CN113092364A - Method for detecting peeling strength of high-temperature high-ductility copper foil for medium and high Tg (glass transition temperature) plate - Google Patents
Method for detecting peeling strength of high-temperature high-ductility copper foil for medium and high Tg (glass transition temperature) plate Download PDFInfo
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- CN113092364A CN113092364A CN202110340626.7A CN202110340626A CN113092364A CN 113092364 A CN113092364 A CN 113092364A CN 202110340626 A CN202110340626 A CN 202110340626A CN 113092364 A CN113092364 A CN 113092364A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 239000011889 copper foil Substances 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 20
- 230000009477 glass transition Effects 0.000 title claims abstract description 7
- 238000010030 laminating Methods 0.000 claims abstract description 50
- 230000008859 change Effects 0.000 claims abstract description 3
- 230000008569 process Effects 0.000 claims abstract description 3
- 230000002035 prolonged effect Effects 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims 5
- 238000001514 detection method Methods 0.000 abstract description 27
- 238000005259 measurement Methods 0.000 abstract description 3
- 238000010008 shearing Methods 0.000 abstract 1
- 238000003475 lamination Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
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- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
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- Laminated Bodies (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention discloses a method for detecting the peeling strength of a high-temperature high-ductility copper foil for a medium and high Tg (glass transition temperature) plate, which comprises the following steps of: cutting the copper foil; shearing prepregs with proper sizes, and gradually overlapping the prepregs with the rough surfaces of the HTE copper foils in an alternate mode to enable the prepregs to be used on two sides; placing the obtained product into a laminating machine, and laminating the obtained product according to a proper temperature and a set fixed time; cutting the laminated board by using a cutting machine, wherein the width of the laminated board is 100mm, and the length of the laminated board is prolonged to a whole laminated board; fixing the processed laminated board on a chassis of a peeling strength tester, peeling the laminated board by using an art designing cutter for 10-20mm in length, and fixing the laminated board on an instrument traction clamp; setting the traction speed to be more than 150mm/min, setting the position of the rotating hub, and representing the stripping degree of the stripping strength tester through the change of the tension sensor in the running process of the stripping strength tester. The invention has wider measurement sample surface, can cover the detection of the transverse area of the whole copper foil and has stronger uniformity.
Description
Technical Field
The invention relates to the technical field of electrolytic copper foil detection, in particular to a method for detecting the peeling strength of a high-temperature high-ductility copper foil for a medium and high Tg (glass transition temperature) plate.
Background
In recent years, due to rapid development of electronic technology, electronic and electrical instruments are gradually developed toward lightness, thinness, shortness, smallness and multifunctionality. Therefore, HTE copper foils are mainly characterized by a great improvement in some properties, and the range of application of HTE copper foils is becoming wider and wider. Its main characteristics include, but are not limited to, high temperature tensile strength, high temperature elongation, high temperature oxidation resistance, wettability/heat/acid resistance, high temperature heat loss, and the like. Generally, the conventional peeling strength detection method has low resolution, and the copper foils with similar specifications cannot be characterized and researched in an advanced manner by the conventional peeling strength detection method. The microstructure of the HTE copper foil is peak-shaped, and the physical properties of the copper foil cannot be comprehensively reflected by representing the microstructure of the HTE copper foil by roughness. With the development of research on specific surface area, more accurate detection is required in the aspect of peeling resistance, so that the invention aims to develop a novel method for detecting the peeling strength of the electrolytic copper foil, and can be applied to other similar related detection fields.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
Aiming at the technical problems in the related art, the invention provides a method for detecting the peeling strength of a high-temperature high-ductility copper foil for a medium and high Tg (glass transition temperature) plate, which can solve the problems.
In order to achieve the technical purpose, the technical scheme of the invention is realized as follows:
a method for detecting the peeling strength of a high-temperature high-ductility copper foil for a medium-high Tg (glass transition temperature) plate comprises the following steps:
s1, cutting the copper foil;
s2, cutting a prepreg with a proper size, and gradually overlapping the prepreg with the rough surface of the HTE copper foil in an alternate mode to enable the prepreg to be used on two sides;
s3, placing the film into a laminating machine, and laminating the film according to the selected proper temperature and the set fixed time;
s4, cutting the laminated board by using a cutting machine, wherein the width is 100mm, and the length is prolonged to the whole laminated board;
s5, fixing the processed laminated board on a chassis of a peeling strength tester, peeling the laminated board by using an art designing cutter for 10-20mm in length, and fixing the laminated board on an instrument traction clamp;
s6, setting the traction speed to be more than 150mm/min, setting the position of the rotating hub, and representing the peeling degree of the peeling strength tester through the change of the tension sensor in the running process of the peeling strength tester.
Further, in step S3, the laminating temperature is 200 ℃, and the laminating time is 2 h.
Further, in step S3, the laminating temperature is 170 ℃ and 190 ℃, and the laminating time is 2.5 h.
Further, in step S3, the laminating temperature is 140 ℃ and 170 ℃, and the laminating time is 3 h.
Further, the copper foil in step S1 has a thickness within a range of 9-105 μm.
Further, the hub position in step S6 is at 1/4 of the total stripped copper foil length.
Further, the hub position in step S6 is at 1/2 of the total stripped copper foil length.
Further, the hub position in step S6 is at 3/4 of the total stripped copper foil length.
The invention has the beneficial effects that:
1. the invention has wider measurement sample surface, can cover the detection of the transverse area of the whole copper foil, and particularly aims at the aspects of higher requirement and stronger uniformity when the HTE copper foil is used for a medium-high Tg plate.
2. The method is more credible in the aspect of accuracy control, and meanwhile, the method is favorable for measuring the stripping performance under various conditions such as high temperature, lead-free, halogen-free, high temperature halogen-free and the like.
3. The unique measuring structure mode of the peeling strength tester is also suitable for the detection of specifications below 12 mu m, and other types of metal foils with the thickness below 3 mu m are not exceeded in limit.
4. The invention can realize the stripping measurement length of 50cm, is easy to cover the whole width of HTE copper foil, and can feed back the performance conditions of the stripping strength of different positions in time.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a graph of lamination temperature versus lamination time;
fig. 2 is a schematic diagram of a tensile test being performed.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
Example 1: selecting 1 piece of HTE copper foil with the specification of 12 micrometers and the size of 10 x 40cm, selecting detection conditions, wherein the lamination temperature is 160 ℃, the lamination time is 2 hours respectively, the position of a rotary hub of a peel strength tester is 1/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 2: selecting 1 piece of HTE copper foil with the specification of 12 micrometers and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 180 ℃, the laminating time is 2 hours respectively, the position of a rotary hub of a peeling strength tester is 1/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 3: selecting 1 piece of HTE copper foil with the specification of 12 micrometers and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2 hours respectively, the position of a rotary hub of a peeling strength tester is 1/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 4: selecting 1 piece of HTE copper foil with the specification of 12 micrometers and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 160 ℃, the laminating time is 2.5 hours respectively, the position of a rotary hub of a peel strength tester is 1/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 5: selecting 1 piece of HTE copper foil with the specification of 12 micrometers and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 180 ℃, the laminating time is 2.5 hours respectively, the position of a rotary hub of a peel strength tester is 1/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 6: selecting 1 piece of HTE copper foil with the specification of 12 micrometers and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2.5 hours respectively, the position of a rotary hub of a peel strength tester is 1/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 7: selecting 1 piece of HTE copper foil with the specification of 12 micrometers and the size of 10 x 40cm, selecting detection conditions, wherein the lamination temperature is 160 ℃, the lamination time is 3 hours respectively, the position of a rotary hub of a peel strength tester is 1/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 8: selecting 1 piece of HTE copper foil with the specification of 12 micrometers and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 180 ℃, the laminating time is 3 hours respectively, the position of a rotary hub of a peeling strength tester is 1/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 9: selecting 1 piece of HTE copper foil with the specification of 12 micrometers and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 3 hours respectively, the position of a rotary hub of a peeling strength tester is 1/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 10: selecting 1 HTE copper foil with the specification of 35 mu m and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2h respectively, the position of a rotary hub of a peeling strength tester is 1/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 11: selecting 1 HTE copper foil with the specification of 35 mu m and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2h respectively, the position of a rotary hub of a peeling strength tester is 1/4, and the traction speed is 180 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 12: selecting 1 HTE copper foil with the specification of 35 mu m and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2h respectively, the position of a rotary hub of a peeling strength tester is 1/4, and the traction speed is 200 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 13: selecting 1 HTE copper foil with the specification of 35 mu m and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2h respectively, the position of a rotary hub of a peeling strength tester is 1/2, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 14: selecting 1 HTE copper foil with the specification of 35 mu m and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2h respectively, the position of a rotary hub of a peeling strength tester is 1/2, and the traction speed is 180 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 15: selecting 1 HTE copper foil with the specification of 35 mu m and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2h respectively, the position of a rotary hub of a peeling strength tester is 1/3, and the traction speed is 200 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 16: selecting 1 HTE copper foil with the specification of 35 mu m and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2h respectively, the position of a rotary hub of a peeling strength tester is 3/4, and the traction speed is 160 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 17: selecting 1 HTE copper foil with the specification of 35 mu m and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2h respectively, the position of a rotary hub of a peeling strength tester is 3/4, and the traction speed is 180 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Example 18: selecting 1 HTE copper foil with the specification of 35 mu m and the size of 10 x 40cm, selecting detection conditions, wherein the laminating temperature is 200 ℃, the laminating time is 2h respectively, the position of a rotary hub of a peeling strength tester is 3/4, and the traction speed is 200 mm/min. The single peeling width was 10mm, and 6 times of peeling was performed per sample.
Table 1:
the peel strength of HTE copper foil at medium to high Tg sheets was tested by different experimental protocols from examples 1-18 above and the results are as follows:
table 2:
as shown in table 2, the HTE copper foils of examples 1 to 3, 4 to 6, and 7 to 9 had very low and acceptable peel strengths at high Tg in order, and error rates of 5% or less, and were able to be accurately used for the detection of peel strength of HTE copper foils.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. A method for detecting the peeling strength of a high-temperature high-ductility copper foil for a medium-high Tg (glass transition temperature) plate is characterized by comprising the following steps of:
s1, cutting the copper foil;
s2, cutting a prepreg with a proper size, and gradually overlapping the prepreg with the rough surface of the HTE copper foil in an alternate mode to enable the prepreg to be used on two sides;
s3, placing the film into a laminating machine, and laminating the film according to the selected proper temperature and the set fixed time;
s4, cutting the laminated board by using a cutting machine, wherein the width is 100mm, and the length is prolonged to the whole laminated board;
s5, fixing the processed laminated board on a chassis of a peeling strength tester, peeling the laminated board by using an art designing cutter for 10-20mm in length, and fixing the laminated board on an instrument traction clamp;
s6, setting the traction speed to be more than 150mm/min, setting the position of the rotating hub, and representing the peeling degree of the peeling strength tester through the change of the tension sensor in the running process of the peeling strength tester.
2. The method for detecting the peel strength of the high-temperature high-ductility copper foil for the medium-high Tg sheet according to claim 1, wherein the laminating temperature in step S3 is 200 ℃ and the laminating time is 2 hours.
3. The method for detecting the peel strength of the high-temperature high-ductility copper foil for the medium-high Tg sheet material as claimed in claim 2, wherein the laminating temperature in step S3 is 170 ℃ and 190 ℃, and the laminating time is 2.5 h.
4. The method for detecting the peel strength of the high-temperature high-ductility copper foil for the middle-high Tg sheet material as claimed in claim 1, wherein the laminating temperature in step S3 is 140 ℃ and 170 ℃, and the laminating time is 3 h.
5. The method for detecting the peel strength of the high-temperature high-ductility copper foil for the medium-high Tg plate as claimed in claim 1, wherein the thickness of the copper foil in step S1 is in the range of 9-105 μm.
6. The method for detecting the peel strength of high-temperature high-ductility copper foil for middle and high Tg sheet materials as claimed in claim 1, wherein the hub position in step S6 is at 1/4 of the total length of the stripped copper foil.
7. The method for detecting the peel strength of high-temperature high-ductility copper foil for middle and high Tg sheet materials as claimed in claim 1, wherein the hub position in step S6 is at 1/2 of the total length of the stripped copper foil.
8. The method for detecting the peel strength of high-temperature high-ductility copper foil for middle and high Tg sheet materials as claimed in claim 1, wherein the hub position in step S6 is at 3/4 of the total length of the stripped copper foil.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110340626.7A CN113092364A (en) | 2021-03-30 | 2021-03-30 | Method for detecting peeling strength of high-temperature high-ductility copper foil for medium and high Tg (glass transition temperature) plate |
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| CN202110340626.7A CN113092364A (en) | 2021-03-30 | 2021-03-30 | Method for detecting peeling strength of high-temperature high-ductility copper foil for medium and high Tg (glass transition temperature) plate |
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Application publication date: 20210709 |