CN113084622A - Chemical polishing machine for display substrate production and polishing method thereof - Google Patents
Chemical polishing machine for display substrate production and polishing method thereof Download PDFInfo
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- CN113084622A CN113084622A CN202110221404.3A CN202110221404A CN113084622A CN 113084622 A CN113084622 A CN 113084622A CN 202110221404 A CN202110221404 A CN 202110221404A CN 113084622 A CN113084622 A CN 113084622A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to the technical field of displays and discloses a chemical polishing machine for producing a display substrate, wherein the top of a machine body is provided with a polishing groove, the output end of the top of a motor is fixedly connected with a polishing disk, the top of the polishing disk is fixedly provided with a polishing pad, the bottom surface of a top frame at the top of the polishing groove is fixedly provided with a polishing head, the middle part of the bottom surface of the polishing head is movably provided with a clamp, the bottom of the interior of the polishing disk is provided with a liquid inlet pipe cavity communicated in a cross shape, the middle part of the polishing pad is provided with a column groove communicated with the center of the liquid inlet pipe cavity, a gland is movably sleeved in the column groove, lugs are fixedly arranged at the bottom wall of the inner side of the polishing groove in a cross shape, a slide block is movably sleeved at the outer port of the liquid inlet pipe cavity, through set up the dropping liquid device inside the burnishing head and set its bottom to the lid form and leave the logical liquid mouth simultaneously, designed feed liquor lumen isotructure in the polishing dish and improved the effect of polishing.
Description
Technical Field
The invention relates to the technical field of displays, in particular to a chemical polishing machine for producing a display substrate and a polishing method thereof.
Background
The display is a display tool which is needed in many places today, and can display an electronic document through a screen, and is researched and produced by many manufacturers due to the display function, but the production process is still very strict, and in order to achieve a better display effect, the manufacturing process of a glass substrate on a display substrate has strict requirements, and the transparency and the definition of the glass substrate are increased, generally, a key procedure of polishing and grinding is needed in the production process, so that the surface of the glass substrate can become smooth and flat without scratches, thus the eye protection effect for a user is also good, but problems still exist when a polishing machine is used:
1. the polishing pad is used for being in contact friction with the glass substrate during polishing, meanwhile, the polishing solution is continuously dripped aside, an oxide film is generated on the surfaces of the polishing solution and the glass substrate, and the oxide film is dissolved in the polishing solution again, but the speed of the polishing solution is lower than that of the polishing solution, so that the polishing pad can polish the surface of the glass substrate to be smoother and smoother in the continuous polishing process, but a larger centrifugal force is generated in the working process of the polishing pad, on one hand, the polishing solution can be thrown away to the periphery under the action of the centrifugal force, not only waste is caused, but also certain pollution is caused, on the other hand, the polishing solution is thrown away, so that the polishing solution is not uniform or insufficient at the part of the polishing substrate, and the polished substrate is not smoother and is not beneficial to subsequent production;
2. because the polishing pad can rub with the rete contact of base plate surface production at the in-process of polishing, polish like this and will form certain mixed polishing solution after polishing, contain a lot of polishing and polish the tiny particle that gets off, just so to hardly take away these mixed polishing solutions to the mode of leaning on one side dropping liquid, be unfavorable for subsequent abundant polishing, the polishing solution only plays the effect of transition simultaneously, just be discharged by the aggregate soon, just so lead to adding new polishing solution always, the cost is higher, still make a lot of polishing solutions combine just to be thrown away with the base plate simultaneously, the utilization ratio of polishing solution is lower.
Disclosure of Invention
Aiming at the defects of the background technology, the invention provides the chemical polishing machine for producing the display substrate and the polishing method thereof, which have the advantages of good polishing effect and energy-saving resources and solve the problems in the background technology.
The invention provides the following technical scheme: a chemical polishing machine for producing a display substrate comprises a machine body, wherein a top frame is fixedly mounted at the top of the machine body, a polishing groove is formed in the top of the machine body, a motor is fixedly mounted at the bottom position of the polishing groove in the machine body, a polishing disc is fixedly connected to the output end of the top of the motor, a polishing pad is fixedly mounted at the top of the polishing disc, a polishing head is fixedly mounted at the bottom surface of the top frame at the top position of the polishing groove, a clamp is movably mounted in the middle of the bottom surface of the polishing head, a liquid inlet pipe cavity communicated in a cross manner is formed in the bottom of the interior of the polishing disc, a column groove communicated with the center of the liquid inlet pipe cavity is formed in the middle of the polishing pad, a gland is movably sleeved in the column groove, a first reset spring is fixedly connected between the bottom outer ring of the gland and the inner wall of the, the utility model discloses a polishing machine, including bearing inner race and polishing groove, the polishing groove is equipped with the liquid inlet pipe chamber pipeline section, the polishing groove is equipped with the liquid inlet pipe chamber, the bearing inner race is equipped with the filter screen with polishing groove inner wall between fixed mounting, liquid inlet pipe chamber pipeline section middle part fixed mounting has the check valve, the slider has been cup jointed in the outer port activity of liquid inlet pipe chamber, fixedly connected with second reset spring between slider and the check valve, the inside anchor clamps that are located of rubbing head position around has seted.
Preferably, the inside even spaced apart magnetic ring groove that is equipped with in middle part of polishing dish, annular magnet has been cup jointed in the top activity of magnetic ring groove, annular magnet's bottom fixed mounting has the bevel piece, the magnetic ring groove is close to one side even spaced apart installation in the centre of a circle and installs the kicking block, the kicking block is close to fixedly connected with spacing spring between the inside of centre of a circle side and the magnetic ring inslot wall, annular regulation chamber has been seted up to the inside of rubbing head bottom, the even activity in inside of adjusting the chamber has cup jointed bar magnet, bar magnet's top fixedly connected with wire drawing.
Preferably, the cross-section of slider is the L form, the outer end size and the feed liquor lumen looks adaptation of slider, the slider blocks up the feed liquor lumen completely with the lug when pushing up maximum position.
Preferably, the magnetic force generated by the ring magnets to the top is the same, the weight of each ring magnet is the same, and the top magnetic poles of the ring magnets are the same as the bottom magnetic poles of the bar magnets.
Preferably, the outer side of the polishing head is communicated with a polishing liquid pipe, the polishing liquid pipe is communicated with a liquid guide hole, and the bottom of the liquid guide hole is provided with a liquid dropping port.
Preferably, the sum of the widths of the ring magnets is equal to the diameter of the bottom end of the polishing head, and the polishing head is positioned right above the ring magnets and parallel to the ring magnets.
The invention also provides an operation method of the chemical polishing machine for producing the display substrate, which comprises the following operation steps:
s1, fixing the substrate on the clamp, connecting the polishing solution and a conveying pipeline of the polishing head, and driving the polishing disc to rotate by the starting switch through the motor;
s2, the substrate is in contact with the polishing pad for polishing, the polishing solution continuously drops from the liquid guide pipe, and the thrown polishing solution flows through the filter screen and enters the bottom of the polishing groove;
and S3, the polishing disk rotates the bump to press the slider to extrude the polishing liquid from the top of the column groove and throw the polishing liquid to the bottom of the polishing head for reuse.
The invention has the following beneficial effects:
1. through the polishing groove that sets up the indent in organism inside, and the design cooperation that adopts the overlay type on the burnishing head has the post groove, compare in prior art, utilize this design can guarantee that the polishing solution can not get rid of the position outside the organism, the design that utilizes the burnishing head can guarantee that the polishing solution can not lead to the fact the not enough condition in its department of covering simultaneously, and utilize the post groove can also provide the polishing solution on can not stopping to the polishing pad, keep the base plate throughout can with the abundant contact of polishing solution at the polishing in-process, and then make the display base plate surface that processes out more level and smooth.
2. Through the design of the ring magnet who sets up and bar magnet, and the cooperation is installed on polishing dish and polishing head, compare in prior art, the mixed polishing solution that produces when the polishing is thrown away to the outside is close to the great that the logical liquid mouth of polishing dish outside one end was opened, the mixed polishing solution that more is favorable to mixing polishing particle is thrown away and is filtered so that reuse through the filter screen, cyclic utilization can reduce the lasting desirability to the polishing solution, resources are saved more improves the utilization ratio, still play the effect of scouring away the polishing pad surface to the polishing solution that comes out from the column casing simultaneously, also do benefit to the abundant contact that improves polishing pad and base plate, the quality of improvement polishing.
Drawings
FIG. 1 is an overall half-sectional view of the structure of the present invention;
FIG. 2 is a transverse sectional view of the liquid inlet pipe cavity of the structure of the invention;
FIG. 3 is a cross-sectional view of the magnetic ring groove of the present invention;
FIG. 4 is an enlarged view taken at A in FIG. 1;
FIG. 5 is a cross-sectional view of a polishing head structure according to the present invention.
In the figure: 1. a body; 101. a polishing tank; 2. a top frame; 3. a motor; 4. a polishing disk; 401. a liquid inlet pipe cavity; 402. a magnetic ring groove; 5. a polishing pad; 6. a polishing head; 601. a drain hole; 602. a liquid through port; 603. An adjustment chamber; 7. a clamp; 8. a column groove; 9. a gland; 10. a filter screen; 11. a first return spring; 12. A bump; 13. a slider; 14. a one-way valve; 15. a bearing; 16. a second return spring; 17. a ring magnet; 18. a bevel block; 19. a top block; 20. a limiting spring; 21. a bar magnet; 22. and (4) drawing.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, a chemical polishing machine for producing a display substrate comprises a machine body 1, a top frame 2 is fixedly installed at the top of the machine body 1, a polishing groove 101 is formed at the top of the machine body 1, a motor 3 is fixedly installed at the bottom of the polishing groove 101 inside the machine body 1, a polishing disk 4 is fixedly connected to the output end of the top of the motor 3, a polishing pad 5 is fixedly installed at the top of the polishing disk 4, a polishing head 6 is fixedly installed at the bottom of the top frame 2 at the top of the polishing groove 101, a clamp 7 is movably installed at the middle of the bottom of the polishing head 6, a liquid inlet pipe cavity 401 communicated in a cross shape is formed at the bottom inside the polishing disk 4, a column groove 8 communicated with the center of the liquid inlet pipe cavity 401 is formed at the middle of the polishing pad 5, a gland 9 is movably sleeved inside the column groove 8, and a first return, the bottom wall of the inner side of the polishing groove 101 is fixedly provided with lugs 12 in a cross distribution manner, the outer ring of the top of the polishing disc 4 is movably provided with a bearing 15, a filter screen 10 is fixedly arranged between the outer ring of the bearing 15 and the inner wall of the polishing groove 101, the middle part of the pipe section of the liquid inlet pipe cavity 401 is fixedly provided with a check valve 14, the outer port of the liquid inlet pipe cavity 401 is movably sleeved with a slide block 13, a second reset spring 16 is fixedly connected between the slide block 13 and the check valve 14, the inside of the polishing head 6 is provided with liquid guide holes 601 around the clamp 7, the inner wall of the bottom of the polishing head 6 is uniformly provided with liquid through holes 602, the middle part of the inside of the polishing disc 4 is uniformly provided with magnetic ring grooves 402 at intervals, the top of the magnetic ring grooves 402 is movably sleeved with an annular magnet 17, the bottom of the annular magnet 17 is fixedly provided with a bevel block 18, one, annular regulation chamber 603 has been seted up to the inside of polishing head 6 bottom, and the even activity of the inside of adjusting chamber 603 has cup jointed bar magnet 21, and bar magnet 21's top fixedly connected with wire drawing 22.
The cross section of the sliding block 13 is L-shaped, the size of the outer end of the sliding block 13 is matched with the liquid inlet pipe cavity 401, the sliding block 13 completely blocks the liquid inlet pipe cavity 401 when the sliding block 13 and the convex block 12 are pushed to the maximum position, the sliding block 13 and the convex block 12 act together to play a role in liquid supply, and a certain amount of polishing liquid can be extruded through the one-way valve 14 to enter the liquid inlet pipe cavity 401 and finally flow out of the top of the column groove 8 after each extrusion.
Wherein, the magnetic force size that annular magnet 17 produced the top is the same and each annular magnet 17's weight is the same, annular magnet 17's top magnetic pole is the same with bar magnet 21's bottom magnetic pole, utilize annular magnet 17 to produce certain repulsion effect to bar magnet 21 at top, because the annular magnet 17 that is close to the outer lane just can upwards lift under the roof pressure of kicking block 19, thereby again according to the effect that the same magnetic pole is repelled makes bar magnet 21 inside of rubbing head 6 move up thereby enlarge the size of leading to liquid mouth 602, more do benefit to inside mixed polishing solution and flow.
Wherein, the outside intercommunication of rubbing head 6 has the polish liquid pipe and polish liquid pipe intercommunication to drain hole 601, and the drip mouth has been seted up to the bottom in drain hole 601, through the downward dropwise add polish of drain hole 601 can guarantee that the direct action of polish is more favorable to the polishing of base plate to the polishing position, has also avoided dripping directly to throw away on polishing pad 5 simultaneously.
Wherein, the width sum of ring magnet 17 equals the diameter of burnishing head 6 bottom and burnishing head 6 is in directly over ring magnet 17 and keeps being parallel with it, and ring magnet 17 corresponds with the inside bar magnet 21 of burnishing head 6 and plays the magnetic force relation, has guaranteed like this to play certain even stable effect.
The polishing method of the chemical polishing machine for producing the display substrate comprises the following operation steps:
s1, fixing the substrate on the clamp 7, connecting the polishing solution and a conveying pipeline of the polishing head, and driving the polishing disk 4 to rotate by the starting switch through the motor 3;
s2, the substrate is in contact with the polishing pad 5 for polishing, the polishing solution continuously drops from the liquid guide pipe, and the thrown polishing solution flows through the filter screen 10 and enters the bottom of the polishing groove 101;
s3, the polishing disk 4 rotates the bump 12 to press the slider 13 to press and overflow the polishing liquid from the top of the column groove 8 and throw the polishing liquid to the bottom of the polishing head 6 for reuse.
The working principle is that before use, a substrate is arranged on a clamp 7 at the bottom of a polishing head 6 and is firmly fixed, a polishing solution connecting pipe of the polishing head 6 is connected, a switch is started, a motor 3 rotates and drives a polishing disk 4 to rotate together, the polishing disk 4 drives a polishing pad 5 to rotate and polish an oxide film formed at the bottom of the substrate smoothly, a liquid guide hole 601 at the top continuously drops liquid downwards in the polishing and polishing process, a jacking block 19 in a magnetic ring groove 402 is thrown outwards under the action of centrifugal force and pushes up an annular magnet 17 upwards through an inclined block 18, more annular magnets 17 close to an outer ring are pushed up due to larger centrifugal force applied to the jacking block 19 close to the outer ring, the annular magnet 17 and strip magnets 21 in a regulating cavity 603 of the polishing head 6 generate repulsive action and are pushed up upwards, and the strip magnets 21 are pushed up more when the polishing head 6 rotates to be close to the outer side, let lead to liquid mouth 602 to open bigger, also more do benefit to the mixed polishing solution after the inside polishing and flow out, the polishing solution that flows down from polishing pad 5 can filter through filter screen 10, later flow down to the bottom of polishing groove 101 again, later along with the rotation slider 13 of polishing dish 4 is inwards pushed into by lug 12 and with some polishing solution through check valve 14 squeeze into liquid inlet pipe chamber 401 inside, later push up gland 9 from the top and flow path polishing pad 5 on the surface supply substrate's the polishing simultaneously with the surface rinse clean more do benefit to polishing of polishing pad 5.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a chemical polishing machine is used in production of display base plate, including organism (1), the top fixed mounting of organism (1) has roof-rack (2), polishing groove (101) have been seted up at the top of organism (1), organism (1) inside is located polishing groove (101) bottom position fixed mounting has motor (3), the top output end fixed connection of motor (3) has polishing dish (4), the top fixed mounting of polishing dish (4) has polishing pad (5), the bottom surface fixed mounting that roof-rack (2) are located polishing groove (101) top position has rubbing head (6), the middle part movable mounting of rubbing head (6) bottom surface has anchor clamps (7), its characterized in that: the polishing disc is characterized in that a liquid inlet pipe cavity (401) which is communicated in a cross shape is formed in the bottom inside the polishing disc (4), a column groove (8) communicated with the center of the liquid inlet pipe cavity (401) is formed in the middle of the polishing pad (5), a gland (9) is sleeved in the column groove (8) in an inner movable mode, a first reset spring (11) is fixedly connected between the bottom outer ring of the gland (9) and the inner wall of the liquid inlet pipe cavity (401), a lug (12) is fixedly arranged at the inner side bottom wall of the polishing groove (101) in a cross distribution mode, a bearing (15) is movably arranged at the top outer ring of the polishing disc (4), a filter screen (10) is fixedly arranged between the outer ring of the bearing (15) and the inner wall of the polishing groove (101), a one-way valve (14) is fixedly arranged in the middle of the pipe section of the liquid inlet pipe cavity (401), a sliding block (13) is sleeved in the outer port of the, the liquid guide holes (601) are formed in the polishing head (6) and located at the periphery of the clamp (7), and liquid through ports (602) are uniformly formed in the inner wall of the bottom of the polishing head (6).
2. The chemical polisher for display substrate production according to claim 1, wherein: polishing dish (4) inside middle part is evenly spaced apart and is equipped with magnetic ring groove (402), annular magnet (17) have been cup jointed in the top activity of magnetic ring groove (402), the bottom fixed mounting of annular magnet (17) has bevel piece (18), ejector pad (19) are installed near the even interval in one side of the centre of a circle in magnetic ring groove (402), fixedly connected with spacing spring (20) between the inside of ejector pad (19) near the centre of a circle side and magnetic ring groove (402) inner wall, annular regulation chamber (603) have been seted up to the inside of rubbing head (6) bottom, bar magnet (21) have been cup jointed in the even activity in inside of regulation chamber (603), the top fixedly connected with wire drawing (22) of bar magnet (21).
3. The chemical polisher for display substrate production according to claim 1, wherein: the cross-section of slider (13) is the L form, the outer end size and the feed liquor lumen (401) looks adaptation of slider (13), slider (13) are stopped up feed liquor lumen (401) completely with slider (13) when lug (12) top to the maximum position.
4. The chemical polisher for display substrate production according to claim 2, wherein: the magnetic force generated by the annular magnets (17) to the top is the same, the weight of each annular magnet (17) is the same, and the top magnetic poles of the annular magnets (17) are the same as the bottom magnetic poles of the bar magnets (21).
5. The chemical polisher for display substrate production according to claim 1, wherein: the outer side of the polishing head (6) is communicated with a polishing liquid pipe, the polishing liquid pipe is communicated to the liquid guide hole (601), and the bottom of the liquid guide hole (601) is provided with a liquid dropping opening.
6. The chemical polisher for display substrate production according to claim 1, wherein: the sum of the widths of the ring magnets (17) is equal to the diameter of the bottom end of the polishing head (6), and the polishing head (6) is positioned right above the ring magnets (17) and is parallel to the ring magnets.
7. A polishing method of a chemical polisher for display substrate production as set forth in any one of claims 1 to 6, characterized in that: the operation steps are as follows:
s1, fixing the substrate on a clamp (7), connecting a conveying pipeline of polishing solution and a polishing head, and driving a polishing disc (4) to rotate by a starting switch through a motor (3);
s2, the substrate is in contact with the polishing pad (5) for polishing, the liquid guide pipe continuously drops polishing liquid, and the thrown polishing liquid flows through the filter screen (10) and enters the bottom of the polishing groove (101);
s3, the polishing disk (4) rotates the bump (12) to press the slider (13) to extrude the polishing liquid from the top of the column groove (8) to overflow and is thrown to the bottom of the polishing head (6) for reuse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110221404.3A CN113084622B (en) | 2021-02-27 | 2021-02-27 | Chemical polishing machine for display substrate production and polishing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110221404.3A CN113084622B (en) | 2021-02-27 | 2021-02-27 | Chemical polishing machine for display substrate production and polishing method thereof |
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| CN113084622A true CN113084622A (en) | 2021-07-09 |
| CN113084622B CN113084622B (en) | 2023-01-13 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114800218A (en) * | 2022-04-12 | 2022-07-29 | 江苏富乐华功率半导体研究院有限公司 | Liquid circulation polishing device suitable for surface coating treatment of metallized ceramic substrate |
| CN115008342A (en) * | 2022-06-15 | 2022-09-06 | 安徽禾臣新材料有限公司 | Wafer polishing wax-free pad capable of preventing corner collapse and production process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0945642A (en) * | 1995-07-26 | 1997-02-14 | Sony Corp | Method and device for grinding semiconductor substrate |
| CN108857754A (en) * | 2018-08-01 | 2018-11-23 | 蚌埠惊涛精密机械有限公司 | A kind of self-clean type glass polishing machine |
| CN111941267A (en) * | 2020-08-13 | 2020-11-17 | 张俊玲 | Semiconductor silicon wafer polishing machine |
| CN112192436A (en) * | 2020-10-15 | 2021-01-08 | 上海理工大学 | Self-adjusting elastic energy-saving polishing device |
| CN112338763A (en) * | 2020-09-22 | 2021-02-09 | 温州奥爵文贸易有限责任公司 | Polishing device capable of sensing conditions by utilizing mirror reflection |
-
2021
- 2021-02-27 CN CN202110221404.3A patent/CN113084622B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0945642A (en) * | 1995-07-26 | 1997-02-14 | Sony Corp | Method and device for grinding semiconductor substrate |
| CN108857754A (en) * | 2018-08-01 | 2018-11-23 | 蚌埠惊涛精密机械有限公司 | A kind of self-clean type glass polishing machine |
| CN111941267A (en) * | 2020-08-13 | 2020-11-17 | 张俊玲 | Semiconductor silicon wafer polishing machine |
| CN112338763A (en) * | 2020-09-22 | 2021-02-09 | 温州奥爵文贸易有限责任公司 | Polishing device capable of sensing conditions by utilizing mirror reflection |
| CN112192436A (en) * | 2020-10-15 | 2021-01-08 | 上海理工大学 | Self-adjusting elastic energy-saving polishing device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114800218A (en) * | 2022-04-12 | 2022-07-29 | 江苏富乐华功率半导体研究院有限公司 | Liquid circulation polishing device suitable for surface coating treatment of metallized ceramic substrate |
| CN115008342A (en) * | 2022-06-15 | 2022-09-06 | 安徽禾臣新材料有限公司 | Wafer polishing wax-free pad capable of preventing corner collapse and production process thereof |
| CN115008342B (en) * | 2022-06-15 | 2023-08-25 | 安徽禾臣新材料有限公司 | Corner collapse preventing wax-free pad for wafer polishing and production process thereof |
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| Publication number | Publication date |
|---|---|
| CN113084622B (en) | 2023-01-13 |
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