CN113125918A - Preparation method of sample wafer for testing insulation performance of capacitor core of epoxy glue impregnated paper sleeve - Google Patents
Preparation method of sample wafer for testing insulation performance of capacitor core of epoxy glue impregnated paper sleeve Download PDFInfo
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- CN113125918A CN113125918A CN202110400935.9A CN202110400935A CN113125918A CN 113125918 A CN113125918 A CN 113125918A CN 202110400935 A CN202110400935 A CN 202110400935A CN 113125918 A CN113125918 A CN 113125918A
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- sample wafer
- capacitor core
- insulation performance
- epoxy glue
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/20—Preparation of articles or specimens to facilitate testing
Abstract
The invention discloses a preparation method of a sample wafer for testing the insulation performance of a capacitor core of an epoxy glue impregnated paper bushing, which mainly comprises the following steps: the method comprises the steps of crepe paper winding, epoxy impregnation, vacuum curing, axial slicing, surface treatment, surface electrode spraying and the like, and the sample wafer prepared by the method has good equivalence with the real insulating material of the bushing capacitor core, so that the test result is closer to the real insulating property of the insulating material.
Description
Technical Field
The invention relates to the field of electrical insulation test, in particular to a preparation method of a sample wafer for testing the insulation performance of a capacitor core body of an epoxy glue impregnated paper sleeve.
Background
The high-voltage bushing is used for leading a current-carrying conductor into or out of a metal box body or a wall body of a valve hall of equipment with different electric potentials in power transmission and transformation engineering, so that full voltage and full current are led in or out, the high-voltage bushing plays roles of insulation and mechanical support, and is comprehensively influenced by various aspects such as voltage, current, tension, vibration, wind power, atmospheric pollution and the like, factors such as current collection, heat, force, environment and the like act into a whole, the operation condition is extremely harsh, the operation reliability is directly related to the operation safety of a large power grid, and the high-voltage bushing is one of key equipment for ensuring the. The epoxy resin impregnated paper condenser type sleeve (also called dry type sleeve) taking the cured epoxy resin impregnated insulating paper as main insulation is widely applied to power grid construction due to the characteristics of excellent and stable electrical performance, explosion prevention, flame retardance, small volume, light weight and the like. At present, the epoxy glue impregnated paper condenser type sleeve is mainly used for a converter transformer valve side sleeve and a direct current wall bushing. The glue-impregnated paper capacitor core is connected with the hollow composite insulator through a flange, and SF6 gas with certain pressure is filled in an air cavity between the capacitor core and the hollow composite insulator to serve as auxiliary insulation of the sleeve. One end of a current-carrying guide rod inside the capacitor core is connected with an extension guide rod positioned in the hollow composite insulator, and the extension guide rod is connected with a wiring terminal at the top of the sleeve. The core tail is generally in the transformer oil, and the current-carrying rod tail terminal is used for connecting with a transformer winding.
In order to test the insulation performance of the material used for the epoxy glue impregnated paper bushing capacitor core, such as insulation resistance, breakdown strength, dielectric loss factor, capacitance and the like, a test sample wafer with equivalent insulation of the capacitor core needs to be prepared. At present, most scientific research units sample wafer preparation methods are high-temperature vacuum forming and high-temperature compression molding. The capacitor core body of the epoxy glue impregnated paper sleeve is formed by winding crepe paper under a certain tension condition, then impregnating the crepe paper in epoxy glue, and finally curing and forming at high temperature under a vacuum condition. Therefore, the main problem of the high-temperature vacuum forming method is that the forming process has no tension control, the stretching state of the wrinkles has a large difference from the actual capacitor core, and the content ratio of the epoxy glue to the crepe paper also has a large difference, so that the actual insulation difference from the capacitor core is large. In addition, the main problem for high temperature press molding is that there is no vacuum environment and the force is pressure during the molding process. The forming under the vacuum-free environment condition can lead to the bubble content in the sample wafer to be greatly increased, the insulativity is changed, and the external pressure and the pulling force in the acting force mode can not be equivalent. In summary, the existing preparation methods of the sample wafer for testing the insulation performance of the capacitor core of the epoxy glue impregnated paper bushing have certain limitations, and the prepared sample wafer for testing cannot be equivalent to the insulation material of the original bushing capacitor core.
Disclosure of Invention
The invention provides a method for preparing a sample wafer for testing the insulation performance of an epoxy glue impregnated paper sleeve capacitor core, which is used for testing the insulation performance of a material used for testing the capacitor core and needs to prepare a sample wafer for testing the insulation equivalent of the capacitor core.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a preparation method of a sample wafer for testing the insulation performance of a capacitor core of an epoxy glue impregnated paper sleeve comprises the following steps:
and (3) winding crepe paper:
under the condition of fixed tension, clockwise or anticlockwise uniformly winding the crepe paper on the outer side of the cylindrical bar by taking the cylindrical bar as an axis, and stopping winding the crepe paper and fixing the crepe paper on the outermost layer to prevent loosening when the diameter meets the requirement;
epoxy glue dipping:
adding epoxy resin and a curing agent into the tank body, uniformly stirring, completely soaking the cylindrical bar wrapped with crepe paper into the epoxy resin mixed liquid, and sealing the tank body;
vacuum curing step:
carrying out vacuum pumping treatment on the tank body by using a vacuum pump, and keeping the vacuum state in the tank body; simultaneously heating the tank body, wherein the temperature is higher than the temperature required by the epoxy resin curing reaction until the epoxy resin is completely cured, naturally cooling to room temperature to complete the preparation of the core body, and then taking the core body out of the tank body;
axial slicing step:
according to the sizes of preset sample wafers such as length, width and thickness, the capacitor core is axially sliced to form a primary sample wafer, so that the direction of applied voltage is consistent with the direction of voltage borne by the actual bushing core in the insulation performance test;
surface treatment:
carrying out smoothing treatment on the surface of the primary sample wafer to reduce the roughness of the surface of the sample wafer;
surface electrode spraying:
and spraying a metal electrode on the surface of the sample wafer according to the specific insulation test requirement to finish the preparation of the sample wafer.
Further, in the crepe paper winding step, the tension of the fixed tension is not less than 100N.
Further, in the crepe paper winding step, the diameter of the bar is not less than 50 mm; the diameter is not less than 100mm after winding.
Further, in the vacuum curing step, the vacuum state in the tank body is maintained, and the pressure is 0-10 Pa.
Further, in the vacuum curing step, the curing time is not less than 24 hours.
Further, in the axial slicing step, radial cutting is not possible.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a preparation method of a sample wafer for testing the insulation performance of a capacitor core of an epoxy glue impregnated paper bushing, which mainly comprises the following steps: the method comprises the steps of crepe paper winding, epoxy impregnation, vacuum curing, axial slicing, surface treatment, surface electrode spraying and the like, and the prepared sample wafer has good equivalence with the insulating material of the sleeve capacitor core.
Drawings
Fig. 1 is a flowchart of a sample wafer preparation method for testing insulation performance of a capacitor core of an oxygen-impregnated paper bushing according to an embodiment of the present invention.
Detailed Description
Example (b):
the technical solution of the present invention is further described below with reference to the accompanying drawings and examples.
The embodiment provides a preparation method of a sample wafer for testing the insulation performance of an epoxy glue impregnated paper bushing capacitor core, which mainly comprises the following steps: winding crepe paper, impregnating with epoxy, curing in vacuum, slicing axially, surface treating and surface electrode spraying.
Firstly, winding crepe paper, taking a cylindrical bar as an axis under the condition of fixed tension, winding the crepe paper on the outer side of the cylindrical bar at a constant speed clockwise or anticlockwise until the diameter meets the requirement, stopping winding the crepe paper and fixing the crepe paper on the outermost layer so as to prevent loosening. Wherein the tensile force is not less than 100N, and the content ratio of paper wrinkles to epoxy glue can be controlled through the tensile force; the diameter of the bar is not less than 50 mm; the diameter of the wound sample wafer is not less than 100mm so as to ensure the equivalence of the prepared sample wafer and the insulating material of the bushing capacitor core
Secondly, impregnating the epoxy glue, adding epoxy resin, curing agent and other fillers into the tank body, uniformly stirring, completely impregnating the cylindrical bar wrapped with the crepe paper into the epoxy resin mixed liquid, and sealing the tank body.
Thirdly, vacuum curing, namely, performing vacuum pumping treatment on the tank body by using a vacuum pump, and keeping the vacuum state in the tank body, wherein the pressure is 0-10 Pa. And simultaneously heating the tank body to a temperature higher than the temperature required by the epoxy resin curing reaction until the epoxy resin is completely cured, naturally cooling to room temperature to complete the preparation of the core body, and taking the core body out of the tank body. The curing temperature is controlled, the temperature is not too high, and the curing time is not less than 24h to ensure the equivalence of the prepared sample wafer and the insulating material of the bushing capacitor core
And axial slicing, namely, axially slicing the capacitor core according to the sizes of preset sample wafers such as length, width and thickness to form a primary sample wafer so as to ensure that the direction of the applied voltage is consistent with the direction of the voltage borne by the actual sleeve core during the insulation performance test and radial cutting cannot be performed.
Surface treatment, namely, smoothing the surface of the primary sample wafer to reduce the roughness of the surface of the sample wafer.
Sixthly, spraying a surface electrode, and spraying a metal electrode on the surface of the sample wafer according to the specific insulation test requirement to finish the preparation of the sample wafer.
The sample wafer prepared by the steps has good equivalence with the real sleeve capacitor core insulating material, so the test result is closer to the real insulating property of the insulating material
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention accordingly, and not to limit the protection scope of the present invention accordingly. All equivalent changes or modifications made in accordance with the spirit of the present disclosure are intended to be covered by the scope of the present disclosure.
Claims (6)
1. A preparation method of a sample wafer for testing the insulation performance of a capacitor core of an epoxy glue impregnated paper sleeve is characterized by comprising the following steps:
and (3) winding crepe paper:
under the condition of fixed tension, clockwise or anticlockwise uniformly winding the crepe paper on the outer side of the cylindrical bar by taking the cylindrical bar as an axis, and stopping winding the crepe paper and fixing the crepe paper on the outermost layer to prevent loosening when the diameter meets the requirement;
epoxy glue dipping:
adding epoxy resin and a curing agent into the tank body, uniformly stirring, completely soaking the cylindrical bar wrapped with crepe paper into the epoxy resin mixed liquid, and sealing the tank body;
vacuum curing step:
carrying out vacuum pumping treatment on the tank body by using a vacuum pump, and keeping the vacuum state in the tank body; simultaneously heating the tank body, wherein the temperature is higher than the temperature required by the epoxy resin curing reaction until the epoxy resin is completely cured, naturally cooling to room temperature to complete the preparation of the core body, and then taking the core body out of the tank body;
axial slicing step:
according to the sizes of preset sample wafers such as length, width and thickness, the capacitor core is axially sliced to form a primary sample wafer, so that the direction of applied voltage is consistent with the direction of voltage borne by the actual bushing core in the insulation performance test;
surface treatment:
carrying out smoothing treatment on the surface of the primary sample wafer to reduce the roughness of the surface of the sample wafer;
surface electrode spraying:
and spraying a metal electrode on the surface of the sample wafer according to the specific insulation test requirement to finish the preparation of the sample wafer.
2. The method for preparing a sample wafer for testing the insulation performance of the capacitor core body of the epoxy glue impregnated paper bushing according to claim 1, wherein in the crepe paper winding step, the tension of the fixed tension is not less than 100N.
3. The method for preparing the sample wafer for testing the insulation performance of the capacitor core body of the epoxy glue impregnated paper bushing according to claim 1 or 2, wherein in the crepe paper winding step, the diameter of the bar is not less than 50 mm; the diameter is not less than 100mm after winding.
4. The method for preparing the sample wafer for testing the insulation performance of the capacitor core body of the epoxy glue impregnated paper bushing according to claim 1, wherein in the vacuum curing step, the vacuum state in the tank body is maintained, and the pressure is 0-10 Pa.
5. The method for preparing the sample wafer for testing the insulation performance of the capacitor core body of the epoxy glue impregnated paper sleeve according to claim 1 or 4, wherein in the vacuum curing step, the curing time is not less than 24 hours.
6. The method for preparing a sample wafer for testing the insulation performance of a capacitor core of an epoxy glue impregnated paper bushing according to claim 1, wherein in the step of axially slicing, radial cutting is not possible.
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