CN105957830A - Encapsulation method of OLED display panel - Google Patents
Encapsulation method of OLED display panel Download PDFInfo
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- CN105957830A CN105957830A CN201610422157.2A CN201610422157A CN105957830A CN 105957830 A CN105957830 A CN 105957830A CN 201610422157 A CN201610422157 A CN 201610422157A CN 105957830 A CN105957830 A CN 105957830A
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000005538 encapsulation Methods 0.000 title claims abstract description 40
- 230000005489 elastic deformation Effects 0.000 claims abstract description 7
- 230000004888 barrier function Effects 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 49
- 238000004806 packaging method and process Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000000231 atomic layer deposition Methods 0.000 claims description 7
- 238000005229 chemical vapour deposition Methods 0.000 claims description 7
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 229910001374 Invar Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 abstract description 13
- 230000000903 blocking effect Effects 0.000 abstract description 7
- 230000008021 deposition Effects 0.000 abstract description 7
- 238000011161 development Methods 0.000 abstract description 5
- 239000010409 thin film Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 229910000851 Alloy steel Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an encapsulation method of an OLED display panel. A circle of elastic blocking layer surrounding a display area is formed outside the display area; a mask plate used for depositing an encapsulation layer is a rigid mask plate; when the encapsulation layer is deposited, the rigid mask plate is supported by the elastic blocking layer; and seamless joint between the upper surface of the elastic blocking layer and the rigid mask plate is achieved through elastic deformation of the elastic blocking layer, so that the deposited encapsulation layer is completely located at the inner side of the elastic blocking layer; extended deposition of the encapsulation layer is effectively avoided; the encapsulation layer is prevented from covering an IC to affect IC binding; and development of a narrow-border panel is facilitated.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a packaging method of an OLED display panel.
Background
Organic Light-Emitting diodes (OLEDs) have characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, and low power consumption, and thus have attracted much attention as a new generation of display mode, and have begun to replace conventional liquid crystal displays, and are widely used in mobile phone screens, computer monitors, and full-color televisions. The OLED display technology is different from the conventional liquid crystal display technology in that a backlight is not required, and a very thin organic material coating and a glass substrate are used, and when a current flows, the organic materials emit light. Therefore, the OLED display panel has been widely used in the field of display technology. However, the metal cathode used for forming the OLED device in the OLED display panel is an active metal, which is very sensitive to moisture and oxygen in the air, and is very easy to react with the permeated moisture to affect the injection of charges, and in addition, the permeated moisture and oxygen can also chemically react with organic materials, which are main factors causing the performance degradation of the OLED device and the service life shortening of the OLED device, so that the OLED display panel has very high requirements for packaging.
Currently, there are several packaging methods for OLED devices, such as: glass lid (Glass) packaging, Frit (Frit) packaging, and Thin Film Encapsulation (TFE) packaging. Among them, the film encapsulation method is most commonly used in the OLED display panel encapsulation process, especially for the flexible OLED display panel, i.e. the OLED device is encapsulated by depositing a transparent film by using the Chemical Vapor Deposition (CVD) or Atomic Layer Deposition (ALD) techniques.
Fig. 1 is a schematic diagram illustrating a conventional OLED display panel employing a thin film encapsulation method, in which a Mask (Mask) is used to deposit thin film encapsulation layers (TFE layers), specifically, openings of the Mask 900 are made to correspond to the upper side of a display Area (Active Area, AA) of an OLED substrate 100, and then the thin film encapsulation layers 400 are deposited by using a CVD or ALD technique, since the Mask 900 is usually made of Invar (Invar) or stainless steel (SUS) with a thickness of about 100 μm, and has a certain flexibility, gaps (Gap) h between the OLED substrate 100 and the Mask 900 are irregularly distributed. The larger the gap h, the larger the distance that the thin film is extended and deposited (Shadow effect) under the mask 900 when the thin film is deposited by using CVD or ALD techniques, and if the thin film encapsulation layer 400 formed by deposition covers the Integrated Circuit (IC) 200 on the OLED substrate 100, the IC Bonding (Bonding) is affected, so the distance d between the IC200 on the OLED substrate 100 and the display area must be greater than the distance that the thin film encapsulation layer 400 is extended and deposited when the thin film encapsulation layer 400 is deposited, so as to prevent the IC Bonding from being affected and the panel performance from being affected, which, however, limits the OLED display panel from developing towards the narrow frame direction.
Disclosure of Invention
The invention aims to provide an encapsulation method of an OLED display panel, which can effectively avoid the extension deposition of a thin film encapsulation layer and is beneficial to the development of a narrow frame panel.
In order to achieve the above object, the present invention provides an encapsulation method for an OLED display panel, including the following steps:
step 1, providing an OLED substrate, wherein the OLED substrate is provided with a display area positioned in the center and a peripheral area positioned at the periphery of the display area;
the display area comprises a substrate base plate and an OLED layer arranged on the substrate base plate;
the peripheral area comprises a substrate and a plurality of ICs arranged on the substrate;
step 2, forming a circle of elastic barrier layer surrounding the display area on the substrate base plate of the peripheral area;
the elastic barrier layer is positioned on one side, close to the display area, of the IC on the substrate base plate; the height of the elastic barrier layer is greater than that of the OLED layer;
and 3, providing a rigid mask plate, descending the rigid mask plate or ascending the OLED substrate after the rigid mask plate is aligned with the OLED substrate, enabling the elastic barrier layer to be right for supporting the rigid mask plate and enabling the upper surface of the elastic barrier layer to be attached to the rigid mask plate in a seamless mode through elastic deformation of the elastic barrier layer, utilizing the rigid mask plate to deposit and cover the OLED substrate on the packaging layer of the display area, enabling the deposited packaging layer to be located on the inner side of the elastic barrier layer, and avoiding the packaging layer from covering the IC and influencing the performance of the OLED display panel.
The elastic barrier layer is of a frame shape and comprises a plurality of elastic barrier units, and the elastic barrier units are connected end to form the frame structure of the elastic barrier layer.
The width of the elastic barrier unit is 10-1000 μm, and the height is 1-50 μm.
The longitudinal section of the elastic blocking unit is trapezoidal.
In the step 2, the elastic barrier layer is formed by using a yellow light process or an inkjet printing process.
The elastic barrier layer is made of a positive photoresist material or a negative photoresist material.
The thickness of the rigid mask plate is 1-5mm, and the rigid mask plate is made of invar alloy or stainless steel.
The packaging layer is prepared by a chemical vapor deposition method or an atomic layer deposition technology.
The display area of the OLED substrate further comprises a TFT array layer positioned between the substrate and the OLED layer;
the OLED layer comprises a plurality of red OLED units, green OLED units and blue OLED units which are arranged in an array mode.
The display area of the OLED substrate further comprises a TFT array layer located between the substrate and the OLED layer, and a color filter film layer located on the OLED layer;
the OLED layer comprises a plurality of white OLED units which are arranged in an array.
The invention has the beneficial effects that: according to the packaging method of the OLED display panel, a circle of elastic barrier layer surrounding the display area is formed outside the display area of the OLED substrate, the mask plate used for depositing the packaging layer is a rigid mask plate, when the packaging layer is deposited, the rigid mask plate is supported by the elastic barrier layer, and seamless joint between the upper surface of the elastic barrier layer and the rigid mask plate is realized through elastic deformation of the elastic barrier layer, so that the deposited packaging layer is completely positioned on the inner side of the elastic barrier layer, the extending deposition of the packaging layer is effectively avoided, the situation that the packaging layer covers an IC to influence IC binding is avoided, and further development of a narrow-frame panel is facilitated.
For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description and are not intended to limit the invention.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
In the drawings, there is shown in the drawings,
FIG. 1 is a schematic diagram of a conventional OLED display panel with a mask plate for depositing a thin film encapsulation layer during thin film encapsulation;
FIG. 2 is a schematic flow chart illustrating an OLED display panel packaging method according to the present invention;
FIG. 3 is a schematic diagram of step 1 of the OLED display panel packaging method according to the present invention;
FIG. 4 is a schematic diagram of step 2 of the OLED display panel packaging method according to the present invention;
fig. 5 is a schematic diagram of step 3 of the encapsulation method of the OLED display panel according to the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Referring to fig. 2, the present invention provides a method for encapsulating an OLED display panel, including the following steps:
step 1, as shown in fig. 3, an OLED substrate is provided, where the OLED substrate has a display area located in the center and a peripheral area located at the periphery of the display area.
Specifically, the display region includes a substrate base plate 10, an OLED layer 20 disposed on the substrate base plate 10, and a TFT array layer (not shown) disposed between the substrate base plate 10 and the OLED layer 20 for driving the OLED layer 20.
Specifically, the peripheral region includes a substrate 10 and a plurality of ICs 30 disposed on the substrate 10.
Specifically, the OLED display panel performs color display by using RGB three-color OLED display devices, and the OLED layer 20 includes a plurality of red OLED units, green OLED units, and blue OLED units arranged in an array; or,
the OLED display panel performs color display by using a white OLED in combination with a color filter, and the OLED layer 20 includes a plurality of white OLED units arranged in an array; the display area of the OLED substrate also includes a color filter film layer (not shown) on the OLED layer 20.
Step 2, as shown in fig. 4, a ring of elastic barrier layers 40 surrounding the display region is formed on the substrate base plate 10 of the peripheral region using a yellow light (Photo) process or an Ink-Jet Printer (Ink-Jet Printer) process.
Specifically, the elastic barrier layer 40 is located on the substrate base plate 10 on the side of the IC30 near the display area.
Specifically, the height of the elastic barrier layer 40 is greater than the height of the OLED layer 20.
Specifically, the elastic barrier layer 40 is frame-shaped and includes a plurality of elastic barrier units, and the elastic barrier units are connected end to form a frame-shaped structure of the elastic barrier layer; the width of the elastic barrier unit is 10-1000 μm, and the height is 1-50 μm; the longitudinal section of the elastic blocking unit is trapezoidal.
Specifically, in step 2, the material forming the elastic barrier layer is a positive photoresist material or a negative photoresist material.
Step 3, as shown in fig. 5, providing a rigid mask plate 90, aligning the rigid mask plate 90 with the OLED substrate, lowering the rigid mask plate 90 or raising the OLED substrate to enable the elastic barrier layer 40 to support the rigid mask plate 90, enabling the upper surface of the elastic barrier layer 40 to be in seamless joint with the rigid mask plate 90 through elastic deformation of the elastic barrier layer 40, and depositing and covering the encapsulation layer 50 of the display area on the OLED substrate by using the rigid mask plate 90, so that the deposited encapsulation layer 50 is located inside the elastic barrier layer 40, and preventing the encapsulation layer 50 from covering the IC30 to influence the performance of the OLED display panel.
Specifically, the thickness of the rigid mask plate 90 is 1-5mm, and the rigid mask plate 90 is made of invar alloy or stainless steel.
Specifically, the encapsulation layer 50 is manufactured by a chemical vapor deposition method or an atomic layer deposition technique.
Specifically, in step 3, after the upper surface of the elastic barrier layer 40 is seamlessly attached to the rigid mask plate 90, the elastic barrier layer 40 is higher than the OLED layer 20 of the OLED substrate, so that the rigid mask plate 90 is prevented from contacting the OLED layer 20 of the display region, and the rigid mask plate 90 is prevented from scratching or crushing the OLED layer 20.
Specifically, the material deposited to form the encapsulation layer 50 is silicon nitride, silicon oxide, aluminum oxide, or titanium dioxide material.
It should be noted that, in the invention, when the encapsulation layer 50 is deposited, the rigid mask plate 90 is supported by using the elastic barrier layer 40, and through the elastic deformation of the elastic barrier layer 40, the upper surface of the elastic barrier layer 40 is in seamless fit with the rigid mask plate 90, so that the encapsulation layer 50 formed by deposition is completely located inside the elastic barrier layer 40, and the extension deposition of the encapsulation layer 50 is effectively avoided, therefore, in the design process of the OLED display panel, the design distance between the IC30 on the OLED substrate and the display area only depends on the width of the elastic barrier unit of the elastic barrier layer 40, thereby facilitating the development of a narrow-bezel panel.
In summary, in the encapsulation method of the OLED display panel of the present invention, a circle of elastic barrier layer surrounding the display area is formed outside the display area of the OLED substrate, and the mask plate used for depositing the encapsulation layer is a rigid mask plate, when the encapsulation layer is deposited, the rigid mask plate is supported by the elastic barrier layer, and through elastic deformation of the elastic barrier layer, seamless attachment is achieved between the upper surface of the elastic barrier layer and the rigid mask plate, so that the deposited encapsulation layer is completely located inside the elastic barrier layer, thereby effectively avoiding extension deposition of the encapsulation layer, avoiding influence on IC binding due to the encapsulation layer covering the IC, and further facilitating development of a narrow-frame panel.
As described above, it will be apparent to those skilled in the art that various other changes and modifications can be made based on the technical solution and the technical idea of the present invention, and all such changes and modifications should fall within the protective scope of the appended claims.
Claims (10)
1. The packaging method of the OLED display panel is characterized by comprising the following steps:
step 1, providing an OLED substrate, wherein the OLED substrate is provided with a display area positioned in the center and a peripheral area positioned at the periphery of the display area;
the display area comprises a substrate base plate (10) and an OLED layer (20) arranged on the substrate base plate (10);
the peripheral area comprises a substrate (10) and a plurality of ICs (30) arranged on the substrate (10);
step 2, forming a ring of elastic barrier layers (40) surrounding the display area on the substrate base plate (10) of the peripheral area;
the elastic barrier layer (40) is located on the substrate base plate (10) on a side of the IC (30) close to the display area; the height of the elastic barrier layer (40) is greater than the height of the OLED layer (20);
step 3, providing a rigid mask plate (90), and will rigid mask plate (90) with the OLED base plate is counterpointed the back, descends rigid mask plate (90), or rises the OLED base plate makes elastic barrier layer (40) are right rigid mask plate (90) support to elastic deformation through elastic barrier layer (40) makes seamless laminating between the upper surface of elastic barrier layer (40) and rigid mask plate (90), utilizes rigid mask plate (90) are in the last deposit of OLED base plate covers display area's encapsulated layer (50), thereby makes sedimentary encapsulated layer (50) be located elastic barrier layer (40) are inboard, avoid encapsulated layer (50) to cover IC (30) and influence OLED display panel's performance.
2. The method of encapsulating the OLED display panel according to claim 1, wherein the elastic barrier layer (40) is frame-shaped and includes a plurality of elastic barrier units, and the plurality of elastic barrier units are connected end to form a frame-shaped structure of the elastic barrier layer (40).
3. The method of encapsulating the OLED display panel of claim 2, wherein the elastic barrier unit has a width of 10-1000 μm and a height of 1-50 μm.
4. The method of encapsulating an OLED display panel as claimed in claim 2, wherein the elastic barrier unit has a trapezoidal longitudinal section.
5. The method of encapsulating the OLED display panel according to claim 1, wherein in the step 2, the elastic barrier layer (40) is formed using a yellow light process or an inkjet printing process.
6. The method for encapsulating an OLED display panel according to claim 1, wherein the material of the elastic barrier layer (40) is a positive photoresist material or a negative photoresist material.
7. The encapsulation method of the OLED display panel according to claim 1, wherein the thickness of the rigid mask (90) is 1-5mm, and the material of the rigid mask (90) is Invar or stainless steel.
8. The encapsulation method of the OLED display panel according to claim 1, wherein the encapsulation layer (50) is made by a chemical vapor deposition method or an atomic layer deposition technique.
9. The encapsulation method of the OLED display panel according to claim 1, wherein the display area of the OLED substrate further includes a TFT array layer between the substrate (10) and the OLED layer (20);
the OLED layer (20) comprises a plurality of red OLED units, green OLED units and blue OLED units which are arranged in an array.
10. The encapsulating method of the OLED display panel according to claim 1, wherein the display area of the OLED substrate further includes a TFT array layer between a substrate (10) and an OLED layer (20), and a color filter film layer on the OLED layer (20);
the OLED layer (20) comprises a plurality of white OLED units which are arranged in an array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610422157.2A CN105957830A (en) | 2016-06-14 | 2016-06-14 | Encapsulation method of OLED display panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610422157.2A CN105957830A (en) | 2016-06-14 | 2016-06-14 | Encapsulation method of OLED display panel |
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| CN105957830A true CN105957830A (en) | 2016-09-21 |
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| CN201610422157.2A Pending CN105957830A (en) | 2016-06-14 | 2016-06-14 | Encapsulation method of OLED display panel |
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Cited By (8)
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| CN106784373A (en) * | 2016-12-27 | 2017-05-31 | 武汉华星光电技术有限公司 | The encapsulating structure and its method for packing of OLED diaphragms |
| CN108281472A (en) * | 2018-02-05 | 2018-07-13 | 京东方科技集团股份有限公司 | A kind of display module, display device and production method |
| CN110265466A (en) * | 2019-06-28 | 2019-09-20 | 昆山工研院新型平板显示技术中心有限公司 | The production method of display panel, display device and display panel |
| CN110416282A (en) * | 2019-08-28 | 2019-11-05 | 云谷（固安）科技有限公司 | Display device and its display base plate |
| CN111403620A (en) * | 2020-03-25 | 2020-07-10 | 武汉华星光电半导体显示技术有限公司 | Display device and manufacturing method thereof |
| WO2020258271A1 (en) * | 2019-06-28 | 2020-12-30 | 深圳市柔宇科技有限公司 | Flexible display screen and fabrication method therefor, and display panel |
| CN112490388A (en) * | 2020-12-08 | 2021-03-12 | 维信诺科技股份有限公司 | Display panel packaging method, display panel packaging system and display panel |
| CN113061840A (en) * | 2021-03-15 | 2021-07-02 | 京东方科技集团股份有限公司 | Evaporation mask plate, manufacturing method thereof and display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106784373A (en) * | 2016-12-27 | 2017-05-31 | 武汉华星光电技术有限公司 | The encapsulating structure and its method for packing of OLED diaphragms |
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| CN108281472A (en) * | 2018-02-05 | 2018-07-13 | 京东方科技集团股份有限公司 | A kind of display module, display device and production method |
| US11239301B2 (en) | 2018-02-05 | 2022-02-01 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display assembly, display device and manufacturing process having a support portion in the non-display region of the substrate |
| CN108281472B (en) * | 2018-02-05 | 2021-01-22 | 京东方科技集团股份有限公司 | Display assembly, display device and manufacturing method |
| WO2020258271A1 (en) * | 2019-06-28 | 2020-12-30 | 深圳市柔宇科技有限公司 | Flexible display screen and fabrication method therefor, and display panel |
| CN113330597A (en) * | 2019-06-28 | 2021-08-31 | 深圳市柔宇科技股份有限公司 | Flexible display screen, manufacturing method thereof and display panel |
| CN110265466B (en) * | 2019-06-28 | 2021-09-03 | 昆山工研院新型平板显示技术中心有限公司 | Display panel, display device and manufacturing method of display panel |
| CN110265466A (en) * | 2019-06-28 | 2019-09-20 | 昆山工研院新型平板显示技术中心有限公司 | The production method of display panel, display device and display panel |
| CN110416282A (en) * | 2019-08-28 | 2019-11-05 | 云谷（固安）科技有限公司 | Display device and its display base plate |
| CN111403620A (en) * | 2020-03-25 | 2020-07-10 | 武汉华星光电半导体显示技术有限公司 | Display device and manufacturing method thereof |
| CN112490388A (en) * | 2020-12-08 | 2021-03-12 | 维信诺科技股份有限公司 | Display panel packaging method, display panel packaging system and display panel |
| CN112490388B (en) * | 2020-12-08 | 2022-11-29 | 维信诺科技股份有限公司 | Display panel packaging method, display panel packaging system and display panel |
| CN113061840A (en) * | 2021-03-15 | 2021-07-02 | 京东方科技集团股份有限公司 | Evaporation mask plate, manufacturing method thereof and display panel |
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Application publication date: 20160921 |