CN113113398A

CN113113398A - Electric control board

Info

Publication number: CN113113398A
Application number: CN202110413057.4A
Authority: CN
Inventors: 王敏; 左安超; 谢荣才
Original assignee: Guangdong Huixin Semiconductor Co Ltd
Current assignee: Guangdong Huixin Semiconductor Co Ltd
Priority date: 2021-04-16
Filing date: 2021-04-16
Publication date: 2021-07-13

Abstract

The invention relates to an electric control board which comprises a first electric control board, a second electric control board and an MIPS, wherein the MIPS is installed between the first electric control board and the second electric control board which are stacked up and down, pins of the MIPS are connected with the first electric control board and the second electric control board in a distributed mode, the working voltage of the first electric control board is weak voltage, and the working voltage of the second electric control board is strong voltage. Therefore, the isolation of the strong current circuit and the weak current circuit is realized, the interference of the strong current circuit to the weak current circuit, particularly the interference to an input control signal is reduced as much as possible, and the input control signal is electrically connected with the MCU, so that the interference to a control signal output by the MCU can be effectively reduced, and the reliability of the whole electric control board is effectively improved.

Description

Electric control board

Technical Field

The invention relates to an electric control board, and belongs to the technical field of application of modular intelligent power systems.

Background

A Modular Intelligent Power System (MIPS) is a Power-driven product combining Power electronics and integrated circuit technology. The pins of the MIPS include a strong current pin including a pin for outputting a load, a pin for strong current supply, and the like, and a weak current pin including a pin for inputting a control signal, and the like, the MIPS is generally mounted on a single electronic control board when applied, the electric control board comprises a strong current circuit and a weak current circuit, the strong current circuit is generally provided with discrete elements such as a large electrolytic capacitor for filtering, an inductor of a PFC circuit, a bridge stack of a rectification circuit and the like, the weak current circuit comprises an MCU and electronic elements around the MCU, the strong circuit is easy to generate interference to the weak current circuit in the working process, the control signal which is interfered by the MCU to be output to the MIPS, so that the control of the MIPS is disordered to influence the reliability of the MIPS, and strong electricity and weak current all set up an automatically controlled board, need consider strong and weak electric isolation for the area occupied of automatically controlled board is great, is not convenient for the miniaturization of whole automatically controlled board.

Disclosure of Invention

The invention aims to solve the technical problems that the working reliability of the MIPS is influenced by strong current interference and weak current caused by sampling a single electric control board by the existing MIPS application circuit and the electric control board occupies a large area.

Specifically, the present invention discloses an electric control board, comprising: the system comprises a first electric control board, a second electric control board and an MIPS; first automatically controlled board and the upper and lower range upon range of setting of second automatically controlled board, MIPS installs between first automatically controlled board and the automatically controlled board of second, and MIPS's pin divide into about two sets of buckling, connects first automatically controlled board and the automatically controlled board of second respectively, and wherein the operating voltage of first automatically controlled board is weak voltage, and the operating voltage of the automatically controlled board of second is strong voltage.

Optionally, a support is installed on a surface, opposite to the MIPS, of the first electronic control board, a support wall is arranged on the periphery of the support, the support wall is abutted to the heat sink, and the MIPS is contained in an installation space surrounded by the support wall.

Optionally, the first electronic control board is provided with a first electronic component, and the first electronic component includes an MCU and a passive electronic component.

Optionally, the first electronic element is a chip package, and the first electronic element is mounted on a side of the first electronic control board, which is far away from the MIPS.

Optionally, a radiator is further installed between the second electronic control board and the MIPS, and the radiator is installed in fit with the heating surface of the MIPS.

Optionally, the heat sink includes a base and heat dissipation fins, and the heat dissipation fins are mounted on a side of the second electronic control board far away from the MIPS.

Optionally, the two opposite side walls of the base are respectively provided with a mounting groove, the two opposite sides of the second electric control plate are respectively provided with a mounting arm matched with the mounting groove, and the base is fixed on the second electric control plate through the matching of the mounting groove and the mounting arm.

Optionally, the second electronic control board is provided with a second electronic element, and the second electronic element is mounted on a side of the second electronic control board far away from the MIPS.

Optionally, the electronic control board further comprises a fixing member, the base and the mounting arm are respectively provided with a first mounting hole and a second mounting hole, and the fixing member penetrates through the first mounting hole and the second mounting hole to fix the base and the mounting arm.

Optionally, the pin group of the MIPS connected to the first electronic control board includes a pin for inputting a control signal, a power pin of a driver chip inside the MIPS, and a fault feedback pin of the driver chip; the pin group of the MIPS connected with the second electric control board comprises a pin of an output control load of the MIPS, a strong power supply pin and a lower bridge arm emitter output pin of the MIPS.

The electric control board comprises a first electric control board, a second electric control board and an MIPS, wherein the MIPS is installed between the first electric control board and the second electric control board which are stacked up and down, pins of the MIPS are connected with the first electric control board and the second electric control board in a distributed mode, the working voltage of the first electric control board is weak voltage, and the working voltage of the second electric control board is strong voltage. Therefore, the isolation of the strong current circuit and the weak current circuit is realized, the interference of the strong current circuit to the weak current circuit, particularly the interference to an input control signal is reduced as much as possible, and the input control signal is electrically connected with the MCU, so that the interference to a control signal output by the MCU can be effectively reduced, and the reliability of the whole electric control board is effectively improved.

Drawings

Fig. 1 is a schematic structural diagram of a MIPS for an electric control board according to an embodiment of the present invention;

fig. 2 is a schematic structural view of fixing a PCB and a bracket of a first electronic control board according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a second electric control board according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of an electronic control board according to an embodiment of the present invention, wherein a first electronic control board has an electronic component mounted face upward;

fig. 5 is a schematic structural view of an electronic control board according to an embodiment of the present invention, wherein a second electronic control board has an electronic component mounted face upward;

FIG. 6 is a schematic view of another orientation of the electrical control panel of FIG. 5;

FIG. 7 is a right side view of the electrical control panel of FIG. 5;

fig. 8 is a front view of the electronic control board of fig. 5.

Reference numerals:

the electronic device comprises a second electronic control board 1, a second electronic component 11, a mounting arm 12, a heat sink 2, a base 21, a first mounting hole 211, a heat dissipation fin 22, a bracket 3, a fixing hole 31, a supporting wall 32, a first electronic control board 4, a first electronic component 41, an MCU411, MIPS5, a second pin group 51, a first pin group 52 and a packaging body 53.

Detailed Description

It is to be noted that the embodiments and features of the embodiments may be combined with each other without conflict in structure or function. The present invention will be described in detail below with reference to examples.

The invention provides an electric control board, as shown in fig. 1 to 8, comprising a first electric control board 4, a second electric control board 1 and a MIPS5, wherein the first electric control board 4 and the second electric control board 1 are stacked up and down, a MIPS5 is installed between the first electric control board 4 and the second electric control board 1, pins of the MIPS5 are divided into two groups which are bent up and down and are respectively connected with the first electric control board 4 and the second electric control board 1, wherein the working voltage of the first electric control board 4 is weak voltage, and the working voltage of the second electric control board 1 is strong voltage. Specifically, as shown in fig. 1 and 4, MIPS5 divides the pins into two groups, namely a first pin group 52 and a second pin group 51, where the first pin group 52 and the second pin group 51 have different functions and different voltages of signals transmitted by the pins, specifically, the first pin group 52 is a weak voltage, and the second pin group 51 is a strong voltage. The term "high voltage" as used herein generally means that the voltage is 180V or more in terms of alternating current or direct current, and "low voltage" means that the voltage is 36V or less in terms of alternating current or direct current. According to the prior art, the pins of the MIPS5 are divided into a pin for inputting a control signal, a power supply pin of a driving chip inside the MIPS and a fault feedback pin of the driving chip according to functions, a pin for outputting a control load of the MIPS, a strong power supply pin, a lower bridge arm emitter output pin of the MIPS, and the like. The pin of the input control signal, the power supply pin of the driving chip in the MIPS and the fault feedback pin of the driving chip transmit weak current signals, and the pin of the output control load of the MIPS, the strong current power supply pin and the lower bridge arm emitter output pin of the MIPS transmit strong current signals. The first pin group 52 and the second pin group 51 are bent up and down to be respectively and electrically connected with the first electric control board 4 and the second electric control board 1 which are arranged in an up-down stacked mode, so that a circuit connected with the MIPS5 is respectively arranged on different electric control boards according to strong current and weak current, and accordingly isolation of the strong current and the weak current is achieved, interference of the strong current on the weak current is reduced as much as possible, particularly interference on an input control signal is reduced, the input control signal is electrically connected with the MCU411, interference on a control signal output by the MCU411 can be effectively reduced, and reliability of the whole electric control board is effectively improved. And through the upper and lower range upon range of setting that falls into two with automatically controlled board, can set up the area occupied at a monoblock automatically controlled board among the effectual reduction prior art to can effectually reduce the volume occupied of whole automatically controlled board, be favorable to the miniaturization of automatically controlled board.

In some embodiments of the present invention, as shown in fig. 2 to 8, a bracket 3 is mounted on a side of the first electronic control board 4 opposite to the MIPS5, a supporting wall 32 is disposed on a periphery of the bracket 3, the supporting wall 32 abuts against the heat sink 2, and the MIPS5 is accommodated in an installation space surrounded by the supporting wall 32. Wherein support walls 32 are disposed on the sides of bracket 3 and are left empty on the side where MIPS5 are mounted to facilitate pin mounting. The height of support walls 32 may be slightly greater than the thickness of package 53 of MIPS5 to accommodate the entire package 53 within the space enclosed by support walls 32. The support 3 may be made of an insulating plastic material. Fixing holes 31 may be further formed in the bottom surface of the bracket 3 to facilitate fixing the bracket 3 to the first electronic control board 4 by fixing members such as screws. Through setting up support 3 for when installing MIPS5 between first automatically controlled board 4 and the second automatically controlled board 1, make MIPS5 protected in the support wall 32 of support 3 avoid the foreign object collision damage, owing to there is the protection of support wall 32 of support 3 in addition, extrusion when also avoiding installing first automatically controlled board 4 and the second automatically controlled board 1 causes the damage to MIPS5, thereby effectual protection MIPS 5.

In some embodiments of the invention, as shown in fig. 3 to 8, the first electronic control board 4 is provided with a first electronic component 41, the first electronic component 41 comprising the MCU411 and passive electronic components. Since the first electronic control board 4 is provided with a weak current circuit, the first electronic components 41 mounted on the first electronic control board 4 are weak current electronic components, such as the MCU411, the IC, and other passive components, such as the resistor and the capacitor. These electronic components are preferably disposed on the side of the first electronic control board 4 away from the MIPS5, i.e. on the upper surface of the first electronic control board 4 as shown in fig. 4, so as to be further away from the second electronic control board 1 with strong electric operation, and reduce the influence of interference. Since the first electronic component 41 operates at a weak voltage and its power consumption is very low, it can be packaged by a patch, which further reduces its occupied volume, thereby reducing the volume of the first electronic control board 4, including the occupied area and the upper and lower thickness. The miniaturization of the whole electric control board is facilitated.

In some embodiments of the present invention, as shown in fig. 3 to 8, a heat sink 2 is further installed between the second electronic control board 1 and the MIPS5, and the heat sink 2 is installed in fit with the heat-generating surface of the MIPS 5. One surface of the package 53 of the MIPS5 is a heating surface formed by an exposed metal substrate to transmit heat of a high-power device packaged inside the package, and the power device includes 6 switching transistors constituting upper and lower arms of an inverter, such as an IGBT (Insulated Gate Bipolar Transistor) or a MOS (metal oxide semiconductor) Transistor, a freewheeling diode, a bridge rectifier, and the like. Since these power devices have large overcurrent of 10A or more, they generate large amount of heat, and in order to dissipate the heat, a heat sink 2 made of aluminum or copper is generally mounted on the heat generating surface of MIPS 5. The heat sink 2 comprises a base 21 and heat dissipation fins 22 connected with the base 21, wherein the surface of the base 21 is tightly attached to a heat generating surface, and a heat conduction material such as silicone grease can be further coated between the base 21 and the heat generating surface to enhance the heat transfer of the base and the heat generating surface. Heat dissipation fins 22 are mounted on the side of the second electronic control board 1 away from the MIPS5, as shown in fig. 4, the side of the second electronic control board 1 facing downwards. The heat generated by the power device is finally transferred to the air through the heat dissipation fins 22 to realize heat dissipation. The MIPS5 and the heat sink 2 can be generally mounted by forming a threaded hole in the base 21, fixing grooves are generally formed in two sides of the MIPS5 package body 53, and the MIPS5 and the heat sink 2 are fixed by embedding fixing members such as screws into the fixing grooves and screwing the fixing members into the threaded hole.

Further, as shown in fig. 3 to 8, two opposite side walls of the base 21 are respectively provided with a mounting groove (not shown), two opposite sides of the second electronic control board 1 are respectively provided with a mounting arm 12 matched with the mounting groove, and the base 21 is fixed to the second electronic control board 1 through the matching of the mounting groove and the mounting arm 12. As shown in fig. 3, two mounting arms 12 extend from the left and right sides of the second electronic control board 1 along the side edge, the length of the mounting arms 12 is the same as the length of the heat sink 2 in the front-back direction in fig. 4, and the mounting arms 12 are preferably integrally formed with the PCB (printed circuit board) of the second electronic control board 1 for convenient processing. Mounting grooves are formed in the left side wall surface and the right side wall surface of the base 21 of the radiator 2, the depth of each mounting groove is consistent with the width of the corresponding mounting arm 12, the height of the mounting groove in the up-down direction is consistent with the thickness of the corresponding mounting arm 12, the mounting arms 12 can be conveniently mounted in the mounting grooves in a penetrating mode to achieve matching of the mounting grooves and the mounting arms, and therefore the radiator 2 can be rapidly mounted on the second electric control board 1. Furthermore, as shown in fig. 5, a fixing member (not shown) may be further provided, and the base 21 and the mounting arm 12 may be further provided with a first mounting hole 211 and a second mounting hole (not shown), respectively, through which the fixing member passes to fix the base 21 and the mounting arm 12, thereby reliably fixing the heat sink 2 to the second electrical control board 1 by the fixing member such as a tapping screw or a bolt.

In some embodiments of the present invention, as shown in fig. 3 to 8, the second electronic control board 1 is provided with a second electronic component 11, and the second electronic component 11 is mounted on a side of the second electronic control board 1 away from the MIPS 5. The second electronic control board 1 works in a strong current, and since the transmission current of the second pin group 51 connected to the MIPS5 is large, and the power of the second electronic component installed therein is relatively large, the volume thereof is also larger than that of the first electronic component 41, and the second electronic component is generally packaged as a plug, and the corresponding circuit thereof is generally a power circuit for providing a high-voltage working power supply (such as 300V dc voltage) for the MIPS5, and an electronic component of a PFC circuit, such as a bridge rectifier, an electrolytic capacitor for filtering, a switching tube of the PFC, such as an IGBT, an inductor, a freewheeling diode, and the like. These electronic components are much larger in volume than the first electronic component 41 of the chip package and are mounted to a thickness that does not generally exceed the thickness of the heat sink fins 22. By mounting the second electronic component 11 on the side of the second electronic control board 1 away from the MIPS5, that is, the lower surface of the second electronic control board 1 in fig. 4, the second electronic component 11 is made to be the principle of the first electronic component 41 as much as possible, so that the interference between the first electronic component and the second electronic component is further reduced.

According to the electric control board provided by the embodiment, the installation steps are as follows:

first, referring to a MIPS5 manufacturing method in the prior art, the MIPS5 can be manufactured, and after the MIPS5 is not described herein again, the pins of the MIPS5 can be further shaped, and the pins are bent and shaped up and down according to the first pin group 52 and the second pin group 51 mentioned in the above embodiments, so as to facilitate the pin installation in the following steps.

In the second step, the second electronic component 11 packaged by the plug-in is mounted on the PCB of the second electronic control board 1 to form a mounting board of the second electronic control board 1.

And thirdly, extending the mounting arm 12 of the PCB of the second electronic control board 1 into the mounting groove of the radiator 2, and fixing the two by a fixing piece to form a second electronic control board assembly.

Fourthly, the second pin group 51 of the MIPS5 is installed in the PCB of the second electronic control board 1, the MIPS5 and the heat sink 2 are fixed by fixing members such as screws, so that the invention surface and the surface of the mounting seat are tightly attached, and heat conductive silicone grease can be coated between the two to enhance the heat transfer between the two. The heat radiator 2, the MIPS5 and the second electronic control board 1 can be fixed by a special carrier, and then the second pin group 51 of the MIPS5 and the second electronic component 11 are soldered on the PCB of the second electronic control board 1 by soldering such as wave soldering, so that the MIPS5, the heat radiator 2 and the electronic component are fixed with the PCB of the second electronic control board 1. Wherein, the special carrier has high temperature resistance of 100 ℃ and 300 ℃ and good heat insulation, and the adopted material can not react with tin.

Fifth, the first electronic component 41 is fixed to the PCB of the first electronic control board 4 by soldering, such as reflow soldering, and the bracket 3 is mounted on the lower surface of the PCB of the first electronic control board 4 shown in fig. 4.

Sixthly, the MIPS5 of the assembly of the second electronic control board 1 formed in the fourth step is mounted in the cradle 3, and the first pin group 52 of the MIPS5 is mounted on the PCB of the first electronic control board 4, and the first electronic control board 4 and the second electronic control board 1 are fixed by fixing members such as screws, thereby fixing the MIPS5 in the cradle 3. Since the height of the supporting wall 32 of the bracket 3 is higher than the thickness of the package 53 of the MIPS5, when the first electronic control board 4 and the second electronic control board 1 are fixed, as shown in fig. 4, the supporting wall 32 abuts against the lower surface of the first electronic control board 4 and the surface of the base 21 of the heat sink 2, and the MIPS5 is not squeezed, so that the MIPS5 is protected and the first electronic control board 4 and the second electronic control board 1 are reliably fixed.

And seventhly, fixing the first pin group 52 which is arranged on the first electric control board 4 in the sixth step on the PCB board of the first electric control board 4 by welding such as wave soldering through a special carrier, thereby completing the installation of the whole electric control board. Wherein the special carrier has high temperature resistance of 100 ℃ and 300 ℃ and good heat insulation, and the adopted material can not react with tin.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims

1. An electronic control board, comprising: the system comprises a first electric control board, a second electric control board and an MIPS; the first electric control board and the second electric control board are stacked up and down, the MIPS is installed between the first electric control board and the second electric control board, pins of the MIPS are divided into two groups which are bent up and down and are connected with the first electric control board and the second electric control board respectively, the working voltage of the first electric control board is weak voltage, and the working voltage of the second electric control board is strong voltage.

2. The electric control board according to claim 1, wherein a bracket is mounted on a side of the first electric control board opposite to the MIPS, a support wall is disposed on a periphery of the bracket, the support wall abuts against the heat sink, and the MIPS is accommodated in an installation space surrounded by the support wall.

3. The electronic control board according to claim 1, characterized in that the first electronic control board is provided with first electronic components comprising an MCU and passive electronic components.

4. The electric control board according to claim 3, wherein the first electronic component is a chip package, and the first electronic component is mounted on a side of the first electric control board away from the MIPS.

5. The electronic control board of claim 1, wherein a heat sink is further mounted between the second electronic control board and the MIPS, and the heat sink is mounted in fit with a heat-generating surface of the MIPS.

6. The electrical control board of claim 5, wherein the heat sink comprises a base and heat fins mounted on a side of the second electrical control board away from the MIPS.

7. The electric control board according to claim 5, wherein two opposite side walls of the base are respectively provided with a mounting groove, two opposite sides of the second electric control board are respectively provided with a mounting arm matched with the mounting groove, and the base is fixed on the second electric control board through the matching of the mounting groove and the mounting arm.

8. The electronic control board according to claim 6, wherein the second electronic control board is provided with a second electronic component, and the second electronic component is mounted on a side of the second electronic control board away from the MIPS.

9. The electrical control board of claim 7, further comprising a fixing member, wherein the base and the mounting arm are respectively provided with a first mounting hole and a second mounting hole, and the fixing member passes through the first mounting hole and the second mounting hole to fix the base and the mounting arm.

10. The electric control board according to claim 1, wherein the pin group of the MIPS connected to the first electric control board includes a pin for inputting a control signal, a power supply pin of the MIPS internal driver chip, and a fault feedback pin of the driver chip; and the pin group of the MIPS connected with the second electric control board comprises a pin of an output control load of the MIPS, a strong power supply pin and a lower bridge arm emitter output pin of the MIPS.