CN113078521B - Switching device for testing integrity of Gbit-level high-speed bus signals - Google Patents
Switching device for testing integrity of Gbit-level high-speed bus signals Download PDFInfo
- Publication number
- CN113078521B CN113078521B CN202110204500.7A CN202110204500A CN113078521B CN 113078521 B CN113078521 B CN 113078521B CN 202110204500 A CN202110204500 A CN 202110204500A CN 113078521 B CN113078521 B CN 113078521B
- Authority
- CN
- China
- Prior art keywords
- connector
- layer
- wiring layer
- signal wiring
- microstrip line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/02—Intermediate parts for distributing energy to two or more circuits in parallel, e.g. splitter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding with earth pin, blade or socket
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
Abstract
The invention discloses a switching device for testing the integrity of Gbi-level high-speed bus signals, which is a switching test device for a socket for a high-speed serial bus. Meanwhile, according to the high-frequency performance of the printed board, the adaptor connector for the PCB, which meets the requirements, is selected, so that the impedance matching of the whole path is ensured. According to the invention, through printed board parameter design and adapter connector design selection, a test adapter device meeting requirements is designed, the high-frequency performance standing wave data of the whole channel can meet the requirement of less than 1.3, the high-speed performance can meet 6.25Gbps transmission, and the data jitter is less than 30ps.
Description
Technical Field
The invention relates to a switching device for testing the integrity of Gbit-level high-speed bus signals, belonging to the technical field of high-speed bus testing.
Background
At present, the socket connector product for the high-speed bus is tested by the conventional electrical performance test, and no excellent conversion test device is used for testing the high-speed and high-frequency performance,
disclosure of Invention
The technical problem solved by the invention is as follows: the invention aims at the conversion of a socket connector for a high-speed bus PCB and performs high-speed and high-frequency performance test on a product through a conversion standard port.
The technical scheme of the invention is as follows: a switching device for testing the integrity of Gbit-level high-speed bus signals comprises: switching to a connector and a PCB (printed circuit board);
a PCB printed board comprising: an upper paint coating layer, an upper character printing layer, an upper signal wiring layer, a substrate, a lower signal wiring layer, a lower character printing layer and a lower paint coating layer;
the upper paint coating layer, the upper character printing layer, the upper signal wiring layer, the substrate, the lower signal wiring layer, the lower character printing layer and the lower paint coating layer are sequentially arranged from top to bottom; a plurality of microstrip lines are arranged on the upper signal routing layer, and one end of each microstrip line is provided with a plating layer and then is connected with a switching connector; the positions of the upper signal routing layer except the microstrip line are all grounded;
the other end of the microstrip line is connected with the socket connector;
a ground wire is arranged on the lower signal wiring layer, one end of the ground wire is connected with the ground of the adapter connector, and the other end of the ground wire is connected with the ground of the adapter connector;
each adapter connector can be connected with a vector network analysis instrument; the socket connector can be connected with a vector network analysis instrument;
the vector network analysis instrument can test the high-frequency performance of the socket connector, including insertion loss and standing wave of the socket connector.
Preferably, the substrate is provided with a metalized via hole, and the upper signal wiring layer and the lower signal wiring layer are connected through the metalized via hole, so that the upper signal wiring layer and the lower signal wiring layer are grounded together.
Preferably, the microstrip line is generated by etching the surface of the upper signal routing layer, the etched widths of the two side edges of the microstrip line are the same, and the etched width of each side is used as the common-ground area interval.
Preferably, the plating layer arranged at one end of each microstrip line is a gold layer.
Preferably, the number of microstrip lines is 2, 4, 8, 16, 20 or 24.
Preferably, the ground of the receptacle connector is an outer conductor of the receptacle connector.
Preferably, the vector network analyzer is used for testing the high-frequency performance of the socket connector, including the insertion loss and the standing wave of the socket connector.
Preferably, the two adjacent microstrip lines are a pair of differential lines.
Preferably, the method for determining the performance of the switching device for the Gbit-level high-speed bus signal integrity test comprises the following steps:
(1) Determining the transmission impedance of the socket connector and the PCB shield pin size of the socket connector (pin size refers to the distance between two adjacent pins;)
(2) According to the transmission impedance of the socket connector, parameters of the PCB are determined, wherein the parameters comprise: the thickness of the substrate, the dielectric constant of the substrate, the width of a microstrip line of an upper signal wiring layer of the printed board, the distance between common-ground areas in the upper signal wiring layer, the thickness of a coating, the thickness of an upper coating paint layer and the thickness of a lower coating paint layer;
(3) According to the determined parameter requirements of the PCB, microstrip line wiring is carried out on a signal routing layer on the PCB, and the length of the microstrip line corresponding to each switching connector is the same; metallized through holes are formed in two sides of each microstrip line, so that the upper signal wiring layer and the lower signal wiring layer are grounded together;
the adaptor connector is a crimp type connector (the adaptor is plated with gold to ensure good contact and impedance matching characteristics.)
(4) The crimp-type connector (preferably 3.5mm crimp-type connector (SMA) below 18GHz, preferably 2.4mm crimp-type connector at 26.5GHz, preferably 1.85mm crimp-type connector at 50 GHz) is selected to match the socket connector according to the transmission impedance and the operating frequency range requirement of the socket connector
Preferably, the pin size refers to a distance between two adjacent pins.
Compared with the prior art, the invention has the advantages that:
(1) The invention provides a switching method for the high-speed high-frequency test of the socket for the high-speed bus, and meets the high-frequency evaluation capability of the socket connector;
(2) The wiring of the invention adopts wide distance wiring between the differential pair wires, the distance between the two signal wires is more than 5mm, and the signals of the two differential pair wires are ensured not to influence each other;
(3) The tail end of the microstrip line is plated with gold, so that the connector is ensured to be in good contact, and the impedance matching performance is better; the microstrip is switched to the connector, a crimping type high-frequency connector is adopted, and compared with a welding mode, the microstrip connector can avoid signal change caused by a welding method and is favorable for signal matching.
Drawings
FIG. 1 is a schematic diagram of a high-speed serial bus socket connector;
FIG. 2 is a schematic structural diagram of a socket connector for a high-speed bus tested by using the adapter of the present invention;
FIG. 3 is a schematic diagram of a high-speed serial bus socket adapter according to the present invention;
Detailed Description
The invention is described in further detail below with reference to the figures and specific embodiments.
The invention discloses a switching device for testing the integrity of Gbit-level high-speed bus signals, which is a switching test device of a socket for a high-speed serial bus. Meanwhile, according to the high-frequency performance of the printed board, the adaptor connector for the PCB, which meets the requirements, is selected, so that the impedance matching of the whole path is ensured. According to the invention, through printed board parameter design and adapter connector design selection, a test adapter device meeting requirements is designed, the high-frequency performance standing wave data of the whole channel can meet the requirement of less than 1.3, the high-speed performance can meet 6.25Gbps transmission, and the data jitter is less than 30ps. The entire path, refers to: a patch connector, a microstrip line, and a link formed by the socket connector.
The switching device is mainly applied to the performance test of a high-speed (the transmission rate is greater than 6.25Gbps, and the working frequency is greater than 4 GHz) socket connector. For socket connectors at 6.25Gbps rate (here, JTG series socket connectors are used for 2711, for example, as shown in fig. 1), if the performance test is performed directly by using conventional probes, several times of loss error of the socket connectors is introduced, so that the test error is caused, and the performance of the socket connectors cannot be evaluated correctly. The problem can be solved by using the invention, and meanwhile, when the invention is used for testing the socket connector, the testing method is as shown in figure 2, the vector network analyzer is connected with the adapter, then the testing signal passes through the PCB, and finally is connected into the vector network analyzer after passing through the socket connector. The impedance of the whole channel meets the requirement of 50 +/-0.5 ohm, the excellent impedance matching performance of the whole channel can be ensured, and the standing wave index of the whole transmission is ensured to be less than 1.3. Meanwhile, the switching device can also be used for testing the integrity of signals such as insertion loss, standing waves, eye patterns, bit error rate, phase difference, isolation and the like.
The invention is mainly applied to the test of the socket connector for the direct-insert PCB, the socket connector is of a direct-insert type (with PCB shielding pins), and the optimal working frequency is not less than 2GHz.
The invention relates to a switching device for testing the integrity of Gbit-level high-speed bus signals, which comprises: switching to a connector and a PCB (printed circuit board);
a PCB printed board comprising: an upper paint coating layer, an upper character printing layer, an upper signal wiring layer, a substrate, a lower signal wiring layer, a lower character printing layer and a lower paint coating layer; wherein the upper and lower paint layers are mainly used for insulating the signal layer from air; the upper character layer and the lower character layer are mainly used for printing characters with corresponding requirements; the upper signal routing layer and the lower signal routing layer are used for distributing micro-strip lines.
The upper paint coating layer, the upper character printing layer, the upper signal wiring layer, the base material, the lower signal wiring layer, the lower character printing layer and the lower paint coating layer are sequentially arranged from top to bottom; the substrate is provided with a metallized via hole, and the metallized via hole is connected with the upper signal wiring layer and the lower signal wiring layer to make the upper signal wiring layer and the lower signal wiring layer share the same ground
A plurality of microstrip lines are arranged on the upper signal routing layer, and one end of each microstrip line is provided with a plating layer and then is connected with a switching connector; the upper signal routing layer is fully grounded except the microstrip line;
the other end of the microstrip line is connected with the socket connector;
a ground wire is arranged on the lower signal wiring layer, one end of the ground wire is connected with the ground of the adaptor connector, and the other end of the ground wire is connected with the ground of the socket connector;
each adaptor connector can be connected with a vector network analysis instrument; the socket connector can be connected with a vector network analysis instrument;
the vector network analyzer can test the high-frequency performance of the socket connector, including the insertion loss and the standing wave of the socket connector;
preferably, the substrate is provided with a metalized via hole, and the upper signal wiring layer and the lower signal wiring layer are connected through the metalized via hole, so that the upper signal wiring layer and the lower signal wiring layer are grounded together.
Preferably, the microstrip line is generated by etching the surface of the upper signal routing layer, the etched widths of the two side edges of the microstrip line are the same, and the etched width of each side is used as the common-ground-region interval.
Preferably, the plating layer arranged at one end of the microstrip line is a gold layer.
Preferably, the number of microstrip lines is preferably 2, 4, 8, 16, 20 or 24.
Preferably, the ground of the receptacle connector is an outer conductor of the receptacle connector.
Preferably, the vector network analyzer is used for testing the high-frequency performance of the socket connector, including the insertion loss and the standing wave of the socket connector.
Preferably, the two adjacent microstrip lines are a pair of differential lines.
Preferably, the method for determining the performance of the switching device for the Gbit-level high-speed bus signal integrity test comprises the following steps:
(1) Determining the transmission impedance of the socket connector and the size of the PCB shielding pin of the socket connector (the pin size refers to the distance between two adjacent pins; the preferred scheme is as follows:
the transmission impedance of the socket connector and the distribution size and length of the PCB shielding pins can be obtained by inquiring or measuring a manual of the socket connector.
(2) According to the transmission impedance of the socket connector, parameters are determined for the PCB, and the parameters comprise: the thickness of the substrate, the dielectric constant of the substrate, the width of a microstrip line of the upper signal wiring layer of the printed board, the spacing of common ground areas in the upper signal wiring layer, the thickness of a coating layer, the thickness of an upper coating paint layer and the thickness of a lower coating paint layer; the preferred scheme is as follows:
according to the transmission impedance of the socket connector, parameters of the PCB are determined, and the method specifically comprises the following steps: the method comprises the steps of determining the thickness H of a base material of a PCB (preferably, 0.93,1.8 and other standard thickness base materials are selected) according to the length of a PCB shielding pin of a selected socket connector, selecting a material with a corresponding dielectric constant (preferably, an FR4 epoxy glass fiber material is selected for 10GHz, a polytetrafluoroethylene glass fiber base material is selected for more than 20 GHz) according to the working frequency of the detected socket connector, preliminarily determining the width W of a microstrip line according to the size of an adjacent pin of the shielding pin (subsequently, fine adjustment is needed according to a calculation formula), and then, reasonably adjusting the transmission impedance to be near 50 +/-0.5 ohm according to an impedance calculation formula (other parameters are adjustable).
(3) According to the determined parameter requirements of the PCB, microstrip line wiring is carried out on a signal routing layer on the PCB, and the length of the microstrip line corresponding to each switching connector is the same; metallized through holes are arranged on two sides of each microstrip line, so that the upper signal routing layer and the lower signal routing layer are grounded together; the adapter connector is a pressure welding type connector (the adapter is in a gold plating form in order to ensure good contact and impedance matching characteristics), and the preferable scheme is as follows:
microstrip line wiring is carried out on a signal wiring layer on the PCB, and the specific requirements are as follows: under the condition of ensuring the width of the microstrip line and other parameters, the physical length difference between the same pair of differential lines is preferably less than 2.54um; acute angles are avoided in the process of routing the microstrip lines; the width change condition is avoided in the microstrip line wiring process.
(4) According to the transmission impedance and the requirement of the working frequency range of the socket connector, a press-fit type connector matched with the socket connector is selected, and the preferable scheme is as follows:
selecting a corresponding crimping connector according to the working frequency of the socket connector, wherein the working frequency below 18GHz can be selected from an SMA (3.5 mm interface) type connector; an operating frequency of 26.5GHz is preferably with a 2.4mm interface connector and an operating frequency of 50GHz is preferably with a 1.85mm interface connector.
In the switching device for testing the signal integrity of the Gbi-level high-speed bus, the socket connector for the high-speed bus has 50 omega transmission impedance requirements, and parameters of a PCB (printed circuit board) are obtained through parameter calculation, preferably: the thickness of the substrate is preferably 0.93mm, the dielectric constant of the substrate is preferably 4.35, the width of the microstrip line of the printed board is preferably 1.27mm, the distance between the common ground areas is preferably 0.508mm, the thickness of the plating layer is preferably 70um, and the thickness of the painting layer is preferably 30um. Therefore, the PCB which meets the characteristic impedance is designed, and aiming at the requirement of impedance matching, the conductive end at the tail end of the microstrip line of the PCB adopts a gold plating form to ensure good contact performance;
two adjacent microstrip lines are a pair of differential lines, and the physical length difference between the same pair of differential lines is preferably less than 2.54um;
the PCB printed board is manufactured by arranging uniform metalized via holes at the position where the distance between the edges of the microstrip lines is preferably 1.5-4 mm, wherein the uniform metalized via holes are used for unifying the electrical level between two layers (an upper signal routing layer and a lower signal routing layer) to realize ground supply, and the two ends of each metalized via hole are turned over to form a bonding pad, the inner diameter of each metalized via hole is preferably 0.36mm, the diameter of each bonding pad of each metalized via hole is preferably 0.72mm, and the center distance between the two adjacent metalized via holes is 4-5 mm;
according to the requirements of the microstrip line at the tail end of the manufactured printed board and the impedance requirement of 50 omega, the adaptor connector adopts a crimping type adaptor connector, the cut-off frequency of the adaptor connector is preferably not less than 20GHz, and the microstrip line is adapted to an SMA type interface through the adaptor connector.
The invention aims to meet the requirement of a socket connector for a high-speed bus to carry out a high-frequency performance test, and aims to connect the socket connector to a signal test path for coaxial transmission in order to carry out the performance test on the socket connector for the high-speed bus as shown in figure 1. The socket connector interface is converted into a coaxial connector to be converted into a vector network analyzer, as shown in fig. 2.
As shown in fig. 3, the socket connector in the present invention is a TLK2711 socket connector, and the PCB printed board is preferably a double-layer PCB printed board, and the adaptor connector is a microstrip line-SMA coaxial connector.
The invention relates to a performance determination method of a switching device for Gbit-level high-speed bus signal integrity test, which comprises the following steps:
the impedance is designed according to a test product (socket connector), in this example, mainly according to the TLK2711 socket connector, relevant parameters of the printed board are calculated according to the impedance requirement (preferably 50 Ω), and the main parameters are as follows: the substrate thickness is preferably 0.93mm, the substrate dielectric constant is preferably 4.35, the printed board signal line width W is preferably 1.27mm, the common ground area pitch (i.e., the signal line-to-ground line pitch) D is preferably 0.508mm, the plating thickness T1 is preferably 70um, and the painting thickness is preferably 30um. The impedance of the PCB transmission signal line can be controlled to be about 50 omega by the control of the main parameters. Thereby achieving the impedance matching between the printed board and the connector;
in order to ensure the 50 Ω impedance matching requirement of the whole link and the fit connection with the test equipment network analyzer, the end of the printed board also needs to be connected with a standard interface through a switching connector. The connector of the crimping type switching printed board of southwest microwave manufacturers is selected as shown in figure 2. After the adapter connector is used, the microstrip line is converted into an SMA (standard interface) interface, and the SMA interface can be directly connected to a vector network analysis instrument.
In order to realize the matching of the transmission impedance of the PCB microstrip line, the specific parameters of the PCB printed board preferably satisfy the following formula requirements:
wherein Z is the characteristic impedance (50 ohm) of the socket connector, er is the substrate dielectric constant of the PCB printed board, H is the substrate thickness of the PCB printed board, W is the width of the microstrip line, T1 is the plating thickness, D is the common-ground area interval, H is the paint coating thickness, k1 and k2 are empirical coefficients (preferably more than 0 and less than 1)
The test is carried out by using the switching device and a vector network analysis instrument, as shown in figure 2. The standing wave of the whole channel is less than 1.3 according to the test result; the test eye jitter is less than 30ps; the insertion loss of the whole path is less than 1dB, and the isolation is greater than 90dB.
Claims (8)
1. A switching device for testing the integrity of Gbit high-speed bus signals is characterized by comprising: switching to a connector and a PCB (printed circuit board);
PCB printed board includes: an upper paint coating layer, an upper character printing layer, an upper signal wiring layer, a substrate, a lower signal wiring layer, a lower character printing layer and a lower paint coating layer; the thickness of the base material is 0.93mm, the dielectric constant of the base material is 4.35, the width of a micro-strip line of the printed board is 1.27mm, the distance between the common ground areas is 0.508mm, the thickness of the coating layer is 70um, and the thickness of the coating layer is 30um;
the upper paint coating layer, the upper character printing layer, the upper signal wiring layer, the base material, the lower signal wiring layer, the lower character printing layer and the lower paint coating layer are sequentially arranged from top to bottom; a plurality of microstrip lines are arranged on the upper signal wiring layer, and one end of each microstrip line is provided with a plating layer and then connected with a switching connector; the upper signal wiring layer is all grounded except the microstrip line;
the other end of the microstrip line is connected with the socket connector; two adjacent microstrip lines are a pair of differential lines, and the physical length difference between the same pair of differential lines is less than 2.54um;
a ground wire is arranged on the lower signal wiring layer, one end of the ground wire is connected with the ground of the adaptor connector, and the other end of the ground wire is connected with the ground of the socket connector;
each adapter connector can be connected with a vector network analysis instrument; the socket connector can be connected with a vector network analysis instrument;
the vector network analyzer can test the high-frequency performance of the socket connector, including integrity tests of insertion loss, standing waves, eye patterns, bit error rate, phase difference and isolation of the socket connector;
the switching device can realize high-speed performance and meet the signal integrity test of 6.25Gbps transmission, and the data jitter is less than 30ps.
2. The transit device for Gbit-level high-speed bus signal integrity test according to claim 1, characterized in that: the substrate is provided with a metalized via hole, and the upper signal wiring layer and the lower signal wiring layer are connected through the metalized via hole, so that the upper signal wiring layer and the lower signal wiring layer are grounded together.
3. The transit device for Gbit-level high-speed bus signal integrity test according to claim 1, characterized in that: the microstrip line is generated by etching the surface of the upper signal routing layer, the etching widths of the edges on two sides of the microstrip line are the same, and the etching width of each side is used as the common-ground area interval.
4. The transit device for Gbit-level high-speed bus signal integrity test according to claim 1, characterized in that: the plating layer arranged on one end of each microstrip line is a gold layer.
5. The transit device for Gbit-level high-speed bus signal integrity test according to claim 1, characterized in that: the number of microstrip lines is 2, 4, 8, 16, 20 or 24.
6. The translator device of claim 1 for performing signal integrity testing on a Gbit-level high speed bus, wherein: the ground of the receptacle connector is the outer conductor of the receptacle connector.
7. A method for determining the performance of a switching device for performing a Gbit high-speed bus signal integrity test on a switching device for a Gbit high-speed bus signal integrity test according to any one of claims 1 to 6, the method comprising the steps of:
(1) Determining the transmission impedance of the socket connector and the size of a PCB shielding pin of the socket connector;
(2) According to the transmission impedance of the socket connector, parameters of the PCB are determined, wherein the parameters comprise: the thickness of the substrate, the dielectric constant of the substrate, the width of a microstrip line of an upper signal wiring layer of the printed board, the distance between common-ground areas in the upper signal wiring layer, the thickness of a coating, the thickness of an upper coating paint layer and the thickness of a lower coating paint layer;
(3) According to the determined PCB parameter requirements, microstrip line wiring is carried out on the signal wiring layer on the PCB, and the length of the corresponding microstrip line of each switching connector is the same; metallized through holes are formed in two sides of each microstrip line, so that the upper signal wiring layer and the lower signal wiring layer are grounded together;
the adapter connector is a crimping connector;
(4) The crimp-type connector is selected to mate with the receptacle connector based on the transmission impedance of the receptacle connector and the operating frequency range requirements.
8. The method for determining the performance of the switching device for the Gbit-level high-speed bus signal integrity test according to claim 7, wherein the method comprises the following steps: the pin size refers to a distance between two adjacent pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110204500.7A CN113078521B (en) | 2021-02-23 | 2021-02-23 | Switching device for testing integrity of Gbit-level high-speed bus signals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110204500.7A CN113078521B (en) | 2021-02-23 | 2021-02-23 | Switching device for testing integrity of Gbit-level high-speed bus signals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113078521A CN113078521A (en) | 2021-07-06 |
| CN113078521B true CN113078521B (en) | 2023-01-06 |
Family
ID=76609484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110204500.7A Active CN113078521B (en) | 2021-02-23 | 2021-02-23 | Switching device for testing integrity of Gbit-level high-speed bus signals |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113078521B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115616455A (en) * | 2021-07-14 | 2023-01-17 | 中兴智能科技南京有限公司 | Test structure and test system |
| CN113466646A (en) * | 2021-07-25 | 2021-10-01 | 浙江德加电子科技有限公司 | Conversion device for testing breakdown voltage of metal substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108254652B (en) * | 2017-12-25 | 2021-07-13 | 中科曙光信息产业成都有限公司 | Testing device of backplane connector |
| CN110441628A (en) * | 2019-07-29 | 2019-11-12 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | High speed connector performance test methods, apparatus and system |
-
2021
- 2021-02-23 CN CN202110204500.7A patent/CN113078521B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113078521A (en) | 2021-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5565788A (en) | Coaxial wafer probe with tip shielding | |
| US5477159A (en) | Integrated circuit probe fixture with detachable high frequency probe carrier | |
| US7876114B2 (en) | Differential waveguide probe | |
| US4795977A (en) | Interface system for interfacing a device tester to a device under test | |
| CN113078521B (en) | Switching device for testing integrity of Gbit-level high-speed bus signals | |
| EP1825282A1 (en) | Signal module with reduced reflections | |
| US6602078B2 (en) | Electrical interconnect having a multi-layer circuit board structure and including a conductive spacer for impedance matching | |
| WO2005006824A1 (en) | Method for minimizing the impedance discontinuity of a via | |
| JP2004510164A (en) | High performance tester interface module | |
| US7786741B2 (en) | Measuring tip for high-frequency measurement | |
| US20220181761A1 (en) | Printed circuit boards and methods for manufacturing thereof for RF connectivity between electro-optic phase modulator and Digital Signal Processor | |
| CN111123079A (en) | Radio frequency testing and calibrating device and radio frequency testing and calibrating method | |
| US11543434B1 (en) | High-frequency data differential testing probe | |
| CN112433098A (en) | Self-correcting radio frequency fuzz button high-frequency performance testing tool and testing method | |
| CN100518336C (en) | Radio test interface in mobile communication terminal | |
| US20220236302A1 (en) | Hybrid shielding sockets with impedance tuning for integrated circuit device test tooling | |
| US11175311B1 (en) | High-frequency layered testing probe | |
| CN211297130U (en) | Auxiliary test circuit board | |
| US20030062914A1 (en) | Surface mating compliant contact assembly with fixed signal path length | |
| CN214201601U (en) | Self-correcting radio frequency fuzz button high-frequency performance testing tool | |
| CN219759965U (en) | Vehicle-mounted transponder antenna for rail inspection vehicle | |
| JP2004257830A (en) | Adaptor for measurement | |
| US7432728B2 (en) | Blade probe and blade probe card | |
| CN214101886U (en) | PCB for testing high-frequency performance of radio frequency fuzz button | |
| US11705611B2 (en) | High-frequency coaxial attenuator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |