CN208949430U - The pcb board electroplanting device of electrolyte is overflowed based on groove body - Google Patents
The pcb board electroplanting device of electrolyte is overflowed based on groove body Download PDFInfo
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- CN208949430U CN208949430U CN201821510006.3U CN201821510006U CN208949430U CN 208949430 U CN208949430 U CN 208949430U CN 201821510006 U CN201821510006 U CN 201821510006U CN 208949430 U CN208949430 U CN 208949430U
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- groove body
- electroplating bath
- pcb board
- liquid outlet
- electroplanting device
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Abstract
The utility model provides a kind of pcb board electroplanting device that electrolyte is overflowed based on groove body, comprising: electroplating bath, filter, groove body, input duct and liquid outlet pipe；The groove body has opening upward, and is set to the top of the electroplating bath inner space；The input duct first end is connected to the liquid outlet of the filter, second end is connected to the groove body；The liquid outlet pipe first end is connected to the inlet of the filter, second end be connected to the electroplating bath inner space bottom.In actual use, the electroplate liquid in groove body can be overflowed from opening, and be entered in the inner space, so that the bubble in electroplate liquid sufficiently discharges, and then the bubble reduced in electroplate liquid improves electroplating quality to greatly reduce the shrinkage pool on pcb board surface.
Description
Technical field
The utility model relates to PCB auxiliary fixture technical field more particularly to a kind of PCB that electrolyte is overflowed based on groove body
Plate electroplanting device.
Background technique
Plate is important electronic component to PCB (Printed Circuit Board, printed circuit board), is electronic component
Supporter, processing quality and efficiency are all vital.In the production process of pcb board, need to carry out electricity to pcb board
Plating, plating are exactly to plate one layer of other metal (for example, copper etc.) on certain metal surfaces using electrolysis principle or close
The production processes such as gold, plating can enhance the corrosion resistance of metal, increase the hardness of material, prevent from wearing away, and improve electric conductivity, smooth
Property, heat resistance and surface aesthetic.
Therefore, a kind of pcb board electroplanting device that electrolyte is overflowed based on groove body how is designed, it is just urgently to be resolved as one
The problem of.
Utility model content
The purpose of this utility model is to provide a kind of pcb board electroplanting devices that electrolyte is overflowed based on groove body.
In order to realize that one of above-mentioned purpose of utility model, one embodiment of the utility model provide a kind of excessive based on groove body
The pcb board electroplanting device of electrolyte out, comprising: electroplating bath, filter, groove body, input duct and liquid outlet pipe；The groove body tool
There is opening upward, and is set to the top of the electroplating bath inner space；The input duct first end is connected to the filtering
The liquid outlet of machine, second end are connected to the groove body；The liquid outlet pipe first end is connected to the inlet of the filter, second end
It is connected to the bottom of the inner space of the electroplating bath.
As the further improvement of one embodiment of the utility model, the groove body is set to the inner sidewall of the electroplating bath
Top.
As the further improvement of one embodiment of the utility model, the bottom of the input duct and the groove body connects
It is logical.
As the further improvement of one embodiment of the utility model, the groove body is cylindrical.
As the further improvement of one embodiment of the utility model, the inner space of the electroplating bath is in cuboid.
As the further improvement of one embodiment of the utility model, the electroplating bath includes in first be oppositely arranged
Side wall and the second inner sidewall, the liquid outlet pipe are communicated to the bottom of the first inner sidewall, and the groove body is set to the second inner sidewall
Top.
As the further improvement of one embodiment of the utility model, it is connected in the input duct or liquid outlet pipe
Pump.
As the further improvement of one embodiment of the utility model, heating device is provided in the electroplating bath.
As the further improvement of one embodiment of the utility model, thermometer is provided in the electroplating bath.
As the further improvement of one embodiment of the utility model, the bottom of the electroplating bath is provided with waste liquid outlet.
Compared with the existing technology, the utility model has the technical effect that the utility model embodiment provides a kind of base
The pcb board electroplanting device of electrolyte is overflowed in groove body, comprising: electroplating bath, filter, groove body, input duct and liquid outlet pipe；Institute
Groove body is stated with opening upward, and is set to the top of the electroplating bath inner space；The input duct first end connection
The liquid outlet of the filter, second end are connected to the groove body；The liquid outlet pipe first end is connected to the feed liquor of the filter
Mouth, second end are connected to the bottom of the inner space of the electroplating bath.In actual use, the electroplate liquid in groove body can overflow from opening
Out, it and enters in the inner space, so that the bubble in electroplate liquid sufficiently discharges, and then reduces electroplate liquid
In bubble improve electroplating quality to greatly reduce the shrinkage pool on pcb board surface.
Detailed description of the invention
Fig. 1 is the three-dimensional structure diagram of the pcb board electroplanting device in the utility model embodiment.
Specific embodiment
The utility model is described in detail below with reference to each embodiment shown in the drawings.But these embodiments
It is not intended to limit the utility model, structure, method or the function that those skilled in the art are made according to these embodiments
Transformation on energy is all contained in the protection scope of the utility model.
The term of the representation space relative position used herein such as "upper", " top ", "lower", " lower section " is for just
A unit as shown in the drawings or feature are described relative to another unit or the relationship of feature in the purpose of explanation.It is empty
Between the term of relative position can be intended to include different direction of the equipment in use or work other than orientation as shown in the figure.
For example, the unit for being described as being located at other units or feature " below " or " under " will if the equipment in figure overturn
Positioned at other units or feature " top ".Therefore, exemplary term " lower section " can include above and below both orientation.If
It is standby to be otherwise directed (be rotated by 90 ° or other directions), and be interpreted accordingly used herein with space correlation
Language is described.
Also, it should be understood that although term first, second etc. can be used to describe herein various elements or
Structure, but these are described object and should not be limited by these terms.These terms are only used to by these description objects that
This is distinguished.For example, the first inner sidewall can be referred to as the second inner sidewall, and similarly the second inner sidewall can also be referred to as
First inner sidewall, this protection scope without departing from the application.
The utility model embodiment provides a kind of pcb board electroplanting device that electrolyte is overflowed based on groove body, such as Fig. 1 institute
It states, comprising: electroplating bath 1, filter 2, groove body 11, input duct 21 and liquid outlet pipe 22；The groove body 11 has opening upward
Mouthful, and it is set to the top of 1 inner space of electroplating bath；21 first end of input duct is connected to going out for the filter 2
Liquid mouth, second end are connected to the groove body 11；22 first end of liquid outlet pipe is connected to the inlet of the filter 2, second end
It is connected to the bottom of the inner space of the electroplating bath 1.
Here, when in use, the pcb board for needing for be put into electroplate liquid in 1 inner space of electroplating bath, and needs being electroplated
It is immersed in the electroplate liquid, then starts to be electroplated；In the plating process, filter 2 start and by liquid outlet pipe 22 it is interior from this
The bottom in portion space sucks the electroplate liquid containing impurity, then filters out impurity, and passes through input duct 21 for filtered electricity
Plating solution is input in groove body 11, it is to be understood that the electroplate liquid in groove body 11 can gradually increase, later can be from opening upward
It overflows, and enters in inner space, so that the bubble in electroplate liquid sufficiently discharges, and then reduce in electroplate liquid
Bubble improve electroplating quality to greatly reduce the shrinkage pool on pcb board surface.
Preferably, the groove body 11 is set to the top of the inner sidewall of the electroplating bath 1.
Preferably, the input duct 21 is connected to the bottom of the groove body 11.Here, in plating, electroplate liquid is the bottom of from
Portion inputs in groove body 11, and then the electroplate liquid slowly rises along groove body 11, overflows then along opening, so as in groove body
When stopping longer in 11, consequently facilitating the release of the bubble in electroplate liquid.
Preferably, the groove body 11 is cylindrical.
Preferably, the inner space of the electroplating bath 1 is in cuboid.
Preferably, the electroplating bath 1 includes the first inner sidewall 12 and the second inner sidewall 13 being oppositely arranged, the liquid out
Pipeline 22 is communicated to the bottom of the first inner sidewall 12, and the groove body 11 is set to the top of the second inner sidewall 13.Here, it is being electroplated
When, electroplate liquid is flowed into the inner space of the electroplating bath 11 from the second inner sidewall 13, the first inner sidewall 12 is then flowed to,
Then it is flowed into filter 2 by liquid outlet pipe 22, it is to be understood that in the process, all positions in electroplating bath 11
The electroplate liquid set all is updated.
Preferably, the pump being connected in the input duct 21 or liquid outlet pipe 22.Here, electroplate liquid is from liquid outlet pipe 22
In flow into filter 2, then flowed in groove body 11 from input duct 21, it is to be understood that this needs an equipment for plating
The flowing of liquid provides power, and therefore, it is necessary to which a pump is arranged, which can be set in input duct 21, also can be set
In liquid outlet pipe 22.
Preferably, heating device is provided in the electroplating bath 1.Here, heating device is set in electroplating bath 1, thus
It can be heated to electroplate liquid.
Preferably, thermometer is provided in the electroplating bath 1.
Preferably, the bottom of the electroplating bath 1 is provided with waste liquid outlet.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book
With the other embodiments of understanding.
Tool of the series of detailed descriptions listed above only for the feasible embodiment of the utility model
Body explanation, they are all without departing from made by the utility model skill spirit not to limit the protection scope of the utility model
Equivalent implementations or change should be included within the scope of protection of this utility model.
Claims (7)
1. a kind of pcb board electroplanting device for overflowing electrolyte based on groove body characterized by comprising
Electroplating bath, filter, groove body, input duct and liquid outlet pipe；
The groove body has opening upward, and is set to the top of the electroplating bath inner space；
The input duct first end is connected to the liquid outlet of the filter, second end is connected to the groove body；The liquid outlet pipe
First end is connected to the inlet of the filter, second end be connected to the electroplating bath inner space bottom, the groove body sets
It is placed in the top of the inner sidewall of the electroplating bath, the input duct is connected to the bottom of the groove body, and the groove body is in cylinder
Shape.
2. pcb board electroplanting device according to claim 1, it is characterised in that:
The inner space of the electroplating bath is in cuboid.
3. pcb board electroplanting device according to claim 1, it is characterised in that:
The electroplating bath includes the first inner sidewall and the second inner sidewall being oppositely arranged, and the liquid outlet pipe is communicated in first
The bottom of side wall, the groove body are set to the top of the second inner sidewall.
4. pcb board electroplanting device according to claim 1, which is characterized in that further include:
The pump being connected in the input duct or liquid outlet pipe.
5. pcb board electroplanting device according to claim 1, it is characterised in that:
Heating device is provided in the electroplating bath.
6. pcb board electroplanting device according to claim 1, it is characterised in that:
Thermometer is provided in the electroplating bath.
7. pcb board electroplanting device according to claim 1, it is characterised in that:
The bottom of the electroplating bath is provided with waste liquid outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821510006.3U CN208949430U (en) | 2018-09-14 | 2018-09-14 | The pcb board electroplanting device of electrolyte is overflowed based on groove body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821510006.3U CN208949430U (en) | 2018-09-14 | 2018-09-14 | The pcb board electroplanting device of electrolyte is overflowed based on groove body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208949430U true CN208949430U (en) | 2019-06-07 |
Family
ID=66738049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821510006.3U Active CN208949430U (en) | 2018-09-14 | 2018-09-14 | The pcb board electroplanting device of electrolyte is overflowed based on groove body |
Country Status (1)
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|---|---|
| CN (1) | CN208949430U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112210813A (en) * | 2020-11-20 | 2021-01-12 | 硅密芯镀(海宁)半导体技术有限公司 | Accommodating cavity and wafer electroplating system comprising same |
-
2018
- 2018-09-14 CN CN201821510006.3U patent/CN208949430U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112210813A (en) * | 2020-11-20 | 2021-01-12 | 硅密芯镀(海宁)半导体技术有限公司 | Accommodating cavity and wafer electroplating system comprising same |
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