CN113099624A - Method for manufacturing circuit board solder mask - Google Patents
Method for manufacturing circuit board solder mask Download PDFInfo
- Publication number
- CN113099624A CN113099624A CN202110366256.4A CN202110366256A CN113099624A CN 113099624 A CN113099624 A CN 113099624A CN 202110366256 A CN202110366256 A CN 202110366256A CN 113099624 A CN113099624 A CN 113099624A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- time
- curing
- solder resist
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 9
- 238000009413 insulation Methods 0.000 abstract description 5
- 230000007306 turnover Effects 0.000 abstract description 3
- 239000012467 final product Substances 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 44
- 230000001680 brushing effect Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011265 semifinished product Substances 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a method for manufacturing a solder mask of a circuit board. The manufacturing method comprises the following steps: successively coating solder resist ink on solder resist areas on two surfaces of the circuit board; laser is adopted to irradiate the solder resist ink on the two sides of the circuit board simultaneously to carry out laser pre-curing; and sequentially carrying out pattern exposure, etching and high-temperature curing to obtain the final product. The method can quickly finish the manufacture of the resistance welding insulation graph of the circuit board, and compared with the prior method, the method saves two-time pre-curing time, one-time graph exposure time, one-time graph etching time, one-time high-temperature curing time and middle turnover time, greatly reduces the production time, omits the prior standing pre-curing equipment and improves the production efficiency; the circuit board can be used for simultaneously carrying out pattern exposure on two sides so as to improve the alignment precision of the solder resist pattern on different sides; the circuit board double-sided solder resist pattern is completely cured at one time, so that the time of the circuit board in a high-temperature environment can be shortened, the circuit board deformation abnormity caused by high temperature is reduced, and the overall quality yield of the circuit board is improved.
Description
Technical Field
The invention relates to a manufacturing method of a solder mask of a circuit board, belonging to the technical field of circuit boards.
Background
In the production and manufacturing process of the PCB, after the outer layer circuit is manufactured, a solder mask layer needs to be manufactured on the surface of the production board and used for protecting the circuit on the board surface. The process for manufacturing the solder mask in the industry at present comprises the following steps: brushing a whole block of solder resist ink in a solder resist area; suspending and standing for precuring for 15-30 min; using laser to expose the pattern; fourthly, etching the pattern by using chemical liquid medicine; fifthly, curing at high temperature for 20-30 min by using a constant temperature box, wherein the flow is shown in figure 1. Because each standing solidification needs to be suspended and stood, the method is the lowest efficiency procedure in the resistance welding insulating layer manufacturing procedure, and the manufacturing efficiency of the resistance welding insulating layer is severely limited; the circuit board is deformed and warped under the high-temperature environment; when solder resist ink patterns need to be manufactured on both sides of the circuit board, the process flow needs to be repeated, one process flow is performed on each side, and secondary high-temperature curing can cause the circuit board to deform more seriously, so that the quality of the circuit board is affected. In addition, the ink pattern is not cured during standing and precuring, so that the ink is easily interfered and polluted by the outside; in order to ensure the correctness and integrity of the printing ink graph, the semi-finished product of the circuit board in the pre-curing stage needs to be suspended and placed still, so that the space, equipment and time are seriously occupied, the manufacturing cost of the circuit board is increased, and the manufacturing period is prolonged. Moreover, when solder resist ink patterns need to be manufactured on both sides of the circuit board, the same circuit board needs to be subjected to high-temperature curing twice, so that the adverse risks of deformation, warping, expansion and contraction and the like of the circuit board are greatly increased, and the overall quality condition of the circuit board is influenced.
Disclosure of Invention
The invention aims to provide a method for manufacturing a circuit board solder mask, which can save working procedures, manufacturing period and cost by carrying out laser pre-curing and completing the pre-curing and pattern exposure in one step.
The invention provides a method for manufacturing a solder mask of a circuit board, which comprises the following steps:
s1, sequentially coating solder resist ink on the solder resist areas on the two surfaces of the circuit board;
s2, simultaneously irradiating the solder resist ink on the two sides of the circuit board by adopting laser to perform laser pre-curing;
and S3, sequentially carrying out pattern exposure, etching and high-temperature curing to form a solder mask on the circuit board.
In the above manufacturing method, in step S2, the wavelength of the laser is 800 to 200000 nm;
the laser pre-curing time is 5-20 min;
after the solder resist ink is coated on a solder resist area, laser is adopted for pre-curing, the laser with specific wavelength is used for irradiating the surface of a semi-finished product of the circuit board, and the high energy of the laser is used for enabling the solder resist ink to reach the pre-curing condition in a very short time so as to finish the pre-curing effect.
Specifically, the laser pre-curing and the pattern exposure can be completed in one step and can be performed in an exposure machine.
In the above manufacturing method, in step S3, the pattern exposure, the etching and the high temperature curing may be performed on the solder resist ink on both sides of the circuit board at the same time, so as to improve the production efficiency;
the etching may be performed under conventional conditions;
the high-temperature curing conditions are as follows:
the temperature is 80-200 ℃, and the time is 20-30 min.
Preferably, the solder mask is fabricated according to the following steps: the method comprises the following steps of brushing solder resist ink on a first surface of a circuit board, turning over and placing on a corresponding carrier, brushing solder resist ink on the other surface immediately, and then pre-curing by utilizing laser on two surfaces simultaneously; then, pattern exposure is carried out on the two sides of the circuit board simultaneously through an exposure machine; then placing the circuit board in etching solution to etch the solder resist patterns on the two sides of the circuit board simultaneously; and finally, putting the circuit board into a high-temperature box for high-temperature curing, and completely curing the solder resist patterns on the two sides of the circuit board at one time.
The invention adopts laser to carry out rapid pre-curing in the manufacturing process of the resistance welding insulating layer of the circuit board, greatly reduces the production period, saves equipment and factory buildings, improves the accuracy of the resistance welding pattern and reduces poor deformation.
Compared with the prior art, the method can quickly finish the manufacture of the resistance welding insulation graph of the circuit board, saves two-time pre-curing time (30-60 min), one-time graph exposure time (5min), one-time graph etching time (5-10 min), one-time high-temperature curing time (20-30 min) and middle turnover time, greatly reduces the production time, omits the prior standing pre-curing equipment and improves the production efficiency; the circuit board can be used for simultaneously carrying out pattern exposure on two sides so as to improve the alignment precision of the solder resist pattern on different sides; the circuit board double-sided solder resist pattern is completely cured at one time, so that the time of the circuit board in a high-temperature environment can be shortened, the circuit board deformation abnormity caused by high temperature is reduced, and the overall quality yield of the circuit board is improved.
Drawings
FIG. 1 is a flow chart of a conventional method for manufacturing a solder resist insulation layer of a circuit board.
FIG. 2 is a flow chart of the circuit board solder resist insulation layer manufacturing method of the present invention.
Detailed Description
The experimental procedures used in the following examples are all conventional procedures unless otherwise specified.
Materials, reagents and the like used in the following examples are commercially available unless otherwise specified.
The manufacturing method of the circuit board solder mask insulating layer provided by the invention adopts a laser pre-curing method,
after the solder resist ink is coated on the solder resist area, laser is adopted for pre-curing, the laser with specific wavelength is used for irradiating the surface of the circuit board semi-finished product, and the high energy of the laser is used for enabling the solder resist ink to reach the pre-curing condition in a very short time so as to finish the pre-curing effect. The specific manufacturing process is as follows:
the method comprises the following steps of brushing solder resist ink on a first surface of a circuit board, turning over and placing on a corresponding carrier, brushing solder resist ink on the other surface immediately, and then pre-curing by utilizing laser on two surfaces simultaneously; then, pattern exposure is carried out on the two sides of the circuit board simultaneously through an exposure machine; then placing the circuit board in etching solution to etch the solder resist patterns on the two sides of the circuit board simultaneously; and finally, putting the circuit board into a high-temperature box for high-temperature curing, and completely curing the solder resist patterns on the two sides of the circuit board at one time.
According to the invention, laser is adopted to carry out rapid pre-curing in the manufacturing process of the resistance welding insulating layer of the circuit board, so that the production period is greatly reduced, equipment and factory buildings are saved, the accuracy of the resistance welding pattern is improved, and poor deformation is reduced; the circuit board can be used for simultaneously carrying out pattern exposure on two sides so as to improve the alignment precision of the solder resist pattern on different sides; the circuit board double-sided solder resist pattern is completely cured at one time, so that the time of the circuit board in a high-temperature environment can be shortened, the circuit board deformation abnormity caused by high temperature is reduced, and the overall quality yield of the circuit board is improved.
Example 1 production of solder resist layer for Wiring Board
The flow chart is shown in fig. 2, and the specific steps are as follows:
s1, firstly, solder resist ink is brushed on the first surface of the circuit board, the circuit board is turned over and placed on a corresponding carrier, and solder resist ink is brushed on the other surface immediately;
s2, irradiating the two sides of the circuit board by using the laser emitted by the exposure machine, performing laser pre-curing, and then performing pattern exposure on the two sides of the circuit board by using the exposure machine;
wherein the wavelength of the laser is 125000nm, the laser pre-curing time is 15min, and the pattern exposure time is 10 min;
s3, placing the circuit board in an etching solution (sodium carbonate solution), and etching the solder resist patterns on the two sides of the circuit board simultaneously;
and S4, finally, placing the circuit board into a high-temperature box for high-temperature curing, and completely curing the solder resist patterns on the two sides of the circuit board.
Wherein the high-temperature curing temperature is 150 ℃ and the time is 25 min.
Comparative examples 1,
The flow chart is shown in fig. 1, and the specific steps are as follows:
1) brushing a whole block of solder resist ink on a solder resist area on one surface of the circuit board; 2) suspending and standing for precuring for 15-30 min; 3) pattern exposure (5min) using laser; 4) carrying out pattern etching by using chemical liquid; 5) and (3) curing at high temperature (150 ℃) for 25min by using a constant temperature box to finish the manufacture of one solder mask layer. The above steps are repeated to complete the fabrication of the solder mask on the other side of the circuit board (key difference from embodiment 1).
The method adopts a suspended standing mode for curing, is the lowest efficiency procedure in the solder resist insulating layer manufacturing procedure, seriously limits the manufacturing efficiency of the solder resist insulating layer, and is easy to be interfered and polluted by the outside because the ink graph is not cured during standing and precuring.
When solder resist ink patterns need to be manufactured on both sides of the circuit board, the same circuit board needs to be subjected to high-temperature curing twice, so that the adverse risks of deformation, warping, expansion and shrinkage and the like of the circuit board are greatly increased, and the overall quality condition of the circuit board is influenced.
Compared with the existing method for manufacturing the welding layer, the method can quickly finish the manufacture of the circuit board solder-resisting insulation pattern, wherein the two-time pre-curing time (30-60 min), the one-time pattern exposure time (5min), the one-time pattern etching time (5-10 min), the one-time high-temperature curing time (20-30 min) and the middle turnover time are saved, the production time is greatly reduced, the original standing pre-curing equipment is omitted, and the production efficiency is improved.
The method of the invention can improve the contraposition precision of the solder resist pattern on different surfaces by simultaneously carrying out pattern exposure on two surfaces of the circuit board (the contraposition precision of the embodiment 1 can reach +/-0.02 mm, and the highest contraposition precision of the comparative example 1 is only +/-0.05 mm).
The method can completely cure the double-sided solder resist pattern of the circuit board at one time, thereby reducing the time of the circuit board in a high-temperature environment, reducing the deformation abnormity of the circuit board caused by high temperature, and improving the overall quality yield of the circuit board (in example 1, only one high-temperature curing is performed, in comparative example 1, the high-temperature curing needs two times, and the deformation abnormity is aggravated by the additional one-time high-temperature curing), wherein the specific performance data is shown in table 1.
Table 1 performance data of solder resists (circuit boards) fabricated in example 1 and comparative example 1
| Performance of | Warp of | Collapsible structure |
| Example 1 | 0.3％ | 2mil |
| Comparative example 1 | 0.7％ | 5mil |
Claims (6)
1. A method for manufacturing a solder mask of a circuit board comprises the following steps:
s1, sequentially coating solder resist ink on the solder resist areas on the two surfaces of the circuit board;
s2, simultaneously irradiating the solder resist ink on the two sides of the circuit board by adopting laser to perform laser pre-curing;
and S3, sequentially carrying out pattern exposure, etching and high-temperature curing to form a solder mask on the circuit board.
2. The method of manufacturing according to claim 1, wherein: in step S2, the wavelength of the laser is 800 to 200000 nm.
3. The manufacturing method according to claim 1 or 2, characterized in that: in step S2, the laser pre-curing time is 5-20 min.
4. The production method according to any one of claims 1 to 3, characterized in that: the laser pre-curing and the pattern exposure are performed in an exposure machine.
5. The production method according to any one of claims 1 to 4, wherein: in step S3, the pattern exposure, the etching, and the high temperature curing are performed simultaneously on the solder resist ink on both sides of the circuit board.
6. The production method according to any one of claims 1 to 5, wherein: in step S3, the high-temperature curing conditions are as follows:
the temperature is 80-200 ℃, and the time is 20-30 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110366256.4A CN113099624A (en) | 2021-04-06 | 2021-04-06 | Method for manufacturing circuit board solder mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110366256.4A CN113099624A (en) | 2021-04-06 | 2021-04-06 | Method for manufacturing circuit board solder mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113099624A true CN113099624A (en) | 2021-07-09 |
Family
ID=76673726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110366256.4A Pending CN113099624A (en) | 2021-04-06 | 2021-04-06 | Method for manufacturing circuit board solder mask |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113099624A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5098527A (en) * | 1988-09-21 | 1992-03-24 | Ciba-Geigy Corporation | Method of making electrically conductive patterns |
| US5290608A (en) * | 1993-07-26 | 1994-03-01 | Macdermid, Incorporated | Method for forming a patterned mask |
| US20030131932A1 (en) * | 2002-01-14 | 2003-07-17 | Hoult Anthony P. | Diode-laser curing of liquid epoxide encapsulants |
| US6664029B1 (en) * | 1998-11-02 | 2003-12-16 | Kansai Paint Co., Ltd. | Method of forming pattern |
| US6686122B1 (en) * | 1998-12-22 | 2004-02-03 | Vantico Inc. | Production of photoresist coatings |
| CN1717428A (en) * | 2002-11-28 | 2006-01-04 | 太阳油墨制造株式会社 | Photocurable and thermosetting resin composition and printed circuit boards made by using the same |
| CN101192001A (en) * | 2006-11-15 | 2008-06-04 | 太阳油墨制造株式会社 | Welding-proof film forming method and photosensitive composition |
| CN101403856A (en) * | 2007-10-01 | 2009-04-08 | 太阳油墨制造株式会社 | Composition, dry film, curing article and printed circuit board |
| CN201682698U (en) * | 2010-05-14 | 2010-12-22 | 深圳市博敏电子有限公司 | Printed circuit board double-sided resistance welding fast printing fixture |
| CN102441740A (en) * | 2010-10-07 | 2012-05-09 | 住友重机械工业株式会社 | Laser irradiation apparatus, laser irradiation method, and insulating film forming apparatus |
| JP2015210443A (en) * | 2014-04-28 | 2015-11-24 | ケーシーシー コーポレーション | Photosensitive composition which has excellent light absorption and is suitable for fine pattern formation |
| CN109275278A (en) * | 2018-11-14 | 2019-01-25 | 大连崇达电路有限公司 | A kind of welding resistance process improving welding resistance ghost |
| CN212628623U (en) * | 2020-08-14 | 2021-02-26 | 北京梦之墨科技有限公司 | Electronic circuit and quick circuit manufacturing system |
-
2021
- 2021-04-06 CN CN202110366256.4A patent/CN113099624A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5098527A (en) * | 1988-09-21 | 1992-03-24 | Ciba-Geigy Corporation | Method of making electrically conductive patterns |
| US5290608A (en) * | 1993-07-26 | 1994-03-01 | Macdermid, Incorporated | Method for forming a patterned mask |
| US6664029B1 (en) * | 1998-11-02 | 2003-12-16 | Kansai Paint Co., Ltd. | Method of forming pattern |
| US6686122B1 (en) * | 1998-12-22 | 2004-02-03 | Vantico Inc. | Production of photoresist coatings |
| US20030131932A1 (en) * | 2002-01-14 | 2003-07-17 | Hoult Anthony P. | Diode-laser curing of liquid epoxide encapsulants |
| CN1717428A (en) * | 2002-11-28 | 2006-01-04 | 太阳油墨制造株式会社 | Photocurable and thermosetting resin composition and printed circuit boards made by using the same |
| CN101192001A (en) * | 2006-11-15 | 2008-06-04 | 太阳油墨制造株式会社 | Welding-proof film forming method and photosensitive composition |
| CN101403856A (en) * | 2007-10-01 | 2009-04-08 | 太阳油墨制造株式会社 | Composition, dry film, curing article and printed circuit board |
| CN201682698U (en) * | 2010-05-14 | 2010-12-22 | 深圳市博敏电子有限公司 | Printed circuit board double-sided resistance welding fast printing fixture |
| CN102441740A (en) * | 2010-10-07 | 2012-05-09 | 住友重机械工业株式会社 | Laser irradiation apparatus, laser irradiation method, and insulating film forming apparatus |
| JP2015210443A (en) * | 2014-04-28 | 2015-11-24 | ケーシーシー コーポレーション | Photosensitive composition which has excellent light absorption and is suitable for fine pattern formation |
| CN109275278A (en) * | 2018-11-14 | 2019-01-25 | 大连崇达电路有限公司 | A kind of welding resistance process improving welding resistance ghost |
| CN212628623U (en) * | 2020-08-14 | 2021-02-26 | 北京梦之墨科技有限公司 | Electronic circuit and quick circuit manufacturing system |
Non-Patent Citations (1)
| Title |
|---|
| 徐竹, 国防工业出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101102647B (en) | Plasma semi-additive process method for manufacturing pcb | |
| WO2017166904A1 (en) | Method for manufacturing power cell circuit board while exposing copper of internal copper plate | |
| CN112533361A (en) | Manufacturing method of circuit board with electromagnetic shielding structure | |
| CN105555043A (en) | Manufacturing process for ultra-thick copper PCB (printed circuit board) | |
| CN105513973A (en) | Blind hole manufacturing method | |
| CN113891557A (en) | Printed circuit board manufacturing method | |
| CN109451655A (en) | A kind of method and its structure producing pcb board control plate body size and warpage | |
| CN113099624A (en) | Method for manufacturing circuit board solder mask | |
| CN114206003A (en) | Glue removing method for copper deposition process of circuit board | |
| KR101425566B1 (en) | A process for forming via hole of core board for PCB | |
| CN108112195B (en) | Method for manufacturing multilayer circuit board | |
| KR101888511B1 (en) | Method of fabricating micro pattern on flexible copper clad laminate using imprinting process | |
| TW201330737A (en) | Method of forming via hole in circuit board | |
| CN114096068A (en) | Production method of white oil board | |
| CN111885828A (en) | Method for manufacturing PCB circuit with through holes and blind holes | |
| KR101412219B1 (en) | Method for Manufacturing Multi-stepped Substrate | |
| KR20110110664A (en) | Manufacturing method of double-sided printed circuit board | |
| CN106922086A (en) | A kind of circuit board explosionproof hole method | |
| CN118175752B (en) | Curing method of large-size flexible circuit board | |
| CN117747544B (en) | Method for forming through silicon via | |
| CN109743839A (en) | A kind of method of non-metallic half-pore plate | |
| CN115734499A (en) | Circuit forming method | |
| CN110809367B (en) | Production process for machining metal-based bevel edge by etching method | |
| CN213242533U (en) | Novel DBC substrate structure for vehicle | |
| JP4961749B2 (en) | Manufacturing method of semiconductor mounting substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210709 |