CN113105834A - High-temperature-resistant tin liquid adhesive tape - Google Patents
High-temperature-resistant tin liquid adhesive tape Download PDFInfo
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- CN113105834A CN113105834A CN202110365210.0A CN202110365210A CN113105834A CN 113105834 A CN113105834 A CN 113105834A CN 202110365210 A CN202110365210 A CN 202110365210A CN 113105834 A CN113105834 A CN 113105834A
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- temperature
- resistant
- adhesive tape
- coating
- adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to the technical field of adhesive tapes and discloses a high-temperature-resistant tin liquid adhesive tape which comprises a gluing layer and a base material layer, wherein the base material layer is a high-temperature-resistant film, the glue of the gluing layer is a high-temperature-resistant pressure-sensitive glue, and the high-temperature-resistant film is a polyimide film; the invention also provides a preparation method of the high-temperature-resistant tin liquid adhesive tape, which comprises the following steps: s1: preparing coating prefabricated liquid, preparing the coating prefabricated liquid according to a high-temperature-resistant glue formula, and sealing for later use; s2: adjusting parameters, placing the polyimide film on a machine for preparation, then setting process parameters, and preparing for starting up production after the process parameters are required. The invention improves the temperature resistance, warping resistance and high viscosity of the adhesive tape on the basis of ensuring the surface protection performance of the adhesive tape, has better tolerance performance to high-temperature tin liquid, is not easy to shrink at high temperature, and has better pasting protection effect on pasted objects.
Description
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to a high-temperature-resistant tin liquid adhesive tape.
Background
With the rapid development of economy and the improvement of the living standard of people's materials, the adhesive tape is completely integrated into buildings, industrial products, industrial production, assembly and daily life of people. In general, the application of tapes to outdoor is required in the fields of construction, industry, and the like, and therefore, the requirements for the performance of such tapes are also increased, and particularly, the heat resistance is greatly expected. The temperature resistance of the high temperature resistant adhesive tape is usually 120 to 260 degrees, and the high temperature resistant adhesive tape is commonly used for coating shielding, fixing in electronic industrial equipment and part manufacturing processes, printed circuit boards, high temperature treatment shielding and the like.
Through retrieval, a patent with an authorization publication number of CN104789185B discloses a high-temperature resistant adhesive tape and a high-temperature resistant adhesive used by the high-temperature resistant adhesive tape, wherein the high-temperature resistant adhesive tape comprises a polyimide film layer, a methyl vinyl phenyl silicone rubber layer and a high-temperature resistant adhesive layer which are sequentially laminated. The high-temperature-resistant adhesive comprises, by weight, 20-50 parts of an organic silicon adhesive resin, 15-40 parts of methyl vinyl silicone rubber, 2-8 parts of an organic peroxide, 5-20 parts of a hydrogenated styrene-isoprene-styrene block copolymer and 2-20 parts of polybutylene terephthalate, and even if the high-temperature-resistant adhesive tape is exposed to a high-temperature condition, the high-temperature-resistant adhesive tape still has good peeling strength and holding power, but the high-temperature-resistant adhesive tape has a poor using effect under the condition of high-temperature tin liquid, is easy to shrink at high temperature, has poor adhesive protection performance and cannot meet the requirements of people.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a high-temperature tin liquor resistant adhesive tape, which solves the problems that the common adhesive tape has poor using effect under the condition of high-temperature tin liquor, is easy to shrink at high temperature, has poor sticking protection performance and can not meet the requirements of people.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a high temperature resistant tin liquid sticky tape, includes rubber coating layer and substrate layer, the substrate layer is high temperature resistant film, and the glue on rubber coating layer is high temperature resistant pressure sensitive adhesive.
In a still further embodiment of the present invention, the high temperature resistant film is a polyimide film.
Further, the high-temperature-resistant pressure-sensitive adhesive is high-temperature-resistant acrylate or high-temperature-resistant silica gel adhesive.
On the basis of the scheme, the total thickness of the base material layer and the gluing layer is 15-30 mu m.
The invention also provides a preparation method of the high-temperature-resistant tin liquid adhesive tape, which comprises the following steps:
s1: preparing coating prefabricated liquid, preparing the coating prefabricated liquid according to a high-temperature-resistant glue formula, and sealing for later use;
s2: adjusting parameters, placing the polyimide film on a machine for preparation, then setting process parameters, and preparing for starting up production after the process parameters are required;
s3: coating, namely finishing coating production by coating the coating prefabricated liquid through a coating machine;
s4: and (5) curing, namely after the adhesive tape coated finished product in the step S3 is finished, sending the adhesive tape coated finished product into a curing chamber for heating and curing, and after curing is finished, obtaining the high-temperature-resistant adhesive tape with stable performance.
Further, the formula of the high-temperature-resistant glue in the S1 is a modified acrylate adhesive, isocyanate and epoxy system two-component curing agent, the modified acrylate adhesive is mainly prepared from an adhesive, the glass transition temperature (Tg) is 5-10 ℃, the rheological modulus G ' at 23 ℃ is 105-6Pa, and the rheological moduli G ' and G ' at 120 ℃ are 104-5 Pa.
Based on the above scheme, in the step S1, the coating dope is uniformly stirred for 10 to 30 minutes, filtered, defoamed and sealed after stirring.
In a further embodiment of the present invention, the polyimide film in S2 adopts primary color PI of 10-20 μm, PI tensile strength is not less than 240Mpa, elastic modulus is not less than 4400Mpa, (265 ℃, 2hrs) heat shrinkage: (-0.15)%, and the insulation strength is not less than 30V/mum.
Further, the coater in S3 is preferably a comma knife coater.
On the basis of the above scheme, the aging in the S4 is performed for 1-4 days at the temperature of 40-60 ℃.
(III) advantageous effects
Compared with the prior art, the invention provides a high-temperature-resistant tin liquid adhesive tape which has the following beneficial effects:
1. the invention improves the temperature resistance, warping resistance and high viscosity of the adhesive tape on the basis of ensuring the surface protection performance of the adhesive tape, has better tolerance performance to high-temperature tin liquid, is not easy to shrink at high temperature, and has better pasting protection effect on pasted objects.
2. The invention can expand the overall reliability and durability of the product by using the modified acrylate adhesive, and the product has excellent temperature resistance and weather resistance, can be used at the temperature of 260 ℃ tin liquid, and enhances the long-term reliability and consistency of the product.
3. The polyimide film disclosed by the invention has good weather resistance, and the uniformity of the coating prefabricated liquid can be improved through the steps of stirring and defoaming, so that the coating effect is improved.
Drawings
In the figure: 1. gluing layers; 2. and a substrate layer.
Fig. 1 is a schematic cross-sectional structural view of a high temperature resistant molten tin adhesive tape provided by the invention.
Fig. 2 is a schematic flow structure diagram of a preparation method of a high-temperature-resistant tin liquid adhesive tape provided by the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, a high temperature resistant tin liquid adhesive tape comprises a glue coating layer 1 and a substrate layer 2, wherein the substrate layer 2 is a high temperature resistant film, and the glue of the glue coating layer 1 is a high temperature resistant pressure sensitive adhesive.
The high-temperature-resistant film is a polyimide film which has good weather resistance, the high-temperature-resistant pressure-sensitive adhesive is high-temperature-resistant acrylate or high-temperature-resistant silica gel adhesive, and the total thickness of the base material layer 2 and the adhesive layer 1 is 22.5 micrometers.
The invention also provides a preparation method of the high-temperature-resistant tin liquid adhesive tape, which comprises the following steps:
s1: preparing coating prefabricated liquid, preparing the coating prefabricated liquid according to a high-temperature-resistant glue formula, and sealing for later use;
s2: adjusting parameters, placing the polyimide film on a machine for preparation, then setting process parameters, and preparing for starting up production after the process parameters are required;
s3: coating, namely finishing coating production by coating the coating prefabricated liquid through a coating machine;
s4: and (4) curing, namely after the adhesive tape coating finished product in the step S3 is finished, sending the adhesive tape coating finished product into a curing chamber for heating and curing, and after the curing is finished, obtaining the high-temperature-resistant adhesive tape with stable performance.
Particularly, the formula of the high-temperature-resistant glue in S1 is a modified acrylate adhesive, isocyanate and epoxy system two-component curing agent, the modified acrylate adhesive is prepared from the main raw materials of adhesive, the glass transition temperature (Tg) is 5 ℃, the rheological modulus G ' at 23 ℃ is 105-6Pa, the rheological modulus G ' and G ' at 120 ℃ is 104-5Pa, 10-micron dry glue is coated on a silicone release film with residual adhesive force of more than 95% and is attached to the steel belt surface of a PI film, the overall reliability and durability of the product can be expanded by using the modified acrylate adhesive, the product has excellent temperature resistance and weather resistance, can be used at the temperature of 260 ℃ tin liquid, the long-term reliability and consistency of the product are enhanced, the coating prefabricated liquid is uniformly stirred for 10-30 minutes during preparation, and is filtered, defoamed and sealed after stirring, the uniformity of the coating prefabricated liquid can be improved through the steps of stirring and defoaming, the coating effect is improved, the polyimide film in S2 adopts primary color PI with the thickness of 12.5 mu m, the PI tensile strength is not less than 240Mpa, the elastic modulus is not less than 4400Mpa, (265 ℃, 2hrs) heating shrinkage rate: (-0.15)%, dielectric strength of not less than 30V/μm, the coater in S3 is preferably a comma knife coater, and curing at 50 deg.C for 2 days in S4 improves the durability of the tape.
According to the above embodiment, the following test items were used to test the performance thereof, and the test parameters are presented in table one.
Watch 1
In the description herein, it is noted that relational terms such as first and second, and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a high temperature resistant tin liquid sticky tape, includes rubber coating (1) and substrate layer (2), its characterized in that, substrate layer (2) are high temperature resistant film, and the glue of rubber coating (1) is high temperature resistant pressure sensitive adhesive.
2. The solder paste tape of claim 1, wherein the high temperature resistant film is a polyimide film.
3. The high-temperature-resistant tin liquid adhesive tape as claimed in claim 1, wherein the high-temperature-resistant pressure-sensitive adhesive is a high-temperature-resistant acrylate or a high-temperature-resistant silica gel adhesive.
4. A hot tin melt resistant adhesive tape according to claim 3, wherein the total thickness of the base material layer (2) and the adhesive layer (1) is 15-30 μm.
5. The preparation method of the high-temperature-resistant tin liquid adhesive tape is characterized by comprising the following steps of:
s1: preparing coating prefabricated liquid, preparing the coating prefabricated liquid according to a high-temperature-resistant glue formula, and sealing for later use;
s2: adjusting parameters, placing the polyimide film on a machine for preparation, then setting process parameters, and preparing for starting up production after the process parameters are required;
s3: coating, namely finishing coating production by coating the coating prefabricated liquid through a coating machine;
s4: and (5) curing, namely after the adhesive tape coated finished product in the step S3 is finished, sending the adhesive tape coated finished product into a curing chamber for heating and curing, and after curing is finished, obtaining the high-temperature-resistant adhesive tape with stable performance.
6. The preparation method of the high-temperature-resistant tin liquid adhesive tape according to claim 5, wherein the formula of the high-temperature-resistant adhesive in the S1 is a modified acrylate adhesive, isocyanate and epoxy system two-component curing agent, the modified acrylate adhesive is mainly prepared from an adhesive, the glass transition temperature (Tg) is 5-10 ℃, the rheological modulus G ' at 23 ℃ is 105-6Pa, and the rheological moduli G ' and G ' at 120 ℃ are 104-5 Pa.
7. The method of claim 6, wherein in step S1, the coating dope is uniformly stirred for 10-30 minutes, filtered, defoamed and sealed.
8. The method for preparing the high temperature resistant tin liquid adhesive tape according to claim 5, wherein the polyimide film in S2 adopts primary color PI with the tensile strength of 10-20 μm or more, the elastic modulus of not less than 4400MPa, and the heat shrinkage rate of 265 ℃ and 2 hrs: (-0.15)%, and the insulation strength is not less than 30V/mum.
9. The method for preparing the high-temperature-resistant molten tin adhesive tape according to claim 5, wherein the coater in S3 is preferably a comma knife coater.
10. The method for preparing a high temperature resistant molten tin adhesive tape according to claim 5, wherein the curing in S4 is performed at a temperature of 40-60 ℃ for 1-4 days.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110365210.0A CN113105834A (en) | 2021-04-06 | 2021-04-06 | High-temperature-resistant tin liquid adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110365210.0A CN113105834A (en) | 2021-04-06 | 2021-04-06 | High-temperature-resistant tin liquid adhesive tape |
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| Publication Number | Publication Date |
|---|---|
| CN113105834A true CN113105834A (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110365210.0A Pending CN113105834A (en) | 2021-04-06 | 2021-04-06 | High-temperature-resistant tin liquid adhesive tape |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2639278A1 (en) * | 2012-03-13 | 2013-09-18 | Nitto Denko Corporation | Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing seminconductor device using the tape |
| CN108977114A (en) * | 2018-06-05 | 2018-12-11 | 太仓新宏电子科技有限公司 | A kind of high temperature resistant temperature indicating insulating tape |
| CN109082242A (en) * | 2018-08-14 | 2018-12-25 | 新恒东薄膜材料（常州）有限公司 | A kind of transparent high temperature resistant adhesive tape and preparation method thereof |
-
2021
- 2021-04-06 CN CN202110365210.0A patent/CN113105834A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2639278A1 (en) * | 2012-03-13 | 2013-09-18 | Nitto Denko Corporation | Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing seminconductor device using the tape |
| CN108977114A (en) * | 2018-06-05 | 2018-12-11 | 太仓新宏电子科技有限公司 | A kind of high temperature resistant temperature indicating insulating tape |
| CN109082242A (en) * | 2018-08-14 | 2018-12-25 | 新恒东薄膜材料（常州）有限公司 | A kind of transparent high temperature resistant adhesive tape and preparation method thereof |
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Application publication date: 20210713 |
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