CN113070589A - Laser cutting method, laser cutting device and computer-readable storage medium - Google Patents
Laser cutting method, laser cutting device and computer-readable storage medium Download PDFInfo
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- CN113070589A CN113070589A CN202110478253.XA CN202110478253A CN113070589A CN 113070589 A CN113070589 A CN 113070589A CN 202110478253 A CN202110478253 A CN 202110478253A CN 113070589 A CN113070589 A CN 113070589A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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Abstract
The application discloses a laser cutting method, a laser cutting device and a computer readable storage medium, wherein the laser cutting method comprises the following steps: acquiring a first laser parameter, and cleaning the surface of a cutting material according to the first laser parameter; acquiring a second laser parameter, and cutting the cleaned cutting material according to the second laser parameter so as to reduce the thickness of the cutting material, wherein the laser energy generated by the laser equipment by adopting the first laser parameter is lower than the laser energy generated by adopting the second laser parameter; and acquiring a third laser parameter, and cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece. The impurities on the surface of the cutting material are cleaned before laser cutting is carried out, and the cleaned cutting material is cut again to reduce the thickness of the cutting material, so that the cutting time can be saved during formal cutting, and the phenomena of blackening and yellowing of the surface of the cutting material are avoided.
Description
Technical Field
The present application relates to the field of laser cutting technologies, and in particular, to a laser cutting method and apparatus, and a computer-readable storage medium.
Background
A Voice Coil Motor (VCM), which is a kind of Motor in electronics, is a VCM Motor, and a spring plate of the VCM Motor is made of copper alloy and has a thickness of 0.035mm, and when the spring plate of the VCM Motor is cut, the precision requirement is high, which is generally 0.01mm, so that the ordinary tool is not suitable for cutting. However, the VCM motor spring is generally cut by laser, but the VCM motor spring surface is blackened and yellowed by the heat generated by laser cutting, so that there is a problem that the surface of the material cut by laser is abnormal.
Disclosure of Invention
The embodiment of the application aims to solve the problem that the surface of a cut material after laser cutting is abnormal by providing a laser cutting method, a laser cutting device and a computer readable storage medium.
To achieve the above object, one aspect of the present application provides a laser cutting method, including:
acquiring a first laser parameter, and cleaning the surface of a cutting material according to the first laser parameter;
acquiring a second laser parameter, and cutting the cleaned cutting material according to the second laser parameter so as to reduce the thickness of the cutting material, wherein the laser energy generated by the laser equipment by adopting the first laser parameter is lower than the laser energy generated by adopting the second laser parameter;
and acquiring a third laser parameter, and cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece.
Optionally, the step of cutting the cleaned cutting material according to the second laser parameter includes:
determining a first cutting power, a first cutting path and a cutting thickness according to the second laser parameters;
and cutting the cleaned cutting material according to the first cutting power, the first cutting path and the cutting thickness, wherein the cutting power adopted by the laser equipment is in direct proportion to the generated laser energy.
Optionally, the determining the first cutting path according to the second laser parameter includes:
acquiring a cutting graph and the width of the cutting graph, wherein the second laser parameter comprises the width of the cutting graph and the width of the cutting graph;
and determining the first cutting path according to the cutting pattern and the width of the cutting pattern.
Optionally, the determining the cutting thickness according to the second laser parameter includes:
acquiring the actual thickness of the cutting material, and comparing the actual thickness with a preset thickness;
when the difference value between the actual thickness and the preset thickness is within a preset range, taking the preset cutting thickness as the cutting thickness;
and when the difference value between the actual thickness and the preset thickness is not in the preset range, determining the cutting thickness according to the difference value between the actual thickness and the preset thickness.
Optionally, the step of cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece includes:
determining a second cutting power and a second cutting path according to the third laser parameter;
and cutting the cutting material according to the second cutting power and the second cutting path to obtain the target workpiece.
Optionally, the step of acquiring a first laser parameter, and sweeping the surface of the cut material according to the first laser parameter includes:
determining a third cutting power and a cleaning path according to the first laser parameter;
sweeping the surface of the cutting material according to the third cutting power and the sweeping path.
Optionally, after the step of cutting the cutting material according to the third laser cutting parameter to obtain the target workpiece, the method includes:
acquiring the outline and the pollution area of the target workpiece;
and sweeping the contour and the polluted area of the target workpiece according to the third cutting power.
Optionally, the laser device generates a laser energy using the second laser parameter that is lower than a laser energy generated using the third laser parameter.
In addition, in order to achieve the above object, another aspect of the present application further provides a laser cutting apparatus, which includes a memory, a processor, and a laser cutting program stored on the memory and running on the processor, wherein the processor implements the steps of the laser cutting method as described above when executing the laser cutting program.
In addition, to achieve the above object, another aspect of the present application further provides a computer-readable storage medium, on which a laser cutting program is stored, and the laser cutting program, when executed by a processor, implements the steps of the laser cutting method as described above.
In the embodiment, the surface of the cut material is cleaned according to the first laser parameter by acquiring the first laser parameter; acquiring a second laser parameter, and cutting the cleaned cutting material according to the second laser parameter so as to reduce the thickness of the cutting material, wherein the laser energy generated by the laser equipment by adopting the first laser parameter is lower than the laser energy generated by adopting the second laser parameter; and acquiring a third laser parameter, and cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece. The impurities on the surface of the cutting material are cleaned before laser cutting is carried out, and the cleaned cutting material is cut again to reduce the thickness of the cutting material, so that the cutting time can be saved during formal cutting, and the phenomena of blackening and yellowing of the surface of the cutting material are avoided.
Drawings
Fig. 1 is a schematic terminal structure diagram of a hardware operating environment according to an embodiment of the present application;
FIG. 2 is a schematic flow chart of a first embodiment of a laser cutting method according to the present application;
FIG. 3 is a schematic flow chart of a second embodiment of the laser cutting method of the present application;
fig. 4 is a schematic flow chart of a third embodiment of the laser cutting method of the present application.
The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The main solution of the embodiment of the application is as follows: acquiring a first laser parameter, and cleaning the surface of a cutting material according to the first laser parameter; acquiring a second laser parameter, and cutting the cleaned cutting material according to the second laser parameter so as to reduce the thickness of the cutting material, wherein the laser energy generated by the laser equipment by adopting the first laser parameter is lower than the laser energy generated by adopting the second laser parameter; and acquiring a third laser parameter, and cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece.
When the elastic sheet of the VCM motor is cut by laser, the phenomenon of blackening and yellowing of the surface of the elastic sheet of the VCM motor can be caused by heat generated by laser cutting, so that the problem of abnormal phenomenon of the surface of a cut material after laser cutting exists.
Based on the problem, the application provides a laser cutting method, which comprises the steps of acquiring a first laser parameter, and cleaning the surface of a cut material according to the first laser parameter; acquiring a second laser parameter, and cutting the cleaned cutting material according to the second laser parameter so as to reduce the thickness of the cutting material, wherein the laser energy generated by the laser equipment by adopting the first laser parameter is lower than the laser energy generated by adopting the second laser parameter; and acquiring a third laser parameter, and cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece. The impurities on the surface of the cutting material are cleaned before laser cutting is carried out, and the cleaned cutting material is cut again to reduce the thickness of the cutting material, so that the cutting time can be saved during formal cutting, and the phenomena of blackening and yellowing of the surface of the cutting material are avoided.
As shown in fig. 1, fig. 1 is a schematic terminal structure diagram of a hardware operating environment according to an embodiment of the present application.
As shown in fig. 1, the terminal may include: a processor 1001, such as a CPU, a network interface 1004, a user interface 1003, a memory 1005, a communication bus 1002. Wherein a communication bus 1002 is used to enable connective communication between these components. The user interface 1003 may include a Display screen (Display), an input unit such as a Keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface, a wireless interface. The network interface 1004 may optionally include a standard wired interface, a wireless interface (e.g., WI-FI interface). The memory 1005 may be a high-speed RAM memory or a non-volatile memory (e.g., a magnetic disk memory). The memory 1005 may alternatively be a storage device separate from the processor 1001.
Those skilled in the art will appreciate that the terminal structure shown in fig. 1 does not constitute a limitation of the terminal device and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
As shown in fig. 1, a memory 1005, which is a kind of computer-readable storage medium, may include therein an operating system, a network communication module, a user interface module, and a laser cutting program.
In the terminal shown in fig. 1, the network interface 1004 is mainly used for data communication with the background server; the user interface 1003 is mainly used for data communication with a client (user side); when the terminal is a laser device, the processor 1001 may be configured to call a laser cutting program in the memory 1005, and perform the following operations:
acquiring a first laser parameter, and cleaning the surface of a cutting material according to the first laser parameter;
acquiring a second laser parameter, and cutting the cleaned cutting material according to the second laser parameter so as to reduce the thickness of the cutting material, wherein the laser energy generated by the laser equipment by adopting the first laser parameter is lower than the laser energy generated by adopting the second laser parameter;
and acquiring a third laser parameter, and cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece.
Referring to fig. 2, fig. 2 is a schematic flow chart of a first embodiment of the laser cutting method of the present application.
While embodiments of the laser cutting method are provided herein, it should be noted that although a logical order is shown in the flow chart, in some cases, the steps shown or described may be performed in an order different than that shown or described herein.
The laser cutting method comprises the following steps:
step S10, acquiring a first laser parameter, and cleaning the surface of the cutting material according to the first laser parameter;
because the shell fragment material of VCM motor is the copper alloy, and thickness is 0.035mm, when the shell fragment of VCM motor is cut, the required precision is higher, generally all is 0.01mm, current generally adopts the shell fragment of laser cutting VCM motor, however, at the in-process of laser cutting, because the energy density of laser is high, make cutting position and the non-cutting position around produce a large amount of heats, thereby make the shell fragment surface of VCM motor appear blackening, the phenomenon of yellowing, influence the quality of the shell fragment of VCM motor then. And this embodiment carries out laser earlier and cleans the shell fragment surface of VCM motor before the shell fragment of cutting VCM motor to avoid high temperature to make the surperficial impurity of shell fragment (like dust, metal particle thing etc.) carbonization of VCM motor when laser cutting, thereby lead to the shell fragment surface to appear blackening, the phenomenon of yellowing. Experiments show that when oxide exists on the surface of the metal, plasma is generated on the surface of the metal, and laser cleaning is mainly based on that pollutants on the surface of an object absorb laser energy, or are vaporized and volatilized, or are heated and expanded instantly to overcome the adsorption force of the surface to particles, so that the particles are separated from the surface of the object, and the aim of cleaning is fulfilled.
Specifically, when laser cleaning is performed, laser parameters including cutting power and a cleaning path need to be obtained first, and the surface of the cutting material is cleaned according to the cutting power and the cleaning path. Since the excessive cutting power may carbonize impurities on the surface of the spring plate of the VCM motor, thereby causing the surface of the spring plate to be black and yellow, and the low cutting power may be adopted to avoid such a phenomenon, for example, the cutting power of the laser device may be divided into low, medium and high powers, and the power adopted for the laser cleaning is low power. Further, in this embodiment, a laser filling layer manner is adopted to clean the surface of the elastic sheet of the VCM motor, where the filling layer in the layer manner means that a path of a laser action is represented in a pattern form, and the filling means that a dense laser path (i.e. a cleaning path) is planned to fill the pattern, for example: when the path acted by the laser is rectangular, the laser works back and forth in the rectangle with low cutting power until the planned path is filled.
It should be noted that, in the present embodiment, the elastic sheet of the VCM motor is used as the cutting material for analysis, however, the cutting material may also include other materials made of copper alloy, or other materials cut by laser.
Step S20, obtaining a second laser parameter, and cutting the cleaned cut material according to the second laser parameter to reduce the thickness of the cut material, wherein the laser energy generated by the laser equipment by adopting the first laser parameter is lower than the laser energy generated by adopting the second laser parameter;
because laser cleans and just clears away the impurity on VCM motor's shell fragment surface, consequently VCM motor's shell fragment thickness does not take place too big change, if the cutting time that the shell fragment used after the direct cutting cleaned is longer, and long-time cutting can lead to the shell fragment to blacken. For solving the above problem, this embodiment still needs slightly cut the shell fragment of VCM motor after cleaning the surperficial impurity of the shell fragment of VCM motor to make the shell fragment attenuation once more, the time of the cutting time ratio direct cutting that adopts behind the shell fragment attenuation is short, thereby has avoided long-time cutting to lead to the problem that the shell fragment surface blackened.
Specifically, in this embodiment, the cleaned cutting material is also cut in a laser filling layer manner, the laser parameters also need to be acquired before each cutting, and then the cleaned cutting material is cut according to the laser parameters. The laser parameters of the current cutting include cutting power, cutting path and cutting thickness, because the purpose of each cutting is different, the adopted cutting parameters are different, and the purpose of the current cutting is to reduce the thickness of the cut material. In addition, the cutting is to slightly cut the material (for example, the cutting thickness is 0.03mm), the cut material is not cut, namely the cutting principle is the same as the laser sweeping principle, when the laser sweeps the surface of the elastic sheet, the surface of the elastic sheet absorbs the laser energy and then vaporizes and volatilizes, so that the elastic sheet becomes thin.
It should be noted that, since the cutting material needs to be thinned in the current cutting, the cutting power used by the laser device to perform the current cutting is greater than the cutting power used by the laser cleaning, and the cutting power used by the laser device is in a direct relationship with the generated laser energy, that is, the laser energy generated by the laser device to perform the current cutting is greater than the laser energy generated by the laser cleaning.
And step S30, obtaining a third laser parameter, and cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece.
After the surface of the elastic sheet of the VCM motor is cleaned and cut and thinned, the cutting needs to be performed again to obtain a final cut workpiece, in this embodiment, a single-line cutting mode is adopted to perform secondary cutting on the cut material, where the single-line cutting mode refers to a mode in which a single laser beam is cut along a line, and the single-line cutting mode is adopted to reduce external force interference of laser pulses by low-energy cutting, so as to reduce shaking of the cut material.
Specifically, the laser parameters of the second cutting are obtained, including the cutting power and the cutting path, where the cutting power of the second cutting is greater than the cutting power of the first cutting, that is, the laser energy generated by the laser device using the second laser parameter is lower than the laser energy generated by using the third laser parameter. The specific laser cutting process is as follows: the laser device discharges the laser through pulses under the control of a computer, so that pulse laser with controlled repeated high frequency is output to form a light beam with certain frequency and certain pulse width, the pulse laser beam is conducted and reflected through a light path and focused on the surface of a cutting material through a focusing lens group to form fine and high-energy-density light spots, and the focal spots are positioned near a surface to be processed to melt or gasify the cutting material at high temperature instantly. Each high-energy laser pulse instantly sputters a small hole on the surface of the object, and the laser processing head and the cut material perform continuous relative movement according to a pre-drawn cutting path to hit points under the control of a computer, so that the elastic sheet of the VCM motor is processed into a desired shape, and a target workpiece is obtained.
Generally, due to the cutting thickness, the gas used for cutting, and the like, the cut material has somewhat burrs after the cutting is completed, and in addition, some smoke is generated during laser cutting, and the smoke also affects the color of the surface of the elastic sheet. Therefore, in order to solve the above problem, in this embodiment, after the target workpiece is cut, the target workpiece is cleaned again to smooth the cut surface of the target workpiece, and the color of the elastic piece is ensured.
Specifically, the second laser cleaning also adopts a pattern filling mode, and the difference between the first laser cleaning and the second laser cleaning is as follows: the first laser sweep is to sweep the surface of the cut material and the second laser sweep is to sweep the cut profile of the laser and the area of smoke contamination. Therefore, the second laser cleaning needs to acquire the contour of the target workpiece and a contaminated area, which is an area affected by the laser smoke, and further cleans the contour of the target workpiece and the contaminated area. The method for acquiring the contour of the target workpiece comprises the following steps: and acquiring a cutting path of the second cutting, wherein the cutting path corresponds to the contour of the target workpiece, for example, the cutting path of the second cutting is a square surrounded by four equal-length straight lines, at the moment, the target workpiece obtained by cutting is a square, and the cutting path is the contour of the target workpiece. Because the area affected by the laser smoke has abnormal phenomena such as blackening and yellowing, the color of the surface of the target workpiece can be directly identified, the color is matched with a normal color (such as golden yellow), if the color is not matched with the normal color, the current area is affected by the laser smoke, and the current area is marked as a polluted area; if the color is matched with the normal color, the fact that no area is affected by laser smoke currently is indicated. The power used for the second laser cleaning is the same as that used for the first laser cleaning, and low power is used for cleaning.
It should be noted that, in the laser cutting process, the cutting processes and the motion parameters of different cutting materials are different, and the setting of the cutting parameters will directly affect the cutting effect of the cutting material, and the cutting parameters of this embodiment include the cutting mode, the cutting path, the cutting thickness, and the cutting power listed in the above embodiments, as well as the cutting speed, the cutting air pressure, the cutting delay, and the like, and the change of each parameter may affect the final cutting effect of the cutting material.
In the embodiment, the surface of the cut material is cleaned according to the first laser parameter by acquiring the first laser parameter; acquiring a second laser parameter, and cutting the cleaned cutting material according to the second laser parameter so as to reduce the thickness of the cutting material, wherein the laser energy generated by the laser equipment by adopting the first laser parameter is lower than the laser energy generated by adopting the second laser parameter; and acquiring a third laser parameter, cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece, and further cleaning the cut target workpiece again. Through cleaning the impurity on cutting material surface before carrying out laser cutting to carry out the secondary cutting to the cutting material after cleaning in order to reduce the thickness of cutting material, make the time that can save the cutting when formal cutting, thereby avoid the surface of cutting material to appear blackening, the phenomenon of yellowing, simultaneously, clean cutting material once more after the cutting, thereby cleaned the burr and the smog pollution area of cutting profile, then make the cutting material become smooth, guarantee original color and luster.
Further, referring to fig. 3, a second embodiment of the laser cutting method of the present application is proposed.
The second embodiment of the laser cutting method differs from the first embodiment of the laser cutting method in that the manner of determining the first cutting path according to the second laser parameter comprises:
step S21, obtaining a cutting graph and the width of the cutting graph, wherein the second laser parameter comprises the width of the cutting graph and the width of the cutting graph;
step S22, determining the first cutting path according to the cutting pattern and the width of the cutting pattern.
In this embodiment, because the cutting mode adopted by the first cutting is a pattern layer filling mode, a cutting pattern and a width of the cutting pattern need to be obtained in advance, where the cutting pattern generally adopts a rectangular shape, and the width of the cutting pattern is generally 0.3mm, and specifically, a cutting path is further set in the cutting pattern when the higher the precision is, the smaller the width is, and the cutting width of the cutting path is within the cutting width of the cutting pattern. For example, taking a rectangular cutting pattern as an example, a rectangle is marked on a cutting material, the width of the rectangle is set to 0.3mm, and dense cutting paths are arranged in the rectangle in a filling manner, so that when cutting is performed, the laser moves back and forth in the rectangle until all the paths are finished.
The width of cutting figure and cutting figure is obtained to this embodiment, confirms the cutting route according to the width of cutting figure and cutting figure to make first cutting cut in the cutting figure of setting for, reach the effect of accurate cutting.
Further, referring to fig. 4, a third embodiment of the laser cutting method of the present application is proposed.
The third embodiment of the laser cutting method differs from the first and second embodiments of the laser cutting method in that the manner of determining the cut thickness according to the second laser parameter comprises:
step S23, acquiring the actual thickness of the cutting material, and comparing the actual thickness with a preset thickness;
step S24, when the difference value between the actual thickness and the preset thickness is in a preset range, taking a preset cutting thickness as the cutting thickness;
and step S25, when the difference value between the actual thickness and the preset thickness is not in the preset range, determining the cutting thickness according to the difference value between the actual thickness and the preset thickness.
When a material is cut by using laser, a preset cutting depth (the preset cutting depth is generally the focal depth of a laser beam) is generally set, and the preset cutting depth is generally set to be the thickness of a common material, so that the utilization rate of the laser beam is low when the material with a smaller cutting thickness (the thickness of the material to be cut is smaller than the preset cutting depth) is cut; when a thicker material is cut (the actual thickness of the material to be cut is greater than the preset cutting depth), the material is not completely cut due to the fact that the cutting depth is smaller than the material thickness, and the cutting effect is poor. And this application sets up cutting parameter according to actual thickness through the actual thickness that obtains waiting to cut the material before cutting to reach better cutting effect.
Specifically, after cleaning of the surface of the elastic sheet of the VCM motor is completed, detecting an actual thickness of the cut material by a thickness sensor, or measuring a difference between an upper surface and a lower surface of the cut material by a height sensor to obtain the actual thickness, further obtaining a preset thickness of the cut material, and comparing the actual thickness with the preset thickness; when the difference value between the actual thickness and the preset thickness is within a preset range, taking the preset cutting thickness as the cutting thickness; and when the difference value between the actual thickness and the preset thickness is not in the preset range, determining the cutting thickness according to the difference value between the actual thickness and the preset thickness. For example, the currently detected actual thickness is 0.036mm, and the preset thickness is 0.035mm, which corresponds to a preset cutting thickness of 0.005mm, and the preset range is 0-0.002mm, so that the difference between the current actual thickness and the preset thickness is 0.001mm, and within the preset range of 0-0.002mm, 0.005mm is directly used as the current cutting thickness. When the actual thickness detected at present is 0.0038mm, the difference between the current actual thickness and the preset thickness is 0.003mm, and is not within the preset range of 0-0.002mm, at this moment, the cutting thickness is determined according to the difference between the actual thickness and the preset thickness, and the preset cutting thickness and the thickness difference are added to obtain the current cutting thickness, that is, the current cutting thickness is 0.008 mm. Optionally, when the difference between the actual thickness and the preset thickness is not within the preset range, the cutting thickness is further determined according to a proportionality coefficient of the actual thickness and the preset thickness.
In the embodiment, the actual thickness of the cut material is obtained and compared with the preset thickness; when the difference value between the actual thickness and the preset thickness is within a preset range, taking the preset cutting thickness as the cutting thickness; and when the difference value between the actual thickness and the preset thickness is not in the preset range, determining the cutting thickness according to the difference value between the actual thickness and the preset thickness. The actual thickness of the material to be cut is obtained, and the current cutting thickness is adjusted according to the preset thickness and the actual thickness, so that a good cutting effect is achieved.
In addition, the application also provides a laser cutting device, the device comprises a memory, a processor and a laser cutting program which is stored on the memory and runs on the processor, and the laser cutting device cleans the surface of a cut material according to first laser parameters by acquiring the first laser parameters; acquiring a second laser parameter, and cutting the cleaned cutting material according to the second laser parameter so as to reduce the thickness of the cutting material; and acquiring a third laser parameter, cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece, and further cleaning the cut target workpiece again. Through cleaning the impurity on cutting material surface before carrying out laser cutting to carry out the secondary cutting to the cutting material after cleaning in order to reduce the thickness of cutting material, make the time that can save the cutting when formal cutting, thereby avoid the surface of cutting material to appear blackening, the phenomenon of yellowing, simultaneously, clean cutting material once more after the cutting, thereby cleaned the burr and the smog pollution area of cutting profile, then make the cutting material become smooth, guarantee original color and luster.
Furthermore, the present application also provides a computer-readable storage medium, on which a laser cutting program is stored, which when executed by a processor implements the steps of the laser cutting method as described above.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It should be noted that in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.
While alternative embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following appended claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A laser cutting method is applied to laser equipment, and is characterized by comprising the following steps:
acquiring a first laser parameter, and cleaning the surface of a cutting material according to the first laser parameter;
acquiring a second laser parameter, and cutting the cleaned cutting material according to the second laser parameter so as to reduce the thickness of the cutting material, wherein the laser energy generated by the laser equipment by adopting the first laser parameter is lower than the laser energy generated by adopting the second laser parameter;
and acquiring a third laser parameter, and cutting the cutting material according to the third laser cutting parameter to obtain a target workpiece.
2. The laser cutting method according to claim 1, wherein the step of cutting the cut material after sweeping according to the second laser parameter includes:
determining a first cutting power, a first cutting path and a cutting thickness according to the second laser parameters;
and cutting the cleaned cutting material according to the first cutting power, the first cutting path and the cutting thickness, wherein the cutting power adopted by the laser equipment is in direct proportion to the generated laser energy.
3. The laser cutting method of claim 2, wherein determining the first cutting path based on the second laser parameter comprises:
acquiring a cutting graph and the width of the cutting graph, wherein the second laser parameter comprises the width of the cutting graph and the width of the cutting graph;
and determining the first cutting path according to the cutting pattern and the width of the cutting pattern.
4. The laser cutting method of claim 2, wherein determining the cut thickness from the second laser parameter comprises:
acquiring the actual thickness of the cutting material, and comparing the actual thickness with a preset thickness;
when the difference value between the actual thickness and the preset thickness is within a preset range, taking the preset cutting thickness as the cutting thickness;
and when the difference value between the actual thickness and the preset thickness is not in the preset range, determining the cutting thickness according to the difference value between the actual thickness and the preset thickness.
5. The laser cutting method of claim 1, wherein the step of cutting the cut material to obtain a target workpiece according to the third laser cutting parameter comprises:
determining a second cutting power and a second cutting path according to the third laser parameter;
and cutting the cutting material according to the second cutting power and the second cutting path to obtain the target workpiece.
6. The laser cutting method according to claim 1, wherein the step of acquiring a first laser parameter according to which the surface of the cut material is swept comprises:
determining a third cutting power and a cleaning path according to the first laser parameter;
sweeping the surface of the cutting material according to the third cutting power and the sweeping path.
7. The laser cutting method according to claim 6, wherein the step of cutting the cut material according to the third laser cutting parameter to obtain a target workpiece comprises:
acquiring the outline and the pollution area of the target workpiece;
and sweeping the contour and the polluted area of the target workpiece according to the third cutting power.
8. The laser cutting method of claim 1, wherein the laser device generates a lower laser energy using the second laser parameter than the third laser parameter.
9. A laser cutting apparatus, characterized in that the apparatus comprises a memory, a processor and a laser cutting program stored on the memory and running on the processor, the processor implementing the steps of the method according to any one of claims 1 to 8 when executing the laser cutting program.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a laser cutting program which, when executed by a processor, implements the steps of the method according to any one of claims 1 to 8.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116604204A (en) * | 2023-07-20 | 2023-08-18 | 包头江馨微电机科技有限公司 | Cutting and separating device, system and method for multi-connection spring piece of voice coil motor |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1034362A (en) * | 1996-07-18 | 1998-02-10 | Mitsubishi Electric Corp | Method and equipment for laser beam machining |
| CN105479016A (en) * | 2015-12-30 | 2016-04-13 | 大族激光科技产业集团股份有限公司 | Laser cutting method for PCB containing copper layer |
| CN109434307A (en) * | 2018-12-29 | 2019-03-08 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting method and laser cutting device of flexible screen |
| CN109570778A (en) * | 2018-12-29 | 2019-04-05 | 大族激光科技产业集团股份有限公司 | A kind of laser processing and laser-processing system of hard brittle material |
| CN110340539A (en) * | 2018-03-30 | 2019-10-18 | 上海微电子装备（集团）股份有限公司 | A kind of laser cutting method and laser cutting system |
| CN110340541A (en) * | 2019-06-05 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of wave pushing-type laser processing, device and system |
| CN110853515A (en) * | 2019-11-20 | 2020-02-28 | 京东方科技集团股份有限公司 | Display panel, cutting method thereof and display device |
| CN112139660A (en) * | 2020-09-30 | 2020-12-29 | 广东利元亨智能装备股份有限公司 | Method, device, equipment and computer readable storage medium for laser cutting thin sheet |
-
2021
- 2021-04-29 CN CN202110478253.XA patent/CN113070589B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1034362A (en) * | 1996-07-18 | 1998-02-10 | Mitsubishi Electric Corp | Method and equipment for laser beam machining |
| CN105479016A (en) * | 2015-12-30 | 2016-04-13 | 大族激光科技产业集团股份有限公司 | Laser cutting method for PCB containing copper layer |
| CN110340539A (en) * | 2018-03-30 | 2019-10-18 | 上海微电子装备（集团）股份有限公司 | A kind of laser cutting method and laser cutting system |
| CN109434307A (en) * | 2018-12-29 | 2019-03-08 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting method and laser cutting device of flexible screen |
| CN109570778A (en) * | 2018-12-29 | 2019-04-05 | 大族激光科技产业集团股份有限公司 | A kind of laser processing and laser-processing system of hard brittle material |
| CN110340541A (en) * | 2019-06-05 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of wave pushing-type laser processing, device and system |
| CN110853515A (en) * | 2019-11-20 | 2020-02-28 | 京东方科技集团股份有限公司 | Display panel, cutting method thereof and display device |
| CN112139660A (en) * | 2020-09-30 | 2020-12-29 | 广东利元亨智能装备股份有限公司 | Method, device, equipment and computer readable storage medium for laser cutting thin sheet |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116604204A (en) * | 2023-07-20 | 2023-08-18 | 包头江馨微电机科技有限公司 | Cutting and separating device, system and method for multi-connection spring piece of voice coil motor |
| CN116604204B (en) * | 2023-07-20 | 2023-10-20 | 包头江馨微电机科技有限公司 | Cutting and separating device, system and method for multi-connection spring piece of voice coil motor |
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