CN102539318B - Assessment method of copper clad laminate mechanical properties - Google Patents
Assessment method of copper clad laminate mechanical properties Download PDFInfo
- Publication number
- CN102539318B CN102539318B CN201110434174.5A CN201110434174A CN102539318B CN 102539318 B CN102539318 B CN 102539318B CN 201110434174 A CN201110434174 A CN 201110434174A CN 102539318 B CN102539318 B CN 102539318B
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- metal
- testing sample
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention provides an assessment method of copper clad laminate mechanical properties, which comprises the following steps: step 1, providing a copper clad laminate to be tested; step 2, manufacturing a sample to be tested, that is, etching the copper foil of the copper clad laminate to be tested, cutting the copper clad laminate with etched copper foil into a sample to be tested with a predetermined dimension; step 3, bending to obtain a predetermined angle by allowing the sample to be tested to surround a cylinder with a predetermined diameter; step 4, observing the laminating condition of the sample to be tested after bending, wherein if no lamination occurs, the sample to be tested accords with testing requirements, if lamination occurs, the sample to be tested does not accord with the testing requirements. The assessment method of copper clad laminate mechanical properties of the invention can simply and rapidly assess whether the mechanical properties to be tested of the copper clad laminate accord with the testing requirements, can rapidly and intuitively characterize the mechanical properties to be tested of the copper clad laminate, such as bonding force and toughness, and improve the assessment method of copper clad laminate mechanical properties.
Description
Technical field
The present invention relates to a kind of appraisal procedure, relate in particular to a kind of assessment method of copper clad laminate mechanical properties.
Background technology
Along with electronics and IT products are produced in a large number, and towards compact, multi-functional designer trends, tellite as electronic components main support, also along with improving constantly technological layer, so that high-density wiring, thin type, fine aperture, high-cooling property to be provided, the Metal Substrate copper-clad laminate of the high heat radiation of being born under this background.The cohesiveness of metal-based copper-clad plate, is a leading indicator that affects its application, and it comprises the cohesive force of cohesive force, metal substrate and the tack coat of Copper Foil and tack coat.For Copper Foil and the assessment of cohesive force, in prior art, there is clear and definite method, as the peel strength of testing Copper Foil, but the method be not suitable for assessing the cohesive force of metal substrate and tack coat, does not still have good appraisal procedure at present for the cohesive force of metal substrate and tack coat.Meanwhile, the toughness of the insulation course of copper-clad plate is an important factor in order of PCB processability, for the toughness of the insulation course of copper-clad plate, also there is no at present good appraisal procedure.
Summary of the invention
The object of the present invention is to provide a kind of assessment method of copper clad laminate mechanical properties, can simple and fast the mechanical property to be measured of assessment copper-clad plate whether meet test request.
For achieving the above object, the invention provides a kind of assessment method of copper clad laminate mechanical properties, comprise the steps:
Step 1, provide copper-clad plate to be measured;
Step 2, making testing sample: the Copper Foil of copper-clad plate to be measured is etched away, the copper-clad plate that etches away Copper Foil is cut into the testing sample of preliminary dimension size;
Step 3, testing sample is carried out to the bending of predetermined angular around the right cylinder of predetermined diameter size;
Step 4, the layering situation of observing the rear testing sample of bending, if there is not layering, represent that testing sample meets test request, if there is layering, represents that testing sample does not meet test request.
Described copper-clad plate comprises metal-based copper-clad plate and non-metal base copper-clad plate.
Described non-metal base copper-clad plate is opened bonding sheet by 1-2 and is pressed into, and the glass-fiber-fabric that bonding sheet adopts is one or both in 106,1080,2116,7628 model glass-fiber-fabrics.
Described copper-clad plate is metal-based copper-clad plate, according to the layering situation between testing sample metal substrate and adhesive linkage after bending, the metal substrate of comparative evaluation metal-based copper-clad plate and the cohesive force between tack coat, and according to the layering situation of tack coat itself, the toughness of the tack coat of comparative evaluation metal-based copper-clad plate.
During described bending, with the tack coat of testing sample, bend outwardly.
Described copper-clad plate is non-metal base copper-clad plate, according to the layering situation of testing sample insulation course after bending, the toughness of the insulation course of comparative evaluation non-metal base copper-clad plate.
During testing sample bending, adopt bending instrument to bend it; Described bending instrument comprises that one end has the rotating shaft of described rounded body, and this rotating shaft is around its central shaft rotation, and testing sample bends on the rounded body outer peripheral face of this rotating shaft.
Described cylindrical radius is 2-100 millimeter, for metal-based copper-clad plate, by changing the right cylinder of different-diameter, come quantification area to divide the excellent poor of the excellent difference of the metal substrate of metal-based copper-clad plate and the bonding force of tack coat and the toughness of tack coat, so that the toughness of the bonding force of the metal substrate of metal-based copper-clad plate and tack coat and tack coat is carried out to grade distinguishing; For non-metal base copper-clad plate, by changing the right cylinder of different-diameter, quantitatively distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate, so that the toughness of the insulation course of non-metal base copper-clad plate is carried out to grade distinguishing.
Described bending angle is 30-180 °, for metal-based copper-clad plate, by changing bending angle, come quantification area to divide the excellent poor of the excellent difference of the metal substrate of metal-based copper-clad plate and the bonding force of tack coat and the toughness of tack coat, so that the toughness of the bonding force of the metal substrate of metal-based copper-clad plate and tack coat and tack coat is carried out to grade distinguishing; For non-metal base copper-clad plate, by changing bending angle, quantitatively distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate, so that the toughness of the insulation course of non-metal base copper-clad plate is carried out to grade distinguishing.
Described testing sample is of a size of wide 10-25 millimeter, long 100-250 millimeter.
The invention has the beneficial effects as follows: assessment method of copper clad laminate mechanical properties of the present invention, can simple and fast the mechanical property to be measured of assessment copper-clad plate whether meet test request; For metal-based copper-clad plate, can simple and fast assess the toughness of bonding force and the tack coat of its metal substrate and tack coat, for non-metal base copper-clad plate, can simple and fast assess the toughness of its insulation course; Assessment method of copper clad laminate mechanical properties of the present invention, can quicklook ground characterize copper-clad plate mechanical property to be measured as bonding force and toughness, the perfect appraisal procedure of copper clad laminate mechanical properties.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, by the embodiment of invention is described in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In accompanying drawing,
Fig. 1 is assessment method of copper clad laminate mechanical properties process flow diagram of the present invention;
Fig. 2 is the metal-based copper-clad plate structural drawing of the embodiment of the present invention 1;
Fig. 3 is that in Fig. 2, metal-based copper-clad plate etches away the structural drawing after Copper Foil;
Fig. 4 is the metal-based copper-clad plate bending structure figure on bending instrument etching away in Fig. 3 after Copper Foil;
Fig. 5 is the non-metal base structure for covering copper plate figure of the embodiment of the present invention 2;
Fig. 6 is that in Fig. 5, non-metal base copper-clad plate etches away the structural drawing after Copper Foil.
Embodiment
As shown in Figure 1, be assessment method of copper clad laminate mechanical properties process flow diagram of the present invention, this disposal route comprises the steps:
Step 1, provide copper-clad plate to be measured;
Step 2, making testing sample: the Copper Foil of copper-clad plate to be measured is etched away, the copper-clad plate that etches away Copper Foil is cut into the testing sample of preliminary dimension size, described testing sample is preferably dimensioned to be wide 10-25 millimeter, long 100-250 millimeter;
Step 3, testing sample is carried out to the bending of predetermined angular around the right cylinder of predetermined diameter size;
Step 4, the layering situation of observing the rear testing sample of bending, if there is not layering, represent that testing sample meets test request, if there is layering, represents that testing sample does not meet test request.
Described copper-clad plate comprises metal-based copper-clad plate and non-metal base copper-clad plate.
Described non-metal base copper-clad plate is opened bonding sheet by 1-2 and is pressed into, and the glass-fiber-fabric that bonding sheet adopts is one or both in 106,1080,2116,7628 model glass-fiber-fabrics.
Described copper-clad plate is metal-based copper-clad plate, according to the layering situation between testing sample metal substrate and adhesive linkage after bending, the metal substrate of comparative evaluation metal-based copper-clad plate and the cohesive force between tack coat, and according to the layering situation of tack coat itself, the toughness of the tack coat of comparative evaluation metal-based copper-clad plate.
During described bending, with the tack coat of testing sample, bend outwardly.
Described copper-clad plate is non-metal base copper-clad plate, according to the layering situation of testing sample insulation course after bending, the toughness of the insulation course of comparative evaluation non-metal base copper-clad plate.
During testing sample bending, adopt bending instrument to bend it; Described bending instrument comprises that one end has the rotating shaft of described rounded body, and this rotating shaft is around its central shaft rotation, and testing sample bends on the rounded body outer peripheral face of this rotating shaft.
Described cylindrical radius can be chosen as 2-100 millimeter, and when testing sample is tested, the right cylinder by changing different-diameter, to repeatedly testing with a collection of testing sample, can come quantification area to divide the mechanical property of testing sample.For metal-based copper-clad plate, by changing the right cylinder of different-diameter, come quantification area to divide the excellent poor of the excellent difference of the metal substrate of metal-based copper-clad plate and the bonding force of tack coat and the toughness of tack coat, so that the toughness of the bonding force of the metal substrate of metal-based copper-clad plate and tack coat and tack coat is carried out to grade distinguishing; For non-metal base copper-clad plate, by changing the right cylinder of different-diameter, quantitatively distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate, so that the toughness of the insulation course of non-metal base copper-clad plate is carried out to grade distinguishing.
During test, described bending angle is preferably 30-180 °, for a collection of testing sample, by changing bending angle, takes multiple measurements, and can come quantification area to divide the mechanical property of testing sample.For metal-based copper-clad plate, by changing bending angle, come quantification area to divide the excellent poor of the excellent difference of the metal substrate of metal-based copper-clad plate and the bonding force of tack coat and the toughness of tack coat, so that the toughness of the bonding force of the metal substrate of metal-based copper-clad plate and tack coat and tack coat is carried out to grade distinguishing; For non-metal base copper-clad plate, by changing bending angle, quantitatively distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate, so that the toughness of the insulation course of non-metal base copper-clad plate is carried out to grade distinguishing.
Below by specific embodiments of the invention, describe content of the present invention in detail.
Embodiment 1
Metal-based copper-clad plate to be measured is provided, shown in figure 2, it comprise metal substrate 10, Copper Foil 30 and be located at metal substrate 10 and Copper Foil 30 between tack coat 20, the Copper Foil of metal-based copper-clad plate 30 is etched away, metal-based copper-clad plate after etching Copper Foil 30 is cut into the testing sample of 25 millimeters of width, 250 millimeters of length, testing sample structure as shown in Figure 3, comprise metal substrate 10 and on tack coat 20.
As shown in Figure 4, testing sample is carried out to the bending (30-180 °) of certain angle by different-diameter with its tack coat 20 on external bending instrument 100, after bending, observe the layering situation between testing sample metal substrate 10 and adhesive linkage 20, the metal substrate 10 of comparative evaluation metal-based copper-clad plate and the cohesive force between tack coat 10, and the layering situation own according to tack coat 20, the toughness of the tack coat 20 of comparative evaluation metal-based copper-clad plate.
Embodiment 2
Non-metal base copper-clad plate to be measured is provided, shown in figure 5, it comprises Copper Foil 40 and is located at the insulation course 50 of 40 of Copper Foils, non-metal base copper-clad plate after etching Copper Foil is cut into the testing sample of 25 millimeters of width, 250 millimeters of length, testing sample structure as shown in Figure 6, comprise insulation course 50, this insulation course 50 is the insulation course of non-metal base copper-clad plate.
Press method shown in Fig. 4, testing sample is carried out on bending instrument 100 to the bending (30-180 °) of certain angle by different-diameter, after bending, observe the layering situation of insulation course 50, to assess the toughness of non-metal base copper-clad plate insulation course 50.
In sum, assessment method of copper clad laminate mechanical properties of the present invention, can simple and fast the mechanical property to be measured of assessment copper-clad plate whether meet test request; For metal-based copper-clad plate, can simple and fast assess the toughness of bonding force and the tack coat of its metal substrate and tack coat, for non-metal base copper-clad plate, can simple and fast assess the toughness of its insulation course; Assessment method of copper clad laminate mechanical properties of the present invention, can quicklook ground characterize copper-clad plate mechanical property to be measured as bonding force and toughness, the perfect appraisal procedure of copper clad laminate mechanical properties.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of the accompanying claim of the present invention.
Claims (6)
1. an assessment method of copper clad laminate mechanical properties, is characterized in that, comprises the steps:
Step 1, provide copper-clad plate to be measured;
Step 2, making testing sample: the Copper Foil of copper-clad plate to be measured is etched away, the copper-clad plate that etches away Copper Foil is cut into the testing sample of preliminary dimension size;
Step 3, testing sample is carried out to the bending of predetermined angular around the right cylinder of predetermined diameter size, make testing sample form a bending angle;
Step 4, the layering situation of observing the rear testing sample of bending, if there is not layering, represent that testing sample meets test request, if there is layering, represents that testing sample does not meet test request; Described copper-clad plate comprises metal-based copper-clad plate and non-metal base copper-clad plate; Described non-metal base copper-clad plate is opened bonding sheet by 1-2 and is pressed into, and the glass-fiber-fabric that bonding sheet adopts is one or both in 106,1080,2116,7628 model glass-fiber-fabrics;
Described bending angle is 30-180 °, for metal-based copper-clad plate, by changing bending angle, come quantification area to divide the excellent poor of the excellent difference of the metal substrate of metal-based copper-clad plate and the bonding force of tack coat and the toughness of tack coat, so that the toughness of the bonding force of the metal substrate of metal-based copper-clad plate and tack coat and tack coat is carried out to grade distinguishing; For non-metal base copper-clad plate, by changing bending angle, quantitatively distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate, so that the toughness of the insulation course of non-metal base copper-clad plate is carried out to grade distinguishing.
2. assessment method of copper clad laminate mechanical properties as claimed in claim 1, it is characterized in that, described copper-clad plate is metal-based copper-clad plate, according to the layering situation between testing sample metal substrate and tack coat after bending, the metal substrate of comparative evaluation metal-based copper-clad plate and the bonding force between tack coat, and according to the layering situation of tack coat itself, the toughness of the tack coat of comparative evaluation metal-based copper-clad plate.
3. assessment method of copper clad laminate mechanical properties as claimed in claim 2, is characterized in that, during described bending, with the tack coat of testing sample, bends outwardly.
4. assessment method of copper clad laminate mechanical properties as claimed in claim 1, is characterized in that, described copper-clad plate is non-metal base copper-clad plate, according to the layering situation of testing sample insulation course after bending, the toughness of the insulation course of comparative evaluation non-metal base copper-clad plate.
5. assessment method of copper clad laminate mechanical properties as claimed in claim 1, is characterized in that, during testing sample bending, adopts bending instrument to bend it; Described bending instrument comprises that one end has described cylindrical rotating shaft, and this rotating shaft is around its central shaft rotation, and testing sample bends on the right cylinder outer peripheral face of this rotating shaft.
6. assessment method of copper clad laminate mechanical properties as claimed in claim 1, is characterized in that, described testing sample is of a size of wide 10-25 millimeter, long 100-250 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110434174.5A CN102539318B (en) | 2011-12-21 | 2011-12-21 | Assessment method of copper clad laminate mechanical properties |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110434174.5A CN102539318B (en) | 2011-12-21 | 2011-12-21 | Assessment method of copper clad laminate mechanical properties |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102539318A CN102539318A (en) | 2012-07-04 |
| CN102539318B true CN102539318B (en) | 2014-02-19 |
Family
ID=46346751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110434174.5A Active CN102539318B (en) | 2011-12-21 | 2011-12-21 | Assessment method of copper clad laminate mechanical properties |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102539318B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104359833A (en) * | 2014-11-07 | 2015-02-18 | 广州兴森快捷电路科技有限公司 | Test method for peel strength of copper-clad plate |
| CN104931350A (en) * | 2015-06-11 | 2015-09-23 | 中国科学院山西煤炭化学研究所 | Method for quantitatively testing flexibility of flexible graphene membrane |
| CN105445118B (en) * | 2015-12-22 | 2019-07-26 | 广东生益科技股份有限公司 | A kind of metal base copper-clad laminate mechanical property appraisal procedure |
| TWI719110B (en) * | 2016-01-15 | 2021-02-21 | 日商Ｊｘ金屬股份有限公司 | Manufacturing methods of copper foil, copper-clad laminates, printed wiring boards, manufacturing methods of electronic devices, manufacturing methods of transmission lines, and manufacturing methods of antennas |
| CN106908384A (en) * | 2017-02-27 | 2017-06-30 | 信利半导体有限公司 | A kind of method of testing of composite membrane layering |
| CN107764736A (en) * | 2017-10-18 | 2018-03-06 | 广东生益科技股份有限公司 | Multiple-plate roughening effect evaluation method |
| CN108982239B (en) * | 2018-05-24 | 2020-12-08 | 中国兵器科学研究院宁波分院 | Organic coating flexibility quantitative detection device |
| CN114646723A (en) * | 2020-12-21 | 2022-06-21 | 广东生益科技股份有限公司 | Laminated board internal structure and performance integrity analysis method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU953535A1 (en) * | 1981-01-14 | 1982-08-23 | Татарский Научно-Исследовательский Институт Нефтяного Машиностроения | Polymeric compound adhesion strength determination method |
| CN101017131A (en) * | 2007-02-14 | 2007-08-15 | 广东生益科技股份有限公司 | Method for testing interlaminar adhesive force and making apparatus |
| CN101206173A (en) * | 2006-12-22 | 2008-06-25 | 上海比亚迪有限公司 | Method for measuring coating adhesive strength on a coating body using flexible material as substrate |
| CN102147354A (en) * | 2010-02-10 | 2011-08-10 | 中国科学院金属研究所 | Device for evaluating coating binding force |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000292343A (en) * | 1999-04-07 | 2000-10-20 | Yokohama Rubber Co Ltd:The | Jig, method, and device for measuring flexibility of adhesive layer |
-
2011
- 2011-12-21 CN CN201110434174.5A patent/CN102539318B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU953535A1 (en) * | 1981-01-14 | 1982-08-23 | Татарский Научно-Исследовательский Институт Нефтяного Машиностроения | Polymeric compound adhesion strength determination method |
| CN101206173A (en) * | 2006-12-22 | 2008-06-25 | 上海比亚迪有限公司 | Method for measuring coating adhesive strength on a coating body using flexible material as substrate |
| CN101017131A (en) * | 2007-02-14 | 2007-08-15 | 广东生益科技股份有限公司 | Method for testing interlaminar adhesive force and making apparatus |
| CN102147354A (en) * | 2010-02-10 | 2011-08-10 | 中国科学院金属研究所 | Device for evaluating coating binding force |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2000-292343A 2000.10.20 |
| 刚挠结合板用挠性材料和粘结材料性能研究;汪传林等;《印制电路信息》;20091231(第8期);20-26 * |
| 汪传林等.刚挠结合板用挠性材料和粘结材料性能研究.《印制电路信息》.2009,(第8期),20-26. |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102539318A (en) | 2012-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102539318B (en) | Assessment method of copper clad laminate mechanical properties | |
| CN201266074Y (en) | Strain induction module | |
| Chen | EM modeling of microstrip conductor losses including surface roughness effect | |
| CN104350816A (en) | Shield film and shield printed wiring board | |
| JP5611355B2 (en) | Metal-clad laminate | |
| CN105102678A (en) | Surface-treated copper foil, and copper-clad laminate obtained using surface-treated copper foil | |
| CN104677819B (en) | A kind of method of evaluation Cu systems metal nano multi-layer film material adhesion property | |
| CN103096642A (en) | Manufacture method of flexible circuit board | |
| CN101998777A (en) | Method for producing conduction between layers of metal aluminum based printed wiring board | |
| CN115038237B (en) | Metal foil, copper-clad laminated plate and printed circuit board | |
| CN105445118A (en) | Mechanical property evaluation method of metal-based copper foil-coated laminated board | |
| KR101525368B1 (en) | Copper foil for flexible printed wiring board, copper-clad laminate, flexible printed wiring board and electronic device | |
| KR101512572B1 (en) | Surface-roughened copper foil and copper-clad laminated substrate | |
| Wu et al. | Ultrasensitive Strain Sensors Based on Cu‐Al Alloy Films with Voided Cluster Boundaries | |
| CN209043174U (en) | A kind of lighium polymer cell polar ear spacing and back gauge detection device | |
| CN209400457U (en) | A kind of monitoring device of fragile material crack initiation time | |
| CN112825616A (en) | 3D electromagnetic shield and preparation method thereof | |
| CN103364674B (en) | The decision method that conductive anodic filament lost efficacy | |
| CN103547132A (en) | Electromagnetic interference shielding structure and flexible printed circuit board with same | |
| CN112867269B (en) | Method for cladding metal on side wall of PCB | |
| CN102519872B (en) | Bending instrument | |
| CN114571532A (en) | Die cutting device for manufacturing bending-proof folded copper foil die cutting piece and manufacturing method | |
| CN207252015U (en) | A kind of HDI circuits board blind hole fills out copper reliability test module | |
| CN1203302C (en) | Method and apparatus for detecting electrical steel surface coating | |
| CN111959095B (en) | Online health monitoring method for fiber reinforced metal laminated plate material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |