CN113097104A - Production equipment and production method of square substrate - Google Patents

Production equipment and production method of square substrate Download PDF

Info

Publication number
CN113097104A
CN113097104A CN202110319188.6A CN202110319188A CN113097104A CN 113097104 A CN113097104 A CN 113097104A CN 202110319188 A CN202110319188 A CN 202110319188A CN 113097104 A CN113097104 A CN 113097104A
Authority
CN
China
Prior art keywords
circular substrate
substrate
glue
vacuum
circular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202110319188.6A
Other languages
Chinese (zh)
Other versions
CN113097104B (en
Inventor
冀然
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Germanlitho Co ltd
Original Assignee
Germanlitho Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Germanlitho Co ltd filed Critical Germanlitho Co ltd
Priority to CN202110319188.6A priority Critical patent/CN113097104B/en
Publication of CN113097104A publication Critical patent/CN113097104A/en
Application granted granted Critical
Publication of CN113097104B publication Critical patent/CN113097104B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention provides a production device of a square substrate, which comprises: a vacuum chuck for fixing circular substrate, vacuum chuck passes through its rotation of motor drive, is provided with the glue dripping device in the vacuum chuck top to glue dripping to circular substrate through the glue dripping device, still including the clamping device who is used for centre gripping circular substrate and the lobe of a leaf box that is used for storing the circular substrate of spin-coating glue solution, be connected with turning device between clamping device and the lobe of a leaf box, in order to put into the lobe of a leaf box with its upset behind the circular substrate of clamping device centre gripping spin-coating glue solution, the lobe of a leaf box is stretched out at the edge of circular substrate, is provided with the laser cutter below the lobe of a leaf box to cut into square substrate with the circular substrate in the lobe of a leaf box. A method of producing a square substrate comprising the steps of: s1, fixing the circular substrate; s2, spin coating glue solution; s3, clamping and storing; and S4, cutting. The invention has simple structure and convenient operation, and can solve the problem of uneven glue body on the square substrate.

Description

Production equipment and production method of square substrate
Technical Field
The invention belongs to the field of nano-imprinting equipment, and particularly relates to production equipment and a production method of a square substrate.
Background
The nanoimprint technology is a technology for transferring a micro-nano structure on a template to a material to be processed through photoresist assistance, the most common photoresist coating mode at present is spin coating, wherein the spin coating refers to dripping various glue solutions on a circular substrate rotating at a high speed, and the glue solutions dripped on the circular substrate are uniformly coated on the circular substrate by utilizing centrifugal force. Due to the influence of centrifugal force, most of common round substrates are round, and the phenomenon of uneven glue solution spin coating can occur in the spin coating process of square substrates, so that the problem that the uneven glue solution on the square substrates needs to be solved at present is met.
Disclosure of Invention
The invention provides production equipment and a production method of a square substrate aiming at the technical problems, which have the advantages of simple structure and convenient operation and can solve the problem of uneven glue body on the square substrate.
In order to achieve the purpose, the invention adopts the technical scheme that: a production apparatus for a square substrate, comprising: a vacuum chuck for fixing circular substrate, vacuum chuck passes through its rotation of motor drive, is provided with the glue dripping device in the vacuum chuck top to glue dripping to circular substrate through the glue dripping device, still including the clamping device who is used for centre gripping circular substrate and the lobe of a leaf box that is used for storing the circular substrate of spin-coating glue solution, be connected with turning device between clamping device and the lobe of a leaf box, in order to put into the lobe of a leaf box with its upset behind the circular substrate of clamping device centre gripping spin-coating glue solution, the lobe of a leaf box is stretched out at the edge of circular substrate, is provided with the laser cutter below the lobe of a leaf box to cut into square substrate with the circular substrate in the lobe of a leaf box.
In some embodiments of the invention, the circular substrate is circular, and the diameter of the circular substrate is greater than the diameter of the vacuum chuck.
In some embodiments of the present invention, the glue dripping device includes a supporting arm capable of extending and retracting vertically, a glue nozzle disposed on the supporting arm, and a glue bottle connected with the glue nozzle through a glue tube.
In some embodiments of the invention, the clamping device comprises two rotatable semicircular clamping portions, the two semicircular clamping portions are arranged oppositely, and a magnet is arranged at the end of the free end of each semicircular clamping portion, so that when the two semicircular clamping portions rotate oppositely, the magnets are abutted and magnetically connected.
In some embodiments of the invention, a vacuum groove is arranged at the upper end of the semicircular clamping part, and a vacuum hole is arranged in the vacuum groove and is connected with a vacuum pump through a vacuum pipe.
In some embodiments of the present invention, the upper end of the semicircular clamping portion corresponds to the lower end of the portion of the circular substrate extending out of the vacuum chuck, and a vertically arranged telescopic rod is connected to the semicircular clamping portion and is connected to the turnover device.
In some embodiments of the invention, the cassette is of a V-shaped configuration.
In some embodiments of the invention, the turnover device comprises a first support rod connected with the clamping device and a second support rod connected with the lobe box, and a servo rotating motor connected between the first support rod and the second support rod.
A method of producing a square substrate comprising the steps of:
s1, fixing the circular substrate;
negative pressure generated on the upper surface of the vacuum chuck fixes a circular substrate, and the size of the circular substrate is larger than that of the vacuum chuck, so that part of the circular substrate is positioned outside the vacuum chuck;
s2 spin coating glue solution
The glue dripping device drips the impression glue on the upper surface of the circular substrate, and the vacuum chuck is driven to rotate by the motor, so that the impression glue on the upper surface of the circular substrate is uniformly coated in a spinning mode;
s3, clamping and storing
The two semicircular clamping parts rotate oppositely, the semicircular clamping part is positioned at the lower end of the circular substrate, the two semicircular clamping parts are formed into a whole by abutting and generating magnetic force connection between magnets, the semicircular clamping part moves upwards to abut the upper surface of the semicircular clamping part against the lower surface of the circular substrate, the vacuum groove on the semicircular clamping part generates vacuum adsorption on the circular substrate, the vacuum sucker releases the circular substrate, the circular substrate is taken down, the overturning device drives the clamping device to overturn for 180 degrees, and the back of the circular substrate is placed upwards in the splitting box;
s4, cutting
And starting a laser cutter to cut a square with a set side length on the round substrate.
In some embodiments of the present invention, in step S4, the two parallel sides of the circular substrate are cut first.
Compared with the prior art, the invention has the advantages and positive effects that: through the circular substrate that fixed dimension is greater than vacuum chuck on vacuum chuck to spin coating glue solution on circular substrate, make the glue solution on the circular substrate even, through clamping device's fixed, avoid circular substrate to warp and pollute, and then put into the lobe of a leaf box with the substrate through turning device, cut circular substrate into square substrate through laser cutting ware at last, guaranteed the homogeneity of final square substrate on the colloid, its mode of setting is simple, and easily the operation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a top view of the present invention;
fig. 2 is a side view of the present invention.
In the above figures: 1. a vacuum chuck; 11. a vacuum tank; 12. a vacuum hole; 13. a motor; 2. a circular substrate; 3. a glue dripping device; 31. a support arm; 32. a glue nozzle; 33. a hose; 34. a glue bottle; 4. a clamping device; 41. a semicircular clamping portion; 42. a semicircular clamping portion; 43. a motor; 44. a motor; 45. a magnet; 46. a vacuum tank; 47. a vacuum hole; 48. a telescopic rod; 5. a cassette for splitting; 6. a turning device; 61. a first support bar; 62. a second support bar; 63. a servo rotating motor; 7. and (3) laser cutter.
Detailed Description
The invention is described in detail below by way of exemplary embodiments. It should be understood, however, that elements, structures and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
A production apparatus for a square substrate, see fig. 1 to 2, comprising:
the vacuum chuck comprises a vacuum chuck 1, wherein a vacuum groove 11 is formed in the upper surface of the vacuum chuck 1, a vacuum hole 12 is formed in the vacuum groove 11, the vacuum hole 12 is connected with a vacuum pump through a vacuum tube, in the embodiment, the vacuum tube and the vacuum pump are not shown in the figure, a circular substrate 2 is fixed on the upper surface of the vacuum chuck 1 by generating negative pressure in the vacuum groove 11, a motor 13 is arranged below the vacuum chuck 1, the vacuum chuck 1 is driven to rotate through the motor 13, and a glue dripping device 3 is arranged above the vacuum chuck 1 so as to drip glue to the circular substrate 2 through the glue dripping device 3;
the automatic spin-coating device is characterized by further comprising a clamping device 4 for clamping the circular substrate 2 and a splitting box 5 for storing the circular substrate 2 spin-coated with glue, wherein a turnover device 6 is connected between the clamping device 4 and the splitting box 5, so that the circular substrate 6 spin-coated with glue is placed in the splitting box 5 in a turnover mode after being clamped by the clamping device 4, the splitting box 5 is of a V-shaped structure, the edge of the circular substrate 2 extends out of the splitting box 5, and a laser cutter 7 is arranged below the splitting box 5 to cut the circular substrate 2 in the splitting box 5 into square substrates;
through the circular substrate 2 that fixed dimension is greater than vacuum chuck 1 on vacuum chuck 1, and spin coating glue solution on circular substrate 2, make circular substrate 2 glue solution even, through clamping device 4's fixed, avoid circular substrate 2 to warp and pollute, and then put into the film splitting box 5 with circular substrate 2 through turning device 6 in, cut into square substrate with circular substrate 2 through laser cutting ware 7 at last, the homogeneity of last square substrate on the colloid has been guaranteed, its mode of setting is simple, and easy to operate.
In this embodiment, the circular substrate 2 is provided in a circular shape, and the diameter of the circular substrate 2 is larger than that of the vacuum chuck 1 so that the partially circular substrate 2 is positioned outside the vacuum chuck 1.
In this embodiment, the glue dripping device 3 includes a supporting arm 31 capable of extending and retracting vertically, a glue nozzle 32 disposed on the supporting arm 31, and a glue bottle 34 connected with the glue nozzle 32 through a glue tube 33, and the supporting arm 31 may be an extension rod.
In this embodiment, the clamping device 4 comprises two rotatable semicircular clamping portions 41 and 42, the rotation of the two semicircular clamping portions 41 and 42 is controlled by motors 43 and 44, the two semicircular clamping portions 41 and 42 are arranged in opposite directions, and a magnet 45 is arranged at the free end of the semicircular clamping portions 41 and 42, so that when the two semicircular clamping portions 41 and 42 rotate in opposite directions, the magnets 45 are abutted and magnetically connected to form a ring structure.
Further, the semicircular clamping portions 41 and 42 are provided at upper ends thereof with vacuum grooves 46, vacuum holes 47 are provided in the vacuum grooves 46, and the vacuum holes 47 are connected with a vacuum pump through vacuum tubes, which are not shown in the figure in this embodiment.
Furthermore, the upper ends of the semicircular clamping parts 41 and 42 correspond to the lower end of the part of the circular substrate 2 extending out of the vacuum chuck 1, and the semicircular clamping parts 41 and 42 are connected with vertically arranged telescopic rods 48, the telescopic rods 48 are connected with a turnover device, and the semicircular clamping parts 41 and 42 can be controlled to vertically move through the telescopic rods 48.
In the present embodiment, the turning device 6 comprises a first support rod 61 connected with the clamping device 4, a second support rod 62 connected with the lobe box, and a servo rotating motor 63 connected between the first support rod 61 and the second support rod 62.
Another object of the present invention is to provide a method for producing a square substrate with uniform gel, the method comprising the steps of:
s1, fixing the circular substrate;
the circular substrate 2 is fixed by negative pressure generated in a vacuum groove 11 on the upper surface of the vacuum chuck 1, and the size of the circular substrate 2 is larger than that of the vacuum chuck 1, so that part of the circular substrate 2 is positioned outside the vacuum chuck 1;
s2 spin coating glue solution
The glue dripping device 3 drips the imprinting glue on the upper surface of the circular substrate 2 on the vacuum chuck 1, the vacuum chuck 1 is driven to rotate through the motor 13, and the imprinting glue on the upper surface of the circular substrate 2 is uniformly coated in a spinning mode under the action of centrifugal force;
s3, clamping and storing
The two semicircular clamping parts 41 and 42 are driven by motors 43 and 44 to rotate oppositely, the semicircular clamping parts 41 and 42 are positioned at the lower end of the circular substrate 2, the two semicircular clamping parts 41 and 42 are abutted through a magnet 45 and generate magnetic connection, so that the two semicircular clamping parts 41 and 42 form a whole, the semicircular clamping parts 41 and 42 move upwards, the upper surfaces of the semicircular clamping parts 41 and 42 are abutted with the lower surface of the circular substrate 2, the circular substrate 2 is adsorbed in a vacuum mode through a vacuum groove 46 on the semicircular clamping parts 41 and 42, the vacuum chuck 1 releases the circular substrate 2, the semicircular clamping parts 41 and 42 take down the circular substrate 2, a first supporting arm 61 of the turnover device 6 drives the clamping device 4 to turn over 180 degrees towards the direction of the cracking box 5, and the back of the circular substrate 2 faces upwards and is placed in the cracking box 5;
s4, cutting
And starting the laser cutter 7, cutting a square with a set side length on the circular substrate 2, and further cutting two parallel sides on the circular substrate 2 firstly during cutting so as to facilitate the clamping of a tool.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (10)

1. An apparatus for producing a square substrate, comprising: a vacuum chuck for fixing circular substrate, vacuum chuck passes through its rotation of motor drive, is provided with the glue dripping device in the vacuum chuck top to glue dripping to circular substrate through the glue dripping device, still including the clamping device who is used for centre gripping circular substrate and the lobe of a leaf box that is used for storing the circular substrate of spin-coating glue solution, be connected with turning device between clamping device and the lobe of a leaf box, in order to put into the lobe of a leaf box with its upset behind the circular substrate of clamping device centre gripping spin-coating glue solution, the lobe of a leaf box is stretched out at the edge of circular substrate, is provided with the laser cutter below the lobe of a leaf box to cut into square substrate with the circular substrate in the lobe of a leaf box.
2. The production apparatus of a square substrate according to claim 1, wherein: the circular substrate is circular, and the diameter of the circular substrate is larger than that of the vacuum chuck.
3. The production apparatus of a square substrate according to claim 1, wherein: the glue dripping device comprises a supporting arm which can be vertically stretched, a glue nozzle arranged on the supporting arm, and a glue bottle connected with the glue nozzle through a glue tube.
4. The production apparatus of a square substrate according to claim 1, wherein: the clamping device comprises two rotatable semicircular clamping parts which are arranged in opposite directions, and magnets are arranged at the free ends of the semicircular clamping parts so as to abut against each other and be connected through magnetic force when the two semicircular clamping parts rotate in opposite directions.
5. The production apparatus of a square substrate according to claim 4, wherein: the vacuum groove is arranged at the upper end of the semicircular clamping part, and a vacuum hole is arranged in the vacuum groove and connected with a vacuum pump through a vacuum tube.
6. The production apparatus of a square substrate according to claim 4, wherein: the upper end of the semicircular clamping part corresponds to the lower end of the part of the circular substrate extending out of the vacuum chuck, a vertically arranged telescopic rod is connected to the semicircular clamping part, and the telescopic rod is connected with the turnover device.
7. The production apparatus of a square substrate according to claim 1, wherein: the splitting box is of a V-shaped structure.
8. The production apparatus of a square substrate according to claim 1, wherein: the turnover device comprises a first supporting rod connected with the clamping device and a second supporting rod connected with the lobe box, and the first supporting rod and the second supporting rod are connected through a servo rotating motor.
9. A method for producing a square substrate using the production apparatus as set forth in any one of claims 1 to 8, characterized in that: the method comprises the following steps:
s1, fixing the circular substrate;
negative pressure generated on the upper surface of the vacuum chuck fixes a circular substrate, and the size of the circular substrate is larger than that of the vacuum chuck, so that part of the circular substrate is positioned outside the vacuum chuck;
s2 spin coating glue solution
The glue dripping device drips the impression glue on the upper surface of the circular substrate, and the vacuum chuck is driven to rotate by the motor, so that the impression glue on the upper surface of the circular substrate is uniformly coated in a spinning mode;
s3, clamping and storing
The two semicircular clamping parts rotate oppositely, the semicircular clamping part is positioned at the lower end of the circular substrate, the two semicircular clamping parts are formed into a whole by abutting and generating magnetic force connection between magnets, the semicircular clamping part moves upwards to abut the upper surface of the semicircular clamping part against the lower surface of the circular substrate, the vacuum groove on the semicircular clamping part generates vacuum adsorption on the circular substrate, the vacuum sucker releases the circular substrate, the circular substrate is taken down, the overturning device drives the clamping device to overturn for 180 degrees, and the back of the circular substrate is placed upwards in the splitting box;
s4, cutting
And starting a laser cutter to cut a square with a set side length on the round substrate.
10. The method for producing a square substrate according to claim 9, wherein: in step S4, the two parallel sides of the circular substrate are cut first.
CN202110319188.6A 2021-03-25 2021-03-25 Production equipment and production method of square substrate Active CN113097104B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110319188.6A CN113097104B (en) 2021-03-25 2021-03-25 Production equipment and production method of square substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110319188.6A CN113097104B (en) 2021-03-25 2021-03-25 Production equipment and production method of square substrate

Publications (2)

Publication Number Publication Date
CN113097104A true CN113097104A (en) 2021-07-09
CN113097104B CN113097104B (en) 2022-08-02

Family

ID=76669566

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110319188.6A Active CN113097104B (en) 2021-03-25 2021-03-25 Production equipment and production method of square substrate

Country Status (1)

Country Link
CN (1) CN113097104B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114200777A (en) * 2021-12-21 2022-03-18 中国科学院光电技术研究所 Square substrate clamping device

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3765763A (en) * 1969-07-29 1973-10-16 Texas Instruments Inc Automatic slice processing
JPS61220352A (en) * 1985-03-26 1986-09-30 Seiei Kosan Kk Wafer loader
EP0228973A1 (en) * 1986-01-06 1987-07-15 CENTRE STEPHANOIS DE RECHERCHES MECANIQUES HYDROMECANIQUE ET FROTTEMENT Société anonyme Process and means for seizing and conveying silicon wafers
US4875434A (en) * 1987-04-02 1989-10-24 Mitsubishi Denki Kabushiki Kaisha Apparatus for coating a substrate with a coating material
JPH03227007A (en) * 1990-05-12 1991-10-08 Taiyo Yuden Co Ltd Spin coating
JPH0669115A (en) * 1991-10-31 1994-03-11 Fujitsu Ltd Spin coating method
JPH07147311A (en) * 1993-11-24 1995-06-06 Tokyo Electron Ltd Transfer arm
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
US6232247B1 (en) * 1999-09-01 2001-05-15 Micron Technology, Inc. Substrate coating apparatus and semiconductor processing method of improving uniformity of liquid deposition
US20030159528A1 (en) * 2002-02-25 2003-08-28 Samsung Electronics Apparatus and method for wafer backside inspection
US6866887B1 (en) * 2003-10-14 2005-03-15 Photon Dynamics, Inc. Method for manufacturing PDLC-based electro-optic modulator using spin coating
US20070037321A1 (en) * 2005-08-10 2007-02-15 Tomoko Higashino Semiconductor device and a manufacturing method of the same
CN201030353Y (en) * 2007-04-30 2008-03-05 沈阳芯源微电子设备有限公司 Square sheet rotating gumming mechanism
CN103224323A (en) * 2012-01-31 2013-07-31 株式会社Tes Substrate breaking system and substrate breaking method
US20160052193A1 (en) * 2014-08-19 2016-02-25 Shin-Etsu Chemical Co., Ltd. Rectangular substrate for imprint lithography and making method
CN111001544A (en) * 2019-12-31 2020-04-14 青岛天仁微纳科技有限责任公司 Uniform spin coating equipment for nano-imprinting
CN210428085U (en) * 2019-10-30 2020-04-28 杭州美迪凯光电科技股份有限公司 Structure of round slice rotary-coating square slice

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3765763A (en) * 1969-07-29 1973-10-16 Texas Instruments Inc Automatic slice processing
JPS61220352A (en) * 1985-03-26 1986-09-30 Seiei Kosan Kk Wafer loader
EP0228973A1 (en) * 1986-01-06 1987-07-15 CENTRE STEPHANOIS DE RECHERCHES MECANIQUES HYDROMECANIQUE ET FROTTEMENT Société anonyme Process and means for seizing and conveying silicon wafers
US4875434A (en) * 1987-04-02 1989-10-24 Mitsubishi Denki Kabushiki Kaisha Apparatus for coating a substrate with a coating material
JPH03227007A (en) * 1990-05-12 1991-10-08 Taiyo Yuden Co Ltd Spin coating
JPH0669115A (en) * 1991-10-31 1994-03-11 Fujitsu Ltd Spin coating method
JPH07147311A (en) * 1993-11-24 1995-06-06 Tokyo Electron Ltd Transfer arm
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
US6232247B1 (en) * 1999-09-01 2001-05-15 Micron Technology, Inc. Substrate coating apparatus and semiconductor processing method of improving uniformity of liquid deposition
US20030159528A1 (en) * 2002-02-25 2003-08-28 Samsung Electronics Apparatus and method for wafer backside inspection
US6866887B1 (en) * 2003-10-14 2005-03-15 Photon Dynamics, Inc. Method for manufacturing PDLC-based electro-optic modulator using spin coating
US20070037321A1 (en) * 2005-08-10 2007-02-15 Tomoko Higashino Semiconductor device and a manufacturing method of the same
CN201030353Y (en) * 2007-04-30 2008-03-05 沈阳芯源微电子设备有限公司 Square sheet rotating gumming mechanism
CN103224323A (en) * 2012-01-31 2013-07-31 株式会社Tes Substrate breaking system and substrate breaking method
US20160052193A1 (en) * 2014-08-19 2016-02-25 Shin-Etsu Chemical Co., Ltd. Rectangular substrate for imprint lithography and making method
CN210428085U (en) * 2019-10-30 2020-04-28 杭州美迪凯光电科技股份有限公司 Structure of round slice rotary-coating square slice
CN111001544A (en) * 2019-12-31 2020-04-14 青岛天仁微纳科技有限责任公司 Uniform spin coating equipment for nano-imprinting

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114200777A (en) * 2021-12-21 2022-03-18 中国科学院光电技术研究所 Square substrate clamping device
CN114200777B (en) * 2021-12-21 2023-06-13 中国科学院光电技术研究所 Square substrate clamping device

Also Published As

Publication number Publication date
CN113097104B (en) 2022-08-02

Similar Documents

Publication Publication Date Title
CN113097104B (en) Production equipment and production method of square substrate
CN111001544A (en) Uniform spin coating equipment for nano-imprinting
CN104985466A (en) Supporting rotating table for mechanical machining of thin-wall workpiece
CN213136449U (en) A positioner for parts machining
CN207385857U (en) A kind of special-shaped glass positions lifting body
CN207873938U (en) A kind of auxiliary reason ring mechanism of piston ring honing device
CN108082621B (en) Carrier for winding guide pipe
CN107475679B (en) Holding-and-aligning device and method
CN209578899U (en) A kind of vacuum fixture of numerically controlled lathe
CN219131134U (en) Working platform for laser marking machine
CN216655203U (en) Coating processing device for semiconductor clamping cross rod
CN107400861B (en) Automatic change continuous type resistance evaporation coating device
CN221288979U (en) Clamping mechanism and cleaning device
CN217747902U (en) Positioning device for liquid crystal display dispensing device
CN217288901U (en) Clamping and rotating device for steel pipe surface treatment
CN206151966U (en) Cerini dialyser cerini rotary positioning device
CN218502517U (en) Glass processing injecting glue machine
CN220362168U (en) Lithium ion battery production fixture
CN211515027U (en) Ink coating equipment for side edge of ultra-soft lens
CN210449698U (en) Micro-component coating bracket
CN220826382U (en) Alignment tool
CN113075860B (en) Desktop type nano imprinting equipment and imprinting method thereof
CN215757589U (en) Rotary clamp for coating long pipe parts
CN213592417U (en) Be used for mechanical manufacturing pipe mouth grinding device
CN215402630U (en) Carrying device for petroleum pipeline installation

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant