CN113124617A - Double-temperature cabinet and defrosting control method thereof - Google Patents
Double-temperature cabinet and defrosting control method thereof Download PDFInfo
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- CN113124617A CN113124617A CN201911411336.6A CN201911411336A CN113124617A CN 113124617 A CN113124617 A CN 113124617A CN 201911411336 A CN201911411336 A CN 201911411336A CN 113124617 A CN113124617 A CN 113124617A
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- refrigerating chamber
- frost
- defrosting
- temperature cabinet
- humidity
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- 238000010257 thawing Methods 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims description 11
- 238000007710 freezing Methods 0.000 claims abstract description 45
- 230000008014 freezing Effects 0.000 claims abstract description 45
- 239000004065 semiconductor Substances 0.000 claims abstract description 41
- 238000005057 refrigeration Methods 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 238000001514 detection method Methods 0.000 claims description 11
- 230000009977 dual effect Effects 0.000 claims description 11
- 230000009467 reduction Effects 0.000 claims description 10
- 238000005187 foaming Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims 2
- 239000002274 desiccant Substances 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/003—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with respect to movable containers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/06—Removing frost
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/14—Collecting or removing condensed and defrost water; Drip trays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/10—Arrangements for mounting in particular locations, e.g. for built-in type, for corner type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/003—Arrangement or mounting of control or safety devices for movable devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
Abstract
The invention discloses a double-temperature cabinet which comprises a box body, wherein a freezing chamber liner and a refrigerating chamber liner are arranged in the box body, the freezing chamber liner defines a freezing chamber, and the refrigerating chamber liner defines a refrigerating chamber; still including reducing the frost module, reduce the frost module including: the defrosting channel is used for communicating the external space of the box body with the internal space of the freezing chamber and the internal space of the refrigerating chamber, so that external air can enter the freezing chamber and the refrigerating chamber; the semiconductor refrigeration element comprises a cold end and a hot end, and the hot end can transfer heat to the inner container of the refrigerating chamber; the first heat dissipation part is arranged on the air inlet flow path of the defrosting channel and can absorb cold energy of the cold end so as to condense water vapor in the wet air entering the defrosting channel from the external space into frost and adsorb the frost on the surface of the frost. The invention solves the problems that in the prior art, the defrosting of the double-temperature cabinet is realized by adopting a drying agent, the double-temperature cabinet needs to be replaced, and the use cost of a user is high due to the fact that a heating wire needs to be arranged in the double-temperature cabinet for temperature compensation.
Description
Technical Field
The invention belongs to the field of household electrical appliances, and particularly relates to an improvement of a double-temperature cabinet and a defrosting control method of the double-temperature cabinet.
Background
At present, the problem of a large amount of frosting exists in the double-temperature cabinet, the frosting amount is large, the electricity consumption of the refrigerator is increased, and the experience feeling of a user in use is very poor. The important factor influencing the frosting amount in the refrigerator is that when the compressor is started and stopped, the pressure in the refrigerator changes, wet air outside the refrigerator enters the refrigerator through the door gap, and then the wet air is precooled and condensed into frost.
The common method for reducing the frosting of the double-temperature cabinet is to utilize a vent pipe to be connected with the outside, a drying agent is added into the vent pipe, when a compressor of the refrigerator works, outside air enters the refrigerator after being dehumidified by the drying agent through the pre-installed vent pipe, and the purpose of controlling the frosting is achieved. 2 groups of ventilation pipelines are needed to be arranged in the refrigerating chamber and the freezing chamber respectively to realize frost control;
but the service life of the drying agent in the vent pipe is short, the drying agent needs to be replaced periodically, the use cost of a user is increased, and meanwhile, as the double-temperature cabinet is provided with 2 groups, the use cost of the user is further increased because 2 groups need to be replaced when the double-temperature cabinet is replaced; simultaneously, two temperature cabinet are owing to there are walk-in and freezer, the difference in temperature is great in walk-in and the freezer, the temperature of freezer can influence the temperature variation in the walk-in, and then make the temperature lower in the walk-in, for compensating the temperature in the walk-in, guarantee that cold-stored courage temperature is between 0-8 ℃, all increase the heating of aluminium foil heater strip and carry out temperature compensation, owing to need solitary heater strip that sets up, the manufacturing cost of whole two temperature cabinet has been improved, and the user is when using, the heater strip heating also needs the electricity, it is big to have leaded to use power consumption in the use, the energy consumption is high.
Disclosure of Invention
Aiming at the problems that in the prior art, a drying agent is adopted for frost control of a double-temperature cabinet, replacement is needed, and a heating wire is needed to be arranged in the double-temperature cabinet for temperature compensation, so that the use cost of a user is high, the arranged frost reduction and control module can be repeatedly used, the temperature compensation in the refrigerating liner can be realized while frost reduction is carried out, and the use cost of the user is reduced.
In order to realize the purpose of the invention, the invention is realized by adopting the following technical scheme:
a double-temperature cabinet, which comprises a cabinet body,
a freezing chamber liner and a refrigerating chamber liner are arranged in the box body, the freezing chamber liner defines a freezing chamber, and the refrigerating chamber liner defines a refrigerating chamber;
still including reducing the frost module, it is including:
the defrosting channel is used for communicating the external space of the box body with the internal space of the freezing chamber and the internal space of the refrigerating chamber, so that external air can enter the freezing chamber and the refrigerating chamber;
a semiconductor refrigeration component comprising:
a cold end;
the hot end is connected with the refrigerating chamber liner and can raise the temperature when the semiconductor refrigerating element operates and transfer heat to the refrigerating chamber liner so as to raise the temperature of the refrigerating chamber;
the first heat dissipation part is arranged on an air inlet flow path of the defrosting channel, is connected with the cold end, and can absorb cold energy of the cold end when the semiconductor refrigeration element operates and the temperature of the cold end is reduced so as to condense water vapor in the wet air entering the defrosting channel from the external space into frost and adsorb the frost on the surface of the cold end.
Further, the frost reducing channel comprises:
a first frost reducing passage communicating with an external space, the first heat dissipating member being located in the first frost reducing passage;
a second frost reducing passage respectively communicating with the freezing chamber and the first frost reducing passage;
and a third frost reducing passage respectively communicated with the refrigerating chamber and the first frost reducing passage.
Further, the method also comprises the following steps:
a humidity detection element provided in the refrigerating chamber for detecting humidity in the refrigerating chamber,
the electric control is positioned on the third frost reducing channel and used for controlling the on-off of the third frost reducing channel;
and the controller is used for receiving the humidity value of the humidity detection element and controlling the electric control according to the relation between the humidity value and a preset humidity value preset in the humidity detection element.
Further, the method also comprises the following steps: the first defrosting channel comprises an upper vent pipe and a lower vent pipe, and the first heat dissipation part is arranged between the upper vent pipe and the lower vent pipe and is attached to and connected with the cold end of the semiconductor refrigerating element.
Furthermore, the hot end of the semiconductor refrigeration element is attached to the refrigerating chamber inner container.
Further, the method also comprises the following steps: and one side of the second heat radiating part is attached to the hot end of the semiconductor refrigerating element, and the other side of the second heat radiating part is attached to the side wall of the refrigerating chamber liner.
Furthermore, the defrosting device also comprises a water collecting device which is arranged at the bottom of the first defrosting channel and used for receiving the defrosting water on the first heat dissipation component in the first defrosting channel.
Furthermore, the water collecting device is arranged in the compressor bin and attached to the side face of the compressor.
Furthermore, a filling part is formed between the freezing chamber liner and the refrigerating chamber liner, a foaming layer is arranged in the filling part, and the frost reducing module is arranged on the foaming layer.
A frost reducing method adopting the double-temperature cabinet in the technical scheme comprises the following steps:
controlling the whole machine of the double-temperature cabinet to be electrified, and operating the compressor and the semiconductor refrigeration element;
acquiring the humidity of the refrigerating chamber through a humidity detection element, and controlling an electric control piece to be started through a controller if the humidity is greater than a first preset humidity; if the humidity is smaller than the first preset humidity, the electric control part is controlled to be closed through the controller;
and detecting the accumulated running time of the compressor and the working state of the compressor, controlling the semiconductor refrigerating element to reversely supply power to defrost the first heat radiating part when the accumulated running time of the compressor is detected to be greater than or equal to n and the compressor is in a stop state, and stopping defrosting when the defrosting time reaches time T.
Compared with the prior art, the invention has the advantages and positive effects that:
the invention provides a double-temperature cabinet, which comprises a defrosting module, wherein the defrosting module comprises a defrosting channel, a first semiconductor refrigerating element and a first heat radiating part matched with the cold end of the semiconductor refrigerating element, the first heat radiating part is arranged on an air inlet flow path of the defrosting channel, when the double-temperature cabinet runs, external humid air can be condensed into frost through the defrosting channel and the first heat radiating part, so that the frost cannot enter a refrigerating chamber and a freezing chamber, the defrosting of the refrigerating chamber and the freezing chamber is realized simultaneously, the first heat radiating part can be defrosted, and the first heat radiating part can be reused after defrosting;
meanwhile, as the semiconductor refrigeration element is adopted in the embodiment, the heat released by the hot end of the semiconductor refrigeration element can be correspondingly transferred to the inner container of the refrigerating chamber and further transferred to the refrigerating chamber to realize the temperature compensation of the whole refrigerating chamber, so that the temperature compensation of the refrigerating chamber is realized while the frost is reduced, a separate external heating wire is not needed, and the production cost and the use cost of a user are reduced.
Other features and advantages of the present invention will become more apparent from the following detailed description of the invention when taken in conjunction with the accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural view of a dual temperature cabinet according to the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a flow chart of the dual-temperature cabinet control of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and examples.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The present invention provides an embodiment of a dual temperature cabinet, which is shown in fig. 1-3, and comprises a cabinet 100, the refrigerator compartment liner 300 and the freezer compartment liner 200 are provided in the cabinet 100, and are arranged in parallel in the cabinet 100, a freezing chamber 210 is defined by the freezing chamber liner 200, a refrigerating chamber 310 is defined by the inside of the refrigerating chamber liner 300, a filling part 800 is formed between the freezing chamber liner 200 and the refrigerating chamber liner 300, preferably, the filling part 800 is a filling cavity formed between the freezing chamber liner 200 and the refrigerating chamber liner 300, when foaming, the foaming material can be filled in the filling cavities among the freezing chamber liner 200, the refrigerating chamber liner 300 and the box body 100 and between the refrigerating chamber liner 300 and the freezing chamber liner 200, the freezing chamber liner 200 and the refrigerating chamber liner 300 are fixed inside the cabinet 100 by the filling action of the foaming material.
In order to achieve the frost reduction, a frost reduction module 400 is correspondingly arranged in the embodiment,
specifically, the frost reduction module 400 in this embodiment includes:
a frost reducing passage 410 for communicating the outer space of the cabinet 100 with the inner spaces of the freezing chamber 210 and the refrigerating chamber 310,
the external air can enter the freezing chamber 210 and the refrigerating chamber 310 through the defrosting channel 410, that is, the defrosting channel 410 in the embodiment can simultaneously communicate the external space of the box body 100 with the internal space of the freezing chamber 210, the external space of the box body 100 and the internal space of the refrigerating chamber 310, and negative pressure is formed in the refrigerating chamber 310 and the freezing chamber 210 during the refrigerating operation of the dual-temperature cabinet, so that the external air enters the refrigerating chamber 310 and the freezing chamber 210 through the defrosting channel 410.
The semiconductor refrigeration element 420 is preferably a semiconductor refrigeration piece, and includes a cold end 421 and a hot end 422, the cold end 421 can generate cold correspondingly when the semiconductor refrigeration element operates, the hot end 422 can generate heat when the semiconductor refrigeration element 420 operates, and the hot end 422 can transfer heat to the refrigerating chamber 310 to compensate the temperature of the refrigerating chamber 310 when the semiconductor refrigeration element 420 operates.
In the concrete implementation, the hot end 422 of the semiconductor refrigeration element 420 can be directly attached to the refrigerating chamber liner 300, the heat of the hot end 422 is directly transferred to the refrigerating chamber liner 300, and the temperature is transferred into the refrigerating chamber 310 through the refrigerating chamber liner 300, so that the temperature compensation in the refrigerating chamber 310 is realized.
Of course, in order to ensure that the heat of the hot end 422 of the semiconductor refrigeration element 420 can be uniformly transferred to the inside of the refrigerating chamber 310, the second heat dissipation component 600 is correspondingly disposed in this embodiment when disposed, and the second heat dissipation component 600 may be a heat dissipation fin or a finned heat dissipation, and the like, which is not limited herein. During assembly, one side of the semiconductor refrigeration element 420 is attached to the hot end 422 of the semiconductor refrigeration element, and the other side of the semiconductor refrigeration element is attached to the side wall of the refrigerating chamber liner 300. The second heat radiating part 600 is arranged, so that the heat of the semiconductor refrigerating element 420 can be transmitted to the refrigerating chamber liner 300 through the second heat radiating part 600, and the conditions that the refrigerating chamber liner 300 is locally overheated and the temperature is uneven due to the fact that the refrigerating chamber liner 300 is directly contacted with the hot end 422 of the semiconductor refrigerating element 420 are avoided.
In the embodiment, the heat of the hot end 422 of the semiconductor refrigeration element 420 is transferred to the refrigerating chamber liner 300, and then is transferred to the inside of the refrigerating chamber 310 through the refrigerating chamber liner 300, so that the temperature compensation of the refrigerating chamber 310 is realized, the problem that the temperature of the refrigerating chamber 310 is deviated due to the proximity of the refrigerating chamber 310 and the freezing chamber 210 is avoided, in addition, the temperature compensation of the refrigerating chamber 310 does not need to be separately provided with a heating wire for heating, the hot end 422 in the semiconductor refrigeration element 420 is directly utilized, and the production cost and the use cost of a user are reduced.
The first heat sink 430 is disposed on the intake flow path of the defrosting passage 410, and may be a heat sink capable of absorbing cold energy of the cold end 421 to condense water vapor in the humid air entering the defrosting passage 410 from the external space without entering the refrigerating chamber 310 and the freezing chamber 210 into frost to be adsorbed on the surface thereof.
The humid air outside the box 100 can enter the refrigerating chamber 310 and the freezing chamber 210 through the defrosting channel 410 when the dual-temperature cabinet operates, when the humid air passes through the first heat dissipation part 430 on the air inlet flow path of the defrosting channel 410, because the first heat dissipation part 430 absorbs the cold temperature reduction of the semiconductor cold end 421, the water vapor in the humid air passing through the first heat dissipation part can be adsorbed on the first heat dissipation part 430 and frosted on the first heat dissipation part 430, so that the air entering the refrigerating chamber 310 or the refrigerating chamber 310 is dry air, the condensation of the water vapor in the humid air on the refrigerating chamber liner 300 or the freezing chamber liner 200 is avoided, the defrosting and the frost controlling are realized, meanwhile, the frost on the first heat dissipation part 430 in the embodiment can be melted and removed, the defrosting and the frost controlling can be continuously performed after the removing, the repeated recycling use is realized, compared with the method of replacing the drying agent in the prior art, the use cost of the user is reduced, and meanwhile, the user can use the system
Preferably, the frost reducing channel 410 in the present embodiment includes:
a first frost reducing passage 411 communicating with an external space of the case 100, the first heat radiating member 430 being positioned on the first frost reducing passage 411;
a second frost reducing passage 412 communicating with the freezing chamber 210 and the first frost reducing passage 411, respectively;
and a third frost reducing passage 413 communicating with the refrigerating compartment 310 and the first frost reducing passage 411, respectively.
An air flow inlet is provided on the first frost reducing channel 411, preferably, the first frost reducing channel 411 is provided from top to bottom along the height direction of the box 100 in the present embodiment, the air flow inlet is located at the bottom of the first frost reducing channel 411,
the outlet of the first frost reducing passage 411 is respectively communicated with the inlets of the second frost reducing passage 412 and the third frost reducing passage 413, the second frost reducing passage 412 has a first air flow outlet facing the freezing chamber 210, the third frost reducing passage 413 has a second air flow outlet facing the refrigerating chamber 310, and when external air enters, the external air can flow through the first frost reducing passage 411 through the air flow inlet at the bottom, and then respectively flow through the second frost reducing passage 412 and the third frost reducing passage 413 to enter the freezing chamber 210 and the refrigerating chamber 310.
The first heat dissipation member 430 is disposed on the first frost reducing passage 411, and when the humid air enters, the first heat dissipation member 430 condenses water vapor on the surface thereof to reduce frost, and then the air flow enters the refrigerating chamber 310 and the freezing chamber 210, so that the freezing chamber 210 and the refrigerating chamber 310 are defrosted synchronously.
The embodiment implements the frost reduction of the refrigerating chamber 310 and the freezing chamber 210 by only providing one frost reduction module 400, thereby further reducing the production and manufacturing costs.
In order to realize the control of the humidity in the refrigerating chamber 310, the present embodiment is further provided with:
and a humidity detecting element for detecting the humidity in the refrigerating compartment 310, wherein the humidity detecting element can be a humidity sensor and can be fixed on the side wall of the refrigerating compartment liner 300.
And the electric control member 500 is positioned on the third frost reducing channel 413 and used for controlling the on-off of the third frost reducing channel 413, and the electric control member 500 can select an electromagnetic valve which is connected to the third frost reducing channel 413 and can be switched off or switched on to control the on-off of the third frost reducing channel 413.
And a controller for receiving the humidity value of the humidity detection element and controlling the electric control 500 according to a relationship between the humidity value and a preset humidity value preset in the humidity detection element.
A preferred embodiment as the first frost reducing passage 411 in the present embodiment is: the semiconductor refrigeration device comprises an upper vent pipe 411-1 and a lower vent pipe 411-2, and the first heat dissipation part 430 is arranged between the upper vent pipe 411-1 and the lower vent pipe 411-2 and is attached to the cold end 421 of the semiconductor refrigeration element 420.
In order to collect the defrosting water of the first heat dissipating member 430, a water collecting device 700 is correspondingly disposed in the present embodiment, and the water collecting device 700 is disposed at the bottom of the defrosting channel 410 and is used for receiving the defrosting water of the first heat dissipating member 430 in the defrosting channel 410. The water collecting device 700 may be a water collecting box or a water receiving tray, and the like, and is not limited herein.
Preferably, the water collecting device 700 is disposed in the compressor bin and attached to the side surface of the compressor. The side setting in its laminating compressor storehouse can be used to absorb the heat that the compressor distributed out to evaporate its inside defrosting water, avoid because of the more problem that leads to rivers to spill over of defrosting water.
The invention also provides a defrosting method for the double-temperature cabinet, which comprises the following steps:
when the double-temperature cabinet is used, the double-temperature cabinet is firstly controlled to be powered on, after the double-temperature cabinet is powered on, the compressor and the semiconductor refrigerating element 420 are controlled to start to synchronously operate through the controller, and after the compressor operates, the evaporator starts to be controlled to refrigerate, so that negative pressure is generated inside the box body 100, outside humid air is sucked into the first defrosting channel 411 and flows through the first heat radiating part 430 to adsorb water vapor;
after the operation, the humidity of the refrigerating chamber 310 is detected through the humidity detection element arranged in the refrigerating chamber 310, if the humidity of the refrigerating chamber 310 is detected to be greater than the first preset humidity, the controller controls the electric control 500 to be turned on, the first preset humidity set in this embodiment is the humidity required by the refrigerating chamber 310, when the humidity of the refrigerating chamber 310 is greater than the first preset humidity, it represents that the humidity of the refrigerating chamber 310 is relatively high, and the humidity of the refrigerating chamber 310 needs to be reduced, at this time, the electric control 500 is turned on to communicate the third defrosting channel 413 with the first defrosting channel 411, so that the external wet air is defrosted through the first defrosting channel 411 and then respectively enters the second defrosting channel 412 and the third defrosting channel 413, and enters the refrigerating chamber 310 through the third defrosting channel 413, so that the air entering the refrigerating chamber 310 is dry air, and the humidity of the whole refrigerating chamber 310 is reduced, so that the humidity in the refrigerating compartment 310 can reach the humidity demand inside the refrigerating compartment 310.
If the humidity is less than the first preset humidity, it indicates that the humidity in the refrigerating compartment 310 is low, and at this time, the controller controls the electrical control 500 to close, so that the third defrosting passage 413 is disconnected, so that the first defrosting passage 411 is only communicated with the second defrosting passage 412, so that the dry air enters only the freezing compartment 210, but not the refrigerating compartment 310, and the humidity in the refrigerating compartment 310 can be kept stable.
And detecting the accumulated running time of the compressor, controlling the semiconductor refrigerating element 420 to supply power reversely for defrosting when the accumulated running time of the compressor is detected to be greater than or equal to n hours and the compressor is in a stop state, and stopping defrosting when the defrosting time reaches the time T, wherein the time T can be set to be 5 min. The accumulated running time of the compressor can be obtained by setting a timer in the controller and stored in the controller.
And if the accumulated running time of the compressor is more than n but the compressor is still in a working state, controlling the semiconductor refrigerating element 420 to continue running, and performing reverse power supply defrosting when the compressor is stopped.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (10)
1. A double-temperature cabinet, which comprises a cabinet body,
a freezing chamber liner and a refrigerating chamber liner are arranged in the box body, the freezing chamber liner defines a freezing chamber, and the refrigerating chamber liner defines a refrigerating chamber;
its characterized in that still including reducing the frost module, reduce the frost module including:
the defrosting channel is used for communicating the external space of the box body with the internal space of the freezing chamber and the internal space of the refrigerating chamber, so that external air can enter the freezing chamber and the refrigerating chamber;
a semiconductor refrigeration component comprising:
a cold end;
the hot end is connected with the refrigerating chamber liner and can raise the temperature when the semiconductor refrigerating element operates and transfer heat to the refrigerating chamber liner so as to raise the temperature of the refrigerating chamber;
the first heat dissipation part is arranged on an air inlet flow path of the defrosting channel, is connected with the cold end, and can absorb cold energy of the cold end when the semiconductor refrigeration element operates and the temperature of the cold end is reduced so as to condense water vapor in the wet air entering the defrosting channel from the external space into frost and adsorb the frost on the surface of the cold end.
2. A dual temperature cabinet according to claim 1, wherein said frost reducing duct comprises:
a first frost reducing passage communicating with an external space, the first heat dissipating member being located in the first frost reducing passage;
a second frost reducing passage respectively communicating with the freezing chamber and the first frost reducing passage;
and a third frost reducing passage respectively communicated with the refrigerating chamber and the first frost reducing passage.
3. A dual temperature cabinet according to claim 2, further comprising:
a humidity detection element provided in the refrigerating chamber for detecting humidity in the refrigerating chamber,
the electric control is positioned on the third frost reducing channel and used for controlling the on-off of the third frost reducing channel;
and the controller is used for receiving the humidity value of the humidity detection element and controlling the electric control according to the relation between the humidity value and a preset humidity value preset in the humidity detection element.
4. A dual temperature cabinet according to claim 2, further comprising: the first defrosting channel comprises an upper vent pipe and a lower vent pipe, and the first heat dissipation part is arranged between the upper vent pipe and the lower vent pipe and is attached to and connected with the cold end of the semiconductor refrigerating element.
5. The dual temperature cabinet of claim 1, wherein the hot end of the semiconductor cooling element is attached to the inner container of the cooling chamber.
6. A dual temperature cabinet according to claim 1, further comprising: and one side of the second heat radiating part is attached to the hot end of the semiconductor refrigerating element, and the other side of the second heat radiating part is attached to the side wall of the refrigerating chamber liner.
7. The dual temperature cabinet of claim 2, further comprising a water collecting means provided at a bottom of the first defrosting passage for receiving the defrosting water of the first heat dissipating member in the first defrosting passage.
8. A dual temperature cabinet according to claim 7, wherein the water collecting means is provided in the compressor compartment and attached to the side of the compressor.
9. The dual temperature cabinet of claim 2, wherein a filling portion is formed between the freezing chamber inner container and the refrigerating chamber inner container, a foaming layer is disposed inside the filling portion, and the frost reduction module is disposed on the foaming layer.
10. A frost reduction control method for the dual temperature cabinet of claim 3, comprising the steps of:
controlling the whole machine of the double-temperature cabinet to be electrified, and operating the compressor and the semiconductor refrigeration element;
acquiring the humidity of the refrigerating chamber through a humidity detection element, and controlling an electric control piece to be started through a controller if the humidity is greater than a first preset humidity; if the humidity is smaller than the first preset humidity, the electric control part is controlled to be closed through the controller;
and detecting the accumulated running time of the compressor and the working state of the compressor, controlling the semiconductor refrigerating element to reversely supply power to defrost the first heat radiating part when the accumulated running time of the compressor is detected to be greater than or equal to n and the compressor is in a stop state, and stopping defrosting when the defrosting time reaches time T.
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| CN201911411336.6A CN113124617A (en) | 2019-12-31 | 2019-12-31 | Double-temperature cabinet and defrosting control method thereof |
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