substrate, which faces away from the moved element, on a circuit board; the electrodes in the piezoelectric element 20 are electrically connected to a first external signal connection terminal, and the lead at the fixed end of the piezoelectric element 20 is electrically connected to a second external signal connection terminal. In this embodiment, the first sacrificial layer, the second sacrificial layer, the third sacrificial layer, the fourth sacrificial layer, the fifth sacrificial layer, and the sixth sacrificial layer may be made of silicon oxide, germanium, or the like, and the designed pattern is fixed on the device by patterning through photolithography, etching, or other processes. The etching includes dry etching or wet etching. In the embodiments, the material of the structural layers, such as the first structural layer and the second structural layer, may be polysilicon, silicon germanium, or the like.

In the implementation, the electrical signal connecting end and the electrical connection part are connected together through the lead, and after the wiring of the moved element 30 is completed, the sacrificial layer is removed, so that the wiring precision is ensured. The fabrication method of this implementation is completed on a single wafer.

It will be apparent to those skilled in the art that various changes and modifications may be made in the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. An imaging module, comprising:

2. The imaging module of claim 1, wherein the moved element comprises: imaging sensing elements, variable lenses, or variable apertures.

3. The imaging module of claim 1, wherein the piezoelectric element comprises: the piezoelectric device comprises a support layer, a piezoelectric laminated structure positioned on the support layer and an insulating layer positioned on the piezoelectric laminated structure, wherein the piezoelectric laminated structure comprises: the upper surface and the lower surface of each piezoelectric film are distributed with electrodes, and two adjacent piezoelectric films share the electrode positioned between the two piezoelectric films; the electrodes are counted from bottom to top in sequence, the electrodes of the odd layers are electrically connected together, and the electrodes of the even layers are electrically connected together.

4. The imaging module of claim 3, wherein the piezoelectric element further comprises: the first leading-out end is electrically connected with the odd layer electrode; the second leading-out terminal is electrically connected with the even layer electrode; the first leading-out end and the second leading-out end are both positioned on the top surface or the bottom surface of the piezoelectric element, or one of the first leading-out end and the second leading-out end is positioned on the top surface and the other one is positioned on the bottom surface; the first leading-out end and the second leading-out end are electrically connected with the first external signal connecting end.

5. The imaging module of claim 3, wherein the conductive wires are routed on a surface of an insulating layer of the piezoelectric element.

6. The imaging module of claim 1, wherein the elastic electrical conductor comprises a meander or spiral configuration.

7. The imaging module of claim 1 or 6, wherein the elastic electrical conductor comprises a spring wire or a flexible wire; the elastic electric conductor is made of metal, and the metal comprises: copper, aluminum, gold, platinum, copper alloy or aluminum alloy.

8. The imaging module of claim 1, wherein the retaining groove is surrounded by at least one membrane layer; the film layer is distributed at the edge of the moved element; alternatively, the film layer is distributed over the entire surface of the moved element.

9. The lens module as recited in claim 8, wherein the limiting groove comprises a first film layer, a second film layer and a third film layer stacked on the surface of the moved element in sequence, two sides of the first film layer and the third film layer extend outward relative to the second film layer to form a protruding portion, and the protruding portion and an end of the second film layer enclose the limiting groove.

10. The lens module as claimed in claim 9, wherein the first film layer is connected to the upper surface or the lower surface of the moved element, and the sidewall of the moved element protrudes relative to the recessed sidewall of the position-limiting groove in a direction parallel to the plane of the moved element and along the recessed direction of the position-limiting groove; the electrical connection is located within the first film layer.

11. The imaging module of claim 10, wherein the second membrane has stops at the movable end of the piezoelectric element along a direction perpendicular to the extension direction from the fixed end to the movable end, the stop extending parallel to the piezoelectric element.

12. The imaging module of claim 1 or 11, wherein the number of the piezoelectric elements is a natural number greater than or equal to 2, and an included angle between two adjacent piezoelectric elements is greater than 0 degree and less than 180 degrees.

13. The imaging module of claim 12, wherein the piezoelectric elements are axisymmetrically distributed around the moved element.

14. The lens module as claimed in claim 1, wherein the movable end has a shaft disposed therein, the shaft provides a moving space for the shaft, and the shaft and the piezoelectric element are integrated and insulated from each other; alternatively, the rotary shaft is bonded to the movable end of the piezoelectric element.

15. The lens module as claimed in claim 14, wherein the rotation axis is disposed at two sides of the movable end; or at least one rotating shaft is distributed between two sides of the movable end.

16. The imaging module of claim 1, wherein the moved element has an electrical signal connection end electrically connected to the electrical connection portion.

17. The imaging module of claim 1, further comprising: the first external signal connecting end and the second external signal connecting end are located on the circuit board.

18. The imaging module of claim 1, further comprising: the initial limiting structure comprises at least one limiting arm arranged opposite to the supporting block; or the supporting block and the initial limiting structure form a direct or indirect annular surrounding limiting groove.

19. A manufacturing method of an imaging module is characterized in that the imaging module comprises a moved element, and the moved element is an element needing an external signal, and the method comprises the following steps:

providing a substrate;

forming a support block on the substrate;

arranging the moved element on the first area of the limiting groove;

20. The method of claim 19, further comprising, prior to forming a backing block on the substrate: an anti-adhesion structure is formed on the substrate, and the anti-adhesion structure is a plurality of discrete bumps.

21. The method of claim 19, wherein the substrate comprises a first region and a second region, the support block is located in the first region, and the retaining groove is located in the second region; the supporting block and the limiting groove are formed in the same process step;

the method for forming the supporting block, the piezoelectric element, the lead, the elastic conductor and the limiting groove comprises the following steps:

forming a first sacrificial layer on the second region of the substrate;

forming a first support layer on the first region of the substrate;

forming a third film layer of a limiting groove on the first sacrificial layer, wherein a first opening is formed between the third film layer and the first support layer;

forming a patterned second sacrificial layer in the first opening and on the third film layer, wherein the second sacrificial layer at least exposes the surface of one end of the third film layer away from the first support layer;

forming a second supporting layer on the first supporting layer, wherein the first supporting layer and the second supporting layer form a supporting block;

forming a first part of a second film layer of a limiting groove on the third film layer exposed by the second sacrificial layer;

forming a piezoelectric element on the second supporting layer, wherein one end of the piezoelectric element on the second supporting layer is a fixed end, and the end opposite to the fixed end is a movable end, and the piezoelectric element is not in contact with the first part of the second film layer;

forming a lead on the piezoelectric element, the lead extending from a fixed end to a movable end;

forming a suspended elastic conductor above the piezoelectric element, wherein one end of the elastic conductor is electrically connected with the lead;

forming a second film layer second portion on the second film layer first portion, the second film layer first portion and second film layer second portion comprising a second film layer;

forming a first film layer above the second film layer, wherein the first film layer is positioned above the elastic conductor, and the elastic conductor is suspended between the first film layer and the piezoelectric element;

the first film layer is provided with a first area and a second area, and an electric connection part penetrating through the first film layer is formed in the first film layer of the second area, so that the electric connection part is electrically connected with the elastic electric conductor.

22. The method of claim 21, wherein forming a piezoelectric element on the second support layer comprises:

and bonding the fixed end of the piezoelectric element to the second support layer.

23. The method of claim 21, wherein the movable end has a hinge thereon, and the movable end of the piezoelectric element is located on the third sacrificial layer and the hinge surface;

forming the rotating shaft and the second supporting layer in the first part of the process of forming the second film layer;

the forming method of the first part of the second film layer, the first supporting layer and the rotating shaft comprises the following steps:

depositing on the second sacrificial layer, the third film layer and the first support layer to form an initial structure layer; patterning the initial structure layer to form a first part of a second film layer, a second supporting layer and a rotating shaft, wherein the rotating shaft is positioned on a second sacrificial layer, the second supporting layer is positioned on a first supporting layer, the first part of the second film layer is positioned on a third film layer, and the top surface of the first part of the second film layer, the top surface of the second supporting layer and the top surface of the rotating shaft are flush;

forming a third sacrificial layer on the second sacrificial layer, wherein the third sacrificial layer is flush with the top surface of the rotating shaft;

and forming the piezoelectric element on the third sacrificial layer, the rotating shaft and the second supporting layer.

24. The method of claim 21, wherein forming a suspended elastic conductor over the piezoelectric element comprises:

forming a fourth sacrificial layer on the surface of the piezoelectric element, wherein the fourth sacrificial layer also covers the supporting block and the surface of the first part of the second film layer;

forming a third opening of a lead at the movable end of the piezoelectric element in the fourth sacrificial layer, wherein the lead at the movable end of the piezoelectric element is exposed out of the third opening;

and forming an initial elastic conductive layer in the third opening and on the surface of the fourth sacrificial layer, and performing graphical treatment on the initial elastic conductive layer on the surface of the fourth sacrificial layer to form an elastic conductive body, wherein the elastic conductive body fills the third opening, is positioned above the piezoelectric element and extends from the movable end to the fixed end.

25. The method of claim 24, wherein forming a second portion of a second layer over the first portion of the second layer comprises:

forming a fifth sacrificial layer overlying the resilient electrical conductor and the fourth sacrificial layer, the fifth sacrificial layer also overlying the second membrane layer first portion;

forming a fourth opening penetrating through the fourth sacrificial layer and the fifth sacrificial layer, wherein the fourth opening at least exposes a first part of a part of the second film layer, and the fourth opening surrounds the movable end of the piezoelectric element;

forming an initial second structure layer in the fourth opening and on the fifth sacrificial layer, patterning the initial second structure layer, removing the initial second structure layer on the surface of the fifth sacrificial layer,

and forming a second part of the second film layer in the fourth opening, wherein the top surface of the second part of the second film layer is higher than the surface of the fifth sacrificial layer.

26. The method of claim 25, wherein the second film layer has stops at the movable end of the piezoelectric element along a direction perpendicular to the extension direction from the fixed end to the movable end, the extension direction of the stops being parallel to the piezoelectric element;

and in the process of forming the second film layer, forming a stop block of the second film layer.

27. The method of claim 26, wherein forming a first layer over the second layer comprises:

forming a sixth sacrificial layer on the fifth sacrificial layer, wherein the sixth sacrificial layer covers the second film layer;

etching the sixth sacrificial layer and the fifth sacrificial layer in the second area to form a fifth opening, a sixth opening and a seventh opening, wherein the fifth opening exposes the other end of the elastic conductor, which is not connected with the lead, the sixth opening exposes part of the surface of the second sublayer of the second film layer, and the seventh opening exposes the top of the stop block of the second film layer;

forming electric connection parts in the sixth opening and the seventh opening, wherein the electric connection parts are also positioned on the surface of a sixth sacrificial layer between the sixth opening and the seventh opening, so that the electric connection parts in the sixth opening and the electric connection parts in the seventh opening are conducted, and the electric connection parts at the bottom of the sixth opening are connected with the elastic electric conductor;

forming a first film layer in the fifth opening, on the sixth sacrificial layer and on the electrical connection portion;

and removing part of the first film layer at the bottom of the seventh opening to expose the electric connection part at the bottom of the seventh opening.

28. The method of claim 27, wherein after forming the fifth opening, the sixth opening, and the seventh opening, and before forming the electrical connection portion, further comprising: forming an isolation layer covering the inner wall of the fifth opening, the inner wall of the sixth opening and the inner wall of the seventh opening, wherein the isolation layer also covers the surface of the sixth sacrificial layer; removing part of the isolation layer at the bottom of the sixth opening to expose the surface of the elastic electric conductor;

the electric connection portions are positioned in the sixth opening, in the seventh opening and on the surface of the isolation layer on a part of the sixth sacrificial layer.

29. The method of manufacturing an imaging module of claim 28, wherein the imaging module further comprises: the initial limiting structure comprises at least one limiting arm arranged opposite to the supporting block; or the supporting block and the initial limiting structure form a direct or indirect annular surrounding limiting groove; the substrate further comprises a third area, and the area where the initial limiting structure is located is the third area;

forming a first portion of the initial limit structure during the forming of the support blocks of the first region;

forming a second portion of the initial limiting structure during the forming of the first portion of the second film layer, the second portion of the initial limiting structure being located above the first portion of the initial limiting structure;

and in the process of forming the second part of the second film layer, forming a third part of the initial limiting structure, wherein the third part of the initial limiting structure is positioned above the second part of the initial limiting structure, and the first part of the initial limiting structure, the second part of the initial limiting structure and the third part of the initial limiting structure form the initial limiting structure.

30. The method of claim 29, wherein after electrically connecting the moved element to the electrical connection portion of the second region; further comprising: and removing the first sacrificial layer, the second sacrificial layer, the third sacrificial layer, the fourth sacrificial layer, the fifth sacrificial layer and the sixth sacrificial layer.

31. The method of claim 19, wherein disposing the moved element on the first region of the retaining groove comprises:

forming a connecting layer on the first region of the limiting groove; placing the moved element on a connecting layer;

the material of the connecting layer comprises a dry film or a curing adhesive.

32. The method of claim 19, wherein the step of forming the imaging module includes the step of forming a mask pattern,

providing a circuit board, wherein the first external signal connecting end and the second external signal connecting end are positioned on the circuit board; placing the surface of the substrate, which faces away from the moved element, on a circuit board; and electrically connecting an electrode in the piezoelectric element with the first external signal connecting end, and electrically connecting a lead at the fixed end of the piezoelectric element with the second external signal connecting end.