CN109082242A - A kind of transparent high temperature resistant adhesive tape and preparation method thereof - Google Patents
A kind of transparent high temperature resistant adhesive tape and preparation method thereof Download PDFInfo
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- CN109082242A CN109082242A CN201810921515.3A CN201810921515A CN109082242A CN 109082242 A CN109082242 A CN 109082242A CN 201810921515 A CN201810921515 A CN 201810921515A CN 109082242 A CN109082242 A CN 109082242A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Adhesive Tapes (AREA)
Abstract
The present invention provides a kind of transparent high temperature resistant adhesive tapes and preparation method thereof.The transparent high temperature resistant adhesive tape includes PI film and the pressure-sensitive adhesive layer that fits with the PI film；The PI film is being modified to diamine portion to the PI resin of Kapton Kapton, it is made to contain-CF3Group unsymmetric structure；The raw material of the pressure-sensitive adhesive layer is silica gel series pressure-sensitive.Transparent high temperature resistant adhesive tape of the invention, Kapton can low temperature moulding, be not necessarily to high temperature imidization, it is colorless and transparent, and thickness can be down to 1-5 μm.
Description
Technical field
The present invention relates to a kind of transparent high temperature resistant adhesive tapes and preparation method thereof, belong to Kapton technical field.
Background technique
With the development of science and technology, every profession and trade is more and more to high temperature resistant, high intensity, lightweight and ultra-thin materials demand.It is poly-
Acid imide is in the ascendant to its research as traditional heat proof material, is the preferable approach to solve the above problems.However at present
Commercialized most thin Kapton is 5 μm of PI films of yellow, and performance is very unstable, in face of positioning requirements such as CCD
Technique when, yellow PI film is completely not applicable, so preparing ultra-thin transparent polyimide film is still one huge
Challenge.It is below a kind of super at 6 μm that the revealed technical solution of patent of Publication No. CN 205099611U is prepared for thickness
Thin Kapton, process are by obtaining, preparing by high temperature imidization containing polyamic acid is coated in silicon substrate layer
Method is simple, and the peel strength of the basal layer is 0.004-0.1kgf/cm.The patent of Publication No. CN104479579A discloses
A kind of ultra-thin PI film improves operability and production efficiency.However these ultra-thin Kaptons still remain it is certain
Defect: 1. preparation process undergo polyamic acid to the high temperature imidization of polyimides.2. film has polyimides common
Yellow, cannot be colorless and transparent.3. solubility range is narrow, it is only capable of in DMF, DMAC and NMP equal solvent, boiling point is high, hardly possible recycling,
Pollution is big.4. need by stretch processes, 5 μm or less form a film it is almost impossible, can not be ultra-thin.5. the knot of imidization film forming
Structure can not improve the adhesive force of acrylic compounds adhesive on it.
Summary of the invention
In view of the problems of the above-mentioned prior art, the purpose of the present invention is to propose to a kind of transparent high temperature resistant adhesive tape and its systems
Preparation Method, the Kapton of the transparent high temperature resistant adhesive tape can low temperature moulding, be not necessarily to high temperature imidization, it is colourless
It is bright, and thickness can be down to 1-5 μm.
The purpose of the present invention is achieved by the following technical programs:
A kind of transparent high temperature resistant adhesive tape comprising PI film (also referred to as Kapton) and fit with the PI film
Pressure-sensitive adhesive layer；
The PI film is being modified to diamine portion to the PI resin of Kapton Kapton, makes it
Contain-CF3Group unsymmetric structure；- the CF3Group unsymmetric structure includes one or more of having structure:
The raw material of the high temperature resistant pressure sensitive adhesive layer is silica gel series pressure-sensitive.
In above-mentioned transparent high temperature resistant adhesive tape, silica gel series pressure-sensitive is conventional selection.
In above-mentioned transparent high temperature resistant adhesive tape, it is preferred that the PI resin contains active group carboxyl.
In above-mentioned transparent high temperature resistant adhesive tape, it is preferred that the overall thickness of the transparent high temperature resistant adhesive tape is 2-7 microns, institute
State PI film with a thickness of 1-5 microns.
In above-mentioned transparent high temperature resistant adhesive tape, it is preferred that the pressure-sensitive adhesive layer with a thickness of 2-5 microns.
In above-mentioned transparent high temperature resistant adhesive tape, it is preferred that the two sides of the transparent high temperature resistant adhesive tape are respectively pasted with release
Film is pasted with the first release film on the outside of pressure-sensitive adhesive layer, the second release film is pasted on the outside of PI film, first release film
With a thickness of 25-38 microns, second release film with a thickness of 25 microns.
In above-mentioned transparent high temperature resistant adhesive tape, it is preferred that the release film is non-silicon non-fluorine release film.
The present invention also provides the preparation methods of above-mentioned transparent high temperature resistant adhesive tape, include the following steps:
Retarder thinner is added into polyimide resin, being diluted to solid content is 3%-15%, is stirred evenly (general
48 hours or less), obtain PI resin；
PI resin is coated on the second release film, 80-120 DEG C of drying 3-15min, film forming obtains PI film；
Pressure sensitive adhesive is coated on the first release film, 80-150 DEG C of drying 3-8min, film forming obtains pressure-sensitive adhesive layer；
PI film and pressure-sensitive adhesive layer are fitted using release film transfer, obtains to two sides and is pasted with the transparent high temperature resistant of release film
Adhesive tape；
It tears release film off and obtains transparent high temperature resistant adhesive tape.
In above-mentioned preparation method, it is 80- that PI resin, which is coated on and prepares the preferred drying temperature of PI film on the second release film,
110 DEG C, preferably drying time is 4-8min.Pressure sensitive adhesive is coated on the preferred drying temperature that pressure-sensitive adhesive layer is prepared on the first release film
It is 90-110 DEG C, preferably drying time is 3-6min.
In above-mentioned preparation method, polyimide resin is colorless and transparent, is not necessarily to imidization, therefore, retarder thinner (can also claim
For dissolution solvent) it is low boiling point solvent, it is preferred that and the retarder thinner includes ethyl acetate, toluene, butanone, butyl acetate second
The combination of one or more of glycol dimethyl ether and methyl iso-butyl ketone (MIBK).
In technical solution of the present invention, PI film is by containing-CF3The colorless and transparent polyimides tree of group unsymmetric structure
Rouge is prepared, colorless and transparent after film forming.
The PI film accurate can be coated in general coating line mass production, be prepared without biaxial tension etc. is complicated
Technique.
PI film film forming is film formation at low temp, and active group can be crosslinked under cryogenic, without 170-370 DEG C of high temperature imines
Change process.
PI resin solubility range is wide, is not limited to the volume of the higher boilings difficulty such as DMF, DMAC and NMP recycling, common solvents
It can dissolve, and boiling point is lower, resource can be saved by RTO exhaust-gas treatment, circulation heating.
The PI film thickness that the present invention obtains is 1-5 μm, ultra-thin, and PI film is 5-125 μm or more on the market at present.
PI resin contains the pendant reactive groups of a small amount of carboxyl, and acrylic acid adhesive resin can have preferably attached on PI
Put forth effort, adhesive force low with common PI film has apparent difference.
The glass transition temperature Tg of the PI resin is greater than 300 DEG C, can stablize and be used for a long time at 260 DEG C of high temperature.
Protrusion effect of the invention are as follows:
1, transparent high temperature resistant adhesive tape has superthin structure, and polyimides can be 1-5 microns；
2, PI film selects the PI resin with special unsymmetric structure, so that adhesive tape is colorless and transparent, non-Huang is non-black；
3, without biaxial orientation process, general coating line can be produced, and be suitble to accurate coating.
4, PI resin soluble end is wide, ethyl acetate, and glycol dimethyl ether etc. can dissolve, dilute, and low boiling point can pass through
RTO process circulation heating saves resource and pollution-free.
5, pendant reactive groups can make acrylic compounds adhesive have better adhesive force, at other corona
Reason.
6, PI resin has 300 DEG C or more of glass transition temperature, and adhesive tape is made for a long time in 260 DEG C of conditions
With.
Specific embodiment
In order to which technical characteristic of the invention, purpose and beneficial effect are more clearly understood, now to skill of the invention
Art scheme carries out described further below, but should not be understood as that limiting the scope of the invention.Institute in following embodiments
Experimental method is stated, is conventional method unless otherwise specified；The reagent and material unless otherwise specified can be from business ways
Diameter obtains.
Embodiment 1
The present embodiment provides a kind of transparent high temperature resistant adhesive tapes comprising PI film and the pressure sensitive adhesive to fit with the PI film
Layer；
The PI film is prepared, the PI by APS-1 polyimide resin (Akron Polymer Systems offer)
Film with a thickness of 1 μm；
The raw material of the high temperature resistant pressure sensitive adhesive layer be Dow Corning Corporation's organosilicon adhesive 7025 (100 parts), 7028 (1.0
Part), platinum catalyst 4000 (1.0 parts), 50 parts of toluene, the pressure-sensitive adhesive layer with a thickness of 2 μm.
2 sides of the transparent high temperature resistant adhesive tape of the present embodiment can respectively be pasted with release film, and the outside of pressure-sensitive adhesive layer attaches
Have the first release film, be pasted with the second release film on the outside of PI film, first release film with a thickness of 38 microns, described second
Release film with a thickness of 25 microns.
The present embodiment also provides the preparation method of above-mentioned transparent high temperature resistant adhesive tape, includes the following steps:
It takes APS-1 polyimide resin 20g to be put into 500ml there-necked flask, 113g solvent ethyl acetate is added, stirring 6 is small
Up to uniform, PI resin is made.
PI resin is coated on the second release film (SDL-50 release film) in the method scratched, 105 DEG C of drying 3min at
1 μm of film obtains PI film.
High-temperature Resistance Adhesives are configured, are uniformly coated on the first release film, 80 DEG C of drying 3min, which form a film 2 μm, obtains pressure sensitive adhesive
Layer.
PI film and pressure-sensitive adhesive layer are fitted using release film transfer, obtains to two sides and is pasted with the transparent high temperature resistant of release film
Adhesive tape；
It tears release film off and obtains transparent high temperature resistant adhesive tape.
Embodiment 2
The present embodiment provides a kind of transparent high temperature resistant adhesive tapes comprising PI film and the pressure sensitive adhesive to fit with the PI film
Layer；
The PI film is prepared, the PI by APS-1 polyimide resin (Akron Polymer Systems offer)
Film with a thickness of 3 μm；
The raw material of the pressure-sensitive adhesive layer is Dow Corning Corporation's organosilicon adhesive 7025 (100 parts), 7028 (1.0 parts), platinum
Au catalyst 4000 (1.0 parts), 50 parts of toluene, the pressure-sensitive adhesive layer with a thickness of 2 μm.
2 sides of the transparent high temperature resistant adhesive tape of the present embodiment can respectively be pasted with release film, and the outside of pressure-sensitive adhesive layer attaches
Have the first release film, be pasted with the second release film on the outside of PI film, first release film with a thickness of 38 microns, described second
Release film with a thickness of 25 microns.
The present embodiment also provides the preparation method of above-mentioned transparent high temperature resistant adhesive tape, includes the following steps:
It takes APS-1 polyimide resin 20g to be put into 500ml there-necked flask, 113g solvent ethylene glycol dimethyl ether, stirring is added
To uniform, PI resin is made within 4 hours.
PI resin is coated on the second release film (SDL-50 release film) in the method scratched, 110 DEG C of drying 3min at
3 μm of film obtain PI film.
High-temperature Resistance Adhesives are configured, are uniformly coated on the first release film, 80 DEG C of drying 3min, which form a film 2 μm, obtains pressure sensitive adhesive
Layer.
PI film and pressure-sensitive adhesive layer are fitted using release film transfer, obtains to two sides and is pasted with the transparent high temperature resistant of release film
Adhesive tape；
It tears release film off and obtains transparent high temperature resistant adhesive tape.
Embodiment 3
The present embodiment provides a kind of transparent high temperature resistant adhesive tapes comprising PI film and the pressure sensitive adhesive to fit with the PI film
Layer；
The PI film is prepared, the PI by APS-1 polyimide resin (Akron Polymer Systems offer)
Film with a thickness of 5 μm；
The raw material of the pressure-sensitive adhesive layer is Dow Corning Corporation's organosilicon adhesive 7025 (100 parts), 7028 (1.0 parts), platinum
Au catalyst 4000 (1.0 parts), 50 parts of toluene, the pressure-sensitive adhesive layer with a thickness of 2 μm.
2 sides of the transparent high temperature resistant adhesive tape of the present embodiment can respectively be pasted with release film, and the outside of pressure-sensitive adhesive layer attaches
Have the first release film, be pasted with the second release film on the outside of PI film, first release film with a thickness of 38 microns, described second
Release film with a thickness of 25 microns.
The present embodiment also provides the preparation method of above-mentioned transparent high temperature resistant adhesive tape, includes the following steps:
It takes APS-1 polyimide resin 20g to be put into 500ml there-necked flask, 113g solvent methylisobutyl ketone, stirring is added
To uniform, PI resin is made within 4 hours.
PI resin is coated on the second release film (SDL-50 release film) in the method scratched, 120 DEG C of drying 15min at
5 μm of film obtain PI film.
High-temperature Resistance Adhesives are configured, are uniformly coated on the first release film, 80 DEG C of drying 3min, which form a film 2 μm, obtains pressure sensitive adhesive
Layer.
PI film and pressure-sensitive adhesive layer are fitted using release film transfer, obtains to two sides and is pasted with the transparent high temperature resistant of release film
Adhesive tape；
It tears release film off and obtains transparent high temperature resistant adhesive tape.
Embodiment 4
The present embodiment tests the correlated performance of (ultra-thin) transparent high temperature resistant adhesive tape made from above-described embodiment 1-3,
As a result as shown in following table 1-3:
Table 1:
☆ tensile strength is 25mm × 25mm, tensile speed 500mm/min
☆ adhesion strength is width 1inch, 180 ° of GLASS plate removings, puller system speed 300mm/min
☆ adhesive force is the test of hundred lattice, and falling off for 5B is 0/100
Table 2:
☆ tensile strength is 25mm × 25mm, tensile speed 500mm/min
☆ adhesion strength is width 1inch, 180 ° of GLASS plate removings, puller system speed 300mm/min
☆ adhesive force is the test of hundred lattice, and falling off for 5B is 0/100
Table 3:
☆ tensile strength is 25mm × 25mm, tensile speed 500mm/min
☆ adhesion strength is width 1inch, 180 ° of GLASS plate removings, puller system speed 300mm/min
☆ adhesive force is the test of hundred lattice, and falling off for 5B is 0/100
Therefore the transparent high temperature resistant adhesive tape of the embodiment of the present invention has a characteristic that
1, transparent high temperature resistant adhesive tape has superthin structure, and polyimides can be 1-5 microns；
2, PI film selects the PI resin with special unsymmetric structure, so that adhesive tape is colorless and transparent, non-Huang is non-black；
3, without biaxial orientation process, general coating line can be produced, and be suitble to accurate coating.
4, PI resin soluble end is wide, ethyl acetate, and glycol dimethyl ether etc. can dissolve, dilute, and low boiling point can pass through
RTO process circulation heating saves resource and pollution-free.
5, pendant reactive groups can make acrylic compounds adhesive have better adhesive force, at other corona
Reason.
6, PI resin has 300 DEG C or more of glass transition temperature, and adhesive tape is made for a long time in 260 DEG C of conditions
With.
Claims (7)
1. a kind of transparent high temperature resistant adhesive tape comprising PI film and the pressure-sensitive adhesive layer to fit with the PI film；
The PI film is being modified to diamine portion to the PI resin of Kapton Kapton, contains it
There is-CF3Group unsymmetric structure；- the CF3Group unsymmetric structure includes one or more of having structure:
The raw material of the high temperature resistant pressure sensitive adhesive layer is silica gel series pressure-sensitive.
2. transparent high temperature resistant adhesive tape according to claim 1, it is characterised in that: the PI resin contains active group carboxylic
Base.
3. transparent high temperature resistant adhesive tape according to claim 1, it is characterised in that: the overall thickness of the transparent high temperature resistant adhesive tape
Be 2-7 microns, the PI film with a thickness of 1-5 microns.
4. transparent high temperature resistant adhesive tape according to claim 1, it is characterised in that: the pressure-sensitive adhesive layer it is micro- with a thickness of 2-5
Rice.
5. transparent high temperature resistant adhesive tape according to claim 1, it is characterised in that: the two sides of the transparent high temperature resistant adhesive tape are each
From release film is pasted with, it is pasted with the first release film on the outside of pressure-sensitive adhesive layer, the second release film is pasted on the outside of PI film, it is described
First release film with a thickness of 25-38 microns, second release film with a thickness of 25 microns.
6. the preparation method of transparent high temperature resistant adhesive tape according to any one of claims 1 to 5, includes the following steps:
Retarder thinner is added into polyimide resin, being diluted to solid content is 3%-15%, stirs evenly, obtains PI resin；
PI resin is coated on the second release film, 80-120 DEG C of drying 3-15min, film forming obtains PI film；
Pressure sensitive adhesive is coated on the first release film, 80-150 DEG C of drying 3-8min, film forming obtains pressure-sensitive adhesive layer；
PI film and pressure-sensitive adhesive layer are fitted using release film transfer, obtains to two sides and is pasted with the transparent high temperature resistant glue of release film
Band；
It tears release film off and obtains transparent high temperature resistant adhesive tape.
7. preparation method according to claim 6, it is characterised in that: the retarder thinner includes ethyl acetate, toluene, fourth
The combination of one or more of ketone, butyl acetate glycol dimethyl ether and methyl iso-butyl ketone (MIBK).
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| CN201810921515.3A CN109082242A (en) | 2018-08-14 | 2018-08-14 | A kind of transparent high temperature resistant adhesive tape and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113105834A (en) * | 2021-04-06 | 2021-07-13 | 苏州高泰电子技术股份有限公司 | High-temperature-resistant tin liquid adhesive tape |
| CN113370540A (en) * | 2021-06-09 | 2021-09-10 | 苏州天立达精密科技股份有限公司 | Method for manufacturing heat-conducting glue |
| CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
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| CN105960443A (en) * | 2014-02-13 | 2016-09-21 | 日东电工株式会社 | Silicone pressure sensitive adhesive composition, pressure sensitive adhesive tape, and method for manufacturing pressure sensitive adhesive tape |
| EP3106500A1 (en) * | 2014-02-13 | 2016-12-21 | Nitto Denko Corporation | Silicone pressure sensitive adhesive composition, pressure sensitive adhesive tape, and method for manufacturing pressure sensitive adhesive tape |
| CN104479579A (en) * | 2014-12-17 | 2015-04-01 | 广东生益科技股份有限公司 | Ultrathin PI cover film and preparation method thereof |
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| CN113370540A (en) * | 2021-06-09 | 2021-09-10 | 苏州天立达精密科技股份有限公司 | Method for manufacturing heat-conducting glue |
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