CN113059407B - Circular hole polishing method and polishing system, polishing device and polishing equipment thereof - Google Patents
Circular hole polishing method and polishing system, polishing device and polishing equipment thereof Download PDFInfo
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- CN113059407B CN113059407B CN202110366123.7A CN202110366123A CN113059407B CN 113059407 B CN113059407 B CN 113059407B CN 202110366123 A CN202110366123 A CN 202110366123A CN 113059407 B CN113059407 B CN 113059407B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
- B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a polishing method of a round hole, a polishing system, a polishing device and polishing equipment thereof, wherein the polishing method of the round hole comprises the following steps: controlling the round hole to be polished to rotate along the axis parallel to or coincident with the round hole; controlling a polishing rod to extend into the round hole to be polished; and controlling the polishing rod to rotate along the axis of the polishing rod, and controlling the axis of the polishing rod to coincide with the axis of the round hole, so that the polishing rod polishes the inner wall of the round hole. According to the circular hole polishing method, the polishing rod can be fully contacted with the whole circle of the inner wall of the circular hole for polishing by utilizing the rotation of the circular hole, the technical requirement on the polishing rod is reduced, and the polishing quality and the quality stability are improved.
Description
Technical Field
The invention relates to the technical field of circular hole polishing, in particular to a circular hole polishing method. Also relates to a polishing system for the round hole. Still relate to the burnishing device of a round hole. Also relates to a polishing device for the round hole.
Background
In the existing circular hole polishing technology, the inner wall of a circular hole 101 of a product 6 such as a mobile phone glass panel is polished, the product 6 is fixed on a carrier 7, a polishing rod 05 extends into the circular hole 101, the product 6 is fixed, and the polishing rod 05 polishes the inner wall of the circular hole 101 by utilizing the rotation of the polishing rod 05 to realize polishing. Reference is made to figures 4 to 7 of the specification.
The prior polishing method has high technical requirements on the polished rod 05. In the technical requirements of installation, the polished rod 05 and the circular hole 101 need to be ensured to coincide, and when the situation of misalignment shown in fig. 5 occurs, the problem that the part of the circular hole 101 not in contact with the polished rod 05 cannot be polished without being polished exists, or the problem of over-polishing occurs, which causes uneven polishing; in the technical requirements of quality, it is necessary to ensure that the polished rod 05 has qualified quality, such as the bending shown in fig. 6 and the eccentricity shown in fig. 7, and the portion of the circular hole 101 not in contact with the polished rod 05 cannot be polished, which also causes a problem of uneven polishing.
Therefore, how to provide a circular hole polishing method that solves the problem of uneven polishing is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a circular hole polishing method, which utilizes the rotation of a circular hole to ensure that a polishing rod can be in full contact with the whole circle of the inner wall of the circular hole for polishing, thereby reducing the technical requirements on the polishing rod and improving the polishing quality and the quality stability. It is another object of the present invention to provide a system for polishing circular holes. It is still another object of the present invention to provide a polishing apparatus for circular holes. Another object of the present invention is to provide a polishing apparatus for circular holes.
In order to achieve the above object, the present invention provides a method for polishing a circular hole, comprising:
controlling the round hole to be polished to rotate along an axis parallel to or coincident with the round hole;
controlling a polishing rod to extend into the round hole to be polished;
and controlling the polishing rod to rotate along the axis of the polishing rod, and controlling the axis of the polishing rod to coincide with the axis of the round hole, so that the polishing rod polishes the inner wall of the round hole.
Preferably, the step of controlling the rotation of the circular hole to be polished along an axis parallel to or coincident with the circular hole specifically comprises:
controlling the round hole to be polished to rotate along the axis of the round hole.
Preferably, the step of controlling the rotation of the circular hole to be polished along an axis parallel to or coincident with the circular hole specifically comprises:
controlling the round hole to be polished to rotate along an axis parallel to the round hole;
and the step of controlling the axis of the polishing rod to coincide with the axis of the circular hole specifically comprises:
controlling the polishing rod to move synchronously with the round hole so that the axis of the polishing rod is coincident with the axis of the round hole.
Preferably, the step of controlling the polishing rod to move synchronously with the circular hole specifically includes:
acquiring point coordinates (r, Q) of the circle center of the round hole to be polished in a polar coordinate system and point coordinates (X) of the rotation axis of the round hole to be polished in a Cartesian coordinate system during rotation 1 ，Y 1 )；
From the point coordinates (r, Q) and point coordinates (X) 1 ，Y 1 ) Calculating to obtain the track coordinate (X) of the round hole to be polished 1 +r*cos(Q)，Y 1 +r*sin(Q))；
Obtaining an X-axis target position and a Y-axis target position of the round hole to be polished according to the track coordinates, wherein the X-axis target position is X 1 + r is cos (Q), and the target position of the Y axis is Y 1 +r*sin(Q)；
And controlling the polishing rod to move synchronously with the circular hole according to the X-axis target position and the Y-axis target position.
Preferably, the step of controlling the rotation of the circular hole to be polished along an axis parallel to or coincident with the circular hole specifically comprises:
fixing the product with the round hole to be polished on a carrier;
and controlling the carrier to rotate along an axis parallel to or coincident with the round hole so as to enable the round hole to be polished and the carrier to synchronously rotate.
Preferably, the step of rotating the control carrier along an axis parallel to or coincident with the circular hole specifically includes:
and controlling the carrier to rotate along the axis of the round hole or the central line of the carrier.
The invention also provides a polishing system for a circular hole, comprising:
a first control module: the polishing device is used for controlling the circular hole to be polished to rotate along an axis parallel to or coincident with the circular hole;
a second control module: the polishing rod is controlled to extend into the round hole to be polished;
a third control module: the polishing rod is used for controlling the polishing rod to rotate along the axis of the polishing rod and controlling the axis of the polishing rod to coincide with the axis of the round hole, so that the polishing rod polishes the inner wall of the round hole.
The present invention also provides a polishing apparatus for a circular hole, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the method of polishing a circular hole according to any one of the above when executing the computer program.
The invention also provides a polishing device for the round hole, which comprises a polishing rod, a control host and a rotary table, wherein the rotary table is used for placing a product with the round hole and controlling the round hole to rotate along an axis parallel to or coincident with the round hole;
the control host is connected with the polishing rod, the control host controls the polishing rod to stretch into the round hole, controls the polishing rod to rotate along the axis of the polishing rod, and controls the axis of the polishing rod to coincide with the axis of the round hole, so that the polishing rod polishes the inner wall of the round hole.
Preferably, the control host includes: the polishing device comprises a polishing host machine used for driving the polishing rod to rotate, an X-axis motion mechanism used for driving the polishing rod to move along an X axis, a Y-axis motion mechanism used for driving the polishing rod to move along a Y axis and a Z-axis motion mechanism used for driving the polishing rod to move along a Z axis, wherein the X-axis motion mechanism is connected with the Y-axis motion mechanism, the Y-axis motion mechanism is connected with the Z-axis motion mechanism, the Z-axis motion mechanism is connected with the polishing host machine, and the polishing host machine is connected with the polishing rod.
Compared with the background art, the circular hole polishing method provided by the invention comprises the following three steps: controlling the round hole to be polished to rotate along an axis parallel to or coincident with the round hole; the second step is that: controlling the polishing rod to extend into the round hole to be polished; the third step: controlling the polishing rod to rotate along the axis of the polishing rod, and controlling the axis of the polishing rod to coincide with the axis of the round hole so that the polishing rod polishes the inner wall of the round hole; under the action of the first step, the round hole to be polished rotates, the rotation axis is parallel to or coincided with the axis of the round hole, and the spatial position of one point of the inner wall when the round hole is static is taken as reference, so that the inner wall of the round hole at the spatial position changes constantly when the round hole rotates; under the action of the second step, the polishing rod is stretched into the round hole to be polished to prepare for the next step of polishing; under the action of the third step, the axis of the polishing rod is kept to be coincident with the axis of the round hole so as to ensure that the polishing rod is always positioned in the round hole, the polishing rod is controlled to rotate along the axis of the polishing rod, namely, the polishing rod rotates automatically so as to be in contact with the inner wall of the round hole by utilizing the rotating polishing rod, and then the inner wall of the round hole is polished; under the effect of first step to third step, utilize the rotation of round hole, make the whole circle homoenergetic of the inner wall of round hole contact with polishing rod to realize more abundant and comprehensive whole circle and polish, avoided not in place because of polishing rod installation and the unqualified inner wall of round hole that leads to of quality not polish fully abundant problem, reduced the technical requirement to polishing rod, improved burnishing and polishing's quality and quality stability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for polishing a circular hole according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a circular hole polishing apparatus according to an embodiment of the present invention;
FIG. 3 is a simplified schematic diagram of the circular hole polishing apparatus of FIG. 2;
FIG. 4 is a schematic view of a carrier in the prior art;
FIG. 5 is a schematic view of a prior art burnishing rod in a circular hole where the centerlines are not coincident;
fig. 6 is a schematic view showing a structure of a first polished rod bent in the prior art;
FIG. 7 is a schematic diagram of a prior art eccentric second polished rod;
FIG. 8 is a schematic diagram of a motion trajectory of a circular hole according to an embodiment of the present invention;
fig. 9 is a schematic polar coordinate diagram of a circular hole according to an embodiment of the present invention.
Wherein:
05-polished rod, 051-first polished rod, 052-second polished rod, 1-X axis movement mechanism, 2-Y axis movement mechanism, 3-Z axis movement mechanism, 4-polishing main machine, 5-polishing rod, 6-product, 7-carrier, 8-rotary table, 9-motor and 101-circular hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 to 9, in which fig. 1 is a schematic flow chart of a polishing method for a circular hole according to an embodiment of the present invention, fig. 2 is a schematic structural view of a polishing apparatus for a circular hole according to an embodiment of the present invention, fig. 3 is a schematic simplified diagram of the polishing apparatus for a circular hole according to fig. 2, fig. 4 is a schematic diagram of a carrier according to the prior art, fig. 5 is a schematic diagram of a polishing rod according to the prior art when center lines of the circular hole do not coincide with each other, fig. 6 is a schematic structural view of a first polishing rod bent according to the prior art, fig. 7 is a schematic structural view of a second polishing rod eccentric according to the prior art, fig. 8 is a schematic diagram of a motion trajectory of a circular hole according to an embodiment of the present invention, and fig. 9 is a schematic polar coordinate of a circular hole according to an embodiment of the present invention.
In a first specific embodiment, the method for polishing a circular hole provided by the invention comprises the following three steps: s1, controlling the circular hole 101 to be polished to rotate along the axis parallel to or coincident with the circular hole 101; s2, controlling the polishing rod 5 to extend into the round hole 101 to be polished; and S3, controlling the polishing rod 5 to rotate along the axis of the polishing rod 5, and controlling the axis of the polishing rod 5 to coincide with the axis of the circular hole 101, so that the polishing rod 5 polishes the inner wall of the circular hole 101.
In the embodiment, under the action of the first step, the circular hole 101 to be polished is controlled to rotate, the rotation axis around which the circular hole 101 rotates is parallel to or coincident with the axis of the circular hole, the rotation mode of the circular hole 101 is different according to different arrangement modes of the rotation axis, and no matter what rotation axis the circular hole 101 moves, the spatial position of one point of the inner wall of the circular hole 101 when the circular hole 101 is static is taken as a reference, so that the inner wall of the circular hole 101 at the spatial position changes constantly when the circular hole 101 rotates.
Under the action of the second step, the polishing rod 5 is inserted into the circular hole 101 to be polished, and the polishing rod 5 is inserted after being aligned with the hole inner space of the circular hole 101, so that preparation is made for polishing the inner wall of the circular hole 101 by utilizing the rotation of the polishing rod 5 in the next step.
Under the action of the third step, the polishing rod 5 is controlled to rotate along the axis thereof, that is, the polishing rod 5 performs autorotation motion, so that the autorotation polishing rod 5 is in contact with the inner wall of the circular hole 101, and the inner wall of the circular hole 101 is polished; in addition, it is necessary to keep the axis of the polishing rod 5 coincident with the axis of the circular hole 101, that is, it is necessary to ensure that the polishing rod 5 is in the circular hole 101 at any time, and then to polish the inner wall of the circular hole 101.
It should be emphasized that, in the present invention, based on the improvement of the existing polishing method, the polishing rod 5 and the polishing rod 05 have the same function, and under the function of the above-mentioned first to third steps, especially the first and third steps, the steps S1 and S2 are utilized, and the improvement of the present invention is especially that in step S2, on the basis of step S1, the rotation of the circular hole 101 is utilized to make the polishing rod 5 polish and polish the circular hole 101 more fully and completely, thereby avoiding the problem that the inner wall of the circular hole 101 is not fully polished due to the failure of the installation of the polishing rod 5 and the quality failure, reducing the technical requirements for the polishing rod 5, and improving the quality and the quality stability of polishing and polishing.
It should be noted that, in order to realize the rotation of the circular hole 101 and control the rotation of the carrier 7 loaded with the product 6, the product 6 has a plurality of circular holes 101, that is, the step S1 of controlling the circular hole 101 to be polished to rotate along an axis parallel to or coincident with the circular hole 101 specifically includes: fixing the product 6 with the circular hole 101 to be polished to the carrier 7; the carrier 7 is controlled to rotate along an axis parallel to or coincident with the circular hole 101 so that the circular hole 101 to be polished and the carrier 7 rotate synchronously.
It should be noted that, here, the rotation of the circular hole 101 is realized by the movement of the product 6 driven by the carrier 7, and the rotation axis of the rotation movement has various arrangement manners, including but not limited to being parallel to or coinciding with the axis of the circular hole 101, and shall also belong to the description scope of the present embodiment.
Taking the case that the rotation axis coincides with the axis of the circular hole 101, that is, the step S1 of controlling the circular hole 101 to be polished to rotate along the axis parallel to or coincident with the circular hole 101 specifically includes: the circular hole 101 to be polished is controlled to rotate along the axis of the circular hole 101.
In this embodiment, the carrier 7 drives the product 6 to rotate by taking the axis of the circular hole 101 to be polished as a rotation axis, taking the earth as a reference system, the spatial position of the axis of the circular hole 101 to be polished does not change, the axis of the polishing rod 5 coincides with the axis of the circular hole 101 at this time, that is, the spatial position of the axis of the polishing rod 5 does not change, on this basis, the polishing rod 5 realizes burnishing and polishing by rotation, and the circular hole 101 makes the whole circle of the inner wall of the circular hole 101 fully contact with the polishing rod 5 by rotation, thereby achieving the effect of fully and fully burnishing and polishing.
In the polishing method of the rotation of the circular hole 101 of the present embodiment, the method is suitable for both single-hole machining and multi-hole machining; during single-hole machining, the rotation axis coinciding with the axis of the circular hole 101 is determined to rotate, the polishing rod 5 with the axis coinciding with the axis of the circular hole 101 is used for polishing, a single hole is machined at a time, operation is simple and convenient, and single-hole efficiency is high; in the multi-hole machining, a first rotating axis and the axis of a first polishing rod 5 are determined when a first hole is machined, a second rotating axis and the axis of a second polishing rod 5 are determined when a second hole is machined, and the like, and the rotating axis and the axis of the polishing rod 5 need to be re-determined every time when each polishing of the multi-hole machining is realized.
Taking the example that the rotation axis is parallel to the axis of the circular hole 101, that is, the step S1, namely, the step of controlling the circular hole 101 to be polished to rotate along the axis parallel to or coincident with the circular hole 101, specifically includes: controlling the circular hole 101 to be polished to rotate along an axis parallel to the circular hole 101; meanwhile, the step S3 of controlling the axis of the polishing rod 5 to coincide with the axis of the circular hole 101 includes: the polishing rod 5 is controlled to move in synchronization with the circular hole 101 so that the axis of the polishing rod 5 coincides with the axis of the circular hole 101.
In this embodiment, the rotation axis of the carrier 7 driving the product 6 to rotate is parallel to and does not coincide with the axis of the circular hole 101 to be polished, taking the earth as a reference system, the spatial position of the axis of the circular hole 101 to be polished changes constantly, the motion trajectory of the axis is an arc with the rotation axis as a circle center, the axis of the polishing rod 5 coincides with the axis of the circular hole 101 at this time, that is, the spatial position of the axis of the polishing rod 5 also changes constantly, the motion trajectory is the same as the motion trajectory of the circular hole 101, on the basis, the polishing rod 5 which moves synchronously rotates to achieve polishing, the position angle of the inner wall of the circular hole 101 relative to the polishing rod 5 changes uniformly in real time, and the whole circle of the inner wall of the circular hole is in full contact with the polishing rod 5, thereby achieving the effect of full polishing.
In popular terms, the polishing method for the circular hole in the embodiment is a polishing method for the circular hole rotating along with the circular hole, so that the inner wall of the circular hole 101 is uniformly polished, and the requirements of high quality and high stability of the product 6 are met.
In the polishing method of revolution of the circular hole 101 of the present embodiment, it is applicable to both single-hole processing and multi-hole processing; in the single-hole processing, a rotation axis which is parallel to the axis of the circular hole 101 and is not coincident with the axis is determined to rotate, and the polishing rod 5 with the axis coincident with the axis of the circular hole 101 is used for polishing; when the porous polishing rod 5 is machined, the rotation axis is shared by multiple holes, each hole corresponds to one polishing rod 5, and the rotation axis of the multiple holes and the polishing rods 5 of the multiple holes are determined at one time.
It should be emphasized that the above method causes the circular hole 101 and the polishing rod 5 to move relatively, i.e. the angle between the inner wall of the circular hole 101 and the center of the polishing rod 5 is changed uniformly in real time, so that the circular hole 101 is polished at every angle position of the inner wall during the polishing process. On this basis, after finishing the grinding and polishing of a single circular hole 101, the grinding and polishing of more circular holes 101 are performed, and only the above steps need to be repeated, which also belongs to the description scope of the present embodiment.
In addition, the rotation mode of the carrier 7 is different according to the rotation axis, that is, the step of controlling the carrier 7 to rotate along the axis parallel to or overlapped with the circular hole 101 includes: the carrier 7 is controlled to rotate along the axis of the circular hole 101, or along the center line of the carrier 7.
More specifically, in order to realize the technical feature of "follow rotation", it is ensured that the axis of the polishing rod 5 coincides with the axis of the circular hole 101, and when the rotation axis is parallel to and does not coincide with the axis of the circular hole 101, the spatial position of the polishing rod 5 and the spatial position of the circular hole 101 have a certain limiting relationship, that is, the step of controlling the polishing rod 5 to move synchronously with the circular hole 101 specifically includes: acquiring point coordinates r and Q of the circle center of the round hole 101 to be polished in a polar coordinate system and point coordinates X of the rotation axis of the round hole 101 to be polished in a Cartesian coordinate system during rotation 1 ，Y 1 (ii) a According to point coordinates r, Q and point coordinate X 1 ，Y 1 Calculating to obtain the track coordinate X of the round hole 101 to be polished 1 +r*cosQ，Y 1 + r sinQ; obtaining an X-axis target position and a Y-axis target position of the round hole 101 to be polished according to the track coordinates, wherein the X-axis target position is X 1 + r COsQ, Y-axis target position is Y 1 + r sinQ; the polishing rod 5 is controlled to move synchronously with the circular hole 101 according to the X-axis target position and the Y-axis target position.
In the present embodiment, the point coordinates (r, Q) of the circular hole 101 in the polar coordinate system and the point coordinates (X) of the rotation center in the cartesian coordinate system are used 1 ，Y 1 ) The locus coordinates (X) of the circular hole 101 are obtained 1 +r*cos(Q)，Y 1 + r sin (q)), and obtaining the X-axis target position ═ X of the circular hole 101 from the trajectory coordinates 1 + r cos (q), Y-axis target position ═ Y 1 + r × sin (q); s2223, controlling the polishing rod 5 to move synchronously with the circular hole 101 according to the X-axis target position and the Y-axis target position.
The invention also provides a polishing system for circular holes, comprising: the polishing device comprises a first control module, a second control module and a third control module, wherein program data for realizing the steps are stored in the control modules, the first control module is used for realizing the control of the step S1 that the circular hole 101 to be polished rotates along an axis parallel to or coincident with the circular hole 101, the second control module is used for realizing the control of the step S2 that the polishing rod 5 extends into the circular hole 101 to be polished, and the third control module is used for realizing the control of the step S3 that the polishing rod 5 rotates along the axis of the polishing rod 5 and the axis of the circular hole 101 coincides, so that the polishing rod 5 polishes the inner wall of the circular hole 101.
On this basis, the first control module can control not only the circular hole 101 to be polished to rotate along the axis of the circular hole 101, but also the circular hole 101 to be polished to rotate along an axis parallel to the circular hole 101. When the first control module controls the circular hole 101 to rotate along the axis of the circular hole, the circular hole 101 rotates, and the axis of the polishing rod 5 controlled by the third control module is fixed; when the first control module controls the circular hole 101 to be polished to rotate along the axis parallel to the circular hole 101, the circular hole 101 revolves, and the third control module controls the polishing rod 5 to move synchronously with the circular hole 101, so that the axis of the polishing rod 5 is coincident with the axis of the circular hole 101.
The present invention also provides a polishing apparatus for a circular hole, comprising: a memory for storing a computer program and a processor for implementing the steps of the polishing method for the circular hole as described above when executing the computer program. The invention also provides a polishing device for the round hole, which is applied to the polishing method for the round hole and comprises a polishing rod 5, a control host and a rotary table 8, wherein the rotary table 8 is used for placing a product 6 with the round hole 101 and controlling the round hole 101 to rotate along an axis parallel to or coincident with the round hole 101; the control host computer is connected with the polishing rod 5, and the control host computer controls the polishing rod 5 to stretch into the round hole 101, and controls the polishing rod 5 to rotate along the axis of the polishing rod 5, and controls the axis of the polishing rod 5 to coincide with the axis of the round hole 101, so that the polishing rod 5 polishes the inner wall of the round hole 101.
In the embodiment, a product 6 with a round hole 101 is fixed on a carrier 7, a turntable 8 carries the carrier 7 and is driven by a motor 9, and a polishing rod 5 is driven by a control host; in brief, the turntable 8 rotates about the axis of the turntable 8, and different rotation effects of the circular hole 101 can be obtained according to the state in which the carrier 7 is placed on the turntable 8, for example, a first rotation case when the axis of the circular hole 101 coincides with the axis of the turntable 8, and a second rotation case when the axis of the carrier 7 coincides with the axis of the turntable 8 (the axis of the circular hole 101 is parallel to and does not coincide with the axis of the turntable 8).
It should be noted that, the control host in this embodiment has various setting modes, including but not limited to a multi-axis combined motion mechanism, a multi-motion manipulator, and the like; illustratively, the control host includes: a polishing host computer 4 for driving 5 rotations of polishing rod, an X axle motion 1 for driving 5 along the X axle motion of polishing rod, a Y axle motion 2 for driving 5 along the Y axle motion of polishing rod and a Z axle motion 3 for driving 5 along the Z axle motion of polishing rod, Y axle motion 2 is connected to X axle motion 1, Z axle motion 3 is connected to Y axle motion 2, Z axle motion 3 connects polishing host computer 4, polishing host computer 4 connects polishing rod 5.
In this embodiment, the X-axis motion mechanism 1, the Y-axis motion mechanism 2, and the Z-axis motion mechanism 3 all have servo motors and respectively realize the feeding motion of the polishing rod 5 in three directions of the X-axis, the Y-axis, and the Z-axis, wherein the Z-axis motion mechanism 3 controls the polishing rod 5 of the rotation to extend into the circular hole 101 and drive the polishing rod 5 to perform the up-and-down circulation motion, and the X-axis motion mechanism 1 and the Y-axis motion mechanism 2 control the polishing rod 5 to move, thereby realizing the above-mentioned "follow rotation" effect.
Specifically, in the "follow-up rotation" embodiment, the rotation axis of the circular hole 101 for the rotation motion is the axis of the carrier 7, coincides with the rotation axis of the turntable 8, which is the point coordinate (X) in the cartesian coordinate system, and coincides with the output shaft of the motor 9 1 ，Y 1 ) Point coordinates (r, Q) of the circular hole 101 in the polar coordinate system, and at this time, trajectory coordinates (X) of the circular hole 101 1 +r*cos(Q)，Y 1 + r sin (q)), X-axis target position ═ X 1 + r × cos (q) is the X-axis target position to be controlled by the X-axis motion mechanism 1, and the Y-axis target position is Y 1 The + r sin (q) is the Y-axis target position to be controlled by the Y-axis moving mechanism 2.
Exemplarily, a bechoff PLC is used for realizing motion control, the PLC controls the turntable 8 to rotate in a servo mode, a motor 9 for controlling the turntable 8 to rotate feeds back the position of the turntable 8, the PLC converts the rotation angle value into an instantaneous angle value when the turntable 8 rotates, and the instantaneous angle value is obtained by changing the formula X into X 1 + r cos (q) and Y ═ Y 1 And (q) substituting + r sin (q) to obtain target positions of an X axis and a Y axis, converting the target positions into motor target positions of an X axis movement mechanism 1 and a Y axis movement mechanism 2 through a PLC (programmable logic controller), and controlling servo real-time target positions of the X axis movement mechanism 1 and the Y axis movement mechanism 2, thereby realizing real-time motion control of 'follow rotation'.
On the basis, the number of the circular holes 101 is three, which are A, B and C, and on the basis of the control manner, taking B as an example, the corresponding control manner can be obtained by changing r and Q, which is not described in detail herein.
It should be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.
The circular hole polishing method, the circular hole polishing system, the circular hole polishing device and the circular hole polishing equipment provided by the invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, it is possible to make various improvements and modifications to the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (8)
1. A method of polishing a circular hole, comprising:
controlling a circular hole (101) to be polished to rotate along an axis parallel to the circular hole (101);
controlling a polishing rod (5) to extend into the round hole (101) to be polished, and controlling the polishing rod (5) to move synchronously with the round hole (101) so that the axis of the polishing rod (5) is superposed with the axis of the round hole (101);
controlling the polishing rod (5) to rotate along the axis of the polishing rod (5) so that the polishing rod (5) polishes the inner wall of the round hole (101).
2. The polishing method according to claim 1, wherein the step of controlling the polishing rod (5) to move synchronously with the circular hole (101) comprises:
acquiring point coordinates (r, Q) of the circle center of the round hole (101) to be polished in a polar coordinate system and point coordinates (X) of the rotation axis of the round hole (101) to be polished in a Cartesian coordinate system when rotating 1 ，Y 1 )；
From the point coordinates (r, Q) and point coordinates (X) 1 ，Y 1 ) Calculating to obtain the track coordinate (X) of the round hole (101) to be polished 1 +r*cos(Q)，Y 1 +r*sin(Q))；
Obtaining an X-axis target position and a Y-axis target position of the round hole (101) to be polished according to the track coordinates, wherein the X-axis target position is X 1 + r is cos (Q), and the target position of the Y axis is Y 1 +r*sin(Q)；
And controlling the polishing rod (5) to move synchronously with the circular hole (101) according to the X-axis target position and the Y-axis target position.
3. The polishing method according to claim 1 or 2, wherein the step of controlling the rotation of the circular hole (101) to be polished along an axis parallel to the circular hole (101) comprises in particular:
-fixing the product (6) with the circular hole (101) to be polished to a carrier (7);
controlling the carrier (7) to rotate along an axis parallel to the circular hole (101) so as to enable the circular hole (101) to be polished and the carrier (7) to rotate synchronously.
4. A polishing method according to claim 3, characterized in that the step of rotating the control carrier (7) along an axis parallel to the circular hole (101) comprises in particular:
controlling the vehicle (7) to rotate along the centerline of the vehicle (7).
5. A polishing system for a circular hole, comprising:
a first control module: for controlling the rotation of a circular hole (101) to be polished along an axis parallel to said circular hole (101);
a second control module: the polishing rod (5) is controlled to extend into the round hole (101) to be polished;
a third control module: the polishing rod is used for controlling the polishing rod (5) to rotate along the axis of the polishing rod (5) and controlling the axis of the polishing rod (5) to coincide with the axis of the round hole (101), so that the polishing rod (5) polishes the inner wall of the round hole (101).
6. A polishing apparatus for a circular hole, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the method of polishing a circular hole according to any one of claims 1 to 4 when executing the computer program.
7. A polishing device for a round hole is characterized by comprising a polishing rod (5), a control host and a rotary table (8), wherein the rotary table (8) is used for placing a product (6) with a round hole (101) and controlling the round hole (101) to rotate along an axis parallel to the round hole (101);
the control host is connected with the polishing rod (5), the control host controls the polishing rod (5) to extend into the round hole (101), controls the polishing rod (5) to rotate along the axis of the polishing rod (5), and controls the axis of the polishing rod (5) to coincide with the axis of the round hole (101), so that the polishing rod (5) polishes the inner wall of the round hole (101).
8. The apparatus for polishing a circular hole according to claim 7, wherein the control main unit includes: the polishing machine is used for driving a polishing host (4) of polishing rod (5) rotation, driving the polishing rod (5) along an X-axis motion mechanism (1) of X-axis motion, driving the polishing rod (5) along a Y-axis motion mechanism (2) and driving the polishing rod (5) along a Z-axis motion mechanism (3) of Z-axis motion, the X-axis motion mechanism (1) is connected with the Y-axis motion mechanism (2), the Y-axis motion mechanism (2) is connected with the Z-axis motion mechanism (3), the Z-axis motion mechanism (3) is connected with the polishing host (4), and the polishing host (4) is connected with the polishing rod (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110366123.7A CN113059407B (en) | 2021-04-06 | 2021-04-06 | Circular hole polishing method and polishing system, polishing device and polishing equipment thereof |
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| CN202110366123.7A CN113059407B (en) | 2021-04-06 | 2021-04-06 | Circular hole polishing method and polishing system, polishing device and polishing equipment thereof |
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| CN113059407B true CN113059407B (en) | 2022-09-09 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3479717B2 (en) * | 1999-09-27 | 2003-12-15 | 株式会社シギヤ精機製作所 | Grinding method with CNC grinder |
| US6875092B2 (en) * | 2002-03-29 | 2005-04-05 | Depuy Products, Inc. | Method for the manufacture of a femoral prosthesis |
| US6957999B1 (en) * | 2005-02-09 | 2005-10-25 | Vehicle Inspection Systems Inc. | Vehicle wheel rim polisher |
| DE102010026026B4 (en) * | 2010-07-03 | 2019-01-03 | Emag Holding Gmbh | Method and grinding machine for grinding surfaces of revolution |
| CN205734213U (en) * | 2016-06-23 | 2016-11-30 | 苏焕宇 | A kind of robot RV reducer planet wheel spindle bearing bore system Special precision grinding machine |
| CN207358835U (en) * | 2017-10-09 | 2018-05-15 | 蓝思科技（长沙）有限公司 | A kind of polishing clamp and burnishing device of the cylindrical rod containing axial hole |
| CN108620693A (en) * | 2018-05-07 | 2018-10-09 | 哈尔滨工业大学 | A kind of parallel-axis type method for grinding of big L/D ratio internal thread |
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