CN210287565U - Circulation supply system of calendering copper foil surface galvanizing liquid - Google Patents
Circulation supply system of calendering copper foil surface galvanizing liquid Download PDFInfo
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- CN210287565U CN210287565U CN201920973460.0U CN201920973460U CN210287565U CN 210287565 U CN210287565 U CN 210287565U CN 201920973460 U CN201920973460 U CN 201920973460U CN 210287565 U CN210287565 U CN 210287565U
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Abstract
The utility model provides a circulation feed system of calendering copper foil surface zinc-plating solution, including a plurality of agitator tanks, low level jar and the plating bath that are used for preparing zinc-plating solution, the agitator tank communicates to the low level jar through the liquid distribution pipe that sets separately respectively, just it has the measuring pump to join in marriage on the liquid pipe, the intercommunication has the last liquid pipe that is used for supplying zinc-plating solution for the plating bath on the low level jar, it has the filter to go up the liquid pipe intercommunication to the bottom of plating bath and go up the liquid on-line intercommunication, the upper portion intercommunication of plating bath has the back flow and the end of this back flow communicates to the low level jar. The utility model discloses can realize the stability of galvanizing solution, the circulation is supplied with, effectively avoided the galvanizing solution to prepare the in-process appear deposit and the great fluctuation of zinc ion, additive and pH value causes calendering copper foil performance unstability scheduling problem behind the surface treatment in the solution.
Description
Technical Field
The utility model belongs to the technical field of calendering copper foil surface treatment equipment, concretely relates to circulation feed system of calendering copper foil surface galvanizing solution.
Background
The high-temperature oxidation resistance of the copper foil can be effectively improved by depositing nano metal zinc on the surface of the rolled copper foil and passivating the nano metal zinc by chromate, wherein the deposition thickness and uniformity of the metal zinc have great influence on the appearance quality and physical and chemical properties of the copper foil, so that the galvanizing solution is strictly controlled for realizing the thickness control and uniformity of a metal zinc coating, and the stable supply of the galvanizing solution is ensured. However, the conventional system for supplying the zinc plating solution has problems of unstable supply amount, concentration fluctuation, and the like, and causes deterioration of the zinc plating quality on the surface of the rolled copper foil.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to the unstable problem that calendering copper foil surface galvanizing solution supplied with existence among the prior art, provide a circulation feed system of calendering copper foil surface galvanizing solution, can realize galvanizing solution's stability, circulation feed, effectively avoided galvanizing solution to prepare the in-process appear deposit and galvanizing solution in zinc ion, additive and the great fluctuation of pH value cause calendering copper foil performance unstability scheduling problem after the surface treatment.
The utility model adopts the following technical scheme:
a circulation supply system for a galvanized solution on the surface of a rolled copper foil comprises a plurality of stirring tanks, a low-level tank and an electroplating bath, wherein the stirring tanks are used for preparing the galvanized solution, the stirring tanks are respectively communicated to the low-level tank through liquid distribution pipes which are respectively arranged, the liquid distribution pipes are communicated with metering pumps, the low-level tank is communicated with a liquid feeding pipe used for supplying the galvanized solution to the electroplating bath, the liquid feeding pipe is communicated to the bottom of the electroplating bath, the liquid feeding pipe is communicated with a filter, the upper part of the electroplating bath is communicated with a return pipe, and the tail end of the return pipe is communicated to the low-level tank.
Furthermore, the bottom of the low-level tank is communicated with a heat exchange tube, the tail end of the heat exchange tube is communicated to the upper portion of the low-level tank, and a heat exchange pump and a heat exchanger are sequentially arranged on the heat exchange tube along the flow direction of liquid in the heat exchange tube.
Furthermore, the plating bath is arranged above the low-level tank, a liquid feeding pump is arranged on the liquid feeding pipe, the filter comprises a bag filter and a core type filter, and the bag filter and the core type filter are sequentially arranged along the flow direction of liquid in the liquid feeding pipe.
Furthermore, an overflow port is formed in the upper portion of the low-level tank to keep the liquid level of the low-level tank constant.
Further, the agitator tank includes zinc sulfate agitator tank, potassium pyrophosphate agitator tank and potassium hydroxide agitator tank.
The utility model has the advantages as follows:
the utility model discloses can realize the stability of galvanizing solution, the circulation is supplied with, and avoided galvanizing solution effectively to appear in the circulation process and deposit and the calendering copper foil unstable scheduling problem that the fluctuation of metallic ion, additive and pH value arouses in the galvanizing solution.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts;
fig. 1 is a schematic structural view of the present invention;
1. a zinc sulfate stirring tank; 2. a potassium pyrophosphate stirring tank; 3. a potassium hydroxide stirring tank; 4. a metering pump; 5. a liquid distribution pipe; 6. a liquid feeding pipe; 7. a low-level tank; 8. an overflow port; 9. feeding a liquid pump; 10. a bag filter; 11. a cartridge filter; 12. an electroplating bath; 13. a return pipe; 14. a heat exchange pipe; 15. a heat exchange pump; 16. a heat exchanger.
Detailed Description
In order to make the technical purpose, technical solution and advantageous effects of the present invention clearer, the technical solution of the present invention is further described below with reference to the accompanying drawings and specific embodiments.
Example 1
As shown in fig. 1, a circulation supply system for a rolled copper foil surface galvanizing solution comprises a zinc sulfate stirring tank 1, a potassium pyrophosphate stirring tank 2, a potassium hydroxide stirring tank 3, a low-level tank 7 and an electroplating bath 12, wherein the zinc sulfate stirring tank 1, the potassium pyrophosphate stirring tank 2 and the potassium hydroxide stirring tank 3 are respectively communicated to the low-level tank 7 through a liquid distribution pipe 5 which is respectively arranged, and the liquid distribution pipe 5 is communicated with a metering pump 4, so that each solution can be flexibly added according to the process demand; the electroplating bath 12 is arranged above the low-level tank 7, the low-level tank 7 is communicated with an upper liquid pipe 6 used for supplying a galvanizing solution to the electroplating bath 12, the upper liquid pipe 6 is communicated to the bottom of the electroplating bath 12, the upper edge of the upper liquid pipe 6 is sequentially communicated with a liquid feeding pump 9, a bag filter 10 and a core filter 11 along the liquid flow direction in the upper liquid pipe 6, the bag filter 10 and the core filter 11 adopt the conventional structure in the field, the upper part of the electroplating bath 12 is communicated with a return pipe 13, and the tail end of the return pipe 13 is communicated to the low-level tank 7. Further, the bottom of the low-level tank 7 is communicated with a heat exchange tube 14, the tail end of the heat exchange tube 14 is communicated with the upper portion of the low-level tank 7, a heat exchange pump 15 and a heat exchanger 16 are sequentially arranged on the heat exchange tube 14 along the flow direction of liquid in the heat exchange tube 14, the heat exchanger 16 adopts a conventional structure in the field, the upper liquid pump 9 and the heat exchange pump 15 are functionally named, and a common pump in the field is adopted.
The utility model discloses when using, the circulation process is as follows simply introduces:
(1) zinc sulfate, potassium pyrophosphate and potassium hydroxide are respectively mixed with distilled water in a zinc sulfate stirring tank 1, a potassium pyrophosphate stirring tank 2 and a potassium hydroxide stirring tank 3 according to a certain mass ratio to prepare solutions, the concentration is detected after stirring for 1 hour, after meeting the process requirements, a metering pump is started, and the three solutions are respectively added into a low-level tank through liquid distribution pipes according to a certain proportion;
(2) starting the heat exchange pump, and allowing the solution in the low-level tank to enter the heat exchanger through the heat exchange pipe for heat exchange so as to enable the temperature of the solution in the low-level tank to meet the process requirement and enable the solutions entering the low-level tank to be uniformly mixed; meanwhile, the concentration of zinc ions, the concentration of potassium pyrophosphate and the pH value in the low-level tank are detected, and the galvanizing solution is adjusted to the required process range through respective metering pumps according to the detection result;
(3) starting a liquid feeding pump, filtering the galvanizing solution by a bag filter and a core filter in sequence, and then feeding the galvanizing solution into an electroplating bath to carry out electro-galvanizing treatment on the surface of the rolled copper foil; meanwhile, the solution in the electroplating bath circularly flows back to the low-level tank through the return pipe so as to ensure that the concentration of each component in the galvanizing solution continuously and stably meets the process requirement;
in the process, the flow of the metering pump is adjusted according to the consumption condition of the galvanizing solution and the concentration detection result of each component, so that the concentration of each component in the galvanizing solution is always in the process requirement range, and the low-level tank solution is ensured to be in an overflow state in the whole process.
Finally, it should be noted that: the above-mentioned embodiments are only used for illustrating but not limiting the technical solution of the present invention, and any equivalent replacement and modification or partial replacement which do not depart from the spirit and scope of the present invention should be covered within the protection scope of the claims of the present invention.
Claims (5)
1. A circulation supply system of a rolled copper foil surface galvanizing solution is characterized in that: the device comprises a plurality of stirring tanks, a low-level tank and an electroplating bath, wherein the stirring tanks are used for preparing a galvanizing solution and are respectively communicated with the low-level tank through liquid distribution pipes which are respectively arranged, the liquid distribution pipes are communicated with metering pumps, the low-level tank is communicated with a liquid feeding pipe which is used for supplying the galvanizing solution to the electroplating bath, the liquid feeding pipe is communicated with the bottom of the electroplating bath and is communicated with a filter, the upper part of the electroplating bath is communicated with a return pipe, and the tail end of the return pipe is communicated with the low-level tank.
2. The system of claim 1, wherein the circulation supply system of the surface galvanizing solution for rolled copper foil comprises: the bottom of the low-level tank is communicated with a heat exchange tube, the tail end of the heat exchange tube is communicated to the upper portion of the low-level tank, and a heat exchange pump and a heat exchanger are sequentially arranged on the heat exchange tube along the liquid flow direction in the heat exchange tube.
3. The circulation supply system of a surface galvanizing solution for rolled copper foil according to claim 1 or 2, characterized in that: the electroplating bath is arranged above the low-level tank, a liquid feeding pump is arranged on the liquid feeding pipe, the filter comprises a bag filter and a core type filter, and the bag filter and the core type filter are sequentially arranged along the flow direction of liquid in the liquid feeding pipe.
4. The system of claim 1, wherein the circulation supply system of the surface galvanizing solution for rolled copper foil comprises: an overflow port is arranged at the upper part of the low-level tank to keep the liquid level of the low-level tank constant.
5. The system of claim 1, wherein the circulation supply system of the surface galvanizing solution for rolled copper foil comprises: the agitator tank includes zinc sulfate agitator tank, potassium pyrophosphate agitator tank and potassium hydroxide agitator tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920973460.0U CN210287565U (en) | 2019-06-26 | 2019-06-26 | Circulation supply system of calendering copper foil surface galvanizing liquid |
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| CN201920973460.0U CN210287565U (en) | 2019-06-26 | 2019-06-26 | Circulation supply system of calendering copper foil surface galvanizing liquid |
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| CN210287565U true CN210287565U (en) | 2020-04-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112376085A (en) * | 2020-10-26 | 2021-02-19 | 陕西汉和新材料科技有限公司 | Novel anti-oxidation process for electrolytic copper foil and adjusting method |
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2019
- 2019-06-26 CN CN201920973460.0U patent/CN210287565U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112376085A (en) * | 2020-10-26 | 2021-02-19 | 陕西汉和新材料科技有限公司 | Novel anti-oxidation process for electrolytic copper foil and adjusting method |
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