CN113466646A - Conversion device for testing breakdown voltage of metal substrate - Google Patents
Conversion device for testing breakdown voltage of metal substrate Download PDFInfo
- Publication number
- CN113466646A CN113466646A CN202110840610.2A CN202110840610A CN113466646A CN 113466646 A CN113466646 A CN 113466646A CN 202110840610 A CN202110840610 A CN 202110840610A CN 113466646 A CN113466646 A CN 113466646A
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- China
- Prior art keywords
- breakdown voltage
- metal substrate
- test
- input interface
- input line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012360 testing method Methods 0.000 title claims abstract description 69
- 239000000758 substrate Substances 0.000 title claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 29
- 239000002184 metal Substances 0.000 title claims abstract description 29
- 230000015556 catabolic process Effects 0.000 title claims abstract description 22
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 239000012212 insulator Substances 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims 3
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000003466 welding Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Abstract
The invention relates to a conversion device for testing the breakdown voltage of a metal substrate, which is characterized by comprising the following components: the PCB board is provided with a bus pad; the horn row is inserted and fixedly connected with the PCB; the input line, input line one end with bus pad fixed connection, the input line other end is equipped with input interface, the inside conductor that is equipped with of input interface, the conductor with input line fixed connection, the input interface outside is equipped with the insulator. An input interface is adopted to connect the positive electrode test pencil of the voltage-withstanding instrument with the switch-in port of the converter, so that current transmission is realized, the test pencil can be pulled out and plugged at any time, and the use is convenient and flexible; the PCB is adopted, the withstand voltage tester can be connected with the test jig, and a plurality of ox horn extension sockets can be welded according to the requirements of product test points; adopt the converter guard box, can prevent when withstand voltage tests, the operator electrocutes the risk.
Description
Technical Field
The invention relates to the technical field of voltage testing, in particular to a conversion device for testing breakdown voltage of a metal substrate.
Background
With the rapid development of the PCB industry, metal-based printed circuit boards (aluminum substrates, copper substrates, etc.) are increasingly widely applied in the market, and products such as home lighting, backlight televisions, new energy vehicles, power devices, etc. are all using aluminum-based circuit boards or copper-based circuit boards. Due to the particularity of the metal-based circuit board structure, the breakdown voltage resistance of the dielectric layer between the conductive copper foil layer and the metal substrate layer directly affects the durability, stability and safety of these products. How the metal-based printed circuit board can meet the breakdown voltage requirement of a product before the PCB factory leaves the factory, defective products which do not conform to the breakdown voltage of the product are effectively removed before SMT welding at a client, mass operation can be achieved, efficiency is improved, and cost is saved.
The test pencil of the existing voltage-withstanding test instrument can only test the breakdown voltage of a certain network of a PCB generally, and a manual point test mode is generally adopted, so that the risk of missing the test network exists, the test efficiency is low, and the hidden danger that the high voltage-withstanding requirement cannot be met exists. The existing voltage-withstanding test instrument is suitable for testing the current input end and the current output end after SMT welding, operation difficulty exists in 100% testing before the PCB factory shipment is met, and batch voltage-withstanding testing cannot be achieved by the existing voltage-withstanding test instrument.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides a conversion apparatus for testing a breakdown voltage of a metal substrate, including:
the PCB board is provided with a bus pad;
the horn row is inserted and fixedly connected with the PCB;
the input line, input line one end with bus pad fixed connection, the input line other end is equipped with input interface, the inside conductor that is equipped with of input interface, the conductor with input line fixed connection, the input interface outside is equipped with the insulator.
Preferably, the PCB board is an FR-4 substrate or a ceramic substrate.
Preferably, the PCB board thickness is greater than 1.6 mm.
Preferably, the ox horn socket is a 32-core or 64-core ox horn socket.
Preferably, the width of the copper foil of the PCB is more than 2mm, and the thickness of the copper foil is more than 10Z.
Preferably, the input interface is in the shape of a pen cap.
Preferably, the device further comprises a PVC insulation protection box.
Preferably, the ox horn socket is welded with the PCB board.
The conversion device for testing the breakdown voltage of the metal substrate has the following beneficial effects: an input interface is adopted to connect the positive electrode test pencil of the voltage-withstanding instrument with the switch-in port of the converter, so that current transmission is realized, the test pencil can be pulled out and plugged at any time, and the use is convenient and flexible; the PCB is adopted, the withstand voltage tester can be connected with the test jig, and a plurality of ox horn extension sockets can be welded according to the requirements of product test points; adopt the converter guard box, can prevent when withstand voltage tests, the operator electrocutes the risk.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic structural diagram of a conversion device for metal substrate breakdown voltage testing according to the present invention;
fig. 2 is an embodiment of an application of the conversion apparatus for metal substrate breakdown voltage test according to the present invention.
In the figure, 1-PCB, 2-ox horn row socket, 3-welding bus, 4-input line end, 5-input line other end, 6-input interface, 7-withstand voltage tester, 8-test pen, 9-conversion head, 10-ox horn row socket, 11-insulation protection box, 12-test jig, 13-metal aluminum plate, 14-test press bed.
Detailed Description
Fig. 1 is a schematic structural diagram of a conversion device for testing a breakdown voltage of a metal substrate according to the present invention. As shown in fig. 1, the conversion apparatus for metal substrate breakdown voltage test according to the first embodiment of the present invention at least includes a PCB board 1 having bus pads;
the horn socket 2 is fixedly connected with the PCB 1;
the input line, input line one end 4 and bus pad fixed connection, the input line other end 5 is equipped with input interface 6, and input interface 6 is inside to be equipped with the conductor, and the conductor is with input line fixed connection, and the input interface outside is equipped with the insulator.
A plurality of ox horn row inserts 2 can be welded on the PCB board 1. The number of the ox horn socket 2 can be determined according to the number of the network points of the product. The ox horn row insert 2 is connected with the PCB board 1 through welding. The PCB board 1 is an FR-4 substrate or a ceramic substrate. The PCB board 1 is selected to be an FR-4 substrate or a ceramic substrate because of its high dielectric strength. The PCB board thickness is preferably greater than 1.6 mm. The size, hole site, hole number of PCB board row jack can be according to the ox horn row of conveniently purchasing and insert and design. Generally, the test fixture is compatible with a flat cable and a test fixture used for an open/short circuit on/off test in a factory, and is usually a 32-core or 64-core ox horn socket. The width of the copper foil of the PCB is more than 2mm, and the thickness of the copper foil is more than 10Z. The larger the width of the conductor and the thickness of the copper foil is, the better the conductor is, so that the phenomenon of PCB explosion caused by overload of the current of the copper foil during high-voltage transmission is prevented. One end of the input line is welded on the bus bonding pad, and the other end of the input line is provided with a pen-cap-shaped input interface. The interface has an inner conductor connected to the input line and an outer insulator. The interface is convenient for the withstand voltage tester test electrography to insert at any time and extract. The device still includes the insulating guard box of PVC, has the risk of electrocuting during the operation of preventing.
Fig. 2 shows an embodiment of a conversion device for testing a breakdown voltage of a metal substrate according to the present invention. As shown in fig. 2, the positive electrode test pencil of the withstand voltage tester 7 is connected to the converter interface. The insulating protection box 11 is provided with a ox horn socket 10. The negative pole of the withstand voltage tester 7 is connected to a metal aluminum plate 13 of the test press 14, and the metal aluminum plate 13 is insulated and isolated from the test press 14 to prevent the test press 14 from being electrified. The test jig 12 is loaded on the test press 14, and the ox horn socket on the test jig 12 and the ox horn socket on the converter are connected together with a flat cable. The withstand voltage tester 7 sets test conditions: test voltage, leakage current range, test time. The test press 14 presses down, the metal aluminum plate 13 presses on the back of the metal substrate, and the metal test needle of the test fixture 12 presses on the pad of the metal substrate, so that the withstand voltage test is realized. When testing different product models, only the test fixture needs to be replaced. The PCB on-off test fixture can be compatible.
Through the design of the above embodiment, the invention has the beneficial effects that: an input interface is adopted to connect the positive electrode test pencil of the voltage-withstanding instrument with the switch-in port of the converter, so that current transmission is realized, the test pencil can be pulled out and plugged at any time, and the use is convenient and flexible; the PCB is adopted, the withstand voltage tester can be connected with the test jig, and a plurality of ox horn extension sockets can be welded according to the requirements of product test points; adopt the converter guard box, can prevent when withstand voltage tests, the operator electrocutes the risk.
While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation to the teachings of the invention without departing from its scope. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (8)
1. A switching device for metal substrate breakdown voltage testing, comprising:
the PCB board is provided with a bus pad;
the horn row is inserted and fixedly connected with the PCB;
the input line, input line one end with bus pad fixed connection, the input line other end is equipped with input interface, the inside conductor that is equipped with of input interface, the conductor with input line fixed connection, the input interface outside is equipped with the insulator.
2. The conversion equipment for metal substrate breakdown voltage test of claim 1, wherein the PCB board is an FR-4 substrate or a ceramic substrate.
3. The conversion equipment for metal substrate breakdown voltage test of claim 1, wherein the PCB board thickness is larger than 1.6 mm.
4. The conversion equipment for metal substrate breakdown voltage test of claim 1, wherein the ox horn socket is 32-core or 64-core ox horn socket.
5. The transition device for metal substrate breakdown voltage testing of claim 1, wherein the PCB board copper foil width is greater than 2mm and copper foil thickness is greater than 10Z.
6. The conversion apparatus according to claim 1, wherein the input interface is in a pen cap shape.
7. The transition device for metal substrate breakdown voltage testing according to any one of claims 1 to 6, further comprising a PVC insulation protection box.
8. The transition device for metal substrate breakdown voltage testing of claim 7, wherein the ox horn socket is soldered to the PCB board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110840610.2A CN113466646A (en) | 2021-07-25 | 2021-07-25 | Conversion device for testing breakdown voltage of metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110840610.2A CN113466646A (en) | 2021-07-25 | 2021-07-25 | Conversion device for testing breakdown voltage of metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113466646A true CN113466646A (en) | 2021-10-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110840610.2A Pending CN113466646A (en) | 2021-07-25 | 2021-07-25 | Conversion device for testing breakdown voltage of metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113466646A (en) |
Citations (16)
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| KR101550852B1 (en) * | 2014-06-03 | 2015-09-07 | 한국전력공사 | Connection apparatus of underground transmission line for withstanding voltage test |
| CN206002564U (en) * | 2016-08-11 | 2017-03-08 | 广东电网有限责任公司中山供电局 | A kind of dielectric loss and insulation resistance test conversion equipment and pilot system |
| CN206179483U (en) * | 2016-10-08 | 2017-05-17 | 星源电子科技(深圳)有限公司 | LCD module's test keysets |
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2021
- 2021-07-25 CN CN202110840610.2A patent/CN113466646A/en active Pending
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| KR101550852B1 (en) * | 2014-06-03 | 2015-09-07 | 한국전력공사 | Connection apparatus of underground transmission line for withstanding voltage test |
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