CN113061840B - Evaporation mask plate, manufacturing method thereof and display panel - Google Patents

Evaporation mask plate, manufacturing method thereof and display panel Download PDF

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Publication number
CN113061840B
CN113061840B CN202110275316.1A CN202110275316A CN113061840B CN 113061840 B CN113061840 B CN 113061840B CN 202110275316 A CN202110275316 A CN 202110275316A CN 113061840 B CN113061840 B CN 113061840B
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Prior art keywords
mask plate
groove
elastic buffer
buffer material
evaporation
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CN113061840A (en
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解洋
徐景华
孟维欣
郭钟旭
郭建
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BOE Technology Group Co Ltd
Chongqing BOE Display Technology Co Ltd
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BOE Technology Group Co Ltd
Chongqing BOE Display Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention provides an evaporation mask plate, a manufacturing method thereof and a display panel, and belongs to the technical field of display. The evaporation mask plate is arranged between the evaporation source and the substrate to be evaporated; one side of the substrate to be evaporated, which is close to the evaporation source, is provided with at least one spacer; the evaporation mask plate comprises: a mask body; the elastic buffer material is used for contacting with the isolation pad and supporting the mask plate body. The technical scheme of the invention can solve the problem that the spacer in the substrate to be evaporated is scratched by the evaporation mask plate.

Description

Evaporation mask plate, manufacturing method thereof and display panel
Technical Field
The invention relates to the technical field of display, in particular to an evaporation mask plate, a manufacturing method thereof and a display panel.
Background
An OLED (Organic Light-Emitting Diode) display device has been listed as a next-generation display technology with great development prospects due to its advantages of thinness, lightness, wide viewing angle, active Light emission, continuous and adjustable Light emission color, low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple production process, high Light emission efficiency, flexible display, and the like.
Disclosure of Invention
The invention aims to solve the technical problem of scratch of a spacer in a substrate to be evaporated by the evaporation mask, and provides the evaporation mask, a manufacturing method of the evaporation mask and a display panel.
In order to solve the technical problems, the embodiment of the invention provides the following technical scheme:
in one aspect, an evaporation mask plate is provided and is arranged between an evaporation source and a substrate to be evaporated; one side of the substrate to be evaporated, which is close to the evaporation source, is provided with at least one spacer; the evaporation mask plate comprises:
a mask body;
the elastic buffer material is used for contacting with the isolation pad and supporting the mask plate body.
In some embodiments, the grooves are in one-to-one correspondence with the spacers; or, the grooves are in one-to-one correspondence with the spacers at the edge area of the substrate to be evaporated.
In some embodiments, a side surface of the resilient cushioning material remote from a bottom of the recess is flush with the mask body.
In some embodiments, the elastomeric buffer material employs a photoresist.
In some embodiments, the cross-section of the groove in the direction perpendicular to the mask body is rectangular or semi-elliptical.
In some embodiments, when the elastic buffer material contacts with the spacer, the orthographic projection of the spacer on the mask body is located in the corresponding groove.
In some embodiments, the depth of the recess is greater than 2um.
The embodiment of the invention also provides a manufacturing method of the evaporation mask plate, wherein the evaporation mask plate is arranged between the evaporation source and the substrate to be evaporated; one side of the substrate to be evaporated, which is close to the evaporation source, is provided with at least one spacer; the manufacturing method of the evaporation mask plate comprises the following steps:
forming a mask plate body;
at least one groove is formed on the mask body, elastic buffer materials are filled in the groove, and the elastic buffer materials are used for contacting with the isolation pad and supporting the mask body.
In some embodiments, the forming at least one groove on the mask body includes:
and coating photoresist on the mask body, exposing the photoresist, developing to form a photoresist retaining area and a photoresist removing area, and etching the mask body in the photoresist removing area to form the groove.
In some embodiments, filling the recess with an elastic cushioning material includes:
and coating an elastic buffer material on the mask body, exposing the elastic buffer material, developing to form an elastic buffer material retaining area and an elastic buffer material removing area, overlapping the orthographic projection of the elastic buffer material retaining area on the mask body with the groove, and removing the part of the elastic buffer material beyond the groove by adopting a laser or mechanical grinding mode, so that the surface of one side of the elastic buffer material far away from the groove bottom of the groove is flush with the mask body.
The embodiment of the invention also provides a display panel, which comprises a thin film transistor TFT backboard and a pixel defining layer arranged on the TFT backboard; wherein the pixel defining layer includes a plurality of opening portions; the display panel also comprises an organic functional layer arranged in the opening part and a spacer arranged on the surface of the TFT backboard; at least a part of the organic functional layer is evaporated by adopting the evaporation mask plate.
The embodiment of the invention has the following beneficial effects:
in the above scheme, at least one groove is formed in the mask body of the vapor deposition mask plate, and an elastic buffer material is filled in the groove, so that when the vapor deposition mask plate provided by the embodiment of the invention is utilized for vapor deposition, the vapor deposition mask plate is arranged between a vapor deposition source and a substrate to be vapor deposited, at least one spacer is arranged on one side of the substrate to be vapor deposited, which is close to the vapor deposition source, and is contacted with the elastic buffer material, and the elastic buffer material has certain elasticity and can be compressed under the pressure of the spacer, so that the sufficient contact between the spacer and the vapor deposition mask plate can be ensured, the contact area between the spacer and the vapor deposition mask plate is increased, the friction force is increased, the vapor deposition mask plate is not easy to slide during vapor deposition, foreign matters caused by scratch of the spacer are avoided, and the packaging effect is ensured; in addition, vapor deposition deviation and poor color mixing can be avoided. Furthermore, the evaporation mask plate is generally made of metal, and has a relatively large weight, and the evaporation mask plate is grooved and filled with an elastic buffer material, so that the weight of the evaporation mask plate can be reduced, and further evaporation PPA (poly (lactic acid)) is reduced, wherein the evaporation PPA represents the position deviation between the actual evaporation position and the anode pattern of the TFT backboard.
Drawings
FIG. 1 is a schematic diagram of vapor deposition using a conventional vapor deposition mask;
FIGS. 2-5 are schematic cross-sectional views of vapor deposition masks according to embodiments of the present invention;
FIG. 6 is a schematic diagram of vapor deposition using a vapor deposition mask plate according to an embodiment of the present invention;
FIG. 7 is a schematic plan view of an evaporation mask plate according to an embodiment of the present invention;
fig. 8-13 are schematic diagrams of manufacturing an evaporation mask plate according to an embodiment of the invention.
Reference numerals
1. Substrate base
2. Thin film transistor array
3. Spacer material
4. Evaporation mask plate
41. Groove
42. Elastic buffer material
43. An opening
44. Mask plate body
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention more apparent, the following detailed description will be given with reference to the accompanying drawings and the specific embodiments.
In vapor deposition, as shown in fig. 1, a vapor deposition mask 4 is bonded to a display substrate (including a substrate 1 and a thin film transistor array layer 2), and a spacer 3 is provided on the display substrate to support the vapor deposition mask. However, due to the non-uniformity of the spacer 3 and the folds of the vapor deposition mask plate 4, the contact between the vapor deposition mask plate 4 and the spacer 3 is insufficient in the vapor deposition process, and the spacer 3 is easily scratched to generate foreign matters when being pressed or rubbed by the vapor deposition mask plate 4, so that a packaging layer is punctured, and poor packaging is caused; in addition, the vapor deposition is deviated, and poor color mixing occurs.
The embodiment of the invention provides an evaporation mask plate, a manufacturing method thereof and a display panel, which can solve the problem that a spacer in a substrate to be evaporated is scratched by the evaporation mask plate.
The embodiment of the invention provides an evaporation mask plate which is arranged between an evaporation source and a substrate to be evaporated; one side of the substrate to be evaporated, which is close to the evaporation source, is provided with at least one spacer; the evaporation mask plate comprises:
a mask body;
the elastic buffer material is used for contacting with the isolation pad and supporting the mask plate body.
In the embodiment, at least one groove is formed in the mask body of the vapor deposition mask plate, and an elastic buffer material is filled in the groove; in addition, vapor deposition deviation and poor color mixing can be avoided. Furthermore, the evaporation mask plate is generally made of metal, and has a relatively large weight, and the evaporation mask plate is grooved and filled with an elastic buffer material, so that the weight of the evaporation mask plate can be reduced, and further evaporation PPA (poly (lactic acid)) is reduced, wherein the evaporation PPA represents the position deviation between the actual evaporation position and the anode pattern of the TFT backboard.
The grooves formed in the evaporation mask plate can be in one-to-one correspondence with the spacer matters arranged on the substrate to be evaporated, in order to ensure the evaporation effect, when the elastic buffer material is contacted with the spacer matters, the orthographic projection of the spacer matters on the mask plate body is positioned in the corresponding grooves, so that the full contact between all spacer matters and the evaporation mask plate can be ensured, the contact area between all spacer matters and the evaporation mask plate is increased, the friction force is increased, the evaporation mask plate is not easy to slide during evaporation, foreign matters caused by scratch of the spacer matters are avoided, and the packaging effect is ensured; in addition, vapor deposition deviation and poor color mixing can be avoided. Furthermore, the weight of the evaporation mask plate can be reduced to the greatest extent, and the evaporation PPA is further reduced.
Because the evaporation mask plate slides relative to the substrate to be evaporated and generally occurs in the edge area, grooves can be formed in the edge area of the evaporation mask plate only, the grooves correspond to the spacers in the edge area of the substrate to be evaporated one by one, and in order to ensure the evaporation effect, when the elastic buffer material is in contact with the spacers, the orthographic projection of the spacers on the mask plate body is positioned in the corresponding grooves.
In order to ensure that the spacer is fully contacted with the elastic buffer material, the maximum deformation amount of the elastic buffer material after the elastic buffer material is subjected to the pressure of the spacer is not smaller than the maximum height difference between the spacer, so that the spacer can be ensured to be contacted with the elastic buffer material in the corresponding groove during evaporation, the depth of the groove is enough to be large enough to fill enough elastic buffer material in order to ensure the maximum deformation amount of the elastic buffer material, otherwise, the deformation of the elastic buffer material is smaller or fails, and in particular, the depth of the groove can be larger than 2um. Of course, the depth of the groove is not too deep, otherwise, the deformation of the elastic buffer material is too large, so that the evaporation mask plate is contacted with the substrate to be evaporated, the flowability problem also exists when the elastic buffer material is coated on the mask plate body, and the structural strength of the evaporation mask plate is also affected, therefore, the depth of the groove is not more than 3um.
In some embodiments, the elastic buffer material may be photoresist, and the material has strong photosensitivity, good elasticity after molding, high temperature resistance, water and oxygen resistance, good stability, and high mass productivity. Of course, the elastic buffer material is not limited to the above material, and other materials having elasticity may be used.
In this embodiment, as shown in fig. 2-5, the evaporation mask plate includes an opening 43 for evaporating the organic light-emitting functional layer; since the openings 43 correspond to the pixel regions of the substrate to be vapor deposited, and the spacers of the substrate to be vapor deposited are disposed between the pixel regions, as shown in fig. 7, the grooves 41 disposed corresponding to the spacers and the elastic buffer material 42 filled therein are disposed between the openings 43, and do not affect the disposition of the openings 43. The grooving area of the groove needs to be larger than the end area of the spacer, but the arrangement of the groove also needs to have no influence on the arrangement of the opening 43.
As shown in fig. 2, in some embodiments, the cross section of the groove in the direction perpendicular to the mask body is rectangular; the cross section of the groove in the direction perpendicular to the mask body can be semi-elliptical. In some embodiments, as shown in fig. 4, the cross section of the groove in the direction perpendicular to the mask body may also be a combination of rectangular and semi-elliptical shapes. The shape of the elastic buffer material 42 is matched with that of the groove 41, and in order to ensure the flatness of the vapor plating mask, the surface of one side of the elastic buffer material 42 away from the groove bottom of the groove 41 is flush with the mask body.
As shown in fig. 6, when the evaporation mask provided by the embodiment of the invention is used for evaporation, the evaporation mask is arranged between the evaporation source and the substrate to be evaporated, the spacer 3 on the substrate to be evaporated contacts with the elastic buffer material 42, and the elastic buffer material is compressed under the pressure of the spacer, so that the sufficient contact between the spacer and the evaporation mask can be ensured, and the evaporation mask is not easy to slide.
The embodiment of the invention also provides a manufacturing method of the evaporation mask plate, wherein the evaporation mask plate is arranged between the evaporation source and the substrate to be evaporated; one side of the substrate to be evaporated, which is close to the evaporation source, is provided with at least one spacer; the manufacturing method of the evaporation mask plate comprises the following steps:
forming a mask plate body;
at least one groove is formed on the mask body, elastic buffer materials are filled in the groove, and the elastic buffer materials are used for contacting with the isolation pad and supporting the mask body.
In the embodiment, at least one groove is formed in the mask body of the vapor deposition mask plate, and an elastic buffer material is filled in the groove; in addition, vapor deposition deviation and poor color mixing can be avoided. Furthermore, the evaporation mask plate is generally made of metal, and has a relatively large weight, and the evaporation mask plate is grooved and filled with an elastic buffer material, so that the weight of the evaporation mask plate can be reduced, and further evaporation PPA (poly (lactic acid)) is reduced, wherein the evaporation PPA represents the position deviation between the actual evaporation position and the anode pattern of the TFT backboard.
In some embodiments, the forming at least one groove on the mask body includes:
and coating photoresist on the mask body, exposing the photoresist, developing to form a photoresist retaining area and a photoresist removing area, and etching the mask body in the photoresist removing area to form the groove.
In a specific example, as shown in fig. 8, a mask body 44 is provided, where the mask body 44 includes an opening 43 for evaporating an organic light-emitting functional layer; a photoresist 5 is coated on the mask body 44.
As shown in fig. 9, the photoresist 5 is exposed by using a mask plate, and a photoresist remaining area and a photoresist removing area are formed after development, wherein the photoresist 5 can be exposed by using the mask plate for manufacturing the spacers, so that no additional mask plate is required to be manufactured.
As shown in fig. 10, the mask body of the photoresist removing region is etched to form a groove.
As shown in fig. 11, the remaining photoresist is stripped.
In some embodiments, filling the recess with an elastic cushioning material includes:
and coating an elastic buffer material on the mask body, exposing the elastic buffer material, developing to form an elastic buffer material retaining area and an elastic buffer material removing area, overlapping the orthographic projection of the elastic buffer material retaining area on the mask body with the groove, and removing the part of the elastic buffer material beyond the groove by adopting a laser or mechanical grinding mode, so that the surface of one side of the elastic buffer material far away from the groove bottom of the groove is flush with the mask body.
In a specific example, as shown in fig. 12, the mask body 44 shown in fig. 11 is coated with an elastic buffer material 6, and the elastic buffer material 6 is made of a photosensitive material.
As shown in fig. 13, the mask is used to expose the elastic buffer material 6, and after development, an elastic buffer material retaining area and an elastic buffer material removing area are formed, where the mask for making the spacer may be used to expose the elastic buffer material 6, so that no additional mask is required to be made.
And then removing the part of the elastic buffer material beyond the groove in a mechanical grinding mode, so that the surface of one side of the elastic buffer material far away from the groove bottom of the groove is flush with the mask body, and the evaporation mask of the embodiment is obtained. Or, the part of the elastic buffer material beyond the groove can be removed in a laser mode, so that the surface of one side of the elastic buffer material far away from the bottom of the groove is flush with the mask body, and the evaporation mask of the embodiment is obtained.
When the part of the elastic buffer material exceeding the groove is removed by adopting a laser mode, carbon dioxide laser can be adopted, the laser energy is 0-10 uj, and the laser frequency is 0-100 KHZ; or a femtosecond laser is adopted, the laser energy is 0-20 uj, and the laser frequency is 0-200 KHZ; or a dye laser is adopted, the laser energy is 0-30 uj, and the laser frequency is 0-300 KHZ.
The embodiment of the invention also provides a display panel, which comprises a thin film transistor TFT backboard and a pixel defining layer arranged on the TFT backboard; wherein the pixel defining layer includes a plurality of opening portions; the display panel also comprises an organic functional layer arranged in the opening part and a spacer arranged on the surface of the TFT backboard; at least a part of the organic functional layer is evaporated by adopting the evaporation mask plate.
The display panel of the present embodiment is applied to a display device including, but not limited to: the system comprises a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, a power supply and the like. It will be appreciated by those skilled in the art that the structure of the display device described above is not limiting of the display device, and that the display device may include more or less components described above, or may be combined with certain components, or may have different arrangements of components. In an embodiment of the invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.
The display device provided by the embodiment of the invention is an electroluminescent display device, which can be an Organic Light-Emitting Diode Display (OLED for short) or a quantum dot electroluminescent display device (Quantum Dot Light Emitting Diodes, QLED for short). Taking the organic electroluminescent display device as an example, the organic electroluminescent display device may be a PMOLED (passive organic light emitting diode, passive Matrix OLED) or one of AMOLEDs (active organic light emitting diode, active Matrix OLED).
The display panel includes a display substrate and a packaging layer for packaging the display substrate. Here, the encapsulation layer may be an encapsulation film; or may be a package substrate. When the encapsulation layer is an encapsulation film, the number of layers of the encapsulation film included in the encapsulation layer is not limited, and the encapsulation layer may include one layer of the encapsulation film, or may include two or more layers of the encapsulation film stacked. In some embodiments, the encapsulation layer comprises three encapsulation films arranged one above the other.
In the case that the encapsulation layer includes three encapsulation films stacked in order, optionally, the material of the encapsulation film located in the middle layer is an organic material, and the material of the encapsulation films located in both sides is an inorganic material.
The organic material is not limited, and may be, for example, P M a. The inorganic material is not limited, and may be, for example, one or more of SiNx (silicon nitride), siOx (silicon oxide), or SiOxNy (silicon oxynitride).
On this basis, the encapsulation film located in the intermediate layer can be manufactured by using an Ink Jet printing process (Ink Jet Printer, abbreviated as IJP). In addition, the encapsulation films on both sides may be respectively fabricated using a chemical vapor deposition method (Chemical Vapor Deposition, CVD for short).
The display substrate comprises a TFT backboard and light-emitting devices which are arranged on the TFT backboard and are arranged in an array.
Wherein the light emitting device includes an anode, an organic functional layer, and a cathode. The display substrate further comprises a pixel defining layer arranged on the TFT backboard, wherein the pixel defining layer comprises a plurality of opening parts; a light emitting device is disposed in an opening. The display substrate further includes spacers.
The display substrate provided in the embodiment of the invention may be of a top emission type, in which case the anode is in an opaque state and the cathode is in a transparent state. The display substrate may be of a bottom emission type, in which case the anode is in a light-transmitting state and the cathode is in a light-impermeable state. The display substrate may be of a double-sided light-emitting type, and in this case, both the anode and the cathode are in a light-transmitting state.
In some embodiments, the organic functional layer includes a light emitting layer. In other embodiments, the organic functional layer includes one or more of an electron transport layer (election transporting layer, ETL), an electron injection layer (election injection layer, EIL), a hole transport layer (hole transporting layer, HTL), and a hole injection layer (hole injection layer, HIL) in addition to the light emitting layer.
Here, the electron injection layer, the electron transport layer, the hole injection layer, and the hole transport layer may be located only in the opening portion of the pixel defining layer; the electron injection layer, the electron transport layer, the hole injection layer and the hole transport layer may be not only located in the opening of the pixel defining layer, but also cover the surface of the pixel defining layer away from the TFT back plate, i.e., the electron injection layer, the electron transport layer, the hole injection layer and the hole transport layer are an integral layer.
It should be understood that one light emitting device corresponds to one subpixel. The subpixels include, for example, red subpixels, green subpixels, and blue subpixels. On the basis, the light emitting layer includes a red light emitting pattern at a red subpixel, a green light emitting pattern at a green subpixel, and a blue light emitting pattern at a blue subpixel.
In some embodiments, the organic functional layer is formed mainly by evaporation coating (evaporation) method in the production of the electroluminescent display panel. In the vapor deposition process, a vapor deposition mask is used to deposit a film layer such as a red light emitting pattern, a green light emitting pattern, and a blue light emitting pattern, so as to ensure that the organic material is vapor deposited at a predetermined position.
During vapor deposition, the vapor deposition mask plate is attached to the display substrate, and at this time, the spacer included in the display substrate plays a role in supporting the vapor deposition mask plate. The mask body comprises a plurality of openings and a shielding part positioned at the periphery of the openings.
The shape of the opening is not limited. The shape of the opening is the same as the shape of the opening of the pixel defining layer, i.e. the shape of the opening of the subpixel. Illustratively, the shape of the opening of the pixel defining layer is hexagonal, in which case the shape of the opening is also hexagonal; of course, the shape of the opening of the pixel defining layer may also be rectangular, and the shape of the opening is also rectangular.
It should be noted that, when the electron injection layer, the electron transport layer, the hole injection layer and the hole transport layer in the organic functional layer are only located in the opening of the pixel defining layer, the electron injection layer, the electron transport layer, the hole injection layer and the hole transport layer may be evaporated by using the evaporation mask provided by the embodiment of the present invention. That is, the vapor deposition mask plate provided by the embodiment of the invention can be used for vapor deposition of a light-emitting layer, and can also be used for vapor deposition of an electron injection layer, an electron transport layer, a hole injection layer and a hole transport layer.
In this specification, all embodiments are described in a progressive manner, and identical and similar parts of the embodiments are all referred to each other, and each embodiment is mainly described in a different way from other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is relatively simple, and the relevant points are found in the section of the product embodiments.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the disclosure, and it is intended to cover the scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (10)

1. The evaporation mask plate is characterized by being arranged between an evaporation source and a substrate to be evaporated; one side of the substrate to be evaporated, which is close to the evaporation source, is provided with at least one spacer; the evaporation mask plate comprises:
a mask body;
the device comprises a mask body, at least one groove arranged on the mask body, wherein the groove is only arranged in the edge area of the vapor plating mask, the groove corresponds to the isolation pad objects in the edge area of the substrate to be vapor plated one by one, elastic buffer materials are filled in the groove, and the elastic buffer materials are used for contacting with the isolation pad and supporting the mask body.
2. The vapor deposition mask plate according to claim 1, wherein a side surface of the elastic buffer material away from a bottom of the groove is flush with the mask plate body.
3. The vapor deposition mask plate according to claim 1, wherein the elastic buffer material is a photoresist.
4. The vapor deposition mask plate according to claim 1, wherein the cross section of the groove in a direction perpendicular to the mask plate body is rectangular or semi-elliptical.
5. The vapor deposition mask plate according to claim 2, wherein when the elastic buffer material is in contact with the spacer, the orthographic projection of the spacer on the mask plate body is located in the corresponding groove.
6. The vapor deposition mask plate according to claim 1, wherein the depth of the groove is greater than 2um.
7. The manufacturing method of the evaporation mask plate is characterized in that the evaporation mask plate is arranged between an evaporation source and a substrate to be evaporated; one side of the substrate to be evaporated, which is close to the evaporation source, is provided with at least one spacer; the manufacturing method of the evaporation mask plate comprises the following steps:
forming a mask plate body;
at least one groove is formed in the mask body, the groove is only arranged in the edge area of the vapor plating mask, the groove corresponds to the isolation pad objects in the edge area of the substrate to be vapor plated one by one, elastic buffer materials are filled in the groove, and the elastic buffer materials are used for contacting with the isolation pad and supporting the mask body.
8. The method for manufacturing a vapor deposition mask plate according to claim 7, wherein forming at least one groove on the mask plate body comprises:
and coating photoresist on the mask body, exposing the photoresist, developing to form a photoresist retaining area and a photoresist removing area, and etching the mask body in the photoresist removing area to form the groove.
9. The method of claim 7, wherein filling the grooves with an elastic buffer material comprises:
and coating an elastic buffer material on the mask body, exposing the elastic buffer material, developing to form an elastic buffer material retaining area and an elastic buffer material removing area, overlapping the orthographic projection of the elastic buffer material retaining area on the mask body with the groove, and removing the part of the elastic buffer material beyond the groove by adopting a laser or mechanical grinding mode, so that the surface of one side of the elastic buffer material far away from the groove bottom of the groove is flush with the mask body.
10. A display panel comprising a thin film transistor, TFT, backplate and a pixel defining layer disposed on the TFT backplate; wherein the pixel defining layer includes a plurality of opening portions; the display panel also comprises an organic functional layer arranged in the opening part and a spacer arranged on the surface of the TFT backboard; at least one part of the organic functional layer is evaporated by the evaporation mask plate according to any one of claims 1 to 6.
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