CN113130732A - Peltier temperature control module, temperature control system and electric automobile - Google Patents
Peltier temperature control module, temperature control system and electric automobile Download PDFInfo
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- CN113130732A CN113130732A CN201911418078.4A CN201911418078A CN113130732A CN 113130732 A CN113130732 A CN 113130732A CN 201911418078 A CN201911418078 A CN 201911418078A CN 113130732 A CN113130732 A CN 113130732A
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- 239000004065 semiconductor Substances 0.000 claims abstract description 104
- 238000010438 heat treatment Methods 0.000 claims abstract description 58
- 238000001816 cooling Methods 0.000 claims description 54
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract 1
- 230000005679 Peltier effect Effects 0.000 description 16
- 238000000034 method Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000003574 free electron Substances 0.000 description 8
- 238000004146 energy storage Methods 0.000 description 7
- 239000012535 impurity Substances 0.000 description 6
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005057 refrigeration Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 238000011217 control strategy Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/82—Connection of interconnections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/615—Heating or keeping warm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/625—Vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/657—Means for temperature control structurally associated with the cells by electric or electromagnetic means
- H01M10/6572—Peltier elements or thermoelectric devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention provides a Peltier temperature control module, a temperature control system and an electric automobile. The Peltier temperature control module comprises a Peltier assembly, and an N-end lug and a P-end lug which are connected with the Peltier assembly; the Peltier assembly includes an N-type semiconductor member connected to the N-terminal lug, a P-type semiconductor member connected to the P-terminal lug, and a conductive element for connecting the N-type semiconductor member and the P-type semiconductor member. In the invention, the N-end lug and the P-end lug of the Peltier temperature control module can be respectively connected with the temperature control power supply, and the switching of two functions of heating and refrigerating can be realized by adjusting the current flow direction of effective current input to the Peltier temperature control module, so that the temperature control efficiency is higher; moreover, the Peltier temperature control module has the advantages of low production cost, small size, convenience for installation on a product to be temperature controlled and contribution to improving the temperature control efficiency.
Description
Technical Field
The invention relates to the technical field of temperature control, in particular to a Peltier temperature control module, a temperature control system and an electric automobile.
Background
In the use process of partial products, the temperature control technology is needed to control the temperature of the products, so that the products work at a proper environment temperature, and the phenomenon that the temperature is too high or too low is avoided, and the product performance or the user experience is influenced. For example, for a product to be temperature controlled, which is an electric energy storage device (including but not limited to a lithium battery) of an electric vehicle, there are problems of low performance when operating at an excessively low temperature and high risk of damage and extreme insecurity when operating at an excessively high temperature, and therefore, it is necessary to adopt a temperature control technology to ensure that the electric energy storage device is not affected by an ambient temperature and can be kept to operate at an appropriate ambient temperature for a long time to ensure performance and safety of the electric energy storage device. For another example, for a product to be temperature controlled, such as a seat (including but not limited to a car seat), when the temperature of the seat is too high or too low, the user feels uncomfortable when riding the seat, and the user experience is affected, so that the temperature of the seat needs to be adjusted by using a temperature control technology. Wherein, the product to be temperature controlled is a product needing temperature control.
The traditional temperature control system adopts cooling media such as refrigerants and the like to carry out temperature control in a heat conduction mode, the temperature control system needs to be provided with a cooling loop, a refrigerating assembly and a heating assembly, wherein the cooling loop is connected with a product to be temperature controlled and filled with the cooling media, the refrigerating assembly is connected with the cooling loop and used for achieving a refrigerating function, and the heating assembly is used for achieving a heating function. In the process of refrigeration, the refrigeration component cools the cooling medium in the cooling loop and conducts heat, so that the refrigeration function is realized, the temperature of a product to be controlled by temperature is reduced, but the refrigeration efficiency is low in the mode; correspondingly, in the process of heating, the heating assembly heats the cooling medium in the cooling loop and conducts heat, so that the heating function is realized, the temperature of the product to be temperature controlled is increased, and the heating efficiency is low in the mode. Therefore, the existing temperature control system has the defects of high production cost, large volume and low temperature control efficiency.
Disclosure of Invention
The invention provides a Peltier temperature control module, a temperature control system and an electric automobile, and aims to solve the problem that the temperature control efficiency of the current temperature control system is low.
The embodiment of the invention provides a Peltier temperature control module, which comprises a Peltier component, an N-end lug and a P-end lug, wherein the N-end lug and the P-end lug are connected with the Peltier component; the Peltier assembly includes an N-type semiconductor member connected to the N-terminal lug, a P-type semiconductor member connected to the P-terminal lug, and a conductive element for connecting the N-type semiconductor member and the P-type semiconductor member.
Preferably, the number of the peltier assemblies is at least two, the N-type semiconductor elements of two adjacent peltier assemblies are connected through a first wire, the P-type semiconductor elements of two adjacent peltier assemblies are connected through a second wire, the first wire is connected with the N-terminal lug, and the second wire is connected with the P-terminal lug.
Preferably, the N-type semiconductor member comprises a first liner and an N-type semiconductor medium disposed within the first liner; the P-type semiconductor member includes a second liner and a P-type semiconductor dielectric disposed within the second liner.
Preferably, the conductive element is embodied as an elongated metal sheet.
The embodiment of the invention also provides a temperature control system, which comprises the Peltier temperature control module, a temperature control power supply and a controller connected with the temperature control power supply; the controller pass through connecting wire with the N of peltier control by temperature change module holds utmost point ear and P utmost point ear and links to each other, the controller is used for acquireing steerable the peltier control by temperature change module carries out the target control signal that refrigerates or heat, and is based on the target control signal is right the output energy of control by temperature change power carries out energy conversion, in order to control the peltier control by temperature change module refrigerates or heats.
Preferably, the peltier temperature control module comprises a first peltier module assembled inside a product to be temperature controlled and a second peltier module assembled outside the product to be temperature controlled; the N-end lug of the first Peltier module is connected with the temperature control power supply or the N-end lug of the second Peltier module; and the P-end lug of the first Peltier module is connected with the temperature control power supply or the P-end lug of the second Peltier module.
Preferably, the temperature control system further comprises a temperature sensor, wherein the temperature sensor is assembled on the product to be temperature controlled, is connected with the controller, and is used for collecting the ambient temperature in the product to be temperature controlled and sending the ambient temperature to the controller, so that the controller adjusts a target control signal capable of controlling the peltier temperature control module to perform cooling or heating according to the ambient temperature.
Preferably, the first peltier module is attached to the outer surface of the product to be temperature controlled, and an insulating spacer is arranged between the first peltier module and the product to be temperature controlled.
Preferably, the product of treating control by temperature change includes the battery module, the battery module includes two at least battery cells that set up side by side, adjacent two be equipped with one between the battery cell first peltier module, just first peltier module with be equipped with insulating separator between the battery cell.
The embodiment of the invention also provides an electric automobile which comprises a product to be temperature controlled and the temperature control system, wherein the Peltier temperature control module in the temperature control system is connected with the product to be temperature controlled.
In the Peltier temperature control module, the temperature control system and the electric automobile, disclosed by the invention, an N-end lug and a P-end lug of the Peltier temperature control module can be respectively connected with a temperature control power supply, and the switching of two functions of heating and refrigerating can be realized by adjusting the current flow direction of effective current input to the Peltier temperature control module, so that the temperature control efficiency is higher; because the Peltier temperature control assembly can realize heating and refrigerating functions through the N-type semiconductor piece, the P-type semiconductor piece and the conductive element, a cooling loop, a refrigerating assembly, a heating assembly and the like do not need to be configured, the production cost is low, the size is small, the Peltier temperature control assembly is convenient to install on a product to be temperature controlled, and the temperature control efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a Peltier temperature control module in accordance with an embodiment of the present invention;
FIG. 2 is a schematic diagram of a temperature control system in accordance with an embodiment of the present invention;
FIG. 3 is a schematic diagram of a cell and a Peltier temperature control module according to an embodiment of the present invention;
FIG. 4 is a schematic view of a battery module and a Peltier temperature control module according to an embodiment of the present invention;
FIG. 5 is another schematic diagram of a temperature control system in accordance with an embodiment of the present invention.
10, a Peltier temperature control module; 11. a Peltier module; 111. an N-type semiconductor member; 112. a P-type semiconductor member; 113. a conductive element; 12. an N-end tab; 13. a P-end tab; 14. a first conductive line; 15. a second conductive line; 101. a first peltier module; 102. a second Peltier module; 20. a temperature control power supply; 30. a controller; 40. connecting a lead; 50. a product to be temperature controlled; 51. a single battery; 511. a positive electrode tab; 512. a negative electrode tab; 52. a battery module; 521. a housing; 60. an insulating spacer; 70. a temperature sensor; 80. and (4) vehicle-mounted loads.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The embodiment of the invention provides a peltier temperature control module 10, and the peltier temperature control module 10 is used for being assembled on a product 50 to be temperature controlled and can realize a refrigerating or heating function, so that the product 50 to be temperature controlled can be subjected to temperature control, and the requirements of people can be met. As shown in fig. 1, the peltier temperature control module 10 includes a peltier module 11, an N-terminal tab 12 and a P-terminal tab 13 connected to the peltier module 11; the peltier module 11 includes an N-type semiconductor member 111, a P-type semiconductor member 112, and a conductive member 113 for connecting the N-type semiconductor member 111 and the P-type semiconductor member 112, the N-type semiconductor member 111 being connected to the N-terminal tab 12, and the P-type semiconductor member 112 being connected to the P-terminal tab 13.
The peltier module 11 is a minimum unit for realizing temperature control, and is a module that can be independently installed and can realize a cooling or heating function using the peltier effect.
The N-type semiconductor member 111 is an element made based on an N-type semiconductor material. The N-type semiconductor is an impurity semiconductor having a free electron concentration much higher than a hole concentration, and is formed by doping a pentavalent element (e.g., phosphorus) into a pure silicon crystal so as to substitute the position of a silicon atom in the crystal. In the N-type semiconductor, free electrons are majority electrons, holes are minority electrons, the conduction is mainly realized by the free electrons, the free electrons are mainly provided by impurity atoms, the holes are formed by thermal excitation, and the more impurities are doped, the higher the concentration of the free electrons is, and the stronger the conduction performance is.
The P-type semiconductor member 112 is a device fabricated based on a P-type semiconductor material. The P-type semiconductor is an impurity semiconductor having a hole concentration much larger than a free electron concentration, and is formed by doping a trivalent element (e.g., boron) into a pure silicon crystal so as to substitute the position of a silicon atom in the crystal. In a P-type semiconductor, holes are majority electrons, and free electrons are minority electrons, and conduction is mainly realized by the holes. The holes are mainly provided by impurity atoms, free electrons are formed by thermal excitation, and the more impurities are doped, the higher the concentration of the holes is, and the stronger the conductivity is.
The conductive member 113 is a member having a conductive function for connecting the N-type semiconductor piece 111 and the P-type semiconductor piece 112.
The N-terminal tab 12 is a tab connected to the N-type semiconductor member 111 for connecting the temperature-controlled power supply 20 or other peltier temperature-controlled module 10, and is a metal conductor. The P-terminal lug 13 is a lug connected with the P-type semiconductor 112 for connecting with the temperature-controlled power supply 20 or other peltier temperature-controlled modules 10, and is a metal conductor. The temperature-controlled power supply 20 is a power supply that can output a current to form a peltier effect.
As an example, the peltier temperature control module 10 may be assembled on the product 50 to be temperature controlled, so that the peltier temperature control module 10 and the product 50 to be temperature controlled can conduct heat, thereby heating or cooling the product 50 to be temperature controlled. In this example, the N-terminal lug 12 and the P-terminal lug 13 of the peltier temperature control module 10 are connected to the temperature control power supply 20 through the connecting wires 40, so that the temperature control power supply 20 can transmit energy to the peltier temperature control module 10 through the N-terminal lug 12 and the P-terminal lug 13. Specifically, when the peltier temperature control module 10 needs to be controlled to heat, the current flow direction of the effective current output from the temperature control power supply 20 to the peltier temperature control module 10 can be controlled to be from the P-type semiconductor 112 to the N-type semiconductor 111, and according to the peltier effect, the conductive element 113 can release heat, so that the product 50 to be temperature controlled is heated, and the temperature of the product 50 to be temperature controlled is increased; when the peltier temperature control module 10 needs to be controlled to cool, the current of the effective current output from the temperature control power supply 20 to the peltier temperature control module 10 can be controlled to flow from the N-type semiconductor member 111 to the P-type semiconductor member 112, and according to the peltier effect, the conductive element 113 can absorb heat, so as to cool the product 50 to be temperature controlled, and thus to reduce the temperature of the product 50 to be temperature controlled. The current flow direction of the effective current output to the peltier temperature control module 10 by the temperature control power supply 20 can be adjusted, so that the peltier temperature control module 10 can be switched to perform heating and cooling functions, the operation process is simple, and the efficiency of temperature control is high. Further, since the amount of heat released or absorbed by the conductive element 113 is directly proportional to the current intensity and the voltage flowing through the conductive element 113 in the peltier effect, the amount of heat generated during the heating or cooling process can be controlled by adjusting the current intensity and the voltage of the effective current output from the temperature control power source 20 to the peltier temperature control module 10, and the peltier temperature control module 10 is prevented from being damaged. The effective current output from the temperature control power supply 20 to the peltier temperature control module 10 is a current finally input to the peltier temperature control module 10, and is a current for controlling the peltier temperature control module 10 to form the peltier effect.
The peltier temperature control module 10 provided in this embodiment can connect the N-terminal lug 12 and the P-terminal lug 13 of the peltier temperature control module 10 to the temperature control power supply 20, respectively, and can realize switching between heating and cooling functions by adjusting the current flow direction of the effective current output by the temperature control power supply 20 to the peltier temperature control module 10, so that the temperature control efficiency is high; because the peltier temperature control component can realize heating and refrigerating functions through the N-type semiconductor piece 111, the P-type semiconductor piece 112 and the conductive element 113, a cooling loop, a refrigerating component, a heating component and the like do not need to be configured, so that the peltier temperature control component is low in production cost and small in size, and is convenient to install on the product 50 to be temperature controlled, and the temperature control efficiency is improved.
In one embodiment, as shown in fig. 1, the number of the peltier modules 11 is at least two, the N-type semiconductor members 111 of two adjacent peltier modules 11 are connected by a first wire 14, the P-type semiconductor members 112 of two adjacent peltier modules 11 are connected by a second wire 15, the first wire 14 is connected to the N-terminal tab 12, and the second wire 15 is connected to the P-terminal tab 13.
The first wire 14 is a wire, specifically a metal wire, for connecting the N-type semiconductor members 111 of the two adjacent peltier modules 11 or for connecting the N-type semiconductor members 111 and the N-terminal lug 12. The second wire 15 is a wire, specifically a metal wire, for connecting the P-type semiconductor members 112 of the two adjacent peltier modules 11 or for connecting the P-type semiconductor members 112 and the P-terminal lug 13.
In this example, the peltier temperature control module 10 includes at least two peltier assemblies 11 connected in series, and the first wire 14 is used to connect the N-type semiconductor members 111 of two adjacent peltier assemblies 11 and connect the N-type semiconductor members 111 and the N-terminal lug 12; the second lead 15 is used to connect the P-type semiconductor members 112 of two adjacent peltier modules 11, and connect the P-type semiconductor members 112 and the P-terminal lug 13, so as to connect the N-terminal lug 12 and the P-terminal lug 13 with the temperature-controlled power supply 20. When the current of the effective current outputted from the temperature control power source 20 to the peltier temperature control module 10 flows from the P-terminal tab 13 to the N-terminal tab 12, the conductive elements 113 in the at least two peltier elements 11 release heat at the same time, so as to heat the product 50 to be temperature controlled, and as can be understood, the product 50 to be temperature controlled is heated at the same time by the at least two peltier elements 11, so that the heating control efficiency is high. When the current flow direction of the effective current outputted to the peltier temperature control module 10 from the temperature control power supply 20 flows from the N-terminal tab 12 to the P-terminal tab 13, the conductive elements 113 of the at least two peltier elements 11 absorb heat from the product 50 to be temperature controlled simultaneously, so as to cool the product 50 to be temperature controlled, understandably, the product 50 to be temperature controlled is cooled simultaneously by the at least two peltier elements 11, and thus the refrigeration control efficiency is high.
In one embodiment, the N-type semiconductor member 111 includes a first liner and an N-type semiconductor dielectric disposed within the first liner; the P-type semiconductor piece 112 includes a second liner and a P-type semiconductor dielectric disposed within the second liner.
Wherein the N-type semiconductor medium is a medium formed based on an N-type semiconductor material. The first pad is an insulating pad for encapsulating the N-type semiconductor medium, and is used for preventing the N-type semiconductor medium from leaking to influence the conductivity of the N-type semiconductor 111, and further influence the temperature control effect by the peltier effect.
Wherein the P-type semiconductor medium is a medium formed based on a P-type semiconductor material. The second pad is an insulating pad for encapsulating the P-type semiconductor medium, and is used for preventing the P-type semiconductor medium from affecting the conductivity of the P-type semiconductor 112 and further affecting the temperature control effect by the peltier effect.
As an example, the first and second gaskets are gaskets formed using at least one material of cermet, epoxy, and polyethylene. The first gasket and the second gasket are formed by any one of metal ceramic, epoxy resin and polyethylene, or formed by mixing at least two of metal ceramic, epoxy resin and polyethylene, so that the insulation property of the semiconductor medium packaged in the first gasket and the second gasket is ensured, and the condition that the semiconductor medium packaged in the first gasket and the second gasket leaks to influence the realization of the Peltier effect is avoided.
In one embodiment, the conductive element 113 is a strip-shaped metal sheet. The strip-shaped metal sheet can be a strip-shaped metal sheet formed by strip-shaped copper sheets, strip-shaped aluminum sheets or other metal materials with high conductivity and electric heating property. Copper and aluminum are cheap and high in electrical conductivity and electrical heating property, so that when the Peltier effect is generated, the copper and aluminum can be efficiently thermally conducted with the product 50 to be temperature controlled, and the temperature control efficiency is high; the strip-shaped metal sheet made of metal copper and metal aluminum can be more easily attached to the product 50 to be temperature controlled, so that the contact area between the strip-shaped metal sheet and the product 50 to be temperature controlled is increased, and the temperature control efficiency is improved. Generally, the ductility of copper is good, and the copper can be deformed properly, so that the strip-shaped metal sheet made of copper metal is attached to the product 50 to be temperature controlled more closely, which is helpful to increase the contact area with the product 50 to be temperature controlled, so as to ensure the temperature control efficiency, and therefore, the strip-shaped copper sheet is preferably used as the conductive element 113.
In one embodiment, as shown in fig. 2, a temperature control system is provided, which comprises the peltier temperature control module 10, the temperature control power supply 20 and the controller 30 connected to the temperature control power supply 20 in the above embodiment; the controller 30 is connected to the N-terminal lug 12 and the P-terminal lug 13 of the peltier temperature control module 10 through the connecting wire 40, and the controller 30 is configured to obtain a target control signal capable of controlling the peltier temperature control module 10 to perform cooling or heating, and perform energy conversion on output energy of the temperature control power supply 20 based on the target control signal to control the peltier temperature control module 10 to perform cooling or heating.
The temperature-controlled power supply 20 is a power supply connected to the peltier temperature control module 10 for causing the peltier temperature control module 10 to form a peltier effect, and the temperature-controlled power supply 20 is configured to output energy to the peltier temperature control module 10. The connection lead 40 is a lead for connecting the controller 30 and the peltier temperature control module 10. The controller 30 is connected to the temperature-controlled power supply 20 and the peltier temperature control module 10. The target control signal includes signals for controlling the direction of the current, the intensity of the current, and the magnitude of the voltage of the effective current input to the peltier temperature control module 10.
Generally, if the temperature control power supply 20 is directly connected to the peltier temperature control module 10, the current flow direction of the effective current output from the temperature control power supply 20 to the peltier temperature control module 10 is fixed, so that the peltier temperature control module 10 can only realize the cooling or heating function, and cannot realize the switching between the cooling and heating functions; moreover, when the output energy from the temperature control power source 20 to the peltier temperature control module 10 is large, the peltier temperature control module 10 may be damaged, and therefore, a controller 30 capable of energy conversion is required to be disposed between the temperature control power source 20 and the peltier temperature control module 10, where the energy conversion specifically includes determining a target control signal according to actual requirements, and converting the output energy from the temperature control power source 20 to the controller 30 based on the target control signal to adjust the energy input to the peltier temperature control module 10, so as to adjust the current flow direction, the current intensity, and the voltage magnitude of the effective current output to the peltier temperature control module 10, so as to complete the cooling or heating function, ensure that the peltier temperature control module 10 operates at safe and effective current intensity and voltage magnitude, and avoid damage to the peltier temperature control module 10.
As shown in fig. 2, the cathode of the controller 30 is connected to the anode of the temperature-controlled power supply 20, and the anode of the controller 30 is connected to the cathode of the temperature-controlled power supply 20, so that the controller 30 can receive the output energy of the temperature-controlled power supply 20, wherein the output energy is the energy output from the temperature-controlled power supply 20 to the controller 30. The controller 30 may determine the current flow direction, the current intensity, and the voltage magnitude of the effective current according to the cooling instruction or the heating instruction after receiving the cooling instruction or the heating instruction triggered by the external controller or the external operation button according to the actual requirement, so as to output energy to the peltier temperature control module 10 based on the current flow direction, the current intensity, and the voltage magnitude, so that the peltier temperature control module 10 completes the cooling or heating function, thereby ensuring that the peltier temperature control module 10 operates at safe and effective current intensity and voltage magnitude, and avoiding damage to the peltier temperature control module 10.
As an example, the peltier temperature control module 10 can be assembled on the product 50 to be temperature controlled, such that the N-terminal lug 12 and the P-terminal lug 13 of the peltier temperature control module 10 are connected to the controller 30 through the connecting wires 40, and the controller 30 is connected to the temperature control power source 20 through the connecting wires 40. When the peltier temperature control module 10 needs to be controlled to heat, the controller 30 can control the current flow direction of the effective current output from the temperature control power supply 20 to the peltier temperature control module 10 to be from the P-type semiconductor piece 112 to the N-type semiconductor piece 111, and according to the peltier effect, the conductive element 113 can release heat, so that the product 50 to be temperature controlled is heated, and the temperature of the product 50 to be temperature controlled is increased; when the peltier temperature control module 10 needs to be controlled to cool, the controller 30 can control the temperature control power supply 20 to output an effective current to the peltier temperature control module 10, wherein the current flow direction of the effective current flows from the N-type semiconductor member 111 to the P-type semiconductor member 112, and according to the peltier effect, the conductive element 113 can absorb heat, so as to cool the product 50 to be temperature controlled, and reduce the temperature of the product 50 to be temperature controlled. That is, the controller 30 can adjust the current flow direction of the effective current outputted from the temperature control power supply 20 to the peltier temperature control module 10, and realize switching between the heating and cooling functions of the peltier temperature control module 10, so that the operation process is simple and the efficiency of temperature control is high. Further, since the amount of heat released or absorbed by the conductive element 113 is directly proportional to the magnitude of the current and the voltage flowing through the conductive element 113 in the peltier effect, the controller 30 can adjust the magnitude of the current and the voltage of the effective current output from the temperature control power supply 20 to the peltier temperature control module 10, so as to control the amount of heat generated in the heating or cooling process.
The temperature control system provided by this embodiment can connect the N-terminal lug 12 and the P-terminal lug 13 of the peltier temperature control module 10 to the temperature control power supply 20 through the controller 30, and adjust the current flow direction of the effective current input to the peltier temperature control module 10 through the controller 30, so as to realize the switching between the heating function and the cooling function, and thus the temperature control efficiency is high; in addition, the controller 30 can also convert the output energy of the temperature control power supply 20 to adjust the current intensity and the voltage of the effective current input to the peltier temperature control module 10, so as to control the heat in the heating or cooling process; since the peltier module 11 can realize heating and cooling functions through the N-type semiconductor member 111, the P-type semiconductor member 112, and the conductive member 113, a cooling circuit, a cooling module, a heating module, and the like do not need to be provided, so that the peltier module is low in production cost, small in size, convenient to mount on the product 50 to be temperature-controlled, and helpful for improving the temperature control efficiency.
In an embodiment, as shown in fig. 2, the peltier temperature control module 10 comprises a first peltier module 101 mounted inside the product 50 to be temperature controlled and a second peltier module 102 mounted outside the product 50 to be temperature controlled; an N-end tab 12 of the first Peltier module 101 is connected with a temperature control power supply 20 or an N-end tab 12 of the second Peltier module 102; the P terminal tab 13 of the first peltier module 101 is connected to the temperature controlled power supply 20 or the P terminal tab 13 of the second peltier module 102.
The product 50 to be temperature controlled is a product that needs to be temperature controlled. The product 50 to be temperature controlled includes, but is not limited to, a single battery 51, a battery module 52 and other heat energy storage devices, and may also be a product requiring temperature adjustment, such as a cold air core and a warm air core of an automobile seat and an air conditioner.
The first peltier module 101 is a peltier temperature control module 10 assembled in the product 50 to be temperature controlled, and is in direct contact with the product 50 to be temperature controlled, and can perform heat exchange with the product 50 to be temperature controlled when the controller 30 adjusts the current flow direction of the effective current output from the temperature control power supply 20 to the peltier temperature control module 10, so as to realize the function of heating or cooling the product 50 to be temperature controlled; in addition, the controller 30 can also convert the output energy of the temperature-controlled power supply 20 to adjust the current intensity and the voltage of the effective current input to the peltier temperature-controlled module 10, so as to control the heat in the heating or cooling process.
The second peltier module 102 is a peltier temperature control module 10 assembled outside the product 50 to be temperature controlled, and is not in direct contact with the product 50 to be temperature controlled but in contact with the external environment, so as to implement heat exchange with the external environment, and perform heating or cooling when the controller 30 controls the current flow direction of the effective current output from the temperature control power supply 20 to the peltier temperature control module 10.
As an example, when the number of the first peltier module 101 and the second peltier module 102 is one, the connection modes with the temperature-controlled power supply 20 and the controller 30 are two types: firstly, the N-terminal tab 12 of the first peltier module 101 is connected to the temperature control power supply 20 through the controller 30, the P-terminal tab 13 of the first peltier module 101 is connected to the P-terminal tab 13 of the second peltier module 102, and the N-terminal tab 12 of the second peltier module 102 is connected to the temperature control power supply 20 through the controller 30. Secondly, a P-terminal tab 13 of the first peltier module 101 is connected to the temperature-controlled power supply 20 through the controller 30, an N-terminal tab 12 of the first peltier module 101 is connected to an N-terminal tab 12 of the second peltier module 102, and a P-terminal tab 13 of the second peltier module 102 is connected to the temperature-controlled power supply 20 through the controller 30.
As an example, when the number of the first peltier modules 101 and/or the second peltier modules 102 is at least two, one second peltier module 102 is disposed between two adjacent first peltier modules 101, one first peltier module 101 is disposed between two adjacent second peltier modules 102, so that the first peltier modules 101 and the second peltier modules 102 are alternately disposed, and the N-terminal tab 12 or the P-terminal tab 13 of the first peltier module 101 and the second peltier module 102 located at the end positions is connected to the controller 30 through the connection wire 40; the N-terminal tabs 12 and the P-terminal tabs 13 of the first and second peltier modules 101 and 102 located at the intermediate position are connected to each other. For example, if the number of the first peltier modules 101 is two and the number of the second peltier modules 102 is one, the second peltier module 102 is located between the two first peltier modules 101, the N-terminal tab 12 of the second peltier module 102 is connected to the N-terminal tab 12 of the first peltier module 101, the P-terminal tab 13 of the second peltier module 102 is connected to the P-terminal tab 13 of the second first peltier module 101, and at this time, the P-terminal tab 13 of the first peltier module 101 is connected to the controller 30 and the N-terminal tab 12 of the second first peltier module 101 is connected to the controller 30.
In this example, if the current flow of the active current flowing through the first peltier module 101 is from the P-type semiconductor 112 to the N-type semiconductor 111, heating is performed in the first peltier module 101; at this time, the current flowing through the effective current of the second peltier module 102 flows from the N-type semiconductor 111 to the P-type semiconductor 112, and the cooling is performed in the second peltier module 102, so that the temperature difference between the first peltier module 101 and the second peltier module 102 is large, and by heat exchange between the first peltier module 101 and the second peltier module 102, the external environment temperature can be better absorbed, so as to heat the product 50 to be temperature controlled, and the heating control of the product 50 to be temperature controlled can be more effectively realized, and the heating control efficiency is higher. On the other hand, if the current of the active current flowing through the first peltier module 101 flows from the N-type semiconductor device 111 to the P-type semiconductor device 112, cooling is performed in the first peltier module 101; at this time, the current flowing through the effective current of the second peltier module 102 flows from the P-type semiconductor 112 to the N-type semiconductor 111, and the heat is generated in the second peltier module 102, so that the temperature difference between the first peltier module 101 and the second peltier module 102 is large, and the heat of the product 50 to be temperature-controlled can be released to the external environment more effectively by the heat exchange between the first peltier module 101 and the second peltier module 102, and the cooling control of the product 50 to be temperature-controlled can be realized more effectively, and the cooling control efficiency is higher.
In an embodiment, the temperature control system further includes a temperature sensor 70, wherein the temperature sensor 70 is mounted on the product 50 to be temperature controlled, and is connected to the controller 30, and is configured to collect an ambient temperature inside the product 50 to be temperature controlled, and send the ambient temperature to the controller 30, so that the controller 30 adjusts a target control signal for controlling the peltier temperature control module 10 to perform cooling or heating according to the ambient temperature.
As an example, the temperature control system further includes a temperature sensor 70 mounted on the product 50 to be temperature controlled, and configured to collect the ambient temperature of the product 50 to be temperature controlled in real time, and send the collected ambient temperature to the controller 30, so that the controller 30 adjusts a target control signal for controlling the peltier temperature control module 10 to perform cooling or heating according to the ambient temperature and a preset temperature control strategy, and specifically adjusts the current flow direction of the effective current input to the peltier temperature control module 10, so that the peltier temperature control module 10 connected to the controller 30 transfers heat to the product 50 to be temperature controlled, or absorbs heat from the product 50 to be temperature controlled, so as to heat or cool the product 50 to be temperature controlled; and adjusts the current intensity and voltage of the effective current input to the peltier temperature control module 10 to control the heat in the heating or cooling process. As can be appreciated, the temperature controller 30 is configured to more effectively control the temperature of the product 50 to be temperature controlled, so that the temperature control is more accurate.
The temperature control strategy is a preset strategy which needs to be controlled for heating or cooling. Generally, the temperature control strategy may include an adjustment strategy in which the temperature control condition corresponds to the temperature control condition, for example, when the ambient temperature is lower than the low temperature threshold, the peltier temperature control module 10 is controlled to execute a heating adjustment strategy to increase the temperature of the product 50 to be temperature controlled; under the temperature control condition that the ambient temperature is higher than the high temperature threshold, the peltier temperature control module 10 is controlled to execute the cooling adjustment strategy to reduce the temperature of the product 50 to be temperature controlled. It is understood that the adjustment strategy includes controlling the current flowing direction of the effective current flowing through the peltier temperature control module 10, and may further include controlling the current intensity and voltage magnitude of the current flowing through the peltier temperature control module 10.
In one embodiment, as shown in fig. 3, the first peltier module 101 is attached to the outer surface of the product 50 to be temperature controlled, and an insulating spacer 60 is disposed between the first peltier module 101 and the product 50 to be temperature controlled. In the present example, the product 50 to be temperature controlled includes, but is not limited to, a single battery 51, a battery module 52, a car seat, a cold air core and a warm air core of an air conditioner, etc., and the present example takes the single battery 51 as an example for illustration.
The single battery 51 is the smallest electric energy storage device, and has the problems of low performance when the single battery 51 works at the excessively low temperature and high damage risk and extreme insecurity when the single battery 51 works at the excessively high temperature, so that when the single battery 51 is used as a product 50 to be temperature controlled and the first peltier module 101 is attached to the outer surface of the single battery 51, the first peltier module 101 is connected with the second peltier module 102. When the ambient temperature of the single battery 51 is low, the controller 30 can control the first peltier module 101 attached to the outer surface of the single battery 51 to heat the single battery 51, and at this time, the second peltier module 102 connected to the first peltier module 101 cools down, so that the single battery 51 can absorb heat from the external environment better, and the heating control efficiency is higher. When the temperature of the environment where the unit cells 51 are located is high, the controller 30 may control the first peltier module 101 attached to the outer surface of the unit cells 51 to cool the unit cells 51, and at this time, the second peltier module 102 connected to the first peltier module 101 heats, so that the unit cells 51 are connected to each other to more effectively release heat to the external environment, and the cooling control efficiency is higher.
The insulating spacer 60 is an element for isolating the first peltier module 101 and the single cell 51 from each other, and it can be understood that the insulating spacer 60 can insulate the first peltier module 101 and the single cell 51 from each other, so as to prevent the peltier effect generated by the first peltier module 101 from affecting the normal operation of the single cell 51, and prevent the current generated during the operation of the single cell 51 from affecting the implementation of the heating or cooling function of the first peltier module 101.
As an example, the size of the first peltier module 101 is equal to or smaller than the size of the unit cell 51, and the size of the insulating spacer 60 is equal to or larger than the size of the first peltier module 101, so as to prevent the first peltier module 101 from directly contacting the unit cell 51 after being expanded by heat, and thus, normal operation of the first peltier module 101 and the unit cell 51 is not affected.
In an embodiment, the product 50 to be temperature controlled includes a battery module 52, the battery module 52 includes at least two unit batteries 51 arranged side by side, a first peltier module 101 is disposed between two adjacent unit batteries 51, and an insulating spacer 60 is disposed between the first peltier module 101 and the unit batteries 51.
The battery module 52 is an electric energy storage device mainly formed by at least two single batteries 51, and the at least two single batteries 51 may be connected in series, in parallel, or in a combination of series and parallel.
In one example, the battery module 52 is an electrical energy storage device provided on an electric vehicle for supplying electrical energy to the vehicle-mounted load 80. As shown in fig. 4 and 5, the battery module 52 includes a housing 521 and at least two single batteries 51 stacked in the housing 521, wherein the anodes of the at least two single batteries 51 are connected to each other through a conductive sheet, the cathodes of the at least two single batteries 51 are connected to each other through a conductive sheet, an anode tab 511 and a cathode tab 512 are provided outside the battery module 52, a load connected to each other through a connection wire 40 is provided between the anode tab 511 and the cathode tab 512, and the load is a vehicle-mounted load 80 that requires the battery module 52 to provide energy when the battery module 52 is an electric vehicle. In this example, a first peltier module 101 is attached to each unit cell 51 through an insulating spacer 60, and the first peltier module 101 is disposed in the housing 521; two adjacent first peltier modules 101 are connected to each other through a second peltier module 102 disposed outside the housing 521. As shown in fig. 4 and 5, when the current of the active current flowing through the first peltier module 101 flows from the P-type semiconductor 112 to the N-type semiconductor 111, heating is performed in the first peltier module 101; at this time, the current of the effective current flowing through the second peltier module 102 flows from the N-type semiconductor 111 to the P-type semiconductor 112, and the cooling is performed in the second peltier module 102, so that the temperature difference between the first peltier module 101 and the second peltier module 102 is large, the external environment temperature is absorbed better, the battery module 52 is heated, the heating control of the battery module 52 can be performed more effectively, and the heating control efficiency is high. On the other hand, if the current of the active current flowing through the first peltier module 101 flows from the N-type semiconductor device 111 to the P-type semiconductor device 112, cooling is performed in the first peltier module 101; at this time, the current of the active current flowing through the second peltier module 102 flows from the P-type semiconductor 112 to the N-type semiconductor 111, and the second peltier module 102 heats up, so that the temperature difference between the first peltier module 101 and the second peltier module 102 is large, and the battery module 52 releases heat to the external environment more effectively, and cooling control of the battery module 52 can be realized more effectively, and the cooling control efficiency is higher.
In this example, at least two unit batteries 51 of the battery module 52 may be arranged side by side, and one first peltier module 101 is arranged between two adjacent unit batteries 51, so that the peltier temperature control module 10 can control the temperature of two adjacent unit batteries 51 attached to two sides of the peltier temperature control module 10, which is helpful for reducing the cost.
In this example, two sides of the first peltier module 101 are respectively provided with one insulating spacer 60, so that the insulating spacers 60 are respectively arranged between the first peltier module 101 and two adjacent single batteries 51, thereby preventing the peltier effect generated by the first peltier module 101 from affecting the normal operation of the single batteries 51, and preventing the current formed in the working process of the single batteries 51 from affecting the realization of the heating or cooling function of the first peltier module 101.
In one embodiment, an electric vehicle is provided, including but not limited to a hybrid vehicle and a plug-in electric vehicle. Specifically, the electric vehicle includes a product 50 to be temperature controlled and the temperature control system in the above embodiment, and the peltier temperature control module 10 in the temperature control system is connected to the product 50 to be temperature controlled.
In this example, the product to be temperature controlled 50 is specifically a product to be temperature controlled, which is disposed on an electric vehicle, and includes, but is not limited to, a single battery 51, a battery module 52, a vehicle seat, a cold air core and a warm air core of an air conditioner, and the like.
In the electric vehicle provided by the embodiment, the peltier temperature control module 10 is assembled on the product 50 to be temperature controlled, so that the peltier temperature control module 10 is connected with the product 50 to be temperature controlled, and heat transfer can be performed between the peltier temperature control module 10 and the product 50 to be temperature controlled; then, the N-terminal lug 12 and the P-terminal lug 13 of the Peltier temperature control module 10 are respectively connected with the temperature control power supply 20 through the controller 30, and the current flow direction of the effective current output to the Peltier temperature control module 10 by the temperature control power supply 20 is adjusted through the controller 30, so that the switching of two functions of heating and refrigerating can be realized, and the temperature control efficiency is high; in addition, the controller 30 can also convert the output energy of the temperature control power supply 20 to adjust the current intensity and the voltage of the effective current input to the peltier temperature control module 10, so as to control the heat in the heating or cooling process; since the peltier module 11 can realize heating and cooling functions through the N-type semiconductor member 111, the P-type semiconductor member 112, and the conductive member 113, a cooling circuit, a cooling module, a heating module, and the like do not need to be provided, so that the peltier module is low in production cost, small in size, convenient to mount on the product 50 to be temperature-controlled, and helpful for improving the temperature control efficiency.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. The Peltier temperature control module is characterized by comprising a Peltier assembly, and an N-end lug and a P-end lug which are connected with the Peltier assembly; the Peltier assembly includes an N-type semiconductor member connected to the N-terminal lug, a P-type semiconductor member connected to the P-terminal lug, and a conductive element for connecting the N-type semiconductor member and the P-type semiconductor member.
2. The peltier temperature control module of claim 1 wherein the number of the peltier modules is at least two, and the N-type semiconductor devices of two adjacent peltier modules are connected by a first wire, and the P-type semiconductor devices of two adjacent peltier modules are connected by a second wire, and the first wire is connected to the N-terminal lug and the second wire is connected to the P-terminal lug.
3. The peltier temperature control module of claim 1 wherein the N-type semiconductor member includes a first pad and an N-type semiconductor medium disposed within the first pad; the P-type semiconductor member includes a second liner and a P-type semiconductor dielectric disposed within the second liner.
4. The peltier temperature control module of claim 1 wherein the conductive element is embodied as an elongated metal sheet.
5. A temperature control system, comprising the peltier temperature control module of any one of claims 1-4, a temperature controlled power supply, and a controller connected to the temperature controlled power supply; the controller pass through connecting wire with the N of peltier control by temperature change module holds utmost point ear and P utmost point ear and links to each other, the controller is used for acquireing steerable the peltier control by temperature change module carries out the target control signal that refrigerates or heat, and is based on the target control signal is right the output energy of control by temperature change power carries out energy conversion, in order to control the peltier control by temperature change module refrigerates or heats.
6. The temperature control system of claim 5, wherein said Peltier temperature control modules comprise a first Peltier module mounted within a product to be temperature controlled and a second Peltier module mounted outside said product to be temperature controlled; the N-end lug of the first Peltier module is connected with the temperature control power supply or the N-end lug of the second Peltier module; and the P-end lug of the first Peltier module is connected with the temperature control power supply or the P-end lug of the second Peltier module.
7. The temperature control system of claim 6, further comprising a temperature sensor mounted on the product to be temperature controlled and connected to the controller for collecting an ambient temperature in the product to be temperature controlled and sending the ambient temperature to the controller, so that the controller can adjust a target control signal for controlling the peltier temperature control module to perform cooling or heating according to the ambient temperature.
8. The temperature control system of claim 6, wherein the first Peltier module is attached to an outer surface of the product to be temperature controlled, and an insulating spacer is disposed between the first Peltier module and the product to be temperature controlled.
9. The temperature control system of claim 6, wherein the product to be temperature controlled comprises a battery module, the battery module comprises at least two single batteries arranged side by side, the first Peltier module is arranged between two adjacent single batteries, and an insulating separator is arranged between the first Peltier module and the single battery.
10. An electric vehicle comprising a product to be temperature controlled, and further comprising a temperature control system of any one of claims 5-9, wherein a peltier temperature control module in the temperature control system is connected with the product to be temperature controlled.
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| CN208208927U (en) * | 2018-05-05 | 2018-12-07 | 力神（青岛）新能源有限公司 | A kind of lithium battery temperature control device based on semiconductor chilling plate |
| CN110165326A (en) * | 2019-05-14 | 2019-08-23 | 深圳市星龙基电子技术有限公司 | The humidity control system and method for on-vehicle battery |
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