CN113084622B - Chemical polishing machine for display substrate production and polishing method thereof - Google Patents
Chemical polishing machine for display substrate production and polishing method thereof Download PDFInfo
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- CN113084622B CN113084622B CN202110221404.3A CN202110221404A CN113084622B CN 113084622 B CN113084622 B CN 113084622B CN 202110221404 A CN202110221404 A CN 202110221404A CN 113084622 B CN113084622 B CN 113084622B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to the technical field of displays and discloses a chemical polishing machine for producing a display substrate.
Description
Technical Field
The invention relates to the technical field of displays, in particular to a chemical polishing machine for producing a display substrate and a polishing method thereof.
Background
The display is a display tool which is required in many places today, and can display electronic documents through a screen, and is researched and produced by many manufacturers due to the display function, but the production process is still very strict, and in order to achieve a better display effect, the manufacturing process of a glass substrate on a display substrate has strict requirements, and the transmittance and the definition of the glass substrate are increased, and generally, a key procedure of polishing and grinding is required in the production process, so that the surface of the glass substrate can be smooth and flat without scratches, and thus, the display tool can well protect the eyes of a user, but some problems still exist when a polishing machine is used:
1. the polishing pad is in contact friction with the glass substrate during polishing, and meanwhile, the polishing solution is continuously dripped aside, the polishing solution and the surface of the glass substrate generate an oxide film and the oxide film is dissolved in the polishing solution, but the speed of the polishing solution is lower than that of the polishing solution, so that the polishing pad can polish the surface of the glass substrate to be smoother and flatter in the continuous polishing process, but a larger centrifugal force can be generated in the working process of the polishing pad, on one hand, the polishing solution can be thrown away to the periphery under the action of the centrifugal force, so that not only is waste and certain pollution caused, but also on the other hand, the polishing solution can be thrown away to cause uneven or insufficient polishing solution at the part of the polishing substrate, so that the polished substrate is not flatter and is not beneficial to subsequent production and use;
2. because the polishing pad can rub with the rete contact of base plate surface production at the in-process of polishing, polish like this and will form certain mixed polishing solution after polishing, contain a lot of polishing and polish the tiny particle that gets off, just so to hardly take away these mixed polishing solutions to the mode of leaning on one side dropping liquid, be unfavorable for subsequent abundant polishing, the polishing solution only plays the effect of transition simultaneously, just be discharged by the aggregate soon, just so lead to adding new polishing solution always, the cost is higher, still make a lot of polishing solutions combine just to be thrown away with the base plate simultaneously, the utilization ratio of polishing solution is lower.
Disclosure of Invention
Aiming at the defects of the background technology, the invention provides the chemical polishing machine for producing the display substrate and the polishing method thereof, which have the advantages of good polishing effect and energy-saving resources and solve the problems in the background technology.
The invention provides the following technical scheme: the utility model provides a chemical polishing machine is used in production of display base plate, includes the organism, and the top fixed mounting of organism has the roof-rack, and the polishing groove has been seted up at the top of organism, and the organism is inside to be located polishing groove bottom fixed mounting has the motor, and the top output end fixedly connected with polishing dish of motor, the top fixed mounting of polishing dish has the polishing pad, and the roof-rack is located the bottom surface fixed mounting of polishing groove top position has the rubbing head, and the middle part movable mounting of rubbing head bottom surface has anchor clamps, the feed liquor lumen that is cross intercommunication is seted up to the inside bottom of polishing dish, the column groove with feed liquor lumen center intercommunication is seted up at the middle part of polishing pad, the gland has been cup jointed in the inside activity of column groove, the first reset spring of fixedly connected with between the bottom outer lane of gland and the feed liquor lumen inner wall, the inboard diapire department of polishing groove is cross distribution fixed mounting has the lug, polishing dish top outer lane movable mounting has the bearing, fixed mounting has the filter screen between bearing outer lane and the polishing groove inner wall, feed liquor lumen middle part fixed mounting has the check valve, the outer port activity of feed liquor lumen has cup jointed the slider, fixedly connected with the second reset spring between slider and the check valve, the inside clamp has seted up the inner wall of rubbing head.
Preferably, the inside middle part of polishing dish is evenly spaced apart to be equipped with the magnetic ring groove, annular magnet has been cup jointed in the top activity of magnetic ring groove, annular magnet's bottom fixed mounting has the bevel piece, the magnetic ring groove is close to one side of the centre of a circle even interval and installs the kicking block, the kicking block is close to fixedly connected with spacing spring between the inside of the side of the centre of a circle and the magnetic ring inslot wall, annular regulation chamber has been seted up to the inside of rubbing head bottom, the inside even activity in regulation chamber has cup jointed bar magnet, bar magnet's top fixedly connected with wire drawing.
Preferably, the cross-section of slider is the L form, the outer end size and the feed liquor lumen looks adaptation of slider, the slider blocks up the feed liquor lumen completely with the lug when pushing up maximum position.
Preferably, the magnetic force generated by the top of the ring magnet is the same, the weight of each ring magnet is the same, and the top magnetic pole of the ring magnet is the same as the bottom magnetic pole of the bar magnet.
Preferably, the outer side of the polishing head is communicated with a polishing liquid pipe, the polishing liquid pipe is communicated to the liquid guide hole, and the bottom of the liquid guide hole is provided with a liquid drop port.
Preferably, the sum of the widths of the ring magnets is equal to the diameter of the bottom end of the polishing head, and the polishing head is positioned right above the ring magnets and parallel to the ring magnets.
The invention also provides an operation method of the chemical polishing machine for producing the display substrate, which comprises the following operation steps:
s1, fixing a substrate on a clamp, connecting a polishing solution with a conveying pipeline of a polishing head, and driving a polishing disc to rotate by a starting switch through a motor;
s2, the substrate is in contact with the polishing pad for polishing, polishing liquid continuously drops from the liquid guide pipe, and the thrown polishing liquid flows through the filter screen and enters the bottom of the polishing groove;
and S3, the polishing disk rotates the bump to press the sliding block to extrude and overflow the polishing liquid from the top of the column groove and throw the polishing liquid to the bottom of the polishing head for reuse.
The invention has the following beneficial effects:
1. through the polishing groove that sets up the indent at the organism inside, and the design cooperation that adopts the overlay type on the burnishing head has the post groove, compare in prior art, utilize this design can guarantee that the polishing solution can not get rid of the position beyond the organism, the design that utilizes the burnishing head simultaneously can guarantee that the polishing solution can not cause the not enough condition in its cover department, and utilize the post groove can also ceaselessly to provide the polishing solution on the polishing pad, keep the base plate throughout can with the abundant contact of polishing solution at the burnishing and polishing in-process, and then make the display substrate surface that processes out more level and smooth.
2. Through the design of the ring magnet and the bar magnet that set up, and the cooperation is installed on polishing dish and polishing head, compare in prior art, the mixed polishing solution that produces when the polishing is thrown away to the outside is close to the through liquid mouth of polishing dish outside one end and is opened great, the mixed polishing solution that is more favorable to mixing polishing particle is thrown away and is filtered so that reuse through the filter screen, cyclic utilization can reduce the continued desirability to the polishing solution, resources are saved increases the utilization ratio more, still play the effect of erodeing the polishing pad surface to the polishing solution of coming out from the column groove simultaneously, also do benefit to the abundant contact that improves polishing pad and base plate, improve the quality of polishing.
Drawings
FIG. 1 is an overall half-sectional view of the structure of the present invention;
FIG. 2 is a transverse sectional view of the liquid inlet pipe cavity of the structure of the invention;
FIG. 3 is a cross-sectional view of the magnetic ring slot of the present invention;
FIG. 4 is an enlarged view taken at A in FIG. 1;
FIG. 5 is a cross-sectional view of a polishing head structure according to the present invention.
In the figure: 1. a body; 101. a polishing tank; 2. a top frame; 3. a motor; 4. a polishing pad; 401. a liquid inlet pipe cavity; 402. a magnetic ring groove; 5. a polishing pad; 6. a polishing head; 601. a drain hole; 602. a liquid through port; 603. An adjustment chamber; 7. a clamp; 8. a column groove; 9. a gland; 10. a filter screen; 11. a first return spring; 12. A bump; 13. a slider; 14. a one-way valve; 15. a bearing; 16. a second return spring; 17. a ring magnet; 18. a bevel block; 19. a top block; 20. a limiting spring; 21. a bar magnet; 22. and (4) drawing.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, a chemical polishing machine for producing a display substrate comprises a machine body 1, a top frame 2 is fixedly installed on the top of the machine body 1, a polishing groove 101 is formed on the top of the machine body 1, a motor 3 is fixedly installed inside the machine body 1 and positioned at the bottom of the polishing groove 101, a polishing disk 4 is fixedly connected to the output end of the top of the motor 3, a polishing pad 5 is fixedly installed on the top of the polishing disk 4, a polishing head 6 is fixedly installed on the bottom surface of the top frame 2 positioned at the top of the polishing groove 101, a clamp 7 is movably installed in the middle of the bottom surface of the polishing head 6, a liquid inlet pipe cavity 401 communicated in a cross shape is formed in the bottom of the polishing disk 4, a column groove 8 communicated with the center of the liquid inlet pipe cavity 401 is formed in the middle of the polishing pad 5, a gland 9 is movably sleeved inside the column groove 8, a first return spring 11 is fixedly connected between the bottom outer ring of the gland 9 and the inner wall of the liquid inlet pipe cavity 401, and bumps 12 are fixedly installed at the bottom wall of the inner side of the polishing groove 101 in a cross shape, a bearing 15 is movably arranged on the outer ring of the top of the polishing disc 4, a filter screen 10 is fixedly arranged between the outer ring of the bearing 15 and the inner wall of the polishing groove 101, a check valve 14 is fixedly arranged in the middle of the pipe section of the liquid inlet pipe cavity 401, a slide block 13 is movably sleeved on the outer port of the liquid inlet pipe cavity 401, a second reset spring 16 is fixedly connected between the slide block 13 and the check valve 14, liquid guide holes 601 are formed in the periphery of a clamp 7 in the polishing head 6, liquid through holes 602 are uniformly formed in the inner wall of the bottom of the polishing head 6, magnetic ring grooves 402 are uniformly arranged in the middle of the inside of the polishing disc 4 at intervals, an annular magnet 17 is movably sleeved on the top of the magnetic ring grooves 402, bevel blocks 18 are fixedly arranged at the bottom of the annular magnet 17, ejector blocks 19 are uniformly arranged at intervals on one side of the magnetic ring grooves 402, and limiting springs 20 are fixedly connected between the inner wall of the magnetic ring grooves 402 and the inner wall of the ejector blocks 19 on the side close to the center of the center, annular regulation chamber 603 has been seted up to the inside of polishing head 6 bottom, and the even activity of the inside of adjusting chamber 603 has cup jointed bar magnet 21, the top fixedly connected with wire drawing 22 of bar magnet 21.
The cross section of the sliding block 13 is L-shaped, the size of the outer end of the sliding block 13 is matched with the liquid inlet pipe cavity 401, the sliding block 13 completely blocks the liquid inlet pipe cavity 401 when the sliding block 13 and the convex block 12 are pushed to the maximum position, the sliding block 13 and the convex block 12 act together to play a role in liquid supply, and a certain amount of polishing liquid can be extruded through the one-way valve 14 to enter the liquid inlet pipe cavity 401 and finally flow out of the top of the column groove 8 after each extrusion.
Wherein, the magnetic force size that annular magnet 17 produced the top is the same and each annular magnet 17's weight is the same, annular magnet 17's top magnetic pole is the same with bar magnet 21's bottom magnetic pole, utilize annular magnet 17 to produce certain repulsion effect to bar magnet 21 at top, because the annular magnet 17 that is close to the outer lane just can upwards lift under the roof pressure of kicking block 19, thereby again according to the effect that the same magnetic pole is repelled makes bar magnet 21 inside of rubbing head 6 move up thereby enlarge the size of leading to liquid mouth 602, more do benefit to inside mixed polishing solution and flow.
Wherein, the outside intercommunication of polishing head 6 has the polish liquid pipe and polish liquid pipe to lead liquid hole 601, and the drip mouth has been seted up to the bottom of leading liquid hole 601, through leading liquid hole 601 downwards dropwise add the polishing solution can guarantee that the direct action of polishing solution more does benefit to the polishing of base plate to the polishing position, has also avoided dripping directly to throw away on polishing pad 5 simultaneously.
Wherein, the width sum of ring magnet 17 equals the diameter of 6 bottoms of burnishing heads and burnishing heads 6 are in directly over ring magnet 17 and keep parallel with it, and ring magnet 17 corresponds with the inside bar magnet 21 of burnishing heads 6 and plays the magnetic force relation, has guaranteed like this to play certain even stable effect.
The polishing method of the chemical polishing machine for producing the display substrate comprises the following operation steps:
s1, fixing a substrate on a clamp 7, communicating a polishing solution with a conveying pipeline of a polishing head, and driving a polishing disc 4 to rotate by a starting switch through a motor 3;
s2, the substrate is in contact with the polishing pad 5 for polishing, the liquid guide pipe continuously drops polishing liquid, and the thrown polishing liquid flows into the bottom of the polishing groove 101 through the filter screen 10;
and S3, the polishing disk 4 rotates the bump 12 to press the slider 13 to extrude the polishing liquid to overflow from the top of the column groove 8 and throw the polishing liquid to the bottom of the polishing head 6 for reuse.
The working principle is that before the polishing device is used, a substrate is mounted on a clamp 7 at the bottom of a polishing head 6 and is firmly fixed, a polishing solution connecting pipe of the polishing head 6 is well connected, a switch is started, a motor 3 rotates and drives a polishing disk 4 to rotate together, the polishing disk 4 drives a polishing pad 5 to rotate and polishes an oxide film formed at the bottom of the substrate smoothly, a liquid guide hole 601 at the top continuously drips downwards in the polishing and polishing process, a top block 19 inside a magnetic ring groove 402 is thrown outwards under the action of centrifugal force and pushes up an annular magnet 17 upwards through a bevel block 18, the annular magnet 17 close to the outer ring is pushed up more due to the fact that the centrifugal force applied to the top block 19 is larger, the annular magnet 17 and a strip magnet 21 in a regulating cavity 603 of the polishing head 6 generate repulsive force and are pushed up upwards, when the polishing solution 6 rotates to be close to the outer side, the strip magnet 21 is pushed up more, a liquid through a liquid inlet 602 is opened more, mixed polishing solution after internal polishing flows out, the polishing solution flowing down from the polishing pad 5 can pass through a filter 10 and then flows to the polishing pad 4 downwards and then flows to the polishing pad 4 and is pushed into a polishing pad cavity 12 to be more beneficial to push the inner side of a polishing pad after the polishing pad 5, and the polishing solution is pushed into a top of a polishing pad pipe cavity 12, and is pushed into the polishing pad.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a chemical polishing machine is used in production of display base plate, including organism (1), the top fixed mounting of organism (1) has roof-rack (2), polishing groove (101) have been seted up at the top of organism (1), organism (1) inside is located polishing groove (101) bottom position fixed mounting has motor (3), the top output end fixedly connected with polishing dish (4) of motor (3), the top fixed mounting of polishing dish (4) has polishing pad (5), the bottom surface fixed mounting that roof-rack (2) are located polishing groove (101) top position has rubbing head (6), the middle part movable mounting of rubbing head (6) bottom surface has anchor clamps (7), its characterized in that: the polishing device is characterized in that a liquid inlet pipe cavity (401) which is communicated in a cross manner is formed in the bottom inside the polishing disc (4), a column groove (8) which is communicated with the center of the liquid inlet pipe cavity (401) is formed in the middle of the polishing pad (5), a gland (9) is movably sleeved in the column groove (8), a first reset spring (11) is fixedly connected between the outer ring of the bottom of the gland (9) and the inner wall of the liquid inlet pipe cavity (401), bumps (12) are fixedly arranged at the bottom wall of the inner side of the polishing groove (101) in a cross distribution manner, a bearing (15) is movably arranged at the outer ring of the top of the polishing disc (4), a filter screen (10) is fixedly arranged between the outer ring of the bearing (15) and the inner wall of the polishing groove (101), a one-way valve (14) is fixedly arranged in the middle of the pipe section of the liquid inlet pipe cavity (401), a sliding block (13) is movably sleeved at the outer port of the liquid inlet pipe cavity (401), a second reset spring (16) is fixedly connected between the sliding block (13) and the one-way valve (14), liquid guide holes (601) are formed in the positions of the inner side of the clamp (7) inside the polishing head (6), and liquid guide holes (602) are uniformly formed in the inner wall of the bottom of the polishing head (6);
polishing dish (4) inside middle part is evenly spaced apart to be equipped with magnetic ring groove (402), annular magnet (17) have been cup jointed in the top activity of magnetic ring groove (402), the bottom fixed mounting of annular magnet (17) has bevel block (18), ejector block (19) have been installed near the even interval in one side in the centre of a circle in magnetic ring groove (402), fixedly connected with spacing spring (20) between the inside that ejector block (19) are close to the centre of a circle side and magnetic ring groove (402) inner wall, annular regulation chamber (603) have been seted up to the inside of rubbing head (6) bottom, the inside even activity of adjusting chamber (603) has been cup jointed bar magnet (21), the top fixedly connected with wire drawing (22) of bar magnet (21), the magnetic force size that annular magnet (17) produced to the top is the same and the weight of each annular magnet (17) is the same, the top magnetic pole of annular magnet (17) is the same with the bottom magnetic pole of bar magnet (21), the width sum of annular magnet rubbing head (17) equals the diameter of bottom, and rubbing head (6) are in just above annular magnet (17) and keep parallel rather than it.
2. The chemical polisher for display substrate production according to claim 1, wherein: the cross-section of slider (13) is the L form, the outer end size and the feed liquor lumen (401) looks adaptation of slider (13), when slider (13) and lug (12) top to the maximum position, slider (13) will feed liquor lumen (401) is stopped up completely.
3. The chemical polisher for display substrate production according to claim 1, wherein: the outer side of the polishing head (6) is communicated with a polishing liquid pipe, the polishing liquid pipe is communicated to the liquid guide hole (601), and the bottom of the liquid guide hole (601) is provided with a liquid dropping opening.
4. A polishing method of a chemical polisher for display substrate production as set forth in any one of claims 1 to 3, characterized in that: the operation steps are as follows:
s1, fixing a substrate on a clamp (7), connecting a polishing solution and a conveying pipeline of a polishing head, and starting a switch to drive a polishing disk (4) to rotate through a motor (3);
s2, the substrate is in contact with a polishing pad (5) for polishing, polishing liquid continuously drops from the liquid guide hole, and the thrown polishing liquid flow filter screen (10) enters the bottom of the polishing tank (101);
and S3, the polishing disk (4) rotates the bump (12) to press the slider (13) to extrude and overflow the polishing liquid from the top of the column groove (8) and throw the polishing liquid to the bottom of the polishing head (6) for reuse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110221404.3A CN113084622B (en) | 2021-02-27 | 2021-02-27 | Chemical polishing machine for display substrate production and polishing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110221404.3A CN113084622B (en) | 2021-02-27 | 2021-02-27 | Chemical polishing machine for display substrate production and polishing method thereof |
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| CN113084622A CN113084622A (en) | 2021-07-09 |
| CN113084622B true CN113084622B (en) | 2023-01-13 |
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| CN114800218B (en) * | 2022-04-12 | 2023-03-28 | 江苏富乐华功率半导体研究院有限公司 | Liquid circulation polishing device suitable for surface coating treatment of metallized ceramic substrate |
| CN115008342B (en) * | 2022-06-15 | 2023-08-25 | 安徽禾臣新材料有限公司 | Corner collapse preventing wax-free pad for wafer polishing and production process thereof |
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| JPH0945642A (en) * | 1995-07-26 | 1997-02-14 | Sony Corp | Method and device for grinding semiconductor substrate |
| CN108857754A (en) * | 2018-08-01 | 2018-11-23 | 蚌埠惊涛精密机械有限公司 | A kind of self-clean type glass polishing machine |
| CN111941267A (en) * | 2020-08-13 | 2020-11-17 | 张俊玲 | Semiconductor silicon wafer polishing machine |
| CN112192436A (en) * | 2020-10-15 | 2021-01-08 | 上海理工大学 | Self-adjusting elastic energy-saving polishing device |
| CN112338763A (en) * | 2020-09-22 | 2021-02-09 | 温州奥爵文贸易有限责任公司 | Polishing device capable of sensing conditions by utilizing mirror reflection |
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2021
- 2021-02-27 CN CN202110221404.3A patent/CN113084622B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0945642A (en) * | 1995-07-26 | 1997-02-14 | Sony Corp | Method and device for grinding semiconductor substrate |
| CN108857754A (en) * | 2018-08-01 | 2018-11-23 | 蚌埠惊涛精密机械有限公司 | A kind of self-clean type glass polishing machine |
| CN111941267A (en) * | 2020-08-13 | 2020-11-17 | 张俊玲 | Semiconductor silicon wafer polishing machine |
| CN112338763A (en) * | 2020-09-22 | 2021-02-09 | 温州奥爵文贸易有限责任公司 | Polishing device capable of sensing conditions by utilizing mirror reflection |
| CN112192436A (en) * | 2020-10-15 | 2021-01-08 | 上海理工大学 | Self-adjusting elastic energy-saving polishing device |
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