CN113113459A - OLED display device and OLED display device - Google Patents
OLED display device and OLED display device Download PDFInfo
- Publication number
- CN113113459A CN113113459A CN202110376418.2A CN202110376418A CN113113459A CN 113113459 A CN113113459 A CN 113113459A CN 202110376418 A CN202110376418 A CN 202110376418A CN 113113459 A CN113113459 A CN 113113459A
- Authority
- CN
- China
- Prior art keywords
- display device
- oled display
- layer
- substrate
- metal wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application provides an OLED display device and an OLED display device. The OLED display device comprises a substrate, an insulating layer, a metal wiring layer, an organic light emitting layer and an encapsulation structure which are sequentially arranged in a laminated manner; the packaging structure is arranged close to the edge of the substrate, the metal wiring layer comprises a first metal wiring layer, a through hole is formed in the insulating layer, a second metal wiring layer is formed on the substrate, the first metal wiring layer is connected with the second metal wiring layer through the through hole, and the second metal wiring layer extends to the outer side of the packaging structure. The second metal routing is equivalent to a leading-out wire of the metal routing layer, so that the metal routing layer is led out from the side edge of the packaging structure. The outgoing line can be further used for connecting an external IC driving board, and the arrangement position of the IC area can be flexibly selected by setting the outgoing line on the substrate, so that the IC area can be kept away from the front side of the OLED display device, and therefore, the size of the frame of the OLED display device can be reduced, and the narrow frame design of the OLED display device is realized.
Description
Technical Field
The application relates to the technical field of display, in particular to an OLED display device and an OLED display device.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
An OLED (Organic Light-Emitting Diode) display device has become a next generation display technology with great competitiveness and development prospect due to a series of advantages of full solid state structure, high brightness, full viewing angle, fast response speed, wide working stability range, capability of realizing flexible display, and the like. Organic light emitting materials and cathode materials used in OLED display devices are particularly sensitive to moisture and oxygen, and excessive moisture and oxygen content can affect the lifetime of the OLED display device. In order to effectively block water vapor and oxygen, it needs to be encapsulated. In addition, in order to control the functions of the OLED display device, the OLED display device needs to be connected to an external IC driving board, and accordingly, an IC area for binding the external IC driving board with an integrated circuit of the OLED display device is disposed at an edge of the OLED display device.
In the related art, the packaging structure of the OLED display device and the arrangement of the IC region both affect the display area of the OLED display device, so that the bezel of the OLED display device has a larger size.
Disclosure of Invention
The embodiment of the application provides an OLED display device and an OLED display device, and is beneficial to realizing the narrow frame of the OLED display device.
In order to solve the above technical problem, the embodiments of the present application provide the following technical solutions:
the embodiment of the first aspect of the application provides an OLED display device, which comprises a substrate, an insulating layer, a metal wiring layer, an organic light emitting layer and an encapsulation structure, wherein the substrate, the insulating layer, the metal wiring layer, the organic light emitting layer and the encapsulation structure are sequentially arranged in a laminated manner; the packaging structure is arranged close to the edge of the substrate, the metal wiring layer comprises first metal wiring, a through hole is formed in the insulating layer, second metal wiring is formed on the substrate, the first metal wiring is connected with the second metal wiring through the through hole, and the second metal wiring extends to the outer side of the packaging structure.
In some embodiments of the present application, the OLED display device further includes a spacer member disposed between the organic light emitting layer and the encapsulation structure, the spacer member being disposed near an edge of the organic light emitting layer.
In some embodiments of the present application, the OLED display device further includes an inorganic protective layer disposed between the metal wiring layer and the organic light emitting layer, and the isolation member is formed on the inorganic protective layer and protrudes from a surface of the inorganic protective layer.
In some embodiments of the present application, the cross-section of the isolation member is in the shape of an inverted "male" shape.
In some embodiments of the present application, the OLED display device further includes a third metal trace formed on the substrate, one end of the third metal trace is located on one surface of the substrate close to the package structure and connected to the second metal trace, the other end of the third metal trace extends to one surface of the substrate away from the package structure, and the other end of the third metal trace is used for connecting an external IC driving board.
In some embodiments of the present application, the edge of the substrate has a chamfered structure.
In some embodiments of the present application, the OLED display device further includes a protective adhesive disposed on an edge of the substrate, and the protective adhesive covers at least a portion of the third metal trace.
In some embodiments of the present application, the encapsulation structure includes a first inorganic layer, an organic layer, and a second inorganic layer sequentially stacked.
In some embodiments of the present application, the OLED display device further includes a protective film formed on the encapsulation structure.
Embodiments of the second aspect of the present application propose an OLED display device including the OLED display device in any one of the above embodiments.
According to OLED display device and OLED display device of this application embodiment, to OLED display device, its metal routing layer includes that first metal walks the line, and simultaneously, is formed with the second metal on the base plate and walks the line to, first metal is walked the line and is connected with the second metal through the via hole on the insulating layer, and the second metal is walked the line and is extended to packaging structure's the outside. Therefore, the second metal routing is equivalent to a leading-out wire of the metal routing layer, and the metal routing layer is led out from the side edge of the packaging structure. The outgoing line (namely the second metal routing) can be further used for connecting an external IC drive board, and the setting position of an IC area (an area for realizing the binding of the external IC drive board and an integrated circuit of the OLED display device) can be flexibly selected by setting a routing path of the outgoing line on the substrate, so that the IC area can be kept away from the front side of the OLED display device, and therefore, the size of a frame of the OLED display device can be reduced, and the narrow-frame design of the OLED display device is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings used in the description of the embodiments of the present application or the related art are briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic structural diagram of an OLED display device according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of an OLED display device according to another embodiment of the present application;
fig. 3 is a schematic view (in a top view) of the distribution of the isolation member on the OLED display device according to the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1, an embodiment of a first aspect of the present application proposes an OLED display device 10. The OLED display device 10 includes a substrate 100, an insulating layer 200, a metal routing layer 300, an organic light emitting layer 400, and an encapsulation structure 500, which are sequentially stacked. The package structure 500 is disposed near the edge of the substrate 100, the metal routing layer 300 can be used as a signal line and a power line, the metal routing layer 300 includes a first metal routing 310, a via hole is disposed on the insulating layer 200, a second metal routing 110 is formed on the substrate 100, the first metal routing 310 is connected to the second metal routing 110 through the via hole, and the second metal routing 110 extends to the outside of the package structure 500. Here, the outer side of the encapsulation structure 500 refers to a side of the encapsulation structure 500 away from the display area of the OLED display device 10.
According to the OLED display device 10 of the embodiment of the application, the metal routing layer 300 includes the first metal routing 310, meanwhile, the second metal routing 110 is formed on the substrate 100, the first metal routing 310 is connected to the second metal routing 110 through the via hole on the insulating layer 200, and the second metal routing 110 extends to the outer side of the package structure 500. Therefore, the second metal trace 110 is equivalent to a lead-out line of the metal wiring layer 300, and the metal wiring layer 300 is led out from a side of the package structure 500. The outgoing line (i.e., the second metal routing line 110) may be further used to connect the external IC driving board 20, and a routing path of the outgoing line on the substrate 100 is set, so that a setting position of an IC area (an area for binding the external IC driving board 20 and an integrated circuit of the OLED display device 10) may be flexibly selected, and thus the IC area may be set on the front side of the OLED display device 10, and thus, a size of a frame of the OLED display device 10 may be reduced, so as to implement a narrow frame design of the OLED display device 10.
In some embodiments of the present application, as shown in fig. 1 and 3, the OLED display device 10 further includes a separation member 600 disposed between the organic light emitting layer 400 and the encapsulation structure 500, the separation member 600 being disposed near an edge of the organic light emitting layer 400. In general, the organic light emitting layer 400 is formed by evaporation, and the isolation member 600 is disposed such that the organic light emitting layer 400 formed by evaporation is broken at an edge position, and at this time, an inner side of the isolation member 600 (a side of the isolation member 600 close to the display area of the OLED display device 10) defines a boundary of an effective area of the organic light emitting layer 400. In the prior art, in order to prevent oxygen and water vapor from adversely affecting the organic light emitting layer 400, an unstable region is usually reserved at an edge position of the organic light emitting layer 400, and a portion of the organic light emitting layer 400 located in the unstable region is an effective region, so as to ensure that oxygen and water vapor do not intrude into the effective region of the organic light emitting layer 400, however, in this way, a certain requirement is imposed on a distance between a boundary of the effective region of the organic light emitting layer 400 and the edge position of the encapsulation structure 500, and thus, a width of the encapsulation structure 500 is large, and further, a frame size of the OLED display device 10 is increased. What is different from the prior art is that, in the embodiment of the present application, the isolation member 600 is disposed near the edge of the organic light emitting layer 400, and the isolation member 600 has an effect of blocking intrusion of oxygen and water vapor, so that the inner side of the isolation member 600 defines the effective area of the organic light emitting layer 400, and due to the blocking effect of the isolation member 600, intrusion of oxygen and water vapor into the effective area of the organic light emitting layer 400 can be prevented. Therefore, due to the arrangement of the isolation member 600, the organic light emitting layer 400 does not need to reserve an unstable region at the edge position, so that the requirement on the width of the encapsulation structure 500 can be reduced, thereby further facilitating the reduction of the frame size of the OLED display device 10. Through experimental verification, by providing the isolation member 600, the width of the package structure 500 can be smaller than 0.2mm, which can further improve the effect of narrowing the frame of the OLED display device 10.
In some embodiments of the present application, the organic light emitting layer 400 may be a light emitting and cathode common layer, that is, a layer structure in which a cathode is formed and an organic light emitting material is formed, thereby forming a light emitting or cathode common layer. In other embodiments, the organic light emitting layer 400 and the cathode are separately disposed so as to be in different layer structures.
In some embodiments of the present application, the OLED display device 10 further includes an inorganic protective layer 700 disposed between the metal wiring layer 300 and the organic light emitting layer 400, and the isolation member 600 is formed on the inorganic protective layer 700 and protrudes from a surface of the inorganic protective layer 700. Based on the present embodiment, the organic light emitting layer 400 may be formed on the inorganic protective layer 700 by a process of evaporation, and meanwhile, the isolation member 600 protrudes from the surface of the inorganic protective layer 700, so that the organic light emitting layer 400 formed by evaporation is broken at the isolation member 600, wherein the portion of the organic light emitting layer 400 located inside the isolation member 600 is the effective area of the organic light emitting layer 400.
Further, the cross-section of the isolation member 600 is in an inverted "convex" shape. On the one hand, the isolation member 600 may protrude from the surface of the inorganic protection layer 700 to facilitate the disconnection of the organic light emitting layer 400 formed by evaporation. On the other hand, the cross-section is the structure of "protruding" font of invertedly, owing to have more corner position, can block steam and oxygen better to improve the anti-intrusion effect to steam and oxygen.
In some embodiments of the present application, as shown in fig. 2, the OLED display device 10 further includes a third metal trace 120 formed on the substrate 100, one end of the third metal trace 120 is located on one side of the substrate 100 close to the package structure 500 and connected to the second metal trace 110, the other end of the third metal trace 120 extends to one side of the substrate 100 away from the package structure 500, and the other end of the third metal trace 120 is used for connecting to the external IC driving board 20. In this embodiment, the third metal trace 120 extends from the side of the substrate 100 close to the package structure 500 to the side away from the package structure 500, and the third metal trace 120 is connected to the second metal trace 110, so that the IC area can be transferred to the back side of the OLED display device 10. In this way, the display area of the OLED display device 10 is prevented from being affected by the arrangement of the IC region, and the effect of narrowing the frame of the OLED display device 10 is further improved. For the OLED display device 10 according to the embodiment of the application, the frame structure includes two portions, namely, a package frame and a routing frame, where the package frame is the package structure 500, and the routing frame is the portion of the substrate 100 located outside the package structure 500. That is, the sum of the width of the encapsulation structure 500 and the width of the portion of the substrate 100 located outside the encapsulation structure 500 determines the size of the bezel structure of the OLED display device 10. Through experimental verification, in the embodiment of the present application, the third metal routing wire 120 is arranged, so that the routing frame can be controlled within 0.2mm in a manner of transferring the IC region to the back of the OLED display device 10.
Further, different sections of the third metal trace 120 can be formed by different processing manners. For example, the portion of the third metal trace 120 located at the side of the substrate 100 may be formed by performing a patterning process using a laser, using side printing or a side partial metallization. For another example, the portion of the third metal trace 120 on the front and/or back of the substrate 100 may be formed by a conventional low-temperature metal pattern.
The pattern may be formed by printing on the substrate 100, or by processing the substrate 100 to form a metal plating film, and then patterning the metal plating film with a laser beam. Thus, the line width and the line distance of the third metal trace 120
Further, the edge of the substrate 100 may have a chamfering structure 101, and the chamfering structure 101 is disposed to facilitate forming protection for the third metal trace 120, that is, the risk of breaking the third metal trace 120 at the corner position of the edge of the substrate 100 may be reduced.
In some embodiments of the present application, the OLED display device 10 further includes a protective adhesive 800 disposed at an edge of the substrate 100, and the protective adhesive 800 covers at least a part of the third metal trace 120. In this embodiment, the protective adhesive 800 covering at least a portion of the third metal trace 120 is disposed at the edge of the substrate 100, so as to protect the third metal trace 120, thereby reducing the risk of breaking or breaking the third metal trace 120.
In some embodiments of the present application, the encapsulation structure 500 includes a first inorganic layer 510, an organic layer 520, and a second inorganic layer 530 stacked in sequence, and the encapsulation structure 500 has good sealing performance and can better isolate oxygen and moisture.
In some embodiments of the present application, the OLED display device 10 further includes a protective film 900 formed on the encapsulation structure 500. The protective film 900 may further protect the package structure 500, so as to reduce the risk of abrasion or damage of the package structure 500.
Embodiments of the second aspect of the present application provide an OLED display device, which is characterized by including the OLED display device 10 in any one of the above embodiments.
According to the OLED display device of the embodiment of the application, the metal routing layer 300 of the OLED display device 10 includes the first metal routing 310, and the second metal routing 110 is formed on the substrate 100, and the first metal routing 310 is connected to the second metal routing 110 through the via hole on the insulating layer 200, and the second metal routing 110 extends to the outside of the package structure 500. Therefore, the second metal trace 110 is equivalent to a lead-out line of the metal wiring layer 300, and the metal wiring layer 300 is led out from a side of the package structure 500. The outgoing line (i.e., the second metal routing line 110) may be further used to connect the external IC driving board 20, and a routing path of the outgoing line on the substrate 100 is set, so that a setting position of an IC area (an area for binding the external IC driving board 20 and an integrated circuit of the OLED display device 10) may be flexibly selected, and thus the IC area may be set on the front side of the OLED display device 10, and thus, a size of a frame of the OLED display device 10 may be reduced, so as to implement a narrow frame design of the OLED display device 10.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments.
The above description is only for the preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the protection scope of the present application.
Claims (10)
1. The OLED display device is characterized by comprising a substrate, an insulating layer, a metal wiring layer, an organic light emitting layer and an encapsulation structure which are sequentially arranged in a laminated manner; the packaging structure is arranged close to the edge of the substrate, the metal wiring layer comprises first metal wiring, a through hole is formed in the insulating layer, second metal wiring is formed on the substrate, the first metal wiring is connected with the second metal wiring through the through hole, and the second metal wiring extends to the outer side of the packaging structure.
2. The OLED display device of claim 1, further comprising a spacer member disposed between the organic light emitting layer and the encapsulation structure, the spacer member being disposed proximate an edge of the organic light emitting layer.
3. The OLED display device according to claim 2, further comprising an inorganic protective layer disposed between the metal wiring layer and the organic light emitting layer, wherein the isolation member is formed on the inorganic protective layer and protrudes from a surface of the inorganic protective layer.
4. The OLED display device of claim 3, wherein the cross-section of the isolation member is in an inverted "convex" shape.
5. The OLED display device according to claim 1, further comprising a third metal trace formed on the substrate, wherein one end of the third metal trace is located on a surface of the substrate close to the package structure and connected to the second metal trace, the other end of the third metal trace extends to a surface of the substrate away from the package structure, and the other end of the third metal trace is used for connecting an external IC driver board.
6. The OLED display device of claim 5, wherein the edge of the substrate has a chamfered structure.
7. The OLED display device according to claim 5, further comprising a protective adhesive disposed on an edge of the substrate, wherein the protective adhesive covers at least a portion of the third metal trace.
8. The OLED display device according to any one of claims 1 to 7, wherein the encapsulation structure comprises a first inorganic layer, an organic layer, and a second inorganic layer sequentially stacked.
9. The OLED display device according to any one of claims 1 to 7, further comprising a protective film formed on the encapsulation structure.
10. An OLED display device comprising the OLED display device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110376418.2A CN113113459B (en) | 2021-04-06 | 2021-04-06 | OLED display device and OLED display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110376418.2A CN113113459B (en) | 2021-04-06 | 2021-04-06 | OLED display device and OLED display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113113459A true CN113113459A (en) | 2021-07-13 |
| CN113113459B CN113113459B (en) | 2022-12-06 |
Family
ID=76714617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110376418.2A Active CN113113459B (en) | 2021-04-06 | 2021-04-06 | OLED display device and OLED display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113113459B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106293258A (en) * | 2016-10-11 | 2017-01-04 | 上海天马微电子有限公司 | A kind of organic electroluminescence display panel |
| CN106876431A (en) * | 2017-02-23 | 2017-06-20 | 武汉华星光电技术有限公司 | Organic light emission touching display screen |
| CN107275379A (en) * | 2017-07-28 | 2017-10-20 | 武汉华星光电半导体显示技术有限公司 | Touch oled display panel and display device |
| CN109148541A (en) * | 2018-08-30 | 2019-01-04 | 上海天马微电子有限公司 | Display panel and preparation method thereof and display device |
| CN110335875A (en) * | 2019-07-02 | 2019-10-15 | 武汉华星光电技术有限公司 | Display panel and preparation method thereof |
| CN110955090A (en) * | 2019-12-20 | 2020-04-03 | 京东方科技集团股份有限公司 | Display panel, manufacturing method of display panel and display device |
| CN112181204A (en) * | 2020-09-29 | 2021-01-05 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
-
2021
- 2021-04-06 CN CN202110376418.2A patent/CN113113459B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106293258A (en) * | 2016-10-11 | 2017-01-04 | 上海天马微电子有限公司 | A kind of organic electroluminescence display panel |
| CN106876431A (en) * | 2017-02-23 | 2017-06-20 | 武汉华星光电技术有限公司 | Organic light emission touching display screen |
| CN107275379A (en) * | 2017-07-28 | 2017-10-20 | 武汉华星光电半导体显示技术有限公司 | Touch oled display panel and display device |
| CN109148541A (en) * | 2018-08-30 | 2019-01-04 | 上海天马微电子有限公司 | Display panel and preparation method thereof and display device |
| CN110335875A (en) * | 2019-07-02 | 2019-10-15 | 武汉华星光电技术有限公司 | Display panel and preparation method thereof |
| CN110955090A (en) * | 2019-12-20 | 2020-04-03 | 京东方科技集团股份有限公司 | Display panel, manufacturing method of display panel and display device |
| CN112181204A (en) * | 2020-09-29 | 2021-01-05 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113113459B (en) | 2022-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111710712B (en) | Display panel | |
| KR101781506B1 (en) | Array substrate for organic electro luminescent device | |
| US20240049531A1 (en) | Display panel and display device | |
| CN108428728A (en) | Array substrate and production method, display panel and production method, display device | |
| CN111146211A (en) | Substrate to be cut, display panel and micro display chip | |
| CN103677406B (en) | Touch panel and touch display panel | |
| CN112242431B (en) | Touch display panel, preparation method thereof and display device | |
| KR20190044016A (en) | Display device and method of manufacturing of the same | |
| CN113299862A (en) | Display panel, preparation method thereof and display device | |
| CN114267686B (en) | Display panel and display device | |
| US8044578B2 (en) | Organic electroluminescence display device and method of fabricating the same | |
| US20190148667A1 (en) | Foldable display device and method of manufacturing the same | |
| CN113113459B (en) | OLED display device and OLED display device | |
| CN108550603A (en) | Flexible display panels, display device and preparation method thereof | |
| CN218101269U (en) | Display panel and display device | |
| CN216749900U (en) | Display substrate and display device | |
| CN114114762A (en) | Display substrate, manufacturing method thereof and display device | |
| CN113161371A (en) | Display panel | |
| KR101116824B1 (en) | Organic electroluminescent device for preventing peeling of an insulating film | |
| KR100635497B1 (en) | OLED and fabricating method of the same | |
| US20240081111A1 (en) | Display substrate and display device | |
| CN115050793B (en) | Display panel | |
| KR100702510B1 (en) | Organic electroluminescent device | |
| US20240023385A1 (en) | Electroluminescence Display | |
| KR102460541B1 (en) | Organic light emitting display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |