CN113122902A - Electroplating apparatus - Google Patents

Abstract

The invention provides electroplating equipment, which comprises a plurality of electroplating modules, wherein each electroplating module comprises a liquid supply tank for supplying electroplating liquid to the electroplating module; and the communicating pipelines are arranged among different liquid supply tanks so as to realize the liquid intercommunication among the corresponding liquid supply tanks. Through the scheme, the electroplating equipment disclosed by the invention has the advantages that when the liquid supply tanks in the electroplating modules are used for supplying the same electroplating, the liquid supply tanks can be mutually communicated through the communication pipelines, the electroplating liquids in the liquid supply tanks are mutually mixed, the physical and chemical properties of the electroplating liquids in the liquid supply tanks are identical, the electroplating liquids in any one of the electroplating modules can be analyzed so as to represent the characteristics of the electroplating liquids in the electroplating modules, the liquid supply tanks are mutually communicated through the communication pipelines, the consistency of the electroplating effect in each electroplating module is facilitated, and the liquid level of the liquid supply tanks can be further adjusted.

Description

Electroplating apparatus

Technical Field

The invention belongs to the technical field of electroplating, and particularly relates to electroplating equipment.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some workpieces by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of the workpiece by using the action of electrolysis so as to prevent metal oxidation (such as corrosion), improve wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhance the appearance and the like. For practical needs, the electroplating machine can be provided with a plurality of electroplating modules, so that the machine is convenient to disassemble and assemble and transport, and different electroplating modules have different functions and can be used for electroplating of the same metal and electroplating of different metals. Each plating module has a cathode tank, the plating solution in the plating chamber of the same plating module is supplied from the respective cathode tank, and the plating solution in the plating chamber is returned to the cathode tank.

However, as the production proceeds, the concentrations of the components in the plating solution will change, so that the analyzer needs to sample the plating solution and make corresponding adjustments every day, and the cathode tank is independent of each other, which means that each tank needs to be sampled, which is a waste of manpower and material resources for the plating module using the same plating solution; in addition, even if the plating solutions are adjusted daily, the concentrations of the components of the plating solutions in the two cathode tank with the same plating solution will always have a certain difference with the accumulation of time, which will cause the process results of the plating chambers of the two plating modules to be different; in addition, when the plating solution level inside the independent tank is too high, the plating solution may overflow from the tank to affect the production, or when the plating solution level is too low, the machine will automatically supply water to the proper range of the plating solution level, but this will cause the change of the plating solution concentration.

Therefore, it is necessary to provide an electroplating apparatus to solve the above problems.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a plating apparatus for solving the problems in the prior art that it is difficult to flexibly control communication or independence between a plurality of supply tanks.

To achieve the above and other related objects, the present invention provides an electroplating apparatus, comprising:

a plurality of plating modules, each of which includes a liquid supply tank for supplying a plating liquid thereto; and

and the communication pipeline is arranged between the liquid supply tanks so as to realize the communication between the liquid supply tanks.

Optionally, the communicating pipeline includes liquid outlet pipes and liquid return pipes corresponding to the liquid supply tanks, and the electroplating apparatus includes a liquid mixing pump, wherein a liquid inlet end of each liquid outlet pipe is communicated with the corresponding liquid supply tank, a liquid outlet end of each liquid outlet pipe is communicated with the liquid mixing pump, a liquid inlet end of each liquid return pipe is communicated with the liquid mixing pump, and a liquid outlet end of each liquid return pipe is communicated with the corresponding liquid supply tank.

Optionally, a liquid outlet control valve is correspondingly arranged on the liquid outlet pipe.

Optionally, when the number of the electroplating modules is two, the electroplating device includes a first electroplating module and a second electroplating module, and correspondingly includes a first liquid supply tank and a second liquid supply tank, wherein the communication pipeline includes a first conveying pipeline and a second conveying pipeline, a liquid inlet end of the first conveying pipeline is communicated with the first liquid supply tank, a liquid outlet end of the first conveying pipeline is communicated with the second liquid supply tank, a liquid inlet end of the second conveying pipeline is communicated with the second liquid supply tank, and a liquid outlet end of the second conveying pipeline is communicated with the first liquid supply tank.

Optionally, a first control valve is disposed on the first delivery line, and a second control valve is disposed on the second delivery line.

Optionally, the electroplating apparatus further includes a first self-circulation pipeline and a second self-circulation pipeline, two ends of the first self-circulation pipeline are respectively communicated with the first liquid supply tank, two ends of the second self-circulation pipeline are respectively communicated with the second liquid supply tank, the first self-circulation pipeline is sequentially provided with a first circulation pump and a first heating device, and the second self-circulation pipeline is sequentially provided with a second circulation pump and a second heating device.

Optionally, the liquid inlet end of the first conveying pipeline is communicated with the first circulating pump and the pipeline between the first heating devices, and the liquid inlet end of the second conveying pipeline is communicated with the second circulating pump and the pipeline between the second heating devices.

Optionally, when the number of the electroplating modules is three or more, at least one main electroplating module is defined in each electroplating module, and the rest are slave electroplating modules, a liquid supply tank included in each main electroplating module is defined as a main liquid supply tank, and a liquid supply tank included in each slave electroplating module is defined as a slave liquid supply tank, wherein the communication pipeline includes a plurality of liquid sending pipes corresponding to the slave liquid supply tanks one to one, and a plurality of liquid distribution pipes led out from the main liquid supply tank, liquid inlet ends of the liquid sending pipes are communicated with the corresponding slave liquid supply tanks, liquid outlet ends of the liquid sending pipes are communicated with any main liquid supply tank, and the main liquid supply tank distributes electroplating solution to any slave liquid supply tank through the liquid distribution pipes.

Optionally, a liquid feeding control valve is correspondingly arranged on the liquid feeding pipe, and a liquid separating control valve is correspondingly arranged on the liquid separating pipe.

Optionally, the electroplating apparatus further includes a main self-circulation pipeline corresponding to each of the main liquid supply tanks, and a sub self-circulation pipeline corresponding to each of the sub liquid supply tanks, wherein two ends of the main self-circulation pipeline are respectively communicated with the corresponding main liquid supply tanks, two ends of the sub self-circulation pipeline are communicated with the corresponding sub liquid supply tanks, a main circulation pump and a main heating device are sequentially disposed on the main self-circulation pipeline, and a sub circulation pump and a sub heating device are sequentially disposed on the sub self-circulation pipeline.

Optionally, a liquid inlet end of each liquid sending pipe is communicated with a pipeline between the slave circulating pump and the slave heating device on the corresponding slave circulating pipeline, and a liquid inlet end of each liquid distributing pipe is communicated with a pipeline between the master circulating pump and the master heating device on the corresponding master self circulating pipeline.

Optionally, a liquid level balance pipeline is arranged between the liquid supply tanks of the adjacent electroplating modules, and a liquid level control valve is arranged on the liquid level balance pipeline.

Optionally, each electroplating module comprises at least one process chamber, and the process chamber is in bidirectional communication with the liquid supply tank included in the corresponding electroplating module.

As described above, the electroplating apparatus of the present invention, when the fluid supply tanks in the multiple electroplating modules are used for supplying the same electroplating solution, can achieve mutual communication through the communication pipelines, and mix the electroplating solutions in the fluid supply tanks, so that the physical and chemical properties of the electroplating solutions in the multiple fluid supply tanks are the same, and thus the electroplating solution in any one of the electroplating modules can be analyzed to represent the characteristics of the electroplating solutions in the multiple electroplating modules.

Drawings

Fig. 1 is a schematic structural diagram of an electroplating apparatus with two electroplating modules according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of an electroplating apparatus with three electroplating modules according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of an electroplating apparatus with two electroplating modules according to a second embodiment of the present invention.

Fig. 4 is a schematic structural diagram of another electroplating apparatus for two electroplating modules according to a second embodiment of the present invention.

Fig. 5 is a schematic structural diagram of an electroplating apparatus with three electroplating modules according to a third embodiment of the present invention.

Description of the element reference numerals

101. 201, 301 first liquid supply tank

102. 202, 302 second liquid supply tank

103. 204 first outlet pipe

104. 205 second outlet pipe

105. 207 first liquid outlet control valve

106. 208 second liquid outlet control valve

107. 210 liquid mixing pump

108. 211 first liquid return pipe

109. 212 second liquid return pipe

110. 214, 307, 412 first self-circulation line

111. 215, 308, 413 first circulation pump

112. 216, 309, 414 first heating device

113. 217, 310, 415 second self-circulation line

114. 218, 311, 416 second circulation pump

115. 219, 312, 417 second heating device

116. 224, 313, 421 first process chamber

117. 224, 314, 422 second process chamber

118. 226, 228, 315, 424, 426 liquid level balance pipeline

119. 227, 229, 316, 425 and 427 liquid level control valve

203 third liquid supply tank

206 third liquid outlet pipe

209 third effluent control valve

213 third liquid return pipe

220. 418 third self-circulation pipeline

221. 419 third circulating pump

222. 420 third heating device

225. 423 third Process Chamber

303 first conveying pipeline

304 second delivery line

305 first control valve

306 second control valve

401 first slave feed tank

402 main liquid supply tank

403 second slave feed tank

404 first liquid delivery pipe

405 first liquid feed control valve

406 second liquid delivery tube

407 second liquid feed control valve

408 first liquid dividing pipe

409 first liquid separation control valve

410 second liquid dividing pipe

411 second liquid-dividing control valve

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structures are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of each component in actual implementation may be changed freely, and the layout of the components may be more complicated.

The invention provides electroplating equipment which comprises a plurality of electroplating modules, namely at least two electroplating modules, wherein each electroplating module comprises a liquid supply tank for supplying electroplating liquid to the electroplating module, and a communication pipeline is arranged between the liquid supply tanks so as to realize communication between the liquid supply tanks. In an example, the plating modules are provided with different types of plating solutions, and in a further optional example, the plating apparatus further comprises other plating modules which perform processes by using different types of plating solutions, wherein in this example, the plating modules which perform processes based on the same plating solution are communicated through the communication pipeline, and the plating modules which perform processes based on different types of plating solutions are independent from each other. In addition, in an example, each electroplating module includes at least one process chamber, the liquid supply tank provides an electroplating solution for the process chamber of the corresponding electroplating module, of course, the electroplating solution after being electroplated by the process chamber may also flow back to the corresponding liquid supply tank, the electroplating solution is recycled in the process chamber and the liquid supply tank, so as to achieve bidirectional communication between the process chamber and the liquid supply tank, when each electroplating module includes two process chambers, each process chamber may respectively perform bidirectional communication with the corresponding liquid supply tank, and different process chambers of the same electroplating module are independent of each other.

The electroplating equipment can be based on the design of the communicating pipeline, so that the liquid supply tanks of different electroplating modules are communicated with each other, the liquid supply tanks of the process can be communicated with each other based on the same type of electroplating solution, wherein all the liquid supply tanks with the same electroplating solution are communicated with each other, and part of the liquid supply tanks with the same electroplating solution can be selected to be communicated with each other according to actual requirements. Along with the production, the concentration of each component in the electroplating solution can be changed to a certain extent, after the liquid supply tanks in the electroplating modules are communicated, an analyst does not need to respectively sample and analyze the electroplating solution in the liquid supply tanks of the electroplating modules, but can sample and analyze any one of the electroplating solutions, and can make corresponding adjustment based on the analysis result, so that the manpower and material resources are saved; in addition, even if the electroplating solution can be adjusted every day, the concentrations of the components of the electroplating solution in the two liquid supply tanks with the same electroplating solution always have certain difference along with the accumulation of time, after the liquid supply tanks are designed to be communicated with each other, the electroplating solution in the interconnected electroplating modules tends to carry out electroplating process under the same concentration, and the concentration change of the electroplating solution in the electroplating modules can be considered to be consistent, so that the electroplating process effects of the electroplating cavities of the electroplating modules tend to be consistent; in addition, when the inside plating solution liquid level of independent supply tank was too high, the plating solution probably spilled over and influence production from the supply tank, perhaps when the plating solution liquid level was crossed lowly, the board can automatic water supply to the suitable scope of liquid level, but this can lead to the change of plating solution concentration, and the design of intercommunication pipeline still is favorable to making each supply tank liquid level unanimous to solve above-mentioned problem.

The structural design of the present invention will be described in detail with reference to specific embodiments.

The first embodiment is as follows:

in this embodiment, the communicating pipeline includes a liquid outlet pipe and a liquid return pipe corresponding to the liquid supply tank, and the electroplating apparatus further includes a liquid mixing pump, wherein a liquid inlet end of each liquid outlet pipe is communicated with the corresponding liquid supply tank, a liquid outlet end of each liquid outlet pipe is communicated with the liquid mixing pump, a liquid inlet end of each liquid return pipe is communicated with the liquid mixing pump, and a liquid outlet end of each liquid return pipe is communicated with the corresponding liquid supply tank.

As an example, the liquid outlet pipe is correspondingly provided with a liquid outlet control valve.

In the following, the case where the number of the plating modules is two and the number of the plating modules is three is taken as an example for explanation, and when the number of the plating modules is three or more, the pipe connections are similar to the number of the plating modules.

As shown in fig. 1, which is a schematic structural diagram when the number of the electroplating modules is two, the electroplating apparatus includes a first electroplating module and a second electroplating module, wherein the first electroplating module includes a first liquid supply tank 101, the second electroplating module includes a second liquid supply tank 102, the communication pipeline includes a first liquid outlet pipe 103 and a first liquid return pipe 108 corresponding to the first liquid supply tank 101, and a second liquid outlet pipe 104 and a second liquid return pipe 109 corresponding to the second liquid supply tank 102, and in addition, in this embodiment, the electroplating apparatus further includes a liquid mixing pump 107, a liquid inlet end of the first liquid outlet pipe 103 is communicated with the first liquid supply tank 101, a liquid outlet end of the first liquid outlet pipe 103 is communicated with the liquid mixing pump 107, a liquid inlet end of the second liquid outlet pipe 104 is communicated with the second liquid supply tank 102, a liquid outlet end of the second liquid outlet pipe 104 is communicated with the liquid mixing pump 107, therefore, the plating solutions in the first and second liquid supply tanks 101 and 102 can be mixed, the mixing pump 107 can provide power for mixing the plating solutions in the first and second liquid supply tanks 101 and 102, in addition, the liquid inlet end of the first liquid return pipe 108 is communicated with the mixing pump 107, the liquid outlet end of the first liquid return pipe 108 is communicated with the first liquid supply tank 101, the liquid inlet end of the second liquid return pipe 109 is communicated with the mixing pump 107, and the liquid outlet end of the second liquid return pipe 109 is communicated with the second liquid supply tank 102, so that the plating solutions mixed by the mixing pump 107 can be respectively conveyed to the first and second liquid supply tanks 101 and 102, and the plating solutions in the two liquid supply tanks are mixed plating solutions. Therefore, the conditions of the electroplating liquid in the two electroplating modules can be obtained by sampling and analyzing any one of the two electroplating modules in the process, the consistency of the electroplating process effect in the two electroplating modules is facilitated, and the liquid level between the two liquid supply tanks is also balanced.

In one example, a first liquid outlet control valve 105 is disposed on the first liquid outlet pipe 103, and a second liquid outlet control valve 106 is disposed on the second liquid outlet pipe 104, wherein both the first liquid outlet control valve 105 and the second liquid outlet control valve 106 may be selected as manual valves. Therefore, the liquid outlet pipes can be controlled to be communicated and closed through the control valves, when the two control valves are opened simultaneously, the two liquid supply tanks can be connected with each other, optionally, the two liquid outlet pipes can be kept to be communicated in the technical process, electroplating liquid can be mixed in real time, and certainly, whether the two pipelines are communicated or not can be respectively selected according to actual requirements.

As an example, a liquid level balance pipeline 118 is further disposed between the first liquid supply tank 101 and the second liquid supply tank 102, the liquid level balance pipeline 118 is directly communicated between the adjacent first liquid supply tank 101 and the second liquid supply tank 102 to further facilitate the liquid level balance between the liquid supply tanks, optionally, a liquid level control valve 119 may be further disposed on the liquid level balance pipeline 118 to facilitate the control of the conduction of the pipeline, the liquid level control valve 119 may be selected to be a manual valve, for example, if the liquid level of one of the liquid supply tanks is too low or too high, the liquid level balance pipeline 118 may be opened and conducted, so that the other liquid supply tank may make balance, and in addition, the liquid level balance pipeline 118 may also be kept in a conducting state in the process. Of course, the fluid level balancing line 118 may also be used to achieve mixing of the plating solution between the communicating fluid supply tanks.

As an example, the electroplating apparatus further includes a first self-circulation pipeline 110 and a second self-circulation pipeline 113, two ends of the first self-circulation pipeline 110 are respectively communicated with the first liquid supply tank 101, two ends of the second self-circulation pipeline 113 are respectively communicated with the second liquid supply tank 102, that is, electroplating solution in each liquid supply tank is self-circulated through the corresponding self-circulation pipeline, wherein a first circulation pump 111 and a first heating device 112 are sequentially arranged on the first self-circulation pipeline 110, so that the electroplating solution in the first liquid supply tank 101 can be extracted and heated, and a second circulation pump 114 and a second heating device 115 are sequentially arranged on the second self-circulation pipeline 113, wherein each circulation pump of the present invention can provide power for the electroplating solution circulation, and each heating device can be selected as a heater to heat the electroplating solution.

As an example, the first electroplating module further includes at least one first process chamber 116, and the second electroplating module includes at least one second process chamber 117, wherein only one first process chamber 116 and one second process chamber 117 are shown in fig. 1, the electroplating solution in the first liquid supply tank 101 can be conveyed to the first process chamber 116 for operation, and meanwhile, the electroplating solution after operation in the first process chamber 116 can also be conveyed to the first liquid supply tank 101 for recycling, optionally, a circulation pump is further disposed on a pipeline of the first liquid supply tank 101 flowing through the first process chamber 116 to facilitate circulation of the electroplating solution, and the second electroplating module can also be similarly disposed.

In addition, in this embodiment, fig. 2 is a schematic structural diagram of the electroplating module with three parts, and the connection manner of the electroplating module is similar to the connection manner of the electroplating module with two parts shown in fig. 1, and the structure, connection, function, and the like of the relevant structural components can be referred to the relevant description in fig. 1. As shown in fig. 2, the electroplating apparatus includes a first electroplating module, a second electroplating module and a third electroplating module, wherein the first electroplating module includes a first liquid supply tank 201, the second electroplating module includes a second liquid supply tank 202, the third electroplating module includes a third liquid supply tank 203, the communication pipeline includes a first liquid outlet pipe 204 and a first liquid return pipe 211 corresponding to the first liquid supply tank 201, a second liquid outlet pipe 205 and a second liquid return pipe 212 corresponding to the second liquid supply tank 202, and a third liquid outlet pipe 206 and a third liquid return pipe 213 corresponding to the third liquid supply tank 203, and in addition, in this embodiment, the electroplating apparatus further includes a liquid mixing pump 210, wherein a liquid inlet end of the first liquid outlet pipe 204 is communicated with the first liquid supply tank 201, a liquid outlet end of the first liquid outlet pipe 205 is communicated with the liquid mixing pump 210, a liquid inlet end of the second liquid outlet pipe 205 is communicated with the second liquid supply tank 202, the liquid outlet end of the second liquid outlet pipe 205 is communicated with the liquid mixing pump 210, the liquid inlet end of the third liquid outlet pipe 206 is communicated with the third liquid supply tank 203, the liquid outlet end of the third liquid outlet pipe 206 is communicated with the liquid mixing pump 210, so that the plating liquids in the first liquid supply tank 201, the second liquid supply tank 302 and the third liquid supply tank 203 can be mixed, the liquid mixing pump 210 can provide power for mixing the plating liquids in the first liquid supply tank 201, the second liquid supply tank 302 and the third liquid supply tank 203, in addition, the liquid inlet end of the first liquid return pipe 211 is communicated with the liquid mixing pump 210, the liquid outlet end of the first liquid return pipe 211 is communicated with the first liquid supply tank 201, the liquid inlet end of the second liquid return pipe 212 is communicated with the liquid mixing pump 210, and the liquid outlet end of the second liquid return pipe 212 is communicated with the second liquid supply tank 202, the liquid inlet end of the third liquid return pipe 213 is communicated with the liquid mixing pump 210, and the liquid outlet end of the third liquid return pipe 213 is communicated with the third liquid supply tank 203, so that the plating solution mixed by the liquid mixing pump 210 can be respectively delivered to the first liquid supply tank 201, the second liquid supply tank 202 and the third liquid supply tank 203, so that the plating solution in the two liquid supply tanks is the mixed plating solution.

Further, in an example, a first liquid outlet control valve 207 is disposed on the first liquid outlet pipe 204, a second liquid outlet control valve 208 is disposed on the second liquid outlet pipe 205, and a third liquid outlet control valve 209 is disposed on the third liquid outlet pipe 206, wherein the first liquid outlet control valve 207, the second liquid outlet control valve 208, and the third control valve 209 may be selected as manual valves.

As an example, a liquid level balance pipeline 226 is disposed between the first liquid supply tank 201 and the second liquid supply tank 202, optionally, a liquid level control valve 227 is further disposed on the liquid level balance pipeline 226, and the liquid level control valve 227 may be selected as a manual valve; a liquid level balance pipeline 228 is arranged between the second liquid supply tank 202 and the third liquid supply tank 203, a liquid level control valve 229 is further arranged on the liquid level balance pipeline 228, and the liquid level control valve 229 can be selected to be a manual valve.

As an example, the electroplating apparatus further includes a first self-circulation pipeline 214, a second self-circulation pipeline 217, and a third self-circulation pipeline 220, wherein two ends of the first self-circulation pipeline 214 are respectively communicated with the first liquid supply tank 201, two ends of the second self-circulation pipeline 217 are respectively communicated with the second liquid supply tank 202, two ends of the third self-circulation pipeline 220 are respectively communicated with the third liquid supply tank 220, wherein the first self-circulation pipeline 214 is sequentially provided with a first circulation pump 215 and a first heating device 216, the second self-circulation pipeline 217 is sequentially provided with a second circulation pump 218 and a second heating device 219, and the third self-circulation pipeline 220 is sequentially provided with a third circulation pump 221 and a third heating device 222.

By way of example, the first electroplating module further comprises at least one first process chamber 223, the second electroplating module comprises at least one second process chamber 224, the third electroplating module further comprises at least one third process chamber 225, wherein only one of the first process chamber 223, one of the second process chamber 224, and one of the third process chamber 225 are shown in FIG. 2, the plating solution in the first supply tank 201 may be transferred to the first process chamber 223 for operation, meanwhile, the plating solution after operation in the first process chamber 202 can also be transferred to the first solution supply tank 201 for recycling, optionally, a circulation pump is also provided in the line of the first feed tank 201 through the first process chamber 223, so as to be beneficial to circulation of the electroplating solution, and meanwhile, the second electroplating module and the third electroplating module can be similarly arranged.

Example two:

in the electroplating apparatus of this embodiment, as shown in fig. 3, the number of the electroplating modules is two, the electroplating apparatus includes a first electroplating module and a second electroplating module, and correspondingly includes a first liquid supply tank 301 and a second liquid supply tank 302, wherein the communication pipeline includes a first conveying pipeline 303 and a second conveying pipeline 304, a liquid inlet end of the first conveying pipeline 303 is communicated with the first liquid supply tank 301, a liquid outlet end of the first conveying pipeline 303 is communicated with the second liquid supply tank 304, so as to convey the electroplating solution in the first liquid supply tank 301 to the second liquid supply tank 302, a liquid inlet end of the second conveying pipeline 304 is communicated with the second liquid supply tank 302, a liquid outlet end of the second conveying pipeline 304 is communicated with the first liquid supply tank 301, so as to convey the electroplating solution in the second liquid supply tank 302 to the first liquid supply tank 301, thereby realizing the mutual communication between the two liquid supply tanks based on the arrangement of the communication pipeline.

Further, in one example, a first control valve 305 is disposed on the first delivery line 303, and a second control valve 306 is disposed on the second delivery line 304, wherein each of the first control valve 305 and the second control valve 306 may be selected to be a manual valve. Therefore, the conduction and the closing of the conveying pipelines can be controlled through the control valves, when the two control valves are opened simultaneously, the two liquid supply tanks can be connected, optionally, in the technical process, the two conveying pipelines can be kept conducted, the electroplating liquid can be mixed in real time, and certainly, whether the two pipelines are conducted or not can be respectively selected according to actual requirements.

As an example, the electroplating apparatus further includes a first self-circulation pipeline 307 and a second self-circulation pipeline 310, two ends of the first self-circulation pipeline 307 are respectively communicated with the first liquid supply tank 301, two ends of the second self-circulation pipeline 310 are respectively communicated with the second liquid supply tank 302, that is, the electroplating solution in each liquid supply tank is self-circulated through the corresponding self-circulation pipeline, wherein the first self-circulation pipeline 307 is sequentially provided with a first circulation pump 308 and a first heating device 309, so that the electroplating solution in the first liquid supply tank 301 can be extracted and heated, and the second self-circulation pipeline 310 is sequentially provided with a second circulation pump 311 and a second heating device 312.

In a further alternative example, the liquid inlet end of the first conveying pipeline 303 is communicated with a pipeline between the first circulating pump 308 and the first heating device 309, as shown in a position a in the figure, and the liquid inlet end of the second conveying pipeline 304 is communicated with a pipeline between the second circulating pump 311 and the second heating device 312, as shown in a position B in the figure, so that the corresponding circulating pump in the self-circulating pipeline can be used for extracting the electroplating solution in the corresponding solution supply tank, and the cost and the space are saved.

As an example, the first electroplating module further includes at least one first process chamber 313, and the second electroplating module includes at least one second process chamber 314, wherein only one first process chamber 313 and one second process chamber 314 are shown in fig. 3, the electroplating solution in the first liquid supply tank 301 can be delivered to the first process chamber 313 for operation, and meanwhile, the electroplating solution after operation in the first process chamber 313 can also be delivered to the first liquid supply tank 301 for recycling, optionally, a circulation pump is further disposed on a pipeline of the first liquid supply tank 301 flowing through the first process chamber 313 to facilitate circulation of the electroplating solution, and the second electroplating module can also be similarly disposed.

As shown in fig. 4, as an example, a liquid level balancing line 315 is further disposed between the first liquid supply tank 301 and the second liquid supply tank 302, the liquid level balancing line 315 is directly communicated between the adjacent first liquid supply tank 301 and the second liquid supply tank 302 to further facilitate liquid level balancing between the liquid supply tanks, optionally, a liquid level control valve 316 may be further disposed on the liquid level balancing line 315 to facilitate controlling the conduction of the line, the liquid level control valve 316 may be selected as a manual valve, for example, if the liquid level of one of the liquid supply tanks is too low or too high, the liquid level balancing line 315 may be opened and conducted, the other liquid supply tank may be balanced, and the liquid level balancing line 315 may also be kept in a conducting state in the process. Of course, the fluid level balancing line 315 may also be used to achieve mixing of plating solution between the communicating fluid supply tanks.

Example three:

in this embodiment, as shown in fig. 5, a structure of the electroplating apparatus is provided when the number of the electroplating modules is three, where fig. 5 illustrates that the number of the electroplating modules is three, and the examples when the number of the electroplating modules is three or more are similar to that of the electroplating modules, and in this embodiment, a connection manner is similar to that of the electroplating modules in the second embodiment, and related similar structural components, connections, functions, and the like may be referred to in the related description of the second embodiment. When the number of the electroplating modules is three, the electroplating device comprises a first electroplating module, a second electroplating module and a third electroplating module, wherein the first electroplating module comprises a first liquid supply tank, the second electroplating module comprises a second liquid supply tank, the third electroplating module comprises a third liquid supply tank, in addition, at least one main electroplating module is defined in each electroplating module, for example, the second electroplating module is defined as a main electroplating module, the rest are secondary electroplating modules, and the corresponding liquid supply tanks are respectively defined as a main liquid supply tank and a secondary liquid supply tank. As shown in fig. 5, for three electroplating modules, the first electroplating module includes a first slave liquid supply tank 401, the second electroplating module includes a master liquid supply tank 402, the third electroplating module includes a second slave liquid supply tank 403, wherein the communication pipeline includes a plurality of liquid sending pipes corresponding to the slave liquid supply tanks one by one, such as a first liquid sending pipe 404 corresponding to the first slave liquid supply tank 401, and a second liquid sending pipe 406 corresponding to the second slave liquid supply tank 403, wherein a liquid inlet end of the first liquid sending pipe 404 is communicated with the corresponding first slave liquid supply tank 401, and a liquid outlet end of the first liquid sending pipe 404 is communicated with the master liquid supply tank 402 to send the plating solution in the first slave liquid supply tank 401 to the master liquid supply tank 402; the liquid inlet end of the second liquid sending pipe 406 is communicated with the corresponding second slave liquid supply tank 403, and the liquid outlet end of the second liquid sending pipe 406 is communicated with the main liquid supply tank 402 to deliver the plating solution in the second slave liquid supply tank 403 to the main liquid supply tank 402, so that the plating solution in the three liquid supply tanks can be mixed in the main liquid supply tank 402. In addition, the communication pipeline further includes a plurality of liquid distribution pipes corresponding to the slave liquid supply tanks, as shown in fig. 5, a first liquid distribution pipe 408 corresponding to the first slave liquid supply tank 401, and a second liquid distribution pipe 410 corresponding to the second slave liquid supply tank 403, wherein a liquid inlet end of the first liquid distribution pipe 408 is communicated with the master liquid supply tank 402, a liquid outlet end is communicated with the first slave liquid supply tank 401, a liquid inlet end of the second liquid distribution pipe 410 is communicated with the master liquid supply tank 402, and a liquid outlet end is communicated with the second slave liquid supply tank 403, so that the plating solution mixed in the master liquid supply tank 402 can be redistributed to the first slave liquid supply tank 401 and the second slave liquid supply tank 403, and the communication between the three liquid supply tanks is realized. It should be noted that, when the number of the electroplating modules is more than three, any one or two or more electroplating modules may be defined as a main electroplating module, the slave liquid supply tank of each slave electroplating module may be selectively connected with the main liquid supply tank of the main electroplating module according to actual requirements, and the slave liquid supply tanks are uniformly mixed in the main liquid supply tank and then distributed to other slave liquid supply tanks through liquid distribution pipes according to actual requirements.

Further, as an example, a liquid feed control valve is provided in each liquid feed pipe, and a liquid separation control valve is provided in each liquid separation pipe, for example, as shown in fig. 5, a first liquid feed control valve 405 is provided in the first liquid feed pipe 404, and a second liquid feed control valve 407 is provided in the second liquid feed pipe 406, and both the first liquid feed control valve 405 and the second liquid feed control valve 407 may be selected as manual valves. Therefore, the liquid feeding control valves can control the conduction and the closing of the liquid feeding pipes, when the two control valves are opened simultaneously, the three liquid feeding tanks can be connected with each other, optionally, in the technical process, the two liquid feeding pipes can be kept to be conducted, the electroplating liquid can be mixed in real time, and certainly, whether the two pipelines are conducted or not can be respectively selected according to actual requirements. In addition, the liquid dividing pipes are similarly arranged, the first liquid dividing pipe 408 is provided with a first liquid dividing control valve 409, the second liquid dividing pipe 410 is provided with a second liquid dividing control valve 411, and both the first liquid dividing control valve 409 and the second liquid dividing control valve 411 can be selected to be manual valves.

As an example, the electroplating apparatus further includes a main self-circulation pipeline corresponding to each of the main electroplating modules and a slave self-circulation pipeline corresponding to each of the slave electroplating modules, wherein two ends of the main self-circulation pipeline are respectively communicated with the corresponding main liquid supply tank, two ends of the slave self-circulation pipeline are communicated with the corresponding slave liquid supply tank, a main circulation pump and a main heating device are sequentially arranged on the main self-circulation pipeline, and a slave circulation pump and a slave heating device are sequentially arranged on the slave self-circulation pipeline. For example, as shown in FIG. 5, the electroplating apparatus further comprises a first self-circulation line 412, a second self-circulation line 415 and a third self-circulation line 418, both ends of the first self-circulation pipeline 412 are respectively communicated with the first slave liquid supply tank 401, both ends of the second self-circulation pipe 415 are respectively communicated with the main liquid supply tank 402, both ends of the third self-circulation pipeline 418 are respectively communicated with the second slave liquid supply tank 403, that is, the plating liquid in each liquid supply tank is self-circulated through a corresponding self-circulation pipeline, wherein the first self-circulation pipeline 412 is sequentially provided with a first circulation pump 413 and a first heating device 414, the first plating solution from the solution supply tank 401 can be extracted and heated, the second self-circulation pipe 415 is provided with a second circulation pump 416 and a second heating device 417 in sequence, the third self-circulation pipeline 418 is sequentially provided with a third circulation pump 419 and a third heating device 420.

In a further alternative example, a liquid inlet end of each liquid sending pipe is communicated with a pipeline between the slave circulating pump and the slave heating device on the corresponding slave circulating pipeline, and a liquid inlet end of each liquid distributing pipe is communicated with a pipeline between the master circulating pump and the master heating device on the corresponding master circulating pipeline. For example, as shown in fig. 3, the liquid inlet of the first liquid sending pipe 404 is connected to the pipeline between the first circulating pump 413 and the first heating device 414, as shown in the position C, the liquid inlet of the second liquid sending pipe 406 is connected to the pipeline between the third circulating pump 419 and the third heating device 420, as shown in the position D, the liquid inlet of the first liquid dividing pipe 408 and the liquid inlet of the second liquid dividing pipe 410 are both connected to the pipeline between the second circulating pump 416 and the second heating device 417, as shown in the position E.

As an example, a liquid level balance pipeline is arranged between the liquid supply tanks of adjacent electroplating modules, and a liquid level control valve is arranged on the liquid level balance pipeline, for example, as shown in fig. 5, a liquid level balance pipeline 424 is arranged between the first slave liquid supply tank 401 and the master liquid supply tank 402, optionally, a liquid level control valve 425 is arranged on the liquid level balance pipeline 424, and the liquid level control valve 425 can be selected to be a manual valve; a liquid level balance pipeline 426 is arranged between the main liquid supply tank 402 and the second auxiliary liquid supply tank 403, a liquid level control valve 427 is further arranged on the liquid level balance pipeline 426, and the liquid level control valve 427 can be selected to be a manual valve.

In summary, the present invention provides an electroplating apparatus, wherein when the fluid supply tanks of a plurality of electroplating modules are used for supplying electroplating solutions, the fluid supply tanks can be interconnected through a communication pipeline, and the electroplating solutions in the fluid supply tanks are mixed with each other, so that the physical and chemical properties of the electroplating solutions in the fluid supply tanks are the same, and thus the electroplating solution in any one of the electroplating modules can be analyzed to characterize the characteristics of the electroplating solutions in the electroplating modules.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (12)

1. An electroplating apparatus, characterized in that the electroplating apparatus comprises:

a plurality of plating modules, each of which includes a liquid supply tank for supplying a plating liquid thereto; and

and the communication pipeline is arranged between the different liquid supply tanks so as to realize the communication between the corresponding liquid supply tanks.

2. The electroplating apparatus according to claim 1, wherein the communication pipeline comprises a liquid outlet pipe and a liquid return pipe corresponding to each liquid supply tank, and the electroplating apparatus further comprises a liquid mixing pump, wherein a liquid inlet end of each liquid outlet pipe is communicated with the corresponding liquid supply tank, a liquid outlet end of each liquid outlet pipe is communicated with the liquid mixing pump, a liquid inlet end of each liquid return pipe is communicated with the liquid mixing pump, and a liquid outlet end of each liquid return pipe is communicated with the corresponding liquid supply tank.

3. The electroplating apparatus as claimed in claim 2, wherein the liquid outlet pipe is correspondingly provided with a liquid outlet control valve.

4. The electroplating apparatus according to claim 1, wherein when there are two electroplating modules, the electroplating apparatus comprises a first electroplating module and a second electroplating module, and correspondingly comprises a first liquid supply tank and a second liquid supply tank, the communication pipeline comprises a first conveying pipeline and a second conveying pipeline, the liquid inlet end of the first conveying pipeline is communicated with the first liquid supply tank, the liquid outlet end of the first conveying pipeline is communicated with the second liquid supply tank, the liquid inlet end of the second conveying pipeline is communicated with the second liquid supply tank, and the liquid outlet end of the second conveying pipeline is communicated with the first liquid supply tank.

5. The plating apparatus as recited in claim 4, wherein a first control valve is provided on the first transport line, and a second control valve is provided on the second transport line.

6. The electroplating apparatus according to claim 4, further comprising a first self-circulation pipeline and a second self-circulation pipeline, wherein two ends of the first self-circulation pipeline are respectively communicated with the first liquid supply tank, two ends of the second self-circulation pipeline are respectively communicated with the second liquid supply tank, the first self-circulation pipeline is sequentially provided with a first circulation pump and a first heating device, and the second self-circulation pipeline is sequentially provided with a second circulation pump and a second heating device.

7. The electroplating apparatus according to claim 6, wherein the liquid inlet end of the first conveying pipeline is communicated with a pipeline between the first circulating pump and the first heating device, and the liquid inlet end of the second conveying pipeline is communicated with a pipeline between the second circulating pump and the second heating device.

8. The plating apparatus as recited in claim 1, wherein when there are three or more plating modules, at least one master plating module is defined in each plating module, and the others are slave plating modules, the master plating module includes a liquid supply tank defined as a master liquid supply tank, and the slave plating module includes a liquid supply tank defined as a slave liquid supply tank, wherein the communication pipe includes a plurality of liquid feeding pipes corresponding to the slave liquid supply tanks one to one, and a plurality of liquid distribution pipes led out from the master liquid supply tank, liquid inlet ends of the liquid feeding pipes communicate with the corresponding slave liquid supply tanks, liquid outlet ends of the liquid feeding pipes communicate with any master liquid supply tank, and the master liquid supply tank distributes plating solution to any slave liquid supply tank through the liquid distribution pipes.

9. The electroplating apparatus as claimed in claim 8, wherein the liquid delivery pipe is correspondingly provided with a liquid delivery control valve, and the liquid distribution pipe is correspondingly provided with a liquid distribution control valve.

10. The plating apparatus as recited in claim 8, further comprising a main self-circulation line corresponding to each of the main liquid supply tanks, and a sub self-circulation line corresponding to each of the sub liquid supply tanks, wherein both ends of the main self-circulation line are respectively communicated with the corresponding main liquid supply tanks, both ends of the sub self-circulation line are communicated with the corresponding sub liquid supply tanks, and a main circulation pump and a main heating device are sequentially disposed on the main self-circulation line, and a sub circulation pump and a sub heating device are sequentially disposed on the sub self-circulation line.

11. The plating apparatus as recited in claim 10, wherein a liquid inlet end of each liquid feeding pipe communicates with a pipe between the slave circulation pump and the slave heating device on the corresponding slave circulation pipe, and a liquid inlet end of each liquid distribution pipe communicates with a pipe between the master circulation pump and the master heating device on the corresponding master circulation pipe.

12. The electroplating apparatus according to any one of claims 1 to 11, wherein a liquid level balance pipeline is arranged between the liquid supply tanks of adjacent electroplating modules, and a liquid level control valve is arranged on the liquid level balance pipeline.

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