CN113093891A - Automatic temperature-sensing and heat-dissipating equipment for case of computer software and hardware - Google Patents
Automatic temperature-sensing and heat-dissipating equipment for case of computer software and hardware Download PDFInfo
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- CN113093891A CN113093891A CN202110441505.1A CN202110441505A CN113093891A CN 113093891 A CN113093891 A CN 113093891A CN 202110441505 A CN202110441505 A CN 202110441505A CN 113093891 A CN113093891 A CN 113093891A
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- heat dissipation
- sensing
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- heat
- hardware
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of computer software and hardware, and discloses automatic temperature-sensing heat dissipation equipment for a case of the computer software and hardware. Will take place anticlockwise deflection to the rotor plate in the driving disc through-hole through the rotary rod, the inside baffle jack-up of heat dissipation pipeline is followed to the push rod, because the heat dissipation pipeline is narrow structure under the width, after baffle rebound, the heat dissipation pipeline will switch on and give quick-witted case heat dissipation equipment main part automatic cooling, after quick-witted case heat dissipation equipment main part temperature recovery is the normal atmospheric temperature, the gasbag reconversion, the initial position is recovered to the effect that the rotor plate does not receive the force, thereby the baffle blocks up the heat dissipation pipeline under the effect of self gravity once more, after having reached the temperature rise, quick-witted case automatic radiating effect.
Description
Technical Field
The invention relates to the technical field of computer software and hardware, in particular to an automatic temperature-sensing and heat-dissipating device for a case of the computer software and hardware.
Background
The computer is commonly called as computer, is a modern electronic computing machine for high-speed computation, can perform numerical computation and logic computation, and also has the function of storing and memorizing. The modern intelligent electronic equipment can run according to a program and automatically process mass data at a high speed, and consists of a hardware system and a software system. The case is a tool for storing software and hardware of the computer.
In the running process of a computer, the internal software and hardware can generate temperature in the continuous working process, and the internal software and hardware of a case can be damaged due to the fact that the internal temperature of the case can not be effectively processed, so that the problem can be solved by providing the automatic temperature sensing and heat dissipating equipment for the case of the computer software and hardware.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides an automatic temperature-sensing and heat-dissipating device for a case of a computer, which has the advantages of sensing the temperature in the case, automatically opening a heat-dissipating pipeline to cool the case after the temperature of the case rises, avoiding the damage of the software and the hardware in the case due to overhigh temperature of the case, and solving the problems that the software and the hardware in the case are damaged due to the fact that the temperature of the software and the hardware in the case is generated in the continuous working process of the computer in the running process and the temperature in the case cannot be effectively processed.
(II) technical scheme
In order to realize the purpose of sensing the temperature in the case, automatically opening a heat dissipation pipeline to cool the case after the temperature of the case rises, and avoiding damage to software and hardware in the case due to overhigh temperature, the invention provides the following technical scheme: an automatic temperature-sensing and heat-dissipating device of a case for computer software and hardware comprises a case heat-dissipating device main body, wherein a fixed disc is fixedly arranged inside the case heat-dissipating device main body, a heat-dissipating pipeline is fixedly arranged on the outer wall of the fixed disc, a baffle is slidably connected inside the heat-dissipating pipeline, a push rod is fixedly connected at the bottom of the baffle, a driving disc is fixedly arranged inside the fixed disc, a through hole is formed in the outer wall of the driving disc, a rotating plate is movably arranged inside the through hole, a temperature-sensing disc is fixedly arranged inside the driving disc, a support is fixedly arranged on the outer wall of the temperature-sensing disc, a rotating rod is movably arranged on the front of the support, a cylinder is fixedly arranged on the left side of the support, an ejector rod is slidably connected inside the cylinder, an air guide pipe is fixedly connected at the bottom of the cylinder, and, the slide way is arranged in the placing groove, a sliding plate is connected to the inside of the slide way in a sliding mode, magnets are fixedly mounted on the inner walls of the left side and the right side of the placing groove, an extrusion plate is fixedly mounted on the right side of the sliding plate, and an air bag is fixedly mounted inside the placing groove.
Preferably, the heat dissipation pipeline is wide at the top and narrow at the bottom, the top is provided with a transition arc, the length of the baffle inside the heat dissipation pipeline is the same as the size of the bottom of the heat dissipation pipeline, and the heat dissipation pipeline is conducted after the baffle moves upwards.
Preferably, the bottom of the push rod is in sliding contact with the top of the rotating plate.
Preferably, the heat dissipation pipeline is located right above the rotating plate, and the rotating plate is located right above the placement groove.
Preferably, the temperature sensing plate is made of heat-gathering materials.
Preferably, the magnetism of the inside of the sliding plate is opposite to that of the magnets on the inner wall of the placement groove, the two magnets attract each other, solid paraffin is placed between the inner wall of the placement groove and the sliding plate, the density of the sliding plate is smaller than that of the paraffin, and the sliding plate can be suspended on the liquid level of the paraffin.
Preferably, the extrusion plate is made of a material capable of blocking magnetism.
Preferably, the air bag is made of an elastic material, and the air bag can restore to the original shape after being squeezed.
(III) advantageous effects
Compared with the prior art, the invention provides an automatic temperature sensing and heat dissipating device for a case of computer software and hardware, which has the following beneficial effects:
1. the device for automatically sensing temperature and dissipating heat of a case of computer software and hardware is characterized in that the temperature in the main body of the heat dissipating device of the case is gathered and transmitted to the inside of a placing groove through the heat gathering effect of a temperature sensing disc, paraffin between the inner wall of the placing groove and a sliding plate is melted into liquid state at high temperature along with the continuous rising of the temperature, the density of the sliding plate is smaller than that of the paraffin, the sliding plate is pushed to move towards the middle along with the melting of the paraffin, so that an air bag is extruded by an extrusion plate to shrink to control the opening of a heat dissipating pipeline, after the temperature in the main body of the heat dissipating device of the case is restored to normal temperature, the paraffin is restored to be solid state again, and under the mutual attraction effect of two magnets with opposite magnetism on the inside of the sliding plate and the inner wall of the placing groove, the paraffin belongs to a deformable solid state, therefore, the air bag is not extruded any more, the heat dissipation pipeline is automatically closed, and the effect that the main body of the chassis heat dissipation equipment automatically senses the temperature change to control the opening and closing of the heat dissipation pipeline is achieved.
2. The automatic temperature-sensing heat dissipation equipment for the computer software and hardware case pushes the sliding plates to move towards the middle of the placing groove after paraffin is melted, the sliding plates on two sides can extrude the middle air bag to shrink, along with the shrinkage of the air bag, gas in the air bag can enter the air cylinder along the air guide pipe, the ejector rod in the air cylinder can be pushed out, so as to drive the rotating rod to rotate anticlockwise, so that the rotating rod can deflect the rotating plate in the through hole of the driving disc anticlockwise, then the push rod jacks up the baffle plate in the heat dissipation pipeline, because the heat dissipation pipeline is of a structure with a wide upper part and a narrow lower part, after the baffle plate moves upwards, the heat dissipation pipeline can be conducted to automatically cool the main body of the heat dissipation equipment of the case, after the temperature of the main body of the heat dissipation equipment of the case is restored to normal temperature, the air bag restores to the original state, the rotating plate is not restored, after the temperature rises, the case automatically radiates.
Drawings
Fig. 1 is a schematic structural diagram of a main body of a temperature-sensing heat dissipation device of a chassis;
FIG. 2 is a schematic structural diagram of a heat dissipation apparatus;
FIG. 3 is an enlarged view of the heat dissipation pipe;
fig. 4 is a schematic structure diagram of an enlarged view of the temperature sensing mechanism.
In the figure: 1. a chassis heat dissipation device main body; 2. fixing the disc; 3. a heat dissipation pipe; 4. a baffle plate; 5. a push rod; 6. driving the disc; 7. a through hole; 8. a rotating plate; 9. a temperature sensing plate; 10. a support; 11. rotating the rod; 12. a cylinder; 13. a top rod; 14. an air duct; 15. a placing groove; 16. a slideway; 17. a sliding plate; 18. a magnet; 19. a pressing plate; 20. an air bag.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an automatic temperature-sensing heat dissipation device for computer hardware and software comprises a main body 1 of a heat dissipation device for computer software, a fixed disk 2 is fixedly installed inside the main body 1 of the heat dissipation device for computer software, a heat dissipation pipe 3 is fixedly installed on the outer wall of the fixed disk 2, the heat dissipation pipe 3 is designed to be wide at the top and narrow at the bottom, a transition arc is arranged at the top, the length of a baffle 4 inside the heat dissipation pipe 3 is the same as the size of the bottom of the heat dissipation pipe 3, the heat dissipation pipe 3 is conducted after the baffle 4 moves upwards, the baffle 4 is slidably connected inside the heat dissipation pipe 3, a push rod 5 is fixedly connected to the bottom of the baffle 4, the bottom of the push rod 5 is in sliding contact with the top of a rotating plate 8, a driving disk 6 is fixedly installed inside the fixed disk 2, a through hole 7 is formed in the outer wall of the driving disk 6, the rotating, the rotating plate 8 is positioned right above the placing groove 15, the temperature sensing disc 9 is fixedly installed inside the driving disc 6, the temperature sensing disc 9 is made of heat-gathering materials, the outer wall of the temperature sensing disc 9 is fixedly provided with a support 10, the front surface of the support 10 is movably provided with a rotating rod 11, the left side of the support 10 is fixedly provided with an air cylinder 12, the inside of the air cylinder 12 is slidably connected with an ejector rod 13, the bottom of the air cylinder 12 is fixedly connected with an air guide pipe 14, the inner wall of the temperature sensing disc 9 is fixedly provided with the placing groove 15, the inside of the placing groove 15 is provided with a slide way 16, the inside of the slide way 16 is slidably connected with a sliding plate 17, the magnetism of the inside of the sliding plate 17 is opposite to that of a magnet 18 on the inner wall of the placing groove 15, the two magnets 18 attract each other, solid paraffin is placed between the inner wall of the placing groove, magnets 18 are fixedly mounted on the inner walls of the left side and the right side of the placement groove 15, an extrusion plate 19 is fixedly mounted on the right side of the sliding plate 17, the extrusion plate 19 is made of a magnetic blocking material, an air bag 20 is fixedly mounted inside the placement groove 15, the air bag 20 is made of an elastic material, and the air bag 20 can restore to the original shape after being extruded.
The working principle is that the temperature in the main body 1 of the chassis heat dissipation device is gathered and transmitted to the inside of the placing groove 15 through the heat gathering action of the temperature sensing disc 9, the paraffin between the inner wall of the placing groove 15 and the sliding plate 17 is melted into liquid state by high temperature along with the continuous rising of the temperature, the density of the sliding plate 17 is smaller than that of the paraffin, the sliding plate 17 is pushed to move towards the middle along with the melting of the paraffin, so that the air bag 20 is extruded through the extrusion plate 19 to shrink to control the opening of the heat dissipation pipeline 3, after the temperature in the main body 1 of the chassis heat dissipation device is restored to normal temperature, the paraffin is restored to solid state again, under the mutual attraction force of the two magnets 18 with opposite magnetism on the inner wall of the sliding plate 17 and the inner wall of the placing groove 15, the paraffin belongs to deformable solid under the solid state condition, the sliding plate 17 moves, therefore, the air bag 20 is not squeezed any more, the heat dissipation pipeline 3 is automatically closed, the effect that the heat dissipation pipeline 3 is controlled to be opened and closed by automatically sensing the temperature change of the chassis heat dissipation device main body 1 is achieved, the sliding plates 17 are pushed to move towards the middle of the placing groove 15 after paraffin wax is melted, the sliding plates 17 on the two sides can squeeze the air bag 20 in the middle to shrink, along with the shrinkage of the air bag 20, the air in the air bag 20 can enter the air cylinder 12 along the air guide pipe 14, the ejector rod 13 in the air cylinder 12 can be pushed out, so that the rotating rod 11 is driven to rotate anticlockwise, the rotating plate 8 in the through hole 7 of the driving disc 6 can be driven to deflect anticlockwise by the rotating rod 11, then the baffle 4 in the heat dissipation pipeline 3 is jacked up by the push rod 5, because the heat dissipation pipeline 3 is of a structure with a wide top and a narrow bottom, after the baffle, when the temperature of the case heat dissipation device main body 1 is restored to normal temperature, the air bag 20 is restored to the original state, the rotating plate 8 is restored to the initial position without the stress, so that the heat dissipation pipeline 3 is blocked by the baffle plate 4 again under the action of self gravity, and the case automatically dissipates heat after the temperature is raised.
In summary, in the automatic temperature-sensing heat dissipation device for computer software and hardware chassis, the temperature inside the chassis heat dissipation device main body 1 is gathered and transmitted to the inside of the installation slot 15 through the heat gathering effect of the temperature-sensing disc 9, as the temperature rises continuously, the paraffin between the inner wall of the installation slot 15 and the sliding plate 17 is melted into liquid state by high temperature, as the density of the sliding plate 17 is less than that of the paraffin, the sliding plate 17 is pushed to move towards the middle after the paraffin is melted, so that the air bag 20 is extruded by the extrusion plate 19 to shrink to control the opening of the heat dissipation pipeline 3, after the temperature inside the chassis heat dissipation device main body 1 is restored to normal temperature, the paraffin is restored to solid state again, and under the mutual attraction effect of the two magnets 18 with opposite magnetism inside the sliding plate 17 and on the inner wall of the installation slot 15, the paraffin belongs to deformable solid state under the solid state condition, the sliding plate 17 will move towards both sides to press the paraffin towards both sides, so that the air bag 20 is not pressed any more, the heat dissipation pipeline 3 is automatically closed, and the effect that the main body 1 of the chassis heat dissipation device automatically senses the change of temperature to control the opening and closing of the heat dissipation pipeline 3 is achieved.
In addition, according to the automatic temperature-sensing heat dissipation device for the computer software and hardware case, after paraffin is melted, the sliding plates 17 are pushed to move towards the middle of the placing groove 15, the sliding plates 17 on the two sides can extrude the air bag 20 in the middle to shrink, along with the shrinkage of the air bag 20, the air in the air bag 20 can enter the air cylinder 12 along the air guide tube 14, the ejector rod 13 in the air cylinder 12 can be pushed out, so as to drive the rotating rod 11 to rotate anticlockwise, so that the rotating rod 11 can drive the rotating plate 8 in the through hole 7 of the driving disk 6 to deflect anticlockwise, then the push rod 5 jacks up the baffle 4 in the heat dissipation pipeline 3, because the heat dissipation pipeline 3 is of a structure with a wide upper part and a narrow lower part, after the baffle 4 moves upwards, the heat dissipation pipeline 3 can be conducted to automatically cool the case heat dissipation device main body 1, and after the temperature of the case heat dissipation, the rotating plate 8 is restored to the initial position without the action of force, so that the baffle 4 blocks the heat dissipation pipeline 3 again under the action of self gravity, and the automatic heat dissipation effect of the case is achieved after the temperature rises.
Having shown and described embodiments of the present invention, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides an automatic radiating equipment of temperature sensing of quick-witted case about computer software and hardware, includes quick-witted case heat dissipation equipment main part (1), its characterized in that: the machine box heat dissipation equipment comprises a machine box heat dissipation equipment main body (1), wherein a fixed disc (2) is fixedly arranged in the machine box heat dissipation equipment main body (1), a heat dissipation pipeline (3) is fixedly arranged on the outer wall of the fixed disc (2), a baffle (4) is connected to the heat dissipation pipeline (3) in a sliding mode, a push rod (5) is fixedly connected to the bottom of the baffle (4), a driving disc (6) is fixedly arranged in the fixed disc (2), a through hole (7) is formed in the outer wall of the driving disc (6), a rotating plate (8) is movably arranged in the through hole (7), a temperature sensing disc (9) is fixedly arranged in the driving disc (6), a support (10) is fixedly arranged on the outer wall of the temperature sensing disc (9), a rotating rod (11) is movably arranged on the front of the support (10), an air cylinder (12) is fixedly arranged on the left side of the support (, the bottom fixedly connected with air duct (14) of cylinder (12), the inner wall fixed mounting of temperature sensing dish (9) has arrangement groove (15), slide (16) have been seted up to the inside of arrangement groove (15), the inside sliding connection of slide (16) has sliding plate (17), the inner wall fixed mounting of arrangement groove (15) the left and right sides has magnet (18), the right side fixed mounting of sliding plate (17) has stripper plate (19), the inside fixed mounting of arrangement groove (15) has gasbag (20).
2. The device for automatically sensing and dissipating heat of computer hardware and software according to claim 1, wherein: the heat dissipation pipeline (3) is designed to be wide at the top and narrow at the bottom, the top is provided with a transition arc, and the length of the baffle (4) inside the heat dissipation pipeline (3) is the same as the size of the bottom of the heat dissipation pipeline (3).
3. The device for automatically sensing and dissipating heat of computer hardware and software according to claim 1, wherein: the bottom of the push rod (5) is in sliding contact with the top of the rotating plate (8).
4. The device for automatically sensing and dissipating heat of computer hardware and software according to claim 1, wherein: the heat dissipation pipeline (3) is located right above the rotating plate (8), and the rotating plate (8) is located right above the placement groove (15).
5. The device for automatically sensing and dissipating heat of computer hardware and software according to claim 1, wherein: the temperature sensing plate (9) is made of heat-gathering materials.
6. The device for automatically sensing and dissipating heat of computer hardware and software according to claim 1, wherein: the magnetism of the magnet (18) in the sliding plate (17) is opposite to that of the magnet on the inner wall of the placing groove (15), solid paraffin is placed between the inner wall of the placing groove (15) and the sliding plate (17), and the density of the sliding plate (17) is smaller than that of the paraffin.
7. The device for automatically sensing and dissipating heat of computer hardware and software according to claim 1, wherein: the extrusion plate (19) is made of a material capable of blocking magnetism.
8. The device for automatically sensing and dissipating heat of computer hardware and software according to claim 1, wherein: the air bag (20) is made of elastic materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110441505.1A CN113093891A (en) | 2021-04-23 | 2021-04-23 | Automatic temperature-sensing and heat-dissipating equipment for case of computer software and hardware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110441505.1A CN113093891A (en) | 2021-04-23 | 2021-04-23 | Automatic temperature-sensing and heat-dissipating equipment for case of computer software and hardware |
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| Publication Number | Publication Date |
|---|---|
| CN113093891A true CN113093891A (en) | 2021-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110441505.1A Withdrawn CN113093891A (en) | 2021-04-23 | 2021-04-23 | Automatic temperature-sensing and heat-dissipating equipment for case of computer software and hardware |
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| CN (1) | CN113093891A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113771657A (en) * | 2021-08-05 | 2021-12-10 | 许浩南 | New energy automobile who effectively avoids rainwater short circuit fills electric pile heat radiation equipment |
-
2021
- 2021-04-23 CN CN202110441505.1A patent/CN113093891A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113771657A (en) * | 2021-08-05 | 2021-12-10 | 许浩南 | New energy automobile who effectively avoids rainwater short circuit fills electric pile heat radiation equipment |
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Application publication date: 20210709 |
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| WW01 | Invention patent application withdrawn after publication |