CN113053244B

CN113053244B - Display module, manufacturing method thereof and back film

Info

Publication number: CN113053244B
Application number: CN202110265899.XA
Authority: CN
Inventors: 杨恕权; 陈立强; 杨超; 赵东东; 张胜星; 庞孟媛
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2021-03-11
Filing date: 2021-03-11
Publication date: 2023-04-18
Anticipated expiration: 2041-03-11
Also published as: US20220293016A1; CN113053244A

Abstract

The embodiment of the application provides a display module, a manufacturing method thereof and a back film. Relates to the technical field of display. The phenomenon of poor display can be improved. The display module comprises a flexible display panel and a bearing structure. The flexible display panel includes a display part and a fan-out part connected with the display part. The carrier structure includes a first carrier film and a first support structure. The first bearing film is arranged on the non-light-emitting side of the flexible display panel, covers the display part and the fan-out part and is used for bearing the flexible display panel. The first supporting structure is arranged on one side, far away from the flexible display panel, of the first bearing film. The vertical projection of the first supporting structure on the flexible display panel is positioned in the area where the fan-out part is positioned and at one end far away from the display part, and is used for supporting one part of the flexible display panel.

Description

Display module, manufacturing method thereof and back film

Technical Field

The application relates to the technical field of display, for example, to a display module and a manufacturing method thereof, and a back film.

Background

An OLED (Organic Light-Emitting Diode) flexible display device has the advantages of small size, portability, capability of realizing bending and folding, narrow frame and the like, and thus becomes the mainstream development trend of the display device at present. A back film in the OLED flexible display device is disposed on a back surface of the flexible display panel, and in order to enable the OLED flexible display device to realize a narrower lower bezel, a Bending (Bending) mode is usually adopted to bend a side of an attached driving chip (Integrated Circuit, abbreviated as IC) on the back surface of the flexible display panel. Therefore, when the bending area is bent, the back film is arranged on the back face of the flexible display panel, so that supporting force can be provided for the flexible display panel, and a better bending effect can be achieved.

Disclosure of Invention

The embodiment of the application provides a display module, a manufacturing method thereof and a back film, which can improve the phenomenon of poor display.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

one aspect of the embodiments of the present application provides a display module. The display module comprises a flexible display panel and a bearing structure. The flexible display panel comprises a display part and a fan-out part connected with the display part. The carrier structure includes a first carrier film and a first support structure. The first bearing film is arranged on the non-light-emitting side of the flexible display panel, covers the display part and the fan-out part and is used for bearing the flexible display panel. The first supporting structure is arranged on one side, far away from the flexible display panel, of the first bearing film, and the vertical projection of the first supporting structure on the flexible display panel is located in the area where the fan-out portion is located and located at one end, far away from the display portion, of the first supporting structure and used for supporting one part of the flexible display panel. Therefore, the first bearing film is arranged in the display module, the display part and the fan-out part in the flexible display panel can be supported in a bearing mode, and the display part and the fan-out part are prevented from deforming. In addition, through set up first bearing structure in display module assembly, can be further play the supporting role to fan-out part, prevent that display module assembly from buckling because the great stress that produces of buckle initial position department drives fan-out part and takes place to warp, and then guarantee the reliability of display screen.

Optionally, the first support structure includes a first cover layer and a first ultraviolet glue. The first ultraviolet glue is positioned between the first covering layer and the first bearing film and is used for bonding the first covering layer and the first bearing film.

Optionally, the flexible display panel further includes a binding portion and a deformation portion. The binding part is used for binding the drive chip. Deformation portion, be located between binding portion and the fan-out part, and be connected with binding portion and fan-out part, deformation portion will bind the portion and set up in flexible display panel's non-light-emitting side under the bending state. The bearing structure further comprises a second bearing film, a second supporting structure and an opening. Wherein, the second bears the membrane, sets up in binding portion and keeps away from one side of driver chip for bear binding portion. And the second supporting structure is arranged on one side of the second bearing film, which is far away from the binding part, and is used for supporting the binding part. The opening is located between the first bearing film and the second bearing film, and the deformation portion is located at the position of the opening. Therefore, the second bearing film is arranged in the display module, the binding part can be borne and supported, and the binding part is prevented from deforming to influence the binding of the signal wiring in the binding part and the drive chip. In addition, through set up second bearing structure in display module assembly, can be further play the supporting role to binding the portion, prevent to be close to binding the part of warp under the state and lead to the signal to walk the tearing disconnection of line because stress action warp to guarantee the reliability of display screen.

Optionally, the second support structure includes a second cover layer and a second ultraviolet glue. The second ultraviolet glue is positioned between the second covering layer and the second bearing film and used for bonding the second covering layer and the second bearing film.

Optionally, the display module further includes a reinforcing layer. The strengthening layer is located one side that flexible display panel was kept away from to first carrier film, and the perpendicular projection of strengthening layer on flexible display panel and the perpendicular projection of first bearing structure on flexible display panel are not overlapped for support flexible display panel. Therefore, the reinforcing layer is arranged in the display module, the mechanical strength of the display module can be improved, meanwhile, the area where the deformation part is located can be subjected to graphical processing, and the deformation and recovery effects of the deformation part are improved.

Optionally, when the bearing structure includes the second supporting structure, the display module further includes: and the spacer layer is positioned between the reinforcing layer and the second covering layer. Thus, the spacer layer with a certain thickness is arranged in the display module, so that the bending radius of the deformation part can be controlled, and the deformation reliability is enhanced.

Optionally, the display module further includes a flip-chip film. One end of the chip on film is bound on the fan-out part, and the other end of the chip on film is used for binding the driving chip. The flip chip film is bound in the area where the part of the fan-out part is located and is overlapped with the vertical projection of the first support structure on the fan-out part.

Optionally, the display module further includes a polarizer and a cover plate located on the light exit side of the flexible display panel and sequentially away from the flexible display panel. Therefore, the polaroid and the cover plate are arranged in the display module, so that the emergent light can be processed and the flexible display panel can be protected.

In another aspect of the embodiments of the present application, a back film is provided. The back film is used for forming a bearing structure in the display module. Wherein the backing film comprises a first film layer and a second film layer. The first film layer is used for forming a first bearing film. And the second film layer is stacked and arranged with the first film layer, is connected with the first film layer and is used for forming a first supporting structure.

Optionally, when the carrier structure further includes a second carrier film, a second support structure, and an opening, and the second support structure includes a second cover layer and a second ultraviolet glue: the first film layer is also used for forming a second bearing film and an opening; the second film layer is also used for forming a second supporting structure, the protective film in the second film layer is also used for forming a second covering layer, and the ultraviolet bonding layer is also used for forming a second ultraviolet glue.

In another aspect of the embodiments of the present application, there is provided a method for manufacturing a display module according to any one of the above embodiments by using the back film according to any one of the above embodiments. Under the condition that the second film layer comprises a protective film and an ultraviolet bonding layer which are arranged in a stacked mode, and the first supporting structure comprises a first covering layer and first ultraviolet glue; arranging a back film on the non-light-emitting side of the flexible display panel, wherein in the back film, a first film layer is bonded with the non-light-emitting side of the flexible display panel; performing mask ultraviolet irradiation on one side of the back film, which is far away from the flexible display panel, and forming a first viscosity area and a second viscosity area in the ultraviolet bonding layer; in the ultraviolet bonding layer, the viscosity of a part positioned in the first viscosity area is different from that of a part positioned in the second viscosity area; removing the part of the ultraviolet bonding layer positioned in the second viscosity area and the part of the protective film bonded with the ultraviolet bonding layer in the second viscosity area; and reserving a part of the ultraviolet adhesive layer in the first viscosity area as a first ultraviolet glue, and reserving a part of the protective film, which is adhered to the ultraviolet adhesive layer in the first viscosity area, as a first cover layer.

Optionally, under the condition that the carrying structure further includes a second carrying film, a second supporting structure and an opening, and the second supporting structure includes a second cover layer and a second ultraviolet glue, after the mask ultraviolet irradiation is performed on the side of the back film far away from the flexible display panel, the manufacturing method further includes: a third viscosity area is also formed in the ultraviolet bonding layer, wherein in the ultraviolet bonding layer, the part positioned in the third viscosity area has the same viscosity as the part positioned in the first viscosity area; and reserving a part of the ultraviolet bonding layer in the third viscosity area as a second ultraviolet glue, and reserving a part of the protective film bonded with the ultraviolet bonding layer in the third viscosity area as a second cover layer. The display module prepared by the method has similar technical effects as the display module, and the description is omitted here.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

fig. 2 is a schematic diagram illustrating a routing design of a fan-out portion according to an embodiment of the present disclosure;

fig. 3A is a schematic structural diagram of another display module provided in the embodiment of the present application;

FIG. 3B is an expanded view of the display module shown in FIG. 3A;

FIG. 4A is a cross-sectional view of the display module shown in FIG. 3B along the Z-Z direction;

FIG. 4B is a schematic view of the display module shown in FIG. 4A after being bent along the deformation portion;

fig. 5A is a schematic structural diagram of another display module provided in the embodiment of the present application;

FIG. 5B is a schematic view of the display module shown in FIG. 5A after being bent along the deformation portion;

FIG. 6 is another cross-sectional view of the display module shown in FIG. 3B in the Z-Z direction after being bent along the deformation portion;

FIG. 7 is a schematic structural diagram of a back film according to an embodiment of the present disclosure;

FIG. 8 is a cross-sectional view of the display module shown in FIG. 3B along the Z-Z direction;

FIG. 9 is another cross-sectional view of the display module shown in FIG. 3B along the Z-Z direction;

FIG. 10A is a diagram of a method for UV irradiation of a backing film according to an embodiment of the present disclosure;

FIG. 10B is a diagram of another example of a method for UV irradiation of a backing film according to an embodiment of the present application;

FIG. 11 is another cross-sectional view of the display module shown in FIG. 3B along the Z-Z direction;

FIG. 12 is another cross-sectional view of the display module shown in FIG. 3B along the Z-Z direction;

FIG. 13A is a diagram of another example of a method for UV irradiation of a backing film according to an embodiment of the present application;

FIG. 13B is another cross-sectional view of the display module shown in FIG. 3B along the Z-Z direction;

FIG. 14A is a diagram of another method for UV irradiation of a backing film according to an embodiment of the present disclosure;

FIG. 14B is another cross-sectional view of the display module shown in FIG. 3B along the Z-Z direction;

fig. 15A is a schematic structural diagram of another display module provided in this embodiment of the present application;

FIG. 15B is an expanded view of the display module shown in FIG. 15A;

FIG. 16A is a cross-sectional view of the display module shown in FIG. 15B along the direction J-J;

fig. 16B is a schematic view of the display module shown in fig. 16A after bending.

Reference numerals are as follows:

100-a display module; 10-a flexible display panel; 11-a display section; 12-a fan-out; 13-a deformation; 14-a binding section; 141-a line-winding part; 142-a binding connection; 15-a stress compensation layer; 16-chip on film; 17-a first light barrier; 18-a second light blocking plate; 20-a backing film; 21-a release film; 22-an adhesive layer; 23-a first film layer; 24-a second film layer; 241-ultraviolet bonding layer; 242-protective film; 30-a load-bearing structure; 31-a first carrier film; 32-a first support structure; 321-first ultraviolet glue; 322-a first cover layer; 33-a second carrier film; 34-a second support structure; 341-second ultraviolet glue; 342-a second cover layer; 35-a third support structure; 351-third ultraviolet glue; 352-third cover layer; 40-a strengthening layer; 50-a spacer layer; 60-a polarizer; 70-cover plate; 71-a transparent cover plate; 72-a light-shielding cover plate; 721-light-shielding protective layer; 722-a light-shielding layer; 73-protective plate; 80-optical cement.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature.

Further, in this application, directional terms, such as "left," "right," "upper," and "lower," are defined with respect to the schematically-disposed orientation of the components in the drawings, and it is to be understood that these directional terms are relative concepts that are used for descriptive and clarity purposes and that will vary accordingly depending on the orientation in which the components are disposed in the drawings.

In this application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, and thus, for example, may be directly connected or indirectly connected through intervening media.

The embodiment of the present application provides a display module, which may be applied to display devices such as televisions, mobile phones, computers, notebook computers, tablet computers (pads), personal Digital Assistants (PDAs), and vehicle-mounted computers, and the display device having the display module is not limited in the present application.

The display module may include an OLED display panel, a Quantum Dot Light Emitting diode (QLED) display panel, and the like. The OLED display panel has the advantages of small size, convenience in carrying, capability of realizing bending and folding, narrow frame and the like, and is increasingly applied to the high-performance display field. The following embodiments of the present application are all explained by taking an example that the display module includes an OLED display panel.

On the basis, when the substrate in the OLED display panel is made of a flexible substrate material, the OLED display panel may be a flexible display panel. The following embodiments of the present application are all explained by taking an OLED display panel as a flexible display panel as an example.

It should be noted that the flexible substrate material may include one or more of Polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), and the like, which is not limited in this embodiment of the present invention.

As can be seen from the above, in some embodiments of the present disclosure, as shown in fig. 1, the display module 100 may include a flexible display panel 10. The flexible display panel 10 may include a display part 11 (Active Area, AA).

As shown in fig. 1, the display portion 11 may include sub-pixels (sub-pixels) P of a plurality of colors, a pixel circuit 110 and a light emitting device OLED electrically connected to the pixel circuit 110 are disposed in each sub-pixel P, and the pixel circuit 110 may drive the light emitting device OLED to emit light. In this case, the OLEDs in the plurality of sub-pixels may emit light of at least three primary colors, for example, red (R), green (G), and Blue (Blue, B).

For convenience of description, the present application exemplifies that the plurality of sub-pixels P are arranged in a matrix form. In this case, the subpixels P arranged in one row in the horizontal direction X are referred to as subpixels of the same row, and the subpixels P arranged in one row in the vertical direction Y are subpixels of the same column.

The display portion 11 may further include a plurality of Data signal lines (DL) and a plurality of Gate signal lines (GL). Wherein the pixel circuits 110 of the sub-pixels P positioned in the same row may be electrically connected to the same gate signal line GL. The pixel circuits 110 of the sub-pixels P located in the same column may be electrically connected to the same data signal line DL.

In a case where the pixel circuit 100 is gated by a gate signal transmitted from the gate signal line GL, a data signal may be written to the pixel circuit 110 through the data signal line DL. In this way, the pixel circuit 110 can drive the light emitting device OLED electrically connected to the pixel circuit 110 to emit light, thereby implementing the display image of the display module 100.

In order to provide the data signals and the gate signals, as shown in fig. 1, the display module 100 may further include a driver IC and a Flexible Printed Circuit (FPC). The FPC connects a control main board (not shown) to the flexible display panel 10. The control main board may supply a gate signal to the pixel circuit 110 through the FPC. In addition, the driving IC may supply a data signal to the pixel circuit 110 under the control of the control main board.

In order to facilitate the electrical connection of the data signal lines DL to the driving IC, as shown in fig. 1, the flexible display panel 10 may further include a fan-out portion 12, wherein the fan-out portion 12 is connected to the display portion 11. On the side of the fan-out portion 12 close to the driving IC, the distance between any two adjacent data signal lines DL of the plurality of data signal lines DL gradually decreases. For example, as shown in fig. 2, a distance D1 between any two adjacent data signal lines DL in the display part 11 is greater than a distance D2 between the two adjacent data signal lines DL in the fan-out part 12. In this way, by providing the fan-out section 12 in the flexible display panel 10, it is possible to facilitate electrical connection between the plurality of data signal lines DL and the driver IC having a small volume.

It should be noted that, for the display, the fan-out portion 12 may further include other signal lines besides the data signal line DL, for example, the fan-out portion 12 may further include a first power line VDD (not shown in fig. 1) and a second power line VSS (not shown in fig. 1), where the first power line VDD may provide the first voltage VDD for the pixel circuit 110, and the second power line VSS may provide the second voltage VSS for the pixel circuit 110.

In the embodiment of the present application, the driving IC and the flexible display panel 10 have two different connection manners, so that the display module 100 has two different structures, and the display module 100 with the two different structures is exemplified below.

In the first example, as shown in fig. 3A, the driving IC is directly electrically connected to the flexible display Panel 10 (Chip On Panel, COP for short), and a portion of the flexible display Panel 10 provided with the driving IC is directly bent to the non-light-emitting side of the display module 100. By bending, a narrow bezel design of the display device having the display module 100 can be achieved.

Specifically, as shown in fig. 3B (fig. 3B is an expanded view of the display module 100 shown in fig. 3A), the flexible display panel 10 may further include a deformation portion 13 (Bending portion) and a binding portion 14. Wherein, deformation portion 13 is located between fan-out portion 12 and binding portion 14, and one end is connected with fan-out portion 12, and the other end is connected with binding portion 14, and the aforesaid is buckled and is taken place in deformation portion 13. The binding unit 14 binds the driver IC and also binds the FPC. The deformation portion 13 may bend the binding portion 14 provided with the driver IC and the FPC to the non-light emitting side of the display module 100 in a bent state.

Since the data signal lines DL led out from the fan-out section 12 are not wound at the position of the strain section 13, that is, the distance between any two adjacent data signal lines DL in the strain section 13 is equal, the binding section 14 may include a winding section 141 as shown in fig. 3B in order to bind and electrically connect the data signal lines DL to the driver IC. The distance between any two adjacent data signal lines DL on the side of the wire rewinding portion 141 close to the driving IC is gradually reduced, and the arrangement manner of the data signal lines DL is similar to that of the data signal lines DL of the fan-out portion 12, which is not described herein again. In this way, the data signal lines DL and the driving IC can be electrically connected by the line collecting portion 141. In addition, the binding part 14 may further include a binding connection part 142. The binding connection portion 142 is used to bind the driver IC and the FPC.

In some embodiments of the present application, as shown in fig. 4A (fig. 4A is a cross-sectional view of the display module 100 shown in fig. 3B along the Z-Z direction), in order to prevent a metal trace (not shown in fig. 4A) in the deformation portion 13 from being broken due to a large stress generated when the deformation portion 13 is bent, the display module 100 may further include a stress compensation layer 15. The stress compensation layer 15 covers the deformations 13 and portions of the fan-out 12 and binding 14 adjacent to the deformations 13.

Thus, by providing the stress compensation layer 15 in the display module 100, the stress applied to the deformation portion 13 during the bending process can be adjusted, and the possibility of breakage of the metal traces in the deformation portion 13 in the bending state is reduced.

It should be noted that, in the embodiment of the present application, the thickness H1 of the stress compensation layer 15 may be in a range of: h1 is more than or equal to 70um and less than or equal to 110um. Wherein, when the thickness H1 of stress compensation layer 15 is less than 70um, because stress compensation layer 15 is too thin, can't play good regulatory action to the stress that produces in the deformation portion 13 process of buckling. When the thickness H1 of the stress compensation layer 15 is larger than 110um, the stress compensation layer 15 is too thick, so that the resource waste is easily caused, the installation condition of the display module can not be met, and the bending difficulty can be caused. Illustratively, the thickness H1 of the stress compensation layer 15 may be 80um, 90um, 100um. At this time, the stress compensation layer 15 can not only perform a good adjustment function on the stress generated in the bending process of the deformation portion 13, but also satisfy the installation condition of the display module. In addition, in some embodiments of the present application, the constituent material of the stress compensation layer 15 may be Ultraviolet glue (UV glue).

As can be seen from the above, the substrate of the flexible display panel 10 is made of a flexible material, so that the flexible display panel 10 is easily deformed, and signal traces (e.g., data signal lines DL) are broken, thereby causing poor display. Thus. In order to prevent the flexible display panel 10 from deforming, in some embodiments of the present application, as shown in fig. 4A, the display module 100 may further include a carrying structure 30. The carrier structure 30 may include a first carrier film 31 and a first support structure 32. The first carrier film 31 is disposed on the non-light-emitting side of the flexible display panel 10, and covers the display portion 11 and the fan-out portion 12, so as to carry the display portion 11 and the fan-out portion 12 and prevent the display portion 11 and the fan-out portion 12 from being deformed.

In some embodiments of the present application, the thickness H2 of the first carrier film 31 may have a value range as follows: h2 is more than or equal to 30um and less than or equal to 120um. When the thickness H2 of the first carrier film 31 is smaller than 30um, the first carrier film 31 is too thin, and thus the display portion 11 and the fan-out portion 12 located thereon cannot be supported well, and when the thickness H2 of the first carrier film 31 is greater than 120um, the first carrier film 31 is too thick, which increases the manufacturing cost and is not beneficial to the light and thin design of the display device. For example, the thickness H2 of the first carrier film 31 may be: 50um,75um,100um, so not only can the display part 11 and the fan-out part 12 on the first carrier film 31 be supported well, but also the cost is low, and the light and thin design of the display device can be realized.

As shown in fig. 4A, the first supporting structure 32 is disposed on a side of the first carrier film 31 away from the fan-out portion 12, and a vertical projection of the first supporting structure 32 on the flexible display panel 10 is located in a region where the fan-out portion 12 is located and at an end away from the display portion 11. As shown in fig. 4B (fig. 4B is a state of fig. 4A after being bent along the bending start position M), the first supporting structure 32 can support the flexible display panel 10 (e.g., the fan-out portion 12 in the dashed line frame V) thereon without deformation in the bending state, so as to ensure the reliability of the display screen.

This is because, in the bending state shown in fig. 4B, the larger stress generated at the bending start position M of the deformation portion 13 and the stress compensation layer 15 with a certain thickness H1 thereon tends to deform the thinner first carrier film 31 (for example, the first carrier film 31 in the region where the dashed line frame V is located), and further, the fan-out portion 12 (for example, the fan-out portion 12 in the dashed line frame V) is deformed together, so that the inorganic layer in the fan-out portion 12 is torn at the position, the signal trace is disconnected, and the display screen is poor. Therefore, by providing the first supporting structure 32 in the display module 100, when the deformation portion 13 is bent at the bending start position M, the fan-out portion 12 (for example, the fan-out portion 12 in the dashed line frame V) can be supported to prevent deformation, thereby ensuring reliability of the display screen.

As can be seen from the above, by providing the first carrier film 31 in the display module 100, the flexible display panel 10 can support the display portion 11 and the fan-out portion 12, and the display portion 11 and the fan-out portion 12 are prevented from being deformed. In addition, by providing the first supporting structure 32 in the display module 100, the fan-out section 12 (for example, the fan-out section 12 in the dashed line frame V) can be further supported, so that when the display module 100 is bent, the fan-out section 12 is prevented from being deformed by a large stress generated at the bending start position M, and thus, the reliability of the display screen is ensured.

In some embodiments of the present application, as shown in fig. 4A or 4B, the first support structure 32 may include a first ultraviolet glue 321 and a first cover layer 322. The first ultraviolet glue 321 is located between the first cover layer 322 and the first carrier film 31, and can adhere the first cover layer 322 to the first carrier film 31. The first cover layer 322 may provide good support for the fan-out 12 located thereon (e.g., the fan-out 12 in the dashed box V).

Note that, the specific material for forming the first ultraviolet glue 321 is not limited in the embodiments of the present application. In some embodiments of the present application, the adhesive layer constituting the first ultraviolet adhesive 321 may be an ultraviolet-enhanced adhesive, and the viscosity of the ultraviolet-enhanced adhesive increases under the irradiation of ultraviolet light. In other embodiments of the present application, the adhesive layer constituting the first ultraviolet adhesive 321 may be an ultraviolet-reducing adhesive, and the viscosity of the ultraviolet-reducing adhesive is reduced under the irradiation of ultraviolet light. For example, the ultraviolet tackifying adhesive can comprise a photoinitiator and acrylate, and ultraviolet irradiation causes the acrylate to perform a crosslinking reaction, so that the ultraviolet tackifying adhesive is increased. In addition, the ultraviolet viscose reducing agent can realize viscosity reduction under the irradiation of ultraviolet light only by controlling the components and the proportion of materials participating in the reaction, and the basic reaction principle is similar to the above. The process of forming the first uv glue using the uv adhesion promoting glue and the uv de-bonding glue will be described in detail in the method of preparing the carrier structure 30 later, and will not be described in detail herein.

In some embodiments of the present application, as shown in fig. 4A, the thickness H3 of the first ultraviolet glue 321 may range from: h3 is more than or equal to 10um and less than or equal to 30um. Wherein, when the thickness H3 of first ultraviolet glue 321 is less than 10um, because first ultraviolet glue 321 is too thin, can not play good bonding effect to the connection of first carrier film 31 and first overburden 322, when the thickness H3 of first ultraviolet glue 321 is greater than 30um, increase the cost of manufacture because first ultraviolet glue 321 is too thick easily. When the thickness H3 of the first ultraviolet glue 321 is 10 to 30um, the first carrier film 31 and the first cover layer 322 can be well adhered, and the cost is low.

In addition, the composition material of the first cover layer 322 is not specifically limited in the embodiments of the present application, and for example, the composition material of the first cover layer 322 may be: one or more of PI, PET, polyolefin (PO), polymethyl Methacrylate (PMMA).

In some embodiments of the present application, as shown in fig. 4A, the thickness H4 of the first cover layer 322 may range from: h4 is more than or equal to 50um and less than or equal to 150um. When the thickness H4 of the first cover layer 322 is less than 50um, the first cover layer 322 is too thin, and thus the fan-out portion 12 cannot be supported well in the bending state of the deformation portion 13, and when the thickness H4 of the first cover layer 322 is greater than 150um, the first cover layer 322 is too thick, which increases the manufacturing cost and is not favorable for the light and thin design of the display device. For example, the thickness H3 of the first capping layer 322 may be: 60um, 80um,100um, 120um, 140um, so, not only can play good supporting role to being located its fan-out portion 12 under the state that warp portion 13 buckles, and the cost is lower moreover, and can realize display device's frivolousization design.

In order to improve the mechanical strength of the display module 100, in some embodiments of the present disclosure, as shown in fig. 4A or fig. 4B, the display module 100 may further include a reinforcing layer 40. The stiffening layer 40 is located on a side of the first carrier film 31 away from the display portion 11 and the fan-out portion 12, and a vertical projection of the stiffening layer 40 on the flexible display panel 10 does not overlap with a vertical projection of the first supporting structure 32 on the flexible display panel 10. In this way, by providing the reinforcing layer 40 in the display module 100, the mechanical strength of the display module 100 can be improved, and the deformation and recovery effects of the deformation portion 13 can be improved by patterning the region where the deformation portion 13 is located.

In addition, in order to control the bending radius of the deformation portion 13 and enhance the reliability of the deformation, in some embodiments of the present application, as shown in fig. 4A, the display module 100 further includes a spacer layer 50. In a bent state of the display module 100, as shown in fig. 4B, the spacer layer 50 may be located between the reinforcing layer 40 and the binding portion 14, and connected to the reinforcing layer 40 and the binding portion 14. In this way, by providing the spacer layer 50 having a constant thickness in the display module 100, the bending radius of the deformation portion 13 can be controlled, and the reliability of the deformation can be enhanced.

It should be noted that, in the embodiments of the present application, the composition material and the thickness of the stiffening layer 40 are not specifically limited, and the specific thickness depends on the thickness of the first carrier film 31, and the like. In addition, the constituent material and thickness of the spacer layer 50 are not specifically limited in the embodiments of the present application, and the specific thickness depends on the design of the bending radius of the deformation portion 13, and the like.

In some embodiments of the present disclosure, as shown in fig. 4A, the display module 100 may further include a Polarizer 60 (Polarizer POL), an optical Adhesive 80 (optical Clear Adhesive, OCA) and a cover plate 70, which are located on the light emitting side of the flexible display panel 10 and sequentially away from the flexible display panel 10. Optical adhesive 80 is disposed between polarizer 60 and cover 70, and may bond polarizer 60 and cover 70. The polarizer 60 is capable of transmitting light rays emitted from the flexible display panel 10, which have the same vibration direction as the transmission axis of the polarizer 60, and absorbing light rays, which have the vibration direction perpendicular to the transmission axis of the polarizer 60, of the light rays. The cover plate 70 may protect the display module 100.

Further, as shown in fig. 4A, the cover plate 70 may include a transparent cover plate 71, a light shielding cover plate 72, and a protective plate 73. The transparent cover 71 is disposed on a side of the optical adhesive 80 away from the polarizer 60, and is adhered to the optical adhesive 80, and a vertical projection of the transparent cover 71 in the flexible display panel 10 is located in a region where the display portion 11 is located. Therefore, the light emitted from each sub-pixel P in the display portion 11 can exit through the transparent cover 71. The light shielding cover 72 is disposed on a side of the optical adhesive 80 away from the polarizer 60, and a vertical projection of the light shielding cover 72 in the flexible display panel 10 is at least located in a region where the fan-out portion 12 and the deformation portion 13 are located, and a part of the light shielding cover 72 is bonded to the optical adhesive 80. By arranging the light shielding cover plate 72 in the display module 100, light shielding processing can be performed on signal wires in the fan-out part 12 and the deformation part 13, light leakage of the display module 100 is prevented, and the display effect is improved. The protective plate 73 is disposed on a side of the transparent cover plate 71 and the light shielding cover plate 72 away from the optical cement 80, and is connected to the transparent cover plate 71 and the light shielding cover plate 72, so as to protect the transparent cover plate 71 and the light shielding cover plate 72.

In some embodiments of the present application, as shown in fig. 4A, the light-shielding cover 72 may include a light-shielding protective layer 721 and a light-shielding layer 722 which are stacked. The light-shielding protective layer 721 is connected to the protective plate 73, and protects the light-shielding layer 722. The light-shielding layer 722 mainly plays a role of shielding light and is made of an opaque material.

The transparent cover plate 71 or the protective plate 73 may be made of transparent glass, sapphire, or a transparent resin material. The term "transparent" in the embodiments of the present application means that the light transmittance of the transparent substrate 50 can reach 85% or more. The transparent cover plate 71 and the protective plate 73 may be the same or different. The opaque material forming the light-shielding layer 722 may be ink, molybdenum oxide, or the like.

In the following drawings, for the sake of simplifying the drawings, the arrangement of the polarizer 60, the cover 70, and the like in the light emission measurement of the flexible display panel 10 is omitted.

On the basis, in some embodiments of the present application, in order to avoid the phenomenon that the signal traces at the position are torn and disconnected due to the deformation of the binding portion 14 when the deformation portion 13 is bent, and the display is not good, as shown in fig. 5A, the supporting structure 30 may further include a second supporting film 33, a second supporting structure 34, and an opening MN between the first supporting film 31 and the second supporting film 33. The deformation portion 13 is located at the position of the opening MN. The second carrier film 33 is located on the side of the binding portion 14 away from the driver IC, and is connected to the binding portion 14. The second support structure 34 is located on a side of the second carrier film 33 remote from the binding portion 14.

Thus, by providing the second carrier film 33 and the second support structure 34 in the display module 100, the binding portion 14 can be supported and supported, and it is avoided that a large stress generated at the bending end position N (as shown in fig. 5B) by the deformation portion 13 drives the thin second carrier film 33 (for example, the second carrier film 33 in the dashed line frame W) to deform, and further drives the binding portion 14 to deform, and further affects the binding between the signal traces in the binding portion 14 and the driver IC or the FPC, which results in poor display.

The constituent materials of the first carrier film 31 and the second carrier film 33 may be the same or different. When the first carrier film 31 and the second carrier film 33 are made of the same material, the first carrier film 31 and the second carrier film 33 can be made of the same backing film for simplifying the process, and the detailed process will not be described herein. The following examples are each explained taking as an example that the constituent materials of the first support film 31 and the second support film 33 are the same.

In some embodiments of the present application, as shown in fig. 5B, the second support structure 34 may include a second ultraviolet glue 341 and a second cover layer 342. The second ultraviolet glue 341 is located between the second cover layer 342 and the second carrier film 33, and can bond the second cover layer 342 and the second carrier film 33. The second cover layer 342 may support the binding 14. In addition, the spacer layer 50 is located between the reinforcing layer 40 and the second cover layer 342. At this time, since the second uv paste 341 and the second cap layer 342 have a certain thickness, the thickness requirement of the spacer layer 50 for controlling the bending radius can be reduced, thereby achieving the purpose of reducing the cost.

The second ultraviolet glue 341 may have the same composition and structure as the first ultraviolet glue 321, or may have a different composition and structure. Similarly, the second cover layer 342 may be the same or different in composition and structure as the first cover layer 322. When the composition of the second ultraviolet glue 341 is the same as that of the first ultraviolet glue 321, and the composition of the second cover layer 342 is the same as that of the first cover layer 322, the second ultraviolet glue 341 and the first ultraviolet glue 321, and the second cover layer 342 and the first cover layer 322 may be manufactured by using the same back film, which is simple in process and low in cost. The specific manufacturing process will be described later, and will not be expanded here. In the embodiments of the present application, the second ultraviolet glue 341 and the first ultraviolet glue 321 have the same composition and structure, and the second cover layer 342 and the first cover layer 322 have the same composition and structure, respectively.

In other embodiments of the present application, as shown in fig. 6, in order to avoid that the thinner second carrier film 33 (e.g., the second carrier film 33 in the dashed line box W) is deformed in the bent state, and then the binding portion 14 (e.g., the binding portion 14 in the dashed line box W) is deformed, so that the signal traces at the position are torn and broken, and the display is not good, the carrier structure 30 may further include a third support structure 35. The third support structure 35 is located on a side of the second carrier film 33 away from the binding portion 14 (e.g., the binding portion 14 in the dashed-line frame W), and can support the binding portion 14 in the dashed-line frame W, so as to prevent the signal traces in the binding portion 14 in the dashed-line frame W from being torn and broken in the bent state, thereby ensuring the reliability of the display screen.

On this basis, as shown in fig. 6, the third support structure 35 may include a third ultraviolet glue 351 and a third capping layer 352. The third ultraviolet glue 351 is located between the third cover layer 352 and the second carrier film 33, and can bond the third cover layer 352 and the second carrier film 33. The third covering layer 352 may support the binding 14. In addition, the spacer layer 50 is located between the reinforcing layer 40 and the second carrier film 33.

As can be seen from the above, by providing the third supporting structure 35 in the display module 100, the bound portion 14 (especially, the bound portion 14 in the dashed line frame W) can be supported, and the bound portion 14 at this position is prevented from being deformed, which causes disconnection of signal lines and thus causes poor display.

The third uv paste 351 may have the same composition and structure as the first uv paste 321, or may have a different composition and structure. Similarly, the third cladding layer 352 may have the same composition and structure as the first cladding layer 322, or may have a different structure, and the explanation here is similar to that described above and will not be repeated. In the embodiments of the present application, the composition and structure of the third ultraviolet glue 351 and the first ultraviolet glue 321 are the same, and the composition and structure of the third cover layer 352 and the first cover layer 322 are the same.

In order to form the supporting structure 30 in the display module 100, some embodiments of the present disclosure provide a back film 20 as shown in fig. 7, and the structure of the back film 20 and the method for manufacturing the back film 20 into the supporting structure 30 are described in detail below.

As shown in fig. 7, the back film 20 may include a release film 21, an adhesive layer 22, a first film layer 23, and a second film layer 24, which are sequentially stacked. The adhesive layer 22 may be formed by adhering the release film 21 to the first film 23, and the second film 24 is connected to the first film 23. The release film 21 can protect the first film layer 23 from external contamination and damage.

In some embodiments of the present application, when the above-mentioned carrier structure 30 comprises the first carrier film 31 and the first support structure 32, the first film layer 23 may be used to form the first carrier film 31, and the second film layer 24 is used to form the first support structure 32. Further, in the case where the first support structure 32 includes the first cover layer 322 and the first ultraviolet glue 321 as described above, the second film layer 24 may include a protective film 242 and an ultraviolet adhesive layer 241 which are stacked as shown in fig. 7. The protective film 242 may form the first cover layer 322, and the uv adhesive layer 241 may form the first uv paste 321.

It should be noted that, in some embodiments of the present application, the uv adhesive layer 241 may be a uv-increasing adhesive as set forth above, and the viscosity of the uv-increasing adhesive increases under the irradiation of uv light. In other embodiments of the present application, the ultraviolet adhesive layer 241 may be an ultraviolet light-reducing adhesive as set forth above, and the viscosity of the ultraviolet light-reducing adhesive is reduced under the irradiation of ultraviolet light. After the ultraviolet light is irradiated, the basic principle that the viscosity of the ultraviolet adhesive layer 241 changes is as follows: the photoinitiator (or photosensitizer) in the composition material of the uv adhesive layer 241 generates active free radicals or cations after absorbing uv light under the irradiation of uv light, and initiates chemical reactions of monomer polymerization, crosslinking and grafting, so that the adhesive is converted from liquid state to solid state within several seconds.

The method for manufacturing the display module 100 is described in detail below, and the carrier structure 30 in the display module 100 can be manufactured by using the above-mentioned structure of the back film 20. At this time, the carrier structure 30 includes a first carrier film 31 and a first support structure 32, and the first support structure 32 includes a first ultraviolet glue 321 and a first cover layer 322. The method comprises steps S101-S106, specifically:

s101, preparing the flexible display panel 10 and a film layer located above the flexible display panel 10. Specifically, as shown in fig. 8, the flexible display panel 10, and the polarizer 60, the cover plate 70, the optical adhesive 80, the driver IC, the FPC, and other structures located above the flexible display panel 10 are prepared. The embodiment of the present application does not describe this process in detail, and reference may be made to related technologies.

S102, the back film 20 is attached. Specifically, as shown in fig. 9, the release film 21 and the adhesive layer 22 of the back film 20 are removed, and the first film layer 23 is bonded to the non-light-emitting side of the flexible display panel 10. In this way, the back film 20 can be provided on the non-light-emitting side of the flexible display panel 10 to support the flexible display panel 10.

S103, mask ultraviolet irradiation. Specifically, the method comprises the following steps:

in some embodiments of the application, when the ultraviolet adhesive layer 241 is an ultraviolet adhesive increasing layer, as shown in fig. 10A, when mask ultraviolet irradiation is performed on one side of the back film 20 away from the flexible display panel 10, the first light barrier 17 may be used to perform mask processing on the back film 20, so that after the back film 20 is subjected to ultraviolet irradiation, a first viscosity region Q1 and a second viscosity region Q2 are formed in the ultraviolet adhesive layer 241. In the ultraviolet adhesive layer 241, a portion located in the first viscosity region Q1 has a different viscosity from a portion located in the second viscosity region Q2. Because the ultraviolet adhesive layer 241 is an ultraviolet adhesive increasing agent, the viscosity of the ultraviolet adhesive increasing agent increases under the irradiation of ultraviolet light. Therefore, the viscosity of the portion of the ultraviolet tackifying gum located in the first viscosity region Q1 is less than that of the portion of the ultraviolet tackifying gum located in the second viscosity region Q2. At this time, the ultraviolet adhesive layer 241 of the second viscosity region Q2 is the first ultraviolet glue 321.

It should be noted that, in the embodiment of the present application, specific materials of the first light barrier 17 are not limited, and only the ultraviolet increasing glue used for forming the second viscosity region Q2 in the light leakage region of the first light barrier 17 needs to be satisfied. In addition, specific parameters of ultraviolet irradiation are not limited in the embodiment of the application, and the optimal absorption light wavelength and energy are determined only according to the characteristics of the photoinitiator, so that the complete crosslinking reaction in the material after the irradiation treatment is ensured. For example, the wavelength of the ultraviolet light is 365nm, and the energy range is: 300-1000mj.

In other embodiments of the present application, when the ultraviolet adhesive layer 241 is an ultraviolet light reducing adhesive, the back film 20 may be subjected to ultraviolet light irradiation by using the second light blocking plate 18 as shown in fig. 10B, and at this time, the first viscosity region Q1 and the second viscosity region Q2 are formed in the ultraviolet adhesive layer 241. In the ultraviolet adhesive layer 241, a portion located in the first viscosity region Q1 has a different viscosity from a portion located in the second viscosity region Q2. Because the ultraviolet adhesive layer 241 is an ultraviolet adhesive reducing agent, the viscosity of the ultraviolet adhesive reducing agent is reduced under the irradiation of ultraviolet light. Therefore, the viscosity of the portion of the uv vis-breaking glue located in the first viscosity region Q1 at this time is lower than that of the portion of the uv vis-breaking glue located in the second viscosity region Q2. At this time, the ultraviolet adhesive layer 241 of the second viscosity region Q2 forms the first ultraviolet glue 321.

It should be noted that, in the embodiment of the present application, specific materials of the second light shielding plate 18 are not limited, and only the ultraviolet light reduction adhesive used for forming the second viscosity region Q2 in the light shielding region of the second light shielding plate 18 needs to be satisfied.

As can be seen from the above, regardless of the mask uv irradiation method shown in fig. 10A or 10B, finally, after the uv irradiation, the viscosity of the portion of the uv adhesive located in the first viscosity region Q1 is lower than that of the portion of the uv adhesive located in the second viscosity region Q2.

S104, forming the first carrier film 31 and the first supporting structure 32. Specifically, as shown in fig. 11, the ultraviolet adhesive layer 241 of the first viscosity range Q1 and the protective film 242 bonded to the ultraviolet adhesive layer 241 are removed, and the ultraviolet adhesive layer 241 of the second viscosity range Q2 and the first film layer 23 bonded to the ultraviolet adhesive layer 241 are left. In addition, the first film layer 23 connected to the binding 14 is torn off. The first film layer 23 remaining at this time forms the first carrier film 31. In this way, the first carrier film 31 and the first supporting structure 32 shown in fig. 11 are formed in the display module 100, wherein the first supporting structure 32 includes the first ultraviolet glue 321 and the first cover layer 322.

S105, attaching the reinforcing layer 40 and the spacer layer 50. As shown in fig. 12, a stiffening layer 40 and a spacer layer 50 are formed in a display module 100. The embodiments of the present application do not refer to the related art for describing the manufacturing method of forming the stiffening layer 40 and the spacer layer 50 in the display module 100 in detail.

And S106, bending. The display module 100 is bent to form the display module 100 satisfying the narrow frame design as shown in fig. 4B.

In addition, in some embodiments of the present application, when the above-mentioned carrier structure 30 further includes the second carrier film 33, the second support structure 34 and the opening MN, and the second support structure 34 includes the second cover layer 342 and the second ultraviolet glue 341, the first film layer 23 may also be used to form the second carrier film 33 and the opening MN. The second film layer 24 may also be used to form the second support structure 34, the protective film 242 in the second film layer 24 may also be used to form the second cover layer 342, and the ultraviolet adhesive layer 241 may also be used to form the second ultraviolet glue 341.

In this case, the mask ultraviolet light irradiation step S103' may be: when the masking uv irradiation is performed on the side of the back film 20 away from the flexible display panel 10, the first light-blocking plate 17 shown in fig. 13A may be used to perform the masking uv irradiation, so that the first viscosity region Q1, the second viscosity region Q2, and the third viscosity region Q3 are formed in the uv adhesive layer 241. The explanation of the first viscosity region Q1 and the second viscosity region Q2 is similar to that described above, and the description thereof is omitted. The ultraviolet adhesive layer 241 of the third viscosity region Q3 and the ultraviolet adhesive layer 241 of the second viscosity region Q2 have the same viscosity. At this time, the ultraviolet adhesive layer 241 of the third viscosity region Q3 is the second ultraviolet glue 341. Step S104' may further include: as shown in fig. 13B, the second ultraviolet glue 341 and the protection film 242 bonded to the second ultraviolet glue 341 are retained, the first film layer 23 connected to the second ultraviolet glue 341 is retained, at this time, the protection film 242 bonded to the second ultraviolet glue 341 is used as the second cover layer 342, and the first film layer 23 bonded to the second ultraviolet glue 341 is used as the second carrier film 33, and the formation of the first carrier film 31 and the formation of the first carrier structure 32 are similar to those in step S104, and details are not repeated here.

Other steps (e.g., forming the flexible display panel 10 and the film layer structure thereon, attaching the back film 20, forming the stiffening layer 40 and the spacer layer 50, and performing the bending process) are similar to the above steps (S101, S102, S105, and S106), which are not repeated herein, and finally the display module 100 shown in fig. 5B is formed.

In other embodiments of the present application, when the above-mentioned carrier structure 30 further includes the second carrier film 33, the third support structure 35 and the opening MN, and the third support structure 35 includes the third cover layer 352 and the third ultraviolet glue 351, the first film layer 23 may also be used to form the second carrier film 34 and the opening MN. The second film layer 24 may also be used to form the third support structure 35, the protection film 242 in the second film layer 24 may also be used to form a third cover layer 352, and the uv adhesive layer 241 may also be used to form a third uv glue 351.

In this case, the mask ultraviolet light irradiation step S103' may be: when the masking uv irradiation is performed on the side of the back film 20 away from the flexible display panel 10, the masking uv irradiation may be performed using the light blocking plate 17 as shown in fig. 14A, and at this time, the first viscosity region Q1, the second viscosity region Q2, and the fourth viscosity region Q4 are formed in the uv adhesive layer 241. The explanation of the first viscosity region Q1 and the second viscosity region Q2 is similar to that described above, and the description thereof is omitted. The ultraviolet adhesive layer 241 of the fourth viscosity region Q4 and the ultraviolet adhesive layer 241 of the second viscosity region Q2 have the same viscosity. At this time, the ultraviolet adhesive layer 241 of the fourth viscosity region Q4 is the third ultraviolet glue 351. The step S104' may further include: as shown in fig. 14B, the second ultraviolet glue 341 and the protective film 242 bonded to the second ultraviolet glue 341 remain, and the first film layer 23 connected to the second ultraviolet glue 341 remains. At this time, the protective film 242 bonded to the second uv glue 341 is used as the third covering layer 352, and the first film layer 23 bonded to the second uv glue 341 is used as the second carrier film 34, and the formation of the first carrier film 31 and the formation of the first carrier structure 32 are similar to those in step S104, and will not be described again here.

Other steps (e.g., forming the flexible display panel 10 and the film layer structure thereon, attaching the back film 20, forming the stiffening layer 40 and the spacer layer 50, and performing the bending process) are similar to the above steps (S101, S102, S105, and S106), which are not repeated herein, and finally the display module 100 shown in fig. 6 is formed.

It should be noted that, in the embodiments corresponding to fig. 13A and fig. 14A, the ultraviolet adhesive layer 241 is used as an ultraviolet adhesion increasing agent for explanation, and the application is not limited thereto. When the ultraviolet adhesive layer 241 is an ultraviolet adhesive reducing layer, the preparation method is only to select different light shielding plates in the step of mask ultraviolet irradiation, and other processes are similar to those described above and will not be described again here.

Example two, the greatest difference between this example and example one is that: as shown in fig. 15A, the driver IC is directly connected to the Chip On film 16 (Chip On film), and the portion of the Chip On film 16 where the driver IC is disposed is bent to the non-light-emitting side of the flexible display panel 10 by using the bending characteristic of the Chip On film 16. In addition, in this example, the flexible display panel 10 only includes the display portion 11 and the fan-out portion 12, and the outside of the chip on film 16 that is bent does not include the stress compensation layer 15.

The same points are that: the display module 100 in this example may also include the reinforcing layer 40, the polarizer 60, and the cover plate 70, which have the same functions as those in the above example and are not described herein again. In addition, in the following drawings, structures such as the polarizer 60 and the cover plate 70 on the flexible display panel 10 are omitted to simplify the drawings.

Specifically, as shown in fig. 15B (fig. 15B is an expanded view of the display module 100 of fig. 15A), the display module 100 may further include the above-mentioned flip-chip film 16. One end of the chip on film 16 is bonded to the fan-out section 12, and the other end is used for bonding the driver IC and the FPC. As shown in fig. 16A (fig. 16A is a sectional view of the display module shown in fig. 15B along the J-J direction), the flip chip film 16 is bonded to the area where the portion of the fan-out portion 12 is located, and overlaps with the vertical projection of the first supporting structure 32 on the fan-out portion 12. Thus, when the chip on film 16 provided with the driving IC is bent to the non-light-emitting side of the flexible display panel 10 as shown in fig. 16B in order to realize the narrow frame design of the display module 100, the first supporting structure 32 can support the fan-out portion 12 in the dashed-line frame X (e.g., the fan-out portion 12 in the dashed-line frame X), so as to prevent the fan-out portion from being deformed, thereby ensuring the reliability of the display screen.

The method for manufacturing the display module 100 shown in fig. 16B by using the back film 20 shown in fig. 7 is similar to the method for manufacturing the display module 100 shown in fig. 4B by using the back film 20 shown in fig. 7 in the first example, and details thereof are omitted here. The difference lies in that: in this example, the display module 100 does not need to form the spacer layer 50, and the bending is achieved by using the bending characteristic of the flip chip, and the flexible display panel 10 does not need to be bent.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A display module, comprising:

the flexible display panel comprises a display part and a fan-out part connected with the display part;

a load bearing structure comprising:

the first bearing film is arranged on the non-light-emitting side of the flexible display panel, covers the display part and the fan-out part and is used for bearing the flexible display panel;

the first supporting structure is arranged on one side, far away from the flexible display panel, of the first bearing film; the vertical projection of the first supporting structure on the flexible display panel is positioned in the area where the fan-out part is positioned and at one end far away from the display part, and the first supporting structure is used for supporting one part of the flexible display panel;

the flexible display panel further includes: a binding part for binding the drive chip;

the load bearing structure further comprises: the second bearing film is arranged on one side of the binding part, which is far away from the driving chip, and is used for bearing the binding part; the second supporting structure is arranged on one side, away from the binding part, of the second bearing film and is used for supporting the binding part;

the display module assembly still includes: the stiffening layer is located first carrier film is kept away from one side of flexible display panel, just the stiffening layer is in perpendicular projection on the flexible display panel with first bearing structure is in perpendicular projection on the flexible display panel is not overlapped, is used for supporting flexible display panel.

2. The display module of claim 1, wherein the first support structure comprises:

a first cover layer;

the first ultraviolet glue is positioned between the first covering layer and the first bearing film and used for bonding the first covering layer and the first bearing film.

3. The display module according to claim 1 or 2,

the flexible display panel further includes:

the deformation part is positioned between the binding part and the fan-out part and is connected with the binding part and the fan-out part, and the deformation part is used for arranging the binding part on the non-light-emitting side of the flexible display panel in a bending state;

the load bearing structure further comprises:

the opening is located between the first bearing film and the second bearing film, and the deformation portion is located at the position of the opening.

4. The display module of claim 3, wherein the second support structure comprises:

a second cover layer;

and the second ultraviolet glue is positioned between the second covering layer and the second bearing film and is used for bonding the second covering layer and the second bearing film.

5. The display module assembly of claim 4, wherein the display module assembly further comprises:

and the spacer layer is positioned between the reinforcing layer and the second covering layer.

6. The display module according to claim 1 or 2, wherein the display module further comprises:

one end of the chip on film is bound on the fan-out part, and the other end of the chip on film is used for binding a driving chip;

the flip chip is bound to the area where the part of the fan-out part is located, and is overlapped with the vertical projection of the first support structure on the fan-out part.

7. The display module assembly of claim 1, wherein the display module assembly further comprises:

and the polaroid and the cover plate are positioned on the light emergent side of the flexible display panel and are sequentially away from the polaroid and the cover plate of the flexible display panel.

8. A backing film for forming a load bearing structure in a display module according to any one of claims 1-7, wherein the backing film comprises:

the first film layer is used for forming the first bearing film;

and the second film layer is stacked and arranged with the first film layer, is connected with the first film layer and is used for forming the first support structure.

9. The backsheet of claim 8, wherein where the first support structure comprises a first cover layer and a first uv glue;

the second film layer comprises a protective film and an ultraviolet bonding layer which are arranged in a stacked mode; the protective film is used for forming the first covering layer, and the ultraviolet bonding layer is used for forming the first ultraviolet glue.

10. The backsheet according to claim 9, wherein, with the carrier structure further comprising an opening and the second support structure comprising a second cover layer and a second uv glue:

the first film layer is also used for forming the second bearing film and the opening;

the second film layer is further used for forming the second supporting structure, the protective film in the second film layer is further used for forming the second covering layer, and the ultraviolet bonding layer is further used for forming the second ultraviolet glue.

11. A method for manufacturing the display module according to any one of claims 1 to 7 by using the back film according to any one of claims 8 to 10, wherein the second film layer comprises a protective film and an ultraviolet adhesive layer which are stacked, and the first support structure comprises a first cover layer and a first ultraviolet adhesive;

arranging the back film on the non-light-emitting side of the flexible display panel, wherein in the back film, the first film layer is bonded with the non-light-emitting side of the flexible display panel;

performing mask ultraviolet irradiation on one side of the back film, which is far away from the flexible display panel, and forming a first viscosity area and a second viscosity area in the ultraviolet bonding layer; in the ultraviolet bonding layer, the viscosity of a part positioned in the first viscosity area is different from that of a part positioned in the second viscosity area;

removing a part of the ultraviolet bonding layer positioned in a first viscosity area and a part of the protective film bonded with the ultraviolet bonding layer in the first viscosity area; and reserving a part of the ultraviolet bonding layer in the second viscosity area as the first ultraviolet glue, and reserving a part of the protective film bonded with the ultraviolet bonding layer in the second viscosity area as the first cover layer.

12. The method of claim 11, wherein in a case where the carrier structure further comprises an opening and the second support structure comprises a second cover layer and a second uv glue, after the masking uv irradiation of the side of the back film away from the flexible display panel, the method further comprises:

a third viscosity area is further formed in the ultraviolet bonding layer, wherein in the ultraviolet bonding layer, the part in the third viscosity area has the same viscosity as the part in the first viscosity area;

and reserving a part of the ultraviolet bonding layer in the third viscosity area as the second ultraviolet glue, and reserving a part of the protective film bonded with the ultraviolet bonding layer in the third viscosity area as the second cover layer.