CN113099609A - Circuit board assembly, camera module and electronic device - Google Patents

Abstract

A circuit board assembly comprises a first circuit board, a second circuit board and a third circuit board, wherein any two of the first circuit board, the second circuit board and the third circuit board are directly and electrically connected through a flexible circuit board. The circuit board assembly can effectively avoid signal attenuation and signal interference caused by overlong routing, and the response speed is improved. The invention also provides a camera module and an electronic device.

Description

Circuit board assembly, camera module and electronic device

Technical Field

The present disclosure relates to circuit boards, and particularly to a circuit board assembly, a camera module including the circuit board assembly, and an electronic device.

Background

In the conventional circuit board assembly (for example, a circuit board assembly in a vehicle-mounted camera module), the internal circuit board is mostly in an up-down laminated arrangement mode, and each layer of circuit board is mainly connected with each other by a vertical connector, so that power and digital signal transmission is transmitted from a bottom layer circuit board to an upper layer circuit board through a middle layer circuit board, the overall wiring distance is long and wiring needs to be repeated in area, the signal processing capability of an integrated circuit carried by the current circuit board is greatly improved, and if the wiring length of the circuit board is too long, signal and power attenuation are easily caused. The circuit boards are stacked up and down and connected with each other through the vertical connector, so that the space for placing the components on the circuit boards is relatively reduced. In addition, for controlling the whole volume, the space between the circuit boards is very close to each other, so that all high-power-consumption and high-heat-source components are intensively placed, heat energy is mutually superposed, and the reliability of the module is reduced.

Disclosure of Invention

In view of the above, it is desirable to provide a circuit board assembly, a camera module and an electronic device, which can effectively avoid the overlong routing of the circuit board.

A circuit board assembly comprises a first circuit board, a second circuit board and a third circuit board, wherein any two of the first circuit board, the second circuit board and the third circuit board are directly and electrically connected through a flexible circuit board. The first circuit board, the second circuit board and the third circuit board are connected in pairs, so that signals between any two circuit boards can be directly transmitted between the circuit boards without being transferred through the third circuit board, and signal attenuation caused by overlong routing can be avoided. In addition, through the connection of the flexible circuit board, the problem that the space for placing components and parts is small due to the vertical connector can be effectively solved, and signal loss and signal interference caused by wiring can be effectively avoided.

In a further embodiment, the first circuit board and the second circuit board are both soft and hard composite boards. The soft and hard composite board comprises a first flexible circuit board and two hard circuit boards arranged on two sides of the first flexible circuit board. The first flexible circuit board is arranged between the two rigid circuit boards, so that the first flexible circuit board can be protected, and meanwhile, the two rigid circuit boards can be provided with more components. The soft and hard composite board comprises the first flexible circuit board, the first flexible circuit board in the soft and hard composite board can be directly adopted to connect the circuit boards, the connection structure is favorably simplified, the influence of a connector on the wiring space of the circuit board is reduced, the signal attenuation caused by wiring can be reduced, and the response speed of the integrated circuit on the circuit board is improved.

The two soft and hard composite boards are connected through one of the following connecting structures:

the two soft and hard composite boards are connected through one of the following connecting structures: the first flexible circuit boards in the two soft and hard composite boards are mutually connected to realize the electric connection of the two soft and hard composite boards. So set up, the signal between two soft or hard composite sheet is walked the inlayer of soft or hard composite sheet can effective control impedance matching nature, practices thrift the components and parts on the soft or hard composite sheet simultaneously and puts the space, is convenient for put more components and parts on the soft or hard composite sheet, can effectively reduce because of walking signal loss and the signal interference that the line brought, promotes the response speed of the components and parts on the circuit board. .

Or the first flexible circuit board in the middle of one of the soft and hard composite boards is electrically connected with the first flexible circuit board connector arranged on the other soft and hard composite board to realize the electrical connection of the two soft and hard composite boards. The first flexible circuit board of one of them soft or hard composite sheet (first board) extends out and is connected with first flexible circuit board connector, can practice thrift the wiring space of this one of them soft or hard composite sheet, effectively reduces because of walking signal loss and signal interference that the line brought, promotes the response speed of components and parts on the circuit board.

Or the two soft and hard composite boards are electrically connected through the connection of a golden finger on the first flexible circuit board connected to the middle of one soft and hard composite board and the connection of a second soft and hard board connector arranged on the other soft and hard composite board. The first flexible circuit board through one of them soft or hard composite sheet (first board) extends out and is connected with the golden finger, can practice thrift the wiring space of this one of them soft or hard composite sheet, can effectively reduce because of walking signal loss and the signal interference that the line brought, promotes the response speed of components and parts on the circuit board. . Through the golden finger is pegged graft the second flexible line board connector, it is convenient to peg graft, the subassembly equipment of being convenient for, and the resistant plug of golden finger, the good reliability.

Or the first flexible circuit board in the middle of one of the soft and hard composite boards, the first connector male seat arranged at the far end part of the first flexible circuit board and the first connector female seat arranged on the other soft and hard composite board are connected to realize the electric connection of the two soft and hard composite boards. . The first flexible circuit board of one of them soft or hard composite sheet (first board) extends out and is connected with the public seat of first connector, can practice thrift the wiring space of this one of them soft or hard composite sheet, can effectively reduce because of walking signal loss and signal interference that the line brought, promotes the response speed of components and parts on the circuit board. . Through the public seat of first connector with the female seat of first connector is pegged graft, and it is convenient to peg graft, and the subassembly equipment of being convenient for, and can adopt general public seat of connector and the female seat of connector, and the suitability is high, and is with low costs.

In a further embodiment, any two of the first circuit board, the second circuit board, and the third circuit board are connected by one of the following connection structures:

two third flexible circuit board connectors respectively arranged on the two circuit boards are connected with a second flexible circuit board connected between the two third flexible circuit board connectors to realize the electric connection of the two circuit boards; the two third flexible circuit board connectors are connected through the second flexible circuit board, so that signal loss and signal interference caused by wiring can be effectively reduced, and the response speed of components on the circuit board is increased.

Or the two circuit boards are electrically connected through a third flexible circuit board which is respectively pressed on the two circuit boards by an anisotropic conductive adhesive film; adopt this kind of connection structure simple structure, it is easy to connect, and connect through the third flexible line way board, can effectively solve the problem that the space that can put components and parts is little that leads to because of the vertical type connector, and can effectively avoid walking signal loss and the signal interference that the line brought, promote the response speed of components and parts on the circuit board.

Or the second connector female seat and the fourth flexible circuit board are respectively arranged on the two circuit boards, and the second connector male seats are arranged at two ends of the fourth flexible circuit board, and the two circuit boards are electrically connected by connecting the second connector male seats with the second connector female seats. Through the public seat of second connector with the female seat of second connector is pegged graft, and it is convenient to peg graft, and the subassembly equipment of being convenient for, and can adopt general public seat of connector and the female seat of connector, and the suitability is high, and is with low costs. The fourth flexible line way board set up can effectively avoid walking signal loss and signal interference that the line brought, promotes the response speed of components and parts on the circuit board.

In a further embodiment, when the first circuit board, the second circuit board and the third circuit board are connected in pairs, the first circuit board, the second circuit board and the third circuit board are located on the same plane or different planes. The three circuit boards are positioned on the same plane, so that the height of the circuit board assembly is minimized; the wiring space between the circuit boards is not influenced, which is beneficial to increasing the wiring space of the circuit boards; and the chips arranged on the three circuit boards are not stacked and gathered, so that the heat dissipation is facilitated. The three circuit boards are located on different planes, so that the occupied horizontal area of the circuit board assembly is reduced, and the three-dimensional circuit board assembly is suitable for use scenes with small horizontal space, such as vehicle-mounted cameras.

In a further embodiment, when the first circuit board, the second circuit board and the third circuit board are connected two by two, the second circuit board and the third circuit board are respectively disposed on two adjacent side edges of the first circuit board, and any two of the first circuit board, the second circuit board and the third circuit board are disposed in an inclined manner or a vertical manner. By the arrangement, the contact area between any two circuit boards is increased, and the circuit boards are favorably interconnected pairwise; when the two circuit boards are connected at the side edges, the signal transmission distance is favorably shortened. When the circuit board is obliquely arranged, the height of the circuit board assembly is reduced; when setting up perpendicularly, all connect through adjacent side separately between the three circuit board, be favorable to reducing circuit board subassembly overall dimension, shorten signal transmission distance, reduce signal loss, in addition, the response speed of components and parts on the promotion circuit board, mutually perpendicular sets up the space that can not occupy circuit board arrangement components and parts, what the circuit that sets up on the circuit board can not receive other circuit boards blocks to be favorable to promoting circuit board subassembly's whole radiating effect.

In a further embodiment, the second circuit board and the third circuit board are respectively disposed on two opposite sides of the first circuit board, and the first circuit board, the second circuit board and the third circuit board are connected end to realize two-to-two connection. So set up, first circuit board the second circuit board the third circuit board is the triangle-shaped setting, is favorable to the firm connection between the circuit board. All connect through adjacent side each other between arbitrary two circuit boards, be favorable to reducing circuit board assembly overall dimension, shorten signal transmission distance, reduce signal loss, promote the response speed of components and parts on the circuit board.

The camera module comprises a lens assembly, a shell and a circuit board assembly, wherein the lens assembly is arranged on the shell, a containing groove is formed in the shell, and the circuit board assembly is arranged in the containing groove. The camera module has the same technical effect as the circuit board assembly, and is not described herein.

In a further embodiment, the first circuit board is a power circuit board, the second circuit board is a sensor circuit board, the third circuit board is an image signal processing circuit board, the sensor circuit board is provided with a sensor integrated circuit, the power circuit board is provided with a power integrated circuit and a serializer, the image signal processing circuit board is provided with an image signal processing integrated circuit, the sensor circuit board or the power circuit board is provided with a coaxial connector, the coaxial connector directly transmits a power signal to the power integrated circuit on the power circuit board, and the power integrated circuit respectively provides power to the serializer, the sensor integrated circuit and the image signal processing integrated circuit. With the arrangement, the transmission of the power supply is in tree-shaped distribution, the coaxial connector to the power supply circuit board is a main line, the power supply integrated circuit to the sensor integrated circuit and the image signal processing integrated circuit are branches, so that the influence of power supply noise on the image high-speed signal between the sensor integrated circuit and the image signal processing integrated circuit can be kept away.

In a further embodiment, the power supply ic includes a serializer power supply sub-circuit, a sensor power supply sub-circuit and an image processor power supply sub-circuit, the serializer power supply sub-circuit is connected to the serializer for converting the power signal transmitted by the coaxial connector into the working voltage signal of the serializer and transmitting the working voltage signal of the serializer to the serializer, the sensor power supply sub-circuit is connected to the sensor integrated circuit for converting the power signal transmitted by the coaxial connector into the working voltage signal of the sensor integrated circuit and transmitting the working voltage signal of the sensor integrated circuit to the sensor integrated circuit, the image processor power supply sub-circuit is connected to the image signal processing integrated circuit for converting the power signal transmitted by the coaxial connector into the working voltage signal of the image signal processing integrated circuit and transmitting the working voltage signal of the image signal processing integrated circuit to the image signal processing integrated circuit And transmitting the working voltage signal of the image signal processing integrated circuit to the image signal processing integrated circuit. Each circuit board is provided with a corresponding power supply sub-circuit, so that the power supply conversion efficiency can be improved.

In a further embodiment, the power circuit board, the sensor circuit board, and the image signal processing circuit board are respectively disposed on different and non-parallel planes, the power circuit board and the image signal processing circuit board are both disposed on the same side of the sensor circuit board, the sensor integrated circuit is disposed on a side away from the power circuit board and the image signal processing circuit board on the sensor circuit board, the power integrated circuit is disposed on a side away from the sensor circuit board and the image signal processing circuit board on the power circuit board, and the image signal processing integrated circuit is disposed on a side away from the power circuit board and the sensor circuit board on the image signal processing circuit board. The arrangement is favorable for dispersing heat generated by the chips on the circuit boards, so that the heat dissipation efficiency of the camera module is further improved.

In a further embodiment, the housing includes a first housing for mounting the lens assembly and a second housing for disposing the receiving groove, and the first housing and the second housing are detachably or rotatably connected. The detachable connection or the rotatable connection is beneficial to the installation and the maintenance of the lens component and the circuit board component. The circuit board assembly and the lens assembly are respectively arranged on the first shell and the second shell, so that heat generated by the circuit board assembly can be prevented from being transferred to the lens assembly.

In a further embodiment, the second housing includes a first receiving portion, a second receiving portion and a third receiving portion connected to each other, the second receiving portion and the third receiving portion respectively extend from two adjacent sides of the first receiving portion toward a direction away from the camera assembly, the receiving slots include a first receiving slot disposed in the first receiving portion and configured to receive the sensor circuit board, a second receiving slot disposed in the second receiving portion and configured to receive the power circuit board, and a third receiving slot disposed in the third receiving portion and configured to receive the ISP circuit board, and the first receiving slot, the second receiving slot and the third receiving slot are connected in pairs. The second accommodating part and the third accommodating part extend from two adjacent sides of the first accommodating part towards the direction far away from the camera assembly respectively, so that heat generated by the circuit board can be dispersed, and the second accommodating part and the third accommodating part are far away from the camera assembly, so that heat generated by the power circuit board and the image signal processing circuit board can be prevented from being transferred to the camera assembly. Each circuit board is arranged in the corresponding accommodating groove respectively and radiates outwards through the side wall of each accommodating part respectively, and heat generated by each circuit board cannot influence other circuit boards, so that the radiating efficiency is effectively improved.

In a further embodiment, the first accommodating portion includes a fixing plate for fixing the sensor circuit board and a bottom plate spaced from the fixing plate, the fixing plate and the bottom plate are provided with through holes, and the coaxial connector on the sensor circuit board extends out of the first accommodating portion through the through holes. The fixed plate and the interval between the bottom plates are favorable for heat dissipation of the sensor circuit board arranged in the first accommodating part, and meanwhile, sufficient accommodating space is provided for components arranged on one side, deviating from the camera assembly, of the sensor circuit board.

In a further embodiment, the first accommodating portion, the second accommodating portion and the third accommodating portion are vertically arranged two by two to form a semi-surrounding structure, the semi-surrounding structure surrounds to form a surrounding space, the camera module further includes a connecting wire, a connecting portion connected with the coaxial connector is arranged at an end of the connecting wire, and the connecting portion is arranged in the surrounding space. By the arrangement, the whole size of the camera module is reduced, and the whole weight of the camera module is reduced. The enclosing space provides a connecting space for the connecting part and the coaxial connector, and is favorable for protecting the connecting part and the coaxial connector from unnecessary damage.

An electronic device comprises the camera module. The camera module is small in overall size, occupies small internal space of the electronic device, and is beneficial to miniaturization of the electronic device. Adopt flexible line way board lug connection between the circuit board in the module of making a video recording, can effectively solve the problem that can put the space of components and parts is little because of what vertical type connector leads to, and can effectively avoid walking signal loss and signal interference that the line brought, promote electron device's response speed. The circuit board assembly is arranged in the accommodating groove in the shell, so that heat generated by the circuit board assembly can be effectively prevented from being transferred to the lens assembly.

Drawings

Fig. 1 is a schematic structural diagram of a conventional circuit board assembly.

Fig. 2 is a schematic diagram of power signal and communication signal transmission of the circuit board assembly shown in fig. 1.

Fig. 3 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention.

Fig. 4(a) is a schematic view of a connection structure between circuit boards according to a first embodiment of the present invention.

Fig. 4(b) is a schematic view of a connection structure between circuit boards according to a second embodiment of the present invention.

Fig. 4(c) is a schematic view of a connection structure between circuit boards according to a third embodiment of the present invention.

Fig. 4(d) is a schematic view of a connection structure between circuit boards according to a fourth embodiment of the present invention.

Fig. 4(e) is a schematic view of a connection structure between circuit boards according to a fifth embodiment of the present invention.

Fig. 4(f) is a schematic view of a connection structure between circuit boards according to a sixth embodiment of the present invention.

Fig. 4(g) is a schematic view of a connection structure between circuit boards according to a seventh embodiment of the present invention.

Fig. 5(a) is a schematic structural diagram of a circuit board assembly according to a first embodiment of the present invention.

Fig. 5(b) is a schematic structural diagram of a circuit board assembly according to a second embodiment of the present invention.

Fig. 5(c) is a schematic structural diagram of a circuit board assembly according to a third embodiment of the present invention.

Fig. 6 is a schematic diagram of communication signal transmission of a circuit board assembly according to a first embodiment of the present invention.

Fig. 7 is a schematic diagram of power signal transmission of the circuit board assembly shown in fig. 6.

Fig. 8(a) is a schematic signal transmission diagram of a circuit board assembly according to a second embodiment of the present invention.

Fig. 8(b) is a signal transmission diagram of a circuit board assembly according to a third embodiment of the present invention.

Fig. 8(c) is a schematic signal transmission diagram of a circuit board assembly according to a fourth embodiment of the present invention.

Fig. 9 is a schematic view of a connection structure of the circuit board assembly shown in fig. 6 in a first state.

Fig. 10 is a schematic view of a connection structure of the circuit board assembly shown in fig. 6 in a second state.

Fig. 11 is a schematic perspective view of a camera module according to an embodiment of the present invention.

Fig. 12 is an exploded view of the camera module shown in fig. 11.

Fig. 13 is a schematic structural view of a second housing of the camera module shown in fig. 11.

Fig. 14 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Description of the main elements

Circuit board assembly 1, 2

First circuit board 10

First side edge 100

Second side 102

Third side 103

Fourth side 104

First side 105

Second side 106

First connector 11

Second circuit board 12

Second connector 13

Third circuit board 14

Third connector 15

Power supply circuit board 20, 900

Power supply IC 200, 9000

Serializer 202, 9002

First side 203 of power circuit board

Second side 204 of the power circuit board

Sensor circuit board 22, 904

Sensor IC 220, 9040

First side 221 of the sensor circuit board

Second side 222 of the sensor circuit board

Third side 223 of sensor circuit board

Fourth side 224 of the sensor circuit board

First side 225 of sensor circuit board

Second side 226 of sensor circuit board

First fixing hole 228

ISP Circuit Board 24, 902

ISP IC 240，9020

First side 241 of ISP circuit board

Second side 242 of the ISP circuit board

First FPC25

Second FPC 26

FPC golden finger 27

Third FPC 270

Golden finger 272

FPC connector 274

Lens component 3

Camera module 4

Housing 40

Containing groove 400

First receiving groove 401

Second receiving groove 402

Third receiving groove 403

First case 41

First positioning hole 410

First via 411

Second housing 42

Second positioning hole 420

First receiving portion 421

Fixing plate 4210

First fixing hole 42100

Second through hole 42102

Baseboard 4212

Second receptacle 422

Third receptacle 423

Enclosing space 424

Connecting wire 5

Connecting part 50

Electronic device 6

Control unit 7

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," and the like are used herein for illustrative purposes only. The terms "first" and "second" are used merely for distinguishing between element names and do not denote any order.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. The embodiments of the present invention are described in detail with reference to the drawings, and for convenience of illustration, the drawings showing the partial structure of the device are not enlarged partially according to the general scale, and the drawings are only examples, which should not limit the scope of the present invention.

The circuit board assembly in the embodiment of the present invention may be used for a vehicle-mounted camera module, and it is understood that the circuit board assembly in the embodiment of the present invention may be used for various electronic assemblies or electronic devices, and the circuit board assembly in the embodiment of the present invention may be used as long as the electronic assemblies or electronic devices include at least three circuit boards, and the three circuit boards need to be in communication connection or electrical connection.

Most of the conventional circuit board assemblies are of a stacked structure, and refer to fig. 1 and 2, which are schematic structural diagrams of a conventional circuit board assembly. The circuit board assembly 90 is applied to a vehicle camera module, and includes a power circuit board 900, an Image Sensor Processor (ISP) circuit board 902, and a Sensor circuit board 904. The power Circuit board 900 carries a power Integrated Circuit (IC) 9000 and a serializer 9002 thereon, the ISP Circuit board 902 carries an ISP IC 9020, and the sensor Circuit board 904 carries a sensor IC 9040. The ISP circuit board 902 is connected between the power circuit board 900 and the sensor circuit board 904. The power circuit board 900, the ISP circuit board 902 and the sensor circuit board 904 are stacked in parallel, and the power signal and the communication signal are transmitted between the power circuit board 900 and the ISP circuit board 902 through an upright connector 1 and between the ISP circuit board 902 and the sensor circuit board 904 through an upright sensor 2. The power signal a of the power circuit board 900 is transmitted to the sensor circuit board 904 through the ISP circuit board 902, and the communication signal b of the serializer 9002 is transmitted to the sensor circuit board 904 through the ISP circuit board 902. The power signal a and the communication signal b are routed through the ISP circuit board 902, which is prone to signal attenuation. The power circuit board 900, the ISP circuit board 902 and the sensor circuit board 904 are stacked in parallel, and adjacent circuit boards are connected to each other through vertical connectors, so that a space for placing components on the circuit boards is relatively reduced, and the space between the circuit boards is relatively small, which causes the components with high power consumption and high heat source on the circuit boards to be placed in a concentrated manner, so that heat energy is stacked, and the reliability of the module is low.

In order to improve the structure of the circuit board assembly, the circuit board assembly provided by the embodiment of the invention comprises a first circuit board, a second circuit board and a third circuit board, wherein any two of the first circuit board, the second circuit board and the third circuit board are directly and electrically connected through a flexible circuit board, so that signal attenuation caused by overlong wiring can be avoided, and the problem of small space for placing components and parts caused by a vertical connector can be effectively solved and signal interference caused by wiring can be effectively avoided through connection of the flexible circuit boards. Fig. 3 is a schematic structural diagram of a circuit board assembly according to a first embodiment of the present invention. The circuit board assembly 1 includes a first circuit board 10, a second circuit board 12 and a third circuit board 14. Any two of the first circuit board 10, the second circuit board 12 and the third circuit board 14 are electrically connected directly through a flexible wiring board. Specifically, the first circuit board 10 is connected to the second circuit board 12 through a first connector 11, the second circuit board 12 is connected to the third circuit board 14 through a second connector 13, and the third circuit board 14 is connected to the first circuit board 10 through a third connector 15. The first connector 11, the second connector 13, and the third connector 15 each include a flexible wiring board. Because all through flexible line way board lug connection between per two circuit boards, can avoid the signal attenuation problem that leads to through the circuit board transfer, and connect through flexible line way board, can effectively solve the problem that the space that can put components and parts is little that leads to because of vertical type connector, and can effectively avoid walking the signal interference that the line brought.

In a further embodiment, the first circuit board 10, the second circuit board 12 and the third circuit board 14 may be a Rigid-Flex PCB (RFPCB). The Flexible and hard composite Board refers to a Circuit Board with FPC (Flexible Printed Circuits) and PCB (Printed Circuit Board) which are combined together according to relevant process requirements through processes such as pressing and the like, and the Circuit Board is formed. The soft and hard composite board provided by the embodiment of the invention comprises a flexible circuit board and two hard PCBs arranged at two sides of the flexible circuit board, namely, the flexible circuit board is clamped at the inner sides of the two hard PCBs.

The soft and hard composite board is manufactured by one or more modes of inner pressure layer connection of a soft board of a flexible circuit board, a golden finger connector of the flexible circuit board, a board-to-board connector or board-to-board anisotropic conductive adhesive hot pressing.

In some embodiments, the upper side and the lower side of the soft and hard composite board are both one to two layers of hard PCBs, and the two layers of flexible circuit boards are laminated through the hard PCBs on the upper side and the lower side to be combined into the soft and hard composite board RFPCB. The flexible circuit board positioned between the two rigid PCBs can directly extend out of the rigid-flexible composite board to realize the connection between the rigid-flexible composite board and the rigid-flexible composite board. The first circuit board 10, the second circuit board 12 and the third circuit board 14 may be directly connected with each other by a flexible circuit board in the middle of the flexible-rigid composite board, or connected with each other by the flexible circuit board and a golden finger of the flexible circuit board, or connected with each other by the golden finger of the flexible circuit board. For example, referring to fig. 3, the first connector 11 may be a flexible printed circuit board, the second connector 13 may be a flexible printed circuit board, and the third connector 15 may be a gold finger of a flexible printed circuit board. It is understood that, in other embodiments, the first connector 11 and the second connector 13 may also be flexible circuit board golden fingers, and the third connector 15 may also be a flexible circuit board. The flexible circuit board is arranged on the inner layer of the circuit board, so that the wiring space of the circuit board is not occupied, and the space of the circuit board, in which components can be placed, is effectively improved.

Fig. 4(a) to 4(g) respectively show connection structure patterns between soft and hard composite boards provided by several embodiments. The first connector 11 between the first circuit board 10 and the second circuit board 12, the second connector 13 between the second circuit board 12 and the third circuit board 14, and the third connector 15 between the third circuit board 14 and the first circuit board 10 may adopt the same connection structure, or may adopt different connection structures. For convenience of description, the connection between the two circuit boards is described as an example, and the first connector 11, the second connector 13, and the third connector 15 may respectively adopt any one of the connection structures shown in fig. 4(a) to 4 (g). It is understood that the connection structures shown in fig. 4(a) to 4(g) are only exemplary and not exhaustive, and the first connector 11, the second connector 13, and the third connector 15 may adopt any suitable board-to-board connection structure.

In fig. 4(a) to 4(d), at least one of the two circuit boards is a soft and hard composite board 160, and includes a first flexible circuit board 161 disposed in the middle and a hard circuit board 162 disposed on two opposite sides of the flexible circuit board 161. Referring to fig. 4(a), the connection structure between the two soft and hard composite boards 160 is formed by extending a first flexible printed circuit board 161 between the two soft and hard composite boards 160. The two soft and hard composite boards 160 are connected through the extended portion of the first flexible printed circuit board 161. So set up, the signal between two soft and hard composite sheet 160 is walked line (for example power is walked line p and signal and is walked line i) and is in the inlayer of soft and hard composite sheet 160 can effectively control impedance matching nature, practices thrift the components and parts on the soft and hard composite sheet 160 simultaneously and puts the space, is convenient for put more components and parts on soft and hard composite sheet 160, reduces because of walking signal loss and the signal interference that brings, promotes the response speed of the components and parts on the circuit board.

Referring to fig. 4(b), the connecting structure between the two rigid-flexible composite boards 160 includes a first flexible printed circuit board 161 and a first flexible printed circuit board connector 163 a. The first flexible printed circuit board 161 of one of the soft and hard composite boards 160 (the first board) extends out to be connected to the first flexible printed circuit board connector 163a disposed on the other soft and hard composite board 160 (the second board), so as to realize the connection between the two soft and hard composite boards 160. The first flexible circuit board 161 extending out from one of the soft and hard composite boards 160 (the first board) is connected to the first flexible circuit board connector 163a, so that the wiring space of the one of the soft and hard composite boards 160 can be saved, the signal loss and the signal interference caused by wiring can be reduced, the response speed of components on the circuit board can be increased, and the first flexible circuit board connector 163a is convenient to assemble.

Referring to fig. 4(c), the connection structure between the two soft and hard composite boards 160 includes a first flexible circuit board 161 in the middle of one of the soft and hard composite boards, a gold finger 164 connected to the first flexible circuit board 161, and a second flexible circuit board connector 163b disposed on the other soft and hard composite board 160. The first flexible circuit board 161 of one of the soft and hard composite boards 160 (the first board) extends out to be connected with the gold finger 164, and the gold finger 164 is connected with the second flexible circuit board connector 163b arranged on the other soft and hard composite board 160 (the second board), so that the connection between the two soft and hard composite boards 160 is realized. The first flexible circuit board 161 of one of the soft and hard composite boards 160 (the first board) extends out to be connected with the golden finger 164, so that the wiring space of the one of the soft and hard composite boards 160 can be saved, the signal loss and the signal interference caused by wiring are reduced, and the response speed of components on the circuit board is improved. Through the golden finger 164 is pegged graft the second flexible line board connector 163b, it is convenient to peg graft, the subassembly equipment of being convenient for, and the golden finger 164 is resistant to plug, and the good reliability.

Referring to fig. 4(d), the connecting structure between two soft and hard composite boards 160 includes a first connector female socket 165a, a first connector male socket 166a, and a first flexible circuit board 161 between one soft and hard composite board 160. One of the soft and hard composite boards 160 is provided with a first connector female socket 165a, and a first flexible circuit board 161 in the middle of the other soft and hard composite board 160 extends out to be connected with the first connector female socket 165a through a first connector male socket 166 a. The first flexible circuit board 161 of one of the soft and hard composite boards 160 (the first board) extends out to be connected with the first connector male seat 166a, so that the wiring space of the one of the soft and hard composite boards 160 can be saved, the signal loss and the signal interference caused by wiring are reduced, and the response speed of components on the circuit board is improved. Through the public seat 166a of first connector with the female seat 165a of first connector pegs graft, it is convenient to peg graft, the subassembly equipment of being convenient for, and can adopt general public seat of connector and the female seat of connector, and the suitability is high, and is with low costs.

In the embodiments of fig. 4(a) to 4(d), the first flexible circuit board in the middle of at least one soft and hard composite board is used to realize the electrical connection of the two circuit boards. It can be understood that, in some embodiments, other connection structures that do not use the first flexible circuit board between the rigid-flexible composite boards may be used between the two circuit boards to achieve electrical connection, as shown in fig. 4(e) to 4(g), where any one of the two circuit boards may be a rigid-flexible composite board or may not be a rigid-flexible composite board, so that the adaptability is higher.

Referring to fig. 4(e), the connection structure between the two circuit boards includes two third flexible circuit board connectors 163c and a second flexible circuit board 167 connected between the two third flexible circuit board connectors 163 c. The two soft and hard composite boards 160 are respectively provided with a third flexible circuit board connector 163c, and the two third flexible circuit board connectors 163c are connected through a second flexible circuit board 167, so that the two soft and hard composite boards 160 are connected through the two third flexible circuit board connectors 163c and the second flexible circuit board 167. The two third flexible circuit board connectors 163c are convenient to assemble and high in connection stability, and the two third flexible circuit board connectors 163c are connected through the second flexible circuit board 167, so that signal loss and signal interference caused by wiring can be effectively reduced, and the response speed of components on the circuit board is increased.

Referring to fig. 4(f), the connection structure between the two circuit boards includes a third flexible circuit board 168 connected between the two rigid-flexible composite boards 160. The two soft and hard composite boards 160 are connected by pressing a third flexible circuit board 168 with an Anisotropic Conductive Film (ACF). Adopt this kind of connection structure simple structure, it is easy to connect, and connect through the third flexible line way board, can effectively solve the problem that the space that can put components and parts is little that leads to because of the vertical type connector, and can effectively avoid walking signal loss and the signal interference that the line brought, promote the response speed of components and parts on the circuit board.

Referring to fig. 4(g), the connection structure between the two circuit boards includes two second connector female seats 165b, two second connector male seats 166b, and a fourth flexible circuit board 169 connected between the two second connector male seats 166 b. The two soft and hard composite boards 160 are respectively provided with a second connector female socket 165b, and the two second connector male sockets 166b respectively connected with the second connector female socket 165b are connected through a fourth flexible circuit board 169. Through the public seat 166b of second connector with the female seat 165b of second connector pegs graft, and it is convenient to peg graft, the subassembly equipment of being convenient for, and can adopt general public seat of connector and the female seat of connector, and the suitability is high, and is with low costs. The fourth flexible circuit board 169 is arranged, so that signal loss and signal interference caused by wiring can be effectively avoided, and the response speed of components on the circuit board is improved. In some embodiments, the first circuit board 10, the second circuit board 12, and the third circuit board 14 may be located on different planes when connected two by two. The three circuit boards are located on different planes, so that the occupied horizontal area of the circuit board assembly is reduced, and the three-dimensional circuit board assembly is suitable for use scenes with small horizontal space, such as vehicle-mounted cameras. In a further embodiment, the first circuit board 10, the second circuit board 12 and the third circuit board 14 are located on planes that are not parallel to each other when connected in pairs. Therefore, respective wiring space cannot be influenced between the circuit boards, and the heat dissipation problem caused by too concentrated components on the circuit boards when the circuit boards are stacked can be effectively avoided.

Specifically, in some embodiments, the second circuit board 12 and the third circuit board 13 may be disposed on two adjacent sides of the first circuit board 10, and two of the circuit boards are disposed vertically or obliquely. Referring to fig. 5(a), for example, the first circuit board 10 includes a first side 100, a second side 102, a third side 103 and a fourth side 104 connected in sequence. The second circuit board 12 may be disposed on the first side 100, and the third circuit board 14 may be disposed on the second side 102. The first circuit board 10 comprises a first side 105 and a second side 106 facing away from the first side. The second circuit board 12 and the third circuit board 14 may be disposed on the same side of the first circuit board 10, e.g., both disposed on the second side 106. When the first circuit board 10, the second circuit board 12 and the third circuit board 14 are connected in pairs, the first circuit board 10, the second circuit board 12 and the third circuit board 14 are arranged in pairs and perpendicular to each other. At the moment, one side edge of each circuit board is adjacent to the other side edge of each circuit board, so that the connection distance between the two circuit boards is shortened, the signal loss is reduced, and the reaction speed of the chip is increased.

It is understood that in some implementations, at least two of the first circuit board 10, the second circuit board 12, and the third circuit board 14 are disposed at an angle to each other when connected in pairs. Referring to fig. 5(b), the second circuit board 12 is disposed on the first side 100 of the first circuit board 10, and the two circuit boards may be perpendicular to or inclined from each other, the third circuit board 14 is disposed on the second side 102 of the first circuit board 10, the second side 102 is adjacent to the first side 100, the two circuit boards are inclined from each other (i.e., the angle formed between the two circuit boards is greater than or less than 90 degrees), and the second circuit board 12 and the third circuit board 14 are disposed at an interval. The circuit board is obliquely arranged between the circuit boards, so that the height of the circuit board assembly is reduced.

It is understood that in other embodiments, the second circuit board 12 and the third circuit board 13 may be disposed on two opposite sides of the first circuit board 10. Referring to fig. 5(c), the second circuit board 12 is disposed on the first side 100, the second circuit board 12 is disposed on the third side 103, the second circuit board 12 and the third circuit board 14 are both disposed on the same side of the first circuit board 10, and when the first circuit board 10, the second circuit board 12 and the third circuit board 14 are connected in pairs, the first circuit board 10, the second circuit board 12 and the third circuit board 14 may be connected end to form a ring shape. The end-to-end ring is beneficial to reducing the overall size of the circuit board assembly and improving the structural stability of the circuit board assembly.

Fig. 6 and fig. 7 are schematic structural views of a circuit board assembly applied to a vehicle-mounted camera module according to a first embodiment of the present invention. The circuit board assembly 2 includes a power circuit board 20, a sensor circuit board 22, and an Image Signal Processor (ISP) circuit board 24. The power circuit board 20, the sensor circuit board 22 and the ISP circuit board 24 are all the above described RFPCBs.

The sensor circuit board 22 is electrically connected with the power circuit board 20 and the ISP circuit board 24 through a first FPC25 and a second FPC 26, respectively, and the power circuit board 20 is electrically connected with the ISP circuit board 24 through FPC gold fingers 27. Specifically, the FPC gold fingers 27 include a third FPC 270 extending from inside the ISP circuit board 24, gold fingers 272 disposed at an end of the third FPC 270, and an FPC connector 274 disposed on the power circuit board 20. The gold finger 272 can be inserted into the FPC connector 274 to thereby electrically connect the power supply circuit board 20 with the ISP circuit board 24.

The circuit board 20 carries a power IC 200 and a serializer 202, the sensor circuit board 22 carries an image processing IC 220 and a Fakra coaxial connector 222, and the ISP circuit board 24 carries an ISP IC 240. It is understood that other components are disposed on the power circuit board 20, the sensor circuit board 22, and the ISP circuit board 24, and will not be described in detail herein.

Referring to fig. 6, the communication signal transmission process includes: after the sensor IC 220 on the sensor circuit board 22 receives an external image signal, the image signal is transmitted from the sensor circuit board 22 to the ISP IC 240 on the ISP circuit board 24 through the second FPC 26 for preliminary image analysis, the analyzed image signal is transmitted from the ISP circuit board 24 to the serializer 202 on the power circuit board 20 through the third FPC 270, the gold finger 272 and the FPC connector 274, the serializer 202 converts the image signal into a Fakra coaxial signal, and then the Fakra coaxial connector 222 transmitted from the power circuit board 20 to the sensor circuit board 22 through the first FPC25 is connected with an external system; the serializer 202 receives a communication signal of an external system, and transmits the communication signal to the ISP IC 240 of the ISP circuit board 24 through the FPC connector 274, the gold finger 272 and the third FPC 270; communication signals of the ISP IC 240 on the ISP circuit board 24 are transmitted to the sensor IC 220 on the sensor circuit board 22 through the second FPC 26.

Referring to fig. 7, the transmission process of the power signal is as follows: the Fakra coaxial connector 222 on the sensor circuit board 22 transmits power supplied from an external system into the interior of the circuit board assembly 2 and transmits power to the power circuit board 20 through the first FPC 25. The power IC 200 on the power circuit board 20 includes a plurality of power sub-ICs such as a serializer power sub-circuit 200a, a sensor power sub-circuit 200b, and an image processor power sub-circuit 200 c. The serializer power supply sub-circuit 200a is connected to the serializer 202, and is configured to convert the power supply signal transmitted by the Fakra coaxial connector 222 into an operating voltage signal of the serializer 202 and transmit the operating voltage signal of the serializer 202 to the serializer 202. The sensor power supply sub-circuit 200b is connected to the sensor IC 220, and is configured to convert a power supply signal transmitted by the coaxial connector into an operating voltage signal of the sensor IC 220 and transmit the operating voltage signal of the sensor IC 220 to the sensor IC 220 on the sensor circuit board 20 through the first FPC 25. The image processor power supply sub-circuit 200c is connected to the ISP IC 240, and is configured to convert the power signal transmitted by the coaxial connector into an operating voltage signal of the ISP IC 240 and transmit the operating voltage signal of the ISP IC 240 to the ISP IC 240 on the ISP circuit board 24 through the FPC connector 274, the gold finger 272 and the third FPC 270. Thus, each circuit board of the circuit board assembly 2 can receive correct working voltage and work normally.

The power circuit board 20, the sensor circuit board 22 and the ISP circuit board 24 are in mutual connection and communication, communication signals and power signals can be directly transmitted between the circuit boards without being transferred through an intermediate board, and the problem of signal attenuation caused by overlong wiring can be effectively solved. Moreover, since the connection between the power circuit board 20 and the sensor circuit board 22 and the connection between the sensor circuit board 22 and the ISP circuit board 24 are realized by the built-in FPCs, the space for arranging the components of the power circuit board 20, the sensor circuit board 22 and the ISP circuit board 24 is not required to be occupied. In addition, because the components and parts on the circuit board are connected and wired on the inner layer of the soft and hard composite board (because the FPC is arranged on the inner layer of the soft and hard composite board), the impedance matching performance can be effectively controlled.

It is to be understood that the connection structure among the power circuit board 20, the sensor circuit board 22 and the ISP circuit board 24 is not limited to the embodiment shown in fig. 6 to 7, and for example, the connection structure shown in fig. 8(a) to 8(c) may be adopted, and any one of the connection structures shown in fig. 4(a) to 4(g) may be adopted between the circuit boards. Referring to fig. 8(a) to 8(c), connection structures and signal transmission diagrams among the power circuit board 20, the sensor circuit board 22 and the ISP circuit board 24 provided by several different embodiments are respectively shown.

The embodiment shown in fig. 8(a) is substantially the same as the embodiments shown in fig. 6 and 7, with the difference that: the positions of the power circuit board 20 and the ISP circuit board are interchanged, namely the sensor circuit board 22 is connected with the ISP circuit board 24 through a first FPC25, the sensor circuit board 22 is connected with the power circuit board 20 through a second FPC 26, and the power circuit board 20 is connected with the ISP circuit board 24 through FPC golden fingers 27. After the sensor IC 220 on the sensor circuit board 22 receives an external image signal, the image signal is transmitted from the sensor circuit board 22 to the ISP IC 240 on the ISP circuit board 24 through the first FPC25 for preliminary image analysis, the analyzed image signal is transmitted from the ISP circuit board 24 to the serializer 202 on the power circuit board 20 through the FPC connector 274, the gold finger 272 and the third FPC 270, the serializer 202 converts the image signal into a Fakra coaxial signal, and then the Fakra coaxial connector 222 transmitted from the power circuit board 20 to the sensor circuit board 22 through the second FPC 26 is connected with an external system. The transmission process of the power supply signal is as follows: the Fakra coaxial connector 222 on the sensor circuit board 22 passes power supplied by an external system into the interior of the circuit board assembly 2 and through the second FPC 26 to the power circuit board 20. The plurality of power ICs 200 on the power circuit board 20 convert power into operating voltages of the sensor IC 220, the ISP IC 240, and the serializer 202, respectively, the converted sensor power is transmitted to the sensor circuit board 20 through the second FPC 26, and the ISP power is transmitted to the ISP circuit board 24 through the third FPC 270, the gold finger 272, and the FPC connector 274. Thus, each circuit board of the circuit board assembly 2 can receive correct working voltage and work normally.

The embodiment shown in fig. 8(b) differs from the embodiments shown in fig. 6 and 7 in that: the Fakra coaxial connector 222 is disposed on the power circuit board 20. The power circuit board 20 is connected with the ISP circuit board 24 through a first FPC25, and is connected with the sensor circuit board 22 through a second FPC 26, and the sensor circuit board 22 and the ISP circuit board 24 are connected through FPC golden fingers 27. The communication signal transmission process comprises the following steps: after the sensor circuit board 22 receives an external image signal, the image signal is transmitted from the sensor circuit board 22 to the ISP IC 240 on the ISP circuit board 24 through the third FPC 270, the gold finger 272 and the FPC connector 274 for preliminary image analysis, the analyzed image signal is transmitted from the ISP circuit board 24 to the serializer 202 on the power circuit board 20 through the first FPC25, and the serializer 202 converts the image signal into a Fakra coaxial signal and connects the Fakra coaxial signal to an external system through the Fakra coaxial connector 222. The transmission process of the power supply signal is as follows: the Fakra coaxial connector 222 on the power circuit board 20 transmits power provided by an external system to enter the circuit board assembly 2, the power ICs 200 on the power circuit board 20 convert the power into working voltages of the sensor IC 220, the ISP IC 240 and the serializer 202, respectively, the converted sensor power is transmitted to the sensor circuit board 20 through the second FPC 26, and the ISP power is transmitted to the ISP circuit board 24 through the first FPC 25. Thus, each circuit board of the circuit board assembly 2 can receive correct working voltage and work normally.

The embodiment shown in fig. 8(c) differs from the embodiment shown in fig. 8(b) in that: the ISP circuit board 24 is interchanged with the sensor circuit board 22. The power circuit board 20 is connected with the sensor circuit board 22 through a first FPC25, connected with the ISP circuit board 24 through a second FPC 26, and the sensor circuit board 22 is connected with the ISP circuit board 24 through FPC golden fingers 27. The communication signal transmission process comprises the following steps: after the sensor circuit board 22 receives an external image signal, the image signal is transmitted from the sensor circuit board 22 to the ISP IC 240 on the ISP circuit board 24 through the third FPC 270, the gold finger 272 and the FPC connector 274 for preliminary image analysis, the analyzed image signal is transmitted from the ISP circuit board 24 to the serializer 202 on the power circuit board 20 through the second FPC 26, and the serializer 202 converts the image signal into a Fakra coaxial signal and connects the Fakra coaxial signal to an external system through the Fakra coaxial connector 222. The transmission process of the power supply signal is as follows: the Fakra coaxial connector 222 on the power circuit board 20 transmits power provided by an external system to enter the circuit board assembly 2, the power ICs 200 on the power circuit board 20 convert the power into working voltages of the sensor IC 220, the ISP IC 240 and the serializer 202, respectively, the converted sensor power is transmitted to the sensor circuit board 20 through the first FPC25, and the ISP power is transmitted to the ISP circuit board 24 through the second FPC 26. Thus, each circuit board of the circuit board assembly 2 can receive correct working voltage and work normally.

In the above embodiment, the power routing adopts a tree structure, i.e. the Fakra connector 222 to the power circuit board 20 are used as the backbone, and then the power of the plurality of power IC branches is output to the serializer 202, the sensor IC 220 and the ISP IC 240 respectively. This arrangement prevents high-speed video signals from the sensor IC 220 to the ISP IC 240 from being affected by power noise.

Fig. 9 is a schematic perspective view of a circuit board assembly in a first state according to an embodiment of the present invention. The power circuit board 20 and the ISP circuit board 24 are disposed on two adjacent sides of the sensor circuit board 22. Specifically, the sensor circuit board 22 includes a first side 221, a second side 222, a third side 223 and a fourth side 224 connected in sequence. The power circuit board 20 is connected to the first side 221 of the sensor circuit board 22 through an FPC, and the ISP circuit board 24 is connected to the second side 222 through an FPC. At this time, the power supply circuit board 20 and the ISP circuit board 24 are not connected.

Fig. 10 is a schematic perspective view of the circuit board assembly shown in fig. 9 in a second state. The sensor circuit board 22 includes a first side 225 on which the sensor IC 220 is disposed and a second side 226 facing away from the first side. The power circuit board 20 includes a first side 203 connected to the sensor circuit board 22 and a second side 204 connected to the first side 203. The FPC connector 274 is disposed at the second side 204 of the power circuit board 20. The ISP circuit board 24 includes a first side 241 connected to the sensor circuit board 22 and a second side 242 connected to the first side 241. The gold finger 272 is disposed on the second side 242 of the ISP circuit board 24. The power circuit board 20 is rotated to the second side 226 around the first FPC25, and the ISP circuit board 24 is rotated to the second side 226 around the second FPC 26, at this time, the power circuit board 20 and the ISP circuit board 24 are both located at the second side of the power circuit board 20, and the second side 204 of the power circuit board 20 is adjacent to the second side 242 of the ISP circuit board 24, so that the gold finger 272 is conveniently inserted into the FPC connector 274. At this time, the power circuit board 20, the sensor circuit board 22, and the ISP circuit board 24 are vertically arranged two by two. Thus, the components (including the power IC 200 and the serializer 202) on the power circuit board 20, the components (including the sensor IC 220) on the sensor circuit board 22, and the components (including the sensor IC 240) on the ISP circuit board 24 are dispersed at different positions, so that heat is not easily collected, the heat dissipation efficiency is effectively improved, and the reliability of the circuit board assembly 2 is improved.

In the embodiment shown in fig. 9 and 10, after the power circuit board 20, the sensor circuit board 22 and the ISP circuit board 24 are connected in pairs, an enclosure space 28 is formed by enclosure, and the chips of the power circuit board 20, the sensor circuit board 22 and the ISP circuit board 24 are disposed on a side away from the enclosure space. That is, the power IC 200 may be disposed on a side of the power circuit board 20 facing away from the sensor circuit board 22 and the ISP circuit board 24, the sensor IC 220 may be disposed on a side of the sensor circuit board 22 facing away from the power circuit board 20 and the ISP circuit board 24, and the ISP IC 240 may be disposed on a side of the ISP circuit board 24 facing away from the power circuit board 20 and the sensor circuit board 22. So set up and do benefit to better heat dissipation. It can be understood that, in other embodiments, when the number of the chips on the power circuit board 20, the sensor circuit board 22 and the ISP circuit board 24 is 2 or more, the chips can be dispersedly disposed on two sides of the circuit board, which is beneficial to dispersing heat generated by the chips, not easy to collect heat, and effectively improving the heat dissipation efficiency, thereby improving the reliability of the circuit board assembly 2.

Referring to fig. 11 to 13, fig. 11 is a schematic perspective view of a camera module according to an embodiment of the present invention, fig. 12 is an exploded schematic view of the camera module shown in fig. 11, and fig. 13 is a schematic perspective view of a second housing of the camera module shown in fig. 11. The camera module 4 comprises the circuit board assembly 2, the lens assembly 3 and the shell 40, the lens assembly 3 is arranged on the shell 40, the shell 40 is provided with a containing groove 400, and the circuit board assembly 2 is arranged in the containing groove 400.

The accommodating groove 400 includes a first accommodating groove 401 formed in a direction perpendicular to the axial direction of the lens assembly 3, a second accommodating groove 402 communicated with the first accommodating groove 401 and extending in a direction away from the first accommodating groove 401, and a third accommodating groove 403 communicated with both the first accommodating groove 401 and the second accommodating groove 402 and extending in a direction away from the first accommodating groove 401. The sensor circuit board 22 is accommodated in the first accommodation groove 401, and the sensor IC 220 is disposed on a side of the sensor circuit board 20 facing the lens assembly 3 and axially aligned with the lens assembly 3. The ISP circuit board 24 is disposed in the second receiving groove 402, and the power circuit board 20 is received in the third receiving groove 403. Since the first receiving groove 402, the second receiving groove 402 and the third receiving groove 403 are communicated with each other, when the circuit board assembly 2 is received in the receiving groove 400, the connecting structure between the circuit boards can be inserted between the receiving grooves, so that the circuit board assembly 2 can be conveniently received in the receiving groove 400. The first receiving groove 401 is perpendicular to the axial direction of the lens assembly 3, so that the surface of the sensor chip 220 is perpendicular to the axial direction, and is aligned with the lens assembly 3 in the axial direction, so as to sense an optical signal entering the lens assembly 3 and convert the optical signal into an image signal, the image signal is transmitted to the ISP IC 240 on the ISP circuit board 24, and the ISP IC 240 performs analysis processing on the image signal. The power circuit board 20, the sensor circuit board 22 and the ISP circuit board 24 are all disposed in different accommodating grooves, and heat generated by components on each circuit board is dispersed and dissipated through the outer walls of the accommodating grooves in which the components are disposed. The second receiving groove 402 and the third receiving groove 403 are both disposed at a side away from the lens assembly 3, and do not transfer heat generated by the components on the power circuit board 20 and the ISP circuit board 24 to the lens.

In some embodiments, the housing 40 includes a first housing 41 and a second housing 42 oppositely disposed along an axial direction of the lens 1, the lens assembly 3 is disposed on the first housing 41, and the circuit board assembly 2 is disposed on the second housing 42.

In the embodiment shown in fig. 11-13, the first housing 41 is removably connected to the second housing 42. The lens assembly positioned on the shell 40, the circuit board assembly 2 in the shell 40, components on the circuit board assembly and the like are convenient to assemble and overhaul. The first housing 41 is provided with a first positioning hole 410, the second housing 42 is provided with a second positioning hole 420 corresponding to the first positioning hole 410, and the first housing 41 and the second housing 42 are fixed by a first fixing structure 43 such as a bolt passing through the first positioning hole 410 and the second positioning hole 420. It is understood that in other embodiments, one side of the first housing 41 and the second housing 42 may be connected by any suitable other fixing structure, such as rotation connection through a rotating shaft, etc., fastening through a buckle, etc., screwing, etc. The present application is not limited to the specific connection manner of the first housing 41 and the second housing 42.

The first housing 41 is provided with a first through hole 411, and the lens assembly 3 is mounted in the first through hole 411. Specifically, an inner side wall of the first through hole 411 is provided with an inner thread, the lens component 3 is provided with an outer thread, and the lens component 3 is mounted in the first through hole 411 by screwing the outer thread and the inner thread.

The second housing 42 includes a first accommodating portion 421, a second accommodating portion 422, and a third accommodating portion 423. The first receiving portion 421 has the first receiving groove 401, the second receiving portion 422 has the second receiving groove 402, and the third receiving portion 423 has the third receiving groove 403. The first receiving portion 421, the second receiving portion 422 and the third receiving portion 423 are connected two by two to form a semi-enclosed structure. This arrangement facilitates reducing the volume of the second housing 42, thereby facilitating reducing the overall volume of the camera module 4.

The first accommodation portion 421 includes a fixing plate 4210 and a bottom plate 4212. The fixing plate 4210 is used for being fixedly connected with the sensor circuit board 22, so that the sensor circuit board 22 is carried on the fixing plate 4210. The bottom plate 4212 and the fixing plate 4210 are arranged at intervals, so that an interval space is formed between the bottom plate 4212 and the fixing plate 4210, a containing space is conveniently provided for components arranged on one side, away from the lens assembly 3, of the sensor circuit board 4120, and meanwhile heat dissipation of the sensor circuit board 22 is facilitated.

The sensor circuit board 22 is provided with a first fixing hole 228, the fixing plate 4210 is provided with a second fixing hole 42100 corresponding to the first fixing hole 221, and the sensor circuit board 22 is fixed to the fixing plate 4210 by a fixing device 23 such as a bolt passing through the first fixing hole 221 and the second fixing hole 42100. The fixing plate 4210 and the bottom plate 4212 are further provided with a second through hole 42102, and the Fakara coaxial connector 222 can extend out of the first accommodating part 421 through the second through hole 42102 so as to be connected with other components. It is understood that the sensor circuit board 22 may also be fixed on the fixing plate 4210 by any other suitable fixing means, such as adhesive, snap, etc., and is not limited herein.

Further, the camera module 4 further includes a connection line 5, an end of the connection line 5 is provided with a connection portion 50 that is connected to the Fakara coaxial connector 222 on the sensor circuit board 22 in a matching manner, and the connection portion 50 can be fixed on the base plate 4212 by a fixing structure such as a screw. The camera module can be connected with other modules through the connecting line 5, and the enclosure space 424 of the semi-enclosed structure formed by the first accommodating portion 421, the second accommodating portion 422 and the third accommodating portion 423 can provide a lead-out space for the connecting line 5, so that the arrangement structure is simple and is beneficial to protecting the connecting portion 50 from unnecessary damage.

Fig. 14 is a schematic structural diagram of an electronic device according to an embodiment of the invention. The electronic device 6 comprises the camera module 4 and a control unit 7. The control unit 7 is in communication connection with the camera module 4 and is used for controlling the operation of the camera module 4. The Control Unit 7 may be a Microprocessor (MCU) or a Digital Signal Processor (DSP) or other device with data processing function. The electronic device 6 may be a camera, a mobile phone, an automobile, or the like.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (16)

1. A circuit board assembly comprises a first circuit board, a second circuit board and a third circuit board, and is characterized in that any two of the first circuit board, the second circuit board and the third circuit board are directly and electrically connected through a flexible circuit board.

2. The circuit board assembly of claim 1, wherein the first circuit board, the second circuit board, and the third circuit board are all soft and hard composite boards, and the soft and hard composite boards comprise a first flexible circuit board and two hard circuit boards disposed on two sides of the first flexible circuit board.

3. The circuit board assembly of claim 2, wherein the two rigid-flexible composite boards are connected by one of the following connection structures: the first flexible circuit boards in the two soft and hard composite boards are mutually connected to realize the electric connection of the two soft and hard composite boards; or the first flexible circuit board in the middle of one of the soft and hard composite boards is electrically connected with the first flexible circuit board connector arranged on the other soft and hard composite board to realize the electrical connection of the two soft and hard composite boards; or the two soft and hard composite boards are electrically connected by connecting a golden finger on a first flexible circuit board connected to the middle of one soft and hard composite board with a second soft and hard board connector arranged on the other soft and hard composite board; or the first flexible circuit board in the middle of one of the soft and hard composite boards, the first connector male seat arranged at the far end part of the first flexible circuit board and the first connector female seat arranged on the other soft and hard composite board are connected to realize the electric connection of the two soft and hard composite boards.

4. The circuit board assembly of claim 1, wherein any two of the first circuit board, the second circuit board, and the third circuit board are connected by one of the following connection structures: two third flexible circuit board connectors respectively arranged on the two circuit boards are connected with a second flexible circuit board connected between the two third flexible circuit board connectors to realize the electric connection of the two circuit boards; or the two circuit boards are electrically connected through a third flexible circuit board which is respectively pressed on the two circuit boards by an anisotropic conductive adhesive film; or the second connector female seat and the fourth flexible circuit board are respectively arranged on the two circuit boards, and the second connector male seats are arranged at two ends of the fourth flexible circuit board, and the two circuit boards are electrically connected by connecting the second connector male seats with the second connector female seats.

5. The circuit board assembly of claim 1, wherein the first circuit board, the second circuit board, and the third circuit board are located on the same plane or different planes when connected two by two.

6. The circuit board assembly of claim 5, wherein the second circuit board and the third circuit board are respectively disposed on two adjacent sides of the first circuit board, and any two of the first circuit board, the second circuit board and the third circuit board are disposed obliquely or perpendicularly to each other.

7. The circuit board assembly of claim 5, wherein the second circuit board and the third circuit board are respectively disposed on two opposite sides of the first circuit board, and the first circuit board, the second circuit board and the third circuit board are connected end to end in pairs.

8. A camera module comprising a lens assembly, wherein the camera module comprises a housing and the circuit board assembly of any one of claims 1 to 7, the lens assembly is disposed on the housing, a receiving groove is disposed in the housing, and the circuit board assembly is disposed in the receiving groove.

9. The camera module of claim 8, wherein the first circuit board is a power circuit board, the second circuit board is a sensor circuit board, the third circuit board is an image signal processing circuit board, the sensor circuit board is provided with a sensor integrated circuit, the power circuit board is provided with a power integrated circuit and a serializer, the image signal processing circuit board is provided with an image signal processing integrated circuit, the sensor circuit board or the power circuit board is provided with a coaxial connector, the coaxial connector directly transmits a power signal to the power integrated circuit on the power circuit board, and the power integrated circuit respectively provides power to the serializer, the sensor integrated circuit and the image signal processing integrated circuit.

10. The camera module of claim 9, wherein the power supply ic comprises a serializer power supply sub-circuit, a sensor power supply sub-circuit and an image processor power supply sub-circuit, the serializer power supply sub-circuit is connected to the serializer for converting the power supply signal transmitted by the coaxial connector into the operating voltage signal of the serializer and transmitting the operating voltage signal of the serializer to the serializer, the sensor power supply sub-circuit is connected to the sensor ic for converting the power supply signal transmitted by the coaxial connector into the operating voltage signal of the sensor ic and transmitting the operating voltage signal of the sensor ic to the sensor ic, and the image processor power supply sub-circuit is connected to the image signal processing ic for converting the power supply signal transmitted by the coaxial connector into the operating voltage signal of the image signal processing ic And the working voltage signal of the image signal processing integrated circuit is transmitted to the image signal processing integrated circuit.

11. The camera module of claim 9, wherein the power circuit board, the sensor circuit board, and the image signal processing circuit board are disposed on different and non-parallel planes, the power circuit board and the image signal processing circuit board are disposed on a same side of the sensor circuit board, the sensor ic is disposed on a side of the sensor circuit board away from the power circuit board and the image signal processing circuit board, the power ic is disposed on a side of the power circuit board away from the sensor circuit board and the image signal processing circuit board, and the image signal processing ic is disposed on a side of the image signal processing circuit board away from the power circuit board and the sensor circuit board.

12. The camera module of claim 7, wherein the housing comprises a first housing for mounting the lens assembly and a second housing for mounting the receiving cavity, and the first housing and the second housing are detachably or rotatably connected.

13. The camera module of claim 12, wherein the second housing comprises a first receiving portion, a second receiving portion and a third receiving portion connected to each other, the second receiving portion and the third receiving portion respectively extend from two adjacent sides of the first receiving portion toward a direction away from the camera module, the receiving slots include a first receiving slot disposed in the first receiving portion for receiving the sensor circuit board, a second receiving slot disposed in the second receiving portion for receiving the power circuit board, and a third receiving slot disposed in the third receiving portion for receiving the image signal processing circuit board, and the first receiving slot, the second receiving slot and the third receiving slot are connected in pairs.

14. The camera module of claim 13, wherein the first receiving portion comprises a fixing plate for fixing the sensor circuit board and a bottom plate spaced apart from the fixing plate, the fixing plate and the bottom plate are both provided with through holes, and the coaxial connector of the sensor circuit board extends out of the first receiving portion through the through holes of the fixing plate and the bottom plate.

15. The camera module of claim 14, wherein the first receiving portion, the second receiving portion and the third receiving portion are vertically disposed in pairs to form a semi-surrounding structure, the semi-surrounding structure is surrounded to form a surrounding space, the camera module further comprises a connecting wire, a connecting portion connected to the coaxial connector is disposed at an end of the connecting wire, and the connecting portion is disposed in the surrounding space.

16. An electronic device comprising the camera module of any one of claims 8-15.

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