CN113088248B - Co-cured epoxy soybean oil-based wood adhesive and plasma enhancement method and application thereof - Google Patents

Co-cured epoxy soybean oil-based wood adhesive and plasma enhancement method and application thereof Download PDF

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CN113088248B
CN113088248B CN202110377994.9A CN202110377994A CN113088248B CN 113088248 B CN113088248 B CN 113088248B CN 202110377994 A CN202110377994 A CN 202110377994A CN 113088248 B CN113088248 B CN 113088248B
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soybean oil
plasma
adhesive
urea
wood adhesive
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CN113088248A (en
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段志刚
李涛洪
杜官本
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Southwest Forestry University
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J191/00Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27DWORKING VENEER OR PLYWOOD
    • B27D1/00Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B27D1/04Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
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  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
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Abstract

The invention discloses a co-cured epoxy soybean oil-based wood adhesive, a plasma enhancement method and application thereof, belonging to the technical field of wood processing production. The co-cured epoxy soybean oil-based wood adhesive comprises the following components in parts by weight: 70-85 parts of epoxidized soybean oil, 15-30 parts of urea-formaldehyde resin, 0.15-0.36 part of catalyst and 1 part of emulsifier. In the plasma enhancement method of the present invention, the plasma is a sliding arc discharge plasma. The plasma using method comprises the following steps: before the adhesive is used for gluing, activating the glued surface of the wood for 5-10 seconds by using plasma. The wood adhesive disclosed by the invention is simple in preparation method, has the advantages of good bonding performance, low formaldehyde release amount and the like, is convenient to implement, clean and environment-friendly, and can remarkably improve the bonding performance of the epoxy soybean oil-based wood adhesive.

Description

Co-cured epoxy soybean oil-based wood adhesive and plasma enhancement method and application thereof
Technical Field
The invention relates to the technical field of artificial board production in wood processing, in particular to a co-cured epoxy soybean oil-based wood adhesive and a plasma enhancement method and application thereof.
Background
The wood adhesive is used for producing wood artificial boards such as plywood, shaving board, fiber board and the like. The wood adhesive greatly determines the manufacturing process, the use scene, the cost and the quality of the artificial board. The wood adhesive is the core technical element of the artificial board industry. The contradiction between the technical requirement and the cost of the adhesive industry and the defects of the adhesive in use is a key reason for restricting the progress of the artificial board industry.
Currently, the adhesives widely used in the wood-based panel industry are mainly formaldehyde resins, including urea-formaldehyde resin (UF), phenol-formaldehyde resin (PF), melamine Formaldehyde (MF), and copolycondensation resins derived from these resins, such as MUF, PUF, and PMUF. Of these resins, urea-formaldehyde resin has been the largest resin used in various adhesives due to its excellent adhesion and low cost. But because formaldehyde is used as a raw material in the synthesis and the stability of a chemical structure is poor, the formaldehyde emission of the artificial board product is large. Formaldehyde easily binds to proteins of the human body to cause irritation reaction by inflammation of mucous membranes of eyes, nose and mouth. Various animal experiments also show that formaldehyde has definite carcinogenicity, and the world health organization in 2004 publishes No. 153 formaldehyde carcinogenic publication to determine that formaldehyde has carcinogenic effect on human bodies.
The most effective way to reduce the formaldehyde emission of wood-based panel products is to reduce the formaldehyde/urea molar ratio (F/U) in the resin synthesis. The F/U has been reduced to around 1.0 in current resin synthesis processes and the resulting resin is referred to as a low mole ratio urea-formaldehyde resin. The formaldehyde emission of artificial board products produced by the resin meets the most severe release standard at home and abroad. However, the formaldehyde emission is reduced and the adhesion properties of the resin are drastically deteriorated, and particularly, the water resistance is not satisfactory at all for use in a humid environment. It can be said that the contradiction between the formaldehyde emission and the performance has not been solved effectively so far. Other resins, such as PF, MF, MUF copolycondensation resins, etc., solve the problem of formaldehyde emission to some extent, but also cause problems of increased cost, complicated synthesis process, etc., and the problem of formaldehyde emission cannot be completely avoided. Another way to thoroughly solve the problem of formaldehyde release of the artificial board product is to completely abandon formaldehyde as a synthetic raw material, namely the formaldehyde-free resin in the true sense. At present, commercial adhesives represented by isocyanate adhesives (pMDI) are applied to the field of artificial board production to a certain extent, but the adhesives also have the problems of high price (which is dozens of times of urea-formaldehyde resin), high protection requirement in the production process, plate sticking in the plate pressing process and the like, so the using amount is very limited. The preparation of green adhesives with natural products instead of fossil raw materials is a hot spot in the current field of adhesive research, e.g. soy protein based adhesives based on vegetable proteins, tannin based adhesives based on natural polyphenols. However, according to the current research results, the biomass adhesive generally has the defect of poor water resistance, and the yield of the plant protein and the natural polyphenol is difficult to meet the requirement of large-scale application.
Although the epoxy resin adhesive has the advantages of good bonding performance, convenient use and the like, compared with the price of the artificial board, the use of the traditional epoxy resin adhesive can also cause the production cost of the artificial board to be greatly increased. Inspired by epoxy resin adhesives, the preparation of adhesives by ring-opening polymerization of epoxy groups in epoxy grease is concerned by many scholars. Since the emergence of transgenic soybeans, the yield of soybeans has increased dramatically worldwide, and soybean oil is not only satisfactory for eating but also useful as an industrial raw material. Epoxidized soybean oil can be obtained by subjecting soybean oil to epoxidation treatment. Currently, epoxidized soybean oil is now being produced industrially on a large scale and is being used in large quantities as a plasticizer for polyvinyl chloride. However, a lot of researches show that although the epoxy groups in the epoxy grease have high chemical activity, the epoxy grease is difficult to cure, and the curing agents (amines, acid anhydrides, acids, phenols and the like) of the traditional epoxy resin are almost ineffective for the epoxy grease, because the grease can be cured for several hours to more than ten hours at high temperature by using the curing agents, which is unacceptable for the production of artificial boards. The slow curing of epoxy grease is probably because the epoxy group is in the carbon chain, the reaction steric hindrance is large, and the macromolecular polymer is difficult to form. On the other hand, the epoxy grease itself has a low molecular weight, which results in a slow curing process. For both reasons, polymers having a high density of functional groups capable of reacting with epoxy groups, while being curable by themselves, may potentially solve the curing problem of epoxy greases. Urea-formaldehyde resins can certainly meet both requirements. On the one hand, a large number of methylol groups (-CH) in urea-formaldehyde resin polymers 2 OH) can react with epoxy group to generate ring-opening reaction, and hydroxyl generated by the ring-opening reaction can further react with epoxy group of other grease to polymerize. Namely, the urea resin plays a role in initiating ring-opening polymerization and crosslinking grease molecules. Essentially, the urea-formaldehyde resin can be co-cured with the grease. Urea-formaldehyde resins, on the other handIt is easy to cure, thereby improving the cohesion of the system. Although the urea-formaldehyde resin contains formaldehyde, the addition amount of the urea-formaldehyde resin can be far lower than the dosage of grease in actual use due to the large molecular weight and high functionality of the urea-formaldehyde resin, so that the problem of formaldehyde release is greatly weakened. Meanwhile, the urea-formaldehyde resin has the obvious advantages of mature synthesis process and low price.
Another way to promote the ring-opening curing of the epoxy structure is to modify the bonding interface of wood, so that the content of oxygen-containing groups such as hydroxyl and carboxyl on the bonding interface is increased and participates in the curing reaction. The plasma treatment can effectively improve the content of oxygen-containing groups on the surface of the wood, thereby promoting the curing.
The invention utilizes the advantages that the urea-formaldehyde resin has high-density active groups and is easy to cure, and the urea-formaldehyde resin and the epoxy grease are mixed to form the co-curing adhesive. Meanwhile, the surface of the wood is activated by adopting plasma, and the curing of the adhesive is further promoted by increasing the active groups of the gluing interface. The method is characterized in that a ternary rapid curing system of epoxy soybean oil-urea resin-activated gluing interface is constructed based on urea-formaldehyde resin and wood surface treatment technologies, the system is not only a formula and a preparation process of a novel adhesive, but also comprises a treatment method of a gluing interface, and the epoxy soybean oil-based adhesive and a plasma activated wood surface method are an inseparable complete co-curing system. The invention solves the problem of difficult curing of the epoxidized soybean oil, so that the epoxidized soybean oil-based adhesive has excellent bonding performance and simultaneously realizes extremely low formaldehyde emission of the artificial board.
At present, an epoxy soybean oil-based wood adhesive with low formaldehyde emission and a plasma enhancement method and application thereof are lacked.
Disclosure of Invention
The invention aims to provide a co-curing epoxy soybean oil-based wood adhesive with renewable raw materials and low formaldehyde emission, a plasma reinforcing method and application thereof. The gluing performance can be effectively improved by treating the wood gluing interface through the sliding arc discharge plasma.
In order to solve the problems in the prior art, the technical scheme adopted by the invention is as follows: the invention relates to a co-cured epoxy soybean oil-based wood adhesive, which comprises the following components in parts by weight: 70-85 parts of epoxidized soybean oil, 15-30 parts of urea-formaldehyde resin, 0.15-0.36 part of catalyst and 1 part of emulsifier, wherein the epoxy value of the epoxidized soybean oil is more than or equal to 6.0.
The urea-formaldehyde resin is used as a co-curing component of the epoxidized soybean oil, the molar ratio of formaldehyde to urea F/U is 1.5-2.0, the solid content of the urea-formaldehyde resin is 50-60%, the urea-formaldehyde resin is added with a catalyst before being mixed with the epoxidized soybean oil, and the added catalyst has the function that the catalyst reacts with free formaldehyde to generate strong acid (such as HCl and H) 2 SO 4 ). According to experimental values, when the addition amount of the urea-formaldehyde resin is 30 parts, the formaldehyde release is greatly smaller than the E1 (GB 18580-2017) grade release standard, and the specific addition amount is determined according to the formaldehyde release limit requirement of the artificial board.
Further, the catalyst is NH 4 Cl or NH 4 SO 4 Any one of the above; the dosage of the catalyst is calculated by the mass of the solid content of the urea-formaldehyde resin, and is 2.0 percent; the emulsifier is any one of tween 80, lauric acid methyl soap or soybean lecithin. And other emulsifiers which can uniformly mix the components of the formula and can not be separated and precipitated within 2 hours are also contained.
The preparation method of the co-cured epoxy soybean oil-based wood adhesive comprises the following steps:
(1) Weighing the components according to the weight ratio.
(2) Continuously stirring the epoxy soybean oil, the urea-formaldehyde resin containing the catalyst and the emulsifier at normal temperature until the epoxy soybean oil, the urea-formaldehyde resin and the emulsifier are uniformly mixed to prepare the co-cured epoxy soybean oil-based wood adhesive.
Further, in the step (1), the urea-formaldehyde resin is added with a catalyst before being mixed with the epoxidized soybean oil and reacts for 15 minutes at room temperature; in the step (2), the components are uniformly mixed and are kept for 2 hours without layering and precipitation.
The invention discloses a plasma co-curing method of co-curing epoxy soybean oil-based wood adhesive, which comprises the following steps: when the epoxy soybean oil-based adhesive is used for manufacturing the plywood, a sliding arc discharge plasma is adopted to treat a wood gluing interface before gluing, the used plasma discharge mode comprises and is not limited to a sliding arc discharge mode, and the principle is that the oxygen-containing groups such as hydroxyl groups and the like on the surface of a wood board to be glued can be obviously increased after treatment.
Further, placing the single plate on a self-made sliding arc plasma processing device, wherein the width of plasma jet is larger than that of the single plate to be processed, and the distance between a plasma nozzle and the single plate is 2-3cm; adjusting the discharge power of a low-temperature plasma power supply to 2000W, performing treatment on a gluing interface for 5-10s by adopting sliding arc discharge plasma before gluing, and gluing the activated surface of the wood within 30min after treatment.
The invention relates to the application of the co-curing epoxy soybean oil-based wood adhesive and the plasma co-curing technology in the preparation of artificial boards.
Has the beneficial effects that: the adhesive has the characteristics of renewable raw materials, excellent bonding performance and low formaldehyde emission. The invention discloses a method for preparing a co-curing system of an adhesive-wood interface by treating a wood gluing interface through sliding arc discharge plasma.
Compared with the prior art, the invention has the following advantages:
(1) The invention uses the epoxidized soybean oil with renewable raw materials as the main component of the adhesive, and the formula has the characteristics of green and sustainability. Meanwhile, the urea-formaldehyde resin with mature synthesis process and low cost is used as the co-curing component of the epoxidized soybean oil, so that the problem of difficult curing of the epoxidized soybean oil is solved, the effective fusion with the prior art is realized, and the cost of the adhesive is reduced.
(2) The formula of the epoxy soybean oil-based wood adhesive prepared by the invention contains urea-formaldehyde resin, but the dosage of the urea-formaldehyde resin is small. Compared with pure urea-formaldehyde resin with equivalent bonding performance, the epoxy soybean oil-based wood adhesive adopts the epoxy soybean oil as the main raw material, so that the formaldehyde release amount of an artificial board prepared by the adhesive is obviously reduced, and the balance of bonding performance, environmental protection and economy is realized.
(3) The method for treating the wood bonding interface by the sliding arc plasma to realize the co-curing system can effectively enhance the bonding performance of the epoxy-based soybean oil, and is simple and convenient to operate and environment-friendly.
(4) The plywood pressed by the resin prepared by the invention can reach the requirement of national standard GB/T9846-2015 ordinary plywood on the water resistance of second-class boards, and can meet the use requirement of artificial board products in a high-humidity environment.
Detailed Description
To further clarify the objects, technical solutions and advantages of the present application, the present invention will be further described with reference to the following examples, which include, but are not limited to, the following examples. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Example 1
The co-cured epoxy soybean oil-based wood adhesive comprises the following raw materials in parts by weight: 70 parts of epoxidized soybean oil, 30 parts of urea-formaldehyde resin, 0.36 part of catalyst and 1 part of emulsifier, wherein the epoxy value of the epoxidized soybean oil is more than or equal to 6.0.
The solid content of the urea-formaldehyde resin is 60%, and the molar ratio of formaldehyde to urea F/U is 1.5; the catalyst is NH 4 Cl; the emulsifier is Tween 80.
The preparation method of the co-cured epoxy soybean oil-based wood adhesive comprises the following steps:
(1) Weighing the components according to the weight ratio, adding a catalyst into the urea resin, and reacting at room temperature for 15 minutes for later use.
(2) Continuously stirring the epoxidized soybean oil, the urea-formaldehyde resin containing the catalyst and the emulsifier at normal temperature until the materials are uniformly mixed, and keeping the materials for 2 hours without layering and precipitation to prepare the co-cured epoxidized soybean oil-based wood adhesive.
The plasma co-curing method of the co-curing epoxy soybean oil-based wood adhesive comprises the following steps: when the epoxy soybean oil-based adhesive is used for manufacturing the plywood, a sliding arc discharge plasma is adopted to treat a wood gluing interface before gluing, a veneer is placed below a nozzle of a sliding arc plasma treatment device, and the distance between the plasma nozzle and the veneer is 2-3cm; and regulating the discharge power of the low-temperature plasma power supply to 2000W. The width of the plasma jet is larger than that of the veneer to be treated, the sliding arc discharge plasma is adopted to treat the gluing interface for 10s before gluing, and the activated surface gluing of the wood can be carried out within 30min after the treatment.
Example 2
Example 2 differs from example 1 in that: the epoxy soybean oil-based wood adhesive comprises the following raw materials in parts by weight: 85 parts of epoxidized soybean oil, 15 parts of urea-formaldehyde resin, 0.18 part of catalyst and 1 part of emulsifier, wherein the epoxy value of the epoxidized soybean oil is more than or equal to 6.0. (ii) a The solid content of the urea-formaldehyde resin is 60%, and the molar ratio of formaldehyde to urea F/U is 2.0; the catalyst is NH 4 SO 4 (ii) a The emulsifier is soybean phospholipid.
The invention discloses a plasma co-curing method of co-curing epoxy soybean oil-based wood adhesive, which comprises the following steps: when the epoxy soybean oil-based adhesive is used for manufacturing the plywood, a sliding arc discharge plasma is adopted to treat a wood gluing interface before gluing, a veneer is placed below a nozzle of a sliding arc plasma treatment device, and the distance between the plasma nozzle and the veneer is 2-3cm; and regulating the discharge power of the low-temperature plasma power supply to 2000W. The width of the plasma jet is larger than that of the veneer to be treated, the sliding arc discharge plasma is adopted to treat the gluing interface for 8s before gluing, and the activated surface gluing of the wood can be carried out within 30min after the treatment.
Example 3
Example 3 differs from example 1 in that: the epoxy soybean oil-based wood adhesive comprises the following raw materials in parts by weight: 80 parts of epoxidized soybean oil, 20 parts of urea-formaldehyde resin, 0.2 part of catalyst and 1 part of emulsifier, wherein the epoxy value of the epoxidized soybean oil is more than or equal to 6.0. (ii) a The solid content of the urea-formaldehyde resin is 50%, and the molar ratio of formaldehyde to urea F/U is 2.0; the catalyst is NH 4 SO 4 (ii) a The describedThe emulsifier of (2) is lauric acid soap.
The plasma co-curing method of the co-curing epoxy soybean oil-based wood adhesive comprises the following steps: when the epoxy soybean oil-based adhesive is used for manufacturing the plywood, a sliding arc discharge plasma is adopted to treat a wood gluing interface before gluing, a single board is arranged below a nozzle of a sliding arc plasma treatment device, and the distance between the nozzle of the plasma and the single board is 2-3cm; and regulating the discharge power of the low-temperature plasma power supply to 2000W. The width of the plasma jet is larger than that of the veneer to be treated, the sliding arc discharge plasma is adopted to treat the gluing interface for 5s before gluing, and the activated surface gluing of the wood can be carried out within 30min after the treatment.
Example 4
Example 4 differs from example 1 in that: the epoxy soybean oil-based wood adhesive comprises the following raw materials in parts by weight: 75 parts of epoxidized soybean oil, 25 parts of urea-formaldehyde resin, 0.25 part of catalyst and 1 part of emulsifier, wherein the epoxy value of the epoxidized soybean oil is more than or equal to 6.0. (ii) a The solid content of the urea-formaldehyde resin is 50%, and the molar ratio of formaldehyde to urea F/U is 1.5; the catalyst is NH 4 Cl; the emulsifier is tween-80.
The plasma co-curing method of the co-curing epoxy soybean oil-based wood adhesive comprises the following steps: when the epoxy soybean oil-based adhesive is used for manufacturing the plywood, a sliding arc discharge plasma is adopted to treat a wood gluing interface before gluing, a veneer is placed below a nozzle of a sliding arc plasma treatment device, and the distance between the plasma nozzle and the veneer is 2-3cm; and regulating the discharge power of the low-temperature plasma power supply to 2000W. The width of the plasma jet is larger than that of the veneer to be treated, the sliding arc discharge plasma is adopted to treat the gluing interface for 7s before gluing, and the activated surface gluing of the wood can be carried out within 30min after the treatment.
Example 5
Example 5 differs from example 1 in that: the epoxy soybean oil-based wood adhesive comprises the following raw materials in parts by weight: 80 parts of epoxidized soybean oil, 30 parts of urea-formaldehyde resin, 0.36 part of catalyst and 1 part of emulsifier, wherein the epoxy value of the epoxidized soybean oil is more than or equal to 6.0. (ii) a What is neededThe solid content of the urea-formaldehyde resin is 50 percent, and the molar ratio of formaldehyde to urea F/U is 2.0; the catalyst is NH 4 SO 4 (ii) a The emulsifier is lauric acid soap.
The invention discloses a plasma co-curing method of co-curing epoxy soybean oil-based wood adhesive, which comprises the following steps: when the epoxy soybean oil-based adhesive is used for manufacturing the plywood, a sliding arc discharge plasma is adopted to treat a wood gluing interface before gluing, a veneer is placed below a nozzle of a sliding arc plasma treatment device, and the distance between the plasma nozzle and the veneer is 2-3cm; and regulating the discharge power of the low-temperature plasma power supply to 2000W. The width of the plasma jet is larger than that of the veneer to be treated, the sliding arc discharge plasma is adopted to treat the gluing interface for 6s before gluing, and the activated surface gluing of the wood can be carried out within 30min after the treatment.
Comparative example 1
The dosage of the formaldehyde resin adhesive is reduced by 30 to 70 percent compared with the dosage of the prior gluing method by carrying out normal pressure DBD plasma modification treatment on a veneer in a patent of manufacturing method of the low-gluing-amount environment-friendly plywood (the patent number is CN 201610206056.1). The purpose of the plasma treatment of the wood surface is to reduce the amount of glue applied, and the adhesives used include conventional formaldehyde-based resins such as urea-formaldehyde, melamine-formaldehyde and phenol-formaldehyde resins. The plasma employed, the purpose of the treatment and the adhesive targeted are all different from the present invention.
Test example 1
The adhesives prepared in the examples 1 to 5 are respectively taken, poplar veneers with the thickness of 2mm are used for manufacturing three-layer plywood, and the glue application amount is 200g/m 2 (the double-side glue application amount of the core layer plate), the physical and mechanical properties of the plate are tested according to the national standard GB/T17657-2013 physicochemical property test method for artificial boards and decorative artificial boards, and the water resistance of the plate is mainly tested. The specific results are as follows:
the hot pressing temperature is 160 ℃, the hot pressing time is 5 minutes, and the wet bonding strength of the test piece after being soaked in hot water at 63 ℃ for 3 hours is 1.2-1.4 Mpa. If the plasma is adopted to treat the wood bonding interface before sizing, the wet bonding strength is improved to 1.6-1.9 Mpa.
The adhesives prepared in the examples 1-5 are respectively taken, poplar veneers with the thickness of 2mm are used for manufacturing three-layer plywood, and the 1m plywood is prepared according to the 1m specification in the test method for the physical and chemical properties of artificial boards and decorative artificial boards of GB/T17657-2013 3 The formaldehyde emission of the plate is detected by a weather box method, and the detection result shows that the formaldehyde emission is 0.05-0.07 mg/m 3 Meets the E1 level release limit requirement (0.124 mg/m) specified by the national standard GB 18580-2017 3 )。
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the foregoing description only for the purpose of illustrating the principles of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims, specification, and equivalents thereof.

Claims (6)

1. A co-cured epoxy soybean oil-based wood adhesive is characterized in that: the co-cured epoxy soybean oil-based wood adhesive comprises the following components in parts by weight:
70-85 parts of epoxidized soybean oil,
15-30 parts of urea-formaldehyde resin,
0.15 to 0.36 portion of catalyst,
1 part of an emulsifier;
the epoxy value of the epoxidized soybean oil is more than or equal to 6.0; the urea-formaldehyde resin is used as a co-curing component of epoxidized soybean oil, the molar ratio of formaldehyde to urea F/U is 1.5-2.0, and the solid content is 50-60%; the catalyst is NH 4 Cl or NH 4 SO 4 Any one of the above; the emulsifier is any one of tween 80, lauric acid methyl soap or soybean lecithin.
2. The method of making the co-cured epoxidized soybean oil-based wood adhesive of claim 1 comprising the steps of:
(1) Weighing the components according to the weight ratio of claim 1,
(2) Continuously stirring the epoxidized soybean oil, the urea-formaldehyde resin containing the catalyst and the emulsifier at normal temperature until the materials are uniformly mixed to prepare the co-cured epoxidized soybean oil-based wood adhesive.
3. The method of making a co-cured epoxidized soybean oil-based wood adhesive of claim 2, wherein: in the step (1), the urea-formaldehyde resin is added with a catalyst before being mixed with the epoxidized soybean oil and reacts for 15 minutes at room temperature; in the step (2), all components of the adhesive are uniformly mixed and are kept for 2 hours without layering and precipitation.
4. The plasma co-cure method of co-curing an epoxidized soy oil-based wood adhesive of claim 3 comprising the steps of: when the epoxy soybean oil-based adhesive is used for manufacturing the plywood, a sliding arc discharge plasma is adopted to treat a wood gluing interface before gluing, and the plasma discharge mode is a sliding arc discharge mode.
5. The plasma co-cure method of co-curing an epoxidized soy oil-based wood adhesive of claim 4 wherein: the jet width of the plasma is larger than that of the single plate to be treated, and the distance between a plasma nozzle and the single plate is 2-3cm; adjusting the discharge power of a low-temperature plasma power supply to 2000W, performing treatment on a gluing interface for 5-10s by adopting sliding arc discharge plasma before gluing, and gluing the activated surface of the wood within 30min after the treatment.
6. Use of the co-cured epoxy soy oil-based wood adhesive of claim 1 in the preparation of a manufactured board.
CN202110377994.9A 2021-04-08 2021-04-08 Co-cured epoxy soybean oil-based wood adhesive and plasma enhancement method and application thereof Active CN113088248B (en)

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