CN113061842A - Mask, manufacturing method of mask and manufacturing method of display panel - Google Patents
Mask, manufacturing method of mask and manufacturing method of display panel Download PDFInfo
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- CN113061842A CN113061842A CN202110298294.0A CN202110298294A CN113061842A CN 113061842 A CN113061842 A CN 113061842A CN 202110298294 A CN202110298294 A CN 202110298294A CN 113061842 A CN113061842 A CN 113061842A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000001704 evaporation Methods 0.000 claims abstract description 121
- 230000008020 evaporation Effects 0.000 claims abstract description 113
- 229910052751 metal Inorganic materials 0.000 claims abstract description 85
- 239000002184 metal Substances 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000007747 plating Methods 0.000 claims abstract description 44
- 239000007769 metal material Substances 0.000 claims abstract description 41
- 230000006911 nucleation Effects 0.000 claims abstract description 14
- 238000010899 nucleation Methods 0.000 claims abstract description 14
- 230000002401 inhibitory effect Effects 0.000 claims abstract description 3
- 239000011248 coating agent Substances 0.000 claims description 50
- 238000000576 coating method Methods 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 24
- -1 polytetrafluoroethylene Polymers 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 7
- 150000003384 small molecules Chemical class 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 239000002861 polymer material Substances 0.000 claims description 6
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 34
- 238000009834 vaporization Methods 0.000 description 30
- 230000008016 vaporization Effects 0.000 description 30
- 238000005253 cladding Methods 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 8
- 239000000178 monomer Substances 0.000 description 6
- 239000010406 cathode material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000010329 laser etching Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The embodiment of the invention discloses a mask, a manufacturing method of the mask and a manufacturing method of a display panel. The mask comprises a metal substrate and a plurality of evaporation holes arranged on the metal substrate, wherein the evaporation holes are arranged in an array mode; the metal substrate comprises a first surface and a second surface which are oppositely arranged, and the evaporation hole penetrates from the first surface to the second surface along the thickness direction of the metal substrate; the second surface of the metal substrate and the sidewalls of the evaporation holes include a plating layer for inhibiting nucleation of the evaporated metal material. By adopting the mask provided by the embodiment of the invention, the metal materials can be prevented from being adhered at the evaporation hole to form a plurality of cathode metal blocks, so that the cathode metal blocks are made smaller, the shading of the cathode metal blocks is reduced, the light transmittance of the cathode layer is higher, the light transmittance of the display panel is improved, and the fingerprint identification precision of the fingerprint under the screen and the image acquisition precision of the camera under the screen are improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a mask, a manufacturing method of the mask and a manufacturing method of a display panel.
Background
With the development of display technologies and the improvement of living standards of people, Organic Light-Emitting Diode (OLED) display devices are widely used, technologies of underscreen fingerprints, underscreen camera shooting and the like of existing flexible display panels with narrow frames or full screens are gradually developed, Light is required to penetrate through a display panel to irradiate on an induction device arranged on the backlight surface of the display panel, the Light transmittance of the existing display panel is low, and the fingerprint identification precision of underscreen fingerprints and the image acquisition precision of underscreen cameras and the like are affected.
Disclosure of Invention
The embodiment of the invention provides a mask and a manufacturing method thereof as well as a manufacturing method of a display panel, which are used for improving the light transmittance of the display panel, so that the fingerprint identification precision of a fingerprint under a screen and the image acquisition precision of a camera under the screen are improved.
In order to realize the technical problem, the invention adopts the following technical scheme:
in a first aspect, an embodiment of the present invention provides a mask, including:
the metal substrate is arranged in a plurality of evaporation holes of the metal substrate, and the evaporation holes are arranged in an array mode;
the metal substrate comprises a first surface and a second surface which are oppositely arranged, and the evaporation hole penetrates from the first surface to the second surface along the thickness direction of the metal substrate;
the second surface of the metal substrate and the sidewalls of the evaporation holes include a plating layer for inhibiting nucleation of the evaporated metal material.
Further, the material adhesion probability of the plating layer is less than or equal to 0.1.
Further, the material of the plating layer comprises a polymer material or an organic small molecule material;
the polymer material comprises one or more polymers of perfluorinated polymers, polytetrafluoroethylene, polyvinyl biphenyl and polyvinyl carbazole;
the organic small molecule material comprises one or more of organic molecules of nitrogen, sulfur, oxygen, phosphorus and aluminum and polycyclic aromatic compounds.
Further, the first surface of the metal substrate includes a plating layer.
Further, the thickness range of the coating comprises 1-10 um.
Further, the roughness of the second surface and the surface of the side wall of the evaporation hole are both larger than that of the first surface.
Further, the size range of the opening of the evaporation hole comprises 10-100 um.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a mask, including:
providing a metal substrate;
forming a plurality of evaporation holes on the metal substrate, wherein the plurality of evaporation holes are arranged in an array mode; the metal substrate comprises a first surface and a second surface which are oppositely arranged, and the evaporation hole penetrates from the first surface to the second surface along the thickness direction of the metal substrate;
forming a plating layer on the second surface of the metal substrate and the side wall of the evaporation hole; the plating layer serves to suppress nucleation of the evaporated metal material.
Further, before forming the plating layer on the first surface, the second surface and the sidewall of the evaporation hole of the metal substrate, the method further comprises:
and carrying out roughening treatment on the second surface and the side wall of the evaporation hole.
In a third aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, in which a cathode is formed by using any mask as in the first aspect.
According to the mask provided by the embodiment of the invention, the coating layers are arranged on the second surface of the metal substrate and the side wall of the evaporation hole, so that when the evaporated metal material is evaporated, the metal material cannot form a film on the mask, the problem of adhesion and hole plugging of the evaporated metal material at the evaporation hole can be avoided, the mask is free from cleaning, the mask is prevented from being damaged by liquid medicine cleaning or ultrasonic cleaning in the cleaning process, the service life of the mask is prolonged, the cost is saved to a certain extent, a plurality of cathode metal blocks can be formed by adopting the mask provided by the embodiment, the light transmittance of the prepared cathode layer is higher, the light transmittance of the display panel is improved, and the fingerprint identification precision of fingerprints under the screen and the image acquisition precision of a camera under the screen are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a mask provided in an embodiment of the present invention;
FIG. 2 is a cross-sectional view along AA' of FIG. 1 of a reticle provided in accordance with an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another mask provided in an embodiment of the present invention;
FIG. 4 is a flowchart of a method for manufacturing a mask according to an embodiment of the present invention;
FIG. 5 is a flow chart of another method for manufacturing a mask according to an embodiment of the present invention;
fig. 6 is a flowchart of a method for manufacturing a mask according to another embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
As mentioned in the background art, corresponding areas such as the fingerprint under the screen and the camera under the screen of the flexible display panel with the narrow frame or the full screen need light to pass through the display panel to irradiate on the sensing device arranged on the backlight surface of the display panel, and the light transmittance of the display panel is low, so that the fingerprint identification precision of the fingerprint under the screen and the image acquisition precision of the camera under the screen are affected. The inventors have found through research that the reason for this problem is that the cathode of the OLED is a full-surface metal, which reduces the light transmittance of the display panel.
Based on the above technical problem, the present embodiment proposes the following solutions:
fig. 1 is a schematic structural diagram of a mask provided in an embodiment of the present invention. Fig. 2 is a cross-sectional view of a mask plate along the direction AA' in fig. 1 according to an embodiment of the present invention. With reference to fig. 1 and fig. 2, the mask provided by the embodiment of the present invention includes a metal substrate 1, and a plurality of evaporation holes 2 disposed on the metal substrate 1, wherein the plurality of evaporation holes 2 are arranged in an array; the metal substrate 1 comprises a first surface 3 and a second surface 4 which are oppositely arranged, and the evaporation hole 2 penetrates from the first surface 3 to the second surface 4 along the thickness direction of the metal substrate 1; the second surface 4 of the metal substrate 1 and the sidewalls of the evaporation holes 2 comprise a plating layer 5, the plating layer 5 serving to suppress nucleation of the evaporated metal material.
Specifically, the plating layer 5 may be provided on the second surface 4 of the metal substrate 1 and the sidewall of the evaporation hole 2 by one or more combinations of thermal evaporation deposition, magnetron sputtering, chemical vapor deposition, and organic vapor deposition. Because the second surface 4 of metal substrate 1 and the lateral wall of evaporation hole 2 are provided with cladding material 5 that can restrain the metal material nucleation by the coating by vaporization, when the coating by vaporization, the metal material by the coating by vaporization can only be through evaporating hole 2 coating by vaporization to treating the coating by vaporization base plate for the metal material by the coating by vaporization can not take place the adhesion stifled hole on the mask version and evaporation hole 2 department. The plurality of evaporation holes 2 provided in the metal substrate 1 are arranged in an array, and the density of the evaporation holes 2 and the size of the evaporation holes 2 may be set as required. The second surface 4 of mask version is the surface that the mask version is close to the coating by vaporization source, the first surface 3 of mask version can with treat that the coating by vaporization base plate laminates, the metal material by the coating by vaporization is placed in one side of the second surface 4 of mask version, the metal material by the coating by vaporization is by coating by vaporization hole 2 coating by vaporization 4 one side of the second surface of mask version to the coating by vaporization base plate of treating of 3 one side of the first surface of mask version on, form patterned metal block, wherein, treat that the coating by vaporization base plate can be the glass substrate.
The metal to be evaporated may be the metal used for the cathode, and the metal block to be formed may be the cathode. One metal block may be disposed corresponding to one light emitting unit as needed, or one metal block may be disposed corresponding to a plurality of light emitting units as needed, and for example, one metal block may be disposed corresponding to one pixel unit. So that the size of the metal block evaporated to the substrate to be evaporated through the evaporation holes 2 meets the requirement of light transmittance.
The mask version that this embodiment provided sets up the cladding material through the lateral wall at metal substrate's second surface and evaporation coating hole, the metal material by the evaporation coating can't form a film on the mask version when the evaporation coating, not only can avoid the metal material by the evaporation coating to take place adhesion stifled hole problem in evaporation coating hole department, still can realize exempting from of mask version and wash, and then avoided the mask version to wash the damage that causes the mask version because of liquid medicine or ultrasonic cleaning in the cleaning process, the life of mask version has been prolonged, the cost is saved, the mask version that adopts this embodiment to provide can form a plurality of negative pole metal blocks, make the light transmissivity of the cathode layer that makes higher, thereby improve display panel's light transmissivity, thereby promote the fingerprint identification precision of fingerprint under the screen and the image acquisition precision of camera under the screen.
Alternatively, on the basis of the above embodiment, with continued reference to fig. 2, the material adhesion probability of the plating layer 5 is less than or equal to 0.1.
Specifically, a sticking probability equal to 1 indicates that all monomers striking the surface are adsorbed and subsequently incorporated into the growing film; a sticking probability equal to 0 indicates that all of the monomer that impacted the surface was desorbed and subsequently did not form a film on the surface. Illustratively, a sticking probability equal to 0.1 indicates that 10% wt of the monomers impacting the surface are adsorbed and 90% wt of the monomers are desorbed; the sticking probability of 0.1 or less indicates that 10% or less by weight of the monomers striking the surface are adsorbed and that almost no monomers form a film on the surface. The metal material that is evaporated can be cathode material, for example can be one, two kinds or more such as Mg, Ag, Al, Zn, metal material evaporation temperature is higher, and the evaporation temperature range is 500 ~ 1300 ℃ generally, when will be evaporated metal material evaporation coating to evaporation coating hole 2, because the material adhesion probability of the 5 cladding material of cladding material on the 2 lateral walls of evaporation coating hole is less than or equal to 0.1 for the difficult nucleation of metal material that is evaporated, the metal material that is evaporated by vaporization coating in-process can not take place the adhesion in evaporation coating hole 2 department, avoid the evaporation coating hole 2 of mask version in-process to take place the stifled hole and can't normally evaporate metal material.
Alternatively, on the basis of the above embodiment, with continued reference to fig. 2, the material of the plating layer 5 includes a polymer material or an organic small molecule material; the polymer material comprises one or more polymers of perfluorinated polymers, polytetrafluoroethylene, polyvinyl biphenyl and polyvinyl carbazole; the organic small molecule material comprises one or more of organic molecules of nitrogen, sulfur, oxygen, phosphorus and aluminum and polycyclic aromatic compounds.
In particular, the polymeric material may include fluoropolymers, and the polymeric material may include, but is not limited to, perfluorinated polymers, Polytetrafluoroethylene (PTFE), polyvinylbiphenyl, Polyvinylcarbazole (PVK), and polymers formed by polymerizing a variety of polycyclic aromatic compounds as described above. The organic small molecule material may include a polycyclic aromatic compound, and may optionally include organic molecules of one or more heteroatoms such as nitrogen (N), sulfur (S), oxygen (O), phosphorus (P), and aluminum (a 1). The metal material to be evaporated may be a cathode material, for example, one, two or more alloys of Mg, Ag, Al, Zn, etc. The coating made of the material can inhibit the nucleation of the cathode material.
Optionally, fig. 3 is a schematic structural diagram of another mask provided in an embodiment of the present invention. On the basis of the above embodiment, referring to fig. 3, the first surface 3 of the metal substrate 1 of the mask provided by the embodiment of the present invention includes the plating layer 5.
Specifically, the plating layer 5 is conveniently arranged on the first surface 3 and the second surface 4 of the metal substrate 1 of the mask and the side wall of the evaporation hole 2 integrally, and the process is simple and easy to realize. In addition, the first surface 3, the second surface 4 and the side wall of the evaporation hole 2 of the mask metal substrate 1 comprise the plating layer 5, so that the metal material evaporated during the evaporation of the metal material cannot nucleate on the first surface 3, the second surface 4 and the side wall of the evaporation hole 2 of the mask, that is, the corresponding metal material cannot be accumulated on the first surface 3, the second surface 4 and the side wall of the evaporation hole 2 of the mask, the thickness of the metal material evaporated on the first surface 3, the second surface 4 and the side wall of the evaporation hole 2 of the mask cannot gradually become thicker along with the increase of the evaporation time, the abnormality of the product caused by the falling of the metal material evaporated on the first surface 3, the second surface 4 and the side wall of the evaporation hole 2 of the mask on the substrate to be evaporated is avoided, the cleaning of the mask can also be reduced, and further the damage to the mask in the cleaning process of the mask is avoided, the service life of the mask can be prolonged, and the cost is saved.
Alternatively, on the basis of the above embodiment, with continued reference to fig. 3, the thickness of the plating layer 5 may include 1 to 10 um.
Specifically, if the thickness of the plating layer 5 is too thick, the self weight of the plating layer 5 will be large, which is not favorable for the plating layer 5 to adhere to the first surface 3, the second surface 4 and the side walls of the evaporation holes 2 of the mask; the thickness of the plating layer 5 is too thin, which is disadvantageous for the continuity of the plating layer 5 and affects the suppression of nucleation of the deposited metal. Set up the thickness scope of cladding material 5 and include 1 ~ 10um, can be so that 5 better first surfaces 3 of attaching to the mask version of cladding material, on the second surface 4 and the lateral wall in evaporation hole 2, when metal material such as cathode material carries out the coating by vaporization, can restrain the metal material nucleation by the coating by vaporization betterly, avoid metal material such as cathode material by the coating by vaporization to take place the adhesion in evaporation hole 2 department, make coating by vaporization hole 2 through the mask version realize the accurate coating by vaporization to metal material smoothly, in order to satisfy the needs of the luminousness of metal levels such as negative pole. Optionally, the thicknesses of the plating layers on the first surface 3, the second surface 4 and the side wall of the evaporation hole 2 are the same, so that the plating layer is formed by one-time process, the process is simple, and the manufacturing is convenient. Optionally, the plating thickness relationship of the first surface 3, the second surface 4 and the sidewall of the evaporation hole 2 is as follows: the thickness of the coating on the second surface 4 is larger than or equal to that of the coating on the first surface 3, further, the thickness of the coating on the side wall of the evaporation hole 2 is larger than or equal to that of the coating on the second surface 4, during evaporation, the first surface 3 of the mask is attached to the substrate to be evaporated, the thickness of the coating on the first surface 3 is set to be thinner, the gap between the substrate to be evaporated and the mask is reduced, evaporation shadows are reduced, and evaporation accuracy is improved; on the other hand, during evaporation, metal materials are easy to form dead angles on the side walls of the evaporation holes 2, and the thickness of the coating on the side walls of the evaporation holes 2 is set to be larger, so that the continuity of the coating on the side walls of the evaporation holes 2 can be ensured; in addition, when evaporating hole 2 lateral wall has the roughness, thick cladding material can be better the coarse part on the covering evaporates hole 2 lateral wall, make the surface that the cladding material deviates from evaporating hole 2 lateral wall of this department comparatively smooth, further prevent the adhesion of metal material in evaporating hole department, can understand, in this embodiment, the roughness of evaporating hole 2 lateral wall can be greater than the roughness of mask version second surface 4, the roughness of evaporating hole 2 lateral wall also can equal to the roughness of mask version second surface 4, the roughness of evaporating hole 2 lateral wall also can be less than the roughness of mask version second surface 4.
Alternatively, on the basis of the above embodiment, with continued reference to fig. 3, the second surface 4 and the sidewall surface roughness of the evaporation holes 2 are both greater than the roughness of the first surface 3.
Specifically, during the coating by vaporization, first surface 3 of mask version with treat the laminating of coating by vaporization base plate, first surface 3 can not do rough treatment, keep certain roughness, be convenient for mask version with treat that the coating by vaporization base plate closely laminates, can only be to the rough treatment of carrying on of metal substrate 1's second surface 4 and coating by vaporization hole 2's lateral wall, or, do rough treatment to first surface 3, but set up the roughness that first surface 3 is less than the roughness of second surface 4 and coating by vaporization hole 2's lateral wall, the setting makes the first surface 3 of metal substrate 1 with the one side of 5 contacts of cladding material like this, second surface 4 and the lateral wall of coating by vaporization hole 2 have certain roughness, the cohesion between the metal substrate 1 of 5 and the mask version of enhancement cladding material that can be better, prevent that 5 materials of cladding material from droing.
Optionally, on the basis of the above embodiment, with reference to fig. 2, the size range of the opening of the evaporation hole 2 includes 10 to 100 um.
Specifically, the shape of the evaporation hole 2 may be set to be rectangular, circular, elongated, etc., as needed, and the size of the opening of the evaporation hole 2 refers to the diameter of the circular evaporation hole 2, the length of the rectangular evaporation hole 2, etc. If the opening size undersize of evaporation hole 2, difficult realization is to evaporation hole 2's preparation in the technology, if evaporation hole 2's opening size is too big, can make the area of every metal block that the evaporation of evaporation hole 2 evaporation of through mask version made great, lead to a metal block to cover a plurality of luminescence units, reduce not by the area of metal block coverage area, and then reduce display panel's luminousness. The size range of the opening for setting up evaporation hole 2 includes 10 ~ 100um for the metal block area through the 2 evaporation plating in evaporation hole of mask version is less, and the metal block that makes is corresponding with the luminescence unit, and wherein, the metal block can with the luminescence unit one-to-one, reduce the sheltering from of metal block to light, improve the light transmissivity.
Optionally, fig. 4 is a flowchart of a method for manufacturing a mask according to an embodiment of the present invention. On the basis of the above embodiment, referring to fig. 4, the method for manufacturing a mask according to an embodiment of the present invention includes:
s101, providing a metal substrate.
S102, forming a plurality of evaporation holes in the metal substrate, wherein the plurality of evaporation holes are arranged in an array mode; the metal substrate comprises a first surface and a second surface which are oppositely arranged, and the evaporation hole penetrates from the first surface to the second surface along the thickness direction of the metal substrate.
Specifically, the shape in coating by vaporization hole can set up to rectangle, circular, rectangular shape etc. as required, and the open-ended size range in coating by vaporization hole can include 10 ~ 100 um.
S103, forming a plating layer on the second surface of the metal substrate and the side wall of the evaporation hole; the plating layer serves to suppress nucleation of the evaporated metal material.
Specifically, the mask may be coated by one or more combinations of thermal evaporation deposition, magnetron sputtering, chemical vapor deposition, and organic vapor deposition.
Optionally, fig. 5 is a flowchart of another method for manufacturing a mask according to an embodiment of the present invention. On the basis of the above embodiment, referring to fig. 5, the method for manufacturing a mask according to an embodiment of the present invention includes:
s101, providing a metal substrate.
S102, forming a plurality of evaporation holes in the metal substrate, wherein the plurality of evaporation holes are arranged in an array mode; the metal substrate comprises a first surface and a second surface which are oppositely arranged, and the evaporation hole penetrates from the first surface to the second surface along the thickness direction of the metal substrate.
S201, carrying out roughening treatment on the second surface and the side wall of the evaporation hole.
Specifically, the second surface roughness treatment can be plasma surface treatment, laser etching, chemical etching, sand blasting, wire drawing or polishing and the like; the side wall of the evaporation hole can be roughened by adopting plasma surface treatment, laser etching, chemical etching and the like, and the purposes of etching, activating, cleaning and the like of the surface of the object can be achieved by carrying out plasma bombardment on the surface of the object. The second surface and the side wall of the evaporation hole are roughened, so that the binding force between the plating layer and the metal substrate of the mask plate can be enhanced, and the plating layer material is prevented from falling off.
S103, forming a plating layer on the second surface of the metal substrate and the side wall of the evaporation hole; the plating layer serves to suppress nucleation of the evaporated metal material.
Optionally, fig. 6 is a flowchart of a method for manufacturing a mask according to another embodiment of the present invention. On the basis of the above embodiment, referring to fig. 6, the method for manufacturing a mask according to an embodiment of the present invention includes:
s101, providing a metal substrate.
S102, forming a plurality of evaporation holes in the metal substrate, wherein the plurality of evaporation holes are arranged in an array mode; the metal substrate comprises a first surface and a second surface which are oppositely arranged, and the evaporation hole penetrates from the first surface to the second surface along the thickness direction of the metal substrate.
S201, carrying out roughening treatment on the second surface and the side wall of the evaporation hole.
S301, forming a plating layer on the first surface, the second surface and the side wall of the evaporation hole of the metal substrate; the plating layer serves to suppress nucleation of the evaporated metal material.
Particularly, the first surface and the second surface of the metal substrate of the mask plate and the side wall of the evaporation hole are integrally provided with the plating layer conveniently, the process is simple, and the realization is easy. In addition, set up like this when evaporating metal material, the metal material by the coating by vaporization can not be nucleated at the first surface of mask version, the lateral wall in second surface and the evaporation hole, can avoid the first surface of mask version, the lateral wall in second surface and the evaporation hole of mask version by metal material on the coating by vaporization, just need not to wash the mask version, avoids causing the damage to the mask version in the mask version cleaning process, can prolong the life of mask version, practices thrift the cost.
Optionally, an embodiment of the present invention further provides a manufacturing method of a display panel, where the cathode is formed by evaporation using the mask provided in any of the embodiments. The mask has the beneficial effects provided by the embodiment, and the description is omitted. The display panel can be used for mobile terminals such as mobile phones, tablet computers and wearable devices. The transparent display area provided with the fingerprint under the screen or the camera module under the screen can adopt the mask plate evaporation plating provided by any embodiment to manufacture the cathode so as to improve the light transmittance of the transparent display area, and the whole display area of the display panel can also adopt the mask plate evaporation plating provided by any embodiment to manufacture the cathode according to the requirement, so that no limitation is made.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A reticle, comprising:
the metal substrate is arranged in a plurality of evaporation holes of the metal substrate, and the evaporation holes are arranged in an array mode;
the metal substrate comprises a first surface and a second surface which are oppositely arranged, and the evaporation hole penetrates from the first surface to the second surface along the thickness direction of the metal substrate;
the second surface of the metal substrate and the side wall of the evaporation hole comprise plating layers for inhibiting nucleation of evaporated metal materials.
2. The reticle of claim 1,
the material adhesion probability of the plating layer is less than or equal to 0.1.
3. The reticle of claim 1,
the material of the coating comprises a polymer material or an organic small molecule material;
the polymer material comprises one or more polymers of perfluorinated polymers, polytetrafluoroethylene, polyvinyl biphenyl and polyvinyl carbazole;
the organic small molecule material comprises one or more of organic molecules of nitrogen, sulfur, oxygen, phosphorus and aluminum and polycyclic aromatic compounds.
4. The reticle of claim 1,
the first surface of the metal substrate includes the plating layer.
5. Reticle according to claim 1 or 4,
the thickness range of the plating layer comprises 1-10 um.
6. The reticle of claim 1,
the roughness of the second surface and the roughness of the side wall surface of the evaporation hole are both larger than that of the first surface.
7. The reticle of claim 1,
the size range of the opening of the evaporation hole comprises 10-100 um.
8. A manufacturing method of a mask is characterized by comprising the following steps:
providing a metal substrate;
forming a plurality of evaporation holes on the metal substrate, wherein the plurality of evaporation holes are arranged in an array manner; the metal substrate comprises a first surface and a second surface which are oppositely arranged, and the evaporation hole penetrates from the first surface to the second surface along the thickness direction of the metal substrate;
forming a plating layer on the second surface of the metal substrate and the side wall of the evaporation hole; wherein the plating layer is used to inhibit nucleation of the evaporated metal material.
9. The method for manufacturing the mask according to claim 8, further comprising, before forming the plating layer on the first surface, the second surface of the metal substrate, and the sidewalls of the evaporation holes:
and carrying out roughening treatment on the second surface and the side wall of the evaporation hole.
10. A method for manufacturing a display panel is characterized by comprising the following steps:
the cathode is formed by evaporation using a mask as claimed in any one of claims 1 to 7.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110298294.0A CN113061842A (en) | 2021-03-19 | 2021-03-19 | Mask, manufacturing method of mask and manufacturing method of display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110298294.0A CN113061842A (en) | 2021-03-19 | 2021-03-19 | Mask, manufacturing method of mask and manufacturing method of display panel |
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| CN202110298294.0A Pending CN113061842A (en) | 2021-03-19 | 2021-03-19 | Mask, manufacturing method of mask and manufacturing method of display panel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113073292A (en) * | 2021-03-26 | 2021-07-06 | 昆山工研院新型平板显示技术中心有限公司 | Pattern structure manufacturing method and mask structure |
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| CN211057217U (en) * | 2019-09-18 | 2020-07-21 | 昆山维信诺科技有限公司 | Mask and evaporation device thereof |
| JP2020158886A (en) * | 2016-02-19 | 2020-10-01 | 凸版印刷株式会社 | Method of manufacturing base material for metal mask, method of manufacturing metal mask for vapor deposition, method of manufacturing metal mask unit, and metal mask unit |
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| WO2015131538A1 (en) * | 2014-03-03 | 2015-09-11 | 京东方科技集团股份有限公司 | Mask plate, organic layer processing method and preparation method for display substrate |
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| CN113073292A (en) * | 2021-03-26 | 2021-07-06 | 昆山工研院新型平板显示技术中心有限公司 | Pattern structure manufacturing method and mask structure |
| CN113073292B (en) * | 2021-03-26 | 2023-01-31 | 昆山工研院新型平板显示技术中心有限公司 | Pattern structure manufacturing method and mask structure |
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Application publication date: 20210702 |