CN113115188B - MEMS piezoelectric microphone - Google Patents
MEMS piezoelectric microphone Download PDFInfo
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- CN113115188B CN113115188B CN202110332900.6A CN202110332900A CN113115188B CN 113115188 B CN113115188 B CN 113115188B CN 202110332900 A CN202110332900 A CN 202110332900A CN 113115188 B CN113115188 B CN 113115188B
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 38
- 239000012528 membrane Substances 0.000 claims abstract description 30
- 238000004873 anchoring Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 32
- 238000010276 construction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/02—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
The invention provides a MEMS piezoelectric microphone, comprising at least one piezoelectric unit, wherein the piezoelectric unit comprises: the membrane structure comprises a fixed area and a plurality of movable parts, wherein the fixed area comprises an anchoring part and a plurality of anchoring arms formed by extending radially from the edge of the anchoring part; the piezoelectric unit further comprises a plurality of elastic structures, each elastic structure comprises a fixing portion and an elastic portion fixed on the fixing portion, the fixing portion is fixed on the anchoring arm, and the elastic portion surrounds the periphery side of each movable portion. According to the invention, the fixed parts of the elastic structures are fixed on the anchoring arms, and the elastic parts encircle the outer peripheral side of each movable part, so that the diaphragm is bound to the substrate through the elastic structures, and the reliability of the microphone is greatly improved.
Description
[ field of technology ]
The invention relates to the technical field of acoustic-electric conversion, in particular to an MEMS piezoelectric microphone.
[ background Art ]
Microelectromechanical systems (Micro-Electro-Mechanical System, MEMS), also known as microelectromechanical systems, microsystems, micromachines, etc., are a tiny high-tech device. Common products include MEMS piezoelectric microphones and the like, which comprise a piezoelectric unit comprising a substrate, a support and a membrane structure, wherein the membrane structure consists of four mutually independent sector-shaped membranes, and a small part of the middle of the membrane structure is fixed on a support column of the support, while the support arm area of the support does not cover the membrane structure, i.e. only the apex part of each sector-shaped membrane is fixed on the support column of the support. However, one end of the structure is fixed in the middle, and the other end is free, so that the free end of the membrane layer of the structure can be greatly warped under the condition of stress, and meanwhile, the reliability in the dropping process can be poor, thereby affecting the reliability of the MEMS piezoelectric microphone to a certain extent.
[ invention ]
The invention aims to provide a MEMS piezoelectric microphone with good reliability.
To achieve the above object, the present invention provides a MEMS piezoelectric microphone comprising at least one piezoelectric unit comprising: the base comprises an annular peripheral wall surrounding an accommodating cavity and a supporting structure arranged in the accommodating cavity, wherein the supporting structure comprises a supporting part and a plurality of extension arms, the supporting part is arranged at intervals with the peripheral wall, and the extension arms extend from the peripheral wall to the supporting part; the diaphragm structure is an integrated structure and comprises a fixed area and a plurality of movable parts, wherein the fixed area comprises an anchoring part and a plurality of anchoring arms which are formed by extending radially from the edge of the anchoring part, the anchoring part is fixed on the supporting part, the anchoring arms are fixed on the extension arm, and each movable part surrounds the anchoring part and is arranged at intervals with the anchoring arms; the piezoelectric unit further comprises a plurality of elastic structures, each elastic structure comprises a fixing portion and an elastic portion fixed on the fixing portion, the fixing portion is fixed on the anchoring arm, and the elastic portion surrounds the periphery side of each movable portion.
Preferably, the elastic part comprises a first elastic arm, a second elastic arm and a connecting arm which are oppositely arranged, two ends of the first elastic arm are respectively fixedly connected with the fixing part and the connecting arm, and the second elastic arm is fixedly connected with the connecting arm and is matched and attached to the outer peripheral side of the movable part.
Preferably, each of the elastic structures is a spring structure.
Preferably, the spring structure comprises one of a single arm structure, a serpentine structure or an i-shaped structure.
Preferably, each elastic structure and the anchoring arm are integrally formed.
Preferably, the diaphragm structure includes a first electrode layer, a first piezoelectric layer and a second electrode layer laminated in sequence along a vibration direction thereof, and the first electrode layer is disposed on a side of the diaphragm structure close to the support structure.
Preferably, the membrane structure further includes a second piezoelectric layer stacked on a side of the second electrode layer away from the first piezoelectric layer, and a third electrode layer stacked on the second piezoelectric layer.
Preferably, the elastic structure includes a first elastic structure layer, a second elastic structure layer, a third elastic structure layer, a fourth elastic structure layer and a fifth elastic structure layer which are sequentially stacked along the vibration direction, and the first elastic structure layer, the second elastic structure layer, the third elastic structure layer, the fourth elastic structure layer and the fifth elastic structure layer respectively encircle on the peripheries of the first electrode layer, the first piezoelectric layer, the second electrode layer, the second piezoelectric layer and the third electrode layer.
Preferably, the first elastic structure layer, the second elastic structure layer, the third elastic structure layer, the fourth elastic structure layer, and the fifth elastic structure layer have the same structure.
The invention has the beneficial effects that: there is provided a MEMS piezoelectric microphone in which a diaphragm structure is fixed to a substrate by an anchor portion and a plurality of anchor arms formed to extend radially from an edge of the anchor portion, and in which the anchor arms of the diaphragm structure are bound to the substrate by an elastic structure by fixing the fixing portion of a plurality of elastic structures to the upper surface, the elastic portion surrounding an outer peripheral side of each of the movable portions, thereby greatly improving reliability of the MEMS piezoelectric microphone.
[ description of the drawings ]
Fig. 1 is a schematic structural view of a piezoelectric unit according to an embodiment of the present invention;
FIG. 2 is a top view of a piezoelectric unit according to an embodiment of the present invention;
FIG. 3 is a bottom view of a piezoelectric unit according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view taken along the line A-A in FIG. 1;
fig. 5 is a perspective view of a piezoelectric unit according to an embodiment of the present invention;
FIG. 6 is a schematic structural view of an elastic structure according to an embodiment of the present invention;
FIG. 7 is an enlarged view of a portion of B in FIG. 6;
FIG. 8 is a schematic view of a substrate according to an embodiment of the present invention;
fig. 9 is a schematic structural view of a first substrate according to an embodiment of the present invention;
FIG. 10 is a top view of a second substrate according to an embodiment of the present invention;
fig. 11 is a schematic structural view of a first electrode layer according to an embodiment of the present invention;
fig. 12 is a schematic structural view of a first piezoelectric layer according to an embodiment of the present invention.
[ detailed description ] of the invention
The invention will be further described with reference to the drawings and embodiments.
It should be noted that, in the embodiments of the present invention, all directional indicators (such as up, down, left, right, front, back, inner, outer, top, bottom … …) are merely used to explain the relative positional relationship between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicators correspondingly change.
Referring to fig. 1 to 12, the present invention provides a MEMS piezoelectric microphone, where the MEMS piezoelectric microphone includes a plurality of piezoelectric units 1, and the plurality of piezoelectric units 1 are distributed in an array structure, in this embodiment, the number of piezoelectric units 1 is 1, and of course, in order to ensure a certain sensitivity or signal-to-noise ratio, the piezoelectric units 1 may also be distributed in a 2×2 array structure, a 3*3 array structure or more.
Referring to fig. 1 to 5, a piezoelectric unit 1 includes a substrate 10, a membrane structure 30, and an elastic structure 20, the square substrate 10 having a receiving cavity 101; the diaphragm structure 30 is formed above the substrate 10, and the elastic structure 20 is fixed to the diaphragm structure 30 and circumferentially disposed on the outer peripheral side of the diaphragm structure 30.
The substrate 10, the substrate 10 includes an annular peripheral wall 102 surrounding a containing cavity 101 and a supporting structure disposed in the containing cavity 101, the supporting structure includes a supporting portion 103 spaced from the peripheral wall 102 and a plurality of extension arms 104 extending from the peripheral wall 102 to the supporting portion 103.
The diaphragm structure 30, the diaphragm structure 30 is an integral structure, and comprises a fixed area 301 and a plurality of movable portions 302, the fixed area 301 comprises an anchor portion 303 and a plurality of anchor arms 304 formed by extending radially from the edge of the anchor portion 303, the anchor portion 303 is fixed on the supporting portion 103, the anchor arms 304 are fixed on the extension arm 104, and each movable portion 302 surrounds the anchor portion 303 and is arranged at intervals with the anchor arms 304.
The elastic structures 20 include a fixing portion 21 and an elastic portion 22 fixed on the fixing portion 21, the fixing portion 21 is fixed on the anchor arm 304, and the elastic portion 22 surrounds the outer peripheral side of each movable portion 302.
The diaphragm structure 30 of the piezoelectric unit 1 is fixed to the substrate by the anchor portion 303 and the plurality of anchor arms 304 formed by extending radially from the edge of the anchor portion, and by fixing the fixing portion 21 of the plurality of elastic structures 20 to the anchor arms 304, the elastic portion 22 surrounds the outer peripheral side of each of the movable portions 302, so that the diaphragm is bound to the substrate 10 by the elastic structures, thereby greatly improving the reliability of the microphone.
In this embodiment, one end of the extension arm 104 is connected to the supporting portion 103, and the other end of the extension arm 104 is connected to the peripheral wall 102, so as to divide the accommodating cavity 101 into a plurality of cavities 105 disposed at intervals along the circumferential direction of the extension arm 104, and the orthographic projection of the elastic structure 20 and the movable portion 302 along the axial direction of the substrate 10 falls into the cavities 105. Specifically, an elastic structure 20 and a movable portion 302 are suspended above each cavity 105, and the projection profile of each elastic structure 20 and each movable portion 302 in the direction perpendicular to the membrane structure 30 is located within the projection profile of the corresponding cavity 105 in the direction perpendicular to the membrane structure 30.
In the present embodiment, four support structures are provided on the substrate 10, and four membrane structures 30 and four elastic structures 20 are correspondingly provided; three support structures may be provided on the substrate 10, three membrane structures 30 and three elastic structures 20 are provided correspondingly, and the electrode layer may be made into a multi-block structure on each membrane. Specifically, the number of electrodes needs to be designed according to the size requirement of the capacitor. Of course, the support structure, the membrane structure and the elastic structure are not limited to the above three, four, etc., but may be five, six, etc., and may be specifically selected according to practical situations.
In this embodiment, the projection profile of the inner side wall of the annular peripheral wall 102 in the direction perpendicular to the membrane structure 30 may be circular or polygonal, and the number of the extension arms 104 may be set according to practical needs, specifically, the number of the extension arms is at least two, and as a more preferred embodiment, the number of the extension arms 104 is four.
In the present embodiment, the projection profiles of the inner side wall of the annular peripheral wall 102 and the outer side wall of the supporting portion 103 in the substrate 10 in the direction perpendicular to the membrane structure 30 are both circular; the projection contour of the anchoring part 303 in the direction of the vertical membrane structure 30 is circular, and the projection contour of the anchoring arm 304 in the direction of the vertical membrane structure 30 is strip-shaped; the projection profile of the single movable portion 302 in the direction perpendicular to the membrane structure 30 is in the shape of a sector ring.
In this embodiment, each elastic structure 20 and the anchor arm 304 are integrally formed. The fixing effect is good, and the structural strength is high.
In this embodiment, the elastic portion 22 includes a first elastic arm 221, a second elastic arm 222, and a connecting arm 223 that are disposed opposite to each other, two ends of the first elastic arm 221 are fixedly connected to the fixing portion and the connecting arm 223, and the second elastic arm 222 is fixedly connected to the connecting arm 223 and is attached to the outer peripheral side of the movable portion in a matching manner. The first elastic arm 221 and the second elastic arm 222 are oppositely disposed between the substrate and the membrane structure, and one ends of the first elastic arm 221 and the second elastic arm 222 are fixedly connected through the connecting arm 223, so that the elastic performance of the first elastic arm 221 and the second elastic arm 222 acts on the membrane structure, and the membrane structure 30 is bound to the substrate 10 through the elastic structure 20, thereby greatly improving the reliability of the MEMS piezoelectric microphone.
In this embodiment, an elastic gap 224 is formed between the first elastic arm 221 and the second elastic arm 222 at intervals. The elastic performance between the first elastic arm 221 and the second elastic arm 222 can be increased through the elastic gap 224, so that the overall elastic performance of the elastic structure 20 is improved, and the reliability of the microphone is further improved.
Further, the first elastic arm 221 and the second elastic arm 222 may be disposed in an arc structure, and correspondingly disposed on the outer peripheral side of the membrane structure 30, so as to facilitate binding the membrane structure to the substrate, and the fixing effect is good.
In this embodiment, each of the elastic structures 20 is a spring structure. The spring structure has good elastic recovery effect, is convenient for binding the diaphragm structure 30 on the substrate 10, and effectively improves the reliability of the microphone.
In other embodiments, the spring structure further comprises one of a single arm structure, a serpentine structure, or an i-shaped structure.
In this embodiment, the membrane structure 30 is formed by stacking at least three layers of materials. Alternatively, the diaphragm structure 30 includes a first electrode layer 31, a first piezoelectric layer 32, and a second electrode layer 33 sequentially stacked in the vibration direction, and the first electrode layer 31 is disposed on a side of the diaphragm structure 30 close to the support structure.
In this embodiment, the membrane structure 30 further includes a second piezoelectric layer 34 stacked on a side of the second electrode layer 33 away from the first piezoelectric layer 32, and a third electrode layer 35 stacked on the second piezoelectric layer 34.
In the present embodiment, the elastic structure includes a first elastic structure layer 23, a second elastic structure layer 24, a third elastic structure layer 25, a fourth elastic structure layer 26, and a fifth elastic structure layer 27, which are laminated in this order, along the vibration direction, the first elastic structure layer 23, the second elastic structure layer 24, the third elastic structure layer 25, the fourth elastic structure layer 26, and the fifth elastic structure layer 27 are respectively wound around the peripheral edges of the first electrode layer 31, the first piezoelectric layer 32, the second electrode layer 33, the second piezoelectric layer 34, and the third electrode layer 35.
The first elastic construction layer 23, the second elastic construction layer 24, the third elastic construction layer 25, the fourth elastic construction layer 26 and the fifth elastic construction layer 27 are identical in structure.
The first electrode layer 31 includes a first electrode piece 311 located at the movable portion 302 and a second electrode piece 312 located at the fixed area 301, where the first electrode piece 311 is spaced from the second electrode piece 312. The second electrode layer 33 and the third electrode layer 35 have the same structure as the first electrode layer 31.
The second electrode layer 33 includes a third electrode piece located at the movable portion 302 and a fourth electrode piece located at the fixed area 301, where the third electrode piece is spaced from the fourth electrode piece.
The third electrode layer 35 includes a fifth electrode piece located at the movable portion 302 and a sixth electrode piece located at the fixed region 301, where the fifth electrode piece is spaced from the sixth electrode piece.
The first piezoelectric layer 32 includes a first movable portion 321 located at the movable portion 302 and a first fixed region 322 located at the fixed region 301, and the first movable portion 321 is connected to the first fixed region 322. The first piezoelectric layer 32 is integrally formed and has a circular structure as a whole, that is, the first movable portion 321 is connected with the first fixed area 322, so as to improve the reliability of the diaphragm structure 30. The second piezoelectric layer 34 is identical in structure to the first piezoelectric layer 32.
The second piezoelectric layer 34 includes a second movable portion located at the movable portion 302 and a second fixed region located at the fixed region 301, and the second movable portion is connected to the second fixed region.
In this embodiment, the extension arm 104 divides the accommodating cavity 101 into a plurality of cavities, and the orthographic projection of the movable portion along the axial direction of the substrate falls into the cavities.
In this embodiment, the number of extension arms 104 is at least two.
In this embodiment, the base 10 includes a first substrate 11 and a second substrate 12, the accommodating cavity 101 includes a first cavity 111 formed in the first substrate 11, the peripheral wall 102 includes a first peripheral wall 112 surrounding the first cavity, the supporting portion 103 includes a first supporting portion 113 disposed in the first cavity 111 and spaced apart from the first peripheral wall 112, and the plurality of extension arms 104 includes a plurality of first extension arms 114 extending from the first peripheral wall 112 to the first supporting portion 113.
Referring to fig. 9 to 10, the first substrate 11 includes a first peripheral wall 112 surrounding a first cavity 111, a first supporting portion 113 disposed in the first cavity 111 and spaced apart from the first peripheral wall 112, and a first extension arm 114 extending from the first peripheral wall 112 to the first supporting portion 113, the first supporting portion 113 being disposed at a central position of the first cavity 111, wherein the first supporting portion 113 and the first extension arm 114 form a first supporting structure; one end of the first extension arm 114 is connected to the first supporting portion 113, and the other end of the first extension arm 114 is connected to the first peripheral wall 112, so that the first cavity 111 is divided into a plurality of first sub-cavities 115 which are arranged at intervals along the circumferential direction of the first extension arm 114.
The second substrate 12 includes a second peripheral wall 122 surrounding a second cavity 121, a second supporting portion 123 disposed in the second cavity 121 and spaced from the second peripheral wall 122, and a second extension arm 124 extending from the second peripheral wall 122 to the second supporting portion 123, wherein the second supporting portion 123 is disposed at a central position of the second cavity 121, and the second supporting portion 123 and the second extension arm 124 form a second supporting structure; one end of the second extension arm 124 is connected to the second supporting portion 123, and the other end of the second extension arm 124 is connected to the second peripheral wall 122, so as to divide the second cavity 121 into a plurality of second sub-cavities 125 disposed at intervals along the circumferential direction of the second extension arm 124.
The first cavity 111 is communicated with the second cavity 121 to form a containing cavity 101, and the first peripheral wall 112 and the second peripheral wall 122 are enclosed to form an annular peripheral wall 102; the first supporting part 113 and the second supporting part 123 are overlapped to form a supporting part 103 of the substrate 10, the first extending arm 114 and the second extending arm 124 form an extending arm 104 of the substrate 10, and the supporting part 103 and the extending arm 104 form a supporting structure; the first subchamber 115 communicates with the second subchamber 125 to form the chamber 105. The extension arm 104 may be used to provide some support protection to the diaphragm structure 30 against breakage of the diaphragm structure 30 when the diaphragm structure 30 is subjected to a large deformation.
Specifically, the diaphragm structure 30 of the piezoelectric unit 1 is fixed to the substrate 10 by the anchor portion 303 and the plurality of anchor arms 304 formed by extending radially from the edge of the anchor portion 303, and by fixing the plurality of fixing portions 21 of the elastic structure 20 to the anchor arms 304, the elastic portion 22 surrounds the outer peripheral side of each of the movable portions 302, so that the diaphragm structure 30 is bound to the substrate 10 by the elastic structure 20, thereby greatly improving the reliability of the MEMS piezoelectric microphone.
While the invention has been described with respect to the above embodiments, it should be noted that modifications can be made by those skilled in the art without departing from the inventive concept, and these are all within the scope of the invention.
Claims (8)
1. A MEMS piezoelectric microphone comprising at least one piezoelectric unit, the piezoelectric unit comprising:
the base comprises an annular peripheral wall surrounding an accommodating cavity and a supporting structure arranged in the accommodating cavity, wherein the supporting structure comprises a supporting part and a plurality of extension arms, the supporting part is arranged at intervals with the peripheral wall, and the extension arms extend from the peripheral wall to the supporting part;
the diaphragm structure is an integrated structure and comprises a fixed area and a plurality of movable parts, wherein the fixed area comprises an anchoring part and a plurality of anchoring arms which are formed by extending radially from the edge of the anchoring part, the anchoring part is fixed on the supporting part, the anchoring arms are fixed on the extension arm, and each movable part surrounds the anchoring part and is arranged at intervals with the anchoring arms; the method is characterized in that:
the piezoelectric unit further comprises a plurality of elastic structures, each elastic structure comprises a fixed part and an elastic part fixed on the fixed part, the fixed part is fixed on the anchoring arm, and the elastic part surrounds the periphery side of each movable part;
the elastic part comprises a first elastic arm, a second elastic arm and a connecting arm which are oppositely arranged, wherein two ends of the first elastic arm are respectively and fixedly connected with the fixed part and the connecting arm, and the second elastic arm is fixedly connected with the connecting arm and is attached to the periphery side of the movable part;
one end of the extension arm is connected with the supporting part, the other end of the extension arm is connected with the peripheral wall and is used for dividing the accommodating cavity into a plurality of cavities which are arranged at intervals along the circumferential direction of the extension arm, one elastic structure and one movable part are suspended above each cavity, and the projection profile of each elastic structure and one movable part in the direction perpendicular to the membrane structure is positioned in the corresponding projection profile of the cavity in the direction perpendicular to the membrane structure.
2. The MEMS piezoelectric microphone of claim 1, wherein: each elastic structure is a spring structure.
3. The MEMS piezoelectric microphone of claim 2, wherein: the spring structure is one of a single-arm structure, a snake-shaped structure or an I-shaped structure.
4. The MEMS piezoelectric microphone of claim 1, wherein: each elastic structure and the anchoring arm are integrally formed.
5. The MEMS piezoelectric microphone of claim 1, wherein: the diaphragm structure comprises a first electrode layer, a first piezoelectric layer and a second electrode layer which are sequentially laminated along the vibration direction of the diaphragm structure, and the first electrode layer is arranged on one side, close to the supporting structure, of the diaphragm structure.
6. The MEMS piezoelectric microphone of claim 5, wherein: the diaphragm structure also comprises a second piezoelectric layer and a third electrode layer, wherein the second piezoelectric layer is overlapped on one side, far away from the first piezoelectric layer, of the second electrode layer, and the third electrode layer is overlapped on the second piezoelectric layer.
7. The MEMS piezoelectric microphone of claim 6, wherein: the elastic structure comprises a first elastic structure layer, a second elastic structure layer, a third elastic structure layer, a fourth elastic structure layer and a fifth elastic structure layer which are sequentially stacked along the vibration direction, wherein the first elastic structure layer, the second elastic structure layer, the third elastic structure layer, the fourth elastic structure layer and the fifth elastic structure layer respectively encircle the periphery of the first electrode layer, the first piezoelectric layer, the second electrode layer, the second piezoelectric layer and the third electrode layer.
8. The MEMS piezoelectric microphone of claim 7, wherein: the first elastic structure layer, the second elastic structure layer, the third elastic structure layer, the fourth elastic structure layer and the fifth elastic structure layer have the same structure.
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| CN202110332900.6A CN113115188B (en) | 2021-03-29 | 2021-03-29 | MEMS piezoelectric microphone |
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| CN202110332900.6A CN113115188B (en) | 2021-03-29 | 2021-03-29 | MEMS piezoelectric microphone |
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| CN113115188B true CN113115188B (en) | 2023-07-04 |
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| CN113905316B (en) * | 2021-09-28 | 2024-02-13 | 重庆黄葛树智能传感器研究院有限公司 | MEMS silicon microphone with small size, high sensitivity and high signal to noise ratio |
| CN114466282B (en) * | 2022-01-24 | 2022-11-25 | 武汉大学 | Acoustic transducer and acoustic device |
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| IT201600121533A1 (en) * | 2016-11-30 | 2018-05-30 | St Microelectronics Srl | MEMS INTEGRATED ELECTROACOUSTIC TRANSDUCER WITH IMPROVED SENSITIVITY AND RELATIVE PROCESS OF MANUFACTURING |
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| CN109803217B (en) * | 2018-12-31 | 2021-06-15 | 瑞声声学科技(深圳)有限公司 | Piezoelectric microphone |
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| CN110545511A (en) * | 2019-08-16 | 2019-12-06 | 瑞声声学科技(深圳)有限公司 | Piezoelectric MEMS microphone |
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