CN113118650A - Thick plate laser perforation processing method - Google Patents

Abstract

The invention relates to a thick plate laser perforation processing method. The method comprises the following steps: reading initial perforation parameters and a reading target, then focusing, focusing the focus to I1, I2 and I3, setting corresponding perforation gas, perforation air pressure, gas outlet delay, cutting nozzle gap and perforation power, closing a switch, judging whether a small circle is cut, and calling parameters of the cut small circle if the small circle is cut to finish the cutting of the small circle; judging whether slag is burned or not, calling slag burning parameters and finishing slag burning; and calling cutting parameters, starting follow-up, calling a blind area function, and starting cutting. The processing method can solve the problem of perforation of the limit stainless steel thick plate, thereby realizing whole plate cutting, ensuring the whole plate cutting to be carried out smoothly and improving the working efficiency.

Description

Thick plate laser perforation processing method

Technical Field

The invention relates to a processing method, in particular to a thick plate laser perforation processing method, and belongs to the technical field of laser cutting.

Background

The laser cutting is realized by focusing a laser beam on the surface of a material by using a focusing lens to melt the material, blowing away the melted slag by using coaxial compressed gas of the laser beam, and making the laser beam and the material move relatively along a certain track so as to form a certain cutting seam; but all the cuts must originate from the perforation of the sheet before the cuts can be made; in other words, the perforation is the first part for good cutting stabilization effect; the perforation plays an important role in laser cutting, and influences the cutting effect, the production efficiency and the cutting stability. At present, when a stainless steel thick plate is subjected to laser nitrogen cutting, if the cutting limit plate thickness is reached, the perforation is unstable, even the perforation cannot be carried out, and the whole plate cutting cannot be realized.

Disclosure of Invention

Aiming at the defects, the invention aims to provide a thick plate laser punching processing method which can solve the punching problem of a limit stainless steel thick plate, realize whole plate cutting and improve the working efficiency.

Therefore, the technical scheme adopted by the invention is as follows:

the method comprises the following steps:

the first step is as follows: reading the starting puncturing parameter: perforation frequency A1, perforation duty ratio B1, gas type C1, gas pressure D1, gas outlet delay E1, cutting nozzle gap F1, perforation power G1, perforation delay H1 and focal position I1;

the second step is that: reading a target perforation parameter: perforation frequency A2, perforation duty ratio B2, gas type C2, gas pressure D2, gas outlet delay E2, cutting nozzle gap F2, perforation power G2, perforation delay H2 and focal position I2;

the third step: reading a target perforation parameter: perforation frequency A3, perforation duty ratio B3, gas type C3, gas pressure D3, gas outlet delay E3, cutting nozzle gap F3, perforation power G3, perforation delay H3 and focal position I3;

the fourth step: focus was adjusted to I1, setting the perforation gas: c1, perforation pressure: d1, air outlet time delay: e1, cutting nozzle gap F1 and perforation power G1, then opening the electronic shutter and emitting light H1 seconds;

the fifth step: setting perforation power G4, perforation focus I4 and gas pressure D4, lifting the cutting head by 40mm at a speed of 5000mm/min, and then descending by 40mm at a speed of 5000 mm/min;

and a sixth step: focus was adjusted to I2, setting perforation gas: c2, perforation pressure: d2, air outlet time delay: e2, cutting torch gap F2, perforation power G2 and light emission H2 seconds;

the seventh step: setting perforation power G4, perforation focus I4 and gas pressure D4, lifting the cutting head by 40mm at a speed of 5000mm/min, and then descending by 40mm at a speed of 5000 mm/min;

eighth step: focus to I3, set perforation gas: c3, perforation pressure: d3, air outlet time delay: e3, cutting torch gap F3, perforation power G3, light emission H3 seconds, and closing;

the ninth step: judging whether a small circle is cut, if so, calling parameters of the cut small circle to finish the cutting of the small circle; judging whether slag is burned or not, calling slag burning parameters and finishing slag burning;

the tenth step: and calling cutting parameters, starting follow-up, calling a blind area function, and starting cutting.

The invention has the advantages that:

the processing method can solve the problem of perforation of the limit stainless steel thick plate, thereby realizing whole plate cutting, ensuring the whole plate cutting to be carried out smoothly and improving the working efficiency.

Drawings

FIG. 1 is a process flow diagram of the present invention.

Detailed Description

A thick plate laser perforation processing method comprises the following steps:

the first step is as follows: reading the starting puncturing parameter: perforation frequency A1, perforation duty ratio B1, gas type C1, gas pressure D1, gas outlet delay E1, cutting nozzle gap F1, perforation power G1, perforation delay H1 and focal position I1;

the second step is that: reading a target perforation parameter: perforation frequency A2, perforation duty ratio B2, gas type C2, gas pressure D2, gas outlet delay E2, cutting nozzle gap F2, perforation power G2, perforation delay H2 and focal position I2;

the third step: reading a target perforation parameter: perforation frequency A3, perforation duty ratio B3, gas type C3, gas pressure D3, gas outlet delay E3, cutting nozzle gap F3, perforation power G3, perforation delay H3 and focal position I3;

the fourth step: focus was adjusted to I1, setting the perforation gas: c1, perforation pressure: d1, air outlet time delay: e1, cutting nozzle gap F1 and perforation power G1, then opening the electronic shutter and emitting light H1 seconds;

the fifth step: setting perforation power G4, perforation focus I4 and gas pressure D4, lifting the cutting head by 40mm at a speed of 5000mm/min, and then descending by 40mm at a speed of 5000 mm/min;

and a sixth step: focus was adjusted to I2, setting perforation gas: c2, perforation pressure: d2, air outlet time delay: e2, cutting torch gap F2, perforation power G2 and light emission H2 seconds;

the seventh step: setting perforation power G4, perforation focus I4 and gas pressure D4, lifting the cutting head by 40mm at a speed of 5000mm/min, and then descending by 40mm at a speed of 5000 mm/min;

eighth step: focus to I3, set perforation gas: c3, perforation pressure: d3, air outlet time delay: e3, cutting torch gap F3, perforation power G3, light emission H3 seconds, and closing;

the ninth step: judging whether a small circle is cut, if so, calling parameters of the cut small circle to finish the cutting of the small circle; judging whether slag is burned or not, calling slag burning parameters and finishing slag burning;

the tenth step: and calling cutting parameters, starting follow-up, calling a blind area function, and starting cutting.

It is to be emphasized that: the above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (1)

1. A thick plate laser perforation processing method is characterized by comprising the following steps:

the first step is as follows: reading the starting puncturing parameter: perforation frequency A1, perforation duty ratio B1, gas type C1, gas pressure D1, gas outlet delay E1, cutting nozzle gap F1, perforation power G1, perforation delay H1 and focal position I1;

the second step is that: reading a target perforation parameter: perforation frequency A2, perforation duty ratio B2, gas type C2, gas pressure D2, gas outlet delay E2, cutting nozzle gap F2, perforation power G2, perforation delay H2 and focal position I2;

the third step: reading a target perforation parameter: perforation frequency A3, perforation duty ratio B3, gas type C3, gas pressure D3, gas outlet delay E3, cutting nozzle gap F3, perforation power G3, perforation delay H3 and focal position I3;

the fourth step: focus was adjusted to I1, setting the perforation gas: c1, perforation pressure: d1, air outlet time delay: e1, cutting nozzle gap F1 and perforation power G1, then opening the electronic shutter and emitting light H1 seconds;

the fifth step: setting perforation power G4, perforation focus I4 and gas pressure D4, lifting the cutting head by 40mm at a speed of 5000mm/min, and then descending by 40mm at a speed of 5000 mm/min;

and a sixth step: focus was adjusted to I2, setting perforation gas: c2, perforation pressure: d2, air outlet time delay: e2, cutting torch gap F2, perforation power G2 and light emission H2 seconds;

the seventh step: setting perforation power G4, perforation focus I4 and gas pressure D4, lifting the cutting head by 40mm at a speed of 5000mm/min, and then descending by 40mm at a speed of 5000 mm/min;

eighth step: focus to I3, set perforation gas: c3, perforation pressure: d3, air outlet time delay: e3, cutting torch gap F3, perforation power G3, light emission H3 seconds, and closing;

the ninth step: judging whether a small circle is cut, if so, calling parameters of the cut small circle to finish the cutting of the small circle; judging whether slag is burned or not, calling slag burning parameters and finishing slag burning;

the tenth step: and calling cutting parameters, starting follow-up, calling a blind area function, and starting cutting.

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